MCP1257-EUN_技术文档

MCP1256/7/8/9

Regulated 3.3V, Low-Ripple Charge Pump with Low-

Operating Current SLEEP Mode or BYPASS Mode

Features

Description

The MCP1256, MCP1257, MCP1258 and MCP1259

are inductorless, positive regulated charge pump

DC/DC converters. The devices generate a regulated

3.3V output voltage from a 1.8V to 3.6V input. The

devices are specifically designed for applications

operating from 2-cell alkaline, Ni-Cd, or Ni-MH

batteries or by one primary lithium MnO2 (or similar)

coin cell battery.

• Inductorless 1.5x, 2x Boost DC/DC Converter

• Output Voltage: 3.3V

• High Output Voltage Accuracy:

- ±3.0% (V_OUTFixed)

• Output Current Up To 100 mA

• 20 mV_PPOutput Voltage Ripple

• Thermal Shutdown and Short Circuit Protection

• Uses Small Ceramic Capacitors

• Switching Frequency: 650 kHz

• Low-Power SLEEP Mode: MCP1256/7

• BYPASS Mode: MCP1258/9

The MCP1256, MCP1257, MCP1258 and MCP1259

provide high efficiency by automatically switching

between 1.5x and 2x boost operation. In addition, at

light output loads, the MCP1256 and MCP1257 can be

placed in a SLEEP mode, lowering the quiescent

current while maintaining the regulated output voltage.

Alternatively, the MCP1258 and MCP1259 provide a

BYPASS feature connecting the input voltage to the

• Low-Power Shutdown Mode: 0.1 μA (Typical)

• Shutdown Input Compatible with 1.8V Logic

• V_INRange: 1.8V to 3.6V

output.

This

allows

for

real-time

clocks,

• Soft-Start Circuitry to Minimize Inrush Current

• Temperature Range: -40°C to +125°C

• Packaging:

microcontrollers or other system devices to remain

biased with virtually no current being consumed by the

MCP1258 or MPC1259.

- 10-Pin, 3 mm x 3 mm DFN

In normal operation, the output voltage ripple is below

20 mV_PPat load currents up to 100 mA. Normal opera-

tion occurs at a fixed switching frequency of 650 kHz,

avoiding interference with sensitive IF bands.

- 10-Pin, MSOP

Applications

The MCP1256 and MCP1258 feature a power-good

output that can be used to detect out-of-regulation

conditions. The MCP1257 and MCP1259 feature a low-

battery indication that issues a warning if the input

voltage drops below a preset voltage threshold.

Extremely low supply current and few external parts (4

capacitors) make these devices ideal for small, battery-

powered applications. A Shutdown mode is also

provided for further power reduction.

• Pagers

• Portable Measurement Instruments

• Home Automation Products

• PICmicro^®MCU Bias

Typical Application

MCP1256

OUTPUT

3.3V

INPUT

1.8V to 3.6V

7

5

1

V

IN

OUT

C

OUT

10 μF

The devices incorporate thermal and short-circuit pro-

tection. Two package offerings are provided: 10-pin

MSOP and 10-lead 3 mm x 3 mm DFN. The devices

are completely characterized over the junction temper-

ature range of -40°C to +125°C.

IN

R

10

1

10 μF

SHDN

PGOOD

Power-Good

Indication

4

8

6

3

C +

1

C +

2

C

1 μF

C

2

1 μF

1

C -

1

C -

2

SLEEP

GND

ON / OFF

9

Typical Application with Power-Good Indication

DS21989A-page 1

MCP1256/7/8/9

Package Pinouts

MCP1256

MCP1257

PGOOD

SLEEP

10 SHDN

LBO

1

2

3

4

5

10 SHDN

1

2

3

4

5

9

8

7

6

GND

SLEEP

9

8

7

6

GND

C -

2

1

2

1

C +

V

C +

V

1

IN

1

IN

V

C +

V

C +

OUT

2

OUT

2

MCP1258

MCP1259

PGOOD

BYPASS

1

2

3

4

5

10 SHDN

LBO

1

2

3

4

5

10 SHDN

9

8

7

6

GND

BYPASS

9

8

7

6

GND

C -

2

1

2

1

C +

V

C +

V

1

IN

1

IN

V

C +

V

C +

OUT

2

OUT

2

Functional Block Diagram

C₂-

C₂+

C₁-

C₁+

V_IN

1.5x, 2x Mode

Comparator

840 kΩ

Gate Drives

S1

S5

S6

+

-

S5,S7

S6

D Q

S4

S1,S3,CE

650 kHz

Osc.

S4

V_OUT

840 kΩ

CE

S2

S3

S7

Bandgap

Ref.

+

-

Feedback

Amplifier

480 kΩ

720kΩ

GND

V_OUT

TABLE 1:

Mode

SWITCH LOGIC

Phase

Oscillator

Q

S1

S2(CE)

S3

S4

S5

S6

S7

1.5x

Charging

Transfer

Charging

Transfer

—

H

L

H

L

H

L

H

L

H

L

H

L

H

L

H

L

2x

H

L

H

—

H

L

H

L

H

L

2x

H

L

BYPASS

—

H

L

H

Legend: L is Logic Low, H is Logic High

DS21989A-page 2

MCP1256/7/8/9

† Notice: Stresses above those listed under “Maximum

Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational listings of this specification is not implied.

