MAX2410EEI [MAXIM]
Low-Cost RF Up/Downconverter with LNA and PA Driver; 低成本，RF上/下变频器，带有LNA和PA驱动器
| 型号： | MAX2410EEI |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | Low-Cost RF Up/Downconverter with LNA and PA Driver |
| 文件： | 总12页 (文件大小：181K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-1320; Rev 1; 3/98
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
MAX2410
________________Ge n e ra l De s c rip t io n
____________________________Fe a t u re s
♦ Low-Cost Silicon Bipolar Design
The MAX2410 performs the RF front-end transmit/receive
function in time-division-duplex (TDD) communication
systems. It operates over a wide frequency range and
is op timize d for RF fre q ue nc ie s a round 1.9GHz.
Applications include most popular cordless and PCS
standards.
♦ Integrated Upconvert/Downconvert Function
♦ Operates from Single +2.7V to +5.5V Supply
♦ 3.2dB Combined Receiver Noise Figure:
2.4dB (LNA)
9.8dB (Mixer)
The MAX2410 contains a low-noise amplifier (LNA), a
downconverter mixer, a local-oscillator (LO) buffer, an
upconverter mixer, and a variable-gain power-amplifier
(PA) driver in a low-cost, plastic surface-mount package.
The LNA ha s a 2.4d B (typ ic a l) nois e fig ure a nd a
-10dBm input third-order intercept point (IP3). The down-
converter mixer has a low 9.8dB noise figure and a
3.3dBm IP3. Image and LO filtering are implemented off-
chip for maximum flexibility. The PA driver has 15dB of
gain, which can be reduced over a 35dB (typical) range.
Power consumption is only 60mW in receive mode or
90mW in transmit mode and drops to less than 0.3µW in
shutdown mode.
♦ Flexible Power-Amplifier Driver:
18dBm Output Third-Order Intercept (OIP3)
35dB Gain Control Range
♦ LO Buffer for Low LO Drive Level
♦ Low Power Consumption:
60mW Receive
90mW Full-Power Transmit
♦ 0.3µW Shutdown Mode
♦ Flexible Power-Down Modes Compatible with
MAX2510/MAX2511 IF Transceivers
A similar part, the MAX2411A, features the same func-
tiona lity a s the MAX2410 b ut offe rs a d iffe re ntia l
bidirectional (transmit and receive) IF port. This allows
the use of a single IF filter for transmit (TX) and receive
(RX). For applications requiring a receive function only,
consult the data sheet for the MAX2406, a low-cost
downconverter with low-noise amplifier.
_______________Ord e rin g In fo rm a t io n
PART
TEMP. RANGE
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
28 QSOP
MAX2410EEI
MAX2410E/D
Dice*
*Dice are specified at T = +25°C, DC parameters only.
A
________________________Ap p lic a t io n s
___________________P in Co n fig u ra t io n
PWT1900
DECT
TOP VIEW
DCS1800/PCS1900
PHS/PACS
ISM-Band Transceiver
Iridium Handsets
GND
LNAIN
GND
1
2
28 GND
27 LNAOUT
26 GND
3
GND
4
25 GND
Fu n c t io n a l Dia g ra m
V
CC
5
24 RXMXIN
23 GND
MAX2410
RXEN
LO
6
LNAOUT
RXMXIN
7
22 IFIN
LO
8
21 IFOUT
20 GND
LNA
IFOUT
LNAIN
RX MIXER
TXEN
9
V
10
19 TXMXOUT
18 GND
LO
LO
CC
RXEN
TXEN
POWER
MANAGEMENT
GC 11
GND 12
MAX2410
PA DRIVER
17 GND
TX MIXER
PADROUT
IFIN
PADROUT 13
GND 14
16 PADRIN
15 GND
GC PADRIN
TXMXOUT
QSOP
________________________________________________________________ Maxim Integrated Products
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
ABSOLUTE MAXIMUM RATINGS
V
CC
to GND..............................................................-0.3V to +6V
Continuous Power Dissipation (T = +70°C)
A
LNAIN Input Power.........................................................+15dBm
LO, LO Input Power........................................................+10dBm
PADRIN Input Power ......................................................+10dBm
RXMXIN Input Power......................................................+10dBm
IFIN Input Power.............................................................+10dBm
QSOP (derate 11mW/°C above +70°C) .......................909mW
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +165°C
Lead Temperature (soldering, 10sec) .............................+300°C
RXEN, TXEN, GC Voltage ...........................-0.3V to (V + 0.3V)
CC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
MAX2410
DC ELECTRICAL CHARACTERISTICS
(V = 2.7V to 5.5V, V = 3.0V, RXEN = TXEN = 0.6V, IFOUT and PADROUT pulled up to V with 50Ω resistors, TXMXOUT pulled
CC
GC
CC
up to V with 125Ω resistor, LNAOUT pulled up to V with 100Ω resistor, all other RF and IF inputs open, T = -40°C to +85°C,
CC
CC
A
unless otherwise noted. Typical values are at T = +25°C and V = 3.0V.)
