MAX9986ETP-T [MAXIM]
SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch; SiGe,高线性度,815MHz至995MHz下变频混频器,带有LO缓冲器/开关![MAX9986ETP-T](http://pdffile.icpdf.com/pdf1/p00120/img/icpdf/MAX9986_661379_icpdf.jpg)
型号: | MAX9986ETP-T |
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描述: | SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch |
文件: | 总12页 (文件大小:1032K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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19-3605; Rev 0; 2/05
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
General Description
Features
♦ 815MHz to 995MHz RF Frequency Range
♦ 960MHz to 1180MHz LO Frequency Range
The MAX9986 high-linearity downconversion mixer pro-
vides 10dB gain, +23.6dBm IIP3, and 9.3dB NF for
815MHz to 995MHz base-station receiver applications.
With a 960MHz to 1180MHz LO frequency range, this
particular mixer is ideal for high-side LO injection
receiver architectures. Low-side LO injection is sup-
ported by the MAX9984, which is pin-for-pin and func-
tionally compatible with the MAX9986.
(MAX9986)
♦ 570MHz to 850MHz LO Frequency Range
(MAX9984)
♦ 50MHz to 250MHz IF Frequency Range
♦ 10dB Conversion Gain
♦ +23.6dBm Input IP3
In addition to offering excellent linearity and noise perfor-
mance, the MAX9986 also yields a high level of compo-
nent integration. This device includes a double-balanced
passive mixer core, an IF amplifier, a dual-input LO selec-
table switch, and an LO buffer. On-chip baluns are also
integrated to allow for single-ended RF and LO inputs.
The MAX9986 requires a nominal LO drive of 0dBm, and
supply current is guaranteed to be below 265mA.
♦ +12dBm Input 1dB Compression Point
♦ 9.3dB Noise Figure
♦ 67dBc 2LO-2RF Spurious Rejection at
P
= -10dBm
RF
♦ Integrated LO Buffer
♦ Integrated RF and LO Baluns for Single-Ended
Inputs
The MAX9984/MAX9986 are pin compatible with the
MAX9994/MAX9996 1700MHz to 2200MHz mixers,
making this entire family of downconverters ideal for
applications where a common PC board layout is used
for both frequency bands. The MAX9986 is also func-
tionally compatible with the MAX9993.
♦ Low -3dBm to +3dBm LO Drive
♦ Built-In SPDT LO Switch with 49dB LO1 to LO2
Isolation and 50ns Switching Time
♦ Pin Compatible with MAX9994/MAX9996 1700MHz
to 2200MHz Mixers
The MAX9986 is available in a compact, 20-pin, thin
QFN package (5mm x 5mm) with an exposed paddle.
Electrical performance is guaranteed over the extended
-40°C to +85°C temperature range.
♦ Functionally Compatible with MAX9993
♦ External Current-Setting Resistors Provide Option
for Operating Mixer in Reduced Power/Reduced
Performance Mode
♦ Lead-Free Package Available
Applications
850MHz W-CDMA Base Stations
Ordering Information
GSM 850/GSM 900 2G and 2.5G EDGE Base
Stations
PKG
CODE
PART
TEMP RANGE PIN-PACKAGE
cdmaOne™ and cdma2000® Base Stations
20 Thin QFN-EP*
-40°C to +85°C
MAX9986ETP
MAX9986ETP-T
T2055-3
iDEN® Base Stations
Predistortion Receivers
Fixed Broadband Wireless Access
Wireless Local Loop
Private Mobile Radios
Military Systems
5mm × 5mm
20 Thin QFN-EP*
-40°C to +85°C
T2055-3
T2055-3
T2055-3
5mm × 5mm
20 Thin QFN-EP*
5mm × 5mm
MAX9986ETP+D -40°C to +85°C
20 Thin QFN-EP*
5mm × 5mm
MAX9986ETP+TD -40°C to +85°C
*EP = Exposed paddle.
Microwave Links
Digital and Spread-Spectrum Communication
Systems
+ = Lead free. D = Dry pack. T = Tape-and-reel.
cdma2000 is a registered trademark of the Telecommunications
Industry Association.
cdmaOne is a trademark of CDMA Development Group.
iDEN is a registered trademark of Motorola, Inc.
