MCRF250-I/P40A_技术文档

MCRF250

Contactless Programmable Passive RFID Device With Anti-Collision

FEATURES

• Anti-collision feature to resolve multiple tags in

the same RF field

APPLICATION

• Read-only data transmission

RF

Signal

• 96 or 128 bits of One-Time Programmable (OTP)

user memory (also supports 48 and 64-bit

protocols)

Transmitter/

Receiver

MCRF250

• Operates up to 150 kHz

Data

• On-chip rectifier and voltage regulator

• Low power operation

• Factory programming and device serialization

available

The MCRF250 is equipped with an anti-collision

feature that allows multiple tags in the same field to

be read simultaneously. This revolutionary feature

eliminates the issue of data corruption due to

simultaneous transmissions from multiple tags.

• Encoding options:

- NRZ Direct, Differential Biphase, Manchester

Biphase, Biphase IDI

• Modulation options:

- FSK, Direct, PSK (change on data change),

PSK (change at the beginning of a one)

The user memory array of this device can be

programmed contactlessly after encapsulation. This

allows the user to keep encapsulated blank tags in

stock for on-demand personalization. The tags can

then be programmed with data as they are needed.

• Contactless programmable after encapsulation

DESCRIPTION

This device is a Radio Frequency Identification (RFID)

tag that provides a variety of operating modes. The

device is powered by an external RF transmitter

(reader) through inductive coupling. When in the reader

field, the device will transmit the contents of its memory

array by damping (modulating) the incoming RF signal.

A reader is able to detect the damping and decodes the

data being transmitted. Code length, modulation

option, encoding option and bit rate are set at the

factory to fit the needs of particular applications.

These devices are available in die form or packaged in

SOIC, PDIP or COB modules. The encoding,

modulation, frequency, and bit rate options are

specified by the customer and programmed by

Microchip Technology Inc. prior to shipment. Array pro-

gramming and serialization (SQTP) can also be

arranged upon request. See TB023 (page 23) for more

information.

BLOCK DIAGRAM

Data

Modulation

Control

Clock

Anti-collision

Circuitry

Generator

Memory

Array

Row

Decode

Coil

Connections

VCC

VSS

Rectifier

Column

Decode

Counter

 2001 Microchip Technology Inc.

DS21267D-page 1

MCRF250

TABLE 1-1:

PAD FUNCTION TABLE

1.0

ELECTRICAL

CHARACTERISTICS

Name Function

1.1

Maximum Ratings*

VA,VB

NC

Coil connection

No connection, test pad

Storage temperature .....................................-65°C to +150°C

Ambient temp. with power applied ................-40°C to +125°C

Maximum current into coil pads ....................................50 mA

*Notice: Stresses above those listed under “Maximum ratings” may

cause permanent damage to the device. This is a stress rating only and

functional operation of the device at those or any other conditions

above those indicated in the operational listings of this specification is

not implied. Exposure to maximum rating conditions for extended peri-

ods may affect device reliability.

TABLE 1-2:

AC AND DC CHARACTERISTICS

All parameters apply across the speci- Industrial (I): Tamb = -40°C to +85°C

fied operating ranges unless otherwise

noted.

Parameter

Clock frequency

Symbol

Min.

Typ.

Max. Units

Conditions

FCLK

TWC

100

—

2

150

—

kHz

s

Contactless programming time

Data retention

128-bit array

200

—

50

2

—

Years 25°C

Coil current (Dynamic)

Operating current

ICD

IDD

µA

—

Turn-on-voltage (Dynamic)

for modulation

VAVB

VCC

10

2

—

VPP

VDC

FIGURE 1-1: DIE PLOT

TABLE 1-3:

RFID PAD COORDINATES

(MICRONS)

NC

Passivation

Openings

Pad

Name Width

Height

Center X Center Y

VA

VB

90.0

427.50

-734.17

-408.60

Note 1: All coordinates are referenced from the cen-

ter of the die.

2: Die size 1.1215 mm x 1.7384 mm.

