MCP1662T-E/OT [MICROCHIP]
High-Voltage Step-Up LED Driver with UVLO and Open Load Protection;
| 型号： | MCP1662T-E/OT |
| 厂家： | 
MICROCHIP |
| 描述： | High-Voltage Step-Up LED Driver with UVLO and Open Load Protection |
| 文件： | 总28页 (文件大小：614K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP1662
High-Voltage Step-Up LED Driver with UVLO and Open Load Protection
Features
General Description
• 36V, 800 m Integrated Switch
• Up to 92% Efficiency
The MCP1662 device is a compact, space-efficient,
fixed-frequency, non-synchronous step-up converter
optimized to drive LED strings with constant current
from a two- or three-cell alkaline or lithium Energizer®,
or NiMH/NiCd, or one-cell Lithium-Ion or Li-Polymer
batteries.
• Drive LED Strings in Constant Current
• 1.3A Peak Input Current Limit:
- ILED up to 200 mA @ 5.0V VIN, 4 White LEDs
- ILED up to 125 mA @ 3.3V VIN, 4 White LEDs
- ILED up to 100 mA @ 4.2V VIN, 8 White LEDs
• Input Voltage Range: 2.4V to 5.5V
• Feedback Voltage Reference: VFB = 300 mV
• Undervoltage Lockout (UVLO):
The device integrates a 36V, 800 m low-side switch,
which is protected by the 1.3A cycle-by-cycle inductor
peak current limit operation. All compensation and pro-
tection circuitry is integrated to minimize the number of
external components.
The internal feedback (VFB) voltage is set to 300 mV for
low power dissipation when sensing and regulating the
LED current. A single resistor sets the LED current.
- UVLO @ VIN Rising: 2.3V, typical
- UVLO @ VIN Falling: 1.85V, typical
• Sleep Mode with 20 nA Typical Quiescent Current
• PWM Operation: 500 kHz Switching Frequency
• Cycle-by-Cycle Current Limiting
The device features an Undervoltage Lockout (UVLO)
that avoids start-up with low inputs or discharged bat-
teries for two-cell-powered applications.
• Internal Compensation
There is an open load protection (OLP) which turns off
the operation in situations when the LED string is acci-
dentally disconnected or the feedback pin is short-cir-
cuited to GND.
• Open Load Protection (OLP) in the Event of:
- Feedback pin shorted to GND (prevent
excessive current into LEDs)
- Disconnected LED string (prevent overvoltage
to the converter’s Output and SW pin)
For standby applications (EN = GND), the device stops
switching, enters into Sleep mode and consumes
20 nA typical of input current.
• Overtemperature Protection
• Available Packages:
- 5-Lead SOT-23
Package Types
- 8-Lead 2x3 TDFN
MCP1662
SOT-23
Applications
• Two and Three-Cell Alkaline or NiMH/NiCd White
LED Driver for Backlighting Products
SW
GND
VFB
VIN
EN
1
2
3
5
4
• Li-Ion Battery LED Lighting Application
• Camera Flash
• LED Flashlights and Backlight Current Source
• Medical Equipment
MCP1662
2x3 TDFN*
• Portable Devices:
VFB
EN
- Handheld Gaming Devices
- GPS Navigation Systems
- LCD Monitors
1
8
PGND
2
3
4
7
6
5
S
EP
9
GND
SW
NC
VIN
- Portable DVD Players
NC
* Includes Exposed Thermal Pad (EP); see
Table 3-1.
2014-2015 Microchip Technology Inc.
DS20005316E-page 1
MCP1662
Typical Application
D
L
MBR0540
4.7 – 10 µH
VOUT
LED1
LED2
CIN
4.7 – 30 µF
SW
VIN
2.4V – 3.0V
VIN
0.3V
COUT
10 µF
+
ILED =
RSET
MCP1662
EN
LED6
-
VFB
ON
VFB = 0.3V
+
RSET
12
OFF
GND
ILED = 25 mA
-
L
L
= 4.7 µH for maximum 4 white LEDs
= 10 µH for 5 to 10 white LEDs
CIN = 4.7-10 µF for VIN > 2.5V
CIN = 20-30 µF for VIN < 2.5V
Maximum LED Current in Regulation vs. Input Voltage, TA = + 25°C
250
200
150
100
50
4 wLEDs, L = 4.7 µH
8 wLEDs, L = 10 µH
0
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
DS20005316E-page 2
2014-2015 Microchip Technology Inc.
MCP1662
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational sections of this specifica-
tion is not intended. Exposure to maximum rating con-
ditions for extended periods may affect device
reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
V
– GND.....................................................................+36V
SW
EN, V – GND...............................................................+6.0V
IN
V
...............................................................................+0.35V
FB
Power Dissipation .......................................Internally Limited
Storage Temperature .................................... -65 C to +150 C
Ambient Temperature with Power Applied .... -40 C to +125 C
Operating Junction Temperature................... -40 C to +150 C
ESD Protection on All Pins:
°
°
°
°
°
°
HBM.................................................................4 kV
MM..................................................................300V
DC AND AC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits apply for typical values at ambient temperature
TA = +25°C, VIN = 3.3V, VOUT = 9V or 3 white LEDs (VF = 2.75V @ IF = 20 mA or VF = 3.1V @ IF = 100 mA),
ILED = 20 mA, CIN = COUT = 10 µF, X7R ceramic, L = 4.7 µH.
