TC1173-28VUA [MICROCHIP]
TC1173-28VUA;型号: | TC1173-28VUA |
厂家: | MICROCHIP |
描述: | TC1173-28VUA 光电二极管 输出元件 调节器 |
文件: | 总12页 (文件大小:444K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TC1173
300mA CMOS LDO with Shutdown ERROR Output and Bypass
Features
General Description
•
Extremely Low Supply Current for Longer Battery Life
The TC1173 is a precision output (typically ±0.5%)
CMOS low dropout regulator. Total supply current is
typically 50µA at full load (20 to 60 times lower than in
bipolar regulators).
• Very Low Dropout Voltage
• 300mA Output Current
• Standard or Custom Output Voltages
TC1173 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 240mV at full load) and internal feed-forward
compensation for fast response to step changes in
load. An error output (ERROR) is asserted when the
TC1173 is out-of-regulation (due to a low input voltage
or excessive output current). ERROR can be set as a
low battery warning or as a processor RESET signal
(with the addition of an external RC network). Supply
current is reduced to 0.05µA (typical) and VOUT and
ERROR fall to zero when the shutdown input is low.
• ERROR Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
• Power Saving Shutdown Mode
• Bypass Input for Ultra Quiet Operation
• Over Current and Over Temperature Protection
• Space-Saving MSOP Package Option
Applications
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
The TC1173 incorporates both over temperature and
over current protection. The TC1173 is stable with an
output capacitor of only 1µF and has a maximum
output current of 300mA.
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
Typical Application
1
8
7
V
V
V
V
IN
OUT
OUT
IN
Device Selection Table
+
C1
1µF
2
Junction
Temp. Range
GND
NC
Part Number
Package
R3
1M
TC1173
TC1173-xxVOA
TC1173-xxVUA
8-Pin SOIC
-40°C to +125°C
-40°C to +125°C
6
5
3
4
NC
SHDN
8-Pin MSOP
NOTE: xx indicates output voltages
Bypass
ERROR
ERROR
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
C
470pF
(Optional)
BYPASS
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Shutdown Control
(from Power Control Logic)
Package Type
8-Pin MSOP
8-Pin SOIC
TC1173VOA
V
1
2
3
4
V
IN
8
7
6
5
OUT
V
1
2
3
4
V
IN
8
7
6
5
OUT
GND
NC
NC
SHDN
TC1173VUA
GND
NC
NC
Bypass
ERROR
SHDN
ERROR
Bypass
2002 Microchip Technology Inc.
DS21362B-page 1
TC1173
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................. (V – 0.3V) to (V + 0.3V)
SS
IN
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........V +0.3V to -0.3V
IN
Operating Temperature Range...... -40°C < T < 125°C
J
Storage Temperature..........................-65°C to +150°C
TC1173 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
VIN
IOUTMAX
VOUT
Parameter
Min
Typ
Max
Units
Test Conditions
Input Operating Voltage
Maximum Output Current
Output Voltage
2.7
—
—
6.0
V
mA
V
Note 8
300
—
—
R – 2.5%
VR ±0.5%
—
—
Note 1
V
V
R + 2.5%
∆VOUT/∆T
∆VOUT/∆VIN
∆VOUT/VOUT
VIN-VOUT
VOUT Temperature Coefficient
Line Regulation
—
—
—
40
0.05
0.5
—
0.35
2.0
ppm/°C Note 2
%
%
(VR + 1V) ≤ VIN ≤ 6V
Load Regulation
IL = 0.1mA to IOUTMAX (Note 3)
Dropout Voltage
—
—
—
20
80
240
30
160
480
mV
I
I
I
L = 0.1mA
L = 100mA
L = 300mA (Note 4)
ISS1
Supply Current
—
—
—
—
—
—
50
0.05
60
90
0.5
—
µA
µA
SHDN = VIH,
SHDN = 0V
FRE ≤ 1kHz
VOUT = 0V
Note 5
ISS2
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
PSRR
IOUTSC
∆VOUT/∆PD
eN
dB
550
0.04
260
650
—
mA
V/W
Output Noise
—
nV/√Hz F = 1kHz, COUT = 1µF,
LOAD = 50Ω
R
SHDN Input
VIH
SHDN Input High Threshold
SHDN Input Low Threshold
45
—
—
—
%VIN
%VIN
VIL
—
15
ERROR Output
VMIN
VOL
VTH
VOL
Minimum Operating Voltage
Output Logic Low Voltage
ERROR Threshold Voltage
ERROR Positive Hysteresis
1.0
—
—
—
—
400
—
V
mV
V
1 mA Flows to ERROR
—
0.95 x VR
50
—
—
mV
Note 7
Note 1: VR is the user-programmed regulator output voltage setting.