Exposure to maximum rating conditions for extended periods

may affect device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings†

Power Supply Voltage, V ...............................................3.8V

IN

Voltage on Any Pin w.r.t. GND ................. -0.3V to (V +0.3V)

IN

Output Short Circuit Duration ................................continuous

Storage Temperature Range.........................-65°C to +150°C

Ambient Temperature with Power Applied ....-55°C to +125°C

Maximum Junction Temperature.................................+150°C

ESD protection on all pins

Human Body Model (1.5 kΩ in Series with 100 pF).......≥ 2 kV

Machine Model (200 pF, No Series Resistance).............200V

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, all limits apply for V = 1.8V to 3.6V, SHDN = V , C = C

= 10 μF,

IN

OUT

C = C = 1 μF, I

= 10 mA, T = -40°C to +125°C. Typical values are at T = +25°C.

J J

1

2

OUT

Unit

s

Parameters

Sym

Min

Typ

Max

Conditions

ALL DEVICES

Supply Voltage

V

1.8

—

3.6

—

+3.0

—

V

IN

Output Voltage

V

3.3

OUT

Output Voltage Accuracy

Output Current

-3.0

30

70

100

—

±0.5

—

%

I

= 10 mA to I

OUT OUT(MAX)

I

mA 1.8V < V < 2.0V

IN

OUT(MAX)

—

mA 2.0V < V < 2.2V

IN

—

mA 2.2V < V < 3.6V

IN

Short Circuit Current

Power Efficiency

I

150

84.5

76.4

80.1

64.0

67.1

67.5

69.7

76.0

76.7

65.0

71.0

71.6

mA

%

V

= 0V, V = 1.8V to 3.6V

OUT IN

SC

η

—

= 1.8V, I

= 10 mA

= 50 mA

= 10 mA

= 50 mA

= 10 mA

= 50 mA

= 100 mA

= 10 mA

= 50 mA

= 100 mA

= 10 mA

= 50 mA

= 100 mA

IN

OUT

—

= 1.8V, I

= 2.0V, I

= 2.4V, I

= 2.8V, I

= 3.0V, I

—

Shutdown Input - SHDN

SHDN Input Voltage Low

SHDN Input Voltage High

V

—

1.4

—

0.4

—

V

IL(SHDN)

IH(SHDN)

LK(SHDN)

V

SHDN Input Leakage

Current

I

0.001

0.1

μA

SHDN Quiescent Current

I

—

0.25

2

μA

V

= 0V, T = +25°C

Q

SHDN J

Thermal Shutdown

Threshold

T

—

160

15

—

°C

J

Thermal Shutdown

Hysteresis

T

J(HYS)

DS21989A-page 3

MCP1256/7/8/9

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all limits apply for V = 1.8V to 3.6V, SHDN = V , C = C

= 10 μF,

IN

OUT

C = C = 1 μF, I

= 10 mA, T = -40°C to +125°C. Typical values are at T = +25°C.

1

2

OUT

J

Unit

s

Parameters

Sym

Min

Typ

Max

Conditions

MCP1256 and MCP1257 Devices

SLEEP Mode Input - SLEEP

SLEEP Input Voltage Low

SLEEP Input Voltage High

V

—

1.4

—

0.4

—

V

IL(SLEEP)

IH(SLEEP)

LK(SLEEP)

V

SLEEP Input Leakage

Current

I

0.001

0.1

μA

SLEEP Quiescent Current

I

—

10

20

μA

V

= 0V, I

= 0 mA

OUT

Q

SLEEP

MCP1256 and MCP1258 Devices

Power-Good Output - PGOOD

PGOOD Threshold

PGOOD Hysteresis

V

—

93

110

25

—

%

Percent of V

Falling

OUT

TH

V

mV

V

Rising

HYS

OUT

PGOOD Output Low

Voltage

V

100

I

= 0.5 mA, V = 1.8V

OL

SINK IN

PGOOD Input Leakage

Current

I

—

0.02

1

μA

V

= V

LK(PGOOD)

PGOOD IN

MCP1257 and MCP1259

Low-Battery Output - LBO

LBO Threshold

V

—

1.95

240

25

—

V

Falling

TH

IN

LBO Hysteresis

V

mV

μA

Rising

HYS

IN

LBO Output Low Voltage

LBO Input Leakage Current

MCP1258 and MCP1259

V

100

1

I

= 0.5 mA, V = 1.8V

OL

SINK IN

I

0.02

V

= V

LK(LBO)

LBO

IN

BYPASS Mode Input - BYPASS

BYPASS Input Voltage Low

V

—

0.4

—

V

IL(BYPASS)

IH(BYPASS)

BYPASS Input Voltage

High

V

1.4

BYPASS Input Leakage

Current

I

—

0.001

0.25

1.5

0.1

2

μA

Ω

LK(BYPASS)

BYPASS Quiescent

Current

I

V

= 0V, I

= 0 mA,

OUT

Q

BYPASS

T = +25°C

J

BYPASS Input-to-Output

Impedance

R

—

V

= 2.4V

BYPASS

IN

DS21989A-page 4

MCP1256/7/8/9

AC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, all limits apply for V = 1.8V to 3.6V, SHDN = V , C = C = 10 μF,

IN

OUT

C = C = 1 μF, I

= 10 mA, T = -40°C to +125°C. Typical values are at T = +25°C.

