DS8023-RRX+ [MAXIM]

Microprocessor Circuit, CMOS, PDSO28, 0.300 INCH, ROHS COMPLIANT, SOP-28;
DS8023-RRX+
型号: DS8023-RRX+
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

Microprocessor Circuit, CMOS, PDSO28, 0.300 INCH, ROHS COMPLIANT, SOP-28

光电二极管 外围集成电路
文件: 总17页 (文件大小:275K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DS8023  
Smart Card Interface  
General Description  
Features  
The DS8023 smart card interface IC is a low-cost, low-  
power, analog front-end for a smart card reader designed  
for all ISO 7816, EMV*, and GSM11-11 applications. The  
DS8023 supports 5V, 3V, and 1.8V smart cards, and pro-  
vides an option for ultra-low stop-mode power consump-  
tion. The DS8023 is available in 28-pin TSSOP and SO  
packages, and can often be used as a replacement for  
the TDA8024 with little or no application changes.  
o Analog Interface and Level Shifting for IC Card  
Communication  
o
8ꢀk ꢁminꢂ ꢃSD ꢁIꢃCꢂ ꢄrotection on Card Interface  
ꢄins  
o Ultra-Low Stop-Mode Current, Less Than 10nA ꢁtypꢂ  
o Internal IC Card-Supply koltage Generation  
5.0k 5ꢅ, 80mA ꢁmaxꢂ  
The DS8023 is designed to interface between a system  
microcontroller and the smart card interface, providing  
all power supply, protection, and level shifting required  
for IC card applications.  
3.0k 8ꢅ, 65mA ꢁmaxꢂ  
1.8k 10ꢅ, 30mA ꢁmaxꢂ  
o Automatic Card Activation and Deactivation  
Controlled by Dedicated Internal Sequencer  
Applications  
Set-Top Box Conditional Access  
Access Control  
o I/O Lines from Host Directly Level Shifted for  
Smart Card Communication  
o Flexible Card Clocꢀ Generation, Supporting  
ꢃxternal Crystal Frequency Divided by 1, 2, 4, or 8  
Banking Applications  
o High-Current/Short-Circuit and High-Temperature  
POS Terminals  
ꢄrotection  
Debit/Credit Payment Terminals  
PIN Pads  
Pin Configuration  
Automated Teller Machines  
Telecommunications  
TOP VIEW  
Pay/Premium Television  
CLKDIV1  
CLKDIV2  
5V/3V  
1
2
3
4
5
6
7
8
9
28 AUX2IN  
27 AUX1IN  
26 I/OIN  
25 XTAL2  
24 XTAL1  
23 OFF  
Ordering Information  
PART  
TEMP RANGE  
-40°C to +85°C  
-40°C to +85°C  
PIN-PACKAGE  
28 TSSOP  
28 SO  
PGND  
DS8023-RJX+  
DS8023-RRX+  
CP2  
V
DDA  
DS8023  
Note: Contact the factory for availability of other variants and  
package options.  
+Denotes a lead(Pb)-free/RoHS-compliant package.  
CP1  
22 GND  
V
21 V  
DD  
UP  
PRES  
20 RSTIN  
19 CMDVCC  
18 1_8V  
PRES 10  
I/O 11  
Selector Guide appears at end of data sheet.  
AUX2 12  
AUX1 13  
CGND 14  
17 V  
CC  
16 RST  
15 CLK  
SO/TSSOP  
*EMV is a trademark owned by EMVCo LLC. EMV Level 1 library and hardware reference design available. Contact factory for details.  
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be  
simultaneously available through various sales channels. For information about device errata, go to: www.maximintegrated.com/errata.  
For pricing, delivery, and ordering information, please contact Maxim Direct  
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.  
19-6380; Rev 1; 4/13  
DS8023  
Smart Card Interface  
ABSOLUTꢃ MAXIMUM RATINGS  
Voltage Range on V  
Voltage Range on V  
Relative to GND ...............-0.5V to +6.5V  
Maximum Junction Temperature .....................................+125°C  
DD  
DDA  
Relative to PGND...........-0.5V to +6.5V  
Maximum Power Dissipation (T = -40°C to +85°C) .......700mW  
A
Voltage Range on CP1, CP2, and V  
Relative to PGND...............................................-0.5V to +7.5V  
Voltage Range on All Other Pins  
Storage Temperature Range.............................-55°C to +150°C  
Soldering Temperature.........Refer to the IPC/JEDEC J-STD-020  
Specification.  
