MAX9986AETP+ [MAXIM]
SiGe High-Linearity, 815MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch; SiGe，高线性度，815MHz至1000MHz下变频混频器，带有LO缓冲器/开关
| 型号： | MAX9986AETP+ |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | SiGe High-Linearity, 815MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch |
| 文件： | 总12页 (文件大小：348K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-3906; Rev 0; 1/06
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
General Description
Features
The MAX9986A high-linearity downconversion mixer
provides 8.2dB gain, +25dBm IIP3, and 10dB NF for
815MHz to 1000MHz base-station receiver applica-
tions. With a 960MHz to 1180MHz LO frequency range,
this particular mixer is ideal for high-side LO injection
receiver architectures. Low-side LO injection is sup-
ported by the MAX9984, which is pin-for-pin and func-
tionally compatible with the MAX9986A.
ꢀ 815MHz to 1000MHz RF Frequency Range
ꢀ 960MHz to 1180MHz LO Frequency Range
(MAX9986A/MAX9986)
ꢀ 570MHz to 850MHz LO Frequency Range
(MAX9984)
ꢀ 50MHz to 250MHz IF Frequency Range
ꢀ 8.2dB Conversion Gain
ꢀ +25dBm Input IP3
ꢀ +14.8dBm Input 1dB Compression Point
ꢀ 10dB Noise Figure
In addition to offering excellent linearity and noise perfor-
mance, the MAX9986A also yields a high level of compo-
nent integration. This device includes a double-balanced
passive mixer core, an IF amplifier, a dual-input LO selec-
table switch, and an LO buffer. On-chip baluns are also
integrated to allow for single-ended RF and LO inputs.
The MAX9986A requires a nominal LO drive of 0dBm,
and supply current is guaranteed to be below 250mA.
ꢀ 69dBc 2LO - 2RF Spurious Rejection at
P
= -10dBm
RF
ꢀ Integrated LO Buffer
ꢀ Integrated RF and LO Baluns for Single-Ended
Inputs
The MAX9986A is a derivative version of the MAX9986
with improved large-signal blocking performance. The
MAX9984/MAX9986/MAX9986A are pin compatible with
the MAX9994/MAX9996 1700MHz to 3000MHz mixers,
making this entire family of downconverters ideal for
applications where a common PC board layout is used
for both frequency bands. The MAX9986A is also func-
tionally compatible with the MAX9993.
ꢀ Low -3dBm to +3dBm LO Drive
ꢀ Built-In SPDT LO Switch with 49dB LO1 to LO2
Isolation and 50ns Switching Time
ꢀ Pin Compatible with MAX9994/MAX9996 1700MHz
to 3000MHz Mixers
ꢀ Functionally Compatible with MAX9993
ꢀ External Current-Setting Resistors Provide Option
for Operating Mixer in Reduced Power/Reduced
Performance Mode
The MAX9986A is available in a compact, 20-pin, thin
QFN package (5mm x 5mm) with an exposed paddle.
Electrical performance is guaranteed over the extended
-40°C to +85°C temperature range.
ꢀ Lead-Free Package Available
Applications
Ordering Information
850MHz WCDMA Base Stations
PKG
CODE
PART
TEMP RANGE PIN-PACKAGE
GSM 850/GSM 900 2G and 2.5G EDGE Base
Stations
cdmaOne™ and cdma2000® Base Stations
iDEN® Base Stations
20 Thin QFN-EP*
-40°C to +85°C
MAX9986AETP
T2055-3
5mm × 5mm
20 Thin QFN-EP*
5mm × 5mm
MAX9986AETP-T -40°C to +85°C
MAX9986AETP+ -40°C to +85°C
MAX9986AETP+T -40°C to +85°C
T2055-3
T2055-3
T2055-3
Predistortion Receivers
Fixed Broadband Wireless Access
Wireless Local Loops
20 Thin QFN-EP*
5mm × 5mm
20 Thin QFN-EP*
5mm × 5mm
Private Mobile Radios
Military Systems
*EP = Exposed paddle.
