MAX2010EVKIT [MAXIM]
MAX2009/MAX2010 Evaluation Kits; MAX2009 / MAX2010评估套件
| 型号： | MAX2010EVKIT |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | MAX2009/MAX2010 Evaluation Kits |
| 文件： | 总11页 (文件大小：520K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-2972; Rev 0; 9/03
MAX2009/MAX2010 Evaluation Kits
General Description
Features
The MAX2009/MAX2010 evaluation kits (EV kits) simplify
the evaluation of the MAX2009 and MAX2010. These kits
are fully assembled and tested at the factory. Standard
50Ω SMA connectors are included for all inputs and out-
puts to facilitate evaluation on the test bench.
ꢀ Fully Assembled and Tested
ꢀ Frequency Range
1200MHz to 2500MHz (MAX2009)
500MHz to 1100MHz (MAX2010)
ꢀ Up to 12dB ACPR Improvement*
ꢀ Independent Adjustable Gain and Phase
Expansion
Each EV kit provides a list of equipment required to
evaluate the device, a test procedure, a circuit
schematic, a bill of materials (BOM), and artwork for
each layer of the PC board.
ꢀ Low Power Consumption
*Performance dependent on amplifier, bias, and modulation.
Component Suppliers
Ordering Information
SUPPLIER
Johnson
Murata
PHONE
WEBSITE
PART
TEMP RANGE
-40 C to +85 C
-40 C to +85 C
PIN-PACKAGE
28 Thin QFN-EP*
28 Thin QFN-EP*
507-833-8822 www.johnsoncomponents.com
770-436-1300 www.murata.com
781-376-3018 www.alphaind.com
800-745-8656 www.toko.com
MAX2009EVKIT
MAX2010EVKIT
Skyworks
TOKO
*EP = Exposed paddle.
MAX2009 Component List
MAX2010 Component List
DESIGNATION QTY
DESCRIPTION
DESIGNATION QTY
DESCRIPTION
8.2pF 0.25pf 50V C0G
ceramic capacitors (0402)
Murata GRP1555C1H8R2C
100pF 5%, 50V C0G
ceramic capacitors (0402)
Murata GRP1555C1H101J
C1, C6, C8,
C1, C2, C3,
C10
4
4
2
C10
1.5pF 0.1pF, 50V C0G
ceramic capacitors (0402)
Murata GRP1555C1H1R5B
0.01µF 10%, 50V X7R
ceramic capacitors (0603)
Murata GRM188R71H103K
C2, C3
C4, C5
2
2
C4, C5
C6, C8
0.01µF 10%, 50V X7R
ceramic capacitors (0603)
Murata GRM188R71H103K
15pF 5%, 50V C0G
ceramic capacitors (0402)
Murata GRP1555C1H150J
2
0.5pF 0.1pF, 50V C0G
ceramic capacitors (0402)
Murata GRP1555C1HR50B
C7, C9
0
2
Not installed
C7, C9
C11, C12
2
0
4
2.2pF 0.1pF, 50V C0G
ceramic capacitors (0402)
Murata GRP1555C1H2R2B
C11, C12
Not installed
PC board edge mount SMA RF
connectors (flat-tab launch)
Johnson 142-0741-856
PC board edge-mount SMA RF
connectors (flat-tab launch)
Johnson 142-0741-856
J1, J2, J3, J4
J1, J2, J3, J4
J5
4
1
2
2 x 10 header, 0.100in centers
Molex 10-89-1201
J5
R1, R2, R3
U1
1
3
1
2 x 10 header, 0.100in centers
Molex 10-89-1201
1kΩ 5% resistors (0402)
5.6nH 0.3nH
chip inductors (0402)
TOKO LL1005-FH5N6S
MAX2009 28-pin thin QFN-EP
Maxim MAX2009ETI-T
L1, L2
R1, R2, R3
U1
3
1
1kΩ 5% resistors (0402)
Hyperabrupt varactor diodes
Skyworks SMV1232-079
VR1, VR2
2
MAX2010 28-pin thin QFN-EP
Maxim MAX2010ETI-T
Hyperabrupt varactor diodes
Skyworks SMV1232-079
VR1, VR2
2
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
MAX2009/MAX2010 Evaluation Kits
4) With all adjustable power supplies disabled, set
Quick Start
The MAX2009/MAX2010 EV kits are fully assembled and
factory tested. Follow the instructions in the Connections
and Setup section for proper device evaluation.