UP  
Relative to GND......................................-0.5V to (V  
+ 0.5V)  
DD  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
RꢃCOMMꢃNDꢃD DC OꢄꢃRATING CONDITIONS  
(V  
= +3.3V, V = +5.0V, T = +25°C, unless otherwise noted.) (Note 1)  
DDA A  
DD  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX UNITS  
POWER SUPPLY  
Digital Supply Voltage  
V
2.7  
4.0  
3.0  
2.30  
50  
6.0  
6.0  
V
V
DD  
V
V
= 5V, |I | < 80mA  
CC  
CC  
Card-Voltage-Generator Supply Voltage  
V
DDA  
= 5V, |I | < 30mA  
6.0  
CC  
CC  
V
TH2  
Threshold voltage (falling)  
Hysteresis  
2.45  
100  
2.60  
150  
V
Reset Voltage Thresholds  
V
HYS2  
mV  
CURRENT CONSUMPTION  
Active V Current 5V Cards  
DD  
(Including 80mA Draw from 5V Card)  
I
f
= 80mA, f  
= 20MHz,  
XTAL  
CC  
I
I
I
215  
135  
100  
35  
mA  
mA  
mA  
mA  
mA  
DD_50V  
= 10MHz, V  
= 5.0V  
CLK  
DDA  
Active V Current 5V Cards  
DD  
(Current Consumed by DS8023 Only)  
I
= 80mA, f  
= 20MHz,  
CC  
XTAL  
I
DD_IC  
f
= 10MHz, V  
= 5.0V (Note 2)  
CLK  
DDA  
Active V Current 3V Cards  
DD  
(Including 65mA Draw from 3V Card)  
I
f
= 65mA, f  
= 10MHz, V  
= 20MHz,  
XTAL  
CC  
DD_30V  
= 5.0V  
CLK  
DDA  
Active V Current 3V Cards  
DD  
(Current Consumed by DS8023 Only)  
I
= 65mA, f  
= 20MHz,  
CC  
XTAL  
I
DD_IC  
f
= 10MHz, V  
= 5.0V (Note 2)  
CLK  
DDA  
Active V Current 1.8V Cards  
DD  
(Including 30mA Draw from 1.8V Card)  
I
= 30mA, f  
= 20MHz,  
CC  
XTAL  
70  
DD_18V  
f
= 10MHz, V  
= 5.0V  
CLK  
DDA  
Active V Current 1.8V Cards  
DD  
(Current Consumed by DS8023 Only)  
I
= 30mA, f  
= 10MHz, V  
= 20MHz,  
CC  
XTAL  
I
35  
mA  
μA  
nA  
DD_IC  
f
= 5.0V (Note 2)  
CLK  
DDA  
Inactive-Mode Current  
I
Card inactive  
500  
DD  
DD_STOP  
DS8023 in ultra-low-power stop  
mode (Note 3)  
Stop-Mode Current  
I
10  
CLOCK SOURCE  
Crystal Frequency  
f
External crystal  
0
0
20  
20  
MHz  
MHz  
XTAL  
f
XTAL1  
0.3 x  
V
-0.3  
IL_XTAL1  
V
DD  
XTAL1 Operating Conditions  
V
0.7 x  
V
+
0.3  
DD  
V
IH_XTAL1  
V
DD  
C
C
,
XTAL1  
External Capacitance for Crystal  
Internal Oscillator  
15  
pF  
XTAL2  
f
2.7  
MHz  
INT  
2
Maxim Integrated  
DS8023  
Smart Card Interface  
RꢃCOMMꢃNDꢃD DC OꢄꢃRATING CONDITIONS ꢁcontinuedꢂ  
(V  
= +3.3V, V = +5.0V, T = +25°C, unless otherwise noted.) (Note 1)  
DDA A  
DD  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX UNITS  
SHUTDOWN TEMPERATURE  
Shutdown Temperature  
RST PIN  
T
+150  
°C  
SD  
Output Low Voltage  
V
I
= 1mA  
OL_RST  
0
0
0
0.3  
-1  
V
mA  
V
OL_RST1  
Card-Inactive Mode  
Card-Active Mode  
Output Current  
I
V
= 0V  
OL_RST1  
O_LRST  
OL_RST  
Output Low Voltage  
V
I
= 200μA  
0.3  
OL_RST2  
Output High  
Voltage  
V
-
CC  
0.5  
V
I
= -200μA  
V
CC  
V
OH_RST2  
OH_RST  
Rise Time  
Fall Time  
t
C = 30pF  
0.1  
0.1  
μs  
μs  
R_RST  
L
t
C = 30pF  
L
F_RST  
Shutdown Current  
Threshold  
I
-20  
mA  
RST(SD)  
Current Limitation  
RSTIN to RST Delay  
I
-20  
+20  
2
mA  
μs  
RST(LIMIT)  
t
D(RSTIN-RST)  
CLK PIN  
Output Low Voltage  
Output Current  
V
I
= 1mA  
= 0V  
0
0
0
0.3  
-1  
V
mA  
V
OL_CLK1  
OLCLK  
Card-Inactive Mode  
I
V
OL_CLK1  
OLCLK  
Output Low Voltage  
V
I
= 200μA  
0.3  
OL_CLK2  
OLCLK  
Output High  
Voltage  
V
0.5  
-
CC  
V
I
= -200μA  
V
CC  
V
OH_CLK2  
OHCLK  
Rise Time  
t
C = 30pF (Note 4)  
L
8
8
ns  
ns  
R_CLK  
Fall Time  
t
C = 30pF (Note 4)  
L
Card-Active Mode  
F_CLK  
Current Limitation  
Clock Frequency  
Duty Factor  
Slew Rate  
I
-70  
0
+70  
10  
mA  
MHz  
%
CLK(LIMIT)  
f
Operational  
CLK  
C = 30pF  
L
45  
0.2  
55  
SR  
C = 30pF  
L
V/ns  
V
CC  
PIN  
Output Low Voltage  
Output Current  
V
I
= 1mA  
= 0V  
0
0
0.3  
-1  
V
CC1  
CC  
Card-Inactive Mode  
I
V
mA  
CC1  
CC  
I
I
I
< 80mA  
< 65mA  
4.75  
2.78  
1.65  
5.00  
3.00  
1.8  
5.25  
3.22  
1.95  
CC(5V)  
CC(3V)  
CC(1.8V)  
< 30mA  