+ = Lead free.
Microwave Links
T = Tape-and-reel.
Digital and Spread-Spectrum Communication
Systems
cdma2000 is a registered trademark of the Telecommunications
Industry Association.
cdmaOne is a trademark of CDMA Development Group.
iDEN is a registered trademark of Motorola, Inc.
Pin Configuration/Functional Diagram and Typical
Application Circuit appear at end of data sheet.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
CC
IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (V
TAP........................................................................-0.3V to +1.4V
LO1, LO2, LEXT to GND........................................-0.3V to +0.3V
RF, LO1, LO2 Input Power .............................................+12dBm
RF (RF is DC shorted to GND through a balun) .................50mA
V
to GND...........................................................-0.3V to +5.5V
θ
θ
.................................................................................+38°C/W
.................................................................................+13°C/W
JA
JC
+ 0.3V)
CC
Operating Temperature Range (Note A) ....T = -40°C to +85°C
C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Continuous Power Dissipation (T = +70°C)
A
20-Pin Thin QFN-EP (derate 26.3mW/°C above +70°C)...........2.1W
Note A: T is the temperature on the exposed paddle of the package.
C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(MAX9986A Typical Application Circuit, V
= +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to V
through
CC
CC
inductive chokes, R1 = 953Ω, R2 = 619Ω, T = -40°C to +85°C, unless otherwise noted. Typical values are at V
= +5V, T
=
C
CC
C
+25°C, unless otherwise noted.)
PARAMETER
Supply Voltage
SYMBOL
CONDITIONS
MIN
TYP
5.00
213
MAX
5.25
250
0.8
UNITS
V
4.75
V
mA
V
CC
CC
Supply Current
I
LO_SEL Input-Logic Low
LO_SEL Input-Logic High
V
IL
V
2
V
IH
AC ELECTRICAL CHARACTERISTICS
(MAX9986A Typical Application Circuit, V
= +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources, P
= -3dBm to
LO
CC
+3dBm, P = -5dBm, f = 815MHz to 1000MHz, f = 960MHz to 1180MHz, f = 160MHz, f > f , T = -40°C to +85°C, unless
RF
RF
LO
IF
LO
RF
C
otherwise noted. Typical values are at V
= +5V, P = -5dBm, P = 0dBm, f = 910MHz, f = 1070MHz, f = 160MHz, T
=
CC
RF
LO
RF
LO
IF
C
+25°C, unless otherwise noted.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
815
960
570
50
TYP
MAX
1000
1180
850
UNITS
RF Frequency Range
f
(Note 2)
(Note 2)
MAX9984
(Note 2)
MHz
RF
LO Frequency Range
f
MHz
LO
IF Frequency Range
f
IF
250
MHz
dB
Conversion Gain
G
T
C
C
= +25°C
7.2
8.2
9.3
C
Gain Variation Over Temperature
T
= -40°C to +85°C
-0.009
dB/°C
Flatness over any one of three frequency bands:
f
f
f
= 824MHz to 849MHz
= 869MHz to 894MHz
= 880MHz to 915MHz
RF
RF
RF
Conversion Gain Flatness
Input Compression Point
0.15
14.8
25
dB
P
(Note 3)
dBm
dBm
1dB
Two tones:
f
= 910MHz, f
= 911MHz,
RF1
RF2
Input Third-Order Intercept Point
IIP3
22
P
P
= -5dBm/tone, f = 1070MHz,
LO
RF
LO
= 0dBm, T = +25°C
A
T
T
= +25°C to -40°C
= +25°C to +85°C
-1.8
Input IP3 Variation Over
Temperature
C
dB
+0.7
C
2
_______________________________________________________________________________________
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX9986A Typical Application Circuit, V
= +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources, P
