MCP1258T-EUN [MICROCHIP]
Regulated 3.3V, Low-Ripple Charge Pump with Low- Operating Current SLEEP Mode or BYPASS Mode; 调节3.3V,低纹波充电泵与低收入工作电流睡眠模式或旁路模式型号: | MCP1258T-EUN |
厂家: | MICROCHIP |
描述: | Regulated 3.3V, Low-Ripple Charge Pump with Low- Operating Current SLEEP Mode or BYPASS Mode |
文件: | 总24页 (文件大小:1287K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MCP1256/7/8/9
Regulated 3.3V, Low-Ripple Charge Pump with Low-
Operating Current SLEEP Mode or BYPASS Mode
Features
Description
The MCP1256, MCP1257, MCP1258 and MCP1259
are inductorless, positive regulated charge pump
DC/DC converters. The devices generate a regulated
3.3V output voltage from a 1.8V to 3.6V input. The
devices are specifically designed for applications
operating from 2-cell alkaline, Ni-Cd, or Ni-MH
batteries or by one primary lithium MnO2 (or similar)
coin cell battery.
• Inductorless 1.5x, 2x Boost DC/DC Converter
• Output Voltage: 3.3V
• High Output Voltage Accuracy:
- ±3.0% (VOUT Fixed)
• Output Current Up To 100 mA
• 20 mVPP Output Voltage Ripple
• Thermal Shutdown and Short Circuit Protection
• Uses Small Ceramic Capacitors
• Switching Frequency: 650 kHz
• Low-Power SLEEP Mode: MCP1256/7
• BYPASS Mode: MCP1258/9
The MCP1256, MCP1257, MCP1258 and MCP1259
provide high efficiency by automatically switching
between 1.5x and 2x boost operation. In addition, at
light output loads, the MCP1256 and MCP1257 can be
placed in a SLEEP mode, lowering the quiescent
current while maintaining the regulated output voltage.
Alternatively, the MCP1258 and MCP1259 provide a
BYPASS feature connecting the input voltage to the
• Low-Power Shutdown Mode: 0.1 μA (Typical)
• Shutdown Input Compatible with 1.8V Logic
• VIN Range: 1.8V to 3.6V
output.
This
allows
for
real-time
clocks,
• Soft-Start Circuitry to Minimize Inrush Current
• Temperature Range: -40°C to +125°C
• Packaging:
microcontrollers or other system devices to remain
biased with virtually no current being consumed by the
MCP1258 or MPC1259.
- 10-Pin, 3 mm x 3 mm DFN
In normal operation, the output voltage ripple is below
20 mVPP at load currents up to 100 mA. Normal opera-
tion occurs at a fixed switching frequency of 650 kHz,
avoiding interference with sensitive IF bands.
- 10-Pin, MSOP
Applications
The MCP1256 and MCP1258 feature a power-good
output that can be used to detect out-of-regulation
conditions. The MCP1257 and MCP1259 feature a low-
battery indication that issues a warning if the input
voltage drops below a preset voltage threshold.
Extremely low supply current and few external parts (4
capacitors) make these devices ideal for small, battery-
powered applications. A Shutdown mode is also
provided for further power reduction.
• Pagers
• Portable Measurement Instruments
• Home Automation Products
• PICmicro® MCU Bias
Typical Application
MCP1256
OUTPUT
3.3V
INPUT
1.8V to 3.6V
7
5
1
V
V
IN
OUT
C
C
OUT
10 μF
The devices incorporate thermal and short-circuit pro-
tection. Two package offerings are provided: 10-pin
MSOP and 10-lead 3 mm x 3 mm DFN. The devices
are completely characterized over the junction temper-
ature range of -40°C to +125°C.
IN
R
10
1
10 μF
SHDN
PGOOD
Power-Good
Indication
4
8
6
3
C +
1
C +
2
C
1 μF
C
2
1 μF
1
C -
1
C -
2
2
SLEEP
GND
ON / OFF
9
Typical Application with Power-Good Indication
© 2006 Microchip Technology Inc.
DS21989A-page 1
MCP1256/7/8/9
Package Pinouts
MCP1256
MCP1257
PGOOD
SLEEP
10 SHDN
LBO
1
2
3
4
5
10 SHDN
1
2
3
4
5
9
8
7
6
GND
SLEEP
9
8
7
6
GND
C -
C -
C -
C -
2
1
2
1
C +
V
C +
V
1
IN
1
IN
V
C +
V
C +
OUT
2
OUT
2
MCP1258
MCP1259
PGOOD
BYPASS
1
2
3
4
5
10 SHDN
LBO
1
2
3
4
5
10 SHDN
9
8
7
6
GND
BYPASS
9
8
7
6
GND
C -
C -
C -
C -
2
1
2
1
C +
V
C +
V
1
IN
1
IN
V
C +
V
C +
OUT
2
OUT
2
Functional Block Diagram
C2-
C2+
C1-
C1+
VIN
1.5x, 2x Mode
Comparator
840 kΩ
Gate Drives
S1
S5
S6
+
-
S5,S7
S6
D Q
S4
S1,S3,CE
650 kHz
Osc.
S4
VOUT
840 kΩ
CE
S2
S3
S7
Bandgap
Ref.