5V card: current pulses of 40nC  
with I < 200mA, t < 400ns,  
f < 20MHz  
4.6  
5.4  
Card-Active Mode  
Output Low Voltage  
V
CC2  
V
3V card: current pulses of 24nC  
with I < 200mA, t < 400ns,  
f < 20MHz  
2.75  
3.25  
1.8V card: current pulses of 12nC  
with I < 200mA, t < 400ns,  
f < 20MHz  
1.62  
1.98  
Maxim Integrated  
3
DS8023  
Smart Card Interface  
RꢃCOMMꢃNDꢃD DC OꢄꢃRATING CONDITIONS ꢁcontinuedꢂ  
(V  
= +3.3V, V = +5.0V, T = +25°C, unless otherwise noted.) (Note 1)  
DDA A  
DD  
PARAMETER  
SYMBOL  
CONDITIONS  
= 0 to 5V  
MIN  
TYP  
MAX UNITS  
V
V
V
-80  
CC(5V)  
CC(3V)  
CC(1.8V)  
Output Current  
I
mA  
= 0 to 3V  
-65  
-30  
CC2  
= 0 to 1.8V  
Card-Active Mode  
Shutdown Current  
Threshold  
I
120  
mA  
CC(SD)  
Slew Rate  
V
CCSR  
Up/down, C < 300nF (Note 5)  
0.05  
0.16  
0.22  
V/μs  
DATA LINES (I/O AND I/OIN)  
I/O I/OIN Falling Edge Delay  
Pullup Pulse Active Time  
Maximum Frequency  
t
200  
100  
1
ns  
ns  
D(IO-IOIN)  
t
PU  
f
MHz  
pF  
IOMAX  
Input Capacitance  
C
10  
I
I/O, AUX1, AUX2 PINS  
Output Low Voltage  
V
I
= 1mA  
= 0V  
0
0
0.3  
-1  
V
OL_IO1  
OL_IO  
Output Current  
I
V
mA  
OL_IO1  
OL_IO  
Card-Inactive Mode  
Internal Pullup  
Resistor  
R
To V  
7
11  
15  
k  
V
PU_IO  
OL_IO2  
OH_IO2  
CC  
Output Low Voltage  
V
I
I
= 1mA  
0
0.3  
OL_IO  
OH_IO  
Output High  
Voltage  
V
= < -40μA (3V/5V)  
0.75 x V  
V
CC  
V
CC  
Output Rise/Fall  
Time  
Input Low Voltage  
t
C = 30pF (Note 3)  
0.1  
μs  
V
OT  
L
V
-0.3  
1.5  
+0.8  
IL_IO  
IH_IO  
IL_IO  
Input High Voltage  
Input Low Current  
Input High Current  
Input Rise/Fall Time  
Current Limitation  
V
V
CC  
Card-Active Mode  
I
V
V
= 0V  
700  
20  
μA  
μA  
μs  
IL_IO  
IH_IO  
I
= V  
CC  
IH_IO  
t
1.2  
+15  
IT  
IO(LIMIT)  
I
C = 30pF  
L
-15  
-1  
mA  
Current When  
Pullup Active  
I
C = 80pF, V  
L
= 0.9 x V  
DD  
mA  
PU  
OH  
I/OIN, AUX1IN, AUX2IN PINS  
Output Low Voltage  
V
I
= 1mA  
OL  
0
0.3  
V
OL  
OH  
OT  
0.9 x  
V
+
DD  
No load  
V
DD  
0.1  
Output High Voltage  
V
V
0.75 x  
V
+
DD  
I
< -40μA  
OH  
V
DD  
0.1  
Output Rise/Fall Time  
Input Low Voltage  
t
C = 30pF, 10% to 90%  
0.1  
μs  
V
L
0.3 x  
V
-0.3  
IL  
V
DD  
0.7 x  
V
+
0.3  
DD  
Input High Voltage  
V
V
IH  
V
DD  
4
Maxim Integrated  
DS8023  
Smart Card Interface  
RꢃCOMMꢃNDꢃD DC OꢄꢃRATING CONDITIONS ꢁcontinuedꢂ  
(V  
= +3.3V, V = +5.0V, T = +25°C, unless otherwise noted.) (Note 1)  
DDA A  
DD  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX UNITS  
Input Low Current  
I
V
V
V
= 0V  
600  
10  
μA  
μA  
μs  
IL_IO  
IL  
IH  
IL  
Input High Current  
I
= V  
IH_IO  
DD  
IH  
Input Rise/Fall Time  
Integrated Pullup Resistor  
Current When Pullup Active  
t
to V  
1.2  
15  
IT  
R
Pullup to V  
7
11  
kꢀ  
mA  
PU  
PU  
DD  
I
C = 30pF, V  
= 0.9 x V  
DD  
-1  
L
OH  
CONTROL PINS (CLKDIV1, CLKDIV2, CMDVCC, RSTIN, 5V/3V)  
0.3 x  
Input Low Voltage  
Input High Voltage  
V
-0.3  
V
V
IL  
V
DD  
0.7 x  
V
DD  
+
V
IH  
V
DD  
0.3  
5
Input Low Current  
I
0 < V < V  
DD  
μA  
μA  
IL_IO  
IL  
Input High Current  
I
0 < V < V  
DD  
5
IH_IO  
IH  
INTERRUPT OUTPUT PIN (OFF)  
Output Low Voltage  
V
I
I
= 2mA  
0
0.3  
V
V
OL  
OL  
0.75 x  
Output High Voltage  
V
= -15μA  
OH  
OH  
V
DD  
Integrated Pullup Resistor  
R
Pullup to V  
15  
24  
33  
kꢀ  
PU  
DD  
PRES, PRES PINS  
0.3 x  
Input Low Voltage  
Input High Voltage  
V
V
V
IL_PRES  
V
DD  
0.7 x  
V
IH_PRES  
V
DD  
Input Low Current  
Input High Current  
TIMING  
I
V
V
= 0V  
5
5
μA  
μA  
IL_PRES  
IL_PRES  
IH_PRES  
I
= V  
DD  
IH_PRES  
Activation Time  
Deactivation Time  
t
160  
80  
μs  
μs  
ACT  
t
DEACT  
Window Start  
Window End  
t
t
95  
CLK to Card Start  
Time  
3
μs  
160  
8
5
PRES/PRES Debounce Time  
t
ms  
DEBOUNCE  
Note 1: Operation guaranteed at T = -40°C and T = +85°C, but not tested.  