1

2

OUT

J

Parameters

Sym

Min

Typ

Max

Units

Conditions

ALL DEVICES

Internal Oscillator Frequency

Output Voltage Ripple,

Normal Operation

F

—

650

5

—

kHz

mVp-p

μs

OSC

V

C

= 10 μF, I

= 10 mA

RIP

OUT

20

12

55

175

= 100 mA

= 10 mA

OUT

= 2.2 μF, I

OUT

= 100 mA

V

Wake-up Time From

T

V

= 3.0V, I

= 10 mA,

,

OUT

WKUP

IN

OUT

Shutdown

SHDN = V

IH(MIN)

V

from 0 to 90% Nominal Regulated

OUT

Output Voltage

MCP1256 and MCP1257

Output Voltage Ripple,

SLEEP Mode

V

—

40

60

40

60

—

mVp-p

C

= 10 μF, I

= 0.1 mA

= 4 mA

RIP

OUT

= 2.2 μF, I

= 0.1 mA

= 4 mA

OUT

MCP1258 and MCP1259

V

Wake-up Time From

T

—

150

—

μs

V

= 3.0V, I

= 10 mA,

,

OUT

WKUP

IN

OUT

BYPASS

SHDN = V

IH(MIN)

V

from 0 to 90% Nominal Regulated

OUT

Output Voltage

TEMPERATURE SPECIFICATIONS

Electrical Specifications: Unless otherwise indicated, all limits apply for V = 1.8V to 3.6V, SHDN = V , C = C = 10 μF,

OUT

IN

C = C = 1 μF, I

= 10 mA, T = -40°C to +125°C. Typical values are at T = +25°C.

1

2

OUT

J

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Specified Temperature Range

Operating Temperature Range

Storage Temperature Range

T

-40

-65

—

+125

+150

°C

J

T

A

Thermal Package Resistances

Thermal Resistance, 10-Lead, MSOP

θ

—

200

57

—

°C/W

4-Layer JC51-7 Standard Board,

Natural Convection

JA

Thermal Resistance, 10-Lead, DFN

3 mm x 3 mm

4-Layer JC51-7 Standard Board,

Natural Convection

DS21989A-page 5

MCP1256/7/8/9

2.0

TYPICAL PERFORMANCE CURVES

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

NOTE: Unless otherwise indicated, C_IN= C_OUT= 10 μF, C₁= C₂= 1 μF, I_OUT= 10 mA, and T_A= +25°C.

100

90

80

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

V_IN= 1.8V

V_IN= 2.1V

V_IN= 2.4V

V_IN= 2.7V

I_OUT= 25 mA

Mode Transition

10

30

50

70

90

110

130

1.8

2.1

2.4

2.7

3.0

3.3

Output Current (mA)

Input Voltage (V)

FIGURE 2-1:

Current (I_OUT).

Efficiency (η) vs. Output

FIGURE 2-4:

Voltage (V_IN).

Efficiency (η) vs. Supply

90

80

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

V_IN= 2.7V

V_IN= 3.0V

V_IN= 3.3V

I_OUT= 50 mA

Mode Transition

10

30

50

70

90

110

130

1.8

2.4

2.7

3.0

3.3

Output Current (mA)

Input Voltage (V)

FIGURE 2-2:

Current (I_OUT).

Efficiency (η) vs. Output

FIGURE 2-5:

Voltage (V_IN).

Efficiency (η) vs. Supply

100

90

80

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

I_OUT= 100 mA

I_OUT= 10 mA

Mode Transition

1.8

2.1

2.4

2.7

3.0

3.3

1.8

2.4

2.7

3.0

3.3

Input Voltage (V)

FIGURE 2-3:

Efficiency (η) vs. Supply

FIGURE 2-6:

Efficiency (η) vs. Supply

Voltage (V_IN).

DS21989A-page 6

MCP1256/7/8/9

TYPICAL PERFORMANCE CURVES (CONTINUED)

NOTE: Unless otherwise indicated, C_IN= C_OUT= 10 μF, C₁= C₂= 1 μF, I_OUT= 10 mA, and T_A= +25°C.

3.5

3.4

3.3

3.2

3.1

3.0

2.9

2.4

2.2

2.0

1.8

1.6

1.4

1.2

V_IN= 3.6V

V_IN= 2.1V

V_IN= 2.4V

V_IN= 1.8V

0

10 20 30 40 50 60 70 80 90 100

Output Current (mA)

10

30

50

70

90

110

130

Output Current (mA)

FIGURE 2-7:

Output Voltage (V_OUT) vs.

FIGURE 2-10:

Quiescent Supply Current

Output Current (I_OUT).

(I_Q) vs. Output Current (I_OUT) - Normal Mode.

3.5

140

V_IN= 2.4V

120

100

80

3.4

I_OUT= 10 mA

3.3

3.2

V_IN= 3.0V

I_OUT= 50 mA

60

3.1

40

20

0

I_OUT= 100 mA

3.0

2.9

1.8

2.1

2.4

2.7

3.0

3.3

3.6

0

0.2 0.4 0.6 0.8

1

1.2 1.4 1.6 1.8

2

Input Voltage (V)

Output Current (mA)

FIGURE 2-8:

Output Voltage (V_OUT) vs.

FIGURE 2-11:

Quiescent Supply Current

Input Voltage (V_IN).

(I_Q) vs. Output Current (I_OUT) - SLEEP Mode.

1.8

1.7

1.6

1.5

1.4

1.3

1.2

0.8

V_IN= 2.4V

0.7

0.6

0.5

V_IN= 2.4V

V_IN= 3.0V

0.4

0.3

0.2

0.1

0

1

2

3

4

5

6

7

8

9

10

0

2

4

6

8

10 12 14 16 18 20

Output Current (mA)

FIGURE 2-9:

Quiescent Supply Current

FIGURE 2-12:

Quiescent Supply Current

(I_Q) vs. Output Current (I_OUT) - Normal Mode.

(I_Q) vs. Output Current (I_OUT) - SLEEP Mode.

