TC1055-5.0VCTRT [MICROCHIP]
5 V FIXED POSITIVE LDO REGULATOR, 0.25 V DROPOUT, PDSO5, SOT-23A, 5 PIN;
| 型号： | TC1055-5.0VCTRT |
| 厂家： | 
MICROCHIP |
| 描述： | 5 V FIXED POSITIVE LDO REGULATOR, 0.25 V DROPOUT, PDSO5, SOT-23A, 5 PIN 线性稳压器IC 调节器 电源电路 光电二极管 输出元件 |
| 文件： | 总18页 (文件大小：502K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1054/TC1055/TC1186
50mA, 100mA and 150mA CMOS LDOs with Shutdown and ERROR Output
Features
Device Selection Table
• Extremely Low Ground Current for Longer
Battery Life
Junction
Temp. Range
Part Number
Package
• Very Low Dropout Voltage
TC1054-xxVCT 5-Pin SOT-23A -40°C to +125°C
TC1055-xxVCT 5-Pin SOT-23A -40°C to +125°C
TC1186-xxVCT 5-Pin SOT-23A -40°C to +125°C
• Choice of 50mA (TC1054), 100mA (TC1055) and
150mA (TC1186) Output
• High Output Voltage Accuracy
• Standard or Custom Output Voltages
• Power-Saving Shutdown Mode
NOTE: xx indicates output voltages
Available Output Voltages: 1.8, 2.5, 2.7, 2.8, 2.85, 3.0, 3.3,
3.6, 4.0, 5.0.
• ERROR Output Can Be Used as a Low Battery
Detector, or Processor Reset Generator
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
• Over Current and Over Temperature Protection
• Space-Saving 5-Pin SOT-23A Package
Package Type
• Pin Compatible Upgrades for Bipolar Regulators
5-Pin SOT-23A
Applications
V
OUT
5
ERROR
4
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
TC1054
TC1055
TC1186
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
1
2
3
V
GND SHDN
IN
NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A)
2002 Microchip Technology Inc.
DS21350B-page 1
TC1054/TC1055/TC1186
General Description
Typical Application
The TC1054, TC1055 and TC1186 are high accuracy
(typically ±0.5%) CMOS upgrades for older (bipolar)
low dropout regulators. Designed specifically for
battery-operated systems, the devices’ CMOS
construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 50µA at full load (20 to 60 times lower than
in bipolar regulators).
1
5
V
V
V
V
OUT
IN
IN
OUT
+
TC1054
TC1055
TC1186
1µF
2
3
GND
The devices’ key features include ultra low noise
operation, very low dropout voltage – typically 85mV
(TC1054); 180mV (TC1055); and 270mV (TC1186) at
full load — and fast response to step changes in load.
An error output (ERROR) is asserted when the devices
are out-of-regulation (due to a low input voltage or
excessive output current). ERROR can be used as a
low battery warning or as a processor RESET signal
(with the addition of an external RC network). Supply
4
ERROR
SHDN
ERROR
Shutdown Control
(from Power Control Logic)
current is reduced to 0.5µA (max) and both V
and
OUT
ERROR are disabled when the shutdown input is low.
The devices incorporate both over-temperature and
over-current protection.
The TC1054, TC1055 and TC1186 are stable with an
output capacitor of only 1µF and have a maximum
output current of 50mA, 100mA and 150mA,
respectively. For higher output current regulators,
please see the TC1173 (I
= 300mA) data sheet.