their voltages to the recommended values in Table
1. Connect these supplies to PB_IN, PD_CS1,
PD_CS2, and PF_S1*. Connect all ground terminals
to the header pins labeled GND.
Test Equipment Required
This section lists the recommended test equipment to
verify the operation of the MAX2009/MAX2010. It is
intended as a guide only, and substitutions may be
possible:
5) Enable the +5V (VCC_P) power supply first, fol-
lowed by the adjustable supplies.
6) Enable the output power on the network analyzer.
7) With the recommended settings, the AM-PM
response of the phase section should provide a
phase expansion breakpoint of approximately
4dBm and a slope of approximately 1.2°/dB.
• Two DC power supplies capable of delivering +5V
and 20mA of continuous current
• Four adjustable DC power supplies capable of deliv-
ering +5V and 5mA of continuous current
8) To power down: First disable the network analyzer,
preamplifier, adjustable supplies, and then the +5V
(VCC_P) supply.
• One high-current power supply capable of biasing a
preamplifier
Table 1. Phase Section Control Voltages
• One HP 8753D or equivalent network analyzer
• One preamplifier with a gain of 25dB in the 500MHz
to 1100MHz (MAX2010) or 1200MHz to 2500MHz
(MAX2009) frequency range with a minimum output
1dB compression point of 38dBm
PIN (J5)
PB_IN
VOLTAGE (V)
0
0
0
5
PD_CS1
PD_CS2
PF_S1*
• One 6dB attenuator
• One 3dB high-power attenuator
• Two 6dB high-power attenuators
*Note: PF_S1 is shorted to PF_S2 on layer 4 of the PC board.
Testing the Gain Section—Figure 2
1) With the network analyzer’s output power disabled,
connect the output attenuator pad of the preamplifi-
er to the SMA labeled GAIN_IN (J3).
Connections and Setup
Test Set Calibration
1) Set up the test equipment per Figure 1 with the net-
work analyzer output power disabled.
2) Connect the SMA labeled GAIN_OUT (J4) to the
attenuator pad on port 2 of the network analyzer.
2) Enable the preamplifier.
3) Set the network analyzer to perform a power sweep
from -20dBm to +8dBm at the frequency of interest
and enable the output power. For the best results,
perform the standard network analyzer calibration
with everything except the MAX2009/MAX2010 EV kit.
3) With the +5V supply disabled, connect the positive
terminal to the header pin labeled VCC_G. Connect
the ground terminal to a header pin labeled GND.
4) With all adjustable power supplies disabled, set
their voltages to the recommended values in Table
2. Connect these supplies to G_BP, G_FS, and
G_CS. Connect all ground terminals to the header
pins labeled GND.
4) After the calibration, leave the preamplifier connect-
ed to port 1 of the network analyzer.
Testing the Phase Section—Figure 1
1) With the network analyzer’s power disabled, con-
nect the output attenuator pad of the preamplifier to
the SMA labeled PHASE_IN (J1).
5) Enable the +5V (VCC_G) power supply first, fol-
lowed by the adjustable supplies.
6) Enable the output power on the network analyzer.
2) Connect the SMA labeled PHASE_OUT (J2) to the
attenuator pad on port 2 of the network analyzer.
7) With the recommended settings, the AM-AM
response of the gain section should provide a gain
expansion breakpoint of approximately 5dBm and a
slope of approximately 0.5dB/dB.
3) With the +5V supply disabled, connect the positive
terminal to the header pin labeled VCC_P. Connect
the ground terminal to a header pin labeled GND.
