LTC4366ITS8-2#TRMPBF [Linear]

LTC4366 - High Voltage Surge Stopper; Package: SOT; Pins: 8; Temperature Range: -40°C to 85°C;
LTC4366ITS8-2#TRMPBF
型号: LTC4366ITS8-2#TRMPBF
厂家: Linear    Linear
描述:

LTC4366 - High Voltage Surge Stopper; Package: SOT; Pins: 8; Temperature Range: -40°C to 85°C

光电二极管
文件: 总24页 (文件大小:287K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC4366  
High Voltage Surge Stopper  
FEATURES  
DESCRIPTION  
The LTC®4366 surge stopper protects loads from high  
voltage transients. By controlling the gate of an external  
N-channel MOSFET, the LTC4366 regulates the output  
during an overvoltage transient. The load may remain  
operational while the overvoltage is dropped across the  
MOSFET. Placing a resistor in the return line isolates the  
LTC4366andallowsittofloatupwiththesupply;therefore,  
the upper limit on the output voltage depends only on the  
availability of high valued resistors and MOSFET ratings.  
n
Rugged Floating Topology  
n
Wide Operating Voltage Range: 9V to >500V  
n
Adjustable Output Clamp Voltage  
n
Controls N-Channel MOSFET  
n
Adjustable Protection Timer  
n
Internal 9-Second Cool-Down Timer  
n
Shutdown I < 14µA  
Q
n
8-Lead TSOT and 3mm × 2mm DFN Packages  
An adjustable overvoltage timer prevents MOSFET dam-  
age during the surge while an additional 9-second timer  
provides for MOSFET cool down. A shutdown pin reduces  
the quiescent current to less than 14µA during shutdown.  
AfterafaulttheLTC4366-1latchesoffwhiletheLTC4366-2  
will auto-retry.  
APPLICATIONS  
n
Industrial, Automotive and Avionic Surge Protection  
High Voltage DC Distribution  
n
n
28V Vehicle Systems  
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks and  
ThinSOT is a trademark of Linear Technology Corporation. All other trademarks are the property  
of their respective owners. Patents pending.  
TYPICAL APPLICATION  
Overvoltage Protected 1.5A, 28V Supply  
IXTK90N25L2  
Overvoltage Protector Regulates Output at 43V During Transient  
V
IN  
V
OUT  
28V  
1.5A  
250V INPUT SURGE  
2nF  
V
10Ω  
324k  
0.47µF  
IN  
100V/DIV  
28V  
V
GATE  
LTC4366-2  
OUT  
FB  
BASE  
DD  
12.4k  
422k  
43V CLAMP  
SD  
V
OUT  
28V  
20V/DIV  
TIMER  
1µF  
V
SS  
436612 TA01a  
436612 TA01b  
100ms/DIV  
46.4k  
436612fe  
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For more information www.linear.com/LTC4366  
LTC4366  
ABSOLUTE MAXIMUM RATINGS (Notes 1, 2) All voltages relative to VSS, unless otherwise noted.  
Supply Voltage (V ) ................................ –0.3V to 10V  
Supply Voltage (OUT) ................................. –0.3V to 5V  
Input Voltages  
Currents  
DD  
I
I
...................................................................10mA  
VDD  
OUT  
...................................................................10mA  
BASE................................................. –300µA to 10µA  
SD.......................................................–10mA to 10µA  
Operating Ambient Temperature Range (Note 4)  
LTC4366C................................................ 0°C to 70°C  
LTC4366I.............................................–40°C to 85°C  
LTC4366H.......................................... –40°C to 125°C  
LTC4366MP....................................... –55°C to 125°C  
Storage Temperature Range .................. –65°C to 150°C  
Lead Temperature (Soldering, 10 sec)  
FB .............................................. –0.3V to OUT + 0.3V  
TIMER................................................... –0.3V to 3.5V  
SD.......................................................... –0.3V to 10V  
Output Voltages  
BASE.........................................................–1.5V to 4V  
