TC1055-5.0VCT713_技术文档

TC1054/TC1055/TC1186

50 mA, 100 mA and 150 mA CMOS LDOs with Shutdown

and ERROR Output

Features

General Description

• Low Ground Current for Longer Battery Life

• Low Dropout Voltage

The TC1054, TC1055 and TC1186 are high accuracy

(typically ±0.5%) CMOS upgrades for older (bipolar)

low dropout regulators. Designed specifically for

battery-operated systems, the devices’ CMOS

construction minimizes ground current, extending

battery life. Total supply current is typically 50 µA at full

load (20 to 60 times lower than in bipolar regulators).

• Choice of 50 mA (TC1054), 100 mA (TC1055)

and 150 mA (TC1186) Output

• High Output Voltage Accuracy

• Standard or Custom Output Voltages:

- 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V,

3.3V, 3.6V, 4.0V, 5.0V

The devices’ key features include low noise operation,

low dropout voltage – typically 85 mV (TC1054),

180 mV (TC1055) and 270 mV (TC1186) at full load —

and fast response to step changes in load. An error

output (ERROR) is asserted when the devices are out-

of-regulation (due to a low input voltage or excessive

output current). ERROR can be used as a low battery

warning or as a processor RESET signal (with the

addition of an external RC network). Supply current is

reduced to 0.5 µA (max), with both V_OUTand ERROR

disabled when the shutdown input is low. The devices

incorporate both over-temperature and over-current

protection.

• Power-Saving Shutdown Mode

• ERROR Output Can Be Used as a Low Battery

Detector or Microcontroller Reset Generator

• Overcurrent and Overtemperature Protection

• 5-Pin SOT-23 Package

• Pin Compatible Upgrades for Bipolar Regulators

Applications

• Battery Operated Systems

• Portable Computers

• Medical Instruments

• Instrumentation

The TC1054, TC1055 and TC1186 are stable with an

output capacitor of only 1 µF and have a maximum

output current of 50 mA, 100 mA and 150 mA,

respectively. For higher output current regulators,

please refer to the TC1173 (I_OUT= 300 mA) data sheet

(DS21632).

• Cellular/GSM/PHS Phones

• Linear Post-Regulators for SMPS

• Pagers

Typical Application

Package Type

5-Pin SOT-23

1

2

5

V_OUT

ERROR

V_IN

V_OUT

+

TC1054

TC1055

TC1186

5

4

1 µF

TC1054

TC1055

TC1186

GND

1 MΩ

3

1

2

4

SHDN ERROR

ERROR

V_IN

GND SHDN

NOTE: 5-Pin SOT-23 is equivalent to the EIAJ (SC-74A)

Shutdown Control

(from Power Control Logic)

DS21350D-page 1

TC1054/TC1055/TC1186

† Stresses above those listed under "Absolute Maximum

Ratings" may cause permanent damage to the device. These

are stress ratings only and functional operation of the device

at these or any other conditions above those indicated in the

operation sections of the specifications is not implied.

Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Input Voltage ....................................................................6.5V

Output Voltage .....................................(-0.3V) to (V_IN+ 0.3V)

Power Dissipation ......................... Internally Limited (Note 6)

Maximum Voltage on Any Pin ...................V_IN+0.3V to -0.3V

Operating Junction Temperature Range ..-40°C < T_J< 125°C

Storage Temperature.....................................-65°C to +150°C

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, V_IN= V_OUT+ 1V, I_L= 100 µA, C_L= 3.3 µF, SHDN > V_IH, T_A= +25°C.

Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Parameters

Sym

Min

2.7

Typ

Max

6.0

Units

Conditions

Input Operating Voltage

Maximum Output Current

V_IN

—

V

Note 8

I_OUTMAX

50

100

150

—

mA

TC1054

TC1055

TC1186

Output Voltage

V_OUT

V_R– 2.5% V_R±0.5% V_R+ 2.5%

V

Note 1

V_OUTTemperature Coefficient

TCV_OUT

—

20

40

—

ppm/°C Note 2

Line Regulation

Load Regulation:

ΔV_OUT/ΔV_IN

ΔV_OUT/V_OUT

—

0.05

0.35

%

(V_R+ 1V) ≤ V_IN≤ 6V

(Note 3)

I_L= 0.1 mA to I_OUTMAX

TC1054; TC1055

—

0.5

2

3

TC1186

Dropout Voltage:

