LE87402MQC [MICROCHIP]
Line Driver, 4 Func, 4 Driver;
| 型号： | LE87402MQC |
| 厂家： | 
MICROCHIP |
| 描述： | Line Driver, 4 Func, 4 Driver 驱动 接口集成电路 驱动器 |
| 文件： | 总22页 (文件大小：1014K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Le87402
Datasheet
PLC Dual Channel Line Driver BD870 Series
May 2018
PLC Dual Channel Line Driver BD870 Series
Contents
1 Revision History ............................................................................................................................. 1
1.1 Revision 8.0 ........................................................................................................................................ 1
1.2 Revision 7.0 ........................................................................................................................................ 1
1.3 Revision 6.0 ........................................................................................................................................ 1
1.4 Revision 5.0 ........................................................................................................................................ 1
1.5 Revision 4.0 ........................................................................................................................................ 1
1.6 Revision 3.0 ........................................................................................................................................ 1
1.7 Revision 2.0 ........................................................................................................................................ 1
1.8 Revision 1.0 ........................................................................................................................................ 2
2 Product Overview .......................................................................................................................... 3
2.1 Features .............................................................................................................................................. 4
2.2 Applications ........................................................................................................................................ 4
3 Functional Descriptions ................................................................................................................. 5
3.1 Operation States ................................................................................................................................. 5
3.2 Class GH Operation ............................................................................................................................. 5
3.3 Boost Capacitor .................................................................................................................................. 6
3.4 Operation Without Boosting .............................................................................................................. 6
4 Electrical Specifications .................................................................................................................. 8
4.1 Thermal Resistance ............................................................................................................................ 9
4.2 Operating Ranges ............................................................................................................................... 9
4.3 Test Circuit ........................................................................................................................................ 10
4.4 Performance Characteristics ............................................................................................................ 10
5 Pin Descriptions ........................................................................................................................... 13
6 Package Information .................................................................................................................... 15
6.1 Package Assembly ............................................................................................................................ 15
7 Design Considerations ................................................................................................................. 17
7.1 Internal Reference Current ............................................................................................................... 17
7.2 Input Considerations ........................................................................................................................ 17
7.3 Output Driving Considerations ......................................................................................................... 17
7.4 Power Supplies and Component Placement .................................................................................... 18
8 Ordering Information ................................................................................................................... 19
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
PLC Dual Channel Line Driver BD870 Series
1
Revision History
The revision history describes the changes that were implemented in the document. The changes are
listed by revision, starting with the most current publication.
1.1
1.2
Revision 8.0
Revision 8.0 was published in May 2018. The format of this document was updated to the latest
template.
Revision 7.0
Revision 7.0 was published in November 2015. The following is a summary of changes done in revision
7.0 of this document.
Added package thermal information in Electrical Specifications (see page 8).
Content in Class GH Operation (see page 5) is re-written for clarity.
1.3
1.4
Revision 6.0
Revision 6.0 was published in February 2014. The following is a summary of changes done in revision 6.0
of this document.
Edited the figure, 28-pin QFN Physical Dimensions (see page 15) to show all information.
Title of Figure 2 (see page 6) is corrected to read GH operation.
Revision 5.0
Revision 5.0 was published in November 2013. The following is a summary of changes done in revision
5.0 of this document.
Updated RoHS statement in the section, Ordering Information (see page 19).
Usable VS supply voltage range is increased in Operating Ranges (see page 9).
Defined RREF in the section, ELectrical Specifications (see page 8).
Added a new section, Internal Reference Current (see page 17).
1.5
Revision 4.0
Revision 4.0 was published in June 2013. The following is a summary of changes done in revision 4.0 of
this document.
Updated the section, Class GH Operation (see page 5).
Updated the table, Pin Descriptions (see page 14).
Added the section, Performance Characteristics (see page 10).
1.6
1.7
Revision 3.0
Revision 3.0 was published in April 2013. Tape and Reel diagram is added in, 28-pin QFN Physical
Dimensions (see page 15).