Boldface specifications apply over the controlled TA range of -40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Note 1
Input Voltage Range
VIN
2.4
—
—
—
—
—
2.3
1.85
—
5.5
—
V
V
Undervoltage Lockout (UVLO)
UVLOSTART
UVLOSTOP
VOUTmax
IOUT
VIN rising, ILED = 20 mA
VIN falling, ILED = 20 mA
—
V
Maximum Output Voltage
Maximum Output Current
32
—
V
100
125
200
300
50
mA
mA
mA
mV
mV
4.2V VIN, 8 LEDs
3.3V VIN, 4 LEDs
5.0V VIN, 4 LEDs
—
—
Feedback Voltage Reference
VFB
275
—
325
—
Feedback Open Load
VFB_OLP
VFB falling (Note 2)
Protection (OLP) Threshold
Feedback Input Bias Current
Shutdown Quiescent Current
IVFB
—
—
—
0.005
0.02
1.3
—
—
—
µA
µA
A
IQSHDN
IN(MAX)
EN = GND
NMOS Peak Switch Current
Limit
Note 2
NMOS Switch Leakage
INLK
—
—
0.4
0.8
—
—
µA
VIN = VSW = 5V;
VOUT = 5.5V
VEN = VFB = GND
NMOS Switch ON Resistance
RDS(ON)
VIN = 5V,
I
LED = 100 mA,
4 series white LEDs
(Note 2)
Feedback Voltage
Line Regulation
|(VFB/VFB)/VIN|
—
0.25
—
%/V
VIN = 3.0V to 5V
Maximum Duty Cycle
Switching Frequency
EN Input Logic High
DCMAX
fSW
—
425
85
90
500
—
—
575
—
%
Note 2
kHz
±15%
VIH
% of VIN
Note 1: Minimum input voltage in the range of VIN (VIN < 5.5V < VOUT) depends on the maximum duty cycle
(DCMAX) and on the output voltage (VOUT), according to the boost converter equation:
VINmin = VOUT x (1 – DCMAX). Output voltage is equal to the LED voltage plus the voltage on the sense
resistor (VOUT = VLED + V_RSET).
2: Determined by characterization, not production tested.
2014-2015 Microchip Technology Inc.
DS20005316E-page 3
MCP1662
DC AND AC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits apply for typical values at ambient temperature
TA = +25°C, VIN = 3.3V, VOUT = 9V or 3 white LEDs (VF = 2.75V @ IF = 20 mA or VF = 3.1V @ IF = 100 mA),
ILED = 20 mA, CIN = COUT = 10 µF, X7R ceramic, L = 4.7 µH.
Boldface specifications apply over the controlled TA range of -40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
EN Input Logic Low
EN Input Leakage Current
Start-up Time
VIL
IENLK
tSS
—
—
—
—
7.5
—
% of VIN
µA
0.025
100
VEN = 5V
—
µs
EN Low-to-High,
90% of ILED
(Note 2, Figure 2-10)
Thermal Shutdown
Die Temperature
TSD
—
—
150
15
—
—
°C
°C
Die Temperature Hysteresis
TSDHYS
Note 1: Minimum input voltage in the range of VIN (VIN < 5.5V < VOUT) depends on the maximum duty cycle
(DCMAX) and on the output voltage (VOUT), according to the boost converter equation:
VINmin = VOUT x (1 – DCMAX). Output voltage is equal to the LED voltage plus the voltage on the sense
resistor (VOUT = VLED + V_RSET).
2: Determined by characterization, not production tested.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, all limits apply for typical values at ambient temperature
TA = +25°C, VIN = 3.0V, IOUT = 20 mA, VOUT = 12V, CIN = COUT = 10 µF, X7R ceramic, L = 4.7 µH.
Boldface specifications apply over the air-forced TA range of -40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Operating Junction Temperature
Range
TJ
-40
—
+125
°C
Steady State
Storage Temperature Range
TA
TJ
-65
—
—
—
+150
+150
°C
°C
Maximum Junction Temperature
Package Thermal Resistances
Thermal Resistance, 5L-SOT-23
Thermal Resistance, 8L 2x3 TDFN
Transient
JA
JA
—
—
201.0
52.5
—
—
°C/W
°C/W
DS20005316E-page 4
2014-2015 Microchip Technology Inc.
MCP1662
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated: VIN = 3.3V, ILED = 20 mA, VOUT = 12V or 4 white LEDs (VF = 2.75V @ IF = 20 mA or
VF = 3.1V @ IF = 100 mA), CIN = COUT = 10 µF, X7R ceramic, L = 4.7 µH.
100
90
80
70
60
50
40
30
20
10
0
150
125
100
75
4 x wLED, L = 4.7 µH
RSET = 2.2ȍ
RSET = 3.2ȍ
VIN = 5.5V
VIN = 4.0V
VIN = 3.0V
RSET = 6.2ȍ
RSET = 15ȍ
50
L = 4.7 µH,
4 wLEDs
25
0
2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
Input Voltage (V)
0
25 50 75 100 125 150 175 200 225 250
ILED (mA)
FIGURE 2-1:
4 White LEDs, ILED vs. VIN.
FIGURE 2-4:
ILED
4 White LEDs, Efficiency vs.
.