OUT – BASE ......................................... –0.3V to 5.5V  
GATE (Note 3)........................................ –0.3V to 15V  
GATE – OUT (Note 3)............................. –0.3V to 10V  
TSOT-23 Package Only .................................... 300°C  
PIN CONFIGURATION  
TOP VIEW  
TOP VIEW  
V
1
2
3
4
8
7
6
5
BASE  
FB  
SS  
V
1
8 GATE  
7 OUT  
6 FB  
TIMER  
DD  
9
SD 2  
TIMER 3  
SD  
OUT  
GATE  
V
DD  
V
SS  
4
5 BASE  
TS8 PACKAGE  
8-LEAD PLASTIC TSOT-23  
= 150°C, θ = 195°C/W  
DDB PACKAGE  
8-LEAD (3mm × 2mm) PLASTIC DFN  
= 150°C,  
T
JMAX  
JA  
T
JMAX  
θ
JA  
= 75°C/W IF V IS SOLDERED TO PCB, θ = 135°C/W IF V IS NOT SOLDERED TO PCB  
SS JA SS  
EXPOSED PAD (PIN 9), PCB V CONNECTION OPTIONAL  
SS  
436612fe  
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For more information www.linear.com/LTC4366  
LTC4366  
ORDER INFORMATION  
Lead Free Finish  
TAPE AND REEL (MINI)  
TAPE AND REEL  
PART MARKING*  
LTFMC  
LTFMC  
LTFMC  
LFMD  
PACKAGE DESCRIPTION  
TEMPERATURE RANGE  
0°C to 70°C  
LTC4366CTS8-1#TRMPBF  
LTC4366ITS8-1#TRMPBF  
LTC4366HTS8-1#TRMPBF  
LTC4366CDDB-1#TRMPBF  
LTC4366IDDB-1#TRMPBF  
LTC4366HDDB-1#TRMPBF  
LTC4366CTS8-2#TRMPBF  
LTC4366ITS8-2#TRMPBF  
LTC4366HTS8-2#TRMPBF  
LTC4366CDDB-2#TRMPBF  
LTC4366IDDB-2#TRMPBF  
LTC4366HDDB-2#TRMPBF  
LTC4366CTS8-1#TRPBF  
LTC4366ITS8-1#TRPBF  
LTC4366HTS8-1#TRPBF  
LTC4366CDDB-1#TRPBF  
LTC4366IDDB-1#TRPBF  
LTC4366HDDB-1#TRPBF  
LTC4366CTS8-2#TRPBF  
LTC4366ITS8-2#TRPBF  
LTC4366HTS8-2#TRPBF  
LTC4366CDDB-2#TRPBF  
LTC4366IDDB-2#TRPBF  
LTC4366HDDB-2#TRPBF  
8-Lead Plastic TSOT-23  
8-Lead Plastic TSOT-23  
–40°C to 85°C  
–40°C to 125°C  
0°C to 70°C  
8-Lead Plastic TSOT-23  
8-Lead (3mm × 2mm) Plastic DFN  
8-Lead (3mm × 2mm) Plastic DFN  
8-Lead (3mm × 2mm) Plastic DFN  
8-Lead Plastic TSOT-23  
LFMD  
–40°C to 85°C  
–40°C to 125°C  
0°C to 70°C  
LFMD  
LTFMF  
LTFMF  
8-Lead Plastic TSOT-23  
–40°C to 85°C  
–40°C to 125°C  
0°C to 70°C  
LTFMF  
8-Lead Plastic TSOT-23  
LFMG  
8-Lead (3mm × 2mm) Plastic DFN  
8-Lead (3mm × 2mm) Plastic DFN  
8-Lead (3mm × 2mm) Plastic DFN  
8-Lead Plastic TSOT-23  
LFMG  
–40°C to 85°C  
–40°C to 125°C  
–55°C to 125°C  
–55°C to 125°C  
–55°C to 125°C  
–55°C to 125°C  
LFMG  
LTC4366MPTS8-1#TRMPBF LTC4366MPTS8-1#TRPBF LTFMC  
LTC4366MPTS8-2#TRMPBF LTC4366MPTS8-2#TRPBF LTFMF  
LTC4366MPDDB-1#TRMPBF LTC4366MPDDB-1#TRPBF LFMD  
LTC4366MPDDB-2#TRMPBF LTC4366MPDDB-2#TRPBF LFMG  
8-Lead Plastic TSOT-23  
8-Lead (3mm × 2mm) Plastic DFN  
8-Lead (3mm × 2mm) Plastic DFN  
TRM = 500 pieces. *Temperature grades are identified by a label on the shipping container.  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
Consult LTC Marketing for information on lead based finish parts.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
436612fe  
3
For more information www.linear.com/LTC4366  
LTC4366  
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. All voltages relative to VSS, unless otherwise noted.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
DD  
Regulator  
l
V
V
V
Shunt Regulator Voltage  
I = 1mA  
11.5  
12  
12.5  
V
Z(VDD)  
DD  
DD  
l
l
V  
Shunt Regulator Load Regulation  
I = 1mA to 5mA  
LTC4366C/I/H  
LTC4366MP  
30  
30  
90  
130  
mV  
mV  
Z(VDD)  
l
l
l
l
V
V
V
V
V
Supply Voltage (Note 3)  
4.5  
V
V
µA  
µA  
µA  
DD  
DD  
DD  
DD  
DD  
Z(VDD)  
I
I
I
Pin Current – Start-Up, Gate Low  
Pin Current – Start-Up, Gate High  
Pin Current – Shutdown  
GATE = 0V, V = 7V, OUT = 0V  
15  
9
23  
VDD(STLO)  
VDD(STHI)  
VDD(SD)  
DD  
GATE Open, V = 7V, OUT = 0V  
13  
8
DD  
V
= 7V, OUT = 0V  
5
DD  
OUT Regulator  
l
l
l
V