A
CC
PARAMETER
CONDITIONS
MIN
2.7
TYP
MAX
UNITS
V
Supply Voltage Range
5.5
Digital Input Voltage High
RXEN, TXEN pins
RXEN, TXEN pins
RXEN = 2V
2.0
V
Digital Input Voltage Low
0.6
1
V
RXEN Input Bias Current (Note 1)
TXEN Input Bias Current (Note 1)
GC Input Bias Current
0.1
0.1
35
µA
µA
µA
mA
mA
µA
µA
TXEN = 2V
1
GC = 3V, TXEN = 2V
RXEN = 2V
46
Supply Current, Receive Mode
Supply Current, Transmit Mode
Supply Current, Standby Mode
Supply Current, Shutdown Mode
20
29.5
44.5
520
10
TXEN = 2V
30
RXEN = 2V, TXEN = 2V
160
0.1
V
CC
= 3V
AC ELECTRICAL CHARACTERISTICS
(MAX2410 EV kit, V
= 3.0V, V
= 2.15V, RXEN = TXEN = low, f
= 1.5GHz, P
= -10dBm, f
= f
= f
=
CC
GC
LO
LO
LNAIN
PADRIN
RXMXIN
1.9GHz, P
= -32dBm, P
= P
= -22dBm, f
= 400MHz, P
= -32dBm. All measurements performed in 50Ω
LNAIN
PADRIN
RXMXIN
IFIN
IFIN
environment. T = +25°C, unless otherwise noted.)
A
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
LOW-NOISE AMPLIFIER (RXEN = High)
T
= +25°C
14.2
12.6
16.2
17.4
19.1
A
Gain (Note 1)
dB
T
A
= T to T
MIN MAX
Noise Figure
2.4
-10
-5
dB
Input IP3
(Note 2)
dBm
dBm
dBm
Output 1dB Compression
LO to LNAIN Leakage
RECEIVE MIXER (RXEN = High)
RXEN = high or low
-49
T
= +25°C
6.6
5.4
8.3
9.8
A
Conversion Gain (Note 1)
dB
T
A
= T
to T
MAX
10.8
MIN
Noise Figure
Single sideband
(Note 3)
9.8
3.3
-8
dB
Input IP3
dBm
dBm
MHz
dBm
Input 1dB Compression
IFOUT Frequency
Minimum LO Drive Level
(Notes 1, 4)
(Note 5)
450
-17
2
_______________________________________________________________________________________
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
MAX2410
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX2410 EV kit, V
= 3.0V, V
= 2.15V, RXEN = TXEN = low, f
= 1.5GHz, P
= -10dBm, f
= f
= f
=
CC
GC
LO
LO
LNAIN
PADRIN
RXMXIN
1.9GHz, P
= -32dBm, P
= P
= -22dBm, f
= 400MHz, P
= -32dBm. All measurements performed in 50Ω
LNAIN
PADRIN
RXMXIN
IFIN
IFIN
environment. T = +25°C, unless otherwise noted.)
A
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
TRANSMIT MIXER (TXEN = high)
T
= +25°C
8.6
7.3
10
11.1
11.8
A
Conversion Gain (Note 1)
dB
T
A
= T to T
MIN MAX
Output IP3
(Note 6)
-0.3
-11.4
-52
dBm
dBm
dBm
dB
Output 1dB Compression Point
LO Leakage
Noise Figure
Single sideband
(Notes 1, 4)
8.2
IFIN Frequency
450
MHz
dBc
dBc
dBc
f
= 2LO-2IF = 2.2GHz
-44
-74
-90
OUT
Intermod Spurious Response
(Note 7)
f
= 2LO-3IF = 1.8GHz
= 3LO-6IF = 2.1GHz
OUT
f
OUT
POWER AMPLIFIER DRIVER (TXEN = high)
T
= +25°C
13
15
16.4
17
A
Gain (Note 1)
dB
T
A
= T
to T
MAX
12.3
MIN
Output IP3
(Note 3)
18
6.3
35
12
dBm
dBm
dB
Output 1dB Compression Point
Gain-Control Range
Gain-Control Sensitivity
(Note 8)
dB/V
LOCAL OSCILLATOR INPUTS (RXEN = TXEN = high)
Receive (TXEN = Low)
Transmit (RXEN = Low)
1.10
1.02
Input Relative VSWR Normalized to
Standby-Mode Impedance
POWER MANAGEMENT (RXEN = TXEN = low)
Receiver Turn-On Time
(Notes 1, 9)
(Notes 1, 10)
0.5
0.3
2.5
2.5
µs
µs
Transmitter Turn-On Time
Note 1: Guaranteed by design and characterization.