A
A
Note 2: I  
measures the amount of current used by the DS8023 to provide the smart card current minus the load.  
DD_IC  
Note 3: Stop mode is enabled by setting CMDVCC, 5V/3V, and 1_8V to logic-high.  
Note 4: Parameters are guaranteed to meet all ISO 7816, GSM11-11, and EMV 2000 requirements. For the 1.8V card, the maximum  
rise time and fall time is 10ns.  
Note 5: Parameter is guaranteed to meet all ISO 7816, GSM11-11, and EMV 2000 requirements. For the 1.8V card, the minimimum  
slew rate is 0.05V/µs and the maximum slew rate is 0.5V/µs.  
Maxim Integrated  
5
DS8023  
Smart Card Interface  
Pin Description  
PIN  
NAME  
FUNCTION  
CLKDIV1, Clock Divider. Determines the divided-down input clock frequency (presented at XTAL1 or from a  
1, 2  
CLKDIV2  
crystal at XTAL1 and XTAL2) on the CLK output pin. Dividers of 1, 2, 4, and 8 are available.  
5V/3V Selection Pin. Allows selection of 5V or 3V for communication with an IC card. Logic-high  
selects 5V operation; logic-low selects 3V operation. See Table 3 for a complete description of  
choosing card voltages.  
3
5V/3V  
4
PGND  
Analog Ground  
Step-Up Converter Contact. Charge-pump capacitor. Connect a 100nF capacitor (ESR < 100mĀ)  
between CP1 and CP2.  
5, 7  
CP2, CP1  
6
8
V
Charge-Pump Supply. Must be equal to or higher than V . Connect a supply of at least 3.0V.  
DD  
DDA  
V
Charge-Pump Output. Connect a 100nF capacitor (ESR < 100mĀ) between V and GND.  
UP  
UP  
Card Presence Indicator. Active-low card presence inputs. When the presence indicator becomes  
active, a debounce timeout begins. After 8ms (typ) the OFF signal becomes active.  
9
PRES  
Card Presence Indicator. Active-high card presence inputs. When the presence indicator becomes  
active, a debounce timeout begins. After 8ms (typ) the OFF signal becomes active.  
10  
11  
PRES  
I/O  
Smart Card Data-Line Output. Card data communication line, contact C7.  
AUX2,  
AUX1  
Smart Card Auxiliary Line (C4, C8) Output. Data line connected to card reader contacts C4 (AUX1)  
and C8 (AUX2).  
12, 13  
14  
15  
16  
CGND  
CLK  
Smart Card Ground  
Smart Card Clock. Card clock, contact C3.  
Smart Card Reset. Card reset output from contact C2.  
RST  
Smart Card Supply Voltage. Decouple to CGND (card ground) with 2 x 100nF or 100 + 220nF  
capacitors (ESR < 100m).  
17  
18  
V
CC  
1.8V Operation Selection. Active-high selection for 1.8V smart card communication. An active-high  
signal on this pin overrides any setting on the 5V/3V pin.  
1_8V  
19  
20  
21  
22  
23  
CMDVCC Activation Sequence Initiate. Active-low input from host.  
RSTIN  
Card Reset Input. Reset input from the host.  
V
DD  
Supply Voltage  
GND  
Digital Ground  
OFF  
Status Output. Active-low interrupt output to the host. Use a 20kintegrated pullup resistor to V  
.
DD  
Crystal/Clock Input. Connect an input from an external clock to XTAL1 or connect a crystal across  
XTAL1 and XTAL2. For the low idle-mode current variant, an external clock must be driven on  
XTAL1.  
XTAL1,  
XTAL2  
24, 25  
26  
I/OIN  
I/O Input. Host-to-interface chip data I/O line.  
AUX1IN,  
AUX2IN  
27, 28  
C4/C8 Input. Host-to-interface I/O line for auxiliary connections to C4 and C8.  
6
Maxim Integrated  
DS8023  
Smart Card Interface  
mode. (Note that the PORADJ pin is not present in the  
DS8023. It is replaced by the 1_8V selection pin.)  
Detailed Description  
The DS8023 is an analog front-end for communicating  
with 1.8V, 3V, and 5V smart cards. Using an integrated  
charge pump, the DS8023 can operate from a single  
input voltage. The device translates all communication  
lines to the correct voltage level and provides power for  
smart card operation. It can operate from a wide input  
voltage range (3.0V to 6.0V) and provides an extremely  
low-power stop mode, consuming only 10nA while in  
stop mode. The DS8023 is very compatible with the  
NXP TDA8024. Many applications can upgrade with  
very minor hardware changes, and only need to add  
support in software to activate the ultra-low-power stop  
Power Supply  
The DS8023 can operate from a single supply or a dual  
supply. The supply pins for the device are V , GND,  
DD  
V
, and PGND. V  
should be in the 2.7V to 6.0V  
DDA  
DD  
range, and is the supply for signals that interface with  
the host controller. It should, therefore, be the same  
supply as used by the host controller. All smart card  
contacts remain inactive during power on or power off.  
