MCRF250-I/P [MICROCHIP]
125 kHz microID Passive RFID Device with Anti-Collision; 125千赫microID无源RFID设备与防碰撞
| 型号： | MCRF250-I/P |
| 厂家： | 
MICROCHIP |
| 描述： | 125 kHz microID Passive RFID Device with Anti-Collision |
| 文件： | 总24页 (文件大小：384K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCRF250
125 kHz microID™ Passive RFID Device with Anti-Collision
Features
Package Type
PDIP/SOIC
Factory programming and memory serialization
VA
1
2
3
4
8
7
6
5
VB
(SQTPSM
)
NC
I/O
NC
VSS
VCC
• Anti-collision feature to read multiple tags in the
same RF field.
• One-time contactless programmable (developer
kit only)
Reset
• Read-only data transmission after programming
Note: Pins 3, 4, 5 and 6 are for device test purposes only.
Pins 1 and 8 are for antenna connection.
• 96 or 128 bits of One-Time Programmable (OTP)
user memory (also supports 48- and 64-bit
protocols)
Description
• Typical operation frequency: 100 kHz-400 kHz
• Ultra low-power operation (5 µA @ VCC = 2V)
• Modulation options:
The MCRF250 is equipped with an anti-collision
feature that allows multiple tags in the same field to be
read simultaneously. This revolutionary feature
eliminates the issue of data corruption due to
simultaneous transmissions from multiple tags.
- ASK, FSK, PSK
• Data Encoding options:
The MCRF250 is a passive Radio Frequency Identifi-
cation (RFID) device for low frequency applications
(100 kHz-400 kHz). The device is powered by
rectifying an incoming RF signal from a reader
interrogator. The device requires an external LC
resonant circuit to receive the incoming energizing
signal and to send data. The device develops a
sufficient DC voltage for operation when it’s external
coil voltage reaches approximately 10 VPP.
- NRZ Direct, Differential Biphase, Manchester
Biphase
• Die, wafer, COB or SOIC package options
• Factory programming options
Applications
• Access control and time attendance
• Security systems
This device has a total of 128 bits of user programma-
ble memory and an additional 12 bits in its configuration
register. The user can manually program the 128 bits of
user memory by using a contactless programmer in a
microID developer kit such as DV103001 or
PG103001. However, in production volume the
MCRF250 is programmed at the factory (Microchip
SQTP - see Technical Bulletin TB023).The device is a
One-Time Programmable (OTP) integrated circuit and
operates as a read-only device after programming.
• Animal tagging
• Product identification
• Industrial tagging
• Inventory control
• Multiple item tagging
RF
Signal
Reader
MCRF250
Data
2003 Microchip Technology Inc.
DS21267F-page 1
MCRF250
Block Diagram
Modulation and
Anti-Collision
Control
Data
Clock
Row
Decode
Memory
Array
Generator
Coil
Connections
Load
VCC
VSS
Rectifier
Column
Decode
Counter
The configuration register includes options for commu-
nication protocol (ASK, FSK, PSK), data encoding
method, data rate and data length.These options are
specified by customer and are factory programmed
during production.
The device has a modulation transistor between the
two antenna connections (VA and VB). The modulation
transistor damps or undamps the coil voltage when it
sends data. The variation of coil voltage controlled by
the modulation transistor results in a perturbation of
voltage in reader antenna coil. By monitoring the
changes in reader coil voltage, the data transmitted
from the device can be reconstructed.
The device is available in die, wafer, Chip-on-Board
(COB) modules, PDIP or SOIC packages. Factory
programming and memory serialization (SQTP) are
also available upon request. See TB023 for more
information on contact programming support.
The DV103002 Developer’s Kit includes Contactless
Programmer, MCRF250 Anti-Collision FSK reference
reader, and reference design guide. The reference
design guide includes schematics for readers and
contactless programmer as well as in-depth
documentation for antenna circuit designs.
DS21267F-page 2
2003 Microchip Technology Inc.
MCRF250
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
Storage temperature ..............................................................................................................................- 65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
Maximum current into coil pads ..............................................................................................................................50 mA
† NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
AC AND DC CHARACTERISTICS
All parameters apply across the
specified operating ranges
unless otherwise noted.