100
90
80
70
60
50
40
30
20
10
0
120
100
80
4 x wLED, L = 4.7 µH, VIN = 3.3V
RSET = 3.2ȍ
VIN = 5.5V
VIN = 3.0V
VIN = 4.0V
60
RSET = 6.2ȍ
RSET = 15ȍ
40
L = 10 µH,
8 wLEDs
20
0
0
20
40
60
80 100 120 140 160
-40 -25 -10
5
20 35 50 65 80 95 110 125
ILED (mA)
Ambient Temperature (oC)
FIGURE 2-5:
8 White LEDs, Efficiency vs.
FIGURE 2-2:
Ambient Temperature.
4 White LEDs, ILED vs.
ILED
.
300
250
200
150
100
50
120
8 x wLED, L = 10 µH, VIN = 4.2V
RSET = 3.2ȍ
100
80
60
40
20
0
5 wLEDs, L = 10 µH
2 wLEDs, L = 4.7 µH
4 wLEDs, L = 4.7 µH
8 wLEDs, L = 10 µH
RSET = 6.2ȍ
RSET = 15ȍ
0
2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
Input Voltage (V)
-40 -25 -10
5
20 35 50 65 80 95 110 125
Ambient Temperature (oC)
FIGURE 2-6:
Maximum ILED vs. VIN.
FIGURE 2-3:
8 White LEDs, ILED vs.
Ambient Temperature.
2014-2015 Microchip Technology Inc.
DS20005316E-page 5
MCP1662
Note: Unless otherwise indicated: VIN = 3.3V, ILED = 20 mA, VOUT = 12V or 4 white LEDs (VF = 2.75V @ IF = 20 mA or
VF = 3.1V @ IF = 100 mA), CIN = COUT = 10 µF, X7R ceramic, L = 4.7 µH.
2.5
250
200
150
100
50
2.4
2.3
2.2
2.1
2
Blue Bars - ILED = 20 mA
Red Bars - ILED = 40 mA
UVLO Start
UVLO Stop
1.9
1.8
1.7
1.6
1.5
0
3
4
5
6
7
8
-40 -25 -10
5
20 35 50 65 80 95 110 125
Ambient Temperature (oC)
Number of LEDs
FIGURE 2-7:
Undervoltage Lockout
FIGURE 2-10:
Soft Start Time vs. Number
(UVLO) vs. Ambient Temperature.
of LEDs.
50
40
30
20
10
3 LEDs, I
= 20 mA
LED
I
LED
10 mA/div
V
EN
2V/div
V
2V/div
IN
0
2.2 2.5 2.8 3.1 3.4 3.7 4.0 4.3 4.6 4.9 5.2 5.5
Input Voltage (V)
40 µs/div
FIGURE 2-8:
Shutdown Quiescent
FIGURE 2-11:
Start-Up When
Current, IQSHDN, vs. VIN (EN = GND).
VIN = VENABLE.
550
3 LED, I
= 20 mA
LED
525
500
475
450
I
LED
10 mA/div
V
EN
2V/div
V
2V/div
IN
-40 -25 -10
5
20 35 50 65 80 95 110 125
40 µs/div
Ambient Temperature (°C)
FIGURE 2-9:
Switching Frequency, fSW
FIGURE 2-12:
Start-Up After Enable.
vs. Ambient Temperature.
DS20005316E-page 6
2014-2015 Microchip Technology Inc.
MCP1662
Note: Unless otherwise indicated: VIN = 3.3V, ILED = 20 mA, VOUT = 12V or 4 white LEDs (VF = 2.75V @ IF = 20 mA or
VF = 3.1V @ IF = 100 mA), CIN = COUT = 10 µF, X7R ceramic, L = 4.7 µH.
3 LEDs
3 LEDs
VOUT
3V/div
ILED
10 mA/div
VSW
4V/div
VSW
4V/div
ILED
20 mA/div
VEN
3V/div
1 µs/div
2 ms/div
FIGURE 2-13:
100 Hz PWM Dimming, 15%
FIGURE 2-16:
3.3V Input, 20 mA 3 White
Duty Cycle.
LEDs PWM Discontinuous Mode Waveforms.
3 LEDs
3 LEDs
ILED
100 mA/div
VOUT
3V/div
VSW
4V/div
ILED
50 mA/div
VSW
4V/div
VEN
3V/div
1 µs/div
2 ms/div
FIGURE 2-14:
100 Hz PWM Dimming, 85%
FIGURE 2-17:
3.3V Input, 100 mA 3 White
Duty Cycle.
LEDs PWM Continuous Mode Waveforms.
3 LEDs
VFB
300 mV/div
ILED
10 mA/div
VSW
4V/div
50 ms/div
FIGURE 2-15:
Open Load (LED Fail or FB
to GND) Response.
2014-2015 Microchip Technology Inc.
DS20005316E-page 7
MCP1662
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MCP1662
MCP1662
SOT-23
Symbol
Description
2x3 TDFN
3
—
1
1
2
VFB
SGND
SW
Feedback Voltage Pin
Signal Ground Pin
3
Switch Node, Boost Inductor Input Pin
Not Connected
—
5
4, 6
5
NC
VIN
Input Voltage Pin
—
4
7
PGND
EN
Power Ground Pin
8
Enable Control Input Pin
Exposed Thermal Pad (EP); must be connected to Ground
Ground Pin
—
2
9
EP
—
GND
3.1
Feedback Voltage Pin (V
)
3.7
Enable Pin (EN)
FB
The VFB pin is used to regulate the voltage across the
RSET sense resistor to 300 mV to keep the output LED
current in regulation. Connect the cathode of the LED
to the VFB pin.