FIGURE 1-2: PIN DIAGRAM

PDIP, SOIC

1

2

3

4

8

7

6

5

VA

VB

NC

VB

VA

DS21267D-page 2

 2001 Microchip Technology Inc.

MCRF250

2.5

Clock Generator

2.0

FUNCTIONAL DESCRIPTION

The RF section generates all the analog functions

needed by the transponder. These include rectification

of the carrier, on-chip regulation of VPP (programming

voltage), and VDD (operating voltage), as well as high

voltage clamping to prevent excessive voltage from

being applied to the device. This section generates a

system clock from the interrogator carrier frequency,

detects carrier interrupts and modulates the tuned LC

antenna for transmission to the interrogator. The chip

detects a power up condition and resets the transpon-

der when sufficient voltage develops.

This circuit generates a clock with a frequency equal to

the interrogator frequency. This clock is used to derive

all timing in the device, including the baud rate,

modulation rate, and programming rate.

2.6

IRQ Detector

This circuitry detects an interrupt in the continuous

electromagnetic field of the interrogator. An IRQ

(interrupt request) is defined as the absence of the

electromagnetic field for a specific number of clock

cycles. Detection of an IRQ will trigger the device to

enter the Anti-collision mode. This mode is discussed

in detail in Section 5.0.

2.1

Rectifier – AC Clamp

The AC voltage induced by the tuned LC circuit is full

wave rectified. This unregulated voltage is used as the

DC supply voltage for the rest of the chip. The peak

voltage on the tuned circuit is clamped by the internal

circuitry to a safe level to prevent damage to the IC.

This voltage is adjusted during programming to allow

sufficient programming voltage to the EEPROM.

2.7

Power On Reset

This circuit generates a power on reset when the tag

first enters the interrogator field. The reset releases

when sufficient power has developed on the VDD

regulator to allow correct operation. The reset trip

points are set such that sufficient voltage across VDD

has developed which allows for correct clocking of the

logic for reading of the EEPROM and configuration

data, and correct modulation.

2.2

Coil Load Modulation

The MCRF250 communicates by shunting a transistor

across the tuned LC circuit, which modulates the

received RF field.

2.8

Modulation Logic

This logic acts upon the serial data being read from the

EEPROM and performs two operations on the data.

The logic first encodes the data according to the

configuration bits CB6 and CB7. The data can be sent

out direct to the modulation logic or encoded biphase_s

2.3

VDD Regulator

The device generates a fixed supply voltage from the

unregulated coil voltage.

2.4

VPP Regulator

(differential),

biphase_l

(manchester)

or

idi

(manchester).

This regulates a programming voltage during the

programming mode. The voltage is switched into the

EEPROM array to perform block erasure of the

memory as well as single bit programming during both

contact and contactless programming. During reading

this voltage is level shifted down and kept below the

programming voltages to insure that the part is not

inadvertently programmed.

The encoded data is then either passed NRZ Direct out

to modulate the coil, or FSK modulated, or PSK

modulated with phase changes on the change of data,

or PSK with phase changes on the bit edge of a one.

Configuration bits CB8 and CB9 determine the

modulation option. CB10 is used if the PSK option has

been selected and determines whether the return

carrier rate is FCLK/2 or FCLK/4.

 2001 Microchip Technology Inc.

DS21267D-page 3

MCRF250

3.3

Baud Rate Timing

3.0

CONFIGURATION LOGIC

The chip will access data at a baud rate determined by

bits CB2, CB3, CB4, and CB5 of the configuration

register. CB2, CB3, and CB4 determine the return data

rate (CACLK). The default rate of FCLK/128 is used for

contact and contactless programming. Once the array

is successfully programmed, the lock bit CB12 is set.

When the lock bit is set, programming and erasing the

device becomes permanently disabled. The

configuration register has no effect on device timing or

modulation until after the EEPROM data array is

programmed. If CB2 is set to a one and CB5 is set to a

one, the 1.5 bit SYNC word option is enabled.

3.1

Control Bit Register

The configuration register determines the operational

parameters of the device. The configuration register

can not be programmed contactlessly; it is

programmed during wafer probe at the Microchip

factory. CB11 is always a one; CB12 is set when

successful contact or contactless programming of the

data array has been completed. Once CB12 is set,

programming and erasing of the device is disabled.

Figure 3-1 contains a description of the control register

bit functions.