Industrial (I): TA = -40°C to +85°C
Parameter
Sym
Min
Typ
Max
Units
Conditions
Clock frequency
FCLK
TWC
100
—
—
2
400
—
kHz
sec
Years
µA
Contactless programming time
Data retention
For all 128-bit array
at 25°C
200
—
—
50
5
—
Coil current (Dynamic)
Operating current
ICD
IDD
—
µA
VCC = 2V
Turn-on-voltage (Dynamic) for
modulation
VAVB
VCC
CIN
10
2
—
—
2
—
—
—
VPP
VDC
pF
Input Capacitance
—
Between VA and VB
2003 Microchip Technology Inc.
DS21267F-page 3
MCRF250
2.1.3
CLOCK GENERATOR
2.0
FUNCTIONAL DESCRIPTION
This circuit generates a clock based on the carrier
frequency from the reader. This clock is used to derive
all timing in the device, including the baud rate and
modulation rate.
The device contains three major building blocks. They
are RF front-end, configuration and control logic, and
memory sections. The Block Diagram is shown on
page 1.
2.1.4
IRQ DETECTOR
2.1
RF Front-End
This circuitry detects an interrupt in the continuous
electromagnetic field of the interrogator. An IRQ
(interrupt request) is defined as the absence of the
electromagnetic field for a specific number of clock
cycles. Detection of an IRQ will trigger the device to
enter the Anti-collision mode. This mode is discussed
in detail in Section 5.0 “Anti-Collision”.
The RF front-end of the device includes circuits for
rectification of the carrier, VDD (operating voltage), and
high-voltage clamping to prevent excessive voltage
from being applied to the device. This section also
generates a system clock from the incoming carrier
signal and modulates the carrier signal to transmit data
to the reader.
2.1.5
MODULATION CIRCUIT
2.1.1
RECTIFIER – AC CLAMP
The device sends the encoded data to the reader by
AM-modulating the coil voltage across the tuned LC
circuit. A modulation transistor is placed between the
two antenna coil pads (VA and VB). The transistor turns
on and off based on the modulation signal. As a result,
the amplitude of the antenna coil voltage varies with the
modulation signal. See Figure 2-1 for details.
The rectifier circuit rectifies RF voltage on the external
LC antenna circuit. Any excessive voltage on the tuned
circuit is clamped by the internal circuitry to a safe level
to prevent damage to the IC.
2.1.2
POWER-ON RESET
This circuit generates a Power-on Reset when the tag
first enters the reader field. The Reset releases when
sufficient power has developed on the VDD regulator to
allow correct operation.
FIGURE 2-1:
MODULATION SIGNAL AND MODULATED SIGNAL
MCRF250
VA
Modulation
Signal
L
C
Modulation
Transistor
VB
Amplitude
Modulation Signal
t
Modulated RF Signal
(across VA and VB)
DS21267F-page 4
2003 Microchip Technology Inc.
MCRF250
2.2.3
MODULATION OPTION
2.2
Configuration Register and
Control Logic
CB8 and CB9 determine the modulation protocol of the
encoded data. The available choices are:
The configuration register determines the operational
parameters of the device. The configuration register
can not be programmed contactlessly; it is
programmed during wafer probe at the Microchip fac-
tory. CB11 is always a one; CB12 is set when success-
ful contact or contactless programming of the data
array has been completed. Once CB12 is set, device
programming and erasing is disabled. Table 2-1
contains a description of the bit functions of the control
register.
• ASK
• FSK
• PSK_1
• PSK_2
When ASK (direct) option is chosen, the encoded data
is fed into the modulation transistor without change.
When FSK option is chosen, the encoded data is
represented by:
a) Sets of 10 RF carrier cycles (first 5 cycles →
higher amplitude, the last 5 cycles → lower
amplitude) for logic “high” level.
2.2.1
BAUD RATE TIMING OPTION
The chip will access data at a baud rate determined by
bits CB2, CB3, and CB4 of the configuration register.
For example, MOD32 (CB2 = 0, CB3 = 1, CB4 = 1) has
32 RF cycles per bit. This gives the data rate of 4 kHz
for the RF carrier frequency of 128 kHz.
b) Sets of 8 RF carrier cycles (first 4 cycles →
higher amplitude, the last 4 cycles → lower
amplitude) for logic “low” level.
For example, FSK signal for MOD40 is represented:
The default timing is MOD 128 (FCLK/128), and this
mode is used for contact and contactless program-
ming. Once the array is successfully programmed, the
lock bit CB12 is set. When the lock bit is set, program-
ming and erasing the device becomes permanently
disabled. The configuration register has no effect on
device timing until the EEPROM data array is
programmed (CB12 = 1).
a) 4 sets of 10 RF carrier cycles for data ‘1’.
b) 5 sets of 8 RF carrier cycles for data ‘0’.