+
-
Feedback
Amplifier
480 kΩ
720kΩ
GND
VOUT
TABLE 1:
Mode
SWITCH LOGIC
Phase
Oscillator
Q
S1
S2(CE)
S3
S4
S5
S6
S7
1.5x
1.5x
Charging
Transfer
Charging
Transfer
—
H
L
L
L
H
L
H
L
H
L
L
H
L
H
L
L
H
H
H
L
H
L
L
L
L
2x
H
L
H
H
—
H
L
H
L
H
L
L
2x
H
H
L
BYPASS
—
H
L
H
H
Legend: L is Logic Low, H is Logic High
DS21989A-page 2
© 2006 Microchip Technology Inc.
MCP1256/7/8/9
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Power Supply Voltage, V ...............................................3.8V
IN
Voltage on Any Pin w.r.t. GND ................. -0.3V to (V +0.3V)
IN
Output Short Circuit Duration ................................continuous
Storage Temperature Range.........................-65°C to +150°C
Ambient Temperature with Power Applied ....-55°C to +125°C
Maximum Junction Temperature.................................+150°C
ESD protection on all pins
Human Body Model (1.5 kΩ in Series with 100 pF).......≥ 2 kV
Machine Model (200 pF, No Series Resistance).............200V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for V = 1.8V to 3.6V, SHDN = V , C = C
= 10 μF,
IN
IN
IN
OUT
C = C = 1 μF, I
= 10 mA, T = -40°C to +125°C. Typical values are at T = +25°C.
J J
1
2
OUT
Unit
s
Parameters
Sym
Min
Typ
Max
Conditions
ALL DEVICES
Supply Voltage
V
1.8
—
—
3.6
—
+3.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
V
V
IN
Output Voltage
V
V
3.3
OUT
OUT
Output Voltage Accuracy
Output Current
-3.0
30
70
100
—
±0.5
—
%
I
= 10 mA to I
OUT OUT(MAX)
I
mA 1.8V < V < 2.0V
IN
OUT(MAX)
—
mA 2.0V < V < 2.2V
IN
—
mA 2.2V < V < 3.6V
IN
Short Circuit Current
Power Efficiency
I
150
84.5
84.5
76.4
80.1
64.0
67.1
67.5
69.7
76.0
76.7
65.0
71.0
71.6
mA
%
%
%
%
%
%
%
%
%
%
%
%
%
V
V
V
V
V
V
V
V
V
V
V
V
V
V
= 0V, V = 1.8V to 3.6V
OUT IN
SC
η
—
= 1.8V, I
= 10 mA
= 50 mA
= 10 mA
= 50 mA
= 10 mA
= 50 mA
= 100 mA
= 10 mA
= 50 mA
= 100 mA
= 10 mA
= 50 mA
= 100 mA
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
—
= 1.8V, I
= 2.0V, I
= 2.0V, I
= 2.4V, I
= 2.4V, I
= 2.4V, I
= 2.8V, I
= 2.8V, I
= 2.8V, I
= 3.0V, I
= 3.0V, I
= 3.0V, I
—
—
—
—
—
—
—
—
—
—
—
Shutdown Input - SHDN
SHDN Input Voltage Low
SHDN Input Voltage High
V
—
1.4
—
—
—
0.4
—
V
V
IL(SHDN)
IH(SHDN)
LK(SHDN)
V
SHDN Input Leakage
Current
I
0.001
0.1
μA
SHDN Quiescent Current
I
—
0.25
2
μA
V
= 0V, T = +25°C
Q
SHDN J
Thermal Shutdown
Thermal Shutdown
Threshold
T
—
—
160
15
—
—
°C
°C
J
Thermal Shutdown
Hysteresis
T
J(HYS)
© 2006 Microchip Technology Inc.
DS21989A-page 3
MCP1256/7/8/9
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for V = 1.8V to 3.6V, SHDN = V , C = C
= 10 μF,
IN
IN
IN
OUT
C = C = 1 μF, I
= 10 mA, T = -40°C to +125°C. Typical values are at T = +25°C.
1
2
OUT
J
J
Unit
s
Parameters
Sym
Min
Typ
Max
Conditions
MCP1256 and MCP1257 Devices
SLEEP Mode Input - SLEEP
SLEEP Input Voltage Low
SLEEP Input Voltage High
V
—
1.4
—
—
—
0.4
—
V
V
IL(SLEEP)
IH(SLEEP)
LK(SLEEP)
V
SLEEP Input Leakage
Current
I
0.001
0.1
μA
SLEEP Quiescent Current
I
—
10
20
μA
V
= 0V, I
= 0 mA
OUT
Q
SLEEP
MCP1256 and MCP1258 Devices
Power-Good Output - PGOOD
PGOOD Threshold
PGOOD Hysteresis
V
—
—
—
93
110
25
—
—
%
Percent of V
Falling
OUT
TH
V
mV
mV
V
Rising
HYS
OUT
PGOOD Output Low
Voltage
V
100
I
= 0.5 mA, V = 1.8V
OL
SINK IN
PGOOD Input Leakage
Current
I
—
0.02
1
μA
V
= V
LK(PGOOD)
PGOOD IN
MCP1257 and MCP1259
Low-Battery Output - LBO
LBO Threshold
V
—
—
—
—
1.95
240
25
—
—
V
V
V
Falling
TH
IN
LBO Hysteresis
V
mV
mV
μA
Rising
HYS
IN
LBO Output Low Voltage
LBO Input Leakage Current
MCP1258 and MCP1259
V
100
1
I
= 0.5 mA, V = 1.8V
OL
SINK IN
I
0.02
V
= V
LK(LBO)
LBO
IN
BYPASS Mode Input - BYPASS
BYPASS Input Voltage Low
V
—
—
—
0.4
—
V
V
IL(BYPASS)
IH(BYPASS)
BYPASS Input Voltage
High
V
1.4
BYPASS Input Leakage
Current
I
—
—
—
0.001
0.25
1.5
0.1
2
μA
μA
Ω
LK(BYPASS)
BYPASS Quiescent
Current
I
V
= 0V, I
= 0 mA,
OUT
Q
BYPASS
T = +25°C
J
BYPASS Input-to-Output
Impedance
R
—
V
= 2.4V
BYPASS
IN
DS21989A-page 4
© 2006 Microchip Technology Inc.
