MAX1122EGK+TD [MAXIM]
ADC, Proprietary Method, 10-Bit, 1 Func, 1 Channel, Parallel, Word Access, 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68;
| 型号： | MAX1122EGK+TD |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | ADC, Proprietary Method, 10-Bit, 1 Func, 1 Channel, Parallel, Word Access, 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 转换器 |
| 文件： | 总17页 (文件大小：203K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-3027; Rev 2; 8/08
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
MAX12
General Description
Features
The MAX1122 is a monolithic 10-bit, 170Msps analog-
to-digital converter (ADC) optimized for outstanding
dynamic performance at high IF frequencies up to
500MHz. The product operates with conversion rates of
up to 170Msps while consuming only 460mW.
♦ 170Msps Conversion Rate
♦ SNR = 57.1dB/56.5dB at f = 100MHz/500MHz
IN
♦ SFDR = 72dBc/63.5dBc at f = 100MHz/500MHz
IN
♦ NPR = 53.7dB at f
= 28.8MHz
NOTCH
At 170Msps and an input frequency of 100MHz, the
MAX1122 achieves a spurious-free dynamic range
(SFDR) of 72dBc. Its excellent signal-to-noise ratio
(SNR) of 57.5dB at 10MHz remains flat (within 1dB) for
input tones up to 500MHz. This makes the MAX1122
ideal for wideband applications such as digital predis-
tortion in cellular base-station transceiver systems.
♦ Single 1.8V Supply
♦ 460mW Power Dissipation at 170Msps
♦ On-Chip Track-and-Hold and Internal Reference
♦ On-Chip Selectable Divide-by-2 Clock Input
♦ LVDS Digital Outputs with Data Clock Output
♦ Evaluation Kit Available (Order MAX1124EVKIT)
The MAX1122 requires a single 1.8V supply. The ana-
log input is designed for either differential or single-
ended operation and can be AC- or DC-coupled. The
ADC also features a selectable on-chip divide-by-2
clock circuit, which allows the user to apply clock fre-
quencies as high as 340MHz. This helps to reduce the
phase noise of the input clock source. A differential
LVDS sampling clock is recommended for best perfor-
mance. The converter’s digital outputs are LVDS com-
patible, and the data format can be selected to be
either two’s complement or offset binary.
Ordering Information
PART
TEMP RANGE
PIN-PACKAGE
MAX1122EGK
-40°C to +85°C
68 QFN-EP*
*EP = Exposed pad.
The MAX1122 is available in a 68-pin QFN with
exposed pad (EP) and is specified over the industrial
(-40°C to +85°C) temperature range.
Pin Configuration
For pin-compatible, higher speed versions of the
MAX1122, refer to the MAX1123 (210Msps) and the
MAX1124 (250Msps) data sheets. For a higher speed,
pin-compatible 8-bit version of the MAX1122, refer to
the MAX1121 data sheet.
TOP VIEW
68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52
AV
CC
1
2
3
4
5
6
7
8
9
51 D6P
50 D6N
49 D5P
48 D5N
47 D4P
46 D4N
45 OGND
Applications
Wireless and Wired Broadband Communication
AGND
REFIO
EP
REFADJ
AGND
Cable-Head End Systems
AV
CC
Digital Predistortion Receivers
AGND
INP
Communications Test Equipment
44 OV
CC
INN
43 DCLKP
42 DCLKN
MAX1122
Radar and Satellite Subsystems Antenna Array
Processing
AGND 10
AV
CC
AV
CC
AV
CC
AV
CC
11
12
13
14
41 OV
CC
40 D3P
39 D3N
38 D2P
37 D2N
36 D1P
35 D1N
AGND 15
AGND 16
CLKDIV 17
18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
ABSOLUTE MAXIMUM RATINGS
AV
to AGND ......................................................-0.3V to +2.1V
to OGND .....................................................-0.3V to +2.1V
Continuous Power Dissipation (T = +70°C)
A
CC
OV
68-Pin QFN (derate 41.7mW/°C above +70°C) .........3333mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Maximum Current into Any Pin............................................50mA
CC
AV
to OV .......................................................-0.3V to +2.1V
CC
CC
AGND to OGND ....................................................-0.3V to +0.3V
Analog Inputs to AGND ...........................-0.3V to (AV
Digital Inputs to AGND.............................-0.3V to (AV
REF, REFADJ to AGND............................-0.3V to (AV
Digital Outputs to OGND.........................-0.3V to (OV
+ 0.3V)
+ 0.3V)
+ 0.3V)
+ 0.3V)
CC
CC
CC
CC
ESD on All Pins (Human Body Model)............................. 2000V
MAX12
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(AV
= OV
= 1.8V, V
= V
= 0, f
= 170MHz, differential sine-wave clock input drive, 0.1µF capacitor on REFIO,
SAMPLE
AGND
OGND
CC
CC
internal reference, digital output pins differential R = 100Ω 1ꢀ, C = 5pF, T = T
to T
, unless otherwise noted. ≥ +25°C
L
L
A
MIN
MAX
guaranteed by production test, < +25°C guaranteed by design and characterization. Typical values are at T = +25°C.)