Refer to Figure 2-2 for the FSK signal with MOD40
option.
The PSK_1 represents change in the phase of the
modulation signal at the change of the encoded data.
For example, the phase changes when the encoded
data is changed from ‘1’ to ‘0’, or from ‘0’ to ‘1’.
2.2.2
DATA ENCODING OPTION
The PSK_2 represents change in the phase at the
change on ‘1’. For example, the phase changes when
the encoded data is changed from ‘0’ to ‘1’, or from ‘1’
to ‘1’.
This logic acts upon the serial data being read from the
EEPROM. The logic encodes the data according to the
configuration bits CB6 and CB7. CB6 and CB7
determine the data encoding method. The available
choices are:
• Non-return to zero-level (NRZ_L)
• Biphase_S (Differential)
• Biphase_L (Manchester)
• Inverted Manchester
FIGURE 2-2:
ENCODED DATA AND FSK OUTPUT SIGNAL FOR MOD40 OPTION
Encoded Data ‘1’
Encoded Data ‘0’
5 cycles (HI)
5 cycles (LO)
4 cycles (HI)
4 cycles (LO)
40 RF cycles
40 RF cycles
2003 Microchip Technology Inc.
DS21267F-page 5
MCRF250
FIGURE 2-3:
PSK DATA MODULATION
‘1’
‘0’
‘0’
‘1’
‘1’
Encoded Data
(NRZ_L)
PSK_ 1
Change on Data
PP
PP
PP
PP
PSK _2
Change on ‘1’
P
P
PP
2.2.4
MEMORY ARRAY LOCK BIT (CB12)
2.4
Examples of Configuration
Settings
The CB12 must be ‘0’ for contactless programming
(Blank). The bit (CB12) is automatically set to ‘1’ itself
as soon as the device is programmed contactlessly.
EXAMPLE 2-1:
“48D” CONFIGURATION
The “48D” (hex) configuration is interpreted as
follows:
2.3
Memory Section
CB1
CB12
The device has 128 bits of one-time programmable
(OTP) memory. The user can choose 96 or 128 bits by
selecting the CB1 bit in the configuration register. See
Table 2-1 for more details.
“48D” → 0100-1000-1101
Referring to Table 2-1, the “48D” configuration
represents:
2.3.1
COLUMN AND ROW DECODER
LOGIC AND BIT COUNTER
Blank (not programmed) Device
Anti-Collision
The column and row decoders address the EEPROM
array at the clock rate and generate a serial data
stream for modulation. This data stream can be up to
128 bits in length. The size of the data stream is user
programmable with CB1 and can be set to 96 or 128
bits. Data lengths of 48 and 64 bits are available by
programming the data twice in the array, end-to-end.
Modulation = PSK_1
PSK rate = rf/2
Data encoding = NRZ_L (direct)
Baud rate = rf/32 = MOD32
Memory size: 128 bits
EXAMPLE 2-2:
“40A” CONFIGURATION
The column and row decoders route the proper voltage
to the array for programming and reading. In the
programming modes, each individual bit is addressed
serially from bit 1 to bit 128.
The “40A” (hex) configuration is interpreted as
follows:
CB1
CB12
“40A” → 0100-0000-1010
The MSB corresponds to CB12 and the LSB
corresponds to CB1 of the configuration register.
Therefore, we have:
CB12=0
CB8=0
CB4=1
CB11=1
CB7=0
CB3=0
CB10=0
CB6=0
CB2=1
CB9=0
CB5=0
CB1=0
Referring to Table 2-1, the “40A” configuration
represents:
Not programmed device (blank), anticollision,
FSK protocol, NRZ_L (direct) encoding, MOD50
(baud rate = rf/50), 96 bits.
Note: The sample cards in the DV103002 kit
are configured to “40A”.