The EN pin is a logic-level input used to enable or dis-
able device switching and lower quiescent current
while disabled. A logic high (>85% of VIN) will enable
the regulator output. A logic low (<7.5% of VIN) will
ensure that the regulator is disabled.
3.2
Signal Ground Pin (S
)
GND
3.8
Exposed Thermal Pad (EP)
The signal ground pin is used as a return for the inte-
grated reference voltage and error amplifier. The signal
ground and power ground must be connected exter-
nally in one point.
There is no internal electrical connection between the
Exposed Thermal Pad (EP) and the SGND and PGND
pins. They must be connected to the same potential on
the Printed Circuit Board (PCB).
3.3
Switch Node Pin (SW)
3.9
Ground Pin (GND)
Connect the inductor from the input voltage to the SW
pin. The SW pin carries inductor current and has a typ-
ical value of 1.3A peak. The integrated N-Channel
switch drain is internally connected to the SW node.
The ground or return pin is used for circuit ground con-
nection. The length of the trace from the input cap
return, the output cap return and the GND pin must be
as short as possible to minimize noise on the GND pin.
The 5-lead SOT-23 package uses a single ground pin.
3.4
Not Connected (NC)
This is an unconnected pin.
3.5
Power Supply Input Voltage Pin
(V )
IN
Connect the input voltage source to VIN. The input
source should be decoupled from GND with a 4.7 µF
minimum capacitor.
3.6
Power Ground Pin (P
)
GND
The power ground pin is used as a return for the
high-current N-Channel switch. The PGND and SGND
pins are connected externally. The signal ground and
power ground must be connected externally in one
point.
DS20005316E-page 8
2014-2015 Microchip Technology Inc.
MCP1662
4.2
Functional Description
4.0
4.1
DETAILED DESCRIPTION
Device Overview
The MCP1662 is a compact, high-efficiency, fixed
500 kHz frequency, step-up DC-DC converter. It oper-
ates as a constant current generator for applications
powered by two- or three-cell alkaline or lithium Ener-
gizer® batteries, or three-cell NiCd or NiMH batteries,
or one-cell Lithium-Ion or Li-Polymer batteries.
The MCP1662 device is a fixed-frequency, synchro-
nous step-up converter, with a low-voltage reference of
300 mV, optimized to keep the output current constant
by regulating the voltage across the feedback resistor
(RSET). The MCP1662 integrates a peak current mode
architecture. It delivers high-efficiency conversion for
an LED lighting application when it is powered by two-
or three-cell alkaline, lithium, NiMH, NiCd, or single-cell
Lithium-Ion batteries. The maximum input voltage is
5.5V. A high level of integration lowers total system
cost, eases implementation and reduces board area.
Figure 4-1 depicts the functional block diagram of the
MCP1662. It incorporates a Current mode control
scheme, in which the PWM ramp signal is derived from
the NMOS power switch current (VSENSE). This ramp
signal adds a slope ramp compensation signal (VRAMP
and is compared to the output of the error amplifier
(VERROR) to control the “on” time of the power switch.
)
The conventional boost converter with a high-voltage
reference has a high-voltage drop across the LED
series current limit resistor. The power dissipated in this
resistor, which is usually in series with the LED string,
reduces the total efficiency conversion of an LED driver
solution. Therefore, the voltage drop on the sense
resistor (RSET) that is used to regulate the LED current
must be low. In the case of MCP1662, the VFB value is
300 mV.
The device features controlled start-up voltage
(UVLOSTART = 2.3V) and open load protection, in case
the LED fails or a short circuit of the VFB pin to GND
occurs. If the VFB voltage drops to 50 mV typical, the
device stops switching and the output voltage will be
equal to the input voltage (minus a diode drop voltage).
This feature prevents damage to the device and LEDs
when there is an accidental drop in voltage.
The 800 m, 36V integrated switch is protected by the
1.3A cycle-by-cycle inductor peak current limit opera-
tion. When the Enable pin is pulled to ground
(EN = GND), the device stops switching, enters into
Shutdown mode and consumes less than 50 nA of
input current (Figure 2-8).
2014-2015 Microchip Technology Inc.
DS20005316E-page 9
MCP1662
SW
VIN
Internal Bias
UVLO_COMP
VBIAS
VUVLO_REF
VIN_OK
Overcurrent Comparator
GateDrive
and
OCREF
VLIMIT
-
Shutdown
Control
Logic
EN
+
VEXT
VSENSE
+
-
+
S
VRAMP
Slope
Compensation
Oscillator
CLK
+
GND
+
VPWM
Logic
SR Latch
VERROR
QN
-
EA
+ 300 mV
-
VFB
Rc
Cc
Open Load Comparator
V
+
OLP_REF
VOLP_REF
300 mV
VFB
-
VUVLO_REF
VFB_FAULT
VOUT_OK
VFB
VIN_OK
EN
Power Good
Comparator
and Delay
Bandgap
Thermal
Shutdown
FIGURE 4-1:
MCP1662 Simplified Block Diagram.
DS20005316E-page 10
2014-2015 Microchip Technology Inc.
MCP1662
4.2.1
INTERNAL BIAS
4.2.4.1
Shutdown Mode.
Input to Output Path (EN = GND)
The MCP1662 gets its bias from VIN. The VIN bias is
used to power the device and drive circuits over the
entire operating range.