MCP1256/7/8/9
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for V = 1.8V to 3.6V, SHDN = V , C = C = 10 μF,
IN
IN
IN
OUT
C = C = 1 μF, I
= 10 mA, T = -40°C to +125°C. Typical values are at T = +25°C.
1
2
OUT
J
J
Parameters
Sym
Min
Typ
Max
Units
Conditions
ALL DEVICES
Internal Oscillator Frequency
Output Voltage Ripple,
Normal Operation
F
—
—
—
—
—
—
650
5
—
—
—
—
—
—
kHz
mVp-p
mVp-p
mVp-p
mVp-p
μs
OSC
V
C
C
C
C
= 10 μF, I
= 10 μF, I
= 10 mA
RIP
OUT
OUT
OUT
OUT
OUT
20
12
55
175
= 100 mA
= 10 mA
OUT
= 2.2 μF, I
= 2.2 μF, I
OUT
OUT
= 100 mA
V
Wake-up Time From
T
V
= 3.0V, I
= 10 mA,
,
OUT
WKUP
IN
OUT
Shutdown
SHDN = V
IH(MIN)
V
from 0 to 90% Nominal Regulated
OUT
Output Voltage
MCP1256 and MCP1257
Output Voltage Ripple,
SLEEP Mode
V
—
—
—
—
40
60
40
60
—
—
—
—
mVp-p
mVp-p
mVp-p
mVp-p
C
C
C
C
= 10 μF, I
= 10 μF, I
= 0.1 mA
= 4 mA
RIP
OUT
OUT
OUT
OUT
OUT
OUT
= 2.2 μF, I
= 2.2 μF, I
= 0.1 mA
= 4 mA
OUT
OUT
MCP1258 and MCP1259
V
Wake-up Time From
T
—
150
—
μs
V
= 3.0V, I
= 10 mA,
,
OUT
WKUP
IN
OUT
BYPASS
SHDN = V
IH(MIN)
V
from 0 to 90% Nominal Regulated
OUT
Output Voltage
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for V = 1.8V to 3.6V, SHDN = V , C = C = 10 μF,
OUT
IN
IN
IN
C = C = 1 μF, I
= 10 mA, T = -40°C to +125°C. Typical values are at T = +25°C.
1
2
OUT
J
J
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
T
T
-40
-40
-65
—
—
—
+125
+125
+150
°C
°C
°C
J
J
T
A
Thermal Package Resistances
Thermal Resistance, 10-Lead, MSOP
θ
θ
—
—
200
57
—
—
°C/W
°C/W
4-Layer JC51-7 Standard Board,
Natural Convection
JA
JA
Thermal Resistance, 10-Lead, DFN
3 mm x 3 mm
4-Layer JC51-7 Standard Board,
Natural Convection
© 2006 Microchip Technology Inc.
DS21989A-page 5
MCP1256/7/8/9
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
NOTE: Unless otherwise indicated, CIN = COUT = 10 μF, C1 = C2 = 1 μF, IOUT = 10 mA, and TA= +25°C.
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 1.8V
VIN = 2.1V
VIN = 2.4V
VIN = 2.7V
IOUT = 25 mA
Mode Transition
10
30
50
70
90
110
130
1.8
2.1
2.1
2.1
2.4
2.7
3.0
3.3
Output Current (mA)
Input Voltage (V)
FIGURE 2-1:
Current (IOUT).
Efficiency (η) vs. Output
FIGURE 2-4:
Voltage (VIN).
Efficiency (η) vs. Supply
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 2.7V
VIN = 3.0V
VIN = 3.3V
IOUT = 50 mA
Mode Transition
10
30
50
70
90
110
130
1.8
2.4
2.7
3.0
3.3
Output Current (mA)
Input Voltage (V)
FIGURE 2-2:
Current (IOUT).
Efficiency (η) vs. Output
FIGURE 2-5:
Voltage (VIN).
Efficiency (η) vs. Supply
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
IOUT = 100 mA
IOUT = 10 mA
Mode Transition
Mode Transition
1.8
2.1
2.4
2.7
3.0
3.3
1.8
2.4
2.7
3.0
3.3
Input Voltage (V)
Input Voltage (V)
FIGURE 2-3:
Efficiency (η) vs. Supply
FIGURE 2-6:
Efficiency (η) vs. Supply
Voltage (VIN).
Voltage (VIN).
DS21989A-page 6
© 2006 Microchip Technology Inc.
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, CIN = COUT = 10 μF, C1 = C2 = 1 μF, IOUT = 10 mA, and TA= +25°C.
