MAX3295AUT [MAXIM]
PLASTIC ENCAPSULATED DEVICES; 塑封器件
| 型号： | MAX3295AUT |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | PLASTIC ENCAPSULATED DEVICES |
| 文件： | 总8页 (文件大小：103K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX3295AUT
Rev. A
RELIABILITY REPORT
FOR
MAX3295AUT
PLASTIC ENCAPSULATED DEVICES
January 27, 2004
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Manager, Reliability Operations
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX3295 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX3295 low-power, high-speed transmitter for RS-485/RS-422 communications operates from a single +3.3V
power supply. This device contains one differential transmitter. The MAX3295 transmitter operates at data rates up to
20Mbps, with an output skew of less than 5ns, and a guaranteed driver propagation delay below 25ns.
The MAX3295 output level is guaranteed at +1.5V with a standard 54 load, compliant with RS-485 specifications.
The transmitter draws 5mA of supply current when unloaded, and 1µA in low-power shutdown mode (DE = GND).
Hot-swap circuitry eliminates false transitions on the data cable during circuit initialization or connection to a live
backplane, and short-circuit current limiting and thermal-shutdown circuitry protect the driver against excessive
power dissipation.
The MAX3295 is available in a 6-pin SOT23 package, and is specified over the automotive temperature range.
B. Absolute Maximum Ratings
Item
Rating
(All voltages referenced to GND, unless otherwise noted.)
Supply Voltage (VCC)
+6V
DE, DI
Y, Z
-0.3V to +6V
-7V to +12.5V
Maximum Continuous Power Dissipation (TA = +70°C)
Operating Temperature Ranges
MAX3295EEUT
MAX3295EAUT
Storage Temperature Range
Junction Temperature
-40°C to +85°C
-40°C to +125°C
-65°C to +160°C
+160°C
Lead Temperature (soldering, 10s)
Continuous Power Dissipation (TA = +70°C)
6-Pin SOT23
+300°C
500mW
Derates above +70°C
6-Pin SOT23
6.25mW/°C
II. Manufacturing Information
A. Description/Function:
B. Process:
20Mbps, +3.3V, SOT23 RS-485/RS-422 Transmitters
B8 (Standard 0.8 micron silicon gate CMOS)
263
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
California, USA
Malaysia, Philippines or Thailand
January, 2003
III. Packaging Information
A. Package Type:
B. Lead Frame:
6-Lead SOT
Copper
C. Lead Finish:
Solder Plate
D. Die Attach:
Non-Conductive Epoxy
Gold (1 mil dia.)
Epoxy with silica filler
# 05-9000-0352
Class UL94-V0
E. Bondwire:
.
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112:
Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
75 x 45 mils
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Aluminum/Si (Si = 1%)
None
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
0.8 microns (as drawn)
0.8 microns (as drawn)
5 mil. Sq.
SiO2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
Jim Pedicord (Manager, Reliability Operations)
Bryan Preeshl (Executive Director of QA)
Kenneth Huening (Vice President)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (l ) is calculated as follows:
l =
1
=
1.83
(Chi square value for MTTF upper limit)
MTTF
192 x 4389 x 48 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
l = 22.62 x 10-9
l = 22.62 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-6110) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The RT66-2 die type has been found to have all pins able to withstand a transient pulse of ±1500V per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
Table 1
Reliability Evaluation Test Results
MAX3295AUT
FAILURE
TEST ITEM
TEST CONDITION
SAMPLE
SIZE
NUMBER OF
FAILURES
IDENTIFICATION
PACKAGE
Static Life Test (Note 1)
Ta = 135°C
Biased
DC Parameters
& functionality
48
0
Time = 192 hrs.
Moisture Testing (Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
DC Parameters
& functionality
SOT
77
77
0
0
85/85
Ta = 85°C
RH = 85%
Biased
DC Parameters
& functionality
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A
Terminal B
(The common combination
of all like-named pins
(Each pin individually
connected to terminal A
with the other floating)
connected to terminal B)
All pins except VPS1 3/
All input and output pins
All VPS1 pins
1.
2.
All other input-output pins
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
a.
Pin combinations to be tested.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected
to terminal B. All pins except the one being tested and the ground pin(s) shall be open.
b.
Each pin individually connected to terminal A with respect to each different set of a combination
of all named power supply pins (e.g., V , or VSS2 or V
or VCC1, or VCC2) connected to
SS3
terminal B. All pins except the one being tSeSs1ted and the power supply pin or set of pins shall be
open.
c.
Each input and each output individually connected to terminal A with respect to a combination of
all the other input and output pins connected to terminal B. All pins except the input or output pin
being tested and the combination of all the other input and output pins shall be open.
TERMINAL C
R2
R1
S1
TERMINAL A
REGULATED
HIGH VOLTAGE
SUPPLY
DUT
S2
SHORT
SOCKET
C1
CURRENT
PROBE
(NOTE 6)
TERMINAL B
R = 1.5kW
C = 100pf
TERMINAL D
Mil Std 883D
Method 3015.7
Notice 8
ONE PER BOARD
ONE PER SOCKET
5V
10 Ohm
1
2
3
6
DI
Z
0.1uF
5
VCC
DE
GND
4
Y
SOT
6 pin
MAX CURRENT = 150mA (+5V)
DRAWN BY RENZO TIRANTI
MAX3293/3294/3295
DOCUMENT I.D. 06-6110
REVISION B
MAXIM TITLE: BI Circuit (MAX3293/3294/3295) RT66Z
PAGE 2
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