TC1173-2.8VOART [MICROCHIP]

2.8 V FIXED POSITIVE LDO REGULATOR, 0.48 V DROPOUT, PDSO8, SOIC-8;
TC1173-2.8VOART
型号: TC1173-2.8VOART
厂家: MICROCHIP    MICROCHIP
描述:

2.8 V FIXED POSITIVE LDO REGULATOR, 0.48 V DROPOUT, PDSO8, SOIC-8

光电二极管 输出元件 调节器
文件: 总8页 (文件大小:62K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TC1173  
300mA CMOS LDO with Shutdown, ERROR Output and Bypass  
GENERAL DESCRIPTION  
FEATURES  
The TC1173 is a precision output (typically ±0.5%)  
CMOS low dropout regulator. Total supply current is typi-  
cally 50µA at full load (20 to 60 times lower than in bipolar  
regulators!).  
Extremely Low Supply Current for Longer  
Battery Life!  
Very Low Dropout Voltage  
300mA Output  
TC1173 key features include ultra low noise operation  
(plus optional Bypass input); very low dropout voltage  
(typically 240mV at full load) and internal feed-forward  
compensation for fast response to step changes in load. An  
error output (ERROR) is asserted when the TC1173 is out-  
of-regulation (due to a low input voltage or excessive output  
current). ERROR can be set as a low battery warning or as  
a processor RESET signal (with the addition of an external  
RC network). Supply current is reduced to 0.05µA (typical)  
and VOUT and ERROR fall to zero when the shutdown input  
is low.  
Standard or Custom Output Voltages  
ERROR Output Can be Used as a Low Battery  
Detector or Processor Reset Generator  
Power-Saving Shutdown Mode  
Bypass Input for Ultra-Quiet Operation  
Over-Current and Over-Temperature Protection  
Space-Saving MSOP Package Option  
APPLICATIONS  
Battery-Operated Systems  
Portable Computers  
Medical Instruments  
Instrumentation  
Cellular / GSM / PHS Phones  
Linear Post-Regulator for SMPS  
Pagers  
The TC1173 incorporates both over-temperature and  
over-currentprotection.TheTC1173isstablewithanoutput  
capacitor of only 1µF and has a maximum output current of  
300mA.  
ORDERING INFORMATION  
Part  
Junction  
Number  
Package  
Temp. Range  
TYPICAL APPLICATION  
TC1173-xxVOA  
TC1173-xxVUA  
8-Pin SOIC  
8-Pin MSOP  
– 40°C to +125°C  
– 40°C to +125°C  
8
7
6
1
VIN  
VOUT  
GND  
VIN  
NC  
C1  
1µF  
Available Output Voltages:  
2.5, 2.8, 3.0, 3.3, 5.0  
xx indicates output voltages  
2
3
R3  
1M  
TC1173  
NC  
SHDN  
Other output voltages are available. Please contact Microchip  
Technology Inc. for details.  
4
5
Bypass  
ERROR  
ERROR  
PIN CONFIGURATION  
MSOP  
CBYPASS  
470pF  
(Optional)  
Shutdown Control  
(from Power Control Logic)  
1
2
3
4
8
7
6
5
VOUT  
GND  
VIN  
NC  
NC  
TC1173VUA  
SHDN  
ERROR  
Bypass  
SOIC  
1
2
8
7
6
5
VOUT  
GND  
VIN  
NC  
3 TC1173VOA  
NC  
SHDN  
Bypass 4  
ERROR  
© 2001 Microchip Technology Inc. DS21362A  
TC1173-2 2/2/00  
300mA CMOS LDO With Shutdown,  
ERROR Output, And Bypass  
TC1173  
Storage Temperature ............................ – 65°C to +150°C  
Maximum Voltage on Any Pin ............ VIN +0.3V to – 0.3V  
Lead Temperature (Soldering, 10 Sec.)................ +300°C  
ABSOLUTE MAXIMUM RATINGS*  
Input Voltage ..............................................................6.5V  
Output Voltage ........................... (VSS – 0.3) to (VIN + 0.3)  
Power Dissipation ....................Internally Limited (Note 7)  
Operating Temperature.................... – 40°C < TJ < 125°C  
*Absolute Maximum Ratings indicate device operation limits beyond dam-  
age may occur. Device operation beyond the limits listed in Electrical  
Characteristics is not recommended.  