A
PARAMETER
DC ACCURACY
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Resolution
10
-1.5
-1.0
-25
-37
Bits
LSB
LSB
Integral Nonlinearity
Differential Nonlinearity
INL
(Note 1)
No missing codes (Note 1)
≥ +25°C
0.4
0.3
+1.5
+1.5
+25
+37
DNL
T
A
Transfer Curve Offset
V
(Note 1)
LSB
OS
(Note 2)
Offset Temperature
Drift
20
µV/°C
ANALOG INPUTS (INP, INN)
Full-Scale Input Voltage Range
V
(Note 1)
1100
1250
130
1375
mV
P-P
FS
Full-Scale Range Temperature
Drift
ppm/°C
1.38
0.18
Common-Mode Input Range
V
V
CM
Input Capacitance
C
3
pF
kΩ
IN
Differential Input Resistance
Full-Power Analog Bandwidth
REFERENCE (REFIO, REFADJ)
Reference Output Voltage
Reference Temperature Drift
R
3.00
1.18
4.3
600
6.25
1.30
IN
FPBW
Figure 8
MHz
V
1.24
90
V
REFIO
ppm/°C
AV
0.3
-
CC
REFADJ Input High Voltage
V
Used to disable the internal reference
V
REFADJ
SAMPLING CHARACTERISTICS
Maximum Sampling Rate
f
f
170
MHz
MHz
SAMPLE
Minimum Sampling Rate
20
SAMPLE
2
_______________________________________________________________________________________
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
MAX12
ELECTRICAL CHARACTERISTICS (continued)
(AV
= OV
= 1.8V, V
= V
= 0, f
= 170MHz, differential sine-wave clock input drive, 0.1µF capacitor on REFIO,
SAMPLE
AGND
OGND
CC
CC
internal reference, digital output pins differential R = 100Ω 1ꢀ, C = 5pF, T = T
to T
, unless otherwise noted. ≥ +25°C
L
L
A
MIN
MAX
guaranteed by production test, < +25°C guaranteed by design and characterization. Typical values are at T = +25°C.)
A
PARAMETER
Clock Duty Cycle
SYMBOL
CONDITIONS
MIN
TYP
40 to 60
350
MAX
UNITS
ꢀ
Set by clock management circuit
Aperture Delay
t
ps
AD
Aperture Jitter
t
0.2
ps
RMS
AJ
CLOCK INPUTS (CLKP, CLKN)
Differential Clock Input Amplitude
(Note 2)
200
500
mV
P-P
Clock Input Common-Mode
Voltage Range
1.15
0.25
V
Clock Differential Input
Resistance
11
25ꢀ
R
C
kΩ
CLK
Clock Differential Input
Capacitance
5
pF
CLK
DYNAMIC CHARACTERISTICS (at -0.5dBFS)
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
f
IN
= 10MHz, T ≥ +25°C
56.5
55.5
57.5
57.1
57.1
56.5
57.4
57
A
= 100MHz, T ≥ +25°C
A
Signal-to-Noise Ratio
SNR
SINAD
SFDR
dB
dB
= 180MHz
= 500MHz
= 10MHz, T ≥ +25°C
56
55
A
= 100MHz, T ≥ +25°C
A
Signal-to-Noise
and Distortion
= 180MHz
= 500MHz
56.7
55.3
77
= 10MHz, T ≥ +25°C
65
64
A
= 100MHz, T ≥ +25°C
72
Spurious-Free
Dynamic Range
A
dBc
dBc
= 180MHz
= 500MHz
= 10MHz
67
63.5
-77
= 100MHz
= 180MHz
= 500MHz
-72
Worst Harmonics
(HD2 or HD3)
-67
-63.5
f
f
= 99MHz at -7dBFS,
= 101MHz at -7dBFS
IN1
IMD
IMD
-79
-60
100
IN2
Two-Tone Intermodulation
Distortion
dBc
mV
f
f
= 499MHz at -7dBFS,
= 503MHz at -7dBFS
IN1
IN2
500
LVDS DIGITAL OUTPUTS (D0P/N–D9P/N, ORP/N)
Differential Output Voltage |V
|
250
450
OD
_______________________________________________________________________________________
3
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
ELECTRICAL CHARACTERISTICS (continued)
(AV
= OV
= 1.8V, V
= V
= 0, f
= 170MHz, differential sine-wave clock input drive, 0.1µF capacitor on REFIO,
SAMPLE
AGND
OGND
CC
CC
internal reference, digital output pins differential R = 100Ω 1ꢀ, C = 5pF, T = T
to T
, unless otherwise noted. ≥ +25°C
L
L
A
MIN
MAX
guaranteed by production test, < +25°C guaranteed by design and characterization. Typical values are at T = +25°C.)
A
PARAMETER
SYMBOL
OV
CONDITIONS
MIN
TYP
MAX
UNITS
Output Offset Voltage
1.125
1.310
V
OS
LVCMOS DIGITAL INPUTS (CLKDIV, T/B)
1
0.2 x
Digital Input Voltage Low
Digital Input Voltage High
V
V
V
IL
AV
CC
0.8 x
V
IH
AV
CC
TIMING CHARACTERISTICS
CLK to Data Propagation Delay
CLK to DCLK Propagation Delay
t
Figure 4
Figure 4
1.5
ns
ns
PDL
t
3.43
CPDL
t
-
CPDL
Data Valid to DCLK Rising Edge
Figure 4 (Note 2)
20ꢀ to 80ꢀ, C = 5pF
1.67
1.93
2.35
ns
t
ADL
LVDS Output Rise-Time
LVDS Output Fall-Time
t
460
460
ps
ps
RISE
L
t
20ꢀ to 80ꢀ, C = 5pF
L
FALL
Clock
cycles
Output Data Pipeline Delay
t
8
LATENCY
POWER REQUIREMENTS
Analog Supply Voltage Range
Digital Supply Voltage Range
Analog Supply Current
AV
OV
1.7
1.7
1.8
1.8
210
45
1.9
1.9
275
75
V
V
CC
CC
I
f
f
f
= 100MHz
= 100MHz
= 100MHz
mA
AVCC
OVCC
IN
IN
IN
Digital Supply Current
Total Power Dissipation
I
mA
P
460
1.6
1.9
630
mW
mV/V
ꢀFS/V
DISS
Offset
Gain
Power-Supply Rejection Ratio
(Note 3)
PSRR
Note 1: Static linearity and offset parameters are computed from a best-fit straight line through the code transition points. The full-
scale range is defined as 1023 x slope of the line.
Note 2: Parameter guaranteed by design and characterization; T = T
to T
.
MAX
A
MIN
Note 3: PSRR is measured with both analog and digital supplies connected to the same potential.
_______________________________________________________________________________________
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
MAX12
Typical Operating Characteristics
(AV
= OV
= 1.8V, V
= V
= 0, f
OGND
= 170.0057MHz, -0.5dBFS; see TOCs for detailed information on test condi-
SAMPLE
AGND
CC
CC
tions, differential input drive, differential sine-wave clock input drive, 0.1µF capacitor on REFIO, internal reference, digital output pins
differential R = 100Ω, T = +25°C.)