V_IN-V_OUT

—

2

65

85

180

270

—

120

250

400

mV

I_L= 100 µA

I_L= 20 mA

I_L= 50 mA

I_L= 100 mA

I_L= 150 mA (Note 4)

TC1055; TC1186

TC1186

Supply Current

I_IN

I_INSD

—

50

0.05

64

80

0.5

—

µA

dB

mA

SHDN = V_IH, I_L= 0 µA (Note 9)

SHDN = 0V

Shutdown Supply Current

Power Supply Rejection Ratio

Output Short Circuit Current

Thermal Regulation

PSRR

I_OUTSC

ΔV_OUT/ΔP_D

T_SD

f ≤ 1 kHz

300

0.04

160

450

—

V_OUT= 0V

V/W Notes 5, 6

Thermal Shutdown Die

Temperature

—

°C

Thermal Shutdown Hysteresis

ΔT_SD

—

10

—

°C

Note 1: V_Ris the regulator output voltage setting. For example: V_R= 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.

6

2:

TC V

= (V_OUTMAX– V_OUTMIN)x 10

OUT

V

x ΔT

OUT

3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal

value.

5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,

excluding load or line regulation effects. Specifications are for a current pulse equal to I_LMAXat V_IN= 6V for T = 10 ms.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction-to-air (i.e., T_A, T_J, θ_JA). Exceeding the maximum allowable power

dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations”, “Ther-

mal Considerations”, for more details.

7: Hysteresis voltage is referenced by V_R.

8: The minimum V_INhas to justify the conditions: V_IN≥ V_R+ V_DROPOUTand V_IN≥ 2.7V for I_L= 0.1 mA to I_OUTMAX

9: Apply for junction temperatures of -40C to +85C.

.

DS21350D-page 2

TC1054/TC1055/TC1186

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, V_IN= V_OUT+ 1V, I_L= 100 µA, C_L= 3.3 µF, SHDN > V_IH, T_A= +25°C.

Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Parameters

Output Noise

Sym

Min

Typ

Max

Units

Conditions

eN

—

260

—

nV/√Hz I_L= I_OUTMAX

SHDN Input

SHDN Input High Threshold

SHDN Input Low Threshold

ERROR Output

V_IH

V_IL

45

—

%V_INV_IN= 2.5V to 6.5V

15

Minimum VIN Operating Voltage

Output Logic Low Voltage

ERROR Threshold Voltage

ERROR Positive Hysteresis

V_OUTto ERROR Delay

V_INMIN

V_OL

1.0

—

400

—

V

mV

V

1 mA Flows to ERROR

See Figure 4-2

V_TH

0.95 x V_R

50

V_HYS

t_DELAY

—

mV

ms

Note 7

2.5

—

V_OUTfalling from V_Rto V_R- 10%

Note 1:

2:

V

TC V

_Ris the regulator output voltage setting. For example: V_R= 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.

6

= (V_OUTMAX– V_OUTMIN)x 10

OUT

V

x ΔT

OUT

3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal

value.

5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,

excluding load or line regulation effects. Specifications are for a current pulse equal to I_LMAXat V_IN= 6V for T = 10 ms.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction-to-air (i.e., T_A, T_J, θ_JA). Exceeding the maximum allowable power

dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations”, “Ther-

mal Considerations”, for more details.

7: Hysteresis voltage is referenced by V_R.

8: The minimum V_INhas to justify the conditions: V_IN≥ V_R+ V_DROPOUTand V_IN≥ 2.7V for I_L= 0.1 mA to I_OUTMAX

9: Apply for junction temperatures of -40C to +85C.

.

DS21350D-page 3

TC1054/TC1055/TC1186

2.0

TYPICAL PERFORMANCE CURVES

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, V_IN= V_OUT+ 1V, I_L= 100 µA, C_L= 3.3 µF, SHDN > V_IH, T_A= +25°C.

0.020

0.018

0.016

0.014

0.012

0.010

0.008

0.006

0.004

0.002

0.000

0.100

0.090

0.080

0.070

0.060

0.050

0.040

0.030

0.020

0.010

0.000

I

= 10 mA

I

= 50 mA

LOAD

C

= 1 μF

C

= 1 μF

IN

OUT

IN

OUT

= 1 μF

-40

-20

0

20

50

70

125

-40

-20

0

20

50

70

125

TEMPERATURE (°C)

FIGURE 2-1:

Temperature (I

Dropout Voltage vs.