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted.  
BOLDFACE type specifications apply for junction temperatures of – 40°C to +125°C  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
VIN  
Input Operating Voltage  
Maximum Output Current  
Output Voltage  
6.0  
V
mA  
V
IOUT  
300  
MAX  
VOUT  
Note 1  
Note 2  
VR ± 0.5%  
VR - 2.5%  
VR + 2.5%  
VOUT/T  
VOUT Temperature Coefficient  
ppm/°C  
40  
VOUT/VIN  
VOUT/VOUT  
VIN – VOUT  
Line Regulation  
(VR + 1V) < VIN < 6V  
0.05  
0.5  
0.35  
2.0  
%
%
Load Regulation  
IL = 0.1mA to IOUTMAX (Note 3)  
Dropout Voltage (Note 4)  
IL = 0.1mA  
IL = 100mA  
IL = 300mA  
20  
80  
240  
30  
160  
480  
mV  
ISS1  
Supply Current  
SHDN = VIH  
SHDN = 0V  
50  
0.05  
60  
90  
0.5  
µA  
µA  
ISS2  
Shutdown Supply Current  
Power Supply Rejection Ratio  
Output Short Circuit Current  
Thermal Regulation  
PSRR  
F
RE 1kHz  
dB  
IOUT  
VOUT = 0V  
550  
0.04  
260  
650  
mA  
SC  
VOUTPD  
Note 5  
V/W  
nV/Hz  
eN  
Output Noise  
F = 1kHz, COUT = 1µF,  
RLOAD = 50Ω  
SHDN Input  
VIH  
VIL  
SHDN Input High Threshold  
SHDN Input Low Threshold  
45  
%VIN  
%VIN  
15  
ERROR Output  
VMIN  
VOL  
VTH  
VOL  
Minimum Operating Voltage  
1.0  
400  
V
mV  
V
Output Logic Low Voltage  
ERROR Threshold Voltage  
ERROR Positive Hysteresis  
1mA Flows to ERROR  
Note 7  
0.95 x VR  
50  
mV  
NOTES: 1. VR is the user-programmed regulator output voltage setting.  
MIN) x 10 6  
2. TC VOUT = (VOUT  
V
OUT  
MAX  
T  
x
VOUT  
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA  
to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification.  
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential.  
5. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load  
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.  
6. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the  
thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate  
thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.  
7. Hysteresis voltage is referenced to VR.  
© 2001 Microchip Technology Inc. DS21362A  
2
TC1173-2 2/2/00  
300mA CMOS LDO With Shutdown,  
ERROR Output, And Bypass  
TC1173  
SHDN may be controlled by a CMOS logic gate, or I/O port  
of a microcontroller. If the SHDN input is not required, it  
should be connected directly to the input supply. While in  
shutdown, supply current decreases to 0.05µA (typical),  
VOUT falls to zero and ERROR is disabled.  
DETAILED DESCRIPTION  
The TC1173 is a fixed output, low drop-out regulator.  
Unlike bipolar regulators, the TC1173 supply current does not  
increasewithloadcurrent. Inaddition, VOUT remainsstableand  
withinregulationatverylowloadcurrents(animportantconsid-  
eration in RTC and CMOS RAM battery back-up applications).  
TC1173 pin functions are detailed below:  
ERROR Output  
ERROR is driven low whenever VOUT falls out of regu-  
lation by more than – 5% (typical). This condition may be  
caused by low input voltage, output current limiting, or  
thermal limiting.  
PIN DESCRIPTIONS  
The ERROR threshold is 5% below rated VOUT regard-  
less of the programmed output voltage value (e.g., ERROR  
= VOL at 4.75V (typ) for a 5.0V regulator and 2.85V (typ) for  
a 3.0V regulator). ERROR output operation is shown in  
Figure 2. Note that ERROR is active when VOUT is at or  
below VTH, and inactive when VOUT is above VTH + VH.  