OUT Shunt Regulator Voltage  
OUT Shunt Regulator Load Regulation  
OUT Supply Voltage (Note 3)  
OUT Undervoltage Lockout 1  
I = 1mA, BASE = 0V  
I = 1mA to 5mA  
5.0  
3.0  
5.7  
30  
6.0  
70  
V
mV  
V
Z(OUT)  
V  
Z(OUT)  
OUT  
V
Z(OUT)  
l
l
V
Rising  
Rising  
LTC4366C/I/H  
LTC4366MP  
2.42  
2.42  
2.55  
2.55  
2.75  
2.80  
V
V
UVLO1  
l
l
l
l
l
l
V  
OUT Undervoltage Lockout 1 Hysteresis  
OUT Undervoltage Lockout 2  
0.2  
4.5  
0.3  
0.28  
4.75  
0.4  
37  
0.4  
4.9  
0.5  
54  
V
V
UVH1  
V
UVLO2  
V  
OUT Undervoltage Lockout 2 Hysteresis  
OUT Pin Current – Regulation Amplifier On  
OUT Pin Current – Charge Pump On  
OUT Pin Current – Shutdown  
V
UVH2  
OUT(AMP)  
OUT(CP)  
OUT(SD)  
I
I
I
µA  
µA  
µA  
150  
3
220  
6
BASE, V  
SS  
l
l
l
l
l
l
V
BASE Shunt Regulator Voltage (OUT – BASE) I = –10µA, OUT = 4.5V  
5.5  
6.2  
125  
–0.8  
–45  
–160  
–7  
6.6  
200  
–5.5  
–72  
V
mV  
µA  
µA  
µA  
µA  
Z(BASE)  
V  
BASE Shunt Regulator Load Regulation  
BASE Pin Leakage Current  
I = –10µA to –80µA, OUT = 4.5V  
OUT = 4.5V, BASE = –0.5V  
Z(BASE)  
I
I
I
I
–0.1  
–30  
BASE  
V
V
V
Pin Current – Regulation Amplifier On  
Pin Current – Charge Pump On  
Pin Current – Shutdown  
VSS(AMP)  
VSS(CP)  
VSS(SD)  
SS  
SS  
SS  
–108  
–230  
–12  
GATE Drive  
l
V  
External N-Channel Gate Drive (GATE – OUT) OUT = 4.9V, I = 0, –1µA  
11.2  
12  
12.5  
V
GATE  
l
l
I
GATE Pin Current – Start-Up  
GATE = OUT = 0V  
LTC4366C/I/H  
LTC4366MP  
–4.5  
–3.2  
–7.5  
–7.5  
–11  
–11  
µA  
µA  
GATE(ST)  
l
l
l
I
I
I
GATE Pin Current – Charge Pump On  
GATE Pin Current – Fast Discharge  
GATE Pin Current – Fault  
GATE = 5V, OUT = 4.9V  
GATE = 10V, OUT = 4.9V  
GATE = 10V, OUT = 4.9V  
–14  
122  
0.3  
–20  
200  
0.7  
–28  
300  
1.2  
µA  
mA  
mA  
GATE(CP)  
GATE(FD)  
GATE(FLT)  
436612fe  
4
For more information www.linear.com/LTC4366  
LTC4366  
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. All voltages relative to VSS, unless otherwise noted.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
1.193  
1.0  
TYP  
MAX  
UNITS  
FB, SD, TIMER  
l
l
l
V
3% FB pin Regulation Threshold (OUT – FB)  
FB Pin Leakage Current  
1.23  
0
1.267  
1
V
µA  
V
FB(REG)  
I
OUT – FB = 1.2V  
Falling  
FB  
V
V
SD Pin Threshold Voltage (V SD)  
1.5  
2.3  
SD(TH)  
DD  
l
l
SD Pin Hysteresis  
LTC4366C/I/H  
LTC4366MP  
147  
129  
280  
280  
530  
530  
mV  
mV  
SD(HYST)  
l
l
I
SD Pin Input Pull-Up Current  
V
DD  
SD = 0.7V  
LTC4366C/I/H  
LTC4366MP  
–0.7  
–0.5  
–1.6  
–1.6  
–3.5  
–3.5  
µA  
µA  
SD  
l
V
TIMER Pin Threshold  
TIMER Rising, V = 7V, OUT = V  
Z(OUT)  
2.6  
2.8  
3.1  
V
TIMER(H)  
DD  
l
l
I
I
I
TIMER Pin Pull-Up Current  
TIMER = 1V  
LTC4366C/I/H  
LTC4366MP  
–5.1  
–4  
–9  
–9  
–13  
–13  
µA  
µA  
TIMER(UP)  
l
l
TIMER Pin Pull-Down Current  
TIMER = 1V  
LTC4366C/I/H  
LTC4366MP  
0.9  
0.7  
1.8  
1.8  
2.8  
2.8  
µA  
µA  
TIMER(DN)  
l
TIMER Pin Current Ratio I  
/I  
15  
20  
25  
%
TIMER(RATIO)  
TIMER(DN) TIMER(UP)  
AC Characteristics  
l
l
t
t
t
SD Low to Gate Low Filter Time  
Step V SD from 0V to 3V  
420  
60  
700  
150  
1200  
300  
µs  
ns  
DLY SD  
DD  
FB Low to Gate Low Delay Time  
Cool-Down Timer (Internal)  
Step OUT – FB from 0V to 1.3V  
DLY FAST  
l
l
V
DD  
= V  
Z(VDD)  
LTC4366C/I/H  
LTC4366MP  
5.9  
5.9  
9
9
16  
19  
Seconds  
Seconds  
D(COOL)  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 3: Limits on the maximum rating is defined as whichever limit occurs  
first. An internal clamp limits the GATE pin to a maximum of 12V above  
source. Driving this pin to voltages beyond the clamp may damage the  
device.  