3.2

Organization

3.4

Column and Row Decoder Logic and

Bit Counter

The configuration bit register directly controls logic

blocks, which generate the baud rate, memory size,

encoded data, and modulated data. This register also

contains bits which lock the data array.

The column and row decoders address the EEPROM

array at the CACLK rate and generate a serial data

stream for modulation. This data stream can be up to

128 bits in length. The size of the stream is user

programmable with CB1, and can be set to 96 or 128

bits. Data lengths of 48 and 64 bits are available by

programming the data twice in the array end to end.

The data is then encoded by the modulation logic. The

data length during contactless programming is 128 bits.

The column and row decoders route the proper voltage

to the array for programming and reading. In the

programming modes, each individual bit is addressed

serially from bit 1 to bit 128.

DS21267D-page 4

 2001 Microchip Technology Inc.

MCRF250

FIGURE 3-1: CONFIGURATION REGISTER

CB12 CB11 CB10 CB9 CB8 CB7 CB6 CB5 CB4 CB3 CB2 CB1

ARRAY SIZE

CB1 = 1: 128-bit user array

CB1 = 0: 96-bit user array

TIMING

CB2 CB3 CB4

Rate

0

1

0

1

0

1

0

1

0

1

0

1

0

1

MOD128

MOD100

MOD80

MOD32

MOD64

MOD50

MOD40

MOD16

SYNC WORD

CB5 = 1: 1.5-bit sync word enable

CB5 = 0: 1.5-bit sync word disable

DATA ENCODING

CB6 = 0; CB7 = 0 nrz_I (direct)

CB6 = 0; CB7 = 1 biphase_s (differential)

CB6 = 1; CB7 = 0 biphase_I (manchester)

CB6 = 1; CB7 = 1 (Inverted Manchester)

MODULATION OPTIONS

CB8 = 0; CB9 = 0 FSK 0 = /8, 1 = /10

CB8 = 0; CB9 = 1 Direct

CB8 = 1; CB9 = 0 psk_1

(phase change on change of data)

CB8 = 1; CB9 = 1 psk_2

(phase change at beginning of a one

PSK RATE OPTION

CB10 = 1 clk/4 carrier

CB10 = 0 clk/2 carrier

(READ ONLY)

CB11 = 1

ARRAY LOCK BIT (READ ONLY)

CB12 = 0 array not locked

CB12 = 1 array is locked

 2001 Microchip Technology Inc.

DS21267D-page 5

MCRF250

4.0

MODES OF OPERATION

The device has two basic modes of operation: Native

Mode and Read Mode.

4.1

Native Mode

In native mode, the MCRF250 will have an

unprogrammed array and will be in the default mode for

contactless programming (default baud rate FCLK/128,

FSK, NRZ_direct).

4.2

Read Mode

The second mode is a read mode after the contactless

or contact programming has been completed and for

the rest of the lifetime of the device. The lock bit CB12

will be set, and the transponder will have the ability to

transmit when powered and enter the anti-collision

algorithm.

FIGURE 4-1: TYPICAL APPLICATION CIRCUIT

IAC

390 pF

Input parasitic

capacitance 2pF

740 µH

From

4.05 mH

RF Energy

carrier

signal

125 kHz

generator

Pad VA

Pad VB

To reader

MCRF250

amplifier/

Data

(Backscattering

Signal)

data detector

2.2 nF

1

f

= ------------------ = 1 2 5 kHz

2π LC

res

DS21267D-page 6

 2001 Microchip Technology Inc.

MCRF250

FIGURE 5-1: ANTI-COLLISION

5.0

ANTI-COLLISION

FLOWCHART

The anti-collision feature is enabled when the array is

locked. In this mode, the MCRF250 has the ability to

stop transmitting when a collision has occurred. The

device will begin transmitting again when its internal

anti-collision algorithm indicates that it is time to do so.

Begin

Multiple tags can enter the same reader field and be

read by the reader in a short period of time. The reader

must provide “gaps” (RF field off) at proper timing

intervals as shown in Figure 5-1 in order to inform the

MCRF250 of collisions, and to sequence from one tag

to another.

Provide Gap*

Wait 5-bit times

Is

No

modulation

present?