L
A
FFT PLOT (8192-POINT DATA RECORD,
COHERENT SAMPLING)
FFT PLOT (8192-POINT DATA RECORD,
COHERENT SAMPLING)
FFT PLOT (8192-POINT DATA RECORD,
COHERENT SAMPLING)
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
f
f
= 170.0057MHz
= 183.5157MHz
f
f
= 170.0057MHz
= 60.0374MHz
f
f
= 170.0057MHz
= 11.5177MHz
SAMPLE
IN
SAMPLE
IN
SAMPLE
IN
A
IN
= -0.4706dBFS
A
IN
= -0.4795dBFS
A
IN
= -0.5065dBFS
SNR = 56.7dB
SNR = 57.5dB
SNR = 57.7dB
SFDR = 66.8dBc
HD2 = -79.3dBc
HD3 = -66.8dBc
SFDR = 77.7dBc
HD2 = -79.8dBc
HD3 = -77.7dBc
SFDR = 77.7dBc
HD2 = -77.7dBc
HD3 = -86.3dBc
HD3
HD2
HD2
HD3
HD2
HD3
0
10 20 30 40 50 60 70 80 90
ANALOG INPUT FREQUENCY (MHz)
0
10 20 30 40 50 60 70 80 90
ANALOG INPUT FREQUENCY (MHz)
0
10 20 30 40 50 60 70 80 90
ANALOG INPUT FREQUENCY (MHz)
SFDR vs. ANALOG INPUT FREQUENCY
= 169.984MHz, A = -0.5dBFS)
FFT PLOT (8192-POINT DATA RECORD,
COHERENT SAMPLING)
SNR vs. ANALOG INPUT FREQUENCY
= 169.984MHz, A = -0.5dBFS)
(f
(f
SAMPLE
IN
SAMPLE
IN
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
80
75
70
65
60
55
50
45
59
58
57
56
55
f
f
= 170.0057MHz
= 500.516MHz
SAMPLE
IN
A
IN
= -0.5155dBFS
SNR = 55.9dB
SFDR = 63.5dBc
HD2 = -68.6dBc
HD3 = -63.5dBc
HD2
HD3
40
35
54
53
30
0
100
200
f
300
(MHz)
400
500
0
10 20 30 40 50 60 70 80 90
ANALOG INPUT FREQUENCY (MHz)
0
100
200
f
300
(MHz)
400
500
IN
IN
SNR vs. ANALOG INPUT AMPLITUDE
SFDR vs. ANALOG INPUT AMPLITUDE
= 170.0057MHz, f = 60.0374MHz)
(f
= 170.0057MHz, f = 60.0374MHz)
(f
SAMPLE
IN
SAMPLE
IN
-50
-60
62
80
57
52
47
42
37
75
70
65
60
55
50
HD3
-70
HD2
-80
-90
32
27
-100
-28 -24 -20 -16 -12
-8
-4
0
-28 -24 -20 -16 -12
-8
-4
0
0
100
200
300
(MHz)
400
500
ANALOG INPUT AMPLITUDE (dBFS)
ANALOG INPUT AMPLITUDE (dBFS)
f
IN
_______________________________________________________________________________________
5
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
Typical Operating Characteristics (continued)
(AV
= OV
= 1.8V, V
= V
= 0, f
OGND
= 170.0057MHz, -0.5dBFS; see TOCs for detailed information on test condi-
SAMPLE
AGND
CC
CC
tions, differential input drive, differential sine-wave clock input drive, 0.1µF capacitor on REFIO, internal reference, digital output pins
differential R = 100Ω, T = +25°C.)
L
A
HD2/HD3 vs. ANALOG INPUT AMPLITUDE
= 170.0057MHz, f = 60.0374MHz)
SNR vs. f
SAMPLE
SFDR vs. f
(f = 60.0374MHz, A = -0.5dBFS)
SAMPLE
IN
(f
-50
(f = 60.0374MHz, A = -0.5dBFS)
SAMPLE
IN
IN
IN
IN
60
59
58
57
56
55
54
53
52
51
50
90
80
70
60
50
40
-55
MAX12
-60
-65
-70
-75
-80
-85
-90
HD2
HD3
-28 -24 -20 -16 -12
-8
-4
0
20
50
80
110
140
170
20
50
80
110
140
170
ANALOG INPUT AMPLITUDE (dBFS)
f
(MHz)
f
(MHz)
SAMPLE
SAMPLE
HD2/HD3 vs. f
SAMPLE
TWO-TONE IMD PLOT (8192-POINT
DATA RECORD, COHERENT SAMPLING)
INTEGRAL NONLINEARITY
vs. DIGITAL OUTPUT CODE
(f = 60.0374MHz, A = -0.5dBFS)
IN
IN
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-60
-68
0.5
0.4
f
f
f
= 170.0057MHz
= 99.0109MHz
SAMPLE
IN1
IN2
= 101.0031MHz
= A = -7dBFS
0.3
HD3
A
IN1
IN2
f
IN2
0.2
IMD = -79dBc
f
IN1
-76
0.1
0
-84
2f
-
-0.1
-0.2
-0.3
-0.4
-0.5
IN1
HD2
2f - f
IN2 IN1
f
IN2
-92
-100
20
50
80
110
140
170
0
10 20 30 40 50 60 70 80 90
ANALOG INPUT FREQUENCY (MHz)
0
128 256 384 512 640 768 896 1024
DIGITAL OUTPUT CODE
f
(MHz)
SAMPLE
DIFFERENTIAL NONLINEARITY
vs. DIGITAL OUTPUT CODE
GAIN BANDWIDTH PLOT
SNR vs. TEMPERATURE (f = 64.9994MHz,
IN
(f
= 170.0057MHz, A = -0.5dBFS)
f
= 169.984MHz, A = -0.5dBFS)
SAMPLE
IN
SAMPLE
IN
0.5
0.4
2
0
60
59
58
57
56
55
54
53
52
51
50
0.3
-2
0.2
0.1
-4
0
-6
-0.1
-0.2
-0.3
-0.4
-0.5
-8
-10
-12
10
100
ANALOG INPUT FREQUENCY (MHz)
1000
128 256 384 512 640 768 896 1024
DIGITAL OUTPUT CODE
-40
-15
10
35
60
85
°
TEMPERATURE ( C)
6
_______________________________________________________________________________________
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
MAX12
Typical Operating Characteristics (continued)
(AV
= OV
= 1.8V, V
= V
= 0, f
OGND
= 170.0057MHz, -0.5dBFS; see TOCs for detailed information on test condi-
SAMPLE
AGND
CC
CC
tions, differential input drive, differential sine-wave clock input drive, 0.1µF capacitor on REFIO, internal reference, digital output pins
differential R = 100Ω, T = +25°C.)