DS21989A-page 7

MCP1256/7/8/9

TYPICAL PERFORMANCE CURVES (CONTINUED)

NOTE: Unless otherwise indicated, C_IN= C_OUT= 10 μF, C₁= C₂= 1 μF, I_OUT= 10 mA, and T_A= +25°C.

2.0

1.8

1.6

1.4

1.2

1.0

0.04

0.03

0.02

0.01

0.00

-0.01

-0.02

-0.03

-0.04

V_IN= 2.4V

I_OUT= 100 mA

1.8

2.1

2.4

2.7

3.0

3.3

3.6

0

1

2

3

4

5

6

7

8

9

10

Input Voltage (V)

Time (μs)

FIGURE 2-13:

BYPASS Impedance

FIGURE 2-16:

Output Voltage Ripple vs.

(R_BYPASS) vs. Supply Voltage (V_IN).

Time - Normal 2x Mode.

0.04

0.03

0.02

0.01

0.00

-0.01

-0.02

-0.03

-0.04

0.04

0.03

0.02

0.01

0.00

-0.01

-0.02

-0.03

-0.04

V_IN= 2.4V

_OUT= 10 mA

V_IN= 3.0V

I_OUT= 10 mA

I

0

1

2

3

4

5

6

7

8

9

10

0

1

2

3

4

5

6

7

8

9

10

Time (μs)

FIGURE 2-14:

Output Voltage Ripple vs.

FIGURE 2-17:

Output Voltage Ripple vs.

Time - Normal 2x Mode.

Time - Normal 1.5x Mode.

0.04

0.03

0.02

0.01

0.00

-0.01

-0.02

-0.03

-0.04

0.04

0.03

0.02

0.01

0.00

-0.01

-0.02

-0.03

-0.04

V_IN= 2.4V

_OUT= 50 mA

V_IN= 3.0V

I_OUT= 50 mA

I

0

1

2

3

4

5

6

7

8

9

10

0

1

2

3

4

5

6

7

8

9

10

Time (μs)

FIGURE 2-15:

Output Voltage Ripple vs.

FIGURE 2-18:

Output Voltage Ripple vs.

Time - Normal 2x Mode.

Time - Normal 1.5x Mode.

DS21989A-page 8

MCP1256/7/8/9

TYPICAL PERFORMANCE CURVES (CONTINUED)

NOTE: Unless otherwise indicated, C_IN= C_OUT= 10 μF, C₁= C₂= 1 μF, I_OUT= 10 mA, and T_A= +25°C.

0.04

0.03

0.02

0.01

0.00

-0.01

-0.02

-0.03

-0.04

0.20

0.15

0.10

0.05

0.00

-0.05

-0.10

-0.15

-0.20

V_IN= 3.0V

I_OUT= 1 mA

V_IN= 3.0V

I_OUT= 100 mA

0

1

2

3

4

5

6

7

8

9

10

Time (μs)

FIGURE 2-19:

Output Voltage Ripple vs.

FIGURE 2-22:

Output Voltage Ripple vs.

Time - Normal 1.5x Mode.

Time - SLEEP Mode.

0.20

0.15

0.10

0.05

0.00

-0.05

-0.10

-0.15

-0.20

0.20

0.15

0.10

0.05

0.00

-0.05

-0.10

-0.15

-0.20

V_IN= 3.0V

_OUT= 10 mA

V_IN= 2.4V

_OUT= 1 mA

I

Time (μs)

FIGURE 2-20:

Output Voltage Ripple vs.

FIGURE 2-23:

Output Voltage Ripple vs.

Time - SLEEP Mode.

0.20

0.15

0.10

0.05

0.00

-0.05

-0.10

-0.15

-0.20

8

7

6

5

4

3

2

1

0

0.20

0.10

0.00

V_IN= 2.4V

_OUT= 10 mA

I

-0.10

V_IN= 2.4V

I_OUT= 10 mA -0.20

-0.30

-0.40

-0.50

-0.60

Time (μs)

FIGURE 2-21:

Output Voltage Ripple vs.

FIGURE 2-24:

Output Voltage Ripple vs.

Time - SLEEP Mode.

Time - Mode Transition: SLEEP Mode-to-Normal

2x Mode-to-SLEEP Mode.

DS21989A-page 9

MCP1256/7/8/9

TYPICAL PERFORMANCE CURVES (CONTINUED)

NOTE: Unless otherwise indicated, C_IN= C_OUT= 10 μF, C₁= C₂= 1 μF, I_OUT= 10 mA, and T_A= +25°C.

8

7

6

5

4

3

2

1

0

0.20

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.00

0.20

0.10

V_OUT

0.10

V_OUT

0.00

-0.10

-0.20

-0.30

-0.40

-0.50

-0.60

-0.10

-0.20

-0.30

-0.40

-0.50

-0.60

V_IN= 2.4V

I_OUT= 10 mA

V_IN

I_OUT

Time (μs)

FIGURE 2-25:

Load Transient Response -

FIGURE 2-27:

Line Transient Response.

Normal 2x Mode.

8

0.20

0.10

0.00

0.40

0.20

0.10

0.00

7

0.35

V_OUT

6

5

4

0.30

0.25

0.20

0.15

0.10

-0.10

I_OUT= 100 mA

V_IN= 3.0V

-0.20

-0.30

-0.40

-0.50

-0.60

-0.20

-0.30

-0.40

-0.50

-0.60

V_IN

3

2

1

0

0.05

0.00

I_OUT

Time (μs)

FIGURE 2-28:

Line Transient Response.

FIGURE 2-26:

Load Transient Response -

Normal 1.5x Mode.