= 10 mA).

FIGURE 2-4:

Temperature (I

Dropout Voltage vs.

= 50 mA).

LOAD

0.300

0.200

I

LOAD

= 100 mA

I

= 150 mA

0.180

LOAD

0.250

0.200

0.150

0.100

0.050

0.160

0.140

0.120

0.100

0.080

0.060

0.040

C

= 1 μF

C

= 1 μF

IN

OUT

IN

OUT

0.020

0.000

= 1 μF

0.000

-40

-20

0

20

50

70

125

-40

-20

0

20

50

70

125

TEMPERATURE (°C)

FIGURE 2-2:

Temperature (I

Dropout Voltage vs.

= 100 mA).

FIGURE 2-5:

Temperature (I

Dropout Voltage vs.

= 150 mA).

LOAD

90

80

70

60

50

40

30

20

10

0

90

80

70

60

50

40

30

20

10

0

I

= 100 mA

LOAD

I

= 10 mA

LOAD

C

= 1 μF

IN

OUT

C

IN

OUT

= 1 μF

C

= 1 μF

0 0.5 1 1.5

2

2.5

3

3.5 4 4.5

(V)

5 5.5 6 6.5 7 7.5

0

0.5

1

1.5

2

2.5

3

3.5 4 4.5

(V)

5

5.5 6 6.5

7

7.5

V

IN

V

IN

FIGURE 2-3:

(I = 10 mA).

Ground Current vs. V

FIGURE 2-6:

(I = 100 mA).

Ground Current vs. V

IN

LOAD

DS21350D-page 4

TC1054/TC1055/TC1186

Note: Unless otherwise indicated, V_IN= V_OUT+ 1V, I_L= 100 µA, C_L= 3.3 µF, SHDN > V_IH, T_A= +25°C.

80

70

60

50

40

30

20

10

0

3.5

3

I

= 0

I

= 150 mA

LOAD

2.5

2

1.5

1

0.5

0

C

= 1 μF

IN

OUT

C

= 1 μF

IN

OUT

= 1 μF

0

0.5

1

1.5

2

2.5

3

3.5

(V)

4

4.5

5

5.5

6

6.5

7

0 0.5

1

1.5

2

2.5

3

3.5 4 4.5

(V)

5 5.5 6 6.5 7 7.5

V

IN

FIGURE 2-7:

Ground Current vs. V

FIGURE 2-10:

(I = 0 mA).

V

vs. V

IN

OUT

(I

= 150 mA).

LOAD

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

3.320

3.315

I

= 100 mA

I

= 10 mA

LOAD

3.310

3.305

3.300

3.295

3.290

3.285

3.280

3.275

C

V

= 1 μF

IN

OUT

IN

= 1 μF

C

= 1 μF

= 4.3V

IN

OUT

= 1 μF

-40

-20

-10

0

20

40

85

125

0

0.5

1

1.5

2

2.5

3

3.5

(V)

4

4.5

5

5.5

6

6.5

7

V

TEMPERATURE (°C)

IN

FIGURE 2-8:

(I = 100 mA).

V

vs. V

FIGURE 2-11:

Temperature (I

Output Voltage (3.3V) vs.

= 10 mA).

OUT

IN

LOAD

3.290

I

= 150 mA

5.025

LOAD

3.288

3.286

3.284

3.282

3.280

3.278

3.276

3.274

I

= 10 mA

LOAD

5.020

5.015

5.010

5.005

5.000

4.995

4.990

4.985

V

= 6V

IN

C

V

= 1 μF

IN

OUT

IN

C

= 1 μF

IN

OUT

= 1 μF

= 4.3V

-40

-20

-10

0

20

40

85

125

-40

-20

-10

0

20

40

85

125

TEMPERATURE (°C)

FIGURE 2-9:

(I = 150 mA).

V

vs. V

FIGURE 2-12:

Temperature (I

Output Voltage (5V) vs.

= 10 mA).

LOAD

OUT

IN

LOAD

DS21350D-page 5

TC1054/TC1055/TC1186

Note: Unless otherwise indicated, V_IN= V_OUT+ 1V, I_L= 100 µA, C_L= 3.3 µF, SHDN > V_IH, T_A= +25°C.