DS21267F-page 6
2003 Microchip Technology Inc.
MCRF250
TABLE 2-1:
CONFIGURATION REGISTER
CB12 CB11 CB10 CB9 CB8 CB7 CB6 CB5 CB4 CB3 CB2 CB1
MEMORY SIZE
CB1 = 1 128-bit user memory array
CB1 = 0 96-bit user memory array
BAUD RATE
CB2 CB3 CB4
Rate
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
MOD128
MOD100
MOD80
MOD32
MOD64
MOD50
MOD40
MOD16
SYNC WORD
CB5 = 0 (Always)
DATA ENCODING
CB6 = 0; CB7 = 0 NRZ_L (Direct)
CB6 = 0; CB7 = 1 Biphase_S (Differential)
CB6 = 1; CB7 = 0 Biphase_L (Manchester)
CB6 = 1; CB7 = 1 (Inverted Manchester)
MODULATION OPTIONS
CB8 = 0; CB9 = 0 FSK 0 = Fc/8, 1 = Fc/10
CB8 = 0; CB9 = 1 Direct (ASK)
CB8 = 1; CB9 = 0 PSK_1
(phase change on change of data)
CB8 = 1; CB9 = 1 PSK_2
(phase change at beginning of a one)
PSK RATE OPTION
CB10 = 1 Carrier/4
CB10 = 0 Carrier/2
(ANTI-COLLISION OPTION (Read only)
CB11 = 1 (Always)
MEMORY ARRAY LOCK BIT (Read only)
CB12 = 0 User memory array not locked (Blank)
CB12 = 1 User memory array is locked
(Programmed)
2003 Microchip Technology Inc.
DS21267F-page 7
MCRF250
3.2
Read Mode
3.0
MODES OF OPERATION
After the device is programmed (CB12 = 1), the device
is operated in the Read-only mode. The device
transmits its data according to the protocol in the
configuration register.
The device has two basic modes of operation: Native
Mode and Read Mode.
3.1
Native Mode
Every unprogrammed blank device (CB12 = 0)
operates in Native mode, regardless of configuration
register settings:
Baud rate = FCLK/128, FSK, NRZ_L (direct)
Once the user memory is programmed, the lock bit is
set (CB12 = 1) which causes the MCRF250 to switch
from Native mode to Communication mode defined by
the configuration register.
Refer to Figure 4-1 for contactless programming
sequence. Also see the microID™ 125 kHz RFID
System Design Guide (DS51115) for more information.
FIGURE 3-1:
TYPICAL APPLICATION CIRCUIT
IAC
390 pF
Input capacitance: 2 pF
Pad VA
4.05 mH
From
Reader
RF Signal
125 kHz
L
Pad VB
To Reader
amplifier/filter
MCRF250
Data
C
1
f
= ------------------- = 1 2 5 k H z
res
2π LC
DS21267F-page 8
2003 Microchip Technology Inc.
MCRF250
4.0
CONTACTLESS
PROGRAMMING
The contactless programming of the device is possible
for blank device (CB12 0) only, and is
a
=
recommended for only low-volume, manual operation
during development. In volume production, the
MCRF250 is normally used as a factory programmed
device only. The contactless programming timing
sequence consists of:
a) RF Power-up signal.
b) Short gap (absence of RF field).
c) Verify signal (continuous RF signal).
d) Programming signal.
e) Device response with programmed data.
The blank device (CB12 = 0) understands the RF
power-up followed by a gap as a blank checking
command, and outputs 128 bits of FSK data with all ‘1’s
after the short gap. To see this blank data (verify), the
reader/programmer must provide a continuous RF
signal for 128 bit-time. (The blank (unprogrammed)
device has all ‘F’s in its memory array. Therefore, the
blank data should be all ‘1’s in FSK format). Since the
blank device operates at Default mode (MOD128),
there are 128 RF cycles for each bit. Therefore, the
time requirement to complete this verify is 128 bits x
128 RF cycles/bit x 8 use/cycles = 131.1 msec for
125 kHz signal.
As soon as the device completes the verify, it enters the
programming mode. The reader/programmer must
provide RF programming data right after the verify. In
this programming mode, each bit lasts for 128 RF
cycles. Refer to Figure 4-1 for the contactless
programming sequence.
Customer must provide the following specific voltage
for the programming:
1. Power-up and verify signal = 13.5 VPP ±1 VPP
2. Programming voltage:
- To program bit to ‘1’: 13.5 VPP ±1 VPP
- To program bit to ‘0’: 30 VPP ±2 VPP
After the programming cycle, the device outputs
programmed data (response). The reader/programmer
can send the programming data repeatedly after the
device response until the programming is successfully
completed. The device locks the CB12 as soon as the
programming mode (out of field) is exited and becomes
a read-only device.
Once the device is programmed (CB12 = 1), the device
outputs its data according to the configuration register.