DS21989A-page 10

MCP1256/7/8/9

3.0

PIN DESCRIPTION

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

Pin No.

PIN FUNCTION TABLE

Symbol

Function

DFN

MSOP

1

PGOOD

LBO

Power-Good Indication Open-Drain Output Pin: MCP1256 and MCP1258

Low-Battery Indication Open-Drain Output Pin: MCP1257 and MCP1259

Active Low SLEEP Mode Input Pin: MCP1256 and MCP1257

Active Low BYPASS Mode Input Pin: MCP1258 and MCP1259

Flying Capacitor Negative Pin

2

SLEEP

BYPASS

C2-

3

4

3

4

C1+

Flying Capacitor Positive Pin

5

V

Regulated 3.3V Output Voltage

OUT

6

C2+

Flying Capacitor Positive Pin

7

V

Power Supply Input Voltage

IN

8

C1-

GND

SHDN

Flying Capacitor Negative Pin

9

0V Reference

10

Active Low SHUTDOWN Mode Input Pin

3.2.2

ACTIVE LOW BYPASS MODE

(BYPASS)

3.1

3.1.1

Status Indication (PGOOD, LBO)

POWER-GOOD OUTPUT PIN

(PGOOD)

MCP1258/9: A logic low signal applied to this pin

places the device into a BYPASS mode of operation. In

this mode, the input supply voltage is connected

directly to the output.

MCP1256/8: PGOOD is high impedance when the out-

put voltage is in regulation. A logic low is asserted

when the output falls 7% (typical) below the nominal

value. The PGOOD output remains low until V_OUTis

within 3% (typical) of its nominal value. On start-up, this

pin indicates when the output voltage reaches its final

value. PGOOD is high impedance when SHDN is low

or when BYPASS is low (MCP1258).

3.3

Flying Capacitor Negative (C2-)

A 1 μF ceramic flying capacitor is recommended.

3.4

Flying Capacitor Positive (C1+)

A 1 μF ceramic flying capacitor is recommended.

3.1.2

LOW-BATTERY OUTPUT PIN (LBO)

3.5

Regulated Output Voltage (V

)

OUT

MCP1257/9: LBO is high impedance when the input

voltage is above the low-battery threshold voltage. A

logic low is asserted when the input falls below the low-

battery threshold voltage. The LBO output remains low

until V_INis above the low-battery threshold voltage plus

the low-battery hysteresis voltage. LBO is high

impedance when SHDN is low or when BYPASS is low

(MCP1259).

Regulated 3.3V output. Bypass to GND with a

minimum of 2.2 μF.

3.6

Flying Capacitor Positive (C2+)

A 1 μF ceramic flying capacitor is recommended.

3.7

Power Supply Input Voltage (V )

IN

A supply voltage of 1.8V to 3.6V is recommended.

Bypass to GND with a minimum of 1 μF.

3.2

Mode Selection (SLEEP, BYPASS)

3.2.1

ACTIVE LOW SLEEP MODE

(SLEEP)

3.8

Flying Capacitor Negative (C1-)

A 1 μF ceramic flying capacitor is recommended.

MCP1256/7: A logic low signal applied to this pin

places the device into a SLEEP mode of operation. In

this mode, the device maintains regulation. SLEEP

mode performs pulse skip operation reducing the

current draw of the device at the expense of increased

output voltage ripple.

3.9

0V Reference (GND)

Connect to negative terminal of and input supply.

3.10 Device Shut Down (SHDN)

A logic low signal applied to this pin disables the

device. A logic high signal applied to this pin allows

normal operation.

DS21989A-page 11

MCP1256/7/8/9

(2x mode), when the energy is transferred to the out-

put. The transfer mode determines which switches are

closed for the transfer.

4.0

DEVICE OVERVIEW

The MCP1256/7/8/9 devices are positive regulated

charge pumps that accept an input voltage from +1.8V

to +3.6V and convert it to a regulated 3.3V output volt-

age. The MCP1256/7/8/9 provide a low-cost, compact

and simple solution for step-up DC/DC conversions,

primarily in battery applications, that do not want to use

switching regulator solutions because of EMI noise and

inductor size.

Both phases occur in one clock period of the internal

oscillator. When the second phase (transfer) has been

completed, the cycle repeats.

4.2

Power Efficiency

The power efficiency, η, is determined by the mode of

operation, 1.5x mode or 2x mode. Equation 4-1 and

Equation 4-2 are used to approximate the power effi-

ciency with any significant amount of output current. At

light loads, the device quiescent current must be taken

into consideration.

The MCP1256/7/8/9 are designed to offer the highest

possible efficiency under common operating condi-

tions, i.e. V_IN= 2.4V or 2.8V, V_OUT= 3.3V,

I

_OUT= 100 mA. A fixed switching frequency, 650 kHz

typically, allows for easy external filtering.

The MCP1256/7 provide a unique SLEEP mode

feature which reduces the current drawn from the input

supply while maintaining a regulated bias on external

peripherals. SLEEP mode can substantially increase

battery run-time in portable applications.

EQUATION 4-1:

P_OUT

V

_OUT× I_OUT

V_OUT

η_1.5x= ------------- = ---------------------------------------- = ----------------------

P_IN

V_IN× 1.5 × I_OUT

V_IN× 1.5

The MCP1258/9 provide a unique BYPASS mode

feature which virtually eliminates the current drawn

from the input supply by the device while maintaining

an unregulated bias on external peripherals. BYPASS

connects the input supply voltage to the output. All

remaining functions of the device are shutdown.

BYPASS mode can substantially increase battery run-

time in portable applications.