Note 2: All currents into pins are positive.  
Note 4: T is calculated from the ambient temperature, T , and power  
J A  
dissipation, P , according to the formula:  
D
T = T + (P • θ )  
JA  
J
A
D
436612fe  
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For more information www.linear.com/LTC4366  
LTC4366  
TYPICAL PERFORMANCE CHARACTERISTICS  
VDD Shunt Regulator vs  
VDD Current  
VDD Shunt Regulator vs  
Temperature  
VDD Start-Up Current vs  
Temperature (Gate High)  
13.0  
12.5  
12.0  
11.5  
13.0  
12.5  
12.0  
11.5  
11.0  
15  
12  
9
6
3
0
5
10  
(mA)  
15  
20  
–50 –25  
0
25  
50  
75 100 125  
–50 –25  
0
25  
50  
75 100 125  
I
TEMPERATURE (°C)  
TEMPERATURE (°C)  
VDD  
436612 G01  
436612 G02  
436612 G03  
OUT Shunt Regulator vs  
OUT Current  
OUT Shunt Regulator vs  
Temperature  
VSS Current (Regulation AMP On)  
vs Temperature  
5.9  
5.8  
5.7  
5.6  
5.5  
7
6
5
4
75  
50  
25  
0
0
5
10  
(mA)  
15  
20  
–50 –25  
0
25  
50  
75 100 125  
–50 –25  
0
25  
50  
75 100 125  
I
TEMPERATURE (°C)  
TEMPERATURE (°C)  
OUT  
436612 G04  
436612 G05  
436612 G10  
VSS Current (Charge Pump On)  
vs Temperature  
Gate Drive vs Gate Pull-Up  
Current  
Gate Current (Charge Pump On)  
vs Temperature  
–300  
–200  
–100  
0
16  
12  
8
–40  
–30  
–20  
–10  
0
4
0
–50 –25  
0
25  
50  
75 100 125  
0
–10  
–20  
–30  
–50 –25  
0
25  
50  
75 100 125  
TEMPERATURE (°C)  
I
(µA)  
TEMPERATURE (°C)  
GATE  
436612 G11  
436612 G12  
436612 G14  
436612fe  
6
For more information www.linear.com/LTC4366  
LTC4366  
TYPICAL PERFORMANCE CHARACTERISTICS  
Base Shunt Regulator vs  
Base Current  
Timer Pull-Up Current vs  
Temperature  
Gate Start-Up Current vs  
Temperature  
–12  
–10  
–8  
7.0  
6.5  
6.0  
5.5  
–12  
–10  
–8  
–6  
–6  
–4  
–4  
–50 –25  
0
25  
50  
75 100 125  
0
–100  
–200  
–300  
(µA)  
–400  
–500  
–50 –25  
0
25  
50  
75 100 125  
TEMPERATURE (°C)  
I
TEMPERATURE (°C)  
BASE  
436612 G15  
436612 G16  
436612 G18  
SD Pull-Up Current vs  
FB Regulation Threshold vs  
Temperature  
Temperature  
Cool-Down Time vs Temperature  
1.24  
1.23  
1.22  
1.21  
16  
14  
12  
10  
8
–3  
–2  
–1  
0
6
–50 –25  
0
25  
50  
75 100 125  
–50 –25  
0
25  
50  
75 100 125  
–50 –25  
0
25  
50  
75 100 125  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
436612 G22  
436612 G23  
436612 G21  
436612fe  
7
For more information www.linear.com/LTC4366  
LTC4366  
PIN FUNCTIONS  
BASE: Base Driver Output for External PNP Shunt Regula-  
tor. This pin is connected to the anode of an internal 6.2V  
Zener with the cathode tied to OUT. In cases where lower  
SD: Shutdown Comparator Input. Tie to V if unused.  
DD  
Connectpintoalimitedcurrentpulldowncreatedbyadding  
a resistor in series with an open-drain or open-collector  
pull-down transistor. Activating the external pull down  
overcomes the internal 1.6µA pull-up current source and  
allows the SD pin to cross the shutdown threshold. This  
Zener (Z3) clamp current is desired but a large V resis-  
SS  
tor is prohibited, connect an external PNP base to this pin  
(PNP collector is grounded, emitter is tied to V ). Tie this  
SS  
pin to V if unused.  
threshold is defined as 1.5V below V with a 280mV  
SS  
DD  
hysteresis. To prevent false triggers this pin must stay  
below the threshold for 700µs to activate the shutdown  
state. The shutdown state lowers the total quiescent cur-  
Exposed Pad: The exposed pad may be left open or con-  
nected to V .  