The PG103001 (Contactless Programmer) is used for
the programming of the device. The voltage level
shown in Figure 4-1 is adjusted by R5 and R7 in the
contactless programmer. Refer to the MicroID™
125 kHz RFID System Design Guide (DS51115) for
more information.
2003 Microchip Technology Inc.
DS21267F-page 9
MCRF250
FIGURE 4-1:
CONTACTLESS PROGRAMMING SEQUENCE
DS21267F-page 10
2003 Microchip Technology Inc.
MCRF250
FIGURE 5-1:
ANTI-COLLISION
FLOWCHART
5.0
ANTI-COLLISION
The anti-collision feature is enabled after the array lock
bit (CB12) is set. This feature relies on internal random
number oscillator/counter and special gap pulses
(= turn off RF field) provided by a reader. Figure 5-1
shows the anti-collision flowchart.
Begin
The MCRF250 works with the following anti-collision
features:
Provide Gap*
1. The device does not output data until it sees the
first gap. (no RF field for about 60 µsec.)
2. When the device sees the first gap, the internal
random number oscillator starts clocking
immediately after the gap.
Wait 5-bit times
3. At the same time, the internal random number
counter starts counting the random number
clocks.
4. The device waits for 5 bit times (about 5 msec.
for MOD128 configuration).
Is
No
No
modulation
present?
Example: 1 bit time=RF/128=1 msec for 128 kHz
for MOD128
5. After the 5 bit times, the device sends data.
Yes
6. At this time, the random number counter is still
running. If multiple tags in the field send data at
the same time, the reader will see a data
collision.
Is
only one tag
modulating?
Yes
7. When the reader sees the data collision, it sends
the second gap pulse. (no RF field for about
60 µsec.)
Read Tag
8. After the second gap pulse, there is a chance
that the random number counter of each tag
may have a different value due to a random
variation in the oscillator’s starting time, etc.
Provide gap in the
first half of the first
bit time to make
tag stop
9. After the second gap, the random number
oscillator stops and the random number counter
will decrement at each subsequent gap.
transmitting
10. The device will transmit data when its random
number counter reaches ‘0’.
11. The device repeats this sequence (as shown in
the flowchart in Figure 5-1) according to the
proper gap pulses provided by the reader.
Note:
*Gap = lack of RF carrier signal
= 60 µs ± 20%.
Note:
Each device will output data in
different time frames since each
random number counter will arrive at
‘0’ at different times. As a result, the
reader can receive clean data from a
different tag in each time frame.
2003 Microchip Technology Inc.
DS21267F-page 11
MCRF250
TABLE 6-1:
Passivation
Openings
PAD COORDINATES (µm)
6.0
MECHANICAL
SPECIFICATIONS FOR DIE
AND WAFER
Pad
Pad
FIGURE 6-1:
DIE PLOT
Pad
Name Width
Pad
Pad
Height
Center Center
Device Test Only
X
Y
VA
VB
90.0
90.0
90.0
90.0
427.50
-734.17
Vss
Vcc Reset I/O
-408.60
-734.17
Note 1: All coordinates are referenced from the
center of the die.
2: Die size: 1.1215 mm x 1.7384 mm.
44.15 mils x 68.44 mils
TABLE 6-2:
Name
PAD FUNCTION TABLE
Function
VA
VB
Antenna Coil connections
VSS
VCC
Reset
I/O
For device test only
Do Not Connect to Antenna
VB
VA
DS21267F-page 12
2003 Microchip Technology Inc.
MCRF250
TABLE 6-3:
DIE MECHANICAL DIMENSIONS
Specifications
Min
Typ
Max
Unit
Comments
Bond pad opening
—
—
3.5 x 3.5
89 x 89
—
—
mil
µm
Note 1, Note 2
Die backgrind thickness
—
—
7
—
—
mil
µm
Sawed 6” wafer on frame
(option = WF) Note 3
177.8
—
—
11
279.4
—
—
mil
µm
Unsawed wafer
(option = W) Note 3
Die backgrind thickness tolerance
Die passivation thickness (multilayer)
—
—
—
—
±1
±25.4
mil
µm
—
0.9050
—
µm
Note 4
Die Size:
Die size X*Y before saw (step size)
Die size X*Y after saw
—
—
44.15 x 68.44
42.58 x 66.87
—
—
mil
mil
—
—
Note 1: The bond pad size is that of the passivation opening. The metal overlaps the bond pad passivation by at
least 0.1 mil.