8) To power down: First disable the network analyzer,
preamplifier, adjustable supplies, and then the +5V
(VCC_G) supply.
2
_______________________________________________________________________________________
MAX2009/MAX2010 Evaluation Kits
Control pin PBRAW should be shorted to the PBEXP
Table 2. Gain Section Control Voltages
output pin for most applications. Driving PBRAW direct-
ly allows for additional control such as obtaining phase
compression for some and/or all the input power
sweep. Resistor R3 allows the option of driving PBRAW
with a low-impedance voltage, which overrides the
PBEXP output voltage.
PIN (J5)
G_BP
VOLTAGE (V)
1.2
5
G_FS
G_CS
1.0
Phase-Expansion Slope
The phase-expansion slope of the MAX2009/MAX2010 is
controlled by the PF_S1, PF_S2, PD_CS1, and PD_CS2
pins. Most applications require PF_S1 and PF_S2 to be
driven identically, and therefore they are shorted on layer
4 of the PC board. The phase-expansion slope of the
MAX2009/MAX2010 must also be adjusted to equal the
opposite slope of the PA’s phase-compression curve.
Detailed Description
The following sections describe the tuning methodology
best implemented with a class A amplifier. Other classes
of operation may require significantly different settings.
Supply Decoupling Capacitors
Capacitors C4 and C5 are 0.01µF ( 10ꢀ% and are used
for minimizing low-frequency noise on the supply.
Gain-Expansion Breakpoint
The G_BP input voltage range of 0.5V to 5.0V
corresponds to a breakpoint input power range of -3dBm
to 23dBm. In order to achieve the optimal performance,
the gain-expansion breakpoint of the MAX2009/
MAX2010 must be set to equal the gain-
compression point of the PA. The G_BP control has a
minimal effect on the small-signal gain when operated
from 0.5V to 5.0V.
External Matching Components
The MAX2009 external matching networks at the input
and output of the phase and gain sections consist of
C1, C11, C10, C12, C9, C8, C6, C7, along with some
high-impedance transmission lines. The MAX2010
matching consists of C1, C11, L1, L2, C10, C12, C9, C8,
C6, and C7.
Phase-Tuning Section
Varactors VR1 and VR2 provide fine tuning of the
phase-expansion slope. Resistors R1 and R2 provide a
high-impedance method to inject control voltage on the
varactors. Capacitors C2 and C3 are coupling capaci-
tors that also offset the series parasitic inductance of
the chip and PC board. If phase-slope fine tuning is not
required in the user’s application, then only C2 and C3
to ground are necessary.
Gain-Expansion Slope
Both G_CS and G_FS pins have an input voltage range
of 0V to V , corresponding to a slope of approximately
CC
0.1dB/dB to 0.6dB/dB. The slope is set to maximum
when V
= 0V and V
= +5V, and the slope is at
GFS
GCS
its minimum when V
= +5V and V
= 0V. In addi-
GCS
GFS
tion to properly setting the breakpoint, the gain-expan-
sion slope of the MAX2009/MAX2010 must also be
adjusted in order to compensate for the PA’s gain com-
pression. The slope should be set using the following
equation:
Gain and Phase Controls
The MAX2009/MAX2010 controls can provide real-time
software-controlled distortion corrections as well as set-
and-forget tuning by setting the expansion starting
point (breakpoint% and the rate of expansion (slope%.
The gain and phase breakpoints are adjustable over a
20dB input power range. The phase expansion slope is
variable from 0.3°/dB to 2.0°/dB and can be adjusted
for a maximum of 24° of phase expansion. The gain
expansion slope is variable from 0.1dB/dB to 0.6dB/dB
and can be adjusted for a maximum of 7dB gain
expansion.
−PA_SLOPE
1 + PA_SLOPE
MAX20XX_SLOPE =
where:
MAX20XX_SLOPE = MAX2009/MAX2010 gain section’s
slope in dB/dB.
PA_SLOPE = PA’s gain slope in dB/dB, a negative
number for compressive behavior.