SS  
FB: Overvoltage Regulation Amplifier Feedback Input.  
Connect this pin to an external resistive divider from OUT  
to ground. The overvoltage regulation amplifier controls  
the gate of the external N-channel MOSFET to regulate  
the FB pin voltage at 1.23V below OUT. The overvoltage  
amplifier will activate a 200mA pull-down on the GATE pin  
during a fast overvoltage event.  
rent (I  
plus I ) below 20µA. This quiescent current  
VDD  
OUT  
does not include shunt current in the V , OUT and BASE  
DD  
regulators. After a fault on the LTC4366, putting the part  
in shutdown will clear the fault and allow operation to  
resume. Clearing the fault during the 9-second cool-down  
period will shorten the timeout for the LTC4366-2 (auto-  
retry) version.  
GATE: Gate Drive for External N-Channel MOSFET. Dur-  
TIMER:TimerInput.Leavethispinopenfora1µsovervolt-  
age regulation period before fault off. Connect a capacitor  
between this pin and VSS to set a 311ms/µF duration for  
overvoltage regulation before the switch is turned off.  
The LTC4366-2 version will restart after a nine second  
cool-down period.  
ing start-up an internal 7.5µA current source charges the  
gate of the external N-channel MOSFET from the V pin.  
DD  
Once the OUT voltage is above V by 4.75V, the charge  
SS  
pump will finish charging the GATE to 12V above OUT.  
During a fast overvoltage event, a 200mA pull-down cur-  
rent source between GATE and OUT is activated, followed  
by regulation of the GATE pin voltage by the overvoltage  
regulation amplifier.  
V :Start-Up Supply. Supplyinput for 7.5µA start-upcur-  
DD  
rentsourcethatchargesthegateoftheexternalN-channel  
MOSFET. Also provides supply for timer and logic circuits  
activewhentheexternalMOSFETisoff.Thispinisclamped  
OUT: Charge Pump and Overvoltage Regulation Amplifier  
SupplyVoltage.Supplyinputforfloatingcircuitrypowered  
from the MOSFET source. Once the OUT voltage is 4.75V  
at 12V above V . Do not bypass this pin with a capacitor.  
SS  
V : Device Return and Substrate. The capacitors on the  
SS  
(UVLO2)aboveV ,thechargepumpwillturnonanddraw  
SS  
TIMER and OUT pins should be returned to this pin.  
power from this pin. When OUT exceeds 2.55V (UVLO1)  
it is used as a power supply and reference input for over-  
voltage regulation amplifier. This pin is clamped at 5.7V  
and requires a 0.22µF or greater bypass to the V pin.  
SS  
436612fe  
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LTC4366  
SIMPLIFIED DIAGRAM  
Start  
Run  
Regulate  
R
IN  
+
1.23V  
7.5µA  
20µA  
Z3  
5.7V  
Z3  
5.7V  
+
R
R
CP  
FB1  
Z1  
12V  
FB2  
436612 SD  
R
SS  
R
SS  
R
SS  
FUNCTIONAL DIAGRAM  
M1  
V
V
OUT  
IN  
R
G
R
IN  
C
G
Z4  
12V  
V
GATE  
OUT  
DD  
7.5µA  
D1  
OUT  
20µA  
CHARGE  
PUMP  
f = 2MHz  
Z1  
12V  
UVLO2  
4.75V  
LOGIC  
SUPPLY  
V
CC  
UVLO1  
2.55V  
V
V
DD  
V
CC  
C1  
SHUTDOWN  
+
1.23V  
COMPARATOR  
+
1.5V  
1.6µA  
9µA  
LOGIC  
AND  
TIMER  
+
+
R
R
FB1  
SD  
FB  
FB2  
OVERVOLTAGE  
AMPLIFIER  
CC  
TIMER  
COMPARATOR  
TIMER  
OUT  
+
Z2  
6.2V  
Z3  
5.7V  
+
C
T
2.8V  
1.8µA  
V
BASE  
SS  
436612 FD  
R
SS  
436612fe  
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LTC4366  
OPERATION  
The Simplified Diagram shows three states of operation:  
the start, run and regulate mode. Previous surge stopper  
parts are powered off the input supply, therefore the surge  
voltageislimitedtothebreakdownvoltageoftheinputpins  
of the part. As demonstrated in run and regulate modes,  
the majority of this part is powered off the output, so the  
MOSFET isolates the surge from the power pins of the  
part. This allows surge voltages up to the breakdown of  
the external MOSFET.  
Once the OUT to V voltage exceeds the 2.55V UVLO1  
SS  
threshold, the overvoltage amplifier is enabled. Next, the  
UVLO2thresholdof4.75Viscrossedandthechargepump  
turns on. The charge pump charges the GATE pin with  
20µA to its final value 12V above OUT (clamped by Z4).  
