MAX3740AETG [MAXIM]

3.2Gbps SFP VCSEL Driver with Diagnostic Monitors; 的3.2Gbps SFP VCSEL驱动器,带有诊断监视器
MAX3740AETG
型号: MAX3740AETG
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

3.2Gbps SFP VCSEL Driver with Diagnostic Monitors
的3.2Gbps SFP VCSEL驱动器,带有诊断监视器

驱动器 监视器
文件: 总14页 (文件大小:286K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
19-3118; Rev 1; 6/04  
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
Ge n e ra l De s c rip t io n  
Fe a t u re s  
The MAX3740A is a high-speed VCSEL driver for small-  
form-factor (SFF) and small-form-factor pluggable (SFP)  
fiber optic LAN transmitters. It contains a bias genera-  
tor, a laser modulator, and comprehensive safety fea-  
tures. The automatic power control (APC) adjusts the  
laser bias current to maintain average optical power  
over changes in temperature and laser properties. The  
driver accommodates common cathode and differential  
configurations.  
Supports all SFF-8472 Digital Diagnostics  
2mA to 15mA Modulation Current  
1mA to 15mA Bias Current  
Optional Peaking Current to Improve VCSEL Edge  
Speed  
Supports Common Cathode and Differential  
Configuration  
The MAX3740A operates up to 3.2Gbps. It can switch  
up to 15mA of laser modulation current and source up  
to 15mA of bias current. Adjustable temperature com-  
pensation is provided to keep the optical extinction  
ratio within specifications over the operating tempera-  
ture range. The MAX3740A interfaces with the Dallas  
DS1858 to me e t SFF-8472 timing a nd d ia g nos tic  
requirements. The MAX3740A accommodates various  
VCSEL packages, including low-cost TO-46 headers.  
Automatic Power Control  
Safety Circuits Compliant with SFF and SFP  
MSAs  
4mm 4mm 24-Pin Thin QFN Package  
Ord e rin g In fo rm a t io n  
The MAX3740A safety circuit detects faults that could  
cause hazardous light levels and disables the VCSEL  
output. The safety circuits are compliant with SFF and  
SFP multisource agreements (MSA).  
PART  
TEMP RANGE PIN-PACKAGE  
MAX3740AETG  
-40°C to +85°C 24 Thin QFN (4mm x 4mm)  
MAX3740AETG+ -40°C to +85°C 24 Thin QFN (4mm x 4mm)  
+Denotes lead-free package.  
The MAX3740A is available in a compact 4mm 4mm,  
24-pin thin QFN package and operates over the -40°C  
to +85°C temperature range.  
Ap p lic a t io n s  
Typ ic a l Ap p lic a t io n Circ u it  
Multirate (1Gbps to 3.2Gbps) SFP/SFF Modules  
Gigabit Ethernet Optical Transmitters  
Fibre Channel Optical Transmitters  
Infiniband Optical Transmitters  
+3.3V  
4.7kΩ  
V
CC  
FAULT  
PWRMON  
MODSET  
TX_DISABLE  
SQUELCH  
R
MODSET  
REF  
MAX3740A  
0.1µF  
0.1µF  
IN+  
COMP  
R
PWRSET  
0.047µF  
MD  
IN-  
BIAS  
TC1  
R
TC  
L1*  
0.01µF  
0.01µF  
TC2  
OUT+  
C
F
BIASSET  
OUT-  
R
BIASSET  
GND  
PEAKSET  
BIASMON  
R
F
50Ω  
R
PEAKSET  
R
BIASMON  
OPTIONAL COMPONENT  
*FERRITE BEAD  
________________________________________________________________ Maxim Integrated Products  
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at  
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.  