Pin Configuration/Functional Diagram and Typical
Application Circuit appear at end of data sheet.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
V
to GND...........................................................-0.3V to +5.5V
θ
θ
.................................................................................+38°C/W
.................................................................................+13°C/W
CC
JA
JC
IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (V
+ 0.3V)
CC
TAP........................................................................-0.3V to +1.4V
LO1, LO2, LEXT to GND........................................-0.3V to +0.3V
RF, LO1, LO2 Input Power .............................................+12dBm
RF (RF is DC shorted to GND through a balun) .................50mA
Operating Temperature Range (Note A) ....T = -40°C to +85°C
C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Continuous Power Dissipation (T = +70°C)
A
20-Pin Thin QFN-EP (derate 26.3mW/°C above +70°C)...........2.1W
Note A: T is the temperature on the exposed paddle of the package.
C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(MAX9986 Typical Application Circuit, V
= +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to V
through
CC
CC
inductive chokes, R = 953Ω, R = 619Ω, T = -40°C to +85°C, unless otherwise noted. Typical values are at V
= +5V, T
=
1
2
C
CC
C
+25°C, unless otherwise noted.)
PARAMETER
Supply Voltage
SYMBOL
CONDITIONS
MIN
TYP
5.00
222
MAX
5.25
265
0.8
UNITS
V
4.75
V
mA
V
CC
CC
Supply Current
I
LO_SEL Input-Logic Low
LO_SEL Input-Logic High
V
IL
V
2
V
IH
AC ELECTRICAL CHARACTERISTICS
(MAX9986 Typical Application Circuit, V
= +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources, P
= -3dBm to
LO
CC
+3dBm, P = -5dBm, f = 815MHz to 995MHz, f = 960MHz to 1180MHz, f = 160MHz, f > f , T = -40°C to +85°C, unless
RF
RF
LO
IF
RF
LO
LO
RF
C
otherwise noted. Typical values are at V
= +5V, P = -5dBm, P = 0dBm, f = 910MHz, f = 1070MHz, f = 160MHz, T
=
CC
RF
LO
IF
C
+25°C, unless otherwise noted.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
815
960
570
50
TYP
MAX
995
1180
850
250
11
UNITS
RF Frequency Range
f
(Note 2)
(Note 2)
MAX9984
(Note 2)
MHz
RF
LO Frequency Range
f
MHz
LO
IF Frequency Range
f
IF
MHz
dB
Conversion Gain
G
T
C
C
= +25°C
9
10
C
Gain Variation Over Temperature
T
= -40°C to +85°C
-0.007
dB/°C
Flatness over any one of three frequency bands:
f
f
f
= 824MHz to 849MHz
= 869MHz to 894MHz
= 880MHz to 915MHz
RF
RF
RF
Conversion Gain Flatness
Input Compression Point
0.15
12
dB
P
(Note 3)
dBm
dBm
1dB
Two tones:
f
= 910MHz, f
= 911MHz,
RF1
RF2
Input Third-Order Intercept Point
IIP3
21
23.6
P
P
= -5dBm/tone, f = 1070MHz,
LO
RF
LO
= 0dBm, T = +25°C
A
T
T
= +25°C to -40°C
= +25°C to +85°C
-1.7
Input IP3 Variation Over
Temperature
C
dB
+1.0
C
2
_______________________________________________________________________________________
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX9986 Typical Application Circuit, V
= +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources, P
= -3dBm to
LO
CC
+3dBm, P = -5dBm, f = 815MHz to 995MHz, f = 960MHz to 1180MHz, f = 160MHz, f > f , T = -40°C to +85°C, unless