L
A
SINAD vs. TEMPERATURE (f = 64.9994MHz,
SFDR vs. TEMPERATURE (f = 64.9994MHz,
POWER DISSIPATION vs. f
SAMPLE
IN
IN
f
= 169.984MHz, A = -0.5dBFS)
f
= 169.984MHz, A = -0.5dBFS)
(f = 60.0374MHz, A = -0.5dBFS)
SAMPLE
IN
SAMPLE
IN
IN
IN
60
59
80
75
70
65
60
55
50
480
474
468
462
456
450
444
438
432
426
420
58
57
56
55
54
53
52
51
50
-40
-15
10
35
60
85
-40
-15
10
35
60
85
20
50
80
110
140
170
°
°
TEMPERATURE ( C)
TEMPERATURE ( C)
f
(MHz)
SAMPLE
INTERNAL REFERENCE vs. SUPPLY VOLTAGE
(f = 170.0057MHz)
SNR vs. VOLTAGE SUPPLY
FS VOLTAGE vs. FS ADJUST RESISTOR
(f = 60.0374MHz, A = -0.5dBFS)
SAMPLE
MEASURED AT THE REFIO PIN
IN
IN
1.34
1.32
1.30
1.28
1.26
1.24
1.22
1.20
1.18
1.16
1.2370
1.2365
1.2360
1.2355
1.2350
1.2345
1.2340
60
59
58
57
56
55
54
53
52
51
50
FIGURE 6
AV = OV
CC
CC
REFADJ = AV = OV
CC
CC
RESISTOR VALUE APPLIED
BETWEEN REFADJ AND AGND
RESISTOR VALUE APPLIED
BETWEEN REFADJ AND REFIO
0
100 200 300 400 500 600 700 800 900 1000
1.5
1.6
1.7
1.8
1.9
2.0
2.1
1.5
1.6
1.7
1.8
1.9
2.0
2.1
FS ADJUST RESISTOR (Ω)
SUPPLY VOLTAGE (V)
VOLTAGE SUPPLY (V)
NOISE HISTOGRAM
(DC INPUT, 256k-POINT DATA RECORD)
PROPAGATION DELAY TIMES
vs. TEMPERATURE
6
2.0E+05
1.6E+05
1.2E+05
8.0E+04
4.0E+04
0.0E+00
f
= 169.984MHz
SAMPLE
199841
5
4
3
2
1
0
t
CPDL
59838
513
t
PDL
2412
511
53
514
512
515
-40
-15
10
35
60
85
DIGITAL OUTPUT NOISE
TEMPERATURE (°C)
_______________________________________________________________________________________
7
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
Typical Operating Characteristics (continued)
(AV
= OV
= 1.8V, V
= V
= 0, f
OGND
= 170.0057MHz, -0.5dBFS; see TOCs for detailed information on test condi-
SAMPLE
AGND
CC
CC
tions, differential input drive, differential sine-wave clock input drive, 0.1µF capacitor on REFIO, internal reference, digital output pins
differential R = 100Ω, T = +25°C.)
L
A
SINAD vs. CLOCK DUTY CYCLE (f = 1.4006MHz,
IN
NOISE POWER RATIO PLOT
f
= 169.984MHz, A = -0.5dBFS)
SAMPLE
IN
60
59
-40
-50
MAX12
58
57
56
-60
-70
55
54
53
-80
-90
52
51
50
f
f
= 170MHz
= 28.8MHz
SAMPLE
NOTCH
-100
NPR = 53.7dB
5
10
15
20
25
30
35
30
36
42
48
54
60
66
72
ANALOG INPUT FREQUENCY (MHz)
CLOCK DUTY CYCLE (%)
Pin Description
PIN
NAME
AV
FUNCTION
1, 6, 11–14, 20, 25,
62, 63, 65
Analog Supply Voltage. Bypass each pin with a 0.1µF capacitor for best decoupling results.
Analog Converter Ground. Connect the converter’s exposed pad (EP) to AGND.
CC
2, 5, 7, 10, 15, 16,
18, 19, 21, 24, 64,
66, 67, EP
AGND
REFIO
Reference Input/Output. With REFADJ pulled high through a 1kΩ resistor, this I/O port allows
an external reference source to be connected to the MAX1122. With REFADJ pulled low
through the same 1kΩ resistor, the internal 1.23V bandgap reference is active.
3
Reference-Adjust Input. REFADJ allows for full-scale range adjustments by placing a resistor
or trim potentiometer between REFADJ and AGND (decreases FS range) or REFADJ and
REFIO (increases FS range). If REFADJ is connected to AV
through a 1kΩ resistor, the
CC
4
REFADJ
internal reference can be overdriven with an external source connected to REFIO. If REFADJ
is connected to AGND through a 1kΩ resistor, the internal reference is used to determine the
full-scale range of the data converter.
8
9
INP
INN
Positive Analog Input Terminal
Negative Analog Input Terminal
Clock Divider Input. This LVCMOS-compatible input controls which speed the converter’s
digital outputs are updated. CLKDIV has an internal pulldown resistor.
CLKDIV = 0: ADC updates digital outputs at one-half the input clock rate.
CLKDIV = 1: ADC updates digital outputs at the input clock rate.