The internal circuits are kept in the reset state until V  
DD  
reaches V  
+ V  
and for the duration of the inter-  
TH2  
HYS2  
nal power-on reset pulse, t . A deactivation sequence  
W
is executed when V  
falls below V  
.
DD  
TH2  
An internal charge pump and regulator generate the  
3V or 5V card supply voltage (V ). The charge pump  
V
DDA  
CARD VOLTAGE  
GENERATOR  
AND  
CC  
PGND  
CP1  
CP2  
V
GND  
POWER-SUPPLY  
SUPERVISOR  
DD  
and regulator are supplied by V  
and PGND. V  
DDA  
DDA  
should be connected to a minimum 3.0V (maximum  
6.0V) supply and should be at a potential that is equal  
CHARGE PUMP  
V
UP  
XTAL1  
XTAL2  
CLKDIV1  
CLKDIV2  
to or higher than V  
.
DD  
CLOCK  
GENERATION  
TEMPERATURE  
MONITOR  
The charge pump operates in a 1x (voltage follower) or  
2x (voltage doubler) mode depending on the input  
V
and the selected card voltage (5V or 3V).  
DDA  
1_8V  
V
CC  
CGND  
RST  
CLK  
• For 5V cards, the DS8023 operates in a 1x mode  
for V > 5.8V and in a 2x mode for V < 5.8V.  
5V/3V  
CMDVCC  
RSTIN  
CONTROL  
SEQUENCER  
DDA  
DDA  
• For 3V cards, the DS8023 operates in a 1x mode  
for V > 4.1V and in a 2x mode for V < 4.1V.  
PRES  
PRES  
OFF  
DDA  
DDA  
• For 1.8V cards, the DS8023 operates in a 1x mode  
for V > 2.9V and in a 2x mode for V < 2.9V.  
I/O  
AUX1  
AUX2  
I/OIN  
AUX1IN  
AUX2IN  
I/O TRANSCEIVER  
DDA  
DDA  
Voltage Supervisor  
DS8023  
The voltage supervisor monitors the V  
supply. A  
DD  
220µs reset pulse (t ) is used internally to keep the  
W
device inactive during power on or power off of the V  
supply. See Figure 2.  
DD  
Figure 1. Functional Diagram  
V
TH2  
V
TH2  
+ V  
HYS2  
V
DD  
ALARM  
(INTERNAL SIGNAL)  
t
t
W
W
POWER ON  
SUPPLY DROPOUT  
POWER OFF  
Figure 2. Voltage Supervisor Behavior  
Maxim Integrated  
7
DS8023  
Smart Card Interface  
The DS8023 card interface remains inactive no matter  
I/O Transceivers  
the levels on the command lines until duration t after  
W
The three data lines I/O, AUX1, and AUX2 are identical.  
This section describes the characteristics of I/O and  
I/OIN, but also applies to AUX1, AUX1IN, AUX2, and  
AUX2IN.  
V
has reached a level higher than V  
+ V  
.
DD  
When V  
TH2  
HYS2  
falls below V  
, the DS8023 executes a  
DD  
TH2  
card deactivation sequence if its card interface is active.  
Clock Circuitry  
I/O and I/OIN are pulled high with an 11kΩ resistor (I/O  
to V  
and I/OIN to V ) in the inactive state. The first  
DD  
CC  
The clock signal from the DS8023 to the smart card  
(CLK) is generated from the clock input on XTAL1 or  
from a crystal operating at up to 20MHz connected  
between pins XTAL1 and XTAL2. The inputs CLKDIV1  
and CLKDIV2 determine the frequency of the CLK sig-  
side of the transceiver to receive a falling edge  
becomes the master. When the master is decided, the  
opposite side switches to slave mode, ignoring subse-  
quent edges until the master releases. After a time delay  
t
, an n transistor on the slave side is turned on,  
D(EDGE)  
nal, which can be f  
, f  
, f  
, or f  
.
XTAL/8  
XTAL XTAL/2 XTAL/4  
thus transmitting the logic 0 present on the master side.  
Table 1 shows the relationship between CLKDIV1 and  
CLKDIV2 and the frequency of CLK.  
When the master side asserts a logic 1, a p transistor  
on the slave side is activated during the time delay,  
Do not change the state of pins CLKDIV1 and CLKDIV2  
simultaneously; a delay of 10ns minimum between  
changes is required. The minimum duration of any state  
of CLK is 8 periods of XTAL1.  
t
, and then both sides return to their inactive (pulled  
PU  
up) states. This active pullup provides fast low-to-high  
transitions. After the duration of t , the output voltage  
PU  
depends only on the internal pullup resistor and the  
load current. Current to and from the card I/O lines is  
limited internally to 15mA. The maximum frequency on  
these lines is 1MHz.  
The hardware in the DS8023 guarantees that the fre-  
quency change is synchronous. During a transition of  
the clock divider, no pulse is shorter than 45% of the  
smallest period, and the clock pulses before and after  
the instant of change have the correct width.  
Inactive Mode  
The DS8023 powers up with the card interface in the  
inactive mode. Minimal circuitry is active while waiting  
for the host to initiate a smart card session.  
To achieve a 45% to 55% duty factor on pin CLK when  
no crystal is present, the input signal on XTAL1 should  
have a 48% to 52% duty factor. Transition time on  
XTAL1 should be less than 5% of the period.  