RF
RF
LO
IF
LO
RF
C
otherwise noted. Typical values are at V
= +5V, P = -5dBm, P = 0dBm, f = 910MHz, f = 1070MHz, f = 160MHz, T
=
CC
RF
LO
RF
LO
IF
C
+25°C, unless otherwise noted.) (Note 1)
PARAMETER SYMBOL
Noise Figure
CONDITIONS
MIN
TYP
MAX
UNITS
NF
Single sideband, f = 190MHz
9.3
dB
IF
P
=
=
f
f
f
f
= 900MHz (no signal)
= 1090MHz
BLOCKER
RF
19
24
+8dBm
LO
Noise Figure Under-Blocking
= 990MHz
dB
BLOCKER
= 190MHz
P
IF
BLOCKER
(Note 4)
+11dBm
P
=
=
BLOCKER
0.3
2
P
= -5dBm
= 910MHz
= 911MHz
FUNDAMENTAL
+8dBm
Small-Signal Compression
Under-Blocking Condition
dB
f
f
FUNDAMENTAL
P
BLOCKER
BLOCKER
+11dBm
LO Drive
-3
+3
dBm
dBc
P
P
P
P
= -10dBm
= -5dBm
= -10dBm
= -5dBm
67
62
87
77
49
50
-47
-30
46
50
20
RF
RF
RF
RF
2 x 2
3 x 3
2LO-2RF
3LO-3RF
Spurious Response at IF
LO2 selected
LO1 selected
42
42
P
= +3dBm
LO
LO1 to LO2 Isolation
dB
T
C
= +25°C (Note 5)
LO Leakage at RF Port
LO Leakage at IF Port
RF-to-IF Isolation
P
P
= +3dBm
= +3dBm
dBm
dBm
dB
LO
LO
LO Switching Time
RF Port Return Loss
50% of LOSEL to IF settled to within 2°
ns
dB
LO1/2 port selected,
LO2/1 and IF terminated
27
26
22
LO Port Return Loss
dB
LO1/2 port unselected,
LO2/1 and IF terminated
LO driven at 0dBm, RF terminated into 50Ω,
differential 200Ω
IF Port Return Loss
dB
Note 1: All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit.
Note 2: Operation outside this range is possible, but with degraded performance of some parameters.
Note 3: Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm.
Note 4: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all
SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021.
Note 5: Guaranteed by design and characterization.
_______________________________________________________________________________________
3
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics
(MAX9986 Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 160MHz, unless otherwise noted.)
LO RF LO RF IF
CC
CONVERSION GAIN vs. RF FREQUENCY
CONVERSION GAIN vs. RF FREQUENCY
CONVERSION GAIN vs. RF FREQUENCY
12
12
11
10
9
12
11
10
9
T
= -40°C
C
11
10
9
T
T
= -25°C
C
P
= -3dBm, 0dBm, +3dBm
V
= 4.75V, 5.0V, 5.25V
LO
CC
T
= +25°C
C
= +85°C
C
8
8
8
7
7
7
890
940
990
740
790
840
1040
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
INPUT IP3 vs. RF FREQUENCY
INPUT IP3 vs. RF FREQUENCY
26
25
24
23
22
21
20
19
26
25
24
23
22
21
20
19
26
25
24
23
22
21
20
19
T
= +85°C
C
V
= 4.75V
CC
CC
P
= +3dBm, 0dBm, -3dBm
LO
V
= 5.0V
V
= 5.25V
CC
T
= +25°C
C
T
= -25°C
C
T
= -40°C
C
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
NOISE FIGURE vs. RF FREQUENCY
NOISE FIGURE vs. RF FREQUENCY
NOISE FIGURE vs. RF FREQUENCY
12
11
10
9
12
11
10
9
12
11
10
9
IF = 190MHz
IF = 190MHz
IF = 190MHz
T
= +85°C
C
T
= +25°C
C
P
= +3dBm, 0dBm, -3dBm
LO
V
= 4.75V, 5.0V, 5.25V
CC
8
8
8
T
= -40°C
C
T
= -25°C
C
7
7
7
6
6
6
760
820
880
940
1000
760
820
880
940
1000
760
820
880
940
1000
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
4
_______________________________________________________________________________________
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9986 Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 160MHz, unless otherwise noted.)