EQUATION 4-2:

P_OUT

V_OUT× I_OUT

V_OUT

η_2x= ------------- = ------------------------------------ = -----------------

P_IN

V_IN× 2 × I_OUT

V_IN× 2

4.3

Shutdown Mode (SHDN)

Driving SHDN low places the MCP1256/7/8/9 in a low-

power Shutdown mode. This disables the charge-pump

switches, oscillator and control logic, reducing the

quiescent current to 0.25 μA (typical). The PGOOD

output and LBO are in a high impedance state during

shutdown.

The devices supply up to 100 mA of output current for

input voltages, V_IN, greater than or equal to 2.2V. The

devices are available in small 10-Pin MSOP or DFN

packages with an operating junction temperature range

of -40°C to +125°C.

4.4

SLEEP Mode (SLEEP)

4.1

Theory of Operation

The MCP1256/7 provide a unique SLEEP mode fea-

ture. SLEEP mode reduces the current drawn from the

input supply while maintaining a regulated bias on

external peripherals. SLEEP mode can substantially

increase battery run-time in portable applications.

The MCP1256/7/8/9 devices employ a switched capac-

itor charge pump to boost an input supply, V_IN, to a reg-

ulated 3.3V output voltage. Refering to the Functional

Block Diagram, the devices perform conversion and

regulation in two phases: charge and transfer. When

the devices are not in shutdown, SLEEP or BYPASS,

the two phases are continuously cycled through.

The regulation control is referred to as a bang-bang

control due to the output being regulated around a fixed

reference with some hysteresis. As a result, some

amount of peak-to-peak ripple will be observed at the

output independent of load current. The frequency of

the output ripple, however, will be influenced heavily by

the load current and output capacitance.

Charge transfers charge from the input supply to the

flying capacitors, C₁and C₂, connected to pins C₁+,

C₁-, C₂+ and C₂-, respectively. During this phase,

switches S4 and S6 are closed. Switch S2 controls the

amount of charge transferred to the flying capacitors.

The amount of charge is determined by a sample and

hold error amplifier with feedback from the output

voltage at the beginning of the phase.

4.5

BYPASS Mode (BYPASS)

The MCP1258/9 provide a unique BYPASS mode fea-

ture which virtually eliminates the current drawn from

the input supply by the device, while maintaining an

unregulated bias on external peripherals. BYPASS

connects the input supply voltage to the output. All

remaining functions of the device are shutdown.

BYPASS mode can substantially increase battery run-

time in portable applications.

Once the first phase (charge) is complete, transfer is

initiated. The second phase transfers the energy from

the flying capacitors to the output. The MCP1256/7/8/9

devices autonomously switch between 1.5x mode and

2x mode. This determines whether the flying capacitors

are placed in parallel (1.5x mode), or remain in series

DS21989A-page 12

MCP1256/7/8/9

4.6

Power-Good Output (PGOOD)

4.9

Thermal Shutdown

For the MCP1256/8 devices, the PGOOD output is an

open-drain output that sinks current when the regulator

output voltage falls below 0.93V_OUT(typical). If the reg-

ulator output voltage falls below 0.93V_OUT(typical) for

less than 200 μs and then recovers, glitch immunity cir-

cuits prevent the PGOOD signal from transitioning low.

A 10 kΩ to 1 MΩ pull-up resistor from PGOOD to V_OUT

may be used to provide a logic output. If not used,

connect PGOOD to GND or leave unconnected.

The MCP1256/7/8/9 devices feature thermal shutdown

with temperature hysteresis. When the die temperature

exceeds 160°C, the device shuts down. When the die

cools by 15°C, the MCP1256/7/8/9 automatically turns

back on again. If high die temperature is caused by out-

put overload and the load is not removed, the device

will turn on and off resulting in a pulsed output.

5.0

5.1

APPLICATIONS

PGOOD is high impedance when the output voltage is

in regulation. A logic low is asserted when the output

falls 7% (typical) below the nominal value. The PGOOD

output remains low until V_OUTis within 3% (typical) of

its nominal value. On start-up, this pin indicates when

the output voltage reaches its final value. PGOOD is

high impedance when SHDN is low or when BYPASS

is low (MCP1258).

Capacitor Selection

The style and value of capacitors used with the

MCP1256/7/8/9 family determine several important

parameters, such as output voltage ripple and charge

pump strength. To minimize noise and ripple, it is rec-

ommended that low ESR (0.1Ω) capacitors be used for

both C_INand C_OUT. These capacitors should be

ceramic and should be 10 μF or higher for optimum

performance.

4.7

Low-Battery Output (LBO)

For the MCP1257/9 devices, the LBO output is an

open-drain output that sinks current when the input

voltage falls below a preset threshold. If the input volt-

age falls below the preset threshold for less than

200 μs and then recovers, glitch immunity circuits pre-

vent the LBO signal from transitioning low. A 10 kΩ to

1 MΩ pull-up resistor from LBO to V_OUTmay be used

to provide a logic output. If not used, connect LBO to

GND or leave unconnected.

If the source impedance to V_INis very low, up to several

megahertz, C_INmay not be required. Alternatively, a

somewhat smaller value of C_INmay be substituted for

the recommended 10 μF, but will not be as effective in

preventing ripple on the V_INpin.

The value of C_OUTcontrols the amount of output volt-

age ripple present on V_OUT. Increasing the size of

C_OUTwill reduce output ripple at the expense of a

slower turn-on time from shutdown and a higher inrush

current.