TC VOUT = (VOUTMAX – VOUTMIN) x 106
2:
VOUT x ∆T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regula-
tion specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7: Hysteresis voltage is referenced by VR.
8: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX
.
DS21362B-page 2
2002 Microchip Technology Inc.
TC1173
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
(8-Pin MSOP)
Symbol
Description
1
2
3
4
5
VOUT
GND
Regulated voltage output.
Ground terminal.
No connect.
NC
Bypass
ERROR
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance
by approximately – 5%.
6
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.05µA (typical).
7
8
NC
VIN
No connect.
Unregulated supply input.
2002 Microchip Technology Inc.
DS21362B-page 3
TC1173
FIGURE 3-2:
ERROR OUTPUT
OPERATION
3.0
DETAILED DESCRIPTION
The TC1173 is a fixed output, low drop-out regulator.
Unlike bipolar regulators, the TC1173’s supply current
does not increase with load current. In addition, V
V
OUT
OUT
remains stable and within regulation over the entire
0mA to I operating load current range, (an
HYSTERESIS (V
)
H
V
TH
OUTMAX
important consideration in RTC and CMOS RAM
battery back-up applications).
ERROR
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
V
IH
(SHDN) is at or above V , and shutdown (disabled)
V
IH
OL
when SHDN is at or below V . SHDN may be
IL
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05µA
3.2
Output Capacitor
A
1µF (min) capacitor from
V
to ground is
OUT
recommended. The output capacitor should have an
effective series resistance greater than 0.1Ω and less
than 5.0Ω. A 1µF capacitor should be connected from
(typical), V
falls to zero and ERROR is disabled.
OUT
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
V
to GND if there is more than 10 inches of wire
IN
between the regulator and the AC filter capacitor, or if a
battery is used as the power source. Aluminum
electrolytic or tantalum capacitor types can be used.
(Since many aluminum electrolytic capacitors freeze at
approximately -30°C, solid tantalums are recom-
mended for applications operating below -25°C.)
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
8
1
2
V
V
V
IN
OUT
OUT
+
+
C2
C1
1µF
1µF
+
7
GND
NC
R3
1M
–
Battery
TC1173
6
5
3
4
NC
SHDN
RESET or
Bypass
ERROR
Battery Low
Shutdown Control
(from Power Control Logic)
C3
0.2µF
3.3
Bypass Input
C3 required only if ERROR
is used as a processor RESET signal.
(see text)
C
470pF
(Optional)
BYPASS
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise. If output noise is not a concern, this input may be
left unconnected. Larger capacitor values may be
used, but results in a longer time period to rated output
voltage when power is initially applied.
3.1
ERROR Output
ERROR is driven low whenever V
falls out of
OUT
regulation by more than – 5% (typical). This condition
may be caused by low input voltage, output current
limiting, or thermal limiting. The ERROR threshold is
5% below rated V
regardless of the programmed
OUT
output voltage value (e.g., ERROR = V at 4.75V
OL
(typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V
regulator). ERROR output operation is shown in
Figure 3-2.
Note that ERROR is active when V
is at or below
OUT
V
, and inactive when V
is above V + V .
TH
OUT TH H
As shown in Figure 3-1, ERROR can be used as a
battery low flag, or as a processor RESET signal (with
the addition of timing capacitor C3). R1 x C3 should be
chosen to maintain ERROR below V of the processor
IH
RESET input for at least 200 msec to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
V
, V or any other voltage less than (V + 0.3V).