= -3dBm to
LO
CC
+3dBm, P = -5dBm, f = 815MHz to 1000MHz, f = 960MHz to 1180MHz, f = 160MHz, f > f , T = -40°C to +85°C, unless
RF
RF
LO
IF
LO
RF
C
otherwise noted. Typical values are at V
= +5V, P = -5dBm, P = 0dBm, f = 910MHz, f = 1070MHz, f = 160MHz, T
=
CC
RF
LO
RF
LO
IF
C
+25°C, unless otherwise noted.) (Note 1)
PARAMETER SYMBOL
Noise Figure
CONDITIONS
MIN
TYP
MAX
UNITS
NF
Single sideband, f = 190MHz
10
dB
IF
P
=
=
f
f
f
f
= 900MHz (no signal)
= 1090MHz
BLOCKER
RF
20
23
+8dBm
LO
Noise Figure Under-Blocking
= 981MHz
dB
BLOCKER
= 190MHz
P
IF
BLOCKER
(Note 4)
+11dBm
P
=
=
BLOCKER
0.18
0.4
P
= -5dBm
= 910MHz
= 911MHz
FUNDAMENTAL
+8dBm
Small-Signal Compression
Under-Blocking Condition
dB
f
f
FUNDAMENTAL
P
BLOCKER
BLOCKER
+11dBm
LO Drive
-3
+3
dBm
dBc
P
P
P
P
= -10dBm
= -5dBm
= -10dBm
= -5dBm
69
64
88
78
49
50
-45
-33
54
50
20
RF
RF
RF
RF
2 x 2
3 x 3
2LO - 2RF
3LO - 3RF
Spurious Response at IF
LO2 selected
LO1 selected
42
42
P
= +3dBm
LO
LO1-to-LO2 Isolation
dB
T
C
= +25°C (Note 5)
LO Leakage at RF Port
LO Leakage at IF Port
RF-to-IF Isolation
P
P
= +3dBm
= +3dBm
dBm
dBm
dB
LO
LO
LO Switching Time
RF Port Return Loss
50% of LOSEL to IF settled to within 2°
ns
dB
LO1/2 port selected,
LO2/1 and IF terminated
22
34
22
LO Port Return Loss
dB
LO1/2 port unselected,
LO2/1 and IF terminated
LO driven at 0dBm, RF terminated into 50Ω,
differential 200Ω
IF Port Return Loss
dB
Note 1: All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit.
Note 2: Operation outside this range is possible, but with degraded performance of some parameters.
Note 3: Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm.
Note 4: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all
SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021.
Note 5: Guaranteed by design and characterization.
_______________________________________________________________________________________
3
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics
(MAX9986A Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 160MHz, unless otherwise noted.)
LO RF LO RF IF
CC
CONVERSION GAIN vs. RF FREQUENCY
CONVERSION GAIN vs. RF FREQUENCY
CONVERSION GAIN vs. RF FREQUENCY
10
10
9
10
9
T
= -40°C
C
9
8
7
6
5
8
8
T
= -25°C
C
T
= +25°C
C
7
7
P
= -3dBm, 0dBm, +3dBm
V
= 4.75V, 5.0V, 5.25V
CC
LO
T
= +85°C
C
6
6
5
5
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
INPUT IP3 vs. RF FREQUENCY
INPUT IP3 vs. RF FREQUENCY
28
27
26
25
24
23
22
21
28
27
26
25
24
23
22
21
28
27
26
25
24
23
22
21
T
= +25°C
C
T
= +85°C
C
V
= 4.75V
CC
V
= 5.0V
CC
P
= -3dBm, 0dBm, +3dBm
LO
V
= 5.25V
CC
T
= -25°C
C
T
= -40°C
C
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
NOISE FIGURE vs. RF FREQUENCY
NOISE FIGURE vs. RF FREQUENCY
NOISE FIGURE vs. RF FREQUENCY
12
11
10
9
12
11
10
9
12
11
10
9
T
= +85°C
T
= +25°C
C
C
IF = 190MHz
IF = 190MHz
P
= -3dBm, 0dBm
V
= 5.25V
LO
CC
V
= 5.0V
CC
P
= +3dBm
LO
V
= 4.75V
CC
T
= -25°C
C
8
8
8
T
= -40°C
C
7
7
7
IF = 190MHz
950 1000
6
6
6
750
800
850
900
750
800
850
900
950
1000
750
800
850
900
950
1000
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
4
_______________________________________________________________________________________
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9986A Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 160MHz, unless otherwise noted.)