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage (V ) ..............................................-0.5V to 6.0V  
Continuous Power Dissipation (T = +85°C)  
A
CC  
Voltage at TX_DISABLE, IN+, IN-, FAULT,  
SQUELCH TC1, TC2, MODSET, PEAKSET, BIASSET,  
BIAS, BIASMON, COMP, MD, REF,  
24-Lead Thin QFN  
(derate 20.8mW/°C above +85°C).................................1354mW  
Operating Temperature Range ...........................-40°C to +85°C  
Storage Temperature Range .............................-55°C to +150°C  
Lead Temperature (soldering, 10s) .................................+300°C  
PWRMON ...............................................-0.5V to (V + 0.5V)  
CC  
Voltage at OUT+, OUT-.........................(V - 2V) to (V + 2V)  
CC  
CC  
Current into FAULT ............................................ -1mA to +25mA  
Current into OUT+, OUT-....................................................60mA  
Stresses beyond those listed under Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
(V = +2.97V to +3.63V, T = -40°C to +85°C. Typical values are at V = +3.3V, TC1 and TC2 are shorted, PEAKSET open, T  
=
CC  
A
CC  
A
+25°C, unless otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
SQUELCH set low,  
I
= 2mA  
32  
MOD  
P-P  
TX_DISABLE set low,  
peaking is not used  
(Note 1)  
I
= 15mA  
55  
15  
68  
20  
MOD  
P-P  
I
CC  
Supply Current  
mA  
Additional current when peaking is used  
(Note 2)  
Additional current when SQUELCH is high  
Total current when TX_DISABLE is high  
5
10  
5
I
3.9  
CC-SHDN  
FAULT OUTPUT  
Output High Voltage  
Output Low Voltage  
TX_DISABLE INPUT  
Input Impedance  
V
R
R
= 10kto 2.97V  
= 4.7kto 3.63V  
2.4  
V
V
OH  
LOAD  
V
0.4  
10.0  
0.8  
OL  
LOAD  
4.7  
2.0  
kΩ  
V
Input High Voltage  
Input Low Voltage  
V
IH  
V
V
IL  
The time for I to reach I  
TX_DISABLE transitions high  
when  
CC  
CC-SHDN  
Power-Down Time  
50  
µs  
SQUELCH  
Squelch Threshold  
25  
10  
85  
mV  
P-P  
Squelch Hysteresis  
mV  
P-P  
Time to Squelch Data  
Time to Resume from Squelch  
BIAS GENERATOR (Note 4)  
(Note 3)  
(Note 3)  
0.02  
0.02  
5.00  
5.00  
µs  
µs  
Minimum  
Maximum  
1
Bias Current  
I
mA  
%
BIAS  
15  
-8  
5mA I  
1mA I  
15mA  
5mA  
+8  
BIAS  
BIAS  
Accuracy of Programmed Bias  
Current  
BIAS  
-12  
+12  
2
_______________________________________________________________________________________  
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
ELECTRICAL CHARACTERISTICS (continued)  
(V = +2.97V to +3.63V, T = -40°C to +85°C. Typical values are at V = +3.3V, TC1 and TC2 are shorted, PEAKSET open, T  
=
CC  
A
CC  
A
+25°C, unless otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Bias Current During Fault  
I
Current out of the BIAS pin  
1.5  
10  
µA  
BIAS_OFF  
1mA < I  
< 3mA  
0.0875  
0.085  
-10  
0.105 0.1375  
BIAS  
BIAS  
BIASMON Gain  
mA/mA  
%
3mA I  
15mA  
0.105  
0.125  
+10  
BIASMON Stability  
(Notes 5,6)  
AUTOMATIC POWER CONTROL (APC)  
V
-
REF  
MD Nominal Voltage  
V
APC loop is closed  
1
2
V
MD  
0.2  
1.8  
0
Voltage at REF  
V
REF  
1.2  
2.2  
V
V
MD Voltage During Fault  
MD Input Current  
Normal operation (FAULT = low)  
-2  
5
0.7  
20  
+2  
µA  
µs  
APC Time Constant  
C
= 0.047µF (Note 6)  
COMP  
PWRMON Nominal Gain  
LASER MODULATOR (Note 7)  
V
/ (V  
- V )  
MD  
1.85  
2.15  
2.45  
250  
V/V  
PWRMON  
REF  
Minimum  
Maximum  
Data Input Voltage Swing  
Output Resistance  
V
mV -  
P P  
ID  
2200  
15  
Single-ended resistance at OUT+  
Single-ended resistance at OUT-  
Minimum  
80  
72  
105  
100  
2
Modulation Current  
I
mA -  
P P  
MOD  
Maximum  
Minimum Peaking Current Range  
Maximum Peaking Current Range  
Peaking Current Duration  
0.2  
2
mA  
mA  
ps  
80  
Tolerance of Programmed  
Modulation Current  
TC1 is shorted to TC2  
-10  
+10  
%
Minimum Programmable  
Temperature Coefficient  
0
ppm/°C  
Maximum Programmable  
Temperature Coefficient  
Temperature range 0°C to +70°C  
+5000  
ppm/°C  
ps  
Modulation Transition Time  
Deterministic Jitter  
Random Jitter  
t , t  
R
5mA I  
5mA I  
15mA, 20% to 80% (Note 6)  
15mA, 3.2Gbps (Notes 6, 8)  
65  
12  
95  
20  
4
F
MOD  
DJ  
RJ  
ps  
P-P  
MOD  
(Note 6)  
1.3  
ps  
RMS  
Laser Modulation During Fault or  
while Squelch is Active  
I
15  