• All card contacts are inactive (approximately 200Ω  
With a crystal, the duty factor on pin CLK may be 45%  
to 55% depending on the circuit layout and on the crys-  
tal characteristics and frequency.  
to GND).  
• Pins I/OIN, AUX1IN, and AUX2IN are in the high-  
impedance state (11kΩ pullup resistor to V ).  
DD  
The DS8023 crystal oscillator runs when the device is  
powered up. If the crystal oscillator is used or the clock  
pulse on pin XTAL1 is permanent, the clock pulse is  
• Voltage generators are stopped.  
• XTAL oscillator is running (if included in the device).  
• Voltage supervisor is active.  
applied to the card at time t (see Figures 7 and 8). If  
4
the signal applied to XTAL1 is controlled by the host  
microcontroller, the clock pulse is applied to the card  
when it is sent by the system microcontroller (after  
completion of the activation sequence).  
• The internal oscillator is running at its low frequency.  
Activation Sequence  
After power-on and the reset delay, the host microcon-  
troller can monitor card presence with signals OFF and  
CMDVCC, as shown in Table 2.  
Table 1. Clocꢀ Frequency Selection  
CLKDIV1  
CLKDIV2  
f
CLK  
Table 2. Card ꢄresence Indication  
0
0
1
1
0
1
1
0
f
f
f
/8  
/4  
/2  
XTAL  
XTAL  
XTAL  
OFF  
High  
Low  
CMDVCC  
High  
STATUS  
Card present.  
High  
Card not present.  
f
XTAL  
8
Maxim Integrated  
DS8023  
Smart Card Interface  
When a card is inserted into the reader (if PRES is  
active), the host microcontroller can begin an activation  
sequence (start a card session) by pulling CMDVCC  
low. The following events form an activation sequence  
(Figure 3):  
An alternate sequence allows the application to control  
when the clock is applied to the card.  
1) Host: Set RSTIN high.  
2) Host: Set CMDVCC low.  
3) Host: Set RSTIN low between t and t ; CLK will now  
3
5
1) Host: CMDVCC is pulled low.  
start.  
2) DS8023: The internal oscillator changes to high  
4) DS8023: RST stays low until t , then RST becomes  
5
frequency (t ).  
0
the copy of RSTIN.  
3) DS8023: The voltage generator is started simulta-  
5) DS8023: RSTIN has no further effect on CLK after t .  
5
neously (t = t ).  
1
0
If the applied clock is not needed, set CMDVCC low  
4) DS8023: Raise V  
from 0 to 5V, 3V, or 1.8V with  
CC  
with RSTIN low. In this case, CLK starts at t (minimum  
3
a controlled slope (t = t + 1.5 × T). T is 64 times  
2
1
200ns after the transition on I/O, see Figure 4); after t ,  
5
the internal oscillator period (approximately 25µs).  
RSTIN can be set high to obtain an answer to request  
(ATR) from an inserted smart card. Do not perform acti-  
vation with RSTIN held permanently high.  
5) DS8023: I/O, AUX1, and AUX2 are enabled  
(t = t + 4T).  
3
1
6) DS8023: The CLK signal is applied to the C3 con-  
tact (t ).  
4
7) DS8023: RST is enabled simulataneously (t = t =  
5
4
t
+ 7T).  
11  
CMDVCC  
V
CC  
ATR  
I/O  
CLK  
RSTIN  
RST  
I/OIN  
t
t
1
t
2
t
t
4
t = t  
5 ACT  
0
3
Figure 3. Activation Sequence Using RSTIN and CMDVCC  
Maxim Integrated  
9
DS8023  
Smart Card Interface  
CMDVCC  
V
CC  
ATR  
I/O  
CLK  
200ns  
RSTIN  
RST  
I/OIN  
t
t
t
2
t
t
4
t = t  
5 ACT  
0
1
3
Figure 4. Activation Sequence at t  
3
CMDVCC  
RST  
CLK  
I/O  
V
CC  
t
10  
t
12  
t
13  
t
14  
t
15  
t
DE  
Figure 5. Deactivation Sequence  
10  
Maxim Integrated  
DS8023  
Smart Card Interface  
There are two different cases for how the DS8023  
reacts to fault detection (Figure 6):  
Deactivation Sequence  
When the host microcontroller is done communicating  
with the smart card, it sets the CMDVCC line high to  
execute an automatic deactivation sequence and  
returns the card interface to the inactive mode.  
Outside a Card Session ꢁCMDVCC Highꢂ. Output  
OFF is low if a card is not in the card reader and  
high if a card is in the reader. The V  
supply is  
DD  
monitored—a decrease in input voltage generates  
an internal power-on reset pulse but does not  
affect the OFF signal. Short-circuit and tempera-  
ture detection are disabled because the card is  
not powered up.  
The following sequence of events occurs during a  
deactivation sequence (Figure 5):  
1) RST goes low (t ).  
10  
2) CLK is held low (t = t + 0.5 × T), where T is 64  
12  
10  
times the period of the internal oscillator (approxi-  
mately 25µs).  
Within a Card Session ꢁCMDVCC Lowꢂ. Output  
OFF goes low when a fault condition is detected,  
and an emergency deactivation is performed auto-  
matically (Figure 7). When the system controller  
resets CMDVCC to high, it may sense the OFF  
level again after completing the deactivation  
sequence. This distinguishes between a card  
extraction and a hardware problem (OFF goes high  
again if a card is present).  
3) I/O, AUX1, and AUX2 are pulled low (t = t + T).  
13  
10  
4) V  
starts to fall (t = t + 3T).  
14 10  
CC  
5) When V  
reaches its inactive state, the deactiva-  
CC  
tion sequence is complete (at t ).  