LO RF LO RF IF
CC
2LO - 2RF RESPONSE vs. RF FREQUENCY
2LO - 2RF RESPONSE vs. RF FREQUENCY
2LO - 2RF RESPONSE vs. RF FREQUENCY
85
75
65
55
45
85
75
65
55
45
85
P
= -5dBm
P
= -5dBm
P = -5dBm
RF
RF
RF
T
= -25°C
C
V
= 5.25V
CC
75
65
55
45
T
= +85°C
C
P
= 0dBm
LO
T
= -40°C
C
V
= 5.0V
CC
P
= -3dBm
940
LO
T
= +25°C
C
V
= 4.75V
840
P
= +3dBm
840
CC
LO
740
790
840
890
940
990 1040
740
790
890
990 1040
740
790
890
940
990 1040
FUNDAMENTAL RF FREQUENCY (MHz)
FUNDAMENTAL RF FREQUENCY (MHz)
FUNDAMENTAL RF FREQUENCY (MHz)
3LO - 3RF RESPONSE vs. RF FREQUENCY
3LO - 3RF RESPONSE vs. RF FREQUENCY
3LO - 3RF RESPONSE vs. RF FREQUENCY
95
85
75
65
55
95
85
75
65
55
95
85
75
65
55
P
= -5dBm
P
= -5dBm
P
RF
= -5dBm
RF
RF
T
= +85°C
C
T
= -25°C
C
V
= 5.25V
CC
P
= 0dBm, +3dBm
LO
V
= 5.0V
CC
T
= +25°C
C
V
= 4.75V
CC
T
= -40°C
C
P
= -3dBm
940
LO
740
790
840
890
940
990 1040
740
790
840
890
990 1040
740
790
840
890
940
990 1040
FUNDAMENTAL RF FREQUENCY (MHz)
FUNDAMENTAL RF FREQUENCY (MHz)
FUNDAMENTAL RF FREQUENCY (MHz)
INPUT P
vs. RF FREQUENCY
INPUT P
vs. RF FREQUENCY
INPUT P
vs. RF FREQUENCY
1dB
1dB
1dB
17
16
15
14
13
12
11
10
17
16
15
14
13
12
11
10
17
16
15
14
13
12
11
10
V
= 5.25V
CC
T
= +85°C
C
T
= +25°C
C
T
= -25°C
C
P
= -3dBm, 0dBm, +3dBm
LO
V
= 4.75V
CC
V
= 5.0V
CC
T
= -40°C
C
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
_______________________________________________________________________________________
5
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9986A Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 160MHz, unless otherwise noted.)
LO RF LO RF IF
CC
LO SWITCH ISOLATION
vs. LO FREQUENCY
LO SWITCH ISOLATION
vs. LO FREQUENCY
LO SWITCH ISOLATION
vs. LO FREQUENCY
60
60
55
50
45
40
60
P
= -3dBm, 0dBm
LO
55
55
50
45
40
T
= -40°C, -25°C
C
50
45
40
V
= 4.75V, 5.0V, 5.25V
CC
P
= +3dBm
LO
T
= +85°C
T = +25°C
C
C
700
900
900
800
900
1000
1100
1200
700
900
900
800
900
1000
1100
1200
700
800
900
1000
1100
1200
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
-20
-30
-40
-50
-20
-30
-40
-50
-20
-30
-40
-50
T
= -25°C
C
V
= 5.25V
CC
T
= -40°C
C
P
= 0dBm
LO
P
= -3dBm
LO
V = 4.75V
CC
T
= +25°C
C
V
= 5.0V
CC
T
= +85°C
C
P
= +3dBm
LO
950 1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
950 1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
900
950 1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
-20
-30
-40
-50
-20
-30
-40
-50
-20
-30
-40
-50
T
= -40°C, -25°C
C
T
= +25°C
C
V
= 5.25V
CC
T
= -40°C
P
= +3dBm
C
LO
P
= 0dBm
LO
V
= 5.0V
CC
P
= -3dBm
LO
T
= +85°C
C
V
= 4.75V
CC
950 1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
950 1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
900
950 1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
6
_______________________________________________________________________________________
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9986A Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 160MHz, unless otherwise noted.)