LO RF LO RF IF
CC
2LO-2RF RESPONSE vs. RF FREQUENCY
2LO-2RF RESPONSE vs. RF FREQUENCY
2LO-2RF RESPONSE vs. RF FREQUENCY
75
70
65
60
55
50
45
75
70
65
60
55
50
45
75
70
65
60
55
50
45
P
= -5dBm
= +3dBm
P
= -5dBm
P
= -5dBm
RF
P
= 0dBm
LO
RF
RF
T
= +85°C
C
V
= 5.25V
P
CC
LO
T
= -40°C, -25°C
C
P
= -3dBm
LO
T
= +25°C
C
V
= 4.75V
CC
V
= 5.0V
CC
990
740
790
840
890
940
1040
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
3LO-3RF RESPONSE vs. RF FREQUENCY
3LO-3RF RESPONSE vs. RF FREQUENCY
3LO-3RF RESPONSE vs. RF FREQUENCY
95
90
85
80
75
70
65
60
55
95
90
85
80
75
70
65
60
55
95
90
85
80
75
70
65
60
55
P
= -5dBm
P
= -5dBm
P
= -5dBm
RF
RF
RF
T
= +25°C
C
T
= +85°C
C
P
= -3dBm, 0dBm, +3dBm
V
= 4.75V, 5.0V, 5.25V
LO
CC
T
= -25°C
C
T
= -40°C
C
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT P
vs. RF FREQUENCY
INPUT P
vs. RF FREQUENCY
INPUT P
vs. RF FREQUENCY
1dB
1dB
1dB
14
13
12
11
10
9
14
13
12
11
10
9
14
13
12
11
10
9
T
= +25°C
C
V
V
= 5.25V
CC
T
= +85°C
C
P
= -3dBm, 0dBm, +3dBm
LO
V
= 4.75V
CC
T
= -40°C
= 5.0V
C
T
= -25°C
CC
C
8
8
8
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
_______________________________________________________________________________________
5
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9986 Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 160MHz, unless otherwise noted.)
LO RF LO RF IF
CC
LO SWITCH ISOLATION
vs. LO FREQUENCY
LO SWITCH ISOLATION
vs. LO FREQUENCY
LO SWITCH ISOLATION
vs. LO FREQUENCY
60
60
55
50
45
40
60
55
50
45
40
55
T
= -40°C, -25°C
C
50
45
40
V
= 4.75V, 5.0V, 5.25V
CC
P
= -3dBm, 0dBm, +3dBm
LO
T
= +85°C
C
T
= +25°C
C
900
950
1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
900
950
1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
900
950
1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
-10
-15
-20
-25
-30
-35
-40
-10
-15
-20
-25
-30
-35
-40
-10
-15
-20
-25
-30
-35
-40
V
= 5.25V
CC
T
= -40°C, -25°C
P
= -3dBm
C
LO
V
= 5.0V
CC
T
= +85°C
C
T
= +25°C
C
P
= +3dBm
LO
V
= 4.75V
P
= 0dBm
CC
LO
900
950
1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
900
950
1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
900
950
1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
-30
-40
-50
-60
-30
-40
-50
-60
-30
-40
-50
-60
P
= -3dBm, 0dBm, +3dBm
LO
V
= 4.75V, 5.0V, 5.25V
CC
T
= -40°C, -25°C
C
T
= +25°C
C
T
= +85°C
C
900
950
1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
900
950 1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
900
950 1000 1050 1100 1150 1200
LO FREQUENCY (MHz)
6
_______________________________________________________________________________________
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9986 Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 160MHz, unless otherwise noted.)
LO RF LO RF IF
CC
RF-TO-IF ISOLATION
vs. RF FREQUENCY
RF-TO-IF ISOLATION
vs. RF FREQUENCY
RF-TO-IF ISOLATION
vs. RF FREQUENCY
60
60
55
50
45
40
35
30
60
55
50
45
40
35
30
V
= 4.75V, 5.0V, 5.25V
P
= 0dBm
CC
LO
55
T
= +85°C
C
T
= +25°C
C
P
= -3dBm
LO
50
45
40
35
30
P
= +3dBm
LO
T
= -40°C, -25°C
C
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
740
790
840
890
940
990 1040
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF PORT RETURN LOSS
vs. RF FREQUENCY
IF PORT RETURN LOSS
vs. IF FREQUENCY
LO SELECTED RETURN LOSS
vs. LO FREQUENCY
0
5
0
5
0
10
P
= -3dBm, 0dBm, +3dBm
10
15
20
25
30
35
40
LO
10
15
20
25
30
P
= +3dBm
LO
20
30
40
50
P
= -3dBm
LO
P
= 0dBm
LO
V
= 4.75V, 5.0V, 5.25V
CC
35
40
740
800
860
920
980 1040 1100
50
100
150
200
250
300
350
700
800
900 1000 1100 1200 1300
LO FREQUENCY (MHz)
RF FREQUENCY (MHz)
IF FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS
vs. LO FREQUENCY
SUPPLY CURRENT
vs. TEMPERATURE (T )
C
0
240
V
= 5.25V
CC
10
230
220
P
= -3dBm, 0dBm, +3dBm
LO
20
30
40
50
210
200
V
= 5.0V
CC
V
= 4.75V
10
CC
700
800
900 1000 1100 1200 1300
LO FREQUENCY (MHz)
-40
-15
35
60
85
TEMPERATURE (°C)
_______________________________________________________________________________________
7
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
Pin Description
PIN
NAME
FUNCTION
Power-Supply Connection. Bypass each V
Application Circuit.