3.5
3.4
3.3
3.2
3.1
3.0
2.9
2.4
2.2
2.0
1.8
1.6
1.4
1.2
VIN = 3.6V
VIN = 2.1V
VIN = 2.4V
VIN = 1.8V
0
10 20 30 40 50 60 70 80 90 100
Output Current (mA)
10
30
50
70
90
110
130
Output Current (mA)
FIGURE 2-7:
Output Voltage (VOUT) vs.
FIGURE 2-10:
Quiescent Supply Current
Output Current (IOUT).
(IQ) vs. Output Current (IOUT) - Normal Mode.
3.5
140
VIN = 2.4V
120
100
80
3.4
IOUT = 10 mA
3.3
3.2
VIN = 3.0V
IOUT = 50 mA
60
3.1
40
20
0
IOUT = 100 mA
3.0
2.9
1.8
2.1
2.4
2.7
3.0
3.3
3.6
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
Input Voltage (V)
Output Current (mA)
FIGURE 2-8:
Output Voltage (VOUT) vs.
FIGURE 2-11:
Quiescent Supply Current
Input Voltage (VIN).
(IQ) vs. Output Current (IOUT) - SLEEP Mode.
1.8
1.7
1.6
1.5
1.4
1.3
1.2
0.8
VIN = 2.4V
0.7
0.6
0.5
VIN = 2.4V
VIN = 3.0V
0.4
0.3
0.2
0.1
0
0
1
2
3
4
5
6
7
8
9
10
0
2
4
6
8
10 12 14 16 18 20
Output Current (mA)
Output Current (mA)
FIGURE 2-9:
Quiescent Supply Current
FIGURE 2-12:
Quiescent Supply Current
(IQ) vs. Output Current (IOUT) - Normal Mode.
(IQ) vs. Output Current (IOUT) - SLEEP Mode.
© 2006 Microchip Technology Inc.
DS21989A-page 7
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, CIN = COUT = 10 μF, C1 = C2 = 1 μF, IOUT = 10 mA, and TA= +25°C.
2.0
1.8
1.6
1.4
1.2
1.0
0.04
0.03
0.02
0.01
0.00
-0.01
-0.02
-0.03
-0.04
VIN = 2.4V
IOUT = 100 mA
1.8
2.1
2.4
2.7
3.0
3.3
3.6
0
1
2
3
4
5
6
7
8
9
10
Input Voltage (V)
Time (μs)
FIGURE 2-13:
BYPASS Impedance
FIGURE 2-16:
Output Voltage Ripple vs.
(RBYPASS) vs. Supply Voltage (VIN).
Time - Normal 2x Mode.
0.04
0.03
0.02
0.01
0.00
-0.01
-0.02
-0.03
-0.04
0.04
0.03
0.02
0.01
0.00
-0.01
-0.02
-0.03
-0.04
VIN = 2.4V
OUT = 10 mA
VIN = 3.0V
IOUT = 10 mA
I
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
Time (μs)
Time (μs)
FIGURE 2-14:
Output Voltage Ripple vs.
FIGURE 2-17:
Output Voltage Ripple vs.
Time - Normal 2x Mode.
Time - Normal 1.5x Mode.
0.04
0.03
0.02
0.01
0.00
-0.01
-0.02
-0.03
-0.04
0.04
0.03
0.02
0.01
0.00
-0.01
-0.02
-0.03
-0.04
VIN = 2.4V
OUT = 50 mA
VIN = 3.0V
IOUT = 50 mA
I
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
Time (μs)
Time (μs)
FIGURE 2-15:
Output Voltage Ripple vs.
FIGURE 2-18:
Output Voltage Ripple vs.
Time - Normal 2x Mode.
Time - Normal 1.5x Mode.
DS21989A-page 8
© 2006 Microchip Technology Inc.
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, CIN = COUT = 10 μF, C1 = C2 = 1 μF, IOUT = 10 mA, and TA= +25°C.
0.04
0.03
0.02
0.01
0.00
-0.01
-0.02
-0.03
-0.04
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
VIN = 3.0V
IOUT = 1 mA
VIN = 3.0V
IOUT = 100 mA
0
1
2
3
4
5
6
7
8
9
10
Time (μs)
Time (μs)
FIGURE 2-19:
Output Voltage Ripple vs.
FIGURE 2-22:
Output Voltage Ripple vs.
Time - Normal 1.5x Mode.
Time - SLEEP Mode.
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
VIN = 3.0V
OUT = 10 mA
VIN = 2.4V
OUT = 1 mA
I
I
Time (μs)
Time (μs)
FIGURE 2-20:
Output Voltage Ripple vs.
FIGURE 2-23:
Output Voltage Ripple vs.
Time - SLEEP Mode.
Time - SLEEP Mode.
0.20
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
8
7
6
5
4
3
2
1
0
0.20
0.10
0.00
VIN = 2.4V
OUT = 10 mA
I
-0.10
VIN = 2.4V
IOUT = 10 mA -0.20
-0.30
-0.40
-0.50
-0.60
Time (μs)
Time (μs)
FIGURE 2-21:
Output Voltage Ripple vs.
FIGURE 2-24:
Output Voltage Ripple vs.
Time - SLEEP Mode.
Time - Mode Transition: SLEEP Mode-to-Normal
2x Mode-to-SLEEP Mode.
© 2006 Microchip Technology Inc.
DS21989A-page 9
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, CIN = COUT = 10 μF, C1 = C2 = 1 μF, IOUT = 10 mA, and TA= +25°C.