2: Metal Pad Composition is 98.5% Aluminum with 1% Si and 0.5% Cu.
3: As the die thickness decreases, susceptibility to cracking increases. It is recommended that the die be as
thick as the application will allow..
4: The Die Passivation thickness can vary by device depending on the mask set used:
-Layer 1: Oxide (undopped oxide, 0.135 µm)
-Layer 2: PSG (dopped oxide, 0.43 µm)
-Layer 3: Oxynitride (top layer, 0.34 µm)
5: The conversion rate is 25.4 µm/mil.
Notice: Extreme care is urged in the handling and assembly of die products since they are susceptible to
mechanical and electrostatic damage.
TABLE 6-4:
WAFER MECHANICAL SPECIFICATIONS
Specifications
Min
Typ
Max
Unit
Comments
Wafer Diameter
Die separation line width
Dice per wafer
—
—
—
—
8
80
—
—
—
—
inch 150 mm
µm
die
14,000
24
Batch size
wafer
2003 Microchip Technology Inc.
DS21267F-page 13
MCRF250
7.0
FAILED DIE IDENTIFICATION
9.0
NOTICE ON DIE AND WAFER
HANDLING
Every die on the wafer is electrically tested according
to the data sheet specifications and visually inspected
to detect any mechanical damage such as mechanical
cracks and scratches.
The device is very susceptible to Electrostatic
Discharge (ESD). ESD can cause critical damage to
the device. Special attention is needed during the
handling process.
Any failed die in the test or visual inspection is identified
by black colored inking. Therefore, any die covered
with black ink should not be used.
Any ultraviolet (UV) light can erase the memory cell
contents of an unpackaged device. Fluorescent lights
and sun light can also erase the memory cell although
it takes more time than UV lamps. Therefore, keep any
unpackaged devices out of UV light and also avoid
direct exposure from strong fluorescent lights and sun
light.
The ink dot specification:
• Ink dot size: minimum 20 µm x 20 µm
• Position: central third of die
• Color: black
Certain integrated circuit (IC) manufacturing, chip-on-
board (COB) and tag assembly operations may use UV
light. Operations such as backgrind, de-tape, certain
cleaning operations, epoxy or glue cure should be done
without exposing the die surface to UV light.
8.0
WAFER DELIVERY
DOCUMENTATION
Each wafer container is marked with the following
information:
Using x-ray for die inspection will not harm the die, nor
erase memory cell contents.
• Microchip Technology Inc. MP Code
• Lot Number
• Total number of wafer in the container
• Total number of good dice in the container
• Average die per wafer (DPW)
• Scribe number of wafer with number of good dice.
DS21267F-page 14
2003 Microchip Technology Inc.
MCRF250
10.0 PACKAGING INFORMATION
10.1 Package Marking Information
8-Lead PDIP (300 mil)
Example:
MCRF250
XXXXXNNN
0025
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
MCRF250
XXX0025
NNN
NNN
Legend: XX...X Customer specific information*
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard device marking consists of Microchip part number, year code, week code, and traceability
code.
2003 Microchip Technology Inc.
DS21267F-page 15
MCRF250
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
UNITS
INCHES*
NOM
8
MILLIMETERS
DIMENSION LIMITS
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
.100
2.54
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A
.140
.155
.130
.170
3.56
2.92
3.94
3.30
4.32
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
.325
.260
.385
.135
.015
.070
.022
.430
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
B1
B
§
eB
α
15
15
10
10
5
10
10
β
15
5
5
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21267F-page 16
2003 Microchip Technology Inc.
MCRF250
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
A1
UNITS
DIMENSION LIMITS
INCHES*
MILLIMETERS
MIN
NOM
8
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
1.27
.050
1.75
Overall Height
Molded Package Thickness
A
A2
A1
E
.053
.061
.056
.007
.237
.154
.193
.015
.025
.069
1.35
1.55
1.42
.18
1.55
.25
6.20
3.99
5.00
.51
.76
8
.061
.010
.244
.157
.197
.020
.030
1.32
.10
5.79
3.71
4.80
.25
.48
0
.052
.004
.228
.146
.189
.010
.019
0
Standoff
§
6.02
3.91
4.90
.38
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
.62
4
4
Foot Angle
8
c
.25
.51
.010
.020
.20
.33
0
.23
Lead Thickness
Lead Width
.008
.013
0
.009
.017
B
α
.42
15
12
12
12
12
Mold Draft Angle Top
Mold Draft Angle Bottom
15
15
β
15
0
0
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2003 Microchip Technology Inc.