LO RF LO RF IF
CC
LO LEAKAGE AT IF PORT
RF-TO-IF ISOLATION
vs. RF FREQUENCY
RF-TO-IF ISOLATION
vs. RF FREQUENCY
OVER FREQUENCY vs. L
EXT
0
-10
-20
-30
-40
60
50
40
30
60
T
= +25°C
P
= +3dBm
LO
C
L3 = 0Ω
T
= +85°C
C
L3 = 4.7nH
50
40
30
P
= dBm
LO
T
= -25°C
C
L3 = 10nH
T
= -40°C
C
P
= -3dBm
LO
L3 = 22nH
L3 = 15nH
L3 = 30nH
900
950 1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION
vs. RF FREQUENCY
RF-TO-IF ISOLATION
OVER FREQUENCY vs. L
RF PORT RETURN LOSS
vs. RF FREQUENCY
EXT
60
50
40
30
70
60
50
40
30
20
0
5
L3 = 22nH
L3 = 30nH
L3 = 15nH
10
15
20
25
30
35
40
V
= 4.75V, 5.0V, 5.25V
CC
L3 = 4.7nH
L3 = 0Ω
L3 = 10nH
P
= -3dBm, 0dBm, +3dBm
LO
10
0
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
500
700
900
1100
1300
1500
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
IF PORT RETURN LOSS
vs. IF FREQUENCY
LO SELECTED RETURN LOSS
vs. LO FREQUENCY
0
10
20
30
40
0
10
20
30
40
50
P
= +3dBm
LO
V
= 4.75V, 5.0V, 5.25V
CC
P
= 0dBm
LO
P
= -3dBm
LO
50
50
100
150
200
250
300
350
600
800
1000
1200
1400
1600
IF FREQUENCY (MHz)
LO FREQUENCY (MHz)
_______________________________________________________________________________________
7
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9986A Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 160MHz, unless otherwise noted.)
LO RF LO RF IF
CC
LO UNSELECTED RETURN LOSS
vs. LO FREQUENCY
SUPPLY CURRENT vs. TEMPERATURE (T )
C
0
10
20
30
40
50
230
220
210
200
190
V
= 5.25V
CC
P
= -3dBm, 0dBm, +3dBm
LO
V
= 5.0V
CC
V
= 4.75V
10
CC
600
800
1000
1200
1400
1600
-40
-15
35
60
85
LO FREQUENCY (MHz)
TEMPERATURE (°C)
Pin Description
PIN
NAME
FUNCTION
pin to GND with capacitors as shown in the Typical
Power-Supply Connection. Bypass each V
Application Circuit.
CC
1, 6, 8, 14
V
CC
Single-Ended 50Ω RF Input. This port is internally matched and DC shorted to GND through a balun.
Requires an external DC-blocking capacitor.
2
3
RF
Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the
Typical Application Circuit.
TAP
GND
4, 5, 10, 12,
13, 17
Ground
7
9
LOBIAS
LOSEL
LO1
Bias Resistor for Internal LO Buffer. Connect a 619Ω 1% resistor from LOBIAS to the power supply.
Local Oscillator Select. Logic control input for selecting LO1 or LO2.
Local Oscillator Input 1. Drive LOSEL low to select LO1.
11
15
LO2
Local Oscillator Input 2. Drive LOSEL high to select LO2.