LBO is high impedance when the input voltage is above

the low-battery threshold voltage. A logic low is

asserted when the input falls below the low-battery

threshold voltage. The LBO output remains low until

The flying capacitors (C₁and C₂) control the strength

of the charge pump and in order to achieve the maxi-

mum rated output current (100 mA), it is necessary to

have at least 1 μF of capacitance for the flying capaci-

tor. A smaller flying capacitor delivers less charge per

clock cycle to the output capacitor resulting in lower

available output current.

V_INis above the low-battery threshold voltage plus the

low-battery hysteresis voltage. LBO is high impedance

when SHDN is low or when BYPASS is low

(MCP1259).

4.8

Soft-Start and Short-Circuit

Protection

5.2

PCB Layout Issues

The MCP1256/7/8/9 devices transfer charge at high

switching frequencies producing fast, high peak, tran-

sient currents. As a result, any stray inductance in the

component layout will produce unwanted noise in the

system. Proper board layout techniques are required to

ensure optimum performance.

The MCP1256/7/8/9 devices feature fold back short-

circuit protection. This circuitry provides an internal

soft-start function by limiting inrush current during

startup and also limits the output current to 150 mA

(typical), if the output is short-circuited to GND. The

internal soft-start circuitry requires approximately

175 μs, typical, from either initial power-up, release

from Shutdown, or release from BYPASS (MCP1258/9)

for the output voltage to be in regulation.

DS21989A-page 13

MCP1256/7/8/9

6.0

TYPICAL APPLICATION

CIRCUITS

The MCP1256/7/8/9 devices are inductorless, positive

regulated, switched capacitor DC/DC converters.

Typical application circuits are depicted in Figure 6-1.

MCP1256

INPUT

1.8V to 3.6V

OUTPUT

3.3V

7

5

1

V

IN

OUT

C

OUT

IN

R

C

1

2

10 μF

10

SHDN

PGOOD

Power-Good

Indication

4

8

6

3

C +

1

2

C

1 μF

1

1 μF

C -

1

2

SLEEP

GND

ON / OFF

9

Typical Application with Power-Good Indication

MCP1259

INPUT

1.8V to 3.6V

OUTPUT

3.3V

7

5

1

V

OUT

IN

C

OUT

IN

10 μF

R

10 μF

1

10

SHDN

LBO

Low-Battery

Indication

4

8

6

3

C +

2

1

C

1 μF

C

2

1

1 μF

C -

2

1

2

BYPASS

GND

ON / OFF

9

Typical Application with Low-Battery Indication

FIGURE 6-1:

Typical Application Circuits.

DS21989A-page 14

MCP1256/7/8/9

7.0

7.1

PACKAGING INFORMATION

Package Marking Information

10-Lead DFN

Example:

1

2

3

4

5

10

9

1

2

3

4

5

10

9

XXXX

XYWW

NNN

1256

E607

256

8

7

6

Example:

10-Lead MSOP

1259E

607256

XXXXX

YWWNNN

Legend: XX...X Customer-specific information

Y

YY

WW

NNN

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

e

3

Pb-free JEDEC designator for Matte Tin (Sn)

*

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

)

e3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS21989A-page 15

MCP1256/7/8/9

10-Lead Plastic Dual-Flat No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated

b

p

E

n

L

K

D

D2

EXPOSED

METAL

PAD

2

1

PIN 1

ID INDEX

AREA

E2

(NOTE 2)

TOP VIEW

BOTTOM VIEW

(NOTE 1)

A

EXPOSED

TIE BAR

(NOTE 3)

A3

A1

Units

INCHES

NOM

MILLIMETERS

NOM

10

*

Dimension Limits

MIN

MAX

MIN

MAX

n

e

Number of Pins

Pitch

10

.020 BSC

0.50 BSC

0.90

Overall Height

Standoff

A

.031

.035

.001

.008 REF.

.039

0.80

1.00

0.05

A1

A3

E

.000

.002

0.00

0.02

Lead Thickness

Overall Length

0.20 REF.

3.00

.112

.082

.112

.051

.008

.012

.008

.118

.094

.118

.065

.010

.016

—

.124

.096

.124

.067

.015

.020

—

2.85

2.08

2.85

1.30

0.18

0.30

0.20

3.15

2.45

3.15

1.70

0.30

0.50

—

(

Note 3

)

Exposed Pad Length

Overall Width

E2

D

2.39

3.00

(

Note 3

)

Exposed Pad Width

Lead Width

D2

b

1.65

0.25

Contact Length §

Contact-to-Exposed Pad §

L

0.40

K

—

*

§

Controlling Parameter

Significant Characteristic

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Exposed pad varies according to die attach paddle size.

3. Package may have one or more exposed tie bars at ends.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

JEDEC equivalent: Not Registered

Drawing No. C04-063

Revised 09-12-05

DS21989A-page 16

MCP1256/7/8/9

10-Lead Plastic Micro Small Outline Package (UN) (MSOP)

E

E1

p

D

2

n

1

B

c

α

φ

A2

A

L

A1

β

(F)

Units

Dimension Limits

INCHES

NOM

MILLIMETERS*

MIN

MAX

MIN

NOM

MAX

n

p

Number of Pins

Pitch

10

–

.020 BSC

.033

.193 BSC

0.50 BSC

Overall Height

Molded Package Thickness

Standoff

A

A2

A1

E

.043

–

0.75

0.00

1.10

.030

.000

.037

.006

0.85

0.95

0.15

Overall Width

4.90 BSC

Molded Package Width

Overall Length

Foot Length

E1

D

.118 BSC

3.00 BSC

L

.016

.024

.037 REF

.031

0.40

0.60

0.95 REF

0.80

Footprint

F

φ

Foot Angle

0°

.003

.006

5°

–

8°

.009

.012

15°

0°

0.08

0.15

5°

–

8°

0.23

0.30

15°

c

Lead Thickness

Lead Width

B

α

.009

–

0.23

–

Mold Draft Angle Top

Mold Draft Angle Bott om

β

5°

–

15°

5°

–

15°

*

Controlling Parameter

Notes:

Dimensions D and E1 donot include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

REF: Reference Dimnesion, usually witho ut tolerance, for information purposes only.