50  
µA  
P-P  
MOD_OFF  
Input Resistance  
Differential resistance  
85  
100  
115  
V
0.3  
-
CC  
Input Bias Voltage  
V
IN  
V
_______________________________________________________________________________________  
3
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
ELECTRICAL CHARACTERISTICS (continued)  
(V = +2.97V to +3.63V, T = -40°C to +85°C. Typical values are at V = +3.3V, TC1 and TC2 are shorted, PEAKSET open, T  
=
CC  
A
CC  
A
+25°C, unless otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
SAFETY FEATURES (see the Typical Operating Characteristics section)  
High-Current Fault Threshold > V causes a fault  
Fault Threshold  
V
V
0.7  
-0.250  
0.7  
0.8  
-0.2  
0.8  
0.9  
-0.150  
0.9  
V
V
V
BMTH  
BIASMON  
BMTH  
V
BIAS  
V
V
referenced to V  
BTH  
BIAS CC  
Power-Monitor Fault Threshold  
V
PMTH  
V
> V  
causes a fault  
PWRMON  
PMTH  
Time from rising edge of TX_DISABLE to  
= I and I = I  
(Note 6)  
TX Disable Time  
t_  
I
1.8  
55  
5
µs  
µs  
OFF  
BIAS  
BIAS_OFF  
MOD  
MOD_OFF  
Time from rising edge of TX_DISABLE to  
and I at 99% of steady state  
TX Disable Negate Time  
t_  
I
500  
ON  
BIAS  
MOD  
(Note 6)  
Time to set V  
after rising edge of TX_DISABLE (Note 6)  
= low after power-on or  
FAULT  
Fault Reset Time  
Power-On Time  
t_  
t_  
1
60  
60  
200  
200  
ms  
ms  
INIT  
Time after power-on to transmitter-on with  
TX_DISABLE low (Note 6)  
2
INIT  
Time from fault occurrence to V  
=
FAULT  
Fault Assert Time  
t_  
high; C  
(Note 6)  
< 20pF, R = 4.7kΩ  
FAULT  
1.4  
1
50  
µs  
FAULT  
FAULT  
Time from fault to I  
= I  
BIAS_OFF  
and  
BIAS  
Fault Delay Time  
t_  
5
1
µs  
µs  
FLTDLY  
I
= I  
(Note 6)  
MOD  
MOD_OFF  
Time TX_DISABLE must be held high to  
reset FAULT (Note 6)  
TX_DISABLE Reset  
t_  
RESET  
Note 1: Supply current measurements exclude I  
from the total current.  
BIAS  
Note 2: Tested with R  
= 1.18k.  
PEAK  
Note 3: Measured by applying a pattern that contains 20µs of K28.5, followed by 5µs of zeros, then 20µs of K28.5, followed by 5µs  
of ones. Data rate is equal to 2.5Gbps, with inputs filtered using 1.8GHz Bessel filters.  
Note 4: V  
< V - 0.7V.  
CC  
BIAS  
Note 5: Variation of bias monitor gain for any single part over the range of V , temperature, 3mA < I  
< 15mA.  
CC  
BIAS  
Note 6: Guaranteed by design and characterization.  
Note 7: Measured electrically with a 50load AC-coupled to OUT+.  
Note 8: Deterministic jitter is the peak-to-peak deviation from the ideal time crossings measured with a K28.5 bit pattern at 3.2Gbps  
4
_______________________________________________________________________________________  
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s  
(V = +3.3V, R = 0, PEAKSET open, measured electrically with a 50load AC-coupled to OUT+, T = +25°C, unless otherwise  
CC  
TC  
A
noted.)  
ELECTRICAL EYE WITH MAX PEAKING  
MAX3740A toc03  
ELECTRICAL EYE  
ELECTRICAL EYE WITH PEAKING  
MAX3740A toc02  
MAX3740A toc01  
3.2Gbps, K28.5, 10mA MODULATION,  
R
= 500  
PEAKSET  
3.2Gbps, K28.5, 10mA MODULATION,  
PEAKING OFF  
3.2Gbps, K28.5, 10mA MODULATION,  
R
= 2.4kΩ  
PEAKSET  
73mV/div  
73mV/div  
73mV/div  
50ps/div  
50ps/div  
50ps/div  
I
vs. BIAS CURRENT  
OPTICAL EYE  
OPTICAL EYE  
BIASMON  
MAX3740A toc04  
MAX3740A toc05  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
E = 8.2dB, 2.125Gbps, K28.5,  
R
850nm VCSEL, WITH 2.3GHz  
O-TO-E CONVERTER  
E = 8.2dB, 2.5Gbps, K28.5,  
R
850nm VCSEL SONET MASK  
WITH +20% MARGIN  
EMCORE SC-TOSA-8585-3420 VCSEL  
68ps/div  
EMCORE SC-TOSA-8585-3420 VCSEL  
58ps/div  
0
4
8
12  
16  
BIAS CURRENT (mA)  
TRANSITION TIME  
vs. MODULATION CURRENT  
DETERMINISTIC JITTER  
vs. MODULATION CURRENT  
RANDOM JITTER  
vs. MODULATION CURRENT  
100  
90  
80  
70  
60  
50  
40  
40  
35  
30  
25  
20  
15  
10  
5
7
6
5
4
3
2
1
0
RISE  
FALL  
0
2
4
6
8
10  
(mA  
12  
14  
16  
0
5
10  
15  
0
5
10  
15  
I
)
I
(mA  
)
I
(mA )  
P-P  
MOD  
P-P  
MOD  
P-P  
MOD  
_______________________________________________________________________________________  
5
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s (c o n t in u e d )  
(V = +3.3V, R = 0, PEAKSET open, measured electrically with a 50load AC-coupled to OUT+, T = +25°C, unless otherwise  
CC  
TC  
A
noted.)  