External Inductor Connection. Short LEXT to ground using a 0Ω resistor. For applications requiring
improved RF-to-IF and LO-to-IF isolation, connect a low-ESR inductor from LEXT to GND. See the
Applications Information section regarding stability issues when using an LEXT inductor.
16
LEXT
Differential IF Outputs. Each output requires external bias to V
Typical Application Circuit).
through an RF choke (see the
CC
18, 19
IF-, IF+
20
EP
IFBIAS
GND
IF Bias Resistor Connection for IF Amplifier. Connect a 953Ω 1% resistor from IFBIAS to GND.
Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias.
ended interfaces to the RF and the two LO ports. A sin-
Detailed Description
gle-pole, double-throw (SPDT) switch provides 50ns
switching time between the two LO inputs with 49dB of
LO-to-LO isolation. Furthermore, the integrated LO
buffer provides a high drive level to the mixer core,
reducing the LO drive required at the MAX9986A’s
The MAX9986A high-linearity downconversion mixer
provides 8.2dB of conversion gain and +25dBm of
IIP3, with a typical 10dB noise figure. The integrated
baluns and matching circuitry allow for 50Ω single-
8
_______________________________________________________________________________________
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
inputs to a -3dBm to +3dBm range. The IF port incor-
porates a differential output, which is ideal for provid-
ing enhanced IIP2 performance.
Differential IF Output Amplifier
The MAX9986A mixer has a 50MHz to 250MHz IF fre-
quency range. The differential, open-collector IF output
ports require external pullup inductors to V . Note that
CC
Specifications are guaranteed over broad frequency
ranges to allow for use in cellular band GSM,
cdma2000, iDEN, and WCDMA 2G/2.5G/3G base sta-
tions. The MAX9986A is specified to operate over a
815MHz to 1000MHz RF frequency range, a 960MHz
to 1180MHz LO frequency range, and a 50MHz to
250MHz IF frequency range. Operation beyond these
ranges is possible; see the Typical Operating
Characteristics for additional details.
these differential outputs are ideal for providing
enhanced 2LO - 2RF rejection performance. Single-
ended IF applications require a 4:1 balun to transform
the 200Ω differential output impedance to a 50Ω single-
ended output.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω. No
matching components are required. RF and LO inputs
require only DC-blocking capacitors for interfacing.
RF Input and Balun
The MAX9986A RF input is internally matched to 50Ω,
requiring no external matching components. A DC-
blocking capacitor is required because the input is inter-
nally DC shorted to ground through the on-chip balun.
The IF output impedance is 200Ω (differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance down to a 50Ω single-
ended output (see the Typical Application Circuit).
LO Inputs, Buffer, and Balun
The MAX9986A is ideally suited for high-side LO injec-
tion applications with a 960MHz to 1180MHz LO fre-
quency range. For a device with a 570MHz to 850MHz
LO frequency range, refer to the MAX9984 data sheet.
As an added feature, the MAX9986A includes an inter-
nal LO SPDT switch that can be used for frequency-
hopping applications. The switch selects one of the two
single-ended LO ports, allowing the external oscillator
to settle on a particular frequency before it is switched
in. LO switching time is typically less than 50ns, which
is more than adequate for virtually all GSM applica-
tions. If frequency hopping is not employed, set the
switch to either of the LO inputs. The switch is con-
trolled by a digital input (LOSEL): logic-high selects
LO2, logic-low selects LO1. To avoid damage to the
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are
optimized by fine tuning resistors R1 and R2. If
reduced current is required at the expense of perfor-
mance, contact the factory for details. If the 1% bias
resistor values are not readily available, substitute stan-
dard 5% values.
LEXT Inductor
Short LEXT to ground using a 0Ω resistor. For applica-
tions requiring improved RF-to-IF and LO-to-IF isolation,
LEXT can be used by connecting a low-ESR inductor
from LEXT to GND. See the Typical Operating
Characteristics on RF-to-IF isolation and LO-to-IF leakage
for various inductor values. However, the load impedance
presented to the mixer must be such that any capaci-
tance from both IF- and IF+ to ground do not exceed sev-
eral picofarads to ensure stable operating conditions.
part, voltage must be applied to V
before digital
CC
logic is applied to LOSEL. LO1 and LO2 inputs are
internally matched to 50Ω, requiring only an 82pF DC-
blocking capacitor.