This allows the capacitor between OUT and V to charge  
SS  
until clamped by Z3 to 5.7V. In this run mode the MOSFET  
is configured as a low resistance pass transistor with little  
voltage drop and power dissipation in the MOSFET.  
In the start mode a 15µA trickle current flows through R ,  
The powered up LTC4366 is now ready to protect the load  
against an overvoltage transient. The overvoltage regula-  
tion amplifier monitors the load voltage between OUT and  
ground by sensing the voltage on the FB pin with respect  
IN  
half is used to charge the gate with the other half used as  
biascurrent.AstheGATEpincharges,theexternalMOSFET  
brings up the OUT pin. This leads to the run mode where  
the output is high enough to become a supply voltage for  
the charge pump. The charge pump is then used to fully  
charge the gate 12V above the source.  
to the OUT pin (drop across R ). In an overvoltage  
FB1  
condition the OUT rises until the amplifier drives the M1  
gate to regulate and limit the output voltage. This is the  
regulate mode.  
With the output voltage equal to the input voltage, it is  
necessary to protect the load from an input supply over-  
voltage. In the regulate mode, the overvoltage regulation  
amplifier is referenced to the output through a 1.23V  
reference. If the voltage drop across the upper feedback  
Duringregulationtheexcessvoltageisdroppedacrossthe  
MOSFET.TopreventoverheatingtheMOSFET,theLTC4366  
limitstheovervoltageregulationtimeusingtheTIMERpin.  
The TIMER pin is charged with 9µA until the pin exceeds  
2.8V. At that point an overvoltage fault is set, the MOSFET  
is turned off, and the part enters a cool-down period of  
9 seconds. The logic and timer block are active during  
cool down while the GATE pin is pulled to OUT.  
resistor,R ,exceeds1.23Vtheregulationamplifierpulls  
FB1  
the gate down to regulate the R voltage back to 1.23V.  
FB1  
Therefore, the output voltage is clamped by setting the  
proper ratio between R and R  
.
FB1  
FB2  
Forexample,iftheoutputvoltageisregulatedat100Vthen  
The latched-off version, LTC4366-1, will remain in fault  
untiltheSDpinistoggledlowandthenhigh. Oncethefault  
is cleared, the GATE is permitted to turn the MOSFET on  
again.Theauto-retryversion,LTC4366-2,waits9seconds  
then clears the fault and restarts.  
the voltage drop across the R is 98.77V. If the Zener Z3  
FB2  
is 5.7V then the voltage drop across R is 94.3V. There-  
SS  
fore, when the output is at a high voltage, the majority of  
the voltage is dropped across the two resistors R and  
FB2  
R . This demonstrates how the LTC4366 floats up with  
SS  
the supply. The adjustable 3-terminal regulators, such  
as the LT®1085 and LM117, are also based on this idea.  
The Functional Diagram shows the actual circuits. An  
external R resistor on the V pin powers up the 12V  
IN  
DD  
shunt regulator which then powers up logic supply, V .  
CC  
After verifying that the shutdown input is not active, the  
GATE pin is charged with a 7.5µA current from V . This  
DD  
is the start mode.  
436612fe  
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LTC4366  
APPLICATIONS INFORMATION  
The typical LTC4366 application is a protected system  
that distributes power to loads safe from overvoltage  
transients. External component selection is discussed in  
the following sections.  
voltage minus 5.7V is impressed on R . The R current  
SS SS  
is divided into three areas: the 5.7V shunt current, bias  
current between OUT and V and finally the R current.  
SS  
IN  
The 5.7V shunt current can be as high as 10mA which  
greatly exceeds the typical OUT (160µA) bias current.  
Dual Shunt Regulators  
Turn-On Sequence  
The LTC4366 uses two shunt regulators coupled with  
the external voltage dropping resistors, R and R , to  
The voltage between the V and V pins is shunt regu-  
DD SS  
SS  
IN  
generate internal supply rails at the V and OUT pins.  
lated to 12V after ramping up the input supply. Next, the  
DD  
These shunt-regulated rails allow overvoltage protection  
from unlimited high voltage transients irrespective of the  
voltage rating of the LTC4366’s internal circuitry.  
internally generated supply, V , produces a 30µs power-  
CC  
on-reset pulse which clears the fault latch and initializes  
internallatches.Next,theshutdowncomparatordetermines  
if the SD pin is externally pulled low, thereby requesting a  
low bias current shutdown state. Otherwise the external  
MOSFET, M1, is allowed to turn on.  
At the beginning of start-up, during shutdown, or after an  
overvoltage fault, the GATE pin is clamped to the OUT pin  
thereby shutting off the MOSFET. This allows the V and  
SS  
OUT pins to be pulled to ground by output load and R .  