Revision 2.0
Revision 2.0 was published in January 2013. The following is a summary of changes done in revision 2.0
of this document.
Changed descriptions of Class H to Class GH operations in Product Overview (see page 3).
Updated the Le87402 Block Diagram (see page 3).
Edited the table, Operating Ranges (see page 9).
Updated the figure, Basic Test Circuit (see page 10).
Updated figure, Typical Application Circuit - Channel A/B (see page 18).
Added descriptions of GH Operations (see page 5).
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
1
PLC Dual Channel Line Driver BD870 Series
1.8
Revision 1.0
Revision 1.0 was published in November 2013. It was the first publication of this document.
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
2
PLC Dual Channel Line Driver BD870 Series
2
Product Overview
Le87402 is a dual-channel line driver designed to work in home plug alliance HPAV2 systems, G.HN and
MOCA. Each channel can be enabled independently; allowing multiple-in, multiple-out (MIMO) or single-
in, single-out (SISO) operations. The Le87402 can drive a line impedance of 100 Ω down to 12 Ω through
a proper transformer and delivers superior performance with power efficiency using Class GH operation.
The following figure shows the block diagram of Le87402
Figure 1 • Le87402 Block Diagram
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
3
PLC Dual Channel Line Driver BD870 Series
2.1
Features
Le87402 has the following important features.
Designed for HPAV2 standard
MIMO or SISO operation
Dual channel architecture
28-pin, 4 × 5 mm QFN package
Low power operation
Class GH operation
Supports HPAV2 power save mode
Independent channel enable/disable control
Capable of driving line impedance between 12 Ω to 100 Ω
Operations to 86 MHz
10 V to 12 V operation
2.2
Applications
The following applications use Le87402.
Power line communications
Home networking
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
4
PLC Dual Channel Line Driver BD870 Series
3
Functional Descriptions
The following sections describe functionalities of Le87402.
3.1
Operation States
Operation state control is depicted in the following table. For active operation, each channel will either
be in enable state (power-up mode) or disable state (power-down mode). A standby state (long-term
sleep mode) is also provided. EN1 and EN2 independently control each channel’s power mode as
follows:
EN1 = 0, channel A/B in power-down mode; EN1 = 1, channel A/B in power-up mode
EN2 = 0, channel C/D in power-down mode; EN2 = 1, channel C/D in power-up mode
C0 and C1 control state selection and their setting applies to both channels. A setting of C0 = C1 = 0
overrides EN1/2 and places both channels in standby state. Standby is the default state when power is
initially supplied.
Table 1 • Operation State Control
EN1 or EN2
C1
1
C0
1
Device State
Mode
1
1
1
X
0
0
0
Enable Full Power
Enable 90% Power
Enable 80% Power
Standby
Power-up
0
1
1
0
0
0
Sleep
1
1
Disable
Power-down
1
0
0
1
Note: X = Do not care.
3.2
Class GH Operation
The device operates and drives signals using a low-voltage supply. The device includes circuitry that
stores voltage on external boost capacitors. When the capacitors are switched on, the supply to the
output of the drive amplifiers is increased; as if a high supply in Class G operation is switched on , similar
to a Class H operation, thereby avoiding saturation and any associated distortion. The GH operation is
shown in the following figure. VS is the external low-voltage supply. When BSTEN is low, external boost
capacitors CBSD and CBSS are charged up, each to about half of the VS potential. When BSTEN is high,
the supplies to the drive amplifiers of the output stage are boosted to the charged value. The timing
diagram is shown in Timing Diagram for Class-H Operation (see page 7).
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
5
PLC Dual Channel Line Driver BD870 Series
Figure 2 • Class GH Operation
3.3
3.4
Boost Capacitor
The minimum value for the boost capacitors (CBSD and CBSS) is dependent on the amplitude statistics
of the transmitted waveform. There is no maximum value for the boost capacitor.
Operation Without Boosting
The device may be used in an application that does not require the boosting supply function. When
operating the device without boosting, the following actions are allowed.
Externally, tie VBPI pin to VS and VBNI pin to GND. This enables a wider VOUT range at the same VS
voltage.