10.0

R

C

= 50 Ω

LOAD

= 1 μF

IN

4.994

OUT

I

= 150 mA

4.992

4.990

4.988

4.986

4.984

4.982

4.980

4.978

4.976

4.974

LOAD

= 1 μF

1.0

V

C

= 6V

0.1

0.0

IN

OUT

= 1 μF

-40

-20

-10

0

20

40

85

125

TEMPERATURE (°C)

0.01K 0.1K

1K

10K 100K 1000K

FREQUENCY (Hz)

FIGURE 2-13:

Temperature (I

Output Voltage (5V) vs.

= 10 mA).

FIGURE 2-16:

Output Noise vs. Frequency.

LOAD

1000

C

= 1 μF

OUT

to 10 μF

70

I

= 10 mA

LOAD

60

50

40

30

20

10

0

100

10

1

Stable Region

V

C

= 6V

IN

OUT

0.1

= 1 μF

0.01

-40

-20

-10

0

20

40

85

125

10

0

20 30 40

50 60 70 80 90 100

LOAD CURRENT (mA)

TEMPERATURE (°C)

FIGURE 2-17:

Stability Region vs. Load

FIGURE 2-14:

GND Current vs.

Current.

Temperature (I

= 10 mA).

LOAD

80

I

= 150 mA

LOAD

70

60

50

40

30

20

10

0

VSHDN

VOUT

V

C

= 6V

IN

OUT

= 1 μF

-40

-20

-10

0

20

40

85

125

TEMPERATURE (°C)

Conditions: C_IN= 1 µF, C_OUT= 1 µF,

_LOAD= 100 mA, V_IN= 4.3V, Temp = +25°C,

Fall Time = 184 µs

I

FIGURE 2-15:

Temperature (I

GND Current vs.

= 150 mA).

LOAD

FIGURE 2-18:

Measure Rise Time of 3.3V

LDO.

DS21350D-page 6

TC1054/TC1055/TC1186

Note: Unless otherwise indicated, V_IN= V_OUT+ 1V, I_L= 100 µA, C_L= 3.3 µF, SHDN > V_IH, T_A= +25°C.

VSHDN

VOUT

Conditions: C_IN= 1 µF, C_OUT= 1 µF,

I_LOAD= 100 mA, V_IN= 6V, Temp = +25°C,

Fall Time = 192 µs

Conditions: C_IN= 1 µF, C_OUT= 1 µF,

I_LOAD= 100 mA, V_IN= 4.3V, Temp = +25°C,

Fall Time = 52 µs

FIGURE 2-19:

Measure Rise Time of 5.0V

FIGURE 2-21:

Measure Fall Time of 3.3V

LDO.

VSHDN

VOUT

Conditions: V_IN= 6V, C_IN= 0 µF, C_OUT= 1 µF

Conditions: C_IN= 1 µF, C_OUT= 1 µF,

I_LOAD= 100 mA, V_IN= 6V, Temp = +25°C,

Fall Time = 88 µs

I_LOADwas increased until temperature of die

reached about 160°C, at which time integrated ther-

mal protection circuitry shuts the regulator off when

die temperature exceeds approximately 160°C. The

regulator remains off until die temperature drops to

approximately 150°C.

FIGURE 2-22:

Measure Fall Time of 5.0V

LDO.

FIGURE 2-20:

Thermal Shutdown

Response of 5.0V LDO.

DS21350D-page 7

TC1054/TC1055/TC1186

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

Pin No.

PIN FUNCTION TABLE

Symbol

Description

1

2

3

4

V_IN

Unregulated supply input

GND

Ground terminal

SHDN

ERROR

Shutdown control input

Out-of-Regulation Flag

(Open-drain output)

5

V_OUT

Regulated voltage output

3.1

Unregulated Supply Input (V_IN)

3.3

Shutdown Control Input (SHDN)

Connect unregulated input supply to the V_INpin. If

there is a large distance between the input supply and

the LDO regulator, some input capacitance is

necessary for proper operation. A 1 µF capacitor

connected from V_INto ground is recommended for

most applications.

The regulator is fully enabled when a logic-high is

applied to SHDN. The regulator enters shutdown when

a logic-low is applied to SHDN. During shutdown,

output voltage falls to zero, ERROR is open-circuited

and supply current is reduced to 0.5 µA (max).

3.4

Out Of Regulation Flag (ERROR)

3.2

Ground Terminal (GND)

ERROR goes low when V_OUTis out-of-tolerance by

approximately -5%.