MONITOR DIODE CURRENT  
BIAS CURRENT vs. R  
MODULATION CURRENT vs. R  
vs. R  
BIASSET  
MODSET  
PWRSET  
10m  
1m  
100m  
10m  
1m  
100m  
10m  
1m  
MEASURED WITH A  
50ELECTRICAL LOAD  
100µ  
10µ  
1µ  
100µ  
100  
1k  
10k  
1k  
10k  
100k  
100  
1k  
10k  
R
()  
R
()  
R
()  
PWRSET  
BIASSET  
MODSET  
SUPPLY CURRENT vs. TEMPERATURE  
INPUT RETURN LOSS  
OUTPUT RETURN LOSS  
80  
70  
60  
50  
40  
30  
20  
10  
0
-5  
0
-2  
DIFFERENTIAL  
MEASUREMENT  
SINGLE-ENDED  
MEASUREMENT  
I
= 15mA  
MOD  
-4  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-6  
-8  
-10  
-12  
-14  
-16  
-18  
I
= 2mA  
60  
MOD  
-40  
-15  
10  
35  
85  
100M  
1G  
10G  
100M  
1G  
10G  
TEMPERATURE (°C)  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
MODULATION CURRENT  
vs. TEMPERATURE  
MONITOR DIODE CURRENT  
vs. TEMPERATURE  
MODULATION CURRENT TEMPCO  
vs. R  
TC  
11  
10  
9
300  
275  
250  
225  
200  
175  
150  
125  
100  
5500  
R
= 100Ω  
TC  
REFERENCED TO +25°C  
R
= 1.35kΩ  
MOD  
4500  
3500  
2500  
1500  
500  
R
= 1kΩ  
TC  
R
TC  
= 5kΩ  
8
R
TC  
= 10kΩ  
7
R
= 60kΩ  
TC  
R
TC  
= 100kΩ  
6
R
= 500kΩ  
TC  
5
4
-500  
0
10 20 30 40 50 60 70 80 90  
-40  
-15  
10  
35  
60  
85  
100  
1k  
10k  
()  
100k  
1M  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
R
TC  
6
_______________________________________________________________________________________  
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s (c o n t in u e d )  
(V = +3.3V, R = 0, PEAKSET open, measured electrically with a 50load AC-coupled to OUT+, T = +25°C, unless otherwise  
CC  
TC  
A
noted.)  
TX_DISABLE NEGATE TIME  
HOT PLUG WITH TX_DISABLE LOW  
STARTUP WITH SLOW RAMPING SUPPLY  
MAX3740A toc21  
MAX3740A toc19  
MAX3740A toc20  
3.3V  
3.3V  
3.3V  
V
CC  
V
CC  
V
CC  
OV  
OV  
FAULT  
FAULT  
FAULT  
LOW  
HIGH  
LOW  
LOW  
t_INIT = 62ms  
LOW  
TX_DISABLE  
TX_DISABLE  
TX_DISABLE  
t_INIT = 60ms  
20ms/div  
t_ON = 54µs  
20µs/div  
LOW  
LOW  
LASER  
OUTPUT  
LASER  
OUTPUT  
LASER  
OUTPUT  
20ms/div  
TRANSMITTER DISABLE  
RESPONSE TO FAULT  
MAX3740A toc22  
MAX3740A toc23  
3.3V  
EXTERNALLY  
FORCED  
FAULT  
V
CC  
V
PWRMON  
t_OFF = 1.86µs  
t_FAULT = 245ns  
FAULT  
FAULT  
LOW  
LOW  
LOW  
LOW  
HIGH  
TX_DISABLE  
TX_DISABLE  
HIGH  
LASER  
LASER  
OUTPUT  
OUTPUT  
1µs/div  
200ns/div  
FAULT RECOVERY TIME  
FREQUENT ASSERTION OF TX_DISABLE  
MAX3740A toc24  
MAX3740A toc25  
EXTERNAL  
FAULT  
REMOVED  
EXTERNALLY  
FORCED FAULT  
V
V
PWRMON  
PWRMON  
FAULT  
FAULT  
HIGH  
LOW  
LOW  
HIGH  
TX_DISABLE  
TX_DISABLE  
LOW  
t_INIT = 54µs  
LASER  
LASER  
OUTPUT  
OUTPUT  
40µs/div  
200µs/div  
_______________________________________________________________________________________  
7
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
P in De s c rip t io n  
PIN  
NAME  
FUNCTION  
1, 10, 13  
GND  
Ground  
Transmit Disable. Driver output is disabled when TX_DISABLE is high or left unconnected. The  
driver output is enabled when the pin is asserted low.  