17
CLKDIV
True Clock Input. This input requires an LVDS-compatible input level to maintain the
converter’s excellent performance.
22
23
CLKP
CLKN
Complementary Clock Input. This input requires an LVDS-compatible input level to maintain
the converter’s excellent performance.
8
_______________________________________________________________________________________
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
MAX12
Pin Description (continued)
PIN
NAME
FUNCTION
Digital Converter Ground. Ground connection for digital circuitry and output drivers.
Digital Supply Voltage. Bypass with a 0.1µF capacitor for best decoupling results.
No Connection. Do not connect to these pins.
Complementary Output Bit 0 (LSB)
26, 45, 61
OGND
27, 28, 41, 44, 60
OV
CC
29–32
33
N.C.
D0N
D0P
D1N
D1P
D2N
D2P
D3N
D3P
34
True Output Bit 0 (LSB)
35
Complementary Output Bit 1
36
True Output Bit 1
37
Complementary Output Bit 2
38
True Output Bit 2
39
Complementary Output Bit 3
40
True Output Bit 3
Complementary Clock Output. This output provides an LVDS-compatible output level and can
be used to synchronize external devices to the converter clock. There is a 2.1ns delay
between CLKN and DCLKN.
42
43
DCLKN
DCLKP
True Clock Output. This output provides an LVDS-compatible output level and can be used to
synchronize external devices to the converter clock. There is a 2.1ns delay between CLKP
and DCLKP.
46
47
48
49
50
51
52
53
54
55
56
57
D4N
D4P
D5N
D5P
D6N
D6P
D7N
D7P
D8N
D8P
D9N
D9P
Complementary Output Bit 4
True Output Bit 4
Complementary Output Bit 5
True Output Bit 5
Complementary Output Bit 6
True Output Bit 6
Complementary Output Bit 7
True Output Bit 7
Complementary Output Bit 8
True Output Bit 8
Complementary Output Bit 9 (MSB)
True Output Bit 9 (MSB)
Complementary Output for Out-of-Range Control Bit. If an out-of-range condition is detected,
bit ORN flags this condition by transitioning low.
58
59
ORN
ORP
True Output for Out-of-Range Control Bit. If an out-of-range condition is detected, bit ORP
flags this condition by transitioning high.
Two’s Complement or Binary Output Format Selection. This LVCMOS-compatible input
controls the digital output format of the MAX1122. T/B has an internal pulldown resistor.
T/B = 0: Two’s complement output format
68
T/B
T/B = 1: Binary output format
_______________________________________________________________________________________
9
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
CLKDIV
DCLKP
DCLKN
CLKP
CLKN
CLOCK-
DIVIDER
CONTROL
CLOCK
MANAGEMENT
INPUT
BUFFER
INP
INN
LVDS
DATA PORT
10-BIT PIPELINE
QUANTIZER CORE
T/H
D0P/N–D9P/N
MAX12
10
2.2kΩ
2.2kΩ
ORP
ORN
REFERENCE
COMMON-MODE
BUFFER
MAX1122
REFIO
REFADJ
Figure 1. MAX1122 Block Diagram
REFERENCE-
SCALING
AV
CC
ADC FULL-SCALE = REFT - REFB
AMPLIFIER
REFT
REFB
G
INP
INN
REFERENCE
BUFFER
REFIO
2.2kΩ
2.2kΩ
0.1μF
1kΩ
1V
REFADJ
TO COMMON-MODE INPUT
TO COMMON-MODE INPUT
AGND
CONTROL LINE TO
DISABLE REFERENCE
BUFFER
Figure 2. Simplified Analog Input Architecture
AV
AV /2
CC
CC
Detailed Description—Theory
of Operation
The MAX1122 uses a fully differential, pipelined archi-
tecture that allows for high-speed conversion, opti-
mized accuracy and linearity, while minimizing power
consumption and die size.
Figure 3. Simplified Reference Architecture
nal, and controls a 2-bit digital-to-analog converter
(DAC). Digitized and reference signals are then subtract-
ed, resulting in a fractional residue signal that is amplified
before it is passed on to the next stage through another
T/H amplifier. This process is repeated until the applied
input signal has successfully passed through all stages of
the 10-bit quantizer. Finally, the digital outputs of all
stages are combined and corrected for in the digital cor-
rection logic to generate the final output code. The result
is a 10-bit parallel digital output word in user-selectable
two’s complement or binary output formats with LVDS-
compatible output levels. See Figure 1 for a more detailed
view of the MAX1122 architecture.
Both positive (INP) and negative/complementary analog
input terminals (INN) are centered around a common-
mode voltage of 1.4V, and accept a differential analog
input voltage swing of 0.3125V each, resulting in a typi-
cal differential full-scale signal swing of 1.25V
.
P-P
INP and INN are buffered prior to entering each track-
and-hold (T/H) stage and are sampled when the differ-
ential sampling clock signal transitions high. A 2-bit
ADC following the first T/H stage then digitizes the sig-
10 ______________________________________________________________________________________
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
MAX12
SAMPLING EVENT
SAMPLING EVENT
SAMPLING EVENT
SAMPLING EVENT
INN
INP
CLKN
CLKP
t
t
CL
CH
t
AD
N
N + 1
N + 8
N + 9
t
CPDL
t
LATENCY
DCLKP
DCLKN
N - 8
N - 7
N
N + 1
t
- t
CPDL PDL
t
PDL
D0P/N–D9P/N
ORP/N
N - 8
N - 7
N - 1
N
N + 1
t
- t ~ 0.4 x t
with t
= 1/f
CPDL PDL
SAMPLE
SAMPLE SAMPLE
NOTE: THE ADC SAMPLES ON THE RISING EDGE OF CLKP. THE RISING EDGE OF DCLKP CAN BE USED TO EXTERNALLY LATCH THE OUTPUT DATA.