In Shutdown mode, the MCP1662 device stops switch-
ing and all internal control circuitry is switched off. The
input voltage will be bypassed to output through the
inductor and the Schottky diode.
4.2.2
START-UP
The MCP1662 is capable of starting from two alkaline
cells. MCP1662 starts switching at approximately 2.3V
typical for a light load current. Once started, the device
will continue to operate down to 1.85V, typical.
While the device stops switching, VOUT is equal to the
output capacitor voltage, which slowly discharges on
the leak path (from VOUT to a value close to VIN) after
the LEDs are turned off.
The start-up time is dependent on the LED’s current, on
the number of LEDs connected at output, and on the
output capacitor value (see Figure 2-10).
In Shutdown mode, the current consumed by the
MCP1662 device from batteries is very low (below
50 nA over VIN range; see Figure 2-8).
Due to the direct path from input to output, in the case
of pulsing enable applications (EN voltage switches
from low-to-high) the output capacitor is already
charged and the output starts from a value close to the
input voltage.
4.2.5
PWM MODE OPERATION
The MCP1662 operates as a fixed-frequency, non-syn-
chronous converter. The switching frequency is main-
tained with a precision oscillator at 500 kHz.
The internal oscillator has a delayed start to let the out-
put capacitor completely charge to the input voltage
value.
Lossless current sensing converts the peak current sig-
nal to a voltage (VSENSE) and adds it to the internal
slope compensation (VRAMP). This summed signal is
compared to the voltage error amplifier output (VER-
ROR) to provide a peak current control signal (VPWM) for
the PWM. The slope compensation signal depends on
the input voltage. Therefore, the converter provides the
proper amount of slope compensation to ensure stabil-
ity. The peak limit current is set to 1.3A.
4.2.3
UNDERVOLTAGE LOCKOUT
(UVLO)
MCP1662 features an UVLO which prevents fault oper-
ation below 1.85V typical, which corresponds to the
value of two discharged alkaline batteries.
Essentially, there is a hysteresis comparator which
monitors VIN at the reference voltage derived from the
bandgap.
4.2.6
INTERNAL COMPENSATION
The error amplifier, with its associated compensation
network, completes the closed-loop system by compar-
ing the output voltage to a reference at the input of the
error amplifier and by feeding the amplified signal to the
control input of the inner current loop. The compensa-
tion network provides phase leads and lags at appropri-
ate frequencies to cancel excessive phase lags and
leads of the power circuit. All necessary compensation
components and slope compensation are integrated.
The device starts its normal operation at 2.3V typical
input, which corresponds to the voltage value of two
rechargeable Ni-MH or Ni-Cd cells. A hysteresis is set
to avoid input transients (temporary VIN drop), which
might trigger the lower UVLO threshold and restart the
device.
When the input voltage is below the UVLOSTART
threshold, the device is operating with limited specifica-
tion.
4.2.4
ENABLE PIN
The MCP1662 device enables switching when the EN
pin is set high. The device is put into Shutdown mode
when the EN pin is set low. To enable the boost con-
verter, the EN voltage level must be greater than 85%
of the VIN voltage. To disable the boost converter, the
EN voltage must be less than 7.5% of the VIN voltage.
2014-2015 Microchip Technology Inc.
DS20005316E-page 11
MCP1662
4.2.7
OPEN LOAD PROTECTION (OLP)
4.2.9
OUTPUT SHORT CIRCUIT
CONDITION
An internal VFB fault signal turns off the PWM signal
(VEXT) when output goes out of regulation and one of
the following occurs:
Like all non-synchronous boost converters, the
MCP1662 inductor current will increase excessively
during a short circuit on the converter’s output. A short
circuit on the output will cause the diode rectifier to fail,
the inductor’s temperature to rise, and the saturation
current to decrease, further increasing the peak cur-
rent. When the diode fails, the SW pin becomes a
high-impedance node: it remains connected only to the
inductor and the resulting excessive ringing may cause
damage to the MCP1662 device.
• open load (LED string fails)
• short circuit of the feedback pin to GND
In any of the above events, for a regular integrated cir-
cuit (IC) without any protection implemented, the VFB
voltage drops to ground potential, its N-channel transis-
tor is forced to switch at full duty cycle and VOUT rises.
This fault event may cause the SW pin to exceed its
maximum voltage rating and may damage the boost
regulator IC, its external components and the LEDs. To
avoid these, MCP1662 has implemented an open load
protection (OLP) which turns off PWM switching when
such a condition is detected. There is an overvoltage
comparator with 50 mV reference which monitors the
VFB voltage.
4.2.10
OVERTEMPERATURE
PROTECTION
Overtemperature protection circuitry is integrated into
the MCP1662 device. This circuitry monitors the device
junction temperature and shuts the device off if the tem-
perature exceeds +150°C. The device will automati-
cally restart when the junction temperature drops by
15°C. The OLP is disabled during an overtemperature
condition.
If the OLP event occurs with the input voltage below
the UVLOSTART threshold and VFB remains under
50 mV due to weak input (discharged batteries) or an
overload condition, the device latches its output; it
resumes after power-up.
The OLP comparator is disabled during start-up
sequences and thermal shutdown. Because the OLP
comparator is turned off during start-up, care must be
taken when using PWM dimming on the EN pin, as this
might damage the device if a fault event occurs.