pin to GND with capacitors as shown in the Typical
CC
1, 6, 8, 14
V
CC
Single-Ended 50Ω RF Input. This port is internally matched and DC shorted to GND through a balun.
Requires an external DC-blocking capacitor.
2
3
RF
Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the
Typical Application Circuit.
TAP
GND
4, 5, 10, 12,
13, 17
Ground
7
9
LOBIAS
LOSEL
LO1
Bias Resistor for Internal LO Buffer. Connect a 619Ω 1% resistor from LOBIAS to the power supply.
Local Oscillator Select. Logic control input for selecting LO1 or LO2.
Local Oscillator Input 1. Drive LOSEL low to select LO1.
11
15
LO2
Local Oscillator Input 2. Drive LOSEL high to select LO2.
External Inductor Connection. Connect a low-ESR, 30nH inductor from LEXT to GND. This inductor
carries approximately 140mA DC current.
16
LEXT
Differential IF Outputs. Each output requires external bias to V
Typical Application Circuit).
through an RF choke (see the
CC
18, 19
IF-, IF+
20
EP
IFBIAS
GND
IF Bias Resistor Connection for IF Amplifier. Connect a 953Ω 1% resistor from IFBIAS to GND.
Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias.
RF Input and Balun
Detailed Description
The MAX9986 RF input is internally matched to 50Ω,
requiring no external matching components. A DC-
blocking capacitor is required because the input is inter-
nally DC shorted to ground through the on-chip balun.
The MAX9986 high-linearity downconversion mixer
provides 10dB of conversion gain and +23.6dBm of
IIP3, with a typical 9.3dB noise figure. The integrated
baluns and matching circuitry allow for 50Ω single-
ended interfaces to the RF and the two LO ports. A sin-
gle-pole, double-throw (SPDT) switch provides 50ns
switching time between the two LO inputs with 49dB of
LO-to-LO isolation. Furthermore, the integrated LO
buffer provides a high drive level to the mixer core,
reducing the LO drive required at the MAX9986’s
inputs to a -3dBm to +3dBm range. The IF port incor-
porates a differential output, which is ideal for provid-
ing enhanced IIP2 performance.
LO Inputs, Buffer, and Balun
The MAX9986 is ideally suited for high-side LO injec-
tion applications with a 960MHz to 1180MHz LO fre-
quency range. For a device with a 570MHz to 850MHz
LO frequency range, refer to the MAX9984 data sheet.
As an added feature, the MAX9986 includes an internal
LO SPDT switch that can be used for frequency-hop-
ping applications. The switch selects one of the two
single-ended LO ports, allowing the external oscillator
to settle on a particular frequency before it is switched
in. LO switching time is typically less than 50ns, which
is more than adequate for virtually all GSM applica-
tions. If frequency hopping is not employed, set the
switch to either of the LO inputs. The switch is con-
trolled by a digital input (LOSEL): logic-high selects
LO2, logic-low selects LO1. To avoid damage to the
Specifications are guaranteed over broad frequency
ranges to allow for use in cellular band GSM,
cdma2000, iDEN, and W-CDMA 2G/2.5G/3G base sta-
tions. The MAX9986 is specified to operate over a
815MHz to 995MHz RF frequency range, a 960MHz to
1180MHz LO frequency range, and a 50MHz to
250MHz IF frequency range. Operation beyond these
ranges is possible; see the Typical Operating
Characteristics for additional details.
part, voltage must be applied to V
before digital
CC
logic is applied to LOSEL. LO1 and LO2 inputs are
internally matched to 50Ω, requiring only a 82pF DC-
blocking capacitor.