Figure 4. System and Output Timing Diagram
OV
CC
Analog Inputs (INP, INN)
INP and INN are the fully differential inputs of the
MAX1122. Differential inputs usually feature good rejec-
tion of even-order harmonics, which allows for enhanced
AC performance as the signals are progressing through
the analog stages. The MAX1122 analog inputs are self-
biased at a common-mode voltage of 1.4V and allow a
differential input voltage swing of 1.25V . Both inputs
P-P
are self-biased through 2.2kΩ resistors, resulting in a
typical differential input resistance of 4.4kΩ. It is recom-
mended to drive the analog inputs of the MAX1122 in
AC-coupled configuration to achieve best dynamic per-
formance. See the AC-Coupled Analog Inputs section for
a detailed discussion of this configuration.
V
V
ON
OP
2.2kΩ
2.2kΩ
On-Chip Reference Circuit
The MAX1122 features an internal 1.23V bandgap ref-
erence circuit (Figure 3), which, in combination with an
internal reference-scaling amplifier, determines the full-
scale range of the MAX1122. Bypass REFIO with a
0.1µF capacitor to AGND. To compensate for gain
errors or increase the ADC’s full-scale range, the volt-
age of this bandgap reference can be indirectly adjust-
ed by adding an external resistor (e.g., 100kΩ trim
potentiometer) between REFADJ and AGND or REFADJ
and REFIO. See the Applications Information section for
a detailed description of this process.
OGND
Figure 5. Simplified LVDS Output Architecture
Clock Inputs (CLKP, CLKN)
Designed for a differential LVDS clock input drive, it is
recommended to drive the clock inputs of the MAX1122
with an LVDS-compatible clock to achieve the best
______________________________________________________________________________________ 11
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
Table 1. MAX1122 Digital Output Coding
BINARY
DIGITAL OUTPUT CODE
(D9–D0)
TWO’S COMPLEMENT
DIGITAL OUTPUT CODE
(D9–D0)
INP ANALOG
VOLTAGE LEVEL
INN ANALOG
VOLTAGE LEVEL
OUT-OF-RANGE
ORP (ORN)
11 1111 1111
(exceeds positive full scale,
OR set)
01 1111 1111
(exceeds positive full scale,
OR set)
> V
+ 0.3125V
< V
- 0.3125V
CM
1 (0)
0 (1)
0 (1)
0 (1)
1 (0)
CM
MAX12
11 1111 1111
(represents positive full
scale)
01 1111 1111
(represents positive full
scale)
V
+ 0.3125V
V
- 0.3125V
CM
CM
10 0000 0000 or
01 1111 1111
(represents midscale)
00 0000 0000 or
11 1111 1111
(represents midscale)
V
V
CM
CM
00 0000 0000
(represents negative full
scale)
10 0000 0000
(represents negative full
scale)
V
- 0.3125V
V
+ 0.3125V
CM
CM
00 0000 0000
10 0000 0000
(exceeds negative full scale, (exceeds negative full scale,
OR set) OR set)
< V
- 0.3125V
> V
+ 0.3125V
CM
CM
dynamic performance. The clock signal source must be
a high-quality, low phase noise to avoid any degrada-
tion in the noise performance of the ADC. The clock
inputs (CLKP, CLKN) are internally biased to 1.2V,
can be used to synchronize external devices (e.g.,
FPGAs) to the ADC. DCLKP and DCLKN are differential
outputs with LVDS-compatible voltage levels. There is a
2.1ns delay time between the rising (falling) edge of
CLKP (CLKN) and the rising edge of DCLKP (DCLKN).
See Figure 4 for timing details.
accept a differential signal swing of 0.2V
to 1.0V
P-P
P-P
and are usually driven in AC-coupled configuration.
See the Differential, AC-Coupled Clock Input in the
Applications Information section for more circuit details
on how to drive CLKP and CLKN appropriately.
Although not recommended, the clock inputs also
accept a single-ended input signal.
Divide-by-2 Clock Control (CLKDIV)
The MAX1122 offers a clock control line (CLKDIV),
which supports the reduction of clock jitter in a system.
Connect CLKDIV to OGND to enable the ADC’s internal
divide-by-2 clock divider. Data is now updated at one-
half the ADC’s input clock rate. CLKDIV has an internal
pulldown resistor and can be left open for applications
that only operate with update rates one-half of the con-
The MAX1122 also features an internal clock manage-
ment circuit (duty-cycle equalizer) that ensures that the
clock signal applied to inputs CLKP and CLKN is
processed to provide a 50ꢀ duty cycle clock signal,
which desensitizes the performance of the converter to
variations in the duty cycle of the input clock source.
Note that the clock duty-cycle equalizer cannot be
turned off externally and requires a minimum clock fre-
quency of >20MHz to work appropriately and accord-
ing to data sheet specifications.
verter’s sampling rate. Connecting CLKDIV to OV
CC
allows data to be updated at the speed of the ADC input
clock.
System Timing Requirements
Figure 4 depicts the relationship between the clock
input and output, analog input, sampling event, and
data output. The MAX1122 samples on the rising
(falling) edge of CLKP (CLKN). Output data is valid on
the next rising (falling) edge of the DCLKP (DCLKN)
clock, but has an internal latency of nine clock cycles.
Clock Outputs (DCLKP, DCLKN)
The MAX1122 features a differential clock output, which
can be used to latch the digital output data with an
external latch or receiver. Additionally, the clock output
12 ______________________________________________________________________________________
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
MAX12
Digital Outputs (D0P/N–D9P/N, DCLKP/N,
ORP/N) and Control Input T/B
ADC FULL-SCALE = REFT - REFB
REFERENCE-
SCALING
The digital outputs D0P/N–D9P/N, DCLKP/N, and
ORP/N are LVDS compatible, and data on
D0P/N–D9P/N is presented in either binary or two’s
complement format (Table 1). The T/B control line is an
LVCMOS-compatible input, which allows the user to
select the desired output format. Pulling T/B low outputs
data in two’s complement and pulling it high presents
data in offset binary format on the 10-bit parallel bus.
T/B has an internal pulldown resistor and may be left
unconnected in applications using only two’s comple-
ment output format. All LVDS outputs provide a typical
voltage swing of 0.4V around a common-mode voltage
of approximately 1.2V, and must be terminated at the
far end of each transmission line pair (true and comple-
mentary) with 100Ω. The LVDS outputs are powered
from a separate power supply, which can be operated
between 1.7V and 1.9V.