8
7
6
5
4
3
2
1
0
0.20
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0.20
0.10
VOUT
0.10
VOUT
0.00
0.00
-0.10
-0.20
-0.30
-0.40
-0.50
-0.60
-0.10
-0.20
-0.30
-0.40
-0.50
-0.60
VIN = 2.4V
IOUT = 10 mA
VIN
IOUT
Time (μs)
Time (μs)
FIGURE 2-25:
Load Transient Response -
FIGURE 2-27:
Line Transient Response.
Normal 2x Mode.
8
0.20
0.10
0.00
0.40
0.20
0.10
0.00
7
0.35
VOUT
VOUT
6
5
4
0.30
0.25
0.20
0.15
0.10
-0.10
-0.10
IOUT = 100 mA
VIN = 3.0V
-0.20
-0.30
-0.40
-0.50
-0.60
-0.20
-0.30
-0.40
-0.50
-0.60
VIN
3
2
1
0
0.05
0.00
IOUT
Time (μs)
Time (μs)
FIGURE 2-28:
Line Transient Response.
FIGURE 2-26:
Load Transient Response -
Normal 1.5x Mode.
DS21989A-page 10
© 2006 Microchip Technology Inc.
MCP1256/7/8/9
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No.
PIN FUNCTION TABLE
Symbol
Function
DFN
MSOP
1
1
PGOOD
LBO
Power-Good Indication Open-Drain Output Pin: MCP1256 and MCP1258
Low-Battery Indication Open-Drain Output Pin: MCP1257 and MCP1259
Active Low SLEEP Mode Input Pin: MCP1256 and MCP1257
Active Low BYPASS Mode Input Pin: MCP1258 and MCP1259
Flying Capacitor Negative Pin
2
2
SLEEP
BYPASS
C2-
3
4
3
4
C1+
Flying Capacitor Positive Pin
5
5
V
Regulated 3.3V Output Voltage
OUT
6
6
C2+
Flying Capacitor Positive Pin
7
7
V
Power Supply Input Voltage
IN
8
8
C1-
GND
SHDN
Flying Capacitor Negative Pin
9
9
0V Reference
10
10
Active Low SHUTDOWN Mode Input Pin
3.2.2
ACTIVE LOW BYPASS MODE
(BYPASS)
3.1
3.1.1
Status Indication (PGOOD, LBO)
POWER-GOOD OUTPUT PIN
(PGOOD)
MCP1258/9: A logic low signal applied to this pin
places the device into a BYPASS mode of operation. In
this mode, the input supply voltage is connected
directly to the output.
MCP1256/8: PGOOD is high impedance when the out-
put voltage is in regulation. A logic low is asserted
when the output falls 7% (typical) below the nominal
value. The PGOOD output remains low until VOUT is
within 3% (typical) of its nominal value. On start-up, this
pin indicates when the output voltage reaches its final
value. PGOOD is high impedance when SHDN is low
or when BYPASS is low (MCP1258).
3.3
Flying Capacitor Negative (C2-)
A 1 μF ceramic flying capacitor is recommended.
3.4
Flying Capacitor Positive (C1+)
A 1 μF ceramic flying capacitor is recommended.
3.1.2
LOW-BATTERY OUTPUT PIN (LBO)
3.5
Regulated Output Voltage (V
)
OUT
MCP1257/9: LBO is high impedance when the input
voltage is above the low-battery threshold voltage. A
logic low is asserted when the input falls below the low-
battery threshold voltage. The LBO output remains low
until VIN is above the low-battery threshold voltage plus
the low-battery hysteresis voltage. LBO is high
impedance when SHDN is low or when BYPASS is low
(MCP1259).
Regulated 3.3V output. Bypass to GND with a
minimum of 2.2 μF.
3.6
Flying Capacitor Positive (C2+)
A 1 μF ceramic flying capacitor is recommended.
3.7
Power Supply Input Voltage (V )
IN
A supply voltage of 1.8V to 3.6V is recommended.
Bypass to GND with a minimum of 1 μF.
3.2
Mode Selection (SLEEP, BYPASS)
3.2.1
ACTIVE LOW SLEEP MODE
(SLEEP)
3.8
Flying Capacitor Negative (C1-)
A 1 μF ceramic flying capacitor is recommended.
MCP1256/7: A logic low signal applied to this pin
places the device into a SLEEP mode of operation. In
this mode, the device maintains regulation. SLEEP
mode performs pulse skip operation reducing the
current draw of the device at the expense of increased
output voltage ripple.
3.9
0V Reference (GND)
Connect to negative terminal of and input supply.
3.10 Device Shut Down (SHDN)
A logic low signal applied to this pin disables the
device. A logic high signal applied to this pin allows
normal operation.
© 2006 Microchip Technology Inc.
DS21989A-page 11
MCP1256/7/8/9
(2x mode), when the energy is transferred to the out-
put. The transfer mode determines which switches are
closed for the transfer.
4.0
DEVICE OVERVIEW
The MCP1256/7/8/9 devices are positive regulated
charge pumps that accept an input voltage from +1.8V
to +3.6V and convert it to a regulated 3.3V output volt-
age. The MCP1256/7/8/9 provide a low-cost, compact
and simple solution for step-up DC/DC conversions,
primarily in battery applications, that do not want to use
switching regulator solutions because of EMI noise and
inductor size.
Both phases occur in one clock period of the internal
oscillator. When the second phase (transfer) has been
completed, the cycle repeats.