Phase-Expansion Breakpoint
The PB_IN input voltage range of 0V to V
corre-
CC
Unlike with the G_BP pin, modifying the gain-expansion
slope bias on the G_CS pin causes a change in the
part’s insertion loss and noise figure. For example, a
smaller slope caused by G_CS results in a better inser-
tion loss and lower noise figure.
sponds to a breakpoint input power range of 3.7dBm to
23dBm. In order to achieve optimal performance, the
phase-expansion breakpoint of the MAX2009/
MAX2010 must be set to equal the phase compression
point of the PA.
_______________________________________________________________________________________
3
MAX2009/MAX2010 Evaluation Kits
placement of components on the PC board. The pack-
Modifying the EV Kit
age’s exposed paddle (EP% dissipates heat from the
device and provides a low-impedance electrical con-
nection. The EP must be solder attached to a PC board
ground pad. This ground pad should be connected to
the lower ground plane using multiple ground vias. The
MAX2009/MAX2010 PC boards use a 3 x 3 grid of
0.012in diameter plated through holes. The MAX2009
layout uses high-impedance lines on the input and out-
put paths of the gain section to aid in matching. In an
actual application, matching capacitors C7, C9, C11,
and C12 could be replaced with a microstrip equivalent
solution to reduce component count. In order to pro-
vide increased tuning range, the ground plane under
the varactor control section has been removed. The
MAX2009/MAX2010 EV kits are constructed on FR4
with the top dielectric thickness of 0.015in.
The external varactors on the EV kit can be replaced with
fixed capacitors if dynamic tuning of the fine phase-
expansion slope through PF_S1 and PF_S2 is not
required. A closely matched minimum effective capaci-
tance of 2pF to 6pF must be presented at these pins.
Component pads for external filtering components are
included for pins PB_IN, PB_RAW, G_BP, G_CS, and
G_FS.
Pins PF_S1 and PF_S2 are shorted together on the EV
kit. If independent control is required, disconnect the
trace connecting these two pins on the bottom side of
the PC board (pins 19 and 20 of J5%.
Layout Considerations
The MAX2009/MAX2010 EV kits can serve as guides to
board layout. Pay close attention to thermal design and
NETWORK ANALYZER
(AG 8753E)
+5V POWER SUPPLY
(AG E3631A)
S21 5 / Ref180
V
mA
6dB HIGH POWER
MARKER 1
160°
6dB HIGH POWER
START -20.0 dBm STOP 8.0 dBm
J2
U1
PHASE_OUT
+5V POWER SUPPLY
(AG E3631A)
MAX2009/
MAX2010
V
mA
J1
PHASE_IN
3dB
6dB
HIGH
VCC
GND
POWER
+5V POWER SUPPLY
(AG E3631A)
1
2
V
mA
J5
20
Figure 1. Testing the Phase Section
4
_______________________________________________________________________________________
MAX2009/MAX2010 Evaluation Kits
+5V POWER SUPPLY
(AG E3631A)
V
mA
VCC
GND
NETWORK ANALYZER
(AG 8753E)
3dB HIGH POWER
S21 2 / Ref-7
MARKER 1
-13dB
J3
GAIN_IN
START -20.0 dBm STOP 8.0 dBm
U1
+5V POWER SUPPLY
(AG E3631A)
MAX2009/
MAX2010
V
mA
6dB
6dB HIGH POWER
J4
GAIN_OUT
6dB HIGH POWER
+5V POWER SUPPLY
(AG E3631A)
1
V
mA
J5
20
2
Figure 2. Testing the Gain Section
_______________________________________________________________________________________
5
MAX2009/MAX2010 Evaluation Kits
W = 10 mil
L = 160 mil C6
J4
GAIN_OUT
C7
28
27
26
25
24
23
22
J5
V
GND*
GND*
ING
G_CS
G_FS
CCG
1
2
3
4
5
6
7
21
20
19
18
17
16
15
1
2
C5
GND*
PBRAW
PBEXP
PBIN
W = 10 mil
G_BP
L = 160 mil C8
J3
VCC_G
PB_RAW
PB_IN
U1
GAIN_IN
R3
C9
GND*
GND*
OUTP
GND*
MAX2009
VCC_P
PD_CS2
PD_CS1
PF_S2
C10
GND*
J2
PHASE_OUT
EXPOSED
PADDLE
C12
V
CCP
C4
20
8
9
10
11
12
13
14
PF_S1
C1
J1
C2
C3
PHASE_IN
R2
C11
R1
VR1
VR2
*INTERNALLY CONNECTED TO EXPOSED PADDLE.