OUT
DS21350B-page 2
2002 Microchip Technology Inc.
TC1054/TC1055/TC1186
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage......................................................... 6.5V
Output Voltage...........................(-0.3V) to (V + 0.3V)
IN
Power Dissipation............... Internally Limited (Note 6)
Maximum Voltage on Any Pin ........ V +0.3V to -0.3V
IN
Operating Temperature Range......-40°C < T < 125°C
J
Storage Temperature......................... -65°C to +150°C
TC1054/TC1055/TC1186 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
VIN
Parameter
Min
2.7
Typ
Max
6.0
Units
Test Conditions
Note 8
Input Operating Voltage
Maximum Output Current
—
V
IOUTMAX
50
100
150
—
—
—
—
—
—
mA
TC1054
TC1055
TC1186
VOUT
Output Voltage
VR – 2.5% VR ±0.5% VR + 2.5%
V
Note 1
TCVOUT
VOUT Temperature Coefficient
—
—
20
40
—
—
ppm/°C Note 2
∆VOUT/∆VIN
Line Regulation
—
0.05
0.35
%
%
(VR + 1V) ≤ VIN ≤ 6V
∆VOUT/VOUT Load Regulation TC1054; TC1055
—
—
0.5
0.5
2
3
IL = 0.1mA to IOUTMAX
IL = 0.1mA to IOUTMAX
(Note 3)
TC1186
VIN-VOUT
Dropout Voltage
—
—
—
—
—
2
65
85
180
270
—
—
120
250
400
mV
I
I
I
I
I
L = 100µA
L = 20mA
L = 50mA
L = 100mA
TC1055; TC1186
TC1186
L = 150mA (Note 4)
IIN
Supply Current
—
—
—
—
—
—
—
—
50
0.05
64
80
0.5
—
µA
µA
SHDN = VIH, IL = 0
SHDN = 0V
FRE ≤ 1kHz
IINSD
PSRR
IOUTSC
∆VOUT/∆PD
TSD
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
dB
300
0.04
160
10
450
—
mA
V/W
°C
VOUT = 0V
Notes 5, 6
Thermal Shutdown Die Temperature
Thermal Shutdown Hysteresis
Output Noise
—
∆TSD
eN
—
°C
260
—
nV/√Hz IL = IOUTMAX
Note 1: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.
TC VOUT = (VOUTMAX – VOUTMIN)x 106
2:
VOUT x ∆T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7: Hysteresis voltage is referenced by VR.
8: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX
.
2002 Microchip Technology Inc.
DS21350B-page 3
TC1054/TC1055/TC1186
TC1054/TC1055/TC1186 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
SHDN Input
VIH
VIL
SHDN Input High Threshold
SHDN Input Low Threshold
45
—
—
—
—
%VIN
%VIN
VIN = 2.5V to 6.5V
15
VIN = 2.5V to 6.5V
ERROR Output
VINMIN
VOL
Minimum VIN Operating Voltage
1.0
—
—
—
—
—
—
400
—
V
Output Logic Low Voltage
ERROR Threshold Voltage
ERROR Positive Hysteresis
mV
V
1 mA Flows to ERROR
See Figure 3-2
Note 7
VTH
0.95 x VR
50
VHYS
—
mV
Note 1: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.
TC VOUT = (VOUTMAX – VOUTMIN)x 106
2:
VOUT x ∆T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7: Hysteresis voltage is referenced by VR.
8: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX
.
DS21350B-page 4
2002 Microchip Technology Inc.
TC1054/TC1055/TC1186
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(5-Pin SOT-23A)
Symbol
Description
1
2
3
VIN
Unregulated supply input.
Ground terminal.
GND
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is applied to this
input. The regulator enters shutdown when a logic low is applied to this input. During
shutdown, output voltage falls to zero, ERROR is open circuited and supply current is
reduced to 0.5µA (max).
4
5
ERROR
VOUT
Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-
tolerance by approximately – 5%.
Regulated voltage output.
2002 Microchip Technology Inc.
DS21350B-page 5
TC1054/TC1055/TC1186
3.1
ERROR Open Drain Output
3.0
DETAILED DESCRIPTION
ERROR is driven low whenever V
falls out of
The TC1054, TC1055 and TC1186 are precision fixed
output voltage regulators. (If an adjustable version is
desired, please see the TC1070/TC1071/TC1187 data
sheet.) Unlike bipolar regulators, the TC1054, TC1055
and TC1186 supply current does not increase with load
OUT
regulation by more than – 5% (typical). This condition
may be caused by low input voltage, output current
limiting, or thermal limiting. The ERROR threshold is
5% below rated V
regardless of the programmed
OUT
output voltage value (e.g. ERROR = V at 4.75V (typ.)
current. In addition, V
remains stable and within
OL
OUT
for a 5.0V regulator and 2.85V (typ.) for a 3.0V
regulator). ERROR output operation is shown in
Figure 3-2.
regulation over the entire 0mA to I
load current range, (an important consideration in RTC
and CMOS RAM battery back-up applications).
operating
OUTMAX
Note that ERROR is active when V
falls to V , and
TH
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
OUT
inactive when V
rises above V by V
.