AMPLIFIER
REFT
REFB
G
REFERENCE
BUFFER
REFIO
0.1μF
13kΩ TO 1MΩ
13kΩ TO 1MΩ
1V
REFADJ
CONTROL LINE TO
DISABLE REFERENCE
BUFFER
AV
AV /2
CC
CC
Figure 6. Circuit Suggestions to Adjust the ADC’s Full-Scale
Range
The MAX1122 offers an additional differential output
pair (ORP, ORN) to flag out-of-range conditions, where
out of range is above positive or below negative full
scale. An out-of-range condition is identified with ORP
(ORN) transitioning high (low).
Applications Information
Full-Scale Range Adjustments Using the
Internal Bandgap Reference
Note: Although differential LVDS reduces single-ended
transients to the supply and ground planes, capacitive
loading on the digital outputs should still be kept as low
as possible. Using LVDS buffers on the digital outputs
of the ADC when driving off-board may improve overall
performance and reduce system timing constraints.
The MAX1122 supports a full-scale adjustment range of
10ꢀ ( 5ꢀ). To decrease the full-scale range, an exter-
nal resistor value ranging from 13kΩ to 1MΩ may be
added between REFADJ and AGND. A similar
approach can be taken to increase the ADCs full-scale
range. Adding a variable resistor, potentiometer, or pre-
V
CLK
0.1μF
8
0.1μF
SINGLE-ENDED
INPUT TERMINAL
7
6
0.1μF
50Ω
2
150Ω
MC100LVEL16
AV OV
CC CC
0.1μF
3
CLKN CLKP
INP
INN
150Ω
D0P/N–D9P/N
10
510Ω
510Ω
4
5
0.01μF
MAX1122
VGND
AGND
OGND
Figure 7. Differential, AC-Coupled, PECL-Compatible Clock Input Configuration
______________________________________________________________________________________ 13
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
AV
CC
OV
CC
SINGLE-ENDED
INPUT TERMINAL
0.1μF
15Ω
15Ω
ADT1–1WT
INP
INN
D0P/N–D9P/N
10
25Ω
25Ω
MAX1122
MAX12
0.1μF
AGND
OGND
Figure 8. Transformer-Coupled Analog Input Configuration with Secondary-Side Termination
determined resistor value between REFADJ and REFIO
increases the full-scale range of the data converter.
Figure 6 shows the two possible configurations and
AV
CC
OV
CC
SINGLE-ENDED
INPUT TERMINAL
0.1μF
INP
INN
their impact on the overall full-scale range adjustment
of the MAX1122. Do not use resistor values of less than
13kΩ to avoid instability of the internal gain regulation
loop for the bandgap reference.
D0P/N–D9P/N
10
50Ω
MAX1122
0.1μF
Differential, AC-Coupled, PECL-Compatible
Clock Input
25Ω
The preferred method of clocking the MAX1122 is differ-
entially with LVDS- or PECL-compatible input levels. To
accomplish this, a 50Ω reverse-terminated clock signal
source with low phase noise is AC-coupled into a fast
differential receiver such as the MC100LVEL16 (Figure
7). The receiver produces the necessary PECL output
levels to drive the clock inputs of the data converter.
AGND
OGND
Figure 9. Single-Ended AC-Coupled Analog Input
Configuration
Single-Ended, AC-Coupled Analog Input
Although not recommended, the MAX1122 can be used
in single-ended mode (Figure 9). Analog signals can be
AC-coupled to the positive input INP through a 0.1µF
capacitor and terminated with a 50Ω resistor to AGND.
The negative input should be 25Ω reverse-
terminated and AC grounded with a 0.1µF capacitor.
Differential, AC-Coupled Analog Input
An RF transformer provides an excellent solution to
convert a single-ended source signal to a fully differen-
tial signal, required by the MAX1122 for optimum
dynamic performance. In general, the MAX1122 pro-
vides the best SFDR and THD with fully differential input
signals and it is not recommended to drive the ADC
inputs in single-ended configuration. In differential input
mode, even-order harmonics are usually lower since
INP and INN are balanced, and each of the ADC inputs
only requires half the signal swing compared to a sin-
gle-ended configuration.
Grounding, Bypassing, and Board
Layout Considerations
The MAX1122 requires board layout design techniques
suitable for high-speed data converters. This ADC pro-
vides separate analog and digital power supplies. The
analog and digital supply voltage pins accept input volt-
age ranges of 1.7V to 1.9V. Although both supply types
can be combined and supplied from one source, it is
recommended to use separate sources to cut down on
performance degradation caused by digital switching
currents, which can couple into the analog supply net-
Figure 8 depicts a secondary-side termination of the 1:1
transformer into two separate 25Ω loads. Terminating the
transformer in this fashion reduces the potential effects of
transformer parasitics. The source impedance combined
with the shunt capacitance provided by a PCB and the
ADC’s parasitic capacitance reduce the combined band-
width to approximately 550MHz.
work. Isolate analog and digital supplies (AV
OV ) where they enter the PCB with separate networks
and
CC
CC
14 ______________________________________________________________________________________
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
MAX12
BYPASSING—BOARD LEVEL
BYPASSING—ADC LEVEL
AV
CC
AV
CC
OV
CC
ANALOG POWER-
SUPPLY SOURCE
1μF
10μF
47μF
0.1μF
0.1μF
AGND
OGND
D0P/N–D9P/N
OV
CC
MAX1122
10
DIGITAL/OUTPUT-
DRIVER POWER-
SUPPLY SOURCE
1μF
10μF
47μF
AGND
OGND
NOTE: EACH POWER-SUPPLY PIN (ANALOG AND DIGITAL)
SHOULD BE DECOUPLED WITH AN INDIVIDUAL 0.1μF CAPACITOR CLOSE TO THE ADC.