Since approximately 140mA flows through LEXT, it is
important to use a low DCR wire-wound inductor.
A two-stage internal LO buffer allows a wide input
power range for the LO drive. All guaranteed specifica-
tions are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO inputs to the IF out-
puts are integrated on-chip.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that mul-
tiple vias be used to connect this pad to the lower level
ground planes. This method provides a good RF/ther-
mal conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX9986A Evaluation Kit can be used as a
High-Linearity Mixer
The core of the MAX9986A is a double-balanced, high-
performance passive mixer. Exceptional linearity is pro-
vided by the large LO swing from the on-chip LO buffer.
When combined with the integrated IF amplifiers, the cas-
caded IIP3, 2LO - 2RF rejection, and NF performance is
typically 25dBm, 69dBc, and 10dB, respectively.
_______________________________________________________________________________________
9
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9986A’s 20-pin
thin QFN-EP package provides a low thermal-resis-
tance path to the die. It is important that the PC board
on which the MAX9986A is mounted be designed to
conduct heat from the EP. In addition, provide the EP
with a low-inductance path to electrical ground. The EP
MUST be soldered to a ground plane on the PC board,
either directly or through an array of plated via holes.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V
pin and
CC
TAP with the capacitors shown in the Typical Application
Circuit; see Table 1. Place the TAP bypass capacitor to
ground within 100 mils of the TAP pin.
Table 1. Component List Referring to the Typical Application Circuit
COMPONENT
VALUE
330nH
30nH
DESCRIPTION
L1, L2
Wire-wound high-Q inductors (0805)
L3*
Wire-wound high-Q inductor (0603)
Microwave capacitor (0603)
Microwave capacitors (0603)
Microwave capacitors (0603)
Microwave capacitor (0402)
1% resistor (0603)
C1
10pF
C2, C4, C7, C8, C10, C11, C12
82pF
C3, C5, C6, C9, C13, C14
0.01µF
220pF
953Ω
C15
R1
R2
R3
T1
619Ω
1% resistor (0603)
0Ω
1% resistor (1206)
4:1 balun
MAX9986A
IF balun TC4-1W-7A
U1
Maxim IC
*Use L3 for improved RF-to-IF and LO-to-IF isolation. See the Applications Information section regarding stability issues when using
L3 inductor.
Pin Configuration/Functional Diagram
20
19
18
16
17
V
CC
1
2
3
4
15
14
13
12
11
LO2
V
RF
CC
MAX9986A
TAP
GND
GND
LO1
GND
GND
5
6
7
8
9
10
THIN QFN
10 ______________________________________________________________________________________
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
Typical Application Circuit
V
CC
T1
3
6
4
IF
R3
OUTPUT
L1
L2
2
C13
1
C15
17
C14
R1
L3*
V
CC
19
18
16
20
C12
C3
C2
V
CC
LO2
LO2
1
2
3
4
5
15
INPUT
C1
MAX9986A
V
CC
RF
INPUT
RF
TAP
14
13
12
11
V
CC
C11
C5
GND
GND
C4
GND
GND
C10
LO1
INPUT
LO1
6
7
8
9
10
R2
C7
V
CC
LOSEL
INPUT
C6
C8
C9
V
CC
*USE L3 FOR IMPROVED RF-TO-IF AND LO-TO-IF ISOLATION. SEE THE Applications Information SECTION REGARDING STABILITY ISSUES WHEN USING L3 INDUCTOR.
Chip Information
TRANSISTOR COUNT: 1017
PROCESS: SiGe BiCMOS
______________________________________________________________________________________ 11
SiGe High-Linearity, 815MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
D2
D
b
0.10 M
C A B
C
L
D2/2
D/2
k
L
MARKING
AAAAA
E/2
E2/2
C
(NE-1) X
e
L
E2
E
PIN # 1 I.D.