4.2
Power Efficiency
The power efficiency, η, is determined by the mode of
operation, 1.5x mode or 2x mode. Equation 4-1 and
Equation 4-2 are used to approximate the power effi-
ciency with any significant amount of output current. At
light loads, the device quiescent current must be taken
into consideration.
The MCP1256/7/8/9 are designed to offer the highest
possible efficiency under common operating condi-
tions, i.e. VIN = 2.4V or 2.8V, VOUT = 3.3V,
I
OUT = 100 mA. A fixed switching frequency, 650 kHz
typically, allows for easy external filtering.
The MCP1256/7 provide a unique SLEEP mode
feature which reduces the current drawn from the input
supply while maintaining a regulated bias on external
peripherals. SLEEP mode can substantially increase
battery run-time in portable applications.
EQUATION 4-1:
POUT
V
OUT × IOUT
VOUT
η1.5x = ------------- = ---------------------------------------- = ----------------------
PIN
VIN × 1.5 × IOUT
VIN × 1.5
The MCP1258/9 provide a unique BYPASS mode
feature which virtually eliminates the current drawn
from the input supply by the device while maintaining
an unregulated bias on external peripherals. BYPASS
connects the input supply voltage to the output. All
remaining functions of the device are shutdown.
BYPASS mode can substantially increase battery run-
time in portable applications.
EQUATION 4-2:
POUT
VOUT × IOUT
VOUT
η2x = ------------- = ------------------------------------ = -----------------
PIN
VIN × 2 × IOUT
VIN × 2
4.3
Shutdown Mode (SHDN)
Driving SHDN low places the MCP1256/7/8/9 in a low-
power Shutdown mode. This disables the charge-pump
switches, oscillator and control logic, reducing the
quiescent current to 0.25 μA (typical). The PGOOD
output and LBO are in a high impedance state during
shutdown.
The devices supply up to 100 mA of output current for
input voltages, VIN, greater than or equal to 2.2V. The
devices are available in small 10-Pin MSOP or DFN
packages with an operating junction temperature range
of -40°C to +125°C.
4.4
SLEEP Mode (SLEEP)
4.1
Theory of Operation
The MCP1256/7 provide a unique SLEEP mode fea-
ture. SLEEP mode reduces the current drawn from the
input supply while maintaining a regulated bias on
external peripherals. SLEEP mode can substantially
increase battery run-time in portable applications.
The MCP1256/7/8/9 devices employ a switched capac-
itor charge pump to boost an input supply, VIN, to a reg-
ulated 3.3V output voltage. Refering to the Functional
Block Diagram, the devices perform conversion and
regulation in two phases: charge and transfer. When
the devices are not in shutdown, SLEEP or BYPASS,
the two phases are continuously cycled through.
The regulation control is referred to as a bang-bang
control due to the output being regulated around a fixed
reference with some hysteresis. As a result, some
amount of peak-to-peak ripple will be observed at the
output independent of load current. The frequency of
the output ripple, however, will be influenced heavily by
the load current and output capacitance.
Charge transfers charge from the input supply to the
flying capacitors, C1 and C2, connected to pins C1+,
C1-, C2+ and C2-, respectively. During this phase,
switches S4 and S6 are closed. Switch S2 controls the
amount of charge transferred to the flying capacitors.
The amount of charge is determined by a sample and
hold error amplifier with feedback from the output
voltage at the beginning of the phase.
4.5
BYPASS Mode (BYPASS)
The MCP1258/9 provide a unique BYPASS mode fea-
ture which virtually eliminates the current drawn from
the input supply by the device, while maintaining an
unregulated bias on external peripherals. BYPASS
connects the input supply voltage to the output. All
remaining functions of the device are shutdown.
BYPASS mode can substantially increase battery run-
time in portable applications.
Once the first phase (charge) is complete, transfer is
initiated. The second phase transfers the energy from
the flying capacitors to the output. The MCP1256/7/8/9
devices autonomously switch between 1.5x mode and
2x mode. This determines whether the flying capacitors
are placed in parallel (1.5x mode), or remain in series
DS21989A-page 12
© 2006 Microchip Technology Inc.
MCP1256/7/8/9
4.6
Power-Good Output (PGOOD)
4.9
Thermal Shutdown
For the MCP1256/8 devices, the PGOOD output is an
open-drain output that sinks current when the regulator
output voltage falls below 0.93VOUT (typical). If the reg-
ulator output voltage falls below 0.93VOUT (typical) for
less than 200 μs and then recovers, glitch immunity cir-
cuits prevent the PGOOD signal from transitioning low.
A 10 kΩ to 1 MΩ pull-up resistor from PGOOD to VOUT
may be used to provide a logic output. If not used,
connect PGOOD to GND or leave unconnected.
The MCP1256/7/8/9 devices feature thermal shutdown
with temperature hysteresis. When the die temperature
exceeds 160°C, the device shuts down. When the die
cools by 15°C, the MCP1256/7/8/9 automatically turns
back on again. If high die temperature is caused by out-
put overload and the load is not removed, the device
will turn on and off resulting in a pulsed output.
5.0
5.1
APPLICATIONS
PGOOD is high impedance when the output voltage is
in regulation. A logic low is asserted when the output
falls 7% (typical) below the nominal value. The PGOOD
output remains low until VOUT is within 3% (typical) of
its nominal value. On start-up, this pin indicates when
the output voltage reaches its final value. PGOOD is
high impedance when SHDN is low or when BYPASS
is low (MCP1258).