8
_______________________________________________________________________________________
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
A two-stage internal LO buffer allows a wide input
power range for the LO drive. All guaranteed specifica-
tions are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO inputs to the IF out-
puts are integrated on-chip.
optimize the performance for a particular frequency
band. Since approximately 140mA flows through this
inductor, it is important to use a low-DCR wire-wound coil.
If the LO-to-IF and RF-to-IF leakage are not critical
parameters, the inductor can be replaced by a short
circuit to ground.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that mul-
tiple vias be used to connect this pad to the lower level
ground planes. This method provides a good RF/ther-
mal conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX9986 Evaluation Kit can be used as a
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
High-Linearity Mixer
The core of the MAX9986 is a double-balanced, high-
performance passive mixer. Exceptional linearity is pro-
vided by the large LO swing from the on-chip LO
buffer. When combined with the integrated IF ampli-
fiers, the cascaded IIP3, 2LO-2RF rejection, and NF
performance is typically 23.6dBm, 67dBc, and 9.3dB,
respectively.
Differential IF Output Amplifier
The MAX9986 mixer has a 50MHz to 250MHz IF fre-
quency range. The differential, open-collector IF output
ports require external pullup inductors to V . Note that
CC
these differential outputs are ideal for providing
enhanced 2LO-2RF rejection performance. Single-
ended IF applications require a 4:1 balun to transform
the 200Ω differential output impedance to a 50Ω single-
ended output.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V
pin and
CC
TAP with the capacitors shown in the Typical Application
Circuit; see Table 1. Place the TAP bypass capacitor to
ground within 100 mils of the TAP pin.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω. No
matching components are required. RF and LO inputs
require only DC-blocking capacitors for interfacing.
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9986’s 20-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
which the MAX9986 is mounted be designed to con-
duct heat from the EP. In addition, provide the EP with
a low-inductance path to electrical ground. The EP
MUST be soldered to a ground plane on the PC board,
either directly or through an array of plated via holes.
The IF output impedance is 200Ω (differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance down to a 50Ω single-
ended output (see the Typical Application Circuit).
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are
optimized by fine tuning resistors R1 and R2. If
reduced current is required at the expense of perfor-
mance, contact the factory for details. If the 1% bias
resistor values are not readily available, substitute stan-
dard 5% values.
Chip Information
TRANSISTOR COUNT: 1017
PROCESS: SiGe BiCMOS
LEXT Inductor
LEXT serves to improve the LO-to-IF and RF-to-IF leak-
age. The inductance value can be adjusted by the user to
_______________________________________________________________________________________
9
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
Table 1. Component List Referring to the Typical Application Circuit
COMPONENT
VALUE
330nH
30nH
DESCRIPTION
Wire-wound high-Q inductors (0805)
L1, L2
L3
Wire-wound high-Q inductor (0603)
Microwave capacitor (0603)
Microwave capacitors (0603)
Microwave capacitors (0603)
Microwave capacitor (0402)
1% resistor (0603)
C1
10pF
C2, C4, C7, C8, C10, C11, C12
82pF
C3, C5, C6, C9, C13, C14
0.01µF
220pF
953Ω
C15
R1
R2
R3
T1
619Ω
1% resistor (0603)
3.57Ω
4:1 balun
MAX9986
1% resistor (1206)
IF balun
U1
Maxim IC
Pin Configuration/Functional Diagram
20
18
19
16
17
V
CC
1
2
3
4
15
14
13
12
11
LO2
V
CC
RF
MAX9986
TAP
GND
GND
LO1
GND
GND
5
6
7
8
9
10
THIN QFN
10 ______________________________________________________________________________________
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
Typical Application Circuit
V
CC
T1
3
6
4
IF
R3
OUTPUT
L1
L2
2
C13
1
C15
17
C14
R1
L3
V
CC
19
18
16
20
C12
C3
C2
V
CC
LO2
LO2
INPUT
1
2
3
4
5
15
C1
MAX9986
V
CC
RF
INPUT
RF
TAP
14
13
12
11
V
CC
C11
C5
GND
GND
C4
GND
GND
C10
LO1
INPUT
LO1
6
7
8
9
10
R2
C7
V
CC
LOSEL
INPUT
C6
C8
C9
V
CC
______________________________________________________________________________________ 11
SiGe High-Linearity, 815MHz to 995MHz
Downconversion Mixer with LO Buffer/Switch
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
D2
D
b
0.10 M
C A B
C
L
D2/2
D/2
k
L
MARKING
XXXXX
E/2
E2/2
C
(NE-1) X
e
L
E2
E
PIN # 1 I.D.