Note 2: Two tones at 1.9GHz and 1.901GHz at -32dBm per tone
Note 3: Two tones at 1.9GHz and 1.901GHz at -22dBm per tone
Note 4: Mixer operation guaranteed to this frequency. For optimum gain, adjust output match. See the Typical Operating
Characteristics for graphs of IFIN and IFOUT Impedance vs. IF Frequency.
Note 5: At this LO drive level the mixer conversion gain is typically 1dB lower than with -10dBm LO drive.
Note 6: Two tones at 400MHz and 401MHz at -32dBm per tone.
Note 7: Transmit mixer output at -17dBm.
Note 8: Calculated from measurements taken at V = 1.0V and V = 1.5V.
GC
GC
Note 9: Time from RXEN = low to RXEN = high transition until the combined receive gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on LNAIN and LNAOUT.
Note 10: Time from TXEN = low to TXEN = high transition until the combined transmit gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on PADRIN and PADROUT.
_______________________________________________________________________________________
3
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
__________________________________________Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s
(MAX2410 EV kit, V
= 3.0V, V
= 2.15V, RXEN = TXEN = low, f = 1.5GHz, P
= -10dBm, f
= f
= f
=
CC
GC
LO
LO
LNAIN
PADRIN
RXMXIN
1.9GHz, P
= -32dBm, P
= P
= -22dBm, f
= 400MHz, P
= -32dBm. All measurements performed in 50Ω
IFIN
LNAIN
PADRIN
RXMXIN
IFIN
environment. T = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
A
TRANSMIT-MODE SUPPLY CURRENT
vs. TEMPERATURE
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
RECEIVE-MODE SUPPLY CURRENT
vs. TEMPERATURE
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
38
36
34
32
30
28
26
24
23
22
21
20
19
18
17
TXEN = V
CC
RXEN = V
CC
RXEN = TXEN = GND
MAX2410
V
CC
= 5.5V
V
= 5.5V
CC
V
CC
= 4.0V
V
CC
= 4.0V
V
= 5.5V
CC
V
= 4.0V
CC
V
CC
= 3.0V
35
V
CC
= 3.0V
V
CC
= 3.0V
V
CC
= 2.7V
V
CC
= 2.7V
10
V
CC
= 2.7V
-40
-15
60
85
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
LNA OUTPUT IMPEDANCE
vs. FREQUENCY
STANDBY SUPPLY CURRENT
vs. TEMPERATURE
LNA INPUT IMPEDANCE
vs. FREQUENCY
MAX2410-06
MAX2410-05
120
100
80
60
40
20
0
40
250
200
150
100
50
0
500
400
300
200
100
0
RXEN = TXEN = 2.0V
RXEN = V
CC
IMAGINARY
RXEN = V
0
-25
-50
-75
-100
-125
V
CC
= 5.5V
CC
IMAGINARY
-40
-80
-120
-160
-200
V
CC
= 4.0V
REAL
REAL
V
CC
= 3.0V
35
V
CC
= 2.7V
0
0
0.5
1.0
1.5
2.0
2.5
3.0
-40
-15
10
60
85
0
0.5
1.0
1.5
2.0
2.5
3.0
FREQUENCY (GHz)
TEMPERATURE (°C)
FREQUENCY (GHz)
LNA GAIN vs. TEMPERATURE
LNA INPUT IP3 vs. TEMPERATURE
LNA GAIN vs. FREQUENCY
20
19
18
17
16
15
14
13
30
25
20
15
10
5
-5
-6
1pF SHUNT CAPACITOR AT LNA INPUT
USING EV KIT MATCHING CIRCUIT (OPTIMIZED
FOR 1.9GHz)