DE  
6) All card contacts become low impedance to GND;  
I/OIN, AUX1IN, and AUX2IN remain at V  
(pulled  
DD  
up through an internal 11kΩ resistor).  
Depending on the connector’s card-present switch  
(normally closed or normally open) and the mechanical  
characteristics of the switch, bouncing can occur on  
the PRES signals at card insertion or withdrawal. The  
DS8023 has a debounce feature with an 8ms typical  
duration (Figure 6). When a card is inserted, output  
OFF goes high after the debounce time delay. When  
the card is extracted, an automatic deactivation  
sequence of the card is performed on the first true/false  
transition on PRES and output OFF goes low.  
7) The internal oscillator returns to its lower frequency.  
V
CC  
Generator  
The card voltage (V ) generator can supply up to  
CC  
80mA continuously at 5V, 65mA at 3V, or 30mA at 1.8V.  
An internal overload detector triggers at approximately  
120mA. Current samples to the detector are filtered.  
This allows spurious current pulses (with a duration of a  
few µs) up to 200mA to be drawn without causing  
deactivation. The average current must stay below the  
specified maximum current value.  
Stop Mode (Low-Power Mode)  
A low-power state, stop mode, can be entered by forc-  
ing the CMDVCC, 5V/3V, and 1_8V input pins to a  
logic-high state. Stop mode can only be entered when  
the smart card interface is inactive. In stop mode all  
internal analog circuits are disabled. The OFF pin fol-  
lows the status of the PRES pin. To exit stop mode,  
change the state of one or more of the three control  
pins to a logic-low. An internal 220µs (typ) power-up  
delay and the 8ms PRES debounce delay are in effect  
and OFF is asserted to allow the internal circuitry to sta-  
bilize. This prevents smart card access from occurring  
after leaving the stop mode. Figure 8 shows the control  
sequence for entering and exiting stop mode. Note that  
an in-progress deactivation sequence always finishes  
before the DS8023 enters low-power stop mode.  
See the Applications Information section for recommen-  
dations to help maintain V  
voltage accuracy.  
CC  
Fault Detection  
The DS8023 integrates circuitry to monitor the following  
fault conditions:  
• Short circuit or high current on V  
CC  
• Card removal while the interface is activated  
• V dropping below threshold  
DD  
• Card voltage generator operating out of the speci-  
fied values (V  
too high)  
too low or current consumption  
DDA  
• Overheating  
Maxim Integrated  
11  
DS8023  
Smart Card Interface  
PRES  
OFF  
CMDVCC  
DEBOUNCE  
DEBOUNCE  
V
CC  
DEACTIVATION CAUSED  
BY CARDS WITHDRAWAL  
DEACTIVATION CAUSED  
BY SHORT CIRCUIT  
Figure 6. Behavior of PRES, OFF, CMDVCC, and V  
CC  
OFF  
PRES  
RST  
CLK  
I/O  
V
CC  
t
10  
t
12  
t
13  
t
14  
t
15  
t
DE  
Figure 7. Emergency Deactivation Sequence (Card Extraction)  
12  
Maxim Integrated  
DS8023  
Smart Card Interface  
DEACTIVATE INTERFACE  
CMDVCC  
1_8V  
5V/3V  
DEACTIVATE  
STOP MODE  
ACTIVATE  
STOP MODE  
8ms  
WARMUP DELAY  
8ms DEBOUNCE  
STOP MODE  
OFF ASSERTED TO  
WAIT FOR DELAY  
OFF  
OFF FOLLOWS  
PRES IN STOP MODE  
PRES  
V
CC  
Figure 8. Stop-Mode Sequence  
Maxim Integrated  
13  
DS8023  
Smart Card Interface  
logic-low state. Care must be exercised when switching  
from one V power selection to the other. If both 1_8V  
Smart Card Power Select  
CC  
The DS8023 supports three smart card V  
voltages:  
CC  
and 5V/3V are high with CMDVCC high at the same  
time, the DS8023 enters stop mode. To avoid acciden-  
tal entry into stop mode, the state of 1_8V and 5V/3V  
must not be changed simultaneously. A minimum delay  
of 100ns should be observed between changing the  
states of 1_8V and 5V/3V. See Figure 9 for the recom-  
1.8V, 3V, and 5V. The power select is controlled by the  
1_8V and 5V/3V signals as shown in Table 3. The 1_8V  
signal has priority over 5V/3V. When 1_8V is asserted  
high, 1.8V is applied to V  
when the smart card is  
CC  
active. When 1_8V is deasserted, 5V/3V dictates V  
CC  
power range. V  
is 5V if 5V/3V is asserted to a logic-  
CC  
mended sequence of changing the V  
range.  
CC  
high state, and V  
is 3V if 5V/3V is pulled to a  
CC  
Table 3. k  
Select and Operation Mode  
CC  
1_8V  
5V/3V  
CMDVCC  
V
CC  
SELECT (V)  
CARD INTERFACE STATUS  
Activated  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
3
3
Deactivated  
5
Activated  
5
Deactivated  
1.8  
1.8  
1.8  
1.8  
Activated  
Deactivated  
Reserved (Activated)  
Not Applicable—Stop Mode  
V
CC  
SELECT  
1.8V  
3V  
5V  
3V  
1.8V  
STOP MODE  
CMDVCC  
1_8V  
5V/3V  
Figure 9. Smart Card Power Select  
14  
Maxim Integrated  
DS8023  
Smart Card Interface  
V
DD  
100nF  
+3.3V  
100nF  
33pF  
33pF  
100nF  
+3.3V  
100nF  
+10μF  
PGND V  
DDA  
100kΩ**  
XTAL1  
XTAL2  
GND  
V
CP1  
CP2 V  
DD  
UP  
GPIO  
...  