OUT
TH
HYS
(SHDN) is at or above V , and shutdown (disabled)
IH
As shown in Figure 3-1, ERROR can be used as a
battery low flag, or as a processor RESET signal (with
the addition of timing capacitor C2). R1 x C2 should be
when SHDN is at or below V . SHDN may be
IL
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05µA
chosen to maintain ERROR below V of the processor
IH
RESET input for at least 200 msec to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
(typical), V
falls to zero volts, and ERROR is open-
OUT
V
, V or any other voltage less than (V + 0.3V).
OUT IN
IN
circuited.
FIGURE 3-2:
ERROR OUTPUT
OPERATION
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
V
OUT
V
V
V
OUT
IN
OUT
+
1µF
+
TC1054
TC1055
TC1186
HYSTERESIS (V
)
H
+
1µF
C1
V
TH
Battery
GND
ERROR
V
IH
V+
SHDN
ERROR
V
OL
R1
1M
Shutdown Control
(to CMOS Logic or Tie
C2 Required Only
if ERROR is used as a
BATTLOW
or RESET
to V if unused)
Processor RESET Signal
(See Text)
IN
3.2
Output Capacitor
0.2µF
C2
A
1µF (min) capacitor from
V
to ground is
OUT
recommended. The output capacitor should have an
effective series resistance greater than 0.1Ω and less
than 5.0Ω, and a resonant frequency above 1MHz. A
1µF capacitor should be connected from V to GND if
IN
there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approxi-
mately -30°C, solid tantalums are recommended for
applications operating below -25°C.) When operating
from sources other than batteries, supply-noise
rejection and transient response can be improved by
increasing the value of the input and output capacitors
and employing passive filtering techniques.
DS21350B-page 6
2002 Microchip Technology Inc.
TC1054/TC1055/TC1186
Equation 4-1 can be used in conjunction with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Given:
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
V
V
= 3.0V ±5%
= 2.7V – 2.5%
= 40mA
INMAX
OUTMIN
LOADMAX
I
T
JMAX
= 125°C
4.2
Power Dissipation
T
= 55°C
AMAX
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX – VOUTMIN)I
LOADMAX
EQUATION 4-1:
–3
= [(3.0 x 1.05) – (2.7 x .975)]40 x 10
= 20.7mW
P
≈ (VINMAX – VOUTMIN)I
LOADMAX
D
Where:
Maximum allowable power dissipation:
= Worst case actual power dissipation
P
D
P
DMAX = (TJMAX – T
)
AMAX
= Maximum voltage on V
V
IN
INMAX
θ
JA
V
= Minimum regulator output voltage
= Maximum output (load) current
OUTMIN
= (125 – 55)
220
I
LOADMAX
= 318mW
The
maximum
allowable
power
dissipation
(Equation 4-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
In this example, the TC1054 dissipates a maximum of
20.7mW; below the allowable limit of 318mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits.
junction-to-air (θ ). The 5-Pin SOT-23A package has
JA
a θ of approximately 220°C/Watt.
JA
EQUATION 4-2:
4.3
Layout Considerations
P
DMAX= (TJMAX – T
)
AMAX
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
θ
JA
Where all terms are previously defined.
supply bus lines combine to lower θ and therefore,
JA
increase the maximum allowable power dissipation
limit.
2002 Microchip Technology Inc.
DS21350B-page 7
TC1054/TC1055/TC1186
5.0
TYPICAL CHARACTERISTICS
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Dropout Voltage vs. Temperature (V
= 10mA
= 3.3V)
Dropout Voltage vs. Temperature (V
= 3.3V)
OUT
OUT
0.100
0.090
0.080
0.070
0.060
0.050
0.040
0.030
0.020
0.010
0.000
0.020
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0.000
I
I
= 50mA
LOAD
LOAD
C
C
= 1µF
IN
OUT
C
C
= 1µF
IN
OUT
= 1µF
= 1µF
-40
-20
0
20
50
70
125
-40
-20
0
20
50
70
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Dropout Voltage vs. Temperature (V
= 3.3V)
OUT
Dropout Voltage vs. Temperature (V
= 3.3V)
0.200
0.180
0.160
0.140
0.120
0.100
0.080
0.060
0.040
0.020
0.000
OUT
0.300
0.250
0.200
0.150
0.100
0.050
0.000
I
= 100mA
LOAD
I
= 150mA
LOAD
C
C
= 1µF
C
C
= 1µF
IN
OUT
IN
OUT
= 1µF
= 1µF
-40
-20
0
20
50
70
125
-40
-20
0
20
50
70
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Ground Current vs. V (V
IN OUT
= 3.3V)
Ground Current vs. V (V
IN OUT
= 3.3V)
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
I
= 100mA
I
= 10mA
LOAD
LOAD
C
C
= 1µF
= 1µF
IN
OUT
C
OUT
= 1µF
IN
C
= 1µF
0 0.5 1 1.5
2
2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
(V)
0
0.5 1 1.5
2
2.5
3
3.5 4 4.5
(V)
5
5.5 6 6.5 7 7.5
V
IN
V
IN
DS21350B-page 8
2002 Microchip Technology Inc.
TC1054/TC1055/TC1186
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)
Ground Current vs. V (V
IN OUT
= 3.3V)
V
vs.