RXEN = V
CC
RXEN = V
CC
V = 5.5V
CC
-7
V
CC
= 3.0V
V
CC
= 4.0V
RXEN = V
CC
-8
V
CC
= 2.7V
-9
-10
-11
-12
-13
-14
-15
V
= 4.0V
CC
V
= 2.7V
CC
V
CC
= 5.5V
V
CC
= 3.0V
0
-40
-15
10
35
60
85
-40 -20
0
20
40
60
80 100
0
0.5
1.0
1.5
2.0
2.5
3.0
TEMPERATURE (°C)
TEMPERATURE (°C)
FREQUENCY (GHz)
4
_______________________________________________________________________________________
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
MAX2410
_____________________________Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s (c o n t in u e d )
(MAX2410 EV kit, V
= 3.0V, V
= 2.15V, RXEN = TXEN = low, f = 1.5GHz, P
= -10dBm, f
= f
= f
=
CC
GC
LO
LO
LNAIN
PADRIN
RXMXIN
1.9GHz, P
= -32dBm, P
= P
= -22dBm, f
= 400MHz, P
= -32dBm. All measurements performed in 50Ω
IFIN
LNAIN
PADRIN
RXMXIN
IFIN
environment. T = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
A
PA DRIVER INPUT IMPEDANCE
vs. FREQUENCY
LNA OUTPUT 1dB COMPRESSION POINT
vs. SUPPLY VOLTAGE
LNA NOISE FIGURE vs. FREQUENCY
MAX2410-12
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
160
140
120
100
80
70
0
-1
-2
-3
-4
-5
-6
TXEN = V
RXEN = V
CC
CC
RXEN = V
CC
30
IMAGINARY
-10
-50
-90
-130
-170
-210
-250
60
40
REAL
20
0
0
0.5
1.0
1.5
2.0
2.5
3.0
100
480
860
1240
1620
2000
2.7
3.2
3.7
4.2
4.7
5.2
FREQUENCY (GHz)
FREQUENCY (MHz)
SUPPLY VOLTAGE (V)
PA DRIVER GAIN AND OUTPUT IP3
vs. GAIN-CONTROL VOLTAGE
PA DRIVER OUTPUT IMPEDANCE
vs. FREQUENCY
PA DRIVER GAIN vs. FREQUENCY
MAX2410-13
30
25
20
15
10
5
20
15
10
5
200
175
150
125
100
75
50
USING EV KIT MATCHING NETWORK
(OPTIMIZED FOR 1.9GHz)
TXEN = V
CC
TXEN = V
CC
0
IMAGINARY
-50
TXEN = V
CC
IP3
-100
-150
-200
-250
-300
-350
0
GAIN
-5
-10
-15
-20
-25
-30
50
REAL
25
0
0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
GAIN-CONTROL VOLTAGE (V)
0
0.5
1.0
1.5
2.0
2.5
3.0
FREQUENCY (GHz)
FREQUENCY (GHz)
PA DRIVER OUTPUT IP3
vs. TEMPERATURE
PA DRIVER OUTPUT 1dB COMPRESSION
POINT vs. SUPPLY VOLTAGE
PA DRIVER GAIN vs. TEMPERATURE
21
20
19
18
17
16
15
14
8
6
18
TXEN = V
CC
TXEN = V
CC
17
16
15
14
13
12
V
= 2.15V
GC
V
= 5.5V
CC
V
= 5.5V
CC
4
TXEN = V
V
= 4.0V
CC
CC
V
= 4.0V
CC
2
V
= 3.0V
CC
V
CC
= 2.7V
0
V
CC
= 3.0V
V
= 2.7V
CC
-2
-4
V
GC
= 1.0V
-40 -20
0
20
40
60
80 100
2.7
3.2
3.7
4.2
4.7
5.2
5.7
-40
-15
10
35
60
85
TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
_______________________________________________________________________________________
5
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
_____________________________Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s (c o n t in u e d )
(MAX2410 EV kit, V
= 3.0V, V
= 2.15V, RXEN = TXEN = low, f = 1.5GHz, P
= -10dBm, f
= f
= f
=
CC
GC
LO
LO
LNAIN
PADRIN
RXMXIN
1.9GHz, P