4.2.8
OVERCURRENT LIMIT
The MCP1662 device uses a 1.3A cycle-by-cycle input
current limit to protect the N-channel switch. There is
an overcurrent comparator which resets the drive latch
when the peak of the inductor current reaches the limit.
In current limitation, the output voltage and load current
start dropping.
DS20005316E-page 12
2014-2015 Microchip Technology Inc.
MCP1662
5.2.2
PWM DIMMING
5.0
5.1
APPLICATION INFORMATION
Typical Applications
LED brightness can also be controlled by setting the
maximum current for the LED string (using Equation 5-1)
and by lowering it in small steps with a variable duty
cycle PWM signal applied to the EN pin. The maximum
frequency for dimming is limited by the start-up time,
which varies with the LED current. By varying the duty
cycle of the signal applied on the EN pin (from 0 to
100%), the LED current is changing linearly.
The MCP1662 non-synchronous boost LED current
regulator operates over a wide output range, up to 32V,
which allows it to drive up to 10 LEDs in series connec-
tion. The input voltage ranges from 2.4V to 5.5V. The
device operates down to 1.85V with limited specifica-
tion. The UVLO typical thresholds are set to 2.3V when
VIN is ramping and to 1.85V when VIN is falling. Output
current capability increases with the input voltage and
is limited by the 1.3A typical peak input current limit.
Typical characterization curves in this data sheet are
presented to display the typical output current capabil-
ity.
5.2.3
OUTPUT CURRENT CAPABILITY.
MINIMUM INPUT VOLTAGE
The maximum device output current is dependent on
the input and output voltage. As there is a 1.3A inductor
peak current limit, output current can go out of regula-
tion before reaching the maximum duty cycle. (Note
that, for boost converters, the average inductor current
is equal to the input current.) Characterization graphs
show device limits.
5.2
LED Brightness Control
5.2.1
ADJUSTABLE CONSTANT
CURRENT CALCULATIONS
The maximum number of LEDs (nLED in Equation 5-2)
that can be placed in series and be driven is dependent
on the maximum LED forward voltage (VFmax) and LED
current set by the RSET resistor. The voltage at the out-
put of the MCP1662, plus a margin, should be below
36V. Consider that VFmax has some variation over the
operating temperature range and that the LED data
sheet must be reviewed for the correct data to be intro-
duced in Equation 5-2. A maximum of 10 white LEDs in
series connection can be driven safely.
To calculate the resistor value to set the LED current,
use Equation 5-1, where RSET is connected to VFB and
GND. The reference voltage, VFB, is 300 mV. The cal-
culated current does not depend on the number of
LEDs in the string.
EQUATION 5-1:
VFB
RSET = -----------
ILED
EQUATION 5-2:
EXAMPLE 1:
VFmax nLED + VFB 36V
VFB = 300 mV
ILED = 25 mA
RSET = 12
Characterization graphs show the maximum current
the device can supply according to the number of LEDs
at the output.
For example, to ensure a 100 mA load current for 4
LEDs (output equal to approximately 12V), a minimum
of 3.1V input voltage is necessary. If an application
requires driving 8 LEDs and is powered by one Li-Ion
battery (VIN from 3.3V to 4.2V), the LED current the
MCP1662 device can regulate is close to 75 mA
(Figure 2-6).
EXAMPLE 2:
VFB
ILED
=
=
=
300 mV
100 mA
3
RSET
The power dissipated on the RSET resistor is very low
and equal to VFB x ILED. For ILED = 100 mA, the power
dissipated on the sense resistor is 30 mW and the effi-
ciency of the conversion is high.
2014-2015 Microchip Technology Inc.
DS20005316E-page 13
MCP1662
5.2.4
OPEN LOAD PROTECTION
5.4
Output Capacitor Selection
The MCP1662 device features an open load protection
(OLP) in case the LED is disconnected from the output
line. If the voltage on the VFB pin drops below 50 mV,
the device stops switching and prevents overvoltage on
the output and SW pin, and excessive current into
LEDs.
The output capacitor helps provide a stable output volt-
age and smooth load current during sudden load tran-
sients and reduces the LED current ripple. Ceramic
capacitors are well suited for this application (X5R and
X7R). The output capacitor ranges from 4.7 µF in case
of light loads and static applications, and up to 20 µF
for hundreds of mA LED current applications.
OLP is not enabled during start-up and thermal shut-
down events. Since OLP is not enabled during these
events, a PWM dimming application on the EN pin
needs extra overvoltage circuits such as a Zenner
diode connected in parallel with the LED string.
As mentioned in Section 5.3, Input Capacitor Selection
X7R or X5R capacitance varies over the operating tem-
perature or the DC bias range. With a voltage applied
at the maximum DC rating, capacitance might drop
down to half. This might affect the stability or limit the
output power. Capacitance drop over the entire tem-
perature range is less than 20%. Users must carefully
select the DC voltage rating (DCVRATE) for the output
capacitor according to Equation 5-3 or 5-4:
5.3
Input Capacitor Selection
The boost input current is smoothed by the boost
inductor, reducing the amount of filtering necessary at
the input. Some capacitance is recommended to pro-
vide decoupling from the source and to ensure that the
input does not drop excessively during switching tran-
sients. Because MCP1662 is rated to work at an ambi-
ent temperature of up to 125°C, low ESR X7R ceramic
capacitors are well suited since they have a low tem-
perature coefficient and small size. For use within a lim-
ited temperature range of up to 85°C, an X5R ceramic
capacitor can be used. For light load applications,
4.7 µF of capacitance is sufficient at the input. For
high-power applications that have high source imped-
ance or long leads, using a 10–20 µF input capacitor is
recommended. When the device is working below a
3.0V input with high LED current, additional input
capacitance can be added to provide a stable input
voltage (3 x 10 µF or 33 µF) due to high input current
demand. The input capacitor must be rated at a mini-
mum of 6.3V. For MLCC ceramic capacitors and X7R
or X5R capacitors, capacitance varies over the operat-
ing temperature or the DC bias range. Usually, there is
a drop down to 50% of capacitance. Review the capac-
itor manufacturer data sheet to see how rated capaci-
tance varies over these conditions.