External boosting capacitors, CBSD and CBSS, can be removed.
VS can be increased beyond the operating ranges shown in Operating Ranges (see page 9), but
must remain within the absolute maximum ratings shown in Absolute Maximum Ratings (see page
9).
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
6
PLC Dual Channel Line Driver BD870 Series
Figure 3 • Timing Diagram for Class GH Operation
Notes on Class GH Operation:
VS is the voltage supply to the chip and must meet operating range restrictions listed in Operating
Ranges (see page 9).
VBPI and VBNI function as supply rails to the line driver amplifiers. When BSTEN is low, VBPI = VS -
Vdiode and VBNI = GND + Vdiode where Vdiode is about 1 V. When BSTEN is high, VBPI and VBNI are
boosted beyond the chip supply rails through external boosting capacitors.
VPth and VNth mark the VOUT range limit while BSTEN is low, as shown in preceding figure. VOUT
exceeds the thresholds if BSTEN is set high with an adequate warning time before the event. A 100
ns warning time is shown in preceding figure.
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
7
PLC Dual Channel Line Driver BD870 Series
4
Electrical Specifications
The following sections provide the available electrical specifications for Le87402. The following table
gives the device parameters, conditions, and the limits.
VS = 12 V, RREF = 75 kΩ, and if not specified, the device is in enable full power state using the basic test
circuit. Typical conditions are: TA = 25 °C. Minimum/Maximum parameters: TA = 0 °C to 85 °C.
Table 2 • Electrical Specifications
Parameter
Condition
Minimum
Typical
Maximum
Unit
mA
Supply Current
IVS (per channel)
Quiescent, VINA/B and VINC/D
floating
– Enable full power state
– Enable 90% power state
– Enable 80% power state
– Enable 80% power state
– Disable state
40
36
32
57
73
66
59
51
46
VS = 10 V, RREF = 130 kΩ
42
mA
mA
mA
0.7
0.4
1.0
0.65
1.4
1.0
Standby state (per device)
Control Input (C0/1, EN1/2, BSTEN) Characteristics
Internal 50 kΩ pull-down on all control inputs
VIH
1.2
3.6
0.6
120
20
V
VIL
–0.3
V
IIH
75
10
µA
µA
IIL
Channel Input (VINA/B, VINC/D) Characteristics
Input offset voltage
–35
13
35
18
mV
kΩ
Differential input impedance
VINA – VINB – VINC – VIND
15
Channel Output (VOUTA/B, VOUTC/D) Characteristics
Output voltage
Boosting1
12.5
8
VPK
VPK
mA
Ω
Not boosting, BSTEN = 0
RLoad = 10 Ω
Output current
600
560
Disabled output impedance1
Channel Dynamic Characteristics
Voltage gain
Differential
VOUT/VIN at 1 MHz
–3 dB
5.5
6.5
95
15
7.5
V/V
Bandwidth1
MHz
Input referred noise1
Differential
nV
/√Hz
MTPR1
Pload = 40 mW
–62
–32
dBc
dBc
0.5 MHz to 30 MHz
30 MHz to 86 MHz
Enable time1
Between disable and any power-
up state
500
500
ns
ns
Disable time1
Boost Characteristics
BSTEN warning time1
Time from BSTEN to VOUT
crossing threshold
100
ns
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
8
PLC Dual Channel Line Driver BD870 Series
Thermal Shutdown
Thermal shutdown temperature1
170
°C
Note: 1. Guaranteed by design and device characterization.
Absolute Maximum Ratings
Stresses above the values listed in the following table can cause permanent device failure. Functionality
at or above these limits is not implied. Exposure to absolute maximum ratings for extended periods can
affect device reliability. The following table shows the absolute maximum ratings of Le87402.