2
TX_DISABLE  
3
4
IN+  
IN-  
Noninverted Data Input  
Inverted Data Input  
Fault Indicator. Open-drain output with ESD protection. FAULT is asserted high during a  
fault condition.  
5
FAULT  
Squelch Enable. Squelch is enabled when the pin is set high. Squelch is disabled when the pin is  
set low or left open.  
6
7, 16, 20  
8
SQUELCH  
V
CC  
+3.3V Supply Voltage  
Temperature Compensation Set Pin 1. A resistor placed between TC1 and TC2 (R ) programs the  
TC  
temperature coefficient of the modulation current.  
TC1  
Temperature Compensation Set Pin 2. A resistor placed between TC1 and TC2 (R ) programs the  
TC  
temperature coefficient of the modulation current.  
9
TC2  
Modulation Set. A resistor connected from MODSET to ground (R  
modulation current amplitude.  
) sets the desired  
MODSET  
11  
12  
MODSET  
PEAKSET  
Peaking Current Set. A resistor connected between PEAKSET and ground (R  
peaking current amplitude. To disable peaking, leave PEAKSET open.  
) programs the  
PEAKSET  
14  
15  
OUT-  
OUT+  
Inverted Modulation-Current Output  
Noninverted Modulation-Current Output  
Bias Current Set. When a closed-loop configuration is used, connect a 1.7kresistor between  
ground and BIASSET to set the maximum bias current. When an open configuration is used,  
17  
18  
19  
BIASSET  
BIAS  
connect a resistor between BIASSET and ground (R  
) to program the VCSEL bias current.  
BIASSET  
Bias Current Output  
Bias Current Monitor. The output of BIASMON is a sourced current proportional to the bias current.  
A resistor connected between BIASMON and ground (R ) can be used to form a ground-  
BIASMON  
referenced bias monitor.  
BIASMON  
Compensation Pin. A capacitor between COMP and MD compensates the APC. A typical value of  
0.047µF is recommended. For open-loop configuration, short the COMP pin to GND to deactivate  
the APC.  
21  
COMP  
22  
23  
MD  
Monitor Diode Connection  
Reference Pin. Reference monitor used for APC. A resistor between REF and MD (R  
photo monitor current when the APC loop is closed.  
) sets the  
PWRSET  
REF  
Average Power Monitor. The pin is used to monitor the transmit optical power. For open-loop  
configuration, connect PWRMON to GND.  
24  
PWRMON  
Ground. Must be soldered to the circuit board ground for proper thermal and electrical  
performance. See the Layout Considerations section.  
EP  
Exposed Pad  
8
_______________________________________________________________________________________  
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
PWRMON  
REF  
CURRENT  
AMPLIFIER  
2X  
1.8V  
R
PWRSET  
MAX3740A  
ENABLE  
I
BIAS  
POWER-  
CONTROL  
AMPLIFIER  
34  
MD  
BIAS  
BIAS GENERATOR  
FERRITE  
BEAD  
SMOOTH-  
START  
BIASMON  
I
PD  
1.6V  
I
BIAS  
9
(2V )  
BE  
1.2V  
R
BIASMON  
200  
COMP  
BIASSET  
R
BIASSET  
C
COMP  
Figure 1. Bias Generator  
The BIASMON output provides a current proportional to  
the laser bias current given by:  
De t a ile d De s c rip t io n  
The MAX3740A contains a bias generator with automat-  
ic power control (APC), safety circuit, and a laser mod-  
ulator with optional peaking compensation.  
I
= I  
/ 9  
BIASMON  
BIAS  
When APC is not used (no monitor diode, open-loop  
configuration) connect the COMP and PWRMON pins  
to GND. In this mode, the bias current is set by the  
Bia s Ge n e ra t o r  
Figure 1 shows the bias generator circuitry that contains  
a power-control amplifier and smooth-start circuitry. An  
internal PNP transistor provides DC laser current to bias  
the laser in a light-emitting state. The APC circuitry  
adjusts the laser-bias current to maintain average power  
over temperature and changing laser properties. The  
smooth-start circuitry prevents current spikes to the laser  
during power-up or enable, ensuring compliance with  
safety requirements and extending the life of the laser.  
resistor R  
. When a closed-loop configuration is  
BIASSET  
used, connect a 1.7kresistor between ground and  
BIASSET to set the maximum bias current.  
S a fe t y Circ u it  
The s a fe ty c irc uit c onta ins a n inp ut d is a b le  
(TX_DISABLE), a latched fault output (FAULT), and fault  
detectors (Figure 2). This circuit monitors the operation  
of the laser driver and forces a shutdown (disables  
laser) if a fault is detected (Table 1). Table 2 contains  
the circuit’s response to various single-point failures.  