= -32dBm, P
= P
= -22dBm, f
= 400MHz, P
= -32dBm. All measurements performed in 50Ω
IFIN
LNAIN
PADRIN
RXMXIN
IFIN
environment. T = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
A
RECEIVE MIXER INPUT IMPEDANCE
PA DRIVER NOISE FIGURE
vs. GAIN-CONTROL VOLTAGE
PA DRIVER NOISE FIGURE
vs. FREQUENCY
vs. FREQUENCY
MAX2410-21
100
90
80
70
60
50
40
30
20
10
0
0
30
25
20
15
10
5
10
9
8
7
6
5
4
3
2
1
0
RXEN = V
CC
TXEN = V
CC
-20
TXEN = V
CC
MAX2410
-40
IMAGINARY
-60
-80
-100
-120
-140
-160
-180
-200
REAL
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
FREQUENCY (GHz)
FREQUENCY (GHz)
GAIN-CONTROL VOLTAGE (V)
RECEIVE MIXER CONVERSION GAIN
vs. TEMPERATURE
IF OUTPUT IMPEDANCE
RECEIVE MIXER INPUT IP3
vs. TEMPERATURE
vs. FREQUENCY
MAX2410-21
10
9
7
6
5
4
3
2
1
0
1000
900
800
700
600
500
400
300
200
100
0
0
RXEN = V
CC
RXEN = V
CC
RXEN = V
CC
-100
-200
-300
-400
-500
-600
-700
-800
-900
-1000
V
= 5.5V
CC
IMAGINARY
V
CC
= 5.5V
V
= 4.0V
CC
8
V
= 2.7V
CC
7
V
= 3.0V
V
CC
= 2.7V
CC
6
REAL
5
-40
-15
10
35
60
85
-40 -20
0
20
40
60
80 100
0
100 200 300 400 500 600 700
TEMPERATURE (°C)
TEMPERATURE (°C)
FREQUENCY (MHz)
RECEIVE MIXER CONVERSION GAIN AND
NOISE FIGURE vs. LO POWER
RECEIVE MIXER CONVERSION GAIN
vs. RF FREQUENCY
TRANSMIT MIXER OUTPUT IMPEDANCE
vs. FREQUENCY
MAX2410-27
16
14
12
10
8
13
12
11
10
9
300
250
200
150
100
50
0
RXEN = V
CC
TXEN = V
CC
-25
NARROWBAND
MATCH AT RXMXIN,
EV KIT MATCH AT IFOUT
NOISE FIGURE
IMAGINARY
REAL
-50
-75
EV KIT MATCHING
NETWORK AT RXMXIN
AND IFOUT
6
-100
-125
-150
-175
-200
4
8
GAIN
2
7
0
RXEN = V
CC
0
6
-50
-100
-2
-4
f
= 400MHz
1.0
IF
5
0.5
1.5
2.0
2.5
3.0
-18 -16 -14 -12 -10 -8 -6 -4 -2
LO POWER (dBm)
0
0
0.5
1.0
1.5
2.0
2.5
3.0
RF FREQUENCY (GHz)
FREQUENCY (GHz)
6
_______________________________________________________________________________________
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
MAX2410
_____________________________Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s (c o n t in u e d )
(MAX2410 EV kit, V
= 3.0V, V
= 2.15V, RXEN = TXEN = low, f = 1.5GHz, P
= -10dBm, f
= f
= f
=
CC
GC
LO
LO
LNAIN
PADRIN
RXMXIN
1.9GHz, P
= -32dBm, P
= P
= -22dBm, f
= 400MHz, P
= -32dBm. All measurements performed in 50Ω
IFIN
LNAIN
PADRIN
RXMXIN
IFIN
environment. T = +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
A
TRANSMIT MIXER CONVERSION GAIN
vs. RF FREQUENCY
IF INPUT IMPEDANCE
vs. FREQUENCY
TRANSMIT MIXER CONVERSION GAIN
vs. TEMPERATURE
MAX2410-28 0
14
13
12
11
10
9
12
10
8
500
400
300
200
100
0
900MHz MATCH
3GHz MATCH
TXEN = V
CC
TXEN = V
CC
-300
IMAGINARY
V
CC
= 5.5V
-600
V = 4.0V
CC
6
-900
EV KIT MATCHING NETWORK
V
CC
= 2.7V
4
TXEN = V
CC
V
= 3.0V
60
CC
8
-1200
2
REAL
7
0
-1500
6
0.5
1.0
1.5.