Capacitor Selection
The style and value of capacitors used with the
MCP1256/7/8/9 family determine several important
parameters, such as output voltage ripple and charge
pump strength. To minimize noise and ripple, it is rec-
ommended that low ESR (0.1Ω) capacitors be used for
both CIN and COUT. These capacitors should be
ceramic and should be 10 μF or higher for optimum
performance.
4.7
Low-Battery Output (LBO)
For the MCP1257/9 devices, the LBO output is an
open-drain output that sinks current when the input
voltage falls below a preset threshold. If the input volt-
age falls below the preset threshold for less than
200 μs and then recovers, glitch immunity circuits pre-
vent the LBO signal from transitioning low. A 10 kΩ to
1 MΩ pull-up resistor from LBO to VOUT may be used
to provide a logic output. If not used, connect LBO to
GND or leave unconnected.
If the source impedance to VIN is very low, up to several
megahertz, CIN may not be required. Alternatively, a
somewhat smaller value of CIN may be substituted for
the recommended 10 μF, but will not be as effective in
preventing ripple on the VIN pin.
The value of COUT controls the amount of output volt-
age ripple present on VOUT. Increasing the size of
COUT will reduce output ripple at the expense of a
slower turn-on time from shutdown and a higher inrush
current.
LBO is high impedance when the input voltage is above
the low-battery threshold voltage. A logic low is
asserted when the input falls below the low-battery
threshold voltage. The LBO output remains low until
The flying capacitors (C1 and C2) control the strength
of the charge pump and in order to achieve the maxi-
mum rated output current (100 mA), it is necessary to
have at least 1 μF of capacitance for the flying capaci-
tor. A smaller flying capacitor delivers less charge per
clock cycle to the output capacitor resulting in lower
available output current.
VIN is above the low-battery threshold voltage plus the
low-battery hysteresis voltage. LBO is high impedance
when SHDN is low or when BYPASS is low
(MCP1259).
4.8
Soft-Start and Short-Circuit
Protection
5.2
PCB Layout Issues
The MCP1256/7/8/9 devices transfer charge at high
switching frequencies producing fast, high peak, tran-
sient currents. As a result, any stray inductance in the
component layout will produce unwanted noise in the
system. Proper board layout techniques are required to
ensure optimum performance.
The MCP1256/7/8/9 devices feature fold back short-
circuit protection. This circuitry provides an internal
soft-start function by limiting inrush current during
startup and also limits the output current to 150 mA
(typical), if the output is short-circuited to GND. The
internal soft-start circuitry requires approximately
175 μs, typical, from either initial power-up, release
from Shutdown, or release from BYPASS (MCP1258/9)
for the output voltage to be in regulation.
© 2006 Microchip Technology Inc.
DS21989A-page 13
MCP1256/7/8/9
6.0
TYPICAL APPLICATION
CIRCUITS
The MCP1256/7/8/9 devices are inductorless, positive
regulated, switched capacitor DC/DC converters.
Typical application circuits are depicted in Figure 6-1.
MCP1256
INPUT
1.8V to 3.6V
OUTPUT
3.3V
7
5
1
V
V
IN
OUT
C
C
OUT
IN
R
C
1
2
10 μF
10 μF
10
SHDN
PGOOD
Power-Good
Indication
4
8
6
3
C +
C +
1
2
C
1 μF
1
1 μF
C -
C -
1
2
2
SLEEP
GND
ON / OFF
9
Typical Application with Power-Good Indication
MCP1259
INPUT
1.8V to 3.6V
OUTPUT
3.3V
7
5
1
V
V
OUT
IN
C
C
OUT
IN
10 μF
R
10 μF
1
10
SHDN
LBO
Low-Battery
Indication
4
8
6
3
C +
C +
2
1
C
1 μF
C
2
1
1 μF
C -
C -
2
1
2
BYPASS
GND
ON / OFF
9
Typical Application with Low-Battery Indication
FIGURE 6-1:
Typical Application Circuits.
DS21989A-page 14
© 2006 Microchip Technology Inc.
MCP1256/7/8/9
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
10-Lead DFN
Example:
1
2
3
4
5
10
9
1
2
3
4
5
10
9
XXXX
XYWW
NNN
1256
E607
256
8
8
7
7
6
6
Example:
10-Lead MSOP
1259E
607256
XXXXX
YWWNNN
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2006 Microchip Technology Inc.
DS21989A-page 15
MCP1256/7/8/9
10-Lead Plastic Dual-Flat No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated
b
p
E
n
L
K
D
D2
EXPOSED
METAL
PAD
2
1
PIN 1
ID INDEX
AREA
E2
(NOTE 2)
TOP VIEW
BOTTOM VIEW
(NOTE 1)
A
EXPOSED
TIE BAR
(NOTE 3)
A3
A1
Units
INCHES
NOM
MILLIMETERS
NOM
10
*
Dimension Limits
MIN
MAX
MIN
MAX
n
e
Number of Pins
Pitch
10
.020 BSC
0.50 BSC
0.90
Overall Height
Standoff
A
.031
.035
.001
.008 REF.