Turningonthe7.5µAGATEpull-upcurrentsourcefromthe  
SS  
Under this condition the V pin is clamped with a 12V  
V
pin begins what can be described as abootstrapped”  
DD  
DD  
shunt regulator to V . The full supply voltage minus 12V  
method for powering up the MOSFET gate. Once the GATE  
SS  
is then impressed on the R resistor which sets the shunt  
reaches the V pin voltage (minus a Schottky diode), the  
IN  
DD  
current. The shunt current can be as high as 10mA which  
7.5µA source loses voltage headroom and stops charging  
theGATE(middleofwaveformsinFigure2.).Thebootstrap  
method relies on charging C1 to a sufficient voltage after  
GATE stops increasing. The voltage on C1 is then used  
as a supply for a charge pump that charges the gate to  
its final value 12V above OUT. C1 will discharge if the  
charge pump current exceeds the C1 charging current.  
If the voltage drops below 4.35V, the charge pump will  
pause allowing C1 to recharge.  
is several orders of magnitude higher than the typical 9µA  
V
pin quiescent current.  
DD  
In normal operation the OUT voltage is equal to the input  
supply.WithC1fullychargedI iszeroatthispoint.Under  
C1  
this condition the voltage between the OUT and V pins  
SS  
are clamped with a 5.7V shunt regulator. The input supply  
M1  
FQA62N25C  
V
V
IN  
OUT  
28V  
1.5A  
(18V DC TO 250V DC)  
(43V CLAMP)  
C
G
R
G
10nF  
V
10Ω  
GATE  
R
10V/DIV  
C1  
0.47µF  
IN  
324k  
CHARGE  
PUMP PAUSE  
R
FB1  
R1  
V
GATE  
LTC4366-2  
OUT  
FB  
BASE  
DD  
12.4k  
470k  
R2  
V
SD  
OUT  
10V/DIV  
R
422k  
100k  
FB2  
Q1  
TIMER  
V
SS  
SD  
MMBT3904  
C1 RECHARGING  
C
T
8.2nF  
V
C1  
436612 F01  
CHARGE  
PUMP STARTS  
5V/DIV  
R
SS  
46.4k  
C1 CHARGING  
20ms/DIV  
436612 TA01b  
Figure 1. Typical Application  
Figure 2. Turn-On Waveforms  
436612fe  
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LTC4366  
APPLICATIONS INFORMATION  
Starting up with a supply voltage insufficient to charge  
C1 with large load current may result in overheating the  
MOSFET and subsequent damage. While the gate and  
output are ramping the drop across the MOSFET is the  
input supply minus the output. If the supply is lower than  
necessarytochargeC1,thentheoutputfailstoramphigher  
than the supply minus the threshold of the MOSFET. This  
3V to 5V MOSFET drop with high load current will result in  
power dissipation without any protection or timeout limit.  
Depending on which version, the part will cool down and  
self start (LTC4366-2), or remain latched off until the SD  
pin activates a shutdown followed by a start-up command  
(LTC4366-1).Thecool-downtimeistypicallynineseconds  
which provides a very low pulsed power duty cycle.  
Starting up with an input supply overvoltage and full  
load current does increase the power dissipation in the  
MOSFET well beyond the case for an overvoltage surge.  
During the gate and output ramp up, the partial supply  
voltage (at full current) is dropped across the MOSFET.  
Afterstart-upthenormalovervoltagesurge(withtimeout)  
occurs before the shutting off the MOSFET. The Design  
Example section only considers the normal overvoltage  
surge for safe operating area (SOA) calculations for the  
MOSFET. Start-up into overvoltage will require additional  
SOA considerations.  
Overvoltage Fault  
The LTC4366 prevents an overvoltage on the input supply  
from reaching the load. Normally, the pass transistor is  
fully on, powering the load with very little voltage drop. As  
theinputvoltageincreasestheOUTvoltageincreasesuntil  
it reaches the regulation point (V ). From that point any  
REG  
further voltage increase is dropped across the MOSFET.  
Note the MOSFET is still on so the LTC4366 allows un-  
interrupted operation during a short overvoltage event.  
Shutdown  
The LTC4366 has a low current (<20µA) shutdown state  
that turns off the pass FET by tying the GATE and OUT pins  
together with a switched resistor. In the normal operating  
TheV pointisconfiguredwiththetwoFBresistors,R  
REG  
FB1  
and R . The regulation amplifier compares the FB pin to  
FB2  
a threshold 1.23V below the OUT pin. During regulation  
condition, the SD pin is pulled up to the V pin voltage  
DD  
the drop across R is 1.23V, while the remainder of the  
with a 1.6µA current source. Tie the SD pin to V when  
FB1  
DD  
V
voltage is dropped across R  
.
the shutdown state is not used.  
REG  
FB2  
Whentheoutputisattheregulationpointatimerisstarted  
to prevent excessive power dissipation in the MOSFET.  