Connect the unregulated input supply ground return to

GND. Also connect the negative side of the 1 µF typical

input decoupling capacitor close to GND and the

negative side of the output capacitor C_OUTto GND.

3.5

Regulated Voltage Output (V_OUT)

Connect the output load to V_OUTof the LDO. Also

connect the positive side of the LDO output capacitor

as close as possible to the V_OUTpin.

DS21350D-page 8

TC1054/TC1055/TC1186

4.1

ERROR Open-Drain Output

4.0

DETAILED DESCRIPTION

ERROR is driven low whenever V_OUTfalls out of

regulation by more than -5% (typical). This condition

may be caused by low input voltage, output current

limiting or thermal limiting. The ERROR threshold is 5%

below rated V_OUT, regardless of the programmed

output voltage value (e.g. ERROR = V_OLat 4.75V (typ.)

for a 5.0V regulator and 2.85V (typ.) for a 3.0V

regulator). ERROR output operation is shown in

Figure 4-2.

The TC1054, TC1055 and TC1186 are precision fixed

output voltage regulators (If an adjustable version is

desired, please see the TC1070/TC1071/TC1187 data

sheet (DS21353)). Unlike bipolar regulators, the

TC1054, TC1055 and TC1186 supply current does not

increase with load current.

Figure 4-1 shows a typical application circuit, where the

regulator is enabled any time the shutdown input

(SHDN) is at or above V_IH, and shutdown (disabled)

when SHDN is at or below V_IL. SHDN may be

controlled by a CMOS logic gate or I/O port of a

microcontroller. If the SHDN input is not required, it

should be connected directly to the input supply. While

in shutdown, supply current decreases to 0.05 µA

(typical), V_OUTfalls to zero volts, and ERROR is open-

circuited.

Note that ERROR is active when V_OUTfalls to V_THand

inactive when V_OUTrises above V_THby V_HYS

.

As shown in Figure 4-1, ERROR can be used either as

a battery low flag or as a processor RESET signal (with

the addition of timing capacitor C₂). R₁x C₂should be

chosen to maintain ERROR below V_IHof the processor

RESET input for at least 200 ms to allow time for the

system to stabilize. Pull-up resistor R₁can be tied to

V_OUT, V_INor any other voltage less than (V_IN+ 0.3V).

V

OUT

IN

OUT

+

1 µF

+

1 µF

TC1054

TC1055

TC1186

+

C

1

Battery

V

OUT

GND

HYSTERESIS (V )

H

V

TH

V+

SHDN ERROR

R

1MW

1

t

DELAY

ERROR

Shutdown Control

(to CMOS Logic or Tie

BATTLOW

or RESET

to V if unused)

IN

V

IH

C

Required Only

0.2 µF

2

C

if ERROR is used as a

2

V

OL

Processor RESET Signal

(See Text)

FIGURE 4-2:

Error Output Operation.

FIGURE 4-1:

Typical Application Circuit.

4.2

Output Capacitor

A 1 µF (minimum) capacitor from V_OUTto ground is

recommended. The output capacitor should have an

effective series resistance greater than 0.1Ω and less

than 5.0Ω, with a resonant frequency above 1 MHz. A

1 µF capacitor should be connected from V_INto GND if

there is more than 10 inches of wire between the

regulator and the AC filter capacitor or if a battery is

used as the power source. Aluminum electrolytic or

tantalum capacitor types can be used (Since many

aluminum electrolytic capacitors freeze at approxi-

mately -30°C, solid tantalums are recommended for

applications operating below -25°C.). When operating

from sources other than batteries, supply-noise

rejection and transient response can be improved by

increasing the value of the input and output capacitors

and employing passive filtering techniques.

DS21350D-page 9

TC1054/TC1055/TC1186

Equation 5-1 can be used in conjunction with

Equation 5-2 to ensure regulator thermal operation is

within limits.

5.0

5.1

THERMAL CONSIDERATIONS

Thermal Shutdown

For example:

Given:

Integrated thermal protection circuitry shuts the

regulator off when die temperature exceeds 160°C.

The regulator remains off until the die temperature

drops to approximately 150°C.