See ASME Y14.5M

JEDEC Equivalent: MO-187 BA

Drawing No. C04-021

Revised 09-16-05

DS21989A-page 17

MCP1256/7/8/9

NOTES:

DS21989A-page 18

MCP1256/7/8/9

APPENDIX A: REVISION HISTORY

Revision A (March 2006)

• Original Release of this Document.

DS21989A-page 19

MCP1256/7/8/9

NOTES:

DS21989A-page 20

MCP1256/7/8/9

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

PART NO.

Device

X

/XX

a)

b)

MCP1256-EMF:

E-Temp, DFN package

MCP1256T-EMF: Tape and Reel, E-Temp,

DFN package

Temperature

Range

Package

c)

d)

MCP1256-EUN:

MCP1256T-EUN: Tape and Reel, E-Temp,

MSOP package

E-Temp, MSOP package

Device

MCP1256:

Positive Regulated Charge Pump with SLEEP

Mode and Power-Good Indication

Positive Regulated Charge Pump with SLEEP

Mode and Power-Good Indication,

Tape and Reel

Positive Regulated Charge Pump with SLEEP

Mode and Low-Battery Indication

Positive Regulated Charge Pump with SLEEP

Mode and Low-Battery Indication,

Tape and Reel

MCP1256T:

a)

b)

MCP1257-EMF:

MCP1257T-EMF: Tape and Reel, E-Temp,

DFN package

MCP1257-EUN:

MCP1257T-EUN: Tape and Reel, E-Temp,

MSOP package

E-Temp, DFN package

MCP1257:

c)

d)

E-Temp, MSOP package

MCP1257T:

MCP1258:

Positive Regulated Charge Pump with

BYPASS Mode and Power-Good Indication

Positive Regulated Charge Pump with

BYPASS Mode and Power-Good Indication,

Tape and Reel

a)

b)

MCP1258-EMF:

MCP1258T-EMF: Tape and Reel, E-Temp,

DFN package

E-Temp, DFN package

MCP1258T:

c)

d)

MCP1258-EUN:

MCP1258T-EUN: Tape and Reel, E-Temp,

MSOP package

E-Temp, MSOP package

MCP1259:

Positive Regulated Charge Pump with

BYPASS Mode and Low-Battery Indication

Positive Regulated Charge Pump with

BYPASS Mode and Low -Battery Indication,

Tape and Reel

MCP1259T:

a)

b)

MCP1259-EMF:

MCP1259T-EMF: Tape and Reel, E-Temp,

DFN package

MCP1259-EUN:

MCP1259T-EUN: Tape and Reel, E-Temp,

MSOP package

E-Temp, DFN package

Temperature Range

Package

E

= -40°C to +125°C

c)

d)

E-Temp, MSOP package

MF

UN

=

Dual Flat, No Lead (3x3 mm body), 10-Lead

Plastic Micro Small Outline (MSOP), 10-Lead

DS21989A-page 21

MCP1256/7/8/9

NOTES:

DS21989A-page 22

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR WAR-

RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,

WRITTEN OR ORAL, STATUTORY OR OTHERWISE,

RELATED TO THE INFORMATION, INCLUDING BUT NOT

LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,

MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and

its use. Use of Microchip devices in life support and/or safety

applications is entirely at the buyer’s risk, and the buyer agrees

to defend, indemnify and hold harmless Microchip from any and

all damages, claims, suits, or expenses resulting from such

use. No licenses are conveyed, implicitly or otherwise, under

any Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,

PICSTART, PRO MATE, PowerSmart, rfPIC, and

SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,

PICMASTER, SEEVAL, SmartSensor and The Embedded

Control Solutions Company are registered trademarks of

Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,

dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,

FanSense, FlexROM, fuzzyLAB, In-Circuit Serial

Programming, ICSP, ICEPIC, Linear Active Thermistor,

MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,

PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,

PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select

Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,

WiperLock and Zena are trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in

October 2003. The Company’s quality system processes and

procedures are for its PICmicro^®8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

DS21989A-page 23

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

Austria - Wels

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-5160-8631

Fax: 91-11-5160-8632

China - Chengdu

Tel: 86-28-8676-6200

Fax: 86-28-8676-6599

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Atlanta

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Alpharetta, GA

Tel: 770-640-0034

Fax: 770-640-0307

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Korea - Gumi

Tel: 82-54-473-4301

Fax: 82-54-473-4302

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Korea - Seoul

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

China - Shenzhen

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Xian

Tel: 86-29-8833-7250

Fax: 86-29-8833-7256

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

San Jose

Mountain View, CA

Tel: 650-215-1444

Fax: 650-961-0286

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

02/16/06

DS21989A-page 24


型号：	MCP1257-EUN
厂家：	MICROCHIP
描述：	Regulated 3.3V, Low-Ripple Charge Pump with Low- Operating Current SLEEP Mode or BYPASS Mode 调节3.3V，低纹波充电泵与低收入工作电流睡眠模式或旁路模式稳压器开关式稳压器或控制器电源电路开关式控制器光电二极管泵
文件：	总24页 (文件大小：1287K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MCP1257-EUN [MICROCHIP]

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