V
(V = 3.3V)
IN OUT
OUT
3.5
3
80
70
60
50
40
30
20
10
0
I
= 0
I
= 150mA
LOAD
LOAD
2.5
2
1.5
1
0.5
0
C
C
= 1µF
IN
C
C
= 1µF
IN
OUT
= 1µF
OUT
= 1µF
0
0.5 1 1.5
2
2.5
3
3.5
(V)
4
4.5
5
5.5
6
6.5
7
0 0.5 1 1.5
2
2.5
3
3.5 4 4.5
(V)
5 5.5 6 6.5 7 7.5
V
V
IN
IN
Output Voltage vs. Temperature (V
= 3.3V)
OUT
V
vs.
V = 3.3V)
(V
OUT
IN OUT
3.320
3.315
3.310
3.305
3.300
3.295
3.290
3.285
3.280
3.275
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
I = 10mA
LOAD
I
= 100mA
LOAD
C
C
= 1µF
IN
OUT
= 1µF
C
C
= 1µF
V
= 4.3V
IN
OUT
IN
= 1µF
-40
-20
-10
0
20
40
85
125
0
0.5
1
1.5
2
2.5
3
3.5
(V)
4
4.5
5
5.5
6
6.5 7
V
TEMPERATURE (°C)
IN
Output Voltage vs. Temperature (V
= 3.3V)
OUT
3.290
I
= 150mA
LOAD
3.288
3.286
3.284
3.282
3.280
3.278
3.276
3.274
C
C
V
= 1µF
IN
OUT
IN
= 1µF
= 4.3V
-40
-20
-10
0
20
40
85
125
TEMPERATURE (°C)
2002 Microchip Technology Inc.
DS21350B-page 9
TC1054/TC1055/TC1186
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)
Output Voltage vs. Temperature (V
= 10mA
= 5V)
Output Voltage vs. Temperature (V
= 150mA
= 5V)
OUT
OUT
4.994
4.992
4.990
4.988
4.986
4.984
4.982
4.980
4.978
4.976
4.974
5.025
5.020
5.015
5.010
5.005
5.000
4.995
4.990
4.985
I
I
LOAD
LOAD
V
C
C
= 6V
V
C
C
= 6V
IN
IN
IN
IN
= 1µF
= 1µF
= 1µF
OUT
= 1µF
OUT
-40
-20
-10
0
20
40
85
125
-40
-20
-10
0
20
40
85
125
TEMPERATURE (°C)
TEMPERATURE (°C)
Temperature vs. Quiescent Current (V
OUT
= 5V)
Temperature vs. Quiescent Current (V
= 5V)
OUT
80
70
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
I
= 150mA
LOAD
I
= 10mA
LOAD
V
C
C
= 6V
IN
= 1µF
IN
OUT
= 1µF
V
= 6V
IN
IN
C
= 1µF
C
= 1µF
-40
-20
-10
0
20
40
85
125
OUT
TEMPERATURE (°C)
-40
-20
-10
0
20
40
85
125
TEMPERATURE (°C)
Output Noise vs. Frequency
Stability Region vs. Load Current
= 1µF
Power Supply Rejection Ratio
= 10mA
1000
-30
-35
10.0
1.0
C
I
OUT
to 10µF
OUT
R
C
C
= 50Ω
LOAD
= 1µF
IN
V
V
V
= 4V
IN
IN
OUT
IN
OUT
DC
AC
OUT
= 100mV
= 3V
-40
-45
p-p
= 1µF
100
10
1
C
C
= 0
= 1µF
-50
-55
Stable Region
-60
-65
-70
-75
-80
0.1
0.0
0.1
0.01
0.1K
1K
10K
1000K
100K
0.01K
0.01K 0.1K
10
1K
10K 100K 1000K
0
20 30 40 50 60 70 80 90 100
LOAD CURRENT (mA)
FREQUENCY (Hz)
FREQUENCY (Hz)