CLKDIV1  
CLKDIV2  
5V/3V  
PRES  
V
CC  
RST  
CLK  
I/O  
AUX1  
AUX2  
1_8V  
...  
...  
OFF  
DS8023  
100nF*  
220nF*  
RSTIN  
CMDVCC  
AUX2IN  
AUX1IN  
I/OIN  
...  
GPIO  
ISOIO0  
CGND  
MAXQ1103  
CLKDIV1  
CLKDIV2  
5V/3V  
V
CC  
GPIO  
...  
RST  
CLK  
I/O  
AUX1  
AUX2  
1_8V  
100nF*  
220nF*  
OFF  
DS8023  
...  
...  
RSTIN  
CMDVCC  
AUX2IN  
AUX1IN  
I/OIN  
CGND  
PRES  
GPIO  
ISOIO1  
XTAL1  
XTAL2  
GND  
V
CP1  
CP2 V  
PGND  
V
DDA  
DD  
UP  
100kΩ**  
+10μF  
100nF  
+3.3V  
100nF  
+3.3V  
100nF  
33pF  
33pF  
100nF  
V
DD  
*PLACE A 100nF CAPACITOR CLOSE TO DS8023 AND PLACE A 220nF CAPACITOR CLOSE TO CARD CONTACT.  
**SCHEMATIC ASSUMES A NORMALLY CLOSED CONNECTION TO GROUND IN THE SOCKET. INSERTING A CARD  
BREAKS THE CONNECTION AND PULLS PRES HIGH.  
Figure 10. Typical Application Diagram  
Maxim Integrated  
15  
DS8023  
Smart Card Interface  
• Connect a 100nF capacitor (ESR < 100mΩ)  
Applications Information  
between V  
and CGND and place near the  
pin.  
CC  
CC  
Performance can be affected by the layout of the appli-  
cation. For example, an additional cross-capacitance of  
1pF between card reader contacts C2 (RST) and C3  
(CLK) or C2 (RST) and C7 (I/O) can cause contact C2  
to be polluted with high-frequency noise from C3 (or  
C7). In this case, include a 100pF capacitor between  
contacts C2 and CGND.  
DS8023’s V  
• Connect a 100nF or 220nF capacitor (220nF pre-  
ferred, ESR < 100mΩ) between V  
and CGND  
CC  
and place near the smart card socket’s C1 contact.  
With all these layout precautions, noise should be kept  
to an acceptable level and jitter on C3 (CLK) should be  
less than 100ps.  
Application recommendations include the following:  
• Ensure there is ample ground area around the  
DS8023 and the connector; place the DS8023  
Technical Support  
For technical support, go to https://support.maxim-  
integrated.com/micro.  
very near to the connector; decouple the V  
and  
DD  
V
DDA  
lines separately. These lines are best posi-  
Selector Guide  
tioned under the connector.  
• The DS8023 and the host microcontroller must use  
the same V supply. Pins CLKDIV1, CLKDIV2,  
CURRENT  
VOLTAGES  
SUPPORTED (V)  
SUPPORTS  
STOP  
MODE?  
PIN-  
PACKAGE  
DD  
PART  
RSTIN, PRES, AUX1IN, I/OIN, AUX2IN, 5V/3V,  
CMDVCC, and OFF are referenced to V ; if pin  
DD  
DS8023-RJX+  
DS8023-RRX+  
1.8, 3.0, 5.0  
1.8, 3.0, 5.0  
Yes  
Yes  
28 TSSOP  
28 SO  
XTAL1 is to be driven by an external clock, also  
reference this pin to V  
.
DD  
Note: Contact the factory for availability of other variants and  
package options.  
+Denotes a lead(Pb)-free/RoHS-compliant package.  
• Trace C3 (CLK) should be placed as far as possi-  
ble from the other traces.  
• The trace connecting CGND to C5 (GND) should  
be straight (the two capacitors on C1 (V ) should  
CC  
Package Information  
be connected to this ground trace).  
For the latest package outline information and land patterns (foot-  
prints), go to www.maximintegrated.com/pacꢀages. Note that a  
“+”, “#”, or “-” in the package code indicates RoHS status only.  
Package drawings may show a different suffix character, but the  
drawing pertains to the package regardless of RoHS status.  
• Avoid ground loops among CGND, PGND, and  
GND.  
• Decouple V  
and V  
separately; if the two  
DD  
DDA  
supplies are the same in the application, they  
should be connected in a star on the main trace.  
LAND  
ꢄATTꢃRN NO.  
ꢄACKAGꢃ  
TYꢄꢃ  
ꢄACKAGꢃ  
CODꢃ  
OUTLINꢃ NO.  
90-0109  
90-0171  
28 SO (300 mils)  
28 TSSOP  
W28+6  
U28+1  
21-0042  
21-0066  
16  
Maxim Integrated  
DS8023  
Smart Card Interface  
Revision History  
REVISION  
NUMBER  
REVISION  
DATE  
PAGES  
CHANGED  
DESCRIPTION  
0
8/08  
Initial release  
Clarified t , t , t , added note to Figure 10 describing PRES pin  
1
5 14  
1
4/13  
9, 11, 15  
operation, and added package information  
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent  
licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and  
max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.  
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 ________________________________ 17  
© 2013 Maxim Integrated Products, Inc.  
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.  

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