EQUATION 5-3:
DCVRATE VFmax nLED + VFB
OR
EQUATION 5-4:
DCVRATE VOUTmax
Table 5-1 contains the recommended range for the
input and output capacitor value.
TABLE 5-1:
CAPACITOR VALUE RANGE
CIN
COUT
Minimum
Maximum
4.7 µF
—
4.7 µF
47 µF
Table 5-1 contains the recommended range for the
input capacitor value.
DS20005316E-page 14
2014-2015 Microchip Technology Inc.
MCP1662
5.5
Inductor Selection
5.6
Rectifier Diode Selection
The MCP1662 device is designed to be used with small
surface mount inductors; the inductance value can
range from 4.7 µH to 10 µH. An inductance value of
4.7 µH is recommended for output voltages below 15V
(4 or 5 LEDs in series connection). For higher output
voltages, up to 32V (from 5 to a maximum of 10 LEDs),
an inductance value of 10 µH is optimum.
Schottky diodes are used to reduce losses. The diode’s
average current must be higher than the maximum out-
put current. The diode’s reverse breakdown voltage
must be higher than the internal switch rating voltage of
36V.
The converter’s efficiency will be improved if the volt-
age drop across the diode is lower. The forward voltage
(VF) rating is forward-current dependent, which is equal
in particular to the load current.
TABLE 5-2:
MCP1662 RECOMMENDED
INDUCTORS FOR BOOST
CONVERTER
For high currents and high ambient temperatures, use
a diode with good thermal characteristics.
Value
(µH) (typ)
DCR
ISAT
(A)
Size
WxLxH (mm)
Part Number
TABLE 5-3:
RECOMMENDED SCHOTTKY
DIODES
Coilcraft
MSS5131-472
4.7
4.7
5.6
10
0.038
0.057
0.175
0.065
0.084
1.42
2.7
1.6
1.5
1.9
5.1x5.1x3.1
4.2x4.2x2.1
5.0x5.0x1.5
6.2x6.2x3.5
4.3x4.3x4.1
Type
VOUTmax
TA
XFL4020-472
PMEG2005
PMEG4005
MBR0520
MBR0540
18V
36V
18V
36V
< 85°C
< 85°C
< 125°C
< 125°C
LPS5015-562
LPS6235-103
XAL4040-103
10
Würth Elektronik
744025004 WE-TPC
744043004 WE-TPC
744773112 WE-PD2
74408943100 WE-SPC
TDK Corporation
B82462G4472
4.7
4.7
10
0.1
1.7
1.7
1.6
2.1
2.8x2.8x2.8
4.8x4.8x2.8
4.0x4.5x3.2
4.8x4.8x3.8
0.05
5.7
Thermal Calculations
0.156
0.082
10
The MCP1662 device is available in two different pack-
ages (5-lead SOT-23 and 8-lead 2x3 TDFN). By calcu-
lating the power dissipation and applying the package
thermal resistance (JA), the junction temperature is
estimated. The maximum continuous junction tempera-
ture rating for the MCP1662 device is +125°C.
4.7
10
0.04
0.062
0.087
1.8
1.3
6.3x6.3x3.0
6.3x6.3x3.0
4.0x4.0x2.4
B82462G4103
VLCF4024T-4R7
4.7
1.43
Several parameters are used to select the correct
inductor: maximum rated current, saturation current,
and direct resistance (DCR). For boost converters, the
inductor current is much higher than the output current.
The average inductor current is equal to the input cur-
rent. The inductor’s peak current is 30-40% higher than
the average. The lower the inductor DCR, the higher
the efficiency of the converter: a common trade-off in
size versus efficiency.
To quickly estimate the internal power dissipation for
the switching boost regulator, an empirical calculation
using measured efficiency can be used. Given the
measured efficiency, the internal power dissipation is
estimated by Equation 5-5.
EQUATION 5-5:
V
I
OUT OUT
------------------------------------- – V
I
OUT OUT
= P
The saturation current typically specifies a point at
which the inductance has rolled off a percentage of the
rated value. This can range from a 20% to 40% reduc-
tion in inductance. As inductance rolls off, the inductor
ripple current increases, as does the peak switch cur-
rent. It is important to keep the inductance from rolling
off too much, causing switch current to reach the peak
limit.
Dis
Efficiency
The difference between the first term, input power, and
the second term, power delivered, is the power dissi-
pated when using the MCP1662 device. This is an esti-
mate, assuming that most of the power lost is internal
to the MCP1662 and not CIN, COUT, the rectifier diode,
and the inductor. There is some percentage of power
lost in the boost inductor and the rectifier diode, with
very little loss in the input and output capacitors. For a
more accurate estimate of internal power dissipation,
subtract the IINRMS2 x LDCR and ILED x VF power dissi-
pation (where IINRMS is the average input current, LDCR
is the inductor series resistance, and VF is the diode
voltage drop). Another source of loss for the LED driver
that is external to the MCP1662 is the sense resistor.