The transmit fault condition is latched until reset by a  
The MD input is connected to the cathode of a monitor  
diode, which is used to sense laser power. The BIAS  
output is connected to the anode of the laser through an  
inductor or ferrite bead. The power-control amplifier dri-  
ves a current amplifier to control the lasers bias current.  
During a fault condition, the bias current is disabled.  
toggle of TX_DISABLE or V . The FAULT pin should  
CC  
be pulled high with a 4.7kto 10kresistor.  
Table 1. Fault Conditions  
The PWRMON output provides a voltage proportional to  
average laser power given by:  
PIN  
FAULT CONDITION  
> V - 0.2V  
BIAS  
V
BIAS  
CC  
V
= 2 I  
PD  
R  
PWRSET  
PWRMON  
BIASMON  
PWRMON  
V
> 0.8V  
BIASMON  
V
> 0.8V  
PWRMON  
_______________________________________________________________________________________  
9
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
Table 2. Circuit Response to Various Single-Point Faults (Closed-Loop APC Configuration)  
PIN NAME  
FAULT  
TX_DISABLE  
IN+  
CIRCUIT RESPONSE TO V  
SHORT  
CIRCUIT RESPONSE TO GND SHORT  
CC  
Does not affect laser power.  
Does not affect laser power.  
Modulation and bias current are disabled.  
Does not affect laser power.  
Does not affect laser power.  
Does not affect laser power.  
Does not affect laser power.  
Normal condition for circuit operation.  
Does not affect laser power.  
Does not affect laser power.  
Does not affect laser power.  
Does not affect laser power.  
IN-  
SQUELCH  
TC1  
The laser modulation is increased, but average power  
is not affected.  
TC2  
Modulation current is disabled.  
The laser modulation is increased, but average power  
is not affected.  
MODSET  
Modulation current is disabled.  
PEAKSET  
OUT+  
Does not affect laser power.  
Modulation current is disabled.  
Does not affect laser power.  
Laser bias is disabled.  
Does not affect laser power.  
Modulation current is disabled.  
Does not affect laser power.  
Fault state* occurs.  
OUT-  
BIASSET  
Fault state* occurs. Note that VCSEL emissions may  
continue; care must be taken to prevent this condition.  
BIAS  
Disables VCSEL.  
BIASMON  
Fault state* occurs.  
Does not affect laser power.  
I
increases to the value determined by R  
; if  
BIAS  
BIASSET  
The bias current is reduced, and the average power of  
the laser output is reduced.  
COMP  
MD  
the bias monitor fault threshold is exceeded, a fault is  
signaled.  
I
increases to the value determined by R  
; if  
BIAS  
BIASSET  
The bias current is reduced, and the average power of  
the laser output is reduced.  
the bias-monitor fault threshold is exceeded, a fault is  
signaled.  
I
increases to the value determined by R  
; if  
BIAS  
BIASSET  
The bias current is reduced, and the average power of  
the laser output is reduced.  
the bias-monitor fault threshold is exceeded, a fault is  
signaled.  
REF  
PWRMON  
Fault state* occurs.  
Does not affect laser power.  
*A fault state asserts the FAULT pin, disables the modulator output, and disables the bias output.  
Mo d u la t io n Circ u it  
The modulation circuitry consists of an input buffer, a  
current mirror, and a high-speed current switch (Figure  
3). The modulator drives up to 15mA of modulation into  
a 50VCSEL load.  
De s ig n P ro c e d u re  
S e le c t La s e r  
Select a communications-grade laser with a rise time of  
260ps or better for 1.25Gbps, or 130ps or better for  
2.5Gbps applications. Use a high-efficiency laser that  
requires low modulation current and generates a low-  
voltage swing. Trim the leads to reduce laser package  
inductance. The typical package leads have induc-  
tance of 25nH per inch (1nH/mm). This inductance  
causes a large voltage swing across the laser. A com-  
pensation filter network can also be used to reduce  
ring ing , e d g e s p e e d , a nd volta g e s wing (s e e the  
Designing the Compensation Filter Network section).  
The amplitude of the modulation current is set with  
resistors at MODSET and temperature coefficient (TC1,  
TC2) pins. The resistor at MODSET (R  
) pro-  
MODSET  
grams the temperature-stable portion of the modulation  
current, and the resistor between TC1 and TC2 (R  
)
TC  
programs the temperature coefficient of the modulation  
current. For appropriate R and R values, see  
MODSET  
TC  
the Typical Operating Characteristics section.  