As shown in Figure 1, ERROR can be used as a battery  
low flag, or as a processor RESET signal (with the addition  
of timing capacitor C2). R1 x C3 should be chosen to  
maintain ERROR below VIH of the processor RESET input  
for at least 200msec to allow time for the system to stabilize.  
Pull-up resistor R1 can be tied to VOUT, VIN or any other  
voltage less than (VIN + 0.3V.)  
Pin  
No.  
Symbol Description  
1
2
3
4
VOUT  
GND  
NC  
Regulated voltage output  
Ground terminal  
No connect  
Bypass  
Referencebypassinput.Connectinga470pF  
to this input further reduces output noise.  
5
6
ERROR  
SHDN  
Out-of-Regulation Flag (Open Drain Out-  
put). This output goes low when VOUT is out-  
of-tolerance by approximately -5%.  
Shutdown control input. The regulator is fully  
enabled when a logic high is applied to this  
input. The regulator enters shutdown when a  
logic low is applied to this input. During  
shutdown, output voltage falls to zero and  
supply current is reduced to 0.05µA (typical).  
VOUT  
7
8
NC  
VIN  
No connect  
Hysteresis (VH)  
VTH  
Unregulated supply input  
Figure 1 shows a typical application circuit. The regula-  
tor is enabled any time the shutdown input (SHDN) is above  
VIH, and shutdown (disabled) when SHDN is at or below VIL.  
ERROR  
VIH  
VOL  
Figure 2: ERROR Output Operation  
8
7
6
1
VIN  
VOUT  
VOUT  
GND  
VIN  
NC  
C1  
1µF  
Output Capacitor  
A 1µF (min) capacitor from VOUT to ground is recom-  
mended. The output capacitor should have an effective  
series resistance of 5or less. A 1µF capacitor should be  
connected from VIN to GND if there is more than 10 inches  
of wire between the regulator and the AC filter capacitor, or  
if a battery is used as the power source. Aluminum electro-  
lytic or tantalum capacitor types can be used. (Since many  
aluminum electrolytic capacitors freeze at approximately –  
30°C, solid tantalums are recommended for applications  
operating below – 25°C.) When operating from sources  
other than batteries, supply-noise rejection and transient  
response can be improved by increasing the value of the  
input and output capacitors and employing passive filtering  
techniques.  
2
3
R3  
1M  
TC1173  
NC  
SHDN  
4
5
Bypass  
ERROR  
ERROR  
CBYPASS  
470pF  
(Optional)  
Shutdown Control  
(from Power Control Logic)  
Figure 1: Typical Application Circuit  
© 2001 Microchip Technology Inc. DS21362A  
3
TC1173-2 2/2/00  
300mA CMOS LDO With Shutdown,  
ERROR Output, And Bypass  
TC1173  
Bypass Input  
Equation 1 can be used in conjunction with Equation 2  
to ensure regulator thermal operation is within limits. For  
example:  
A 470pF capacitor connected from the Bypass input to  
ground reduces noise present on the internal reference,  
which in turn significantly reduces output noise. If output  
noise is not a concern, this input may be left unconnected.  
Larger capacitor values may be used, but results in a longer  
time period to rated output voltage when power is initially  
applied.  
GIVEN:  
VINMAX= 3.0V ± 10%  
VOUTMIN= 2.7V ± 0.5%  
ILOADMAX = 250mA  
TJ  
TA  
= 125°C  
= 55°C  
MAX  
MAX  
JA = 200°C/W  
Thermal Considerations  
8-Pin MSOP Package  
Thermal Shutdown  
FIND:  
1. Actual power dissipation  
Integrated thermal protection circuitry shuts the regula-  
tor off when die temperature exceeds 150°C. The regulator  
remains off until the die temperature drops to approximately  
140°C.  
2. Maximum allowable dissipation  
Actual power dissipation:  
PD (VINMAX - VOUTMIN)ILOAD  
MAX  
= [(3.0 x 1.1) - (2.7 x .995)]250 x 10-3  
Power Dissipation  
The amount of power the regulator dissipates is prima-  
rilyafunctionofinputandoutputvoltage,andoutputcurrent.  