The losses for the sense resistor can be approximated
by VFB x ILED
.
2014-2015 Microchip Technology Inc.
DS20005316E-page 15
MCP1662
The RSET resistor and feedback signal should be
routed away from the switching node and the switching
current loop. When possible, ground planes and traces
should be used to help shield the feedback signal and
minimize noise and magnetic interferences.
5.8
PCB Layout Information
Good printed circuit board layout techniques are
important to any switching circuitry, and switching
power supplies are no different. When wiring the
switching high-current paths, short and wide traces
should be used. Therefore it is important that the input
and output capacitors be placed as close as possible to
the MCP1662 to minimize the loop area.
EN
+VIN
CIN
Vias to GND Bottom Plane
MCP1662
1
RSET
GND
LED1
LEDN
L
A
K
LEDs
A
D
COUT
K
+VOUT
GND
Vias to GND Bottom Plane
GND Bottom Plane
FIGURE 5-1:
MCP1662 5-Lead SOT-23 Recommended Layout.
+V
OUT
A
K
L
D
A
LED1
+V
IN
COUT
LED2
LEDN
K
MCP1662
CIN
LEDs
Via to GND
RSET
1
EN
GND
GND Bottom Plane
Vias to GND
Bottom Plane
FIGURE 5-2:
MCP1662 TDFN Recommended Layout.
DS20005316E-page 16
2014-2015 Microchip Technology Inc.
MCP1662
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
5-Lead SOT-23
Example
AAAM5
25256
XXXXY
8-Lead TDFN (2x3x0.75 mm)
Example
ACA
543
25
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
e
3
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters
for customer-specific information.
2014-2015 Microchip Technology Inc.
DS20005316E-page 17
MCP1662
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DS20005316E-page 18
2014-2015 Microchip Technology Inc.
MCP1662
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2014-2015 Microchip Technology Inc.
DS20005316E-page 19
MCP1662
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005316E-page 20
2014-2015 Microchip Technology Inc.
MCP1662
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2014-2015 Microchip Technology Inc.
DS20005316E-page 21
MCP1662
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DS20005316E-page 22
2014-2015 Microchip Technology Inc.
MCP1662
APPENDIX A: REVISION HISTORY
Revision E (September 2015)
• The following is the list of modifications:
• Updated Features and General Description sec-
tions.
• Updated parameters in the DC and AC Character-
istics table.
• Updated Figures 2-10, 2-11 and 2-12.
• Corrected Section 4.2.2 “Start-up”.
• Minor updates in Section 4.2.6 “Internal Com-
pensation” and Section 4.2.9 “Output Short
Circuit Condition”.
• Corrected Figure 5-1.
Revision D (March 2015)
The following is the list of modifications
Updated the example packages in Section 6.0
“Packaging Information”.
Revision C (December 2014)
The following is the list of modifications:
Updated the example packages in Section 6.0
“Packaging Information”.
Revision B (November 2014)
The following is the list of modifications:
• Updated the example packages in Section 6.0
“Packaging Information”
• Minor typographical corrections.
Revision A (June 2014)
• Original Release of this Document.
2014-2015 Microchip Technology Inc.
DS20005316E-page 23
MCP1662
NOTES:
DS20005316E-page 24
2014-2015 Microchip Technology Inc.
MCP1662
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
(1)
X
/XX
[X]
Examples:
PART NO.
Device
a)
MCP1662T-E/MNY: Tape and Reel,
Temperature Package
Range
Tape and Reel
Option
Extended temperature,
8LD TFDN package
Tape and Reel,
b)
MCP1662T-E/OT:
Extended temperature,
5LD SOT-23 package
Device:
MCP1662: High-Voltage Step-Up LED Driver with UVLO and
OLP
Tape and Reel
Option:
T
E
= Tape and Reel(1)
Temperature
Range:
= -40C to +125C (Extended)
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Package:
MN* = Plastic Dual Flat, No Lead – 2x3x0.75 mm Body
(TDFN)
OT
*Y
=
=
Plastic Small Outline Transistor (SOT-23)
Nickel palladium gold manufacturing designator.
Only available on the TDFN package.
2014-2015 Microchip Technology Inc.
DS20005316E-page 25
MCP1662
NOTES:
DS20005316E-page 26
2014-2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
32
OptoLyzer, PIC, PICSTART, PIC logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2014-2015, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63277-776-8
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2014-2015 Microchip Technology Inc.
DS20005316E-page 27
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Germany - Karlsruhe
Tel: 49-721-625370
India - Pune
Tel: 91-20-3019-1500
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Austin, TX
Tel: 512-257-3370
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Boston
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Dongguan
Tel: 86-769-8702-9880
Italy - Venice
Tel: 39-049-7625286
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
Cleveland
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Poland - Warsaw
Tel: 48-22-3325737
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Sweden - Stockholm
Tel: 46-8-5090-4654
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Detroit
Novi, MI
UK - Wokingham
Tel: 44-118-921-5800
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Tel: 248-848-4000
Fax: 44-118-921-5820
Houston, TX
Tel: 281-894-5983
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
San Jose, CA
Tel: 408-735-9110
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
07/14/15
DS20005316E-page 28
2014-2015 Microchip Technology Inc.
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