10 ______________________________________________________________________________________  
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
TX_DISABLE  
BIAS  
V
BIAS  
FAULT  
FAULT  
V
CC  
- 0.2V  
0.8V  
OUTPUT  
FAULT  
BIASMON  
HIGH-CURRENT FAULT  
R
S
Q
ENABLE  
R-S LATCH  
PWRMON  
HIGH-POWER FAULT  
POR  
0.8V  
MAX3740A  
TX_DISABLE  
SAFETY CIRCUIT  
Figure 2. Safety Circuit  
V
CC  
MAX3740A  
R
OUT+  
R
OUT-  
INPUT BUFFER  
OUT+  
OUT-  
CURRENT SWITCH  
IN+  
SIGNAL  
DETECT  
100  
PEAKING  
CONTROL  
IN-  
PEAKSET  
SQUELCH  
MODULATION  
CURRENT GENERATOR  
R
PEAKSET  
ENABLE  
CURRENT AMPLIFIER 30x  
TEMPERATURE  
COMPENSATION  
1V  
200Ω  
TC1  
TC2  
MODSET  
R
MODSET  
R
TC  
Figure 3. Modulation Circuit  
______________________________________________________________________________________ 11  
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
0.021mW/mA at +25°C, which reduces to 0.018mW/mA  
at +85°C. The temperature coefficient is given by the  
following:  
P ro g ra m m in g Mo d u la t io n Cu rre n t  
The modulation current output of the MAX3740A is con-  
trolle d b y a re s is tor (R  
) p la c e d b e twe e n  
MODSET  
MODSET and ground. The R  
the amount of current being sourced to the VCSEL. The  
modulation current is given by the following:  
resistor controls  
MODSET  
(SE SE  
)
25  
85  
Laser tempco =  
×1E6  
SE ×(85 25)  
25  
= 2380ppm/°C  
R
OUT+  
+ R  
I
= I  
× 30 ×  
(
[
)
]
MOD  
MODSET  
R
From the Typical Operating Characteristics, the value  
OUT+  
LOAD  
R
of R , which offsets the tempco of the laser, is 9k. If  
TC  
1
OUT+  
+ R  
modulation temperature compensation is not desired,  
short TC1 and TC2.  
I
=
× 30 ×  
MOD  
200 + R  
R
OUT+  
MODSET  
LOAD  
P ro g ra m m in g t h e AP C Lo o p  
Prog ra m the a ve ra g e op tic a l p owe r b y a d jus ting  
. To s e le c t the re s is ta nc e , d e te rmine the  
desired monitor current to be maintained over tempera-  
ture and lifetime. See the Monitor Diode Current vs.  
It is important to note that the modulation current being  
s ourc e d b y the MAX3740A is a ffe c te d b y the loa d  
impedance of the VCSEL. The Modulation Current vs.  
R
PWRSET  
R
graph in the Typical Operating Characteristics  
MODSET  
shows the current into a 50electrical load.  
R
graph in the Typical Operating Characteristics  
PWRSET  
section, and select the value of R  
sponds to the required current.  
that corre-  
PWRSET  
P ro g ra m m in g Bia s Cu rre n t  
The bias current output of the MAX3740A is controlled  
by a resistor (R ) placed between BIASSET and  
In p u t Te rm in a t io n Re q u ire m e n t s  
The MAX3740A data inputs are SFP MSA compatible.  
On-chip 100differential input impedance is provided  
for optimal termination (Figure 4). Because of the on-chip  
biasing network, the MAX3740A inputs self-bias to the  
proper operating point to accommodate AC-coupling.  
BIASSET  
ground. In open-loop operation the R  
controls  
BIASSET  
the bias current level of the VCSEL. In closed-loop  
operation the R controls the maximum bias cur-  
BIASSET  
rent provided by the APC. The bias current is given by  
the following:  
I
= I  
(
× 34  
)
BIAS  
BIASSET  
1.2  
I
=
× 34  
BIAS  
200 + R  
BIASSET  
V
CC  
The Bias Current vs. R  
graph is also shown in  
BIASSET  
the Typical Operating Characteristics.  
MAX3740A  
PACKAGE  
1nH  
16kΩ  
P h o t o d io d e S e le c t io n  
To ensure stable operation of the APC circuit, the time  
constant of the MD node should be shorter than the  
V
CC  
IN+  
IN-  
APC time constant. (t  
= 5µs if C  
= 0.047µF).  
APC  
APC  
0.5pF  
50Ω  
50Ω  
t
5µs  
APC  
20  
t
, R  
× C ≤  
MD  
= 250ns  
MD  
MD  
V
CC  
20  
1nH  
For typical I  
= 400µA, R  
= 500, select a  
PWRSET  
PD  
photodiode with capacitance less than 500pF.  
0.5pF  
24kΩ  
P ro g ra m m in g Mo d u la t io n -Cu rre n t Te m p c o  
Compute the required modulation tempco from the  
slope efficiency of the laser at T = +25°C and at a  
A
higher temperature. Then select the value of R  
from  
TC  
the Typical Operating Characteristics. For example,  
s up p os e a la s e r ha s a s lop e e ffic ie nc y (SE) of  
Figure 4. Simplified Input Structure  
12 ______________________________________________________________________________________  
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
V
CC  
UNCOMPENSATED  
PACKAGE  
1nH  
R
OUT-  
R
OUT+  
CORRECTLY COMPENSATED  
OVERCOMPENSATED  
OUT-  
0.5pF  
1nH  
OUT+  
0.5pF  
TIME  
MAX3740A  
Figure 7. Laser Compensation  
The compensation components (R and C ) are most  
F
F
easily determined by experimentation. Begin with R  
=
F
Figure 5. Simplified Output Structure  
50and C = 1pF. Increase C until the desired trans-  
F
F
mitte r re s p ons e is ob ta ine d (Fig ure 7). Re fe r to  
Application Note HFAN-2-0: Interfacing Maxim Laser  
Drives with Laser Diodes for more information.  