Thefollowingequationisusedtocalculateworstcaseactual  
power dissipation:  
= 155mW  
Maximum allowable power dissipation:  
J
A
MAX  
PD (T MAX– T  
)
JA  
PD (VINMAX – VOUTMIN)ILOAD  
MAX  
Where:  
PD = worst case actual power dissipation  
VINMAX = maximum voltage on VIN  
= (125 – 55)  
200  
VOUTMIN = minimum regulator output voltage  
ILOADMAX = maximum output (load) current  
= 350mW  
In this example, the TC1173 dissipates a maximum of  
only 155mW; far below the allowable limit of 350mW. In a  
similar manner, Equation 1 and Equation 2 can be used to  
calculate maximum current and/or input voltage limits. For  
example, the maximum allowable VIN is found by substitut-  
ing the maximum allowable power dissipation of 350mW  
into Equation 1, from which VINMAX = 4.1V.  
Equation 1.  
The maximum allowablepower dissipation (Equation 2)  
is a function of the maximum ambient temperature (TAMAX),  
the maximum allowable die temperature (125°C), and the  
thermal resistance from junction-to-air (JA). The 8-Pin  
SOIC package has a JA of approximately 160°C/Watt,  
while the 8-Pin MSOP package has a JA of approximately  
200°C/Watt; both when mounted on a single layer FR4  
dielectric copper clad PC board.  
Layout Considerations  
The primary path of heat conduction out of the package  
isviathepackageleads. Therefore, layoutshavingaground  
plane, wide traces at the pads, and wide power supply bus  
lines combine to lower JA and, therefore, increase the  
maximum allowable power dissipation limit.  
PDMAX = (TJMAX – TA  
)
MAX  
JA  
Where all terms are previously defined.  
Equation 2.  
© 2001 Microchip Technology Inc. DS21362A  
4
TC1173-2 2/2/00  
300mA CMOS LDO With Shutdown,  
ERROR Output, And Bypass  
TC1173  
TYPICAL CHARACTERISTICS  
Load Regulation  
Line Regulation  
Output Noise  
2.00  
1.80  
0.012  
0.010  
10.0  
1.0  
R
C
= 50  
= 1µF  
LOAD  
OUT  
1.60  
1.40  
1.20  
1 to 300mA  
1 to 100mA  
0.008  
0.006  
1.00  
0.80  
0.60  
0.40  
0.004  
0.002  
0.000  
0.1  
0.0  
1 to 50mA  
–0.002  
0.20  
0.00  
–0.004  
0.01  
10  
–40 –20  
0
20 40 60 80 100 120  
–40 –20  
0.01  
1
100  
1000  
0
20 40 60 80 100 120  
FREQUENCY (KHz)  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Supply Current  
Dropout Voltage vs. Load Current  
V
vs. Temperature  
OUT  
100.0  
90.0  
80.0  
3.075  
3.025  
0.40  
0.35  
125°C  
85°C  
V
= 4V  
= 100µA  
IN  
I
LOAD  
C
= 3.3µF  
LOAD  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
70°C  
25°C  
70.0  
60.0  
50.0  
40.0  
0°C  
2.975  
–40°C  
2.925  
–40 –20  
0
–40 –20  
0
20 40 60 80 100 120  
50  
0
20 40 60 80 100 120  
TEMPERATURE (°C)  
150 200 250 300  
100  
TEMPERATURE (°C)  
LOAD CURRENT (mA)  
Power Supply Rejection Ratio  
= 5V  
–30dB  
–35dB  
–40dB  
V
R
V
OUT  
= 50Ω  
= 50mV p-p  
LOAD  
INAC  
–45dB  
–50dB  
–55dB  
–60dB  
–65dB  
–70dB  
–75dB  
C
= 1µF  
OUT  
–80dB  
1K  
100K  
1M  
10  
100  
10K  
FREQUENCY (KHz)  
© 2001 Microchip Technology Inc. DS21362A  
5
TC1173-2 2/2/00  
300mA CMOS LDO With Shutdown,  
ERROR Output, And Bypass  
TC1173  
TAPE AND REEL DIAGRAMS  
