2N5323-BP [MCC]
Small Signal Bipolar Transistor, 2A I(C), 50V V(BR)CEO, 1-Element, PNP, Silicon, TO-39, ROHS COMPLIANT, METAL CAN-3;型号: | 2N5323-BP |
厂家: | Micro Commercial Components |
描述: | Small Signal Bipolar Transistor, 2A I(C), 50V V(BR)CEO, 1-Element, PNP, Silicon, TO-39, ROHS COMPLIANT, METAL CAN-3 开关 晶体管 |
文件: | 总2页 (文件大小:373K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Micro Commercial Components
2N5323
Features
•
10 Watts Power Dissipation.
PNP Silicon
Switching Transistor
•
Metal can case.
Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
RoHS Compliant. See ordering information)
•
Maximum Ratings
Symbol
Rating
Rating
50
75
5.0
2.0
1.0
-55 to +150
-55 to +150
Unit
V
V
V
A
TO-39
VCEO
VCBO
VEBO
IC
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current, Continuous
Base Current
IB
A
TJ
TSTG
Operating Junction Temperature
Storage Temperature
OC
OC
Thermal Characteristics
Symbol
Rating
Max
10
0.057
Unit
W
PD
Total Device Dissipation
Derate above 25OC
mW/OC
OC/W
RJC
Thermal Resistance, Junction to Case
17.5
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol
Parameter
Min
Max
Units
OFF CHARACTERISTICS
V(BR)CEO
Collector-Emitter Breakdown Voltage
(IC=100mAdc, IB=0)
50
---
Vdc
ICEX
Collector Cutoff Current
(VCE=75Vdc, VEB(off)=1.5Vdc)
(VCE=45Vdc, VEB(off)=1.5Vdc, TC=150OC)
Emitter Cutoff Current
---
---
0.1
5.0
mAdc
IEBO
(VEB=5.0Vdc, IC=0)
---
0.1
mAdc
ON CHARACTERISTICS
hFE
DC Current Gain (1)
(VCE=4.0Vdc, IC=500mAdc)
Collector-Emitter Saturation Voltage (1)
(IC=500mAdc, IB=50mAdc)
Base-Emitter On Voltage
40
---
---
250
1.2
1.4
---
VCE(sat)
VBE(on)
Vdc
Vdc
DIMENSIONS
(IC=500mAdc, VCE=4.0Vdc)
INCHES
MIN
.335
.305
.240
.50
MM
SMALL-SIGNAL CHARACTERISTICS
DIM
A
B
C
D
E
MAX
.370
.335
.260
.75
MIN
8.509
7.747
6.096
12.7
MAX
9.40
NOTE
hfe
Small-signal current gain
(VCE=4.0Vdc, IC=50mAdc,f=10MHz)
5.0
---
---
8.509
6.604
19.05
SWITCHING CHARACTERISTICS
ton
Turn-On Time
(VCC=30Vdc, IC=500mAdc,IB1=50mAdc)
Turn-Off Time
(VCC=30Vdc,
.200
5.08
ns
ns
---
---
100
F
.029
-----
.009
44°
.045
.050
.031
46°
7.366
-----
0.229
44°
11.43
1.27
7.874
46°
toff
G
H
J
1000
IC=500mAdc,IB1=IB2=50mAdc)
K
L
.028
.016
.034
.021
0.711
0.406
0.864
0.533
Notes:1.High Temperature Solder Exemption Applied, see EU Directive Annex 7.
www.mccsemi.com
1 of 2
Revision: A
2011/01/01
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Micro Commercial Components
Ordering Information :
Device
Packing
Part Number-BP
Bulk;50pcs/Box
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Revision: A
2011/01/01
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