V_INMAX

V_OUTMIN

I_LOADMAX

T_JMAX

= 3.0V +5%

= 2.7V – 2.5%

= 40 mA

5.2

Power Dissipation

= +125°C

The amount of power the regulator dissipates is

primarily a function of input voltage, output voltage and

output current. The following equation is used to

calculate worst case actual power dissipation:

T_AMAX

= +55°C

Find:

1. Actual power dissipation

2. Maximum allowable dissipation

Actual power dissipation:

P_D≈ (V_INMAX– V_OUTMIN)I_LOADMAX

EQUATION 5-1:

P_D≈ (V_INMAX– V_OUTMIN)I_LOADMAX

= [(3.0 × 1.05) – (2.7 × 0.975)]40 × 10^-3

Where:

= 20.7mW

P_D= Worst case actual power dissipation

= Maximum voltage on V_IN

V_INMAX

V_OUTMIN= Minimum regulator output voltage

I_LOADMAX= Maximum output (load) current

Maximum allowable power dissipation:

(T_JMAX– T_AMAX

)

P_DMAX= -------------------------------------------

θ_JA

The

maximum

allowable

power

dissipation

(125 – 55)

220

= 318mW

(Equation 5-2) is a function of the maximum ambient

temperature (T_AMAX), the maximum allowable die

temperature (T_JMAX) and the thermal resistance from

junction-to-air (θ_JA). The 5-Pin SOT-23 package has a

= -------------------------

θ

_JAof approximately 220°C/Watt.

In this example, the TC1054 dissipates a maximum of

20.7 mW; below the allowable limit of 318 mW. In a

similar manner, Equation 5-1 and Equation 5-2 can be

used to calculate maximum current and/or input

voltage limits.

EQUATION 5-2:

(T_JMAX– T_AMAX

)

P_DMAX= -------------------------------------------

θ_JA

5.3

Layout Considerations

Where all terms are previously defined.

The primary path of heat conduction out of the package

is via the package leads. Therefore, layouts having a

ground plane, wide traces at the pads and wide power

supply bus lines combine to lower θ_JAand, therefore,

increase the maximum allowable power dissipation

limit.

DS21350D-page 10

TC1054/TC1055/TC1186

6.0

6.1

PACKAGING INFORMATION

Package Marking Information

5-Pin SOT-23

5

4

1

2

3 4

1

3

2

1

2

represents part number code +

temperature range and voltage

&

TC1054

Code

TC1055

Code

TC1186

Code

(V)

1.8

2.5

2.6

2.7

2.8

2.85

3.0

3.3

3.6

4.0

5.0

CY

C1

CT

C2

CZ

C8

C3

C4

C9

C0

C6

DY

D1

DT

D2

DZ

D8

D3

D4

D9

D0

D6

PY

P1

PV

P2

PZ

P8

P3

P5

P9

P0

P7

3

represents year and quarter code

represents lot ID number

4

DS21350D-page 11

TC1054/TC1055/TC1186

5-Lead Plastic Small Outline Transistor (OT) [SOT-23]

CT

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

b

N

E

E1

3

2

1

e

e1

D

A2

c

A

φ

A1

L

L1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Lead Pitch

N

e

5

0.95 BSC

Outside Lead Pitch

Overall Height

e1

A

1.90 BSC

0.90

0.89

0.00

2.20

1.30

2.70

0.10

0.35

0°

–

1.45

1.30

0.15

3.20

1.80

3.10

0.60

0.80

30°

Molded Package Thickness

Standoff

A2

A1

E

Overall Width

Molded Package Width

Overall Length

Foot Length

E1

D

L

Footprint

L1

φ

Foot Angle

Lead Thickness

Lead Width

c

0.08

0.20

0.26

0.51

b

Notes:

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-091B

DS21350D-page 12

TC1054/TC1055/TC1186

APPENDIX A: REVISION HISTORY

Revision D (February 2007)

• Corrected standard output voltages on page 1

and in “Product Identification System”.

• Added T_DELAYparameter in DC Characteristics

table in “Electrical Characteristics”.

• Changes to Figure 4-2.

•

“Packaging Information”: Corrected SOT-23

Packaging Informaton.

Revision C (March 2003)

• Undocumented changes.

Revision B (May 2002)

• Undocumented changes.

Revision A (March 2002)

• Original Release of this Document.

DS21350D-page 13

TC1054/TC1055/TC1186

NOTES:

DS21350D-page 14

TC1054/TC1055/TC1186

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

PART NO.