Table 3 • Absolute Maximum Ratings
Parameter
Value
Storage temperature
–65 °C ≤ TA ≤ 150 °C
– 40 °C ≤ TJ ≤ 150 °C1
– 0.3 V to 16 V
VS to GND
Operating junction temperature
VS to GND
Driver inputs VINA/B/C/D
Control inputs C0/1, EN1/2, BSTEN with respect to GND
Continuous driver output current
– 0.3 V to 4 V
200 mArms
1.7 W
Maximum device power dissipation, continuous 2 – TA = 85 °C, PD
Junction to ambient thermal resistance (2,3), ΘJA
Junction to board thermal resistance 2, ΘJB
Junction to case bottom (exposed pad) thermal resistance, ΘJC(BOTTOM)
29.7 °C/W
13.1 °C/W
3.7 °C/W
Junction-to-top characterization parameter2, ΨJT
ESD immunity (human body model)
ESD immunity (charge device model)
Notes:
0.3 °C/W
JESD22 Class 2 compliant
JESD22 Class IV compliant
1. Continuous operation above 145°C junction temperature may degrade
long term reliability of the device.
2. See the following section.
3. No air flow.
4.1
4.2
Thermal Resistance
The thermal performance of a thermally enhanced package is assured through optimized printed circuit
board layout. Specified performance requires that the exposed thermal pad is soldered to an exposed
copper surface of same size, which, in turn, conducts heat through multiple vials to larger internal
copper planes.
Operating Ranges
Microsemi guarantees the performance of this device over 0 °C to 85 °C temperature range by
conducting electrical characterization and a single insertion production test coupled with periodic
sampling. These procedures comply with the Telcordia GR-357-CORE generic requirements for assuring
the reliability of components used in telecommunications equipment.
Table 4 • Operating Ranges
Ambient temperature
VS with respect to GND
0 °C to 85 °C
10 V to 12 V, +/- 5%
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
9
PLC Dual Channel Line Driver BD870 Series
MIMO operation has the same device specification as SISO operation. The difference is that more power
is delivered to the line in SISO operation.
4.3
Test Circuit
The following figure shows the basic test circuit.
Figure 4 • Basic Test Circuit
4.4
Performance Characteristics
The following graphs show typical device performance characteristics using the Basic Test Circuit (see
page 10). Plotted performance is representative of either of the channels. Differential Gain (see page
11) plots device gain performance versus frequency. Supply Power Versus Load Power (see page 11)
plots line driver power to the load; with one channel operating in the full power state and loaded with
40 Ω. Disabled Output Impedance Applications (see page 12) plots output impedance versus frequency
in the disabled state.
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
10
PLC Dual Channel Line Driver BD870 Series
Figure 5 • Differential Gain
Figure 6 • Supply Power Versus Load Power
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
11
PLC Dual Channel Line Driver BD870 Series
Figure 7 • Disabled Output Impedance Applications
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
12
PLC Dual Channel Line Driver BD870 Series
5
Pin Descriptions
The following figure shows the pin diagram for Le87402.
Figure 8 • Le87402 Pin Diagram
Note: 1. Pin 1 is marked for orientation.
2. The device incorporates an exposed die pad on the underside of its package. The pad acts as a heat
sink and must be connected to a copper plane through thermal vials for proper heat dissipation. It is
electrically isolated and may be connected to GND.
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
13
PLC Dual Channel Line Driver BD870 Series
The following table lists the pin name, corresponding pin number, type, and the descriptions.
Table 5 • Pin Descriptions
Pin Name
IREF
Pin #
Type
Description
1
Input
Device internal reference current. Connect resistor RREF to GND
Channel A and B enable/disable control
Channel C and D enable/disable control
Amplifier A input
EN1
26
Input
EN2
11
Input
VINA
VINB
2
Input
3
Input
Amplifier B input
VINC
6
Input
Amplifier C input
VIND
VOUTA
VOUTB
VOUTC
VOUTD
C0, C1
VBPO
VBPI
7
Input
Amplifier D input
27
Output
Output
Output
Output
Inputs
Output
Input
Amplifier A input
25
Amplifier B input
12
Amplifier C input
10
Amplifier D input
28,9
23
Sets operation state when channel is enabled
Connect a capacitor to VBPI
Connects to V S through an internal diode
Power supply
21
VS
18,19,20
4,5,13,17
16
Power
Ground
Input
GND
Low noise analog ground
Connects to GND through an internal diode
Connects a capacitor to VBNI
Boost enable
VBNI
VBNO
BSTEN
NC
14
Output
Input
24
8,15,22
NA
No connect
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
14
PLC Dual Channel Line Driver BD870 Series
6
Package Information
The following figure shows the outline drawing of the LE87402 device.