Yes

Is

only one tag

modulating?

Yes

Read Tag

Provide gap in the

first half of the first

bit time to make

tag stop

transmitting

Note: *Gap = lack of RF carrier signal

= 60 µs ± 20%.

 2001 Microchip Technology Inc.

DS21267D-page 7

MCRF250

MCRF250 PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

MCRF250 - I

/WFxxx

Hex = Three digit hex value to be programmed into the

Code

configuration register. Three hex characters corre-

spond to 12 binary bits. These bits are programmed

into the configuration register MSB first (CB12,

CB11…CB1). See the example below.

Configuration:

Package:

WF = Sawed wafer on frame (7 mil backgrind)

W = Wafer

S = Dice in wafer pack

SN = 150 mil SOIC

P = PDIP

1C = COB module with 1000 pF capacitor

3C = COB module with 330 pF capacitor

Temperature

Range:

I = –40°C to +85°C

250 = 125 kHz

Device:

Sample Part

Number:

MCRF250-I /40A

MCRF250-I/W40A = 125 kHz, Industrial temperature, wafer package,

anti-collision, 96 bit, FSK/8 /10,direct encoded, F/50

data return rate tag. The configuration register is:

CB12 CB11 CB10 CB9 CB8 CB7 CB6 CB5 CB4 CB3 CB2 CB1

0

1

0

1

0

1

0

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-

mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

DS21267D-page 8

 2001 Microchip Technology Inc.

MCRF250

NOTES:

 2001 Microchip Technology Inc.

DS21267D-page 9

MCRF250

NOTES:

DS21267D-page 10

 2001 Microchip Technology Inc.

MCRF250

Technology Incorporated, USA. Information contained

in this publication regarding device applications and the

like is intended through suggestion only and may be

superseded by updates. No representation or warranty

is given and no liability is assumed by Microchip

Technology Incorporated with respect to the accuracy

or use of such information, or infringement of patents or

other intellectual property rights arising from such use

or otherwise. Use of Microchip’s products as critical

components in life support systems is not authorized

except with express written approval by Microchip. No

licenses are conveyed, implicitly or otherwise, under

any intellectual property rights. The Microchip logo and

name are registered trademarks of Microchip

Technology Inc. in the U.S.A. and other countries. All

rights reserved. All other trademarks mentioned herein

are the property of their respective companies. No

licenses are conveyed, implicitly or otherwise, under

any intellectual property rights.”

Trademarks

The Microchip name, logo, PIC, PICmicro,

PICMASTER, PICSTART, PRO MATE, KEELOQ,

SEEVAL, MPLAB and The Embedded Control

Solutions Company are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and

other countries.

Total Endurance, ICSP, In-Circuit Serial Programming,

FilterLab, MXDEV, microID, FlexROM, fuzzyLAB,

MPASM, MPLINK, MPLIB, PICDEM, ICEPIC,

Migratable Memory, FanSense, ECONOMONITOR,

SelectMode and microPort are trademarks of

Microchip Technology Incorporated in the U.S.A.

Serialized Quick Term Programming (SQTP) is a

service mark of Microchip Technology Incorporated in

the U.S.A.

All other trademarks mentioned herein are property of

their respective companies.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999. The

Company’s quality system processes and

procedures are QS-9000 compliant for its

PICmicro^®8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs and microperipheral

products. In addition, Microchip’s quality

system for the design and manufacture of

development systems is ISO 9001 certified.

 2001 Microchip Technology Inc.

DS21267D-page 11

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Web Address: http://www.microchip.com

ASIA/PACIFIC (continued)

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01/30/01

Printed on recycled paper.

Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by

updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is

assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual

property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with

express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellec-

tual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights

reserved. All other trademarks mentioned herein are the property of their respective companies.

DS21267D-page 12

 2001 Microchip Technology Inc.


型号：	MCRF250-I/P40A
厂家：	MICROCHIP
描述：	SPECIALTY TELECOM CIRCUIT, PDIP8, PLASTIC, DIP-8 电信光电二极管电信集成电路
文件：	总12页 (文件大小：170K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MCRF250-I/P40A [MICROCHIP]

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