Device

X.X

XXXXX

X

a)

b)

c)

d)

e)

f)

TC1054-1.8VCT713: 1.8V LDO Regulator

TC1054-2.5VCT713: 2.5V LDO Regulator

TC1054-2.6VCT713: 2.6V LDO Regulator

TC1054-2.7VCT713: 2.7V LDO Regulator

TC1054-2.8VCT713: 2.8V LDO Regulator

TC1054-2.85VCT713: 2.85V LDO Regulator

TC1054-3.0VCT713: 3.0V LDO Regulator

TC1054-3.3VCT713: 3.3V LDO Regulator

TC1054-3.6VCT713: 3.6V LDO Regulator

TC1054-4.0VCT713: 4.0V LDO Regulator

TC1054-5.0VCT713: 5.0V LDO Regulator

Output

Voltage

Package

Temperature

Range

Device:

TC1054: 50 mA LDO with Shutdown & Error output

TC1055: 100 mA LDO with Shutdown & Error output

TC1186: 150 mA LDO with Shutdown & Error output

g)

h)

i)

Output Voltage *:

1.8

2.5

2.6

2.7

2.8

=

1.8V “Standard”

2.5V “Standard”

2.6V “Standard”

2.7V “Standard”

2.8V “Standard”

2.85V “Standard”

3.0V “Standard”

3.3V “Standard”

3.6V “Standard”

4.0V “Standard”

5.0V “Standard”

j)

k)

a)

b)

c)

d)

e)

f)

TC1055-1.8VCT713: 1.8V LDO Regulator

TC1055-2.5VCT713: 2.5V LDO Regulator

TC1055-2.6VCT713: 2.6V LDO Regulator

TC1055-2.7VCT713: 2.7V LDO Regulator

TC1055-2.8VCT713: 2.8V LDO Regulator

TC1055-2.85VCT713: 2.85V LDO Regulator

TC1055-3.0VCT713: 3.0V LDO Regulator

TC1055-3.3VCT713: 3.3V LDO Regulator

TC1055-3.6VCT713: 3.6V LDO Regulator

TC1055-4.0VCT713: 4.0V LDO Regulator

TC1055-5.0VCT713: 5.0V LDO Regulator

2.85 =

3.0

3.3

3.6

4.0

5.0

=

*Contact factory for other output voltage options.

g)

h)

i)

Temperature Range:

Package:

V

= -40°C to +125°C

j)

CT713 = 5L SOT-23, Tape and Reel

k)

a)

b)

c)

d)

e)

f)

TC1186-1.8VCT713: 1.8V LDO Regulator

TC1186-2.5VCT713: 2.5V LDO Regulator

TC1186-2.6VCT713: 2.6V LDO Regulator

TC1186-2.7VCT713: 2.7V LDO Regulator

TC1186-2.8VCT713: 2.8V LDO Regulator

TC1186-2.85VCT713: 2.85V LDO Regulator

TC1186-3.0VCT713: 3.0V LDO Regulator

TC1186-3.3VCT713: 3.3V LDO Regulator

TC1186-3.6VCT713: 3.6V LDO Regulator

TC1186-4.0VCT713: 4.0V LDO Regulator

TC1186-5.0VCT713: 5.0V LDO Regulator

g)

h)

i)

j)

k)

DS21350D-page 15

TC1054/TC1055/TC1186

NOTES:

DS21350D-page 16

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and

SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Linear Active Thermistor, Migratable

Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor

and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,

MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona, Gresham, Oregon and Mountain View, California. The

Company’s quality system processes and procedures are for its PIC^®

MCUs and dsPIC^®DSCs, KEELOQ^®code hopping devices, Serial

EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and

manufacture of development systems is ISO 9001:2000 certified.

DS21350D-page 17

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Habour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Korea - Gumi

Tel: 82-54-473-4301

Fax: 82-54-473-4302

Boston

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

China - Xian

Tel: 86-29-8833-7250

Fax: 86-29-8833-7256

12/08/06

DS21350D-page 18


型号：	TC1055-5.0VCT713
厂家：	MICROCHIP
描述：	50 mA, 100 mA and 150 mA CMOS LDOs with Shutdown and ERROR Output 50毫安100 mA和150毫安CMOS LDO，具有关断和错误输出线性稳压器IC 调节器电源电路光电二极管输出元件
文件：	总18页 (文件大小：375K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TC1055-5.0VCT713 [MICROCHIP]

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