DS21350B-page 10
2002 Microchip Technology Inc.
TC1054/TC1055/TC1186
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
Measure Fall Time of 3.3V LDO
Measure Rise Time of 3.3V LDO
Conditions: C = 1µF, C
IN OUT
= 1µF, I
LOAD
= 100mA, V = 4.3V,
IN
Conditions: C = 1µF, C
IN OUT
= 1µF, I
LOAD
= 100mA, V = 4.3V,
IN
Temp = 25°C, Fall Time = 52µS
Temp = 25°C, Fall Time = 184µS
VSHDN
VSHDN
VOUT
VOUT
Measure Rise Time of 5.0V LDO
Measure Fall Time of 5.0V LDO
Conditions: C = 1µF, C
IN OUT
= 1µF, I
LOAD
= 100mA, V = 6V,
IN
Conditions: C = 1µF, C
IN OUT
= 1µF, I
LOAD
= 100mA, V = 6V,
IN
Temp = 25°C, Fall Time = 192µS
Temp = 25°C, Fall Time = 88µS
VSHDN
VSHDN
VOUT
VOUT
Thermal Shutdown Response of 5.0V LDO
Conditions: V = 6V, C = 0µF, C
IN IN
= 1µF
OUT
VOUT
I
was increased until temperature of die reached about 160°C, at
LOAD
which time integrated thermal protection circuitry shuts the regulator
off when die temperature exceeds approximately 160°C. The regulator
remains off until die temperature drops to approximately 150°C.
2002 Microchip Technology Inc.
DS21350B-page 11
TC1054/TC1055/TC1186
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
“1” & “2” = part number code + temperature range and
voltage
TC1054
Code
TC1055
Code
TC1186
Code
(V)
1.8
2.5
2.7
2.8
2.85
3.0
3.3
3.6
4.0
5.0
CY
C1
C2
CZ
C8
C3
C5
C9
C0
C7
DY
D1
D2
DZ
D8
D3
D5
D9
D0
D7
PY
P1
P2
PZ
P8
P3
P5
P9
P0
P7
“3” represents year and quarter code
“4” represents lot ID number
6.2
Taping Form
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices
User Direction of Feed
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
5-Pin SOT-23A
8 mm
4 mm
3000
7 in
DS21350B-page 12
2002 Microchip Technology Inc.
TC1054/TC1055/TC1186
6.3
Package Dimensions
SOT-23A-5
.075 (1.90)
REF.
.071 (1.80)
.059 (1.50)
.122 (3.10)
.098 (2.50)
.020 (0.50)
.012 (0.30)
PIN 1
.037 (0.95)
REF.
.122 (3.10)
.106 (2.70)
.057 (1.45)
.035 (0.90)
.010 (0.25)
.004 (0.09)
10° MAX.
.006 (0.15)
.000 (0.00)
.024 (0.60)
.004 (0.10)
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21350B-page 13
TC1054/TC1055/TC1186
NOTES:
DS21350B-page 14
2002 Microchip Technology Inc.
TC1054/TC1055/TC1186
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21350B-page 15
TC1054/TC1055/TC1186
NOTES:
DS21350B-page 16
2002 Microchip Technology Inc.
TC1054/TC1055/TC1186
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21350B-page 17
WORLDWIDE SALES AND SERVICE
Japan
AMERICAS
ASIA/PACIFIC
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Corporate Office
Australia
2355 West Chandler Blvd.
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Korea
Rocky Mountain
China - Beijing
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
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Tel: 86-28-86766200 Fax: 86-28-86766599
Tel: 630-285-0071 Fax: 630-285-0075
China - Fuzhou
Dallas
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
4570 Westgrove Drive, Suite 160
Addison, TX 75001
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
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Tel: 45 4420 9895 Fax: 45 4420 9910
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Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
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Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Kokomo
France
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Tel: 765-864-8360 Fax: 765-864-8387
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Microchip Technology SARL
Parc d’Activite du Moulin de Massy
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Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
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Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
New York
150 Motor Parkway, Suite 202
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Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
China - Hong Kong SAR
Italy
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
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6285 Northam Drive, Suite 108
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Tel: 905-673-0699 Fax: 905-673-6509
India
Tel: 39-039-65791-1 Fax: 39-039-6899883
Microchip Technology Inc.
India Liaison Office
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
05/01/02
DS21350B-page 18
2002 Microchip Technology Inc.
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