2.0
2.5
3.0
3.5
0
100 200 300 400 500 600 700
FREQUENCY (GHz)
-40
-15
10
35
85
RF FREQUENCY (GHz)
TEMPERATURE (°C)
TRANSMIT MIXER OUTPUT IP3
vs. TEMPERATURE
TRANSMIT MIXER GAIN AND NOISE FIGURE
vs. LO POWER
LO PORT RETURN LOSS vs. FREQUENCY
0
5
1.0
0.5
0
11
TXEN = V
CC
GAIN
RXEN = TXEN = V
CC
10
9
10
15
20
25
30
35
40
V
CC
= 5.5V
TXEN = V
CC
V
= 4.0V
CC
-0.5
8
NOISE FIGURE
-1.0
-1.5
-2.0
V
= 3.0V
CC
V
CC
= 2.7V
7
6
0
0.5
1.0
1.5
2.0
2.5
3.0
-40
-15
10
35
60
85
-18 -16 -14 -12 -10 -8 -6 -4 -2
LO POWER (dBm)
0
FREQUENCY (GHz)
TEMPERATURE (°C)
_______________________________________________________________________________________
7
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
______________________________________________________________P in De s c rip t io n
PIN
NAME
FUNCTION
1, 3, 4, 12,
14, 18, 20,
23, 28
GND
Ground. Connect to PC board ground plane with minimal inductance.
RF Input to the LNA. AC couple to this pin. At 1.9GHz, LNAIN can be easily matched to 50Ω with one
external shunt 1pF capacitor.
2
LNAIN
MAX2410
Supply Voltage (2.7V to 5.5V). Bypass V to GND at each pin with a 47pF capacitor as close to each
CC
pin as possible.
5, 10
V
CC
Logic-Level Enable for Receiver Circuitry. A logic high turns on the receiver. When TXEN and RXEN are
both at a logic high, the part is placed in standby mode, with a supply current of 160µA (typical). If
TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with a supply current of
0.1µA (typical).
6
RXEN
7
8
LO
50Ω Local-Oscillator (LO) Input Port. AC couple to this pin.
50Ω Inverting Local-Oscillator Input Port. For single-ended operation connect LO directly to GND. If a
differential LO signal is available, AC couple the inverted LO signal to this pin.
LO
Logic-Level Enable for Transmitter Circuitry. A logic high turns on the transmitter. When TXEN and
RXEN are both at a logic high, the part is placed in standby mode, with 160µA (typical) supply current.
If TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with 0.1µA (typical) supply
current.
9
TXEN
GC
Gain-Control Input for Power-Amplifier Driver. By applying an analog control voltage between 0V and
11
2.15V, the gain of the PA driver can be adjusted over a 35dB range. Connect to V for maximum gain.
CC
Power-Amplifier Driver Output. AC couple to this pin. Use external shunt inductor to V to match this pin
CC
13
15, 17
16
PADROUT to 50Ω. This also provides DC bias. See the Typical Operating Characteristics for a plot of PADROUT
Impedance vs. Frequency.
GND
Power-Amplifier Driver Input Ground. Connect to PC board ground plane with minimal inductance.
RF Input to Variable-Gain Power-Amplifier Driver. AC couple to this pin. Internally matched to 50Ω. This
input typically provides a 2:1 VSWR at 1.9GHz. See the Typical Operating Characteristics for a plot of
PADRIN Impedance vs. Frequency.
PADRIN
RF Output of Transmit Mixer (Upconverter). AC couple to this pin. Use an external shunt inductor to
19
21
TXMXOUT
IFOUT
V
as part of a matching network to 50Ω. This also provides DC bias. See the Typical Operating
CC
Characteristics for a plot of TXMXOUT Impedance vs. Frequency.
IF Output of Receive Mixer (Downconverter). AC couple to this pin. This output is an open collector and
should be pulled up to V with an inductor. This inductor can be part of the matching network to the
CC
desired IF impedance. Alternatively, a resistor can be placed in parallel to this inductor to set a termi-
nating impedance. See the Typical Operating Circuit for more information.
IF Input of Transmit Mixer (Upconverter). AC couple to this pin. IFIN presents a high input impedance
and typically requires a matching network. See the Typical Operating Characteristics for a plot of IFIN
Impedance vs. Frequency.
22
24
IFIN
RF Input to Receive Mixer (Downconverter). AC couple to this pin. This input typically requires a matching
network for connecting to an external filter. See the Typical Operating Characteristics for a plot of RXMXIN
Impedance vs. Frequency.
RXMXIN
25
26
GND
GND
Receive Mixer Input Ground. Connect to PC board ground plane with minimal inductance.
LNA Output Ground. Connect to PC board ground plane with minimal inductance.
LNA Output. AC couple to this pin. This output typically provides a VSWR of better than 2:1 at frequen-
cies from 1.7GHz to 3GHz with no external matching components. At other frequencies, a matching
network may be required to match this pin to an external filter. Consult the Typical Operating
Characteristics for a plot of LNA Output Impedance vs. Frequency.