DS21267F-page 17
MCRF250
1M/3M COB (IOA2)
MCRF250 COB
5 mm
Thickness = 0.4 mm
DS21267F-page 18
2003 Microchip Technology Inc.
MCRF250
ON-LINE SUPPORT
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
Microchip provides on-line support on the Microchip
World Wide Web site.
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits. The Hot Line
Numbers are:
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
Connecting to the Microchip Internet
Web Site
042003
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP
service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A
variety of Microchip specific business information is
also available, including listings of Microchip sales
offices, distributors and factory representatives. Other
data available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
2003 Microchip Technology Inc.
DS21267F-page 19
MCRF250
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
Reader Response
Total Pages Sent ________
RE:
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
MCRF250
DS21267F
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21267F-page 20
2003 Microchip Technology Inc.
MCRF250
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
-X
/XXX
XXX
Examples:
a)
MCRF250-I/W40A = 125 kHz, industrial
temperature, wafer package, contactlessly
programmable, 96 bit, FSK Fc/8 Fc/10,
direct encoded, Fc/50 data return rate tag.
Temperature Package Configuration/SQTP Code
Range
b)
MCRF250-I/WFQ23 = 125 kHz, industrial
temperature, wafer sawn and mounted on
frame, factory programmed.
Device:
MCRF250 = 125 kHz Anticollision MicroID tag, 96/128-bit
Temperature Range:
Package:
I
=
-40°C to +85°C
The configuration register is:
CB12 CB11 CB10 CB9 CB8 CB7 CB6 CB5 CB4 CB3 CB2 CB1
WF
W
S
P
SN
=
=
=
=
=
Sawed wafer on frame (7 mil backgrind)
Wafer (11 mil backgrind)
Dice in waffle pack
Plastic PDIP (300 mil Body) 8-lead
Plastic SOIC (150 mil Body) 8-lead
0
1
0
0
0
0
0
0
1
0
1
0
Configuration:
SQTP Code:
Three-digit hex value to be programmed into the configura-
tion register. Three hex characters correspond to 12 binary
bits. These bits are programmed into the configuration
register MSB first (CB12, CB11...CB1). Refer to example.
An assigned, customer 3-digit code used for tracking and
controlling production and customer data files for factory
programming. In this case the configuration code is not
shown in the part number, but is captured in the SQTP
documention.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2003 Microchip Technology Inc.
DS21267F-page21
MCRF250
NOTES:
DS21267F-page22
2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE and PowerSmart are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,
SEEVAL, SmartShunt and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Application Maestro, dsPICDEM, dsPICDEM.net,
dsPICworks, ECAN, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC,
Select Mode, SmartSensor, SmartTel and Total Endurance
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in October
2003 . The Company’s quality system processes and procedures are
for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, non-volatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
2003 Microchip Technology Inc.
DS21267F-page 23
WORLDWIDE SALES AND SERVICE
Korea
AMERICAS
ASIA/PACIFIC
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Singapore
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
China - Beijing
Unit 706B
Wan Tai Bei Hai Bldg.
No. 6 Chaoyangmen Bei Str.
Beijing, 100027, China
Tel: 86-10-85282100
Fax: 86-10-85282104
Atlanta
3780 Mansell Road, Suite 130
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Tel: 770-640-0034
Fax: 770-640-0307
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Min Chuan 2nd Road
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Tel: 886-7-536-4818
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Boston
China - Chengdu
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Tel: 978-692-3848
Fax: 978-692-3821
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Tel: 86-28-86766200
Taiwan
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Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
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EUROPE
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Denmark
Regus Business Centre
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Tel: 972-818-7423
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Detroit
Tri-Atria Office Building
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Tel: 86-21-6275-5700
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Tel: 86-755-82901380
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Kokomo
France
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Italy
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
San Jose
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
P. A. De Biesbosch 14
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Tel: 31-416-690399
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Tel: 650-215-1444
Toronto
India
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Divyasree Chambers
1 Floor, Wing A (A3/A4)
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Japan
Fax: 31-416-690340
United Kingdom
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Tel: 81-45-471- 6166 Fax: 81-45-471-6122
11/24/03
DS21267F-page 24
2003 Microchip Technology Inc.
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