Figure 9 • 28-pin QFN Physical Dimensions
Note: Packages may have mold tooling markings on the surface. These markings have no impact on the
form, fit or function of the device. Markings vary with the mold tool used in manufacturing.
6.1
Package Assembly
The green package devices are assembled with enhanced, environmental compatible lead-free, halogen-
free, and antimony-free materials. The leads possess a matte-tin plating which is compatible with
conventional board assembly processes or newer lead-free board assembly processes.
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
15
PLC Dual Channel Line Driver BD870 Series
Refer to IPC/JEDEC J-Std-020 for recommended peak soldering temperature and solder reflow
temperature profile.
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
16
PLC Dual Channel Line Driver BD870 Series
7
Design Considerations
The Le87402 integrates two sets of high-power line driver amplifiers. The amplifiers are designed for
low distortion for signals up to 86 MHz. A typical application interface circuit (for one channel) is shown
in Typical Application Circuit (see page 18). The amplifiers have identical positive gain connections with
common-mode rejection. Any DC input errors are duplicated and create common-mode rather than
differential line errors.
7.1
Internal Reference Current
Resistor RREF sets the internal reference current for both channels of the Le87402 device. The standard
value for RREF is 75 kΩ, this value was used for all specifications in this data sheet. Increasing the value of
RREF not only reduces device power dissipation but also lowers the available drive bandwidth. Do not
exceed an RREF value above 130 kΩ.
7.2
7.3
Input Considerations
The driving source impedance should be less than 100 nH to avoid any ringing or oscillation.
Output Driving Considerations
The internal metallization is designed to drive 200 mArms sinusoidal current and there is no current
limit mechanism. Driving lines without a series resistor is not recommended. If a DC current path exists
between the two outputs, a DC current can flow through the outputs. To avoid DC current flow, the
most effective solution is to place DC blocking capacitors in series with the output as shown in the
following figure.
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
17
PLC Dual Channel Line Driver BD870 Series
7.4
Power Supplies and Component Placement
The power supplies should be well bypassed; with decoupling placed close to the Le87402. The
following figure shows the typical application circuit for Le87402.
Figure 10 • Typical Application Circuit - Channel A/B
Note: In this figure only one channel of the two channel device is shown.
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
18
PLC Dual Channel Line Driver BD870 Series
8
Ordering Information
The following list shows the ordering part numbers to be used while ordering Le87402.
Le87402MQC 28-pin QFN Green Pkg. Tray
Le87402MQCT 28-pin QFN Green Pkg. Tape and Reel
Note: The preceding ordering part number is for ordering the tape and reel packing system.
The green package is halogen free and meets RoHS 2 directive 2011/65/EU of the European Council to
minimize the environmental impact of electrical equipment.
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
19
PLC Dual Channel Line Driver BD870 Series
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services
for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The
products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with
mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and
complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data
and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any
products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the
entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights,
licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this
document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products
and services at any time without notice.
Microsemi Corporate Headquarters
One Enterprise, Aliso Viejo,
CA 92656 USA
Within the USA: +1 (800) 713-4113
Outside the USA: +1 (949) 380-6100
Fax: +1 (949) 215-4996
Email: sales.support@microsemi.com
www.microsemi.com
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense,
communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated
circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's
standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions; security technologies
and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www.microsemi.com.
© 2018 Microsemi Corporation. All rights reserved. Microsemi and the
Microsemi logo are trademarks of Microsemi Corporation. All other
trademarks and service marks are the property of their respective owners.
PD-000267194
Microsemi Proprietary and Confidential. Le87402 Datasheet Revision 8.0
20
相关型号：
©2020 ICPDF网 联系我们和版权申明