27
LNAOUT
8
_______________________________________________________________________________________
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
MAX2410
Typ ic a l Op e ra t in g Circ u it
1
2
3
28
GND
GND
LNAOUT
GND
220pF
220pF
27
26
25
LNA
OUTPUT
LNA
INPUT
LNAIN
GND
1pF
4
5
GND
GND
V
CC
220pF
3.9nH
82nH
RX
MIXER
RFINPUT
24
23
V
CC
RXMXIN
GND
MAX2410
47pF
1000pF
220pF
TX
MIXER
IFINPUT
22
7
8
LO
INPUT
IFIN
LO
LO
V
CC
1000pF
68nH
68nH
R
OPT
V
CC
1000pF
50Ω RX
MIXER
IFOUTPUT
10
21
20
IFOUT
V
CC
47pF
GND
GND
GND
V
CC
V
CC
18
17
1000pF
1000pF
18nH
5.6nH
220pF
220pF
3.9nH
PA
DRIVER
OUTPUT
TX
MIXER
RFOUTPUT
13
19
PADROUT
TXMXOUT
220pF
PA
DRIVER
INPUT
12
14
16
15
GND
GND
PADRIN
GND
TXEN
RXEN
6
GC
11
9
Lo w -No is e Am p lifie r (LNA)
_______________De t a ile d De s c rip t io n
The LNA is a wideband, single-ended cascode amplifi-
er that can be used over a wide range of frequencies
(re fe r to the LNA Ga in vs . Fre q ue nc y g ra p h in the
Typical Operating Characteristics). Its port impedances
are optimized for operation around 1.9GHz, requiring
only a 1pF shunt capacitor at the LNA input for a VSWR
of better than 2:1 and a noise figure of 2.4dB. As with
every LNA, the input match can be traded off for better
noise figure.
The MAX2410 consists of five major components: a
transmit mixer, a variable-gain power-amplifier (PA)
driver, a low-noise amplifier (LNA), a receive mixer, and
power-management section.
The following s e c tions d e s c rib e e a c h b loc k in the
MAX2410 Functional Diagram.
_______________________________________________________________________________________
9
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
RF Output
P A Drive r
The transmit mixer output appears on the TXMXOUT
pin. It is an open-collector output that requires an exter-
The PA d rive r typ ic a lly ha s 15d B of g a in, whic h is
adjustable over a 35dB range via the GC pin. At full
g a in, the PA d rive r ha s a nois e fig ure of 3.5d B a t
1.9GHz.
nal pull-up inductor to V
for DC biasing, which can
CC
be part of an impedance-matching network. Consult
the Typ ic a l Op e ra ting Cha ra c te ris tic s for a p lot of
TXMXOUT Impedance vs Frequency.
For input and output matching information, refer to the
Typical Operating Characteristics for plots of PA Driver
Input and Output Impedance vs. Frequency.
IF Input
The IFIN pin is a self-biasing input that must be AC-
coupled to the IF source. Refer to the Typical Operating
Characteristics for plots of Input and Output Impedance
vs. Frequency.
MAX2410
Re c e ive Mix e r
The receive mixer is a wideband, double-balanced
design with excellent noise figure and linearity. The
inputs to the mixer are the RF signal at the RXMXIN pin
and the LO inputs at LO and LO. The downconverted
output signal appears at the IFOUT port. The conver-
sion gain of the receive mixer is typically 8.3dB with a
noise figure of 9.8dB.
Local-Oscillator Inputs
The LO and LO pins are terminated with 50Ω on-chip
resistors. AC couple the LO signal to these pins. If a
single-ended LO source is used, connect LO directly to
GND.
RF Input
The RXMXIN input is typically connected to the LNA
output through an off-chip filter. This input is externally
matched to 50Ω. See the Typical Operating Circuit
for an example matching network and the RXMXIN
Impedance vs. Frequency graph in the Typical Operating
Characteristics.
Ad va n c e d S ys t e m
P o w e r Ma n a g e m e n t
RXEN and TXEN are the two separate power-control
inputs for the receiver and the transmitter. If both inputs
are at logic 0, the part enters shutdown mode and the
supply current drops below 1µA. When one input is
brought to a logic 1, the corresponding function is
enabled. If RXEN and TXEN are both set to logic 1, the
part enters standby mode as described in the Standby
Mode section. Table 1 summarizes these operating
modes.