0.35x45¡
DETAIL A
e/2
PIN # 1
I.D.
e
(ND-1) X
e
DETAIL B
e
L
C
L
C
L
L1
L
L
e
e
0.10
C
A
0.08
C
C
A3
A1
PACKAGE OUTLINE,
16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm
1
-DRAWING NOT TO SCALE-
I
21-0140
2
COMMON DIMENSIONS
20L 5x5 28L 5x5
EXPOSED PAD VARIATIONS
D2 E2
MIN. NOM. MAX. MIN. NOM. MAX.
3.00 3.10 3.20 3.00 3.10 3.20
3.00 3.10 3.20 3.00 3.10 3.20
PKG.
SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX.
16L 5x5
32L 5x5
40L 5x5
L
DOWN
BONDS
ALLOWED
YES
NO
NO
YES
exceptions
PKG.
CODES
–0.15
A
0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80
0.02 0.05 0.02 0.05 0.02 0.05 0.02 0.05 0.02 0.05
0.20 REF. 0.20 REF. 0.20 REF. 0.20 REF. 0.20 REF.
T1655-2
T1655-3
**
**
**
**
A1
0
0
0
0
0
A3
b
T1655N-1 3.00 3.10 3.20 3.00 3.10 3.20
0.25 0.30 0.35 0.25 0.30 0.35 0.20 0.25 0.30 0.20 0.25 0.30 0.15 0.20 0.25
4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10
4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10
T2055-3
T2055-4
T2055-5
T2855-3
3.00 3.10 3.20 3.00 3.10 3.20
3.00 3.10 3.20 3.00 3.10 3.20
D
E
NO
**
YES
3.15 3.25 3.35 3.15 3.25 3.35 0.40
3.15 3.25 3.35 3.15 3.25 3.35
e
0.80 BSC.
0.25
0.65 BSC.
0.25
0.50 BSC.
0.25
0.50 BSC.
0.25
0.40 BSC.
YES
YES
NO
NO
YES
YES
**
**
**
k
-
-
-
-
-
-
-
-
0.25 0.35 0.45
T2855-4
T2855-5
2.60 2.70 2.80 2.60 2.70 2.80
2.60 2.70 2.80 2.60 2.70 2.80
3.15 3.25 3.35 3.15 3.25 3.35
L
0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50 0.40 0.50 0.60
L1
-
-
-
-
-
-
-
-
-
-
-
-
0.30 0.40 0.50
T2855-6
T2855-7
**
**
N
ND
16
4
4
20
5
28
7
32
8
8
40
10
10
2.80
2.60 2.70
2.60 2.70 2.80
5
7
NE
T2855-8
3.15 3.25 3.35 3.15 3.25 3.35 0.40
WHHB
WHHC
WHHD-1
WHHD-2
-----
JEDEC
NOTES:
T2855N-1 3.15 3.25 3.35 3.15 3.25 3.35
NO
YES
NO
YES
NO
**
**
**
**
**
**
3.20
T3255-3
T3255-4
T3255-5
3.00 3.10
3.00 3.10 3.20 3.00 3.10 3.20
3.20
3.00 3.10 3.20
3.00 3.10
3.00 3.10 3.20
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
T3255N-1 3.00 3.10 3.20 3.00 3.10 3.20
T4055-1 3.20 3.30 3.40 3.20 3.30 3.40
YES
**SEE COMMON DIMENSIONS TABLE
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL
CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE
OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1
IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN
0.25 mm AND 0.30 mm FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR
T2855-3 AND T2855-6.
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY.
12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY.
13. LEAD CENTERLINES TO BE AT TRUE POSITION AS DEFINED BY BASIC DIMENSION "e", –0.05.
PACKAGE OUTLINE,
16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm
2
-DRAWING NOT TO SCALE-
21-0140
I
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2006 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products, Inc.
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