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices  
User Direction of Feed  
User Direction of Feed  
PIN 1  
W
PIN 1  
P
Standard Reel Component Orientation  
for TR Suffix Device  
Standard Reel Component Orientation  
for RT Suffix Device  
Carrier Tape, Number of Components Per Reel and Reel Size  
Package  
Carrier Width (W)  
Pitch (P)  
Part Per Full Reel  
Reel Size  
8-Pin SOIC (N)  
12 mm  
8 mm  
2500  
13 in  
Component Taping Orientation for 8-Pin MSOP Devices  
User Direction of Feed  
User Direction of Feed  
PIN 1  
W
PIN 1  
P
Standard Reel Component Orientation  
for TR Suffix Device  
Reverse Reel Component Orientation  
for RT Suffix Device  
Carrier Tape, Number of Components Per Reel and Reel Size  
Package  
Carrier Width (W)  
Pitch (P)  
Part Per Full Reel  
Reel Size  
8-Pin MSOP  
12 mm  
8 mm  
2500  
13 in  
© 2001 Microchip Technology Inc. DS21362A  
6
TC1173-2 2/2/00  
300mA CMOS LDO With Shutdown,  
ERROR Output, And Bypass  
TC1173  
PACKAGE DIMENSIONS  
8-Pin SOIC (Narrow)  
PIN 1  
.157 (3.99)  
.150 (3.81)  
.244 (6.20)  
.228 (5.79)  
.050 (1.27) TYP.  
.197 (5.00)  
.189 (4.80)  
.069 (1.75)  
.053 (1.35)  
.010 (0.25)  
.007 (0.18)  
8° MAX.  
.020 (0.51)  
.013 (0.33)  
.010 (0.25)  
.004 (0.10)  
.050 (1.27)  
.016 (0.40)  
8-Pin MSOP  
PIN 1  
.197 (5.00)  
.189 (4.80)  
.122 (3.10)  
.114 (2.90)  
.026 (0.65) TYP.  
.122 (3.10)  
.114 (2.90)  
.043 (1.10)  
MAX.  
.008 (0.20)  
.005 (0.13)  
6° MAX.  
.016 (0.40)  
.010 (0.25)  
.006 (0.15)  
.002 (0.05)  
.028 (0.70)  
.016 (0.40)  
Dimensions: inches (mm)  
© 2001 Microchip Technology Inc. DS21362A  
7
TC1173-2 2/2/00  
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Los Angeles  
18201 Von Karman, Suite 1090  
Irvine, CA 92612  
Milan, Italy  
Tel: 39-039-65791-1 Fax: 39-039-6899883  
Korea  
Microchip Technology Korea  
168-1, Youngbo Bldg. 3 Floor  
Samsung-Dong, Kangnam-Ku  
Seoul, Korea  
Tel: 949-263-1888 Fax: 949-263-1338  
United Kingdom  
Arizona Microchip Technology Ltd.  
505 Eskdale Road  
Winnersh Triangle  
Wokingham  
Mountain View  
Analog Product Sales  
1300 Terra Bella Avenue  
Mountain View, CA 94043-1836  
Tel: 650-968-9241 Fax: 650-967-1590  
Tel: 82-2-554-7200 Fax: 82-2-558-5934  
Berkshire, England RG41 5TU  
Tel: 44 118 921 5869 Fax: 44-118 921-5820  
01/09/01  
All rights reserved.  
©
2001 Microchip Technology Incorporated. Printed in the USA. 1/01  
Printed on recycled paper.  
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by  
updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is  
assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual  
property rights arising from such use or otherwise. Use of Microchipís products as critical components in life support systems is not authorized except with  
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellec-  
tual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights  
reserved. All other trademarks mentioned herein are the property of their respective companies.  
© 2001 Microchip Technology Inc. DS21362A  
8
TC1173-2 2/2/00  

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