Local-Oscillator Inputs
The LO and LO pins are internally terminated with 50Ω
on-chip resistors. AC couple the LO signal to these
pins. If a single-ended LO source is used, connect LO
directly to ground.
Power-down is guaranteed with a control voltage at or
below 0.6V. The power-down function is designed to
reduce the total power consumption to less than 1µA in
less than 2.5µs. Complete power-up will happen in the
same amount of time.
IF Output Port
The MAX2410’s receive mixer output appears at the
IFOUT pin, an open-collector output that requires an
external pull-up inductor to V . This inductor can be
CC
part of a matching network to the desired IF imped -
ance. Alternatively, a resistor can be placed in parallel
with the pull-up inductor to set a terminating impedance.
Table 1. Advanced System Power-
Management Functions
The MAX2411A, a similar part to the MAX2410, has the
same functionality as the MAX2410 but offers a differ-
ential, bidirectional (transmit and receive) IF port. This
allows sharing of TX and RX IF filters, which for some
applications provides a lower cost, smaller solution.
RXEN
TXEN
FUNCTION
Shutdown
0
0
1
1
0
1
0
1
Transmit
Receive
Standby Mode
Tra n s m it Mix e r
The transmit mixer takes an IF signal at the IFIN pin and
upconverts it to an RF frequency at the TXMXOUT pin.
The conversion gain is typically 10dB and the output
1d B c omp re s s ion p oint is typ ic a lly -11.4d Bm a t
1.9GHz.
10 ______________________________________________________________________________________
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
MAX2410
Standby Mode
When the TXEN and RXEN pins are both set to logic 1,
all functions are disabled and the supply current drops
to 160µA (typical). This mode is called standby, and it
corresponds to a standby mode on the compatible IF
transceiver chips MAX2510 and MAX2511.
vs. Frequency on all RF and IF pins for use in designing
matching networks. The LO port (LO and LO) is internally
terminated with 50Ω resistors and provides a VSWR of
approximately 1.2:1 to 2GHz and 2:1 up to 3GHz.
La yo u t Is s u e s
A properly designed PC board is an essential part of
any RF/microwave circuit. Be sure to use controlled
impedance lines on all high-frequency inputs and out-
puts. Use low-inductance connections to ground on all
GND pins, and place decoupling capacitors close to all
Ap p lic a t io n s In fo rm a t io n
Ex t e n d e d Fre q u e n c y Ra n g e
The MAX2410 has been characterized at 1.9GHz for use
in PCS-band applications; however, it operates over a
much wider frequency range. The LNA gain and noise
figure, as well as mixer conversion gain, are plotted over
a wid e fre q ue nc y ra ng e in the Typ ic a l Op e ra ting
Characteristics. When operating the device at RF fre-
quencies other than those specified in the AC Electrical
Characteristics table, it may be necessary to design or
alter the matching networks on the RF ports. If the IF
frequency is different than that specified in the AC
Electrical Characteristics table, the IFIN and IFOUT
ma tc hing ne tworks mus t b e a lte re d . The Typ ic a l
Operating Characteristics provide Port Impedance Data
V
CC
connections.
For the power supplies, a star topology works well. In a
star topology, each V node in the circuit has its own
CC
path to the central V , and its own decoupling capaci-
CC
tor which provides a low impedance at the RF frequen-
c y of inte re s t. The c e ntra l V
nod e ha s a la rg e
CC
decoupling capacitor as well, to provide good isolation
between the different sections of the MAX2410. The
MAX2410 EV kit layout can be used as a guide to inte-
grating the MAX2410 into your design.
_________________________________________Typ ic a l Ap p lic a t io n Blo c k Dia g ra m
RF
BPF
MATCH
RX MIXER
LNA
LNAIN
IFOUT
RECEIVE
IFOUT
MATCH
ANTENNA
RF
BPF
IF
BPF
T/R
RXEN
TXEN
POWER
MANAGEMENT
LO
LO
LOCAL
OSCILLATOR
MAX2410
PA DRIVER
IFIN
TRANSMIT
IFIN
MATCH
MATCH
PADROUT
CBLOCK
TX MIXER
IF
BPF
RF
BPF
GC
RF
BPF
MATCH
______________________________________________________________________________________ 11
Lo w -Co s t RF Up /Do w n c o n ve rt e r
w it h LNA a n d PA Drive r
________________________________________________________P a c k a g e In fo rm a t io n
MAX2410
12 ______________________________________________________________________________________
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