OUT
IN IN
DS21362B-page 4
2002 Microchip Technology Inc.
TC1173
EQUATION 4-2:
DMAX = (TJMAX – T
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
P
)
AMAX
θ
JA
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
Where all terms are previously defined.
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
4.2
Power Dissipation
Given:
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
V
= 3.0V ± 10%
= 2.7V ± 0.5%
= 250mA
INMAX
V
OUTMIN
I
LOADMAX
T
= 125°C
JMAX
EQUATION 4-1:
T
= 55°C
AMAX
θ
= 200°C/W
P
≈ (VINMAX – VOUT )ILOAD
MIN MAX
JA
D
8-Pin MSOP Package
Where:
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
P
= Worst case actual power dissipation
= Maximum voltage on VIN
D
VIN
MAX
VOUT
= Minimum regulator output voltage
= Maximum output (load) current
Actual power dissipation:
MIN
ILOAD
MAX
P
≈ (VINMAX – VOUTMIN)I
LOADMAX
D
–3
= [(3.0 x 1.1) – (2.7 x .995)]250 x 10
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
= 155mW
(T MAX), the maximum allowable die temperature
Maximum allowable power dissipation:
A
(TJMAX) and the thermal resistance from junction-to-air
P
DMAX = (TJMAX – T
)
AMAX
(θ ). The 8-Pin SOIC package has a θ of approxi-
JA
JA
θ
JA
mately 160°C/Watt, while the 8-Pin MSOP package
= (125 – 55)
has a θ of approximately 200°C/Watt.
JA
200
= 350mW
In this example, the TC1173 dissipates a maximum of
155mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
V
is found by substituting the maximum allowable
IN
power dissipation of 250mW into Equation 4-1, from
which VINMAX = 4.1V.
4.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θ and therefore
JA
increase the maximum allowable power dissipation
limit.
2002 Microchip Technology Inc.
DS21362B-page 5
TC1173
5.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Load Regulation
Line Regulation
Output Noise
2.00
1.80
0.012
0.010
10.0
1.0
R
C
= 50Ω
= 1µF
LOAD
OUT
1.60
1.40
1.20
1 to 300mA
0.008
0.006
1.00
0.80
0.60
0.40
0.004
0.002
0.000
0.1
0.0
1 to 100mA
1 to 50mA
-0.002
0.20
0.00
-0.004
0.01
10
-40° -20° 0° 20° 40° 60° 80° 100° 120°
-40° -20°
0.01
1
100
1000
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
FREQUENCY (kHz)
TEMPERATURE (°C)
Supply Current
V
vs. Temperature
OUT
100.0
90.0
80.0
0.40
0.35
3.075
3.025
125C
85C
V
= 4V
LOAD
LOAD
IN
I
= 100µA
= 3.3µF
C
0.30
0.25
0.20
0.15
0.10
0.05
0.00
70C
25C
70.0
60.0
50.0
40.0
0C
2.975
-40C
2.925
-40° -20°
0
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
50
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
100
150 200 250 300
LOAD CURRENT (mA)
DS21362B-page 6
2002 Microchip Technology Inc.
TC1173
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
2002 Microchip Technology Inc.
DS21362B-page 7
TC1173
6.3
Package Dimensions
8-Pin MSOP
PIN 1
.197 (5.00)
.189 (4.80)
.122 (3.10)
.114 (2.90)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.008 (0.20)
.005 (0.13)
6° MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
8-Pin SOIC
PIN 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
8
.020 (0.51)
.013 (0.33)
.010 (0.25)
.004 (0.10)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
DS21362B-page 8
2002 Microchip Technology Inc.
TC1173
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21362B-page 9
TC1173
NOTES:
DS21362B-page 10
2002 Microchip Technology Inc.
TC1173
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
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dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
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Serialized Quick Turn Programming (SQTP) is a service mark
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© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
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The Company’s quality system processes and
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2002 Microchip Technology Inc.
DS21362B-page 11
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Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
New York
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
China - Hong Kong SAR
Italy
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Tel: 39-039-65791-1 Fax: 39-039-6899883
Microchip Technology Inc.
India Liaison Office
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
05/01/02
DS21362B-page 12
2002 Microchip Technology Inc.
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