V
CC  
MAX3740A  
Ex p o s e d -P a d (EP ) P a c k a g e  
FAULT  
The exposed pad on the 24-pin thin QFN provides a very  
low thermal resistance path for heat removal from the IC.  
The pad is also electrical ground on the MAX3740A and  
must be soldered to the circuit board ground for proper  
thermal and electrical performance. Refer to Maxim  
Application Note HFAN-08.1: Thermal Considerations for  
QFN and Other Exposed-Pad Packages for additional  
information.  
Figure 6. Fault Circuit Interface  
Ap p lic a t io n s In fo rm a t io n  
La s e r S a fe t y a n d IEC 8 2 5  
In t e rfa c e Mo d e ls  
The International Electrotechnical Commission (IEC)  
determines standards for hazardous light emissions from  
fiber optic transmitters. IEC 825 defines the maximum  
light output for various hazard levels. The MAX3740A  
provides features that facilitate compliance with IEC 825.  
A common safety precaution is single-point fault toler-  
ance, whereby one unplanned short, open, or resistive  
connection does not cause excess light output. Using  
this laser driver alone does not ensure that a transmitter  
design is compliant with IEC 825. The entire transmitter  
circuit and component selections must be considered.  
Customers must determine the level of fault tolerance  
required by their applications, recognizing that Maxim  
products are not designed or authorized for use as com-  
ponents in systems intended for surgical implant into the  
body, for applications intended to support or sustain life,  
or for any other application where the failure of a Maxim  
product could create a situation where personal injury or  
death may occur.  
Figures 4 and 5 show simplified input and output circuits  
for the MAX3740A laser driver. Figure 6 shows the fault  
circuit interface.  
La yo u t Co n s id e ra t io n s  
To minimize inductance, keep the connections between  
the MAX3740A output pins and laser diode as short as  
possible. Use good high-frequency layout techniques  
and multilayer boards with uninterrupted ground planes  
to minimize EMI and crosstalk.  
De s igning the Com pe ns a tion Filte r  
Ne tw ork  
Laser package inductance causes the laser impedance  
to increase at high frequencies, leading to ringing, over-  
shoot, and degradation of the laser output. A laser com-  
pensation filter network can be used to reduce the laser  
impedance at high frequencies, thereby reducing output  
ringing and overshoot.  
______________________________________________________________________________________ 13  
3 .2 Gb p s S FP VCS EL Drive r w it h Dia g n o s t ic  
Mo n it o rs  
Fu n c t io n a l Dia g ra m  
BIASMON  
COMP MD  
REF  
PWRMON  
FAULT  
BIAS  
BIAS  
GENERATOR  
WITH APC  
SAFETY  
CIRCUITRY  
TX_DISABLE  
BIASSET  
ENABLE  
V
CC  
LASER  
MODULATOR  
MAX3740A  
SQUELCH  
IN+  
OUT-  
OUT+  
SIGNAL  
DETECT  
PEAKING  
CONTROL  
100Ω  
IN-  
MODULATION CURRENT  
GENERATOR  
ENABLE  
TC1  
TC2  
MODSET  
PEAKSET  
P in Co n fig u ra t io n  
Ch ip In fo rm a t io n  
TRANSISTOR COUNT: 3806  
PROCESS: SiGe BIPOLAR  
TOP VIEW  
GND  
1
2
3
4
5
6
18 BIAS  
TX_DISABLE  
IN+  
17 BIASSET  
16  
V
CC  
P a c k a g e In fo rm a t io n  
MAX3740A  
IN-  
15 OUT+  
14 OUT-  
For the latest package outline information, go to  
www.maxim-ic.com/packages.  
FAULT  
SQUELCH  
13  
GND  
PART  
PACKAGE TYPE  
PACKAGE CODE  
24 Thin QFN  
(4mm x 4mm x 0.8mm)  
MAX3740AETG  
T2444-1  
24 THIN QFN (4mm x 4mm)  
*EXPOSED PAD IS CONNECTED TO GND  
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are  
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.  
14 ____________________Ma x im In t e g ra t e d P ro d u c t s , 1 2 0 S a n Ga b rie l Drive , S u n n yva le , CA 9 4 0 8 6 4 0 8 -7 3 7 -7 6 0 0  
© 2004 Maxim Integrated Products  
Printed USA  
is a registered trademark of Maxim Integrated Products.  

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