0.35x45°
DETAIL A
e/2
PIN # 1
I.D.
e
(ND-1) X
e
DETAIL B
e
L
C
C
L
L1
L
L
L
e
e
0.10
C
A
0.08
C
C
A3
A1
PACKAGE OUTLINE,
16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm
1
21-0140
H
-DRAWING NOT TO SCALE-
2
COMMON DIMENSIONS
20L 5x5 28L 5x5
EXPOSED PAD VARIATIONS
D2 E2
MIN. NOM. MAX. MIN. NOM. MAX. ±0.15
PKG.
SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX.
16L 5x5
32L 5x5
40L 5x5
DOWN
BONDS
ALLOWED
L
PKG.
CODES
A
0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80
T1655-1
T1655-2
3.00 3.10 3.20 3.00 3.10 3.20
3.00 3.10 3.20 3.00 3.10 3.20
NO
**
**
**
**
A1
A3
b
0
0.02 0.05
0.20 REF.
0
0.02 0.05
0.20 REF.
0
0.02 0.05
0.20 REF.
0
0.02 0.05
0.20 REF.
0
0.02 0.05
0.20 REF.
YES
NO
T1655N-1 3.00 3.10 3.20 3.00 3.10 3.20
0.25 0.30 0.35 0.25 0.30 0.35 0.20 0.25 0.30 0.20 0.25 0.30 0.15 0.20 0.25
4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10
4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10
T2055-2
T2055-3
T2055-4
T2055-5
3.00 3.10 3.20 3.00 3.10 3.20
3.00 3.10 3.20 3.00 3.10 3.20
3.00 3.10 3.20 3.00 3.10 3.20
NO
YES
NO
D
E
**
**
e
0.80 BSC.
0.25
0.65 BSC.
0.25
0.50 BSC.
0.25
0.50 BSC.
0.25
0.40 BSC.
YES
3.15 3.25 3.35 3.15 3.25 3.35 0.40
k
-
-
-
-
-
-
-
-
0.25 0.35 0.45
T2855-1
T2855-2
3.15 3.25 3.35 3.15 3.25 3.35
2.60 2.70 2.80 2.60 2.70 2.80
NO
NO
L
**
**
**
**
0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50 0.40 0.50 0.60
L1
-
-
-
-
-
-
-
-
-
-
-
-
0.30 0.40 0.50
40
T2855-3
T2855-4
3.15 3.25 3.35 3.15 3.25 3.35
2.60 2.70 2.80 2.60 2.70 2.80
2.60 2.70 2.80 2.60 2.70 2.80
3.15 3.25 3.35 3.15 3.25 3.35
YES
YES
NO
N
ND
NE
16
20
28
32
4
4
5
5
7
7
8
8
10
10
T2855-5
T2855-6
T2855-7
T2855-8
**
**
**
WHHB
WHHC
WHHD-1
WHHD-2
-----
JEDEC
NO
YES
2.80
3.35
3.35
3.20
2.60 2.70
3.15 3.25
2.60 2.70 2.80
3.15 3.25 3.35
3.15 3.25 3.35
3.00 3.10 3.20
0.40
YES
NO
NO
NOTES:
T2855N-1 3.15 3.25
**
**
**
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
T3255-2
T3255-3
T3255-4
3.00 3.10
3.00 3.10 3.20 3.00 3.10 3.20
3.00 3.10 3.20 3.00 3.10 3.20
YES
NO
**
**
**
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL
CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE
OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1
IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
NO
T3255N-1 3.00 3.10 3.20 3.00 3.10 3.20
T4055-1 3.20 3.30 3.40 3.20 3.30 3.40
YES
**SEE COMMON DIMENSIONS TABLE
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN
0.25 mm AND 0.30 mm FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1,
T2855-3, AND T2855-6.
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY.
12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY.
13. LEAD CENTERLINES TO BE AT TRUE POSITION AS DEFINED BY BASIC DIMENSION "e", ±0.05.
PACKAGE OUTLINE,
16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm
2
-DRAWING NOT TO SCALE-
21-0140
H
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2005 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products, Inc.
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