Figure 10. Grounding, Bypassing, and Decoupling Recommendations for the MAX1122
of ferrite beads and capacitors to their corresponding
grounds (AGND, OGND).
be positioned throughout the layout to divert digital
switching currents away from the sensitive analog sec-
tions of the ADC. This does not require additional
ground splitting, but can be accomplished by placing
substantial ground connections between the analog
front end and the digital outputs.
To achieve optimum performance, provide each supply
with a separate network of a 47µF tantalum capacitor in
parallel with 10µF and 1µF ceramic capacitors.
Additionally, the ADC requires each supply pin to be
bypassed with separate 0.1µF ceramic capacitors
(Figure 10). Locate these capacitors directly at the ADC
supply pins or as close as possible to the MAX1122.
Choose surface-mount capacitors, which are preferably
located on the same side as the converter, to save
space and minimize the inductance.
The MAX1122 is packaged in a 68-pin QFN-EP pack-
age (package code: G6800-4), providing greater
design flexibility, increased thermal efficiency, and opti-
mized AC performance of the ADC. The EP must be
soldered down to AGND.
In this package, the data converter die is attached to
an EP lead frame with the back of this frame exposed at
the package bottom surface, facing the PCB side of the
package. This allows a solid attachment of the package
to the PCB with standard infrared (IR) flow soldering
techniques.
Multilayer boards with separated ground and power
planes produce the highest level of signal integrity.
Consider the use of a split ground plane arranged to
match the physical location of analog and digital
ground on the ADC’s package. The two ground planes
should be joined at a single point so the noisy digital
ground currents do not interfere with the analog ground
plane. A major concern with this approach are the
dynamic currents that may need to travel long dis-
tances before they are recombined at a common
source ground, resulting in large and undesirable
ground loops. Ground loops can add to digital noise by
coupling back to the analog front end of the converter,
resulting in increased spur activity and a decreased
noise performance.
Note that thermal efficiency is not the key factor, since
the MAX1122 features low-power operation. The
exposed pad is the key element to ensure a solid
ground connection between the DAC and the PCB’s
analog ground layer.
Considerable care must be taken, when routing the dig-
ital output traces for a high-speed, high-resolution data
converter. It is essential to keep trace lengths at a mini-
mum and place minimal capacitive loading—less than
5pF—on any digital trace to prevent coupling to sensi-
tive analog sections of the ADC. It is recommended to
run the LVDS output traces as differential lines with
100Ω characteristic impedance from the ADC to the
LVDS load device.
Alternatively, all ground pins could share the same
ground plane, if the ground plane is sufficiently isolated
from any noisy, digital systems ground. To minimize the
effects of digital noise coupling, ground return vias can
______________________________________________________________________________________ 15
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
Static Parameter Definitions
CLKP
Integral Nonlinearity (INL)
CLKN
Integral nonlinearity is the deviation of the values on an
actual transfer function from a straight line. This straight
ANALOG
INPUT
line can be either a best straight-line fit or a line drawn
between the end points of the transfer function, once
offset and gain errors have been nullified. However, the
t
AD
static linearity parameters for the MAX1122 are mea-
sured using the histogram method with an input fre-
quency of 10MHz.
t
AJ
MAX12
SAMPLED
DATA (T/H)
Differential Nonlinearly (DNL)
Differential nonlinearity is the difference between an
actual step width and the ideal value of 1 LSB. A DNL
error specification of less than 1 LSB guarantees no
missing codes and a monotonic transfer function. The
MAX1122’s DNL specification is measured with the his-
togram method based on a 10MHz input tone.
HOLD
TRACK
TRACK
T/H
Figure 11. Aperture Jitter/Delay Specifications
Spurious-Free Dynamic Range (SFDR)
SFDR is the ratio of RMS amplitude of the carrier fre-
quency (maximum signal component) to the RMS value
of the next-largest noise or harmonic distortion compo-
nent. SFDR is usually measured in dBc with respect to
the carrier frequency amplitude or in dBFS with respect
to the ADC’s full-scale range.
Dynamic Parameter Definitions
Aperture Jitter
Figure 11 depicts the aperture jitter (t ), which is the
AJ
sample-to-sample variation in the aperture delay.
Aperture Delay
Aperture delay (t ) is the time defined between the
AD
Two-Tone Intermodulation Distortion (IMD)
The two-tone IMD is the ratio expressed in decibels of
either input tone to the worst 3rd-order (or higher) inter-
modulation products. The individual input tone levels
are at -7dB full scale.
falling edge of the sampling clock and the instant when
an actual sample is taken (Figure 11).
Signal-to-Noise Ratio (SNR)
For a waveform perfectly reconstructed from digital
samples, the theoretical maximum SNR is the ratio of
the full-scale analog input (RMS value) to the RMS
quantization error (residual error). The ideal, theoretical
minimum analog-to-digital noise is caused by quantiza-
tion error only and results directly from the ADC’s reso-
lution (N bits):
Pin-Compatible Higher Speed/
Lower Resolution Versions
RESOLUTION
(Bits)
SPEED GRADE
(Msps)
PART
SNR
= 6.02 x N + 1.76
dB dB
dB[max]
MAX1123
MAX1124
MAX1121
10
10
8
210
250
250
In reality, other noise sources such as thermal noise,
clock jitter, signal phase noise, and transfer function
nonlinearities are also contributing to the SNR calcula-
tion and should be considered when determining the
SNR in ADC.
Signal-to-Noise Plus Distortion (SINAD)
SINAD is computed by taking the ratio of the RMS sig-
nal to all spectral components excluding the fundamen-
tal and the DC offset. In case of the MAX1122, SINAD is
computed from a curve fit.
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
68 QFN-EP
G6800-4
21-0122
16 ______________________________________________________________________________________
1.8V, 10-Bit, 170Msps Analog-to-Digital Converter
with LVDS Outputs for Wideband Applications
MAX12
Revision History
REVISION REVISION
PAGES
CHANGED
DESCRIPTION
NUMBER
DATE
10/03
2/04
0
1
Initial release
—
—
—
Minor corrections to the data sheet to fix problems found during off-shore
transfer.
2
8/08
3, 4
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 17
© 2008 Maxim Integrated Products
is a registered trademark of Maxim Integrated Products, Inc.
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