PC BOARD DIELECTRIC FR4.
RF LAYER DIELECTRIC THICKNESS = 15 mils.
Figure 3. MAX2009 EV Kit Schematic
6
_______________________________________________________________________________________
MAX2009/MAX2010 Evaluation Kits
C6
J4
GAIN_OUT
C7
28
27
26
25
24
23
22
J5
V
GND*
GND*
ING
G_CS
G_FS
CCG
1
2
3
4
5
6
7
21
20
19
18
17
16
15
1
2
C5
GND*
PBRAW
PBEXP
PBIN
G_BP
C8
J3
VCC_G
PB_RAW
PB_IN
U1
GAIN_IN
R3
C9
GND*
GND*
OUTP
GND*
MAX2010
VCC_P
PD_CS2
PD_CS1
PF_S2
C10
L2
GND*
J2
PHASE_OUT
EXPOSED
PADDLE
C12
V
CCP
C4
20
8
9
10
11
12
13
14
PF_S1
C1
L1
J1
C2
C3
PHASE_IN
R2
C11
R1
VR1
VR2
*INTERNALLY CONNECTED TO EXPOSED PADDLE.
PC BOARD DIELECTRIC FR4.
RF LAYER DIELECTRIC THICKNESS = 15 mils.
Figure 4. MAX2010 EV Kit Schematic
_______________________________________________________________________________________
7
MAX2009/MAX2010 Evaluation Kits
1.0"
1.0"
Figure 5. MAX2009 EV Kit PC Board Layout—Top Silkscreen
Figure 6. MAX2009 EV Kit PC Board Layout—Top Soldermask
1.0"
1.0"
Figure 7. MAX2009 EV Kit PC Board Layout—Top Layer Metal
Figure 8. MAX2009 EV Kit PC Board Layout—Inner Layer 2
(GND)
8
_______________________________________________________________________________________
MAX2009/MAX2010 Evaluation Kits
1.0"
1.0"
Figure 9. MAX2009 EV Kit PC Board Layout—Inner Layer 3
(Routes)
Figure 10. MAX2009 EV Kit PC Board Layout—Bottom Layer
Metal
1.0"
1.0"
Figure 11. MAX2009 EV Kit PC Board Layout—Bottom
Soldermask
Figure 12. MAX2009 EV Kit PC Board Layout—Bottom
Silkscreen
_______________________________________________________________________________________
9
MAX2009/MAX2010 Evaluation Kits
1.0"
1.0"
Figure 13. MAX2010 EV Kit PC Board Layout—Top Silkscreen
Figure 14. MAX2010 EV Kit PC Board Layout—Top Soldermask
1.0"
1.0"
Figure 15. MAX2010 EV Kit PC Board Layout—Top Layer Metal
Figure 16. MAX2010 EV Kit PC Board Layout—Inner Layer 2
(GND)
10 ______________________________________________________________________________________
MAX2009/MAX2010 Evaluation Kits
1.0"
1.0"
Figure 17. MAX2010 EV Kit PC Board Layout—Inner Layer 3
(Routes)
Figure 18. MAX2010 EV Kit PC Board Layout—Bottom Layer
Metal
1.0"
1.0"
Figure 19. MAX2010 EV Kit PC Board Layout—Bottom
Soldermask
Figure 20. MAX2010 EV Kit PC Board Layout—Bottom
Silkscreen
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 11
© 2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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