.039
0.80
1.00
0.05
A1
A3
E
.000
.002
0.00
0.02
Lead Thickness
Overall Length
0.20 REF.
3.00
.112
.082
.112
.051
.008
.012
.008
.118
.094
.118
.065
.010
.016
—
.124
.096
.124
.067
.015
.020
—
2.85
2.08
2.85
1.30
0.18
0.30
0.20
3.15
2.45
3.15
1.70
0.30
0.50
—
(
Note 3
)
Exposed Pad Length
Overall Width
E2
D
2.39
3.00
(
Note 3
)
Exposed Pad Width
Lead Width
D2
b
1.65
0.25
Contact Length §
Contact-to-Exposed Pad §
L
0.40
K
—
*
§
Controlling Parameter
Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad varies according to die attach paddle size.
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: Not Registered
Drawing No. C04-063
Revised 09-12-05
DS21989A-page 16
© 2006 Microchip Technology Inc.
MCP1256/7/8/9
10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
E
E1
p
D
2
n
1
B
c
α
φ
A2
A
L
A1
β
(F)
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
10
10
–
.020 BSC
.033
.193 BSC
0.50 BSC
Overall Height
Molded Package Thickness
Standoff
A
A2
A1
E
.043
–
0.75
0.00
1.10
.030
.000
.037
.006
0.85
0.95
0.15
Overall Width
4.90 BSC
Molded Package Width
Overall Length
Foot Length
E1
D
.118 BSC
.118 BSC
3.00 BSC
3.00 BSC
L
.016
.024
.037 REF
.031
0.40
0.60
0.95 REF
0.80
Footprint
F
φ
Foot Angle
0°
.003
.006
5°
–
–
8°
.009
.012
15°
0°
0.08
0.15
5°
–
–
8°
0.23
0.30
15°
c
Lead Thickness
Lead Width
B
α
.009
–
0.23
–
Mold Draft Angle Top
Mold Draft Angle Bott om
β
5°
–
15°
5°
–
15°
*
Controlling Parameter
Notes:
Dimensions D and E1 donot include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimnesion, usually witho ut tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MO-187 BA
Drawing No. C04-021
Revised 09-16-05
© 2006 Microchip Technology Inc.
DS21989A-page 17
MCP1256/7/8/9
NOTES:
DS21989A-page 18
© 2006 Microchip Technology Inc.
MCP1256/7/8/9
APPENDIX A: REVISION HISTORY
Revision A (March 2006)
• Original Release of this Document.
© 2006 Microchip Technology Inc.
DS21989A-page 19
MCP1256/7/8/9
NOTES:
DS21989A-page 20
© 2006 Microchip Technology Inc.
MCP1256/7/8/9
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a)
b)
MCP1256-EMF:
E-Temp, DFN package
MCP1256T-EMF: Tape and Reel, E-Temp,
DFN package
Temperature
Range
Package
c)
d)
MCP1256-EUN:
MCP1256T-EUN: Tape and Reel, E-Temp,
MSOP package
E-Temp, MSOP package
Device
MCP1256:
Positive Regulated Charge Pump with SLEEP
Mode and Power-Good Indication
Positive Regulated Charge Pump with SLEEP
Mode and Power-Good Indication,
Tape and Reel
Positive Regulated Charge Pump with SLEEP
Mode and Low-Battery Indication
Positive Regulated Charge Pump with SLEEP
Mode and Low-Battery Indication,
Tape and Reel
MCP1256T:
a)
b)
MCP1257-EMF:
MCP1257T-EMF: Tape and Reel, E-Temp,
DFN package
MCP1257-EUN:
MCP1257T-EUN: Tape and Reel, E-Temp,
MSOP package
E-Temp, DFN package
MCP1257:
c)
d)
E-Temp, MSOP package
MCP1257T:
MCP1258:
Positive Regulated Charge Pump with
BYPASS Mode and Power-Good Indication
Positive Regulated Charge Pump with
BYPASS Mode and Power-Good Indication,
Tape and Reel
a)
b)
MCP1258-EMF:
MCP1258T-EMF: Tape and Reel, E-Temp,
DFN package
E-Temp, DFN package
MCP1258T:
c)
d)
MCP1258-EUN:
MCP1258T-EUN: Tape and Reel, E-Temp,
MSOP package
E-Temp, MSOP package
MCP1259:
Positive Regulated Charge Pump with
BYPASS Mode and Low-Battery Indication
Positive Regulated Charge Pump with
BYPASS Mode and Low -Battery Indication,
Tape and Reel
MCP1259T:
a)
b)
MCP1259-EMF:
MCP1259T-EMF: Tape and Reel, E-Temp,
DFN package
MCP1259-EUN:
MCP1259T-EUN: Tape and Reel, E-Temp,
MSOP package
E-Temp, DFN package
Temperature Range
Package
E
= -40°C to +125°C
c)
d)
E-Temp, MSOP package
MF
UN
=
=
Dual Flat, No Lead (3x3 mm body), 10-Lead
Plastic Micro Small Outline (MSOP), 10-Lead
© 2006 Microchip Technology Inc.
DS21989A-page 21
MCP1256/7/8/9
NOTES:
DS21989A-page 22
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip devices in life support and/or safety
applications is entirely at the buyer’s risk, and the buyer agrees
to defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and Zena are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS21989A-page 23
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
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Tel: 91-80-4182-8400
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Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
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Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
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Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
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Tel: 45-4450-2828
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Tel: 91-11-5160-8631
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Thailand - Bangkok
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Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
02/16/06
DS21989A-page 24
© 2006 Microchip Technology Inc.
相关型号:
MCP1259
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