Normally the TIMER pin is held low with a 1.8µA pull-  
down current. During regulation the TIMER pin charges  
with 9µA. If the regulation point is held long enough for  
the TIMER pin to reach 2.8V then an overvoltage fault is  
latched. The equation for setting the timer capacitor is:  
Bringing the SD pin more than 1.5V below V pin volt-  
DD  
age for greater than the 700µs filter time activates the  
shutdown state. This filter time prevents unwanted activa-  
tion of shutdown during transients. The SD pin is diode  
clamped 0.7V below V which requires current limiting  
SS  
(maximum 10mA) on the pull-down device. One way to  
limit the current is to connect an external 470k resistor in  
series with the open-collector pull-down device. Activat-  
ing the external pull-down overcomes the internal 1.6µA  
pull-up current source and allows the SD pin to cross the  
shutdown threshold.  
C = 3.2 • t nF /ms  
[
]
T
436612fe  
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LTC4366  
APPLICATIONS INFORMATION  
Followinganovervoltagefault,puttingthepartinshutdown  
will clear the fault, allowing operation to resume once the  
LTC4366 leaves shutdown.  
The full supply voltage minus 12V can appear across  
IN  
R
during the overvoltage cool-down period. Normally  
the value for R is several times larger than R which  
IN  
SS  
lowers the power and size requirements for this resistor.  
Output Short  
External PNP  
A sudden short on the output can result in excessive cur-  
rent into the LTC4366 GATE pin supplied from the gate  
InsomecasesthepowerresistorforR maybephysically  
SS  
capacitor, C . The GATE pin is internally clamped to OUT  
large. A large value R (with lower power and size) may  
G
SS  
with a 10V to 12V clamp. If the OUT pin is pulled low  
be used in conjunction with a PNP as shown in Figure 4.  
while the GATE pin is held up with C , then the clamp will  
In addition to the 0.8µA sourced from the BASE pin, the  
G
be damaged trying to discharge C when clamp voltage  
base current from the PNP must flow through R which  
SS  
G
is exceeded. One solution is to add a 1k R resistor in  
will limit the maximum R value. In some cases the  
S
SS  
series with C with a bypass diode as shown in Figure 3.  
minimum PNP Beta is as low as 35. The base current  
G
The diode allows the capacitor to function as a bypass for  
energy coming from the MOSFET drain to gate capacitor  
during an supply overvoltage.  
becomes 10µA when the V current is 350µA. One can  
SS  
see this allows a 35 (Beta) times larger R than the ap-  
SS  
plication without the PNP.  
M1  
R
G
LTC4366  
D
BYPASS  
BASE  
R
V
SS  
R
S
LTC4366  
1k  
GATE  
OUT  
C
G
10V TO  
12V  
SS  
436612 F04  
436612 F03  
Figure 4. External PNP Option  
Figure 3. Output Short Protection  
Minimum Supply Start-Up  
Resistor Power Ratings  
When designing for the minimum supply condition, it is  
important that R and R are chosen to provide enough  
The proper rating for the R resistor in Figure 1 must be  
SS  
considered. During an overvoltage event the OUT pin is  
SS  
IN  
current to sufficiently charge C1 to 4.75V. The parameters  
that determine the minimum supply voltage include: C1  
voltage,MOSFETthresholdvoltage,aseriesSchottkydiode  
voltage drop, resistance of R and R , current in the V  
at regulation voltage (V ), so the voltage across R is  
REG  
SS  
V
REG  
minus5.7V.Asmallminimumsupplyvoltagereduces  
the value of R . Therefore, large differences between  
SS  
minimum supply voltage and the regulation voltage may  
SS  
IN  
DD  
require a large power resistor for R .  
SS  
436612fe  
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LTC4366  
APPLICATIONS INFORMATION  
pin, and finally the current from the V pin (see Figure 5).  
The last V  
SS  
equation sets the maximum value for  
IN(MIN)  
SS  
R . After choosing R the maximum value for R (for  
SS  
IN  
V
= (I  
• R ) + V + V + V + (I  
• R )  
IN(MIN)  
VDD  
IN  
D
TH  
C1  
VSS SS  
that particular R ) is calculated from the first V  
equation:  
SS  
IN(MIN)  
Using the Electrical Characteristics table for above  
parameters:  
VIN(MIN) – 5.7V  
RSS(MAX)  
=
V
= V  
= 4.75V (UVLO2 threshold)  
C1  
UVLO2  
160µA  
I
I
= I  
= 9µA (I  
VDD  
start-up, gate high)  
w/regulation amp)  
VDD  
VSS  
VDD(STHI)  
VSS(AMP)  
V
IN(MIN) – 4.75V – 0.58V – VTH – 45µA R  
(
)
SS  
RIN(MAX)  
=
= I  
= 45µA (I  
VSS  
9µA  
V = 0.58V  
D
These two equations maximize the values of R and  
IN  
SS  
V
=(A•R )+0.58V+V +4.75V+(45µA• R )  
IN TH SS  
IN(MIN)  
R
(reducing power dissipation) while still providing  
the necessary V voltage to turn the charge pump on.  
C1  
When the MOSFET gate is fully enhanced, the OUT pin  
voltage is equal to the supply voltage. This places another  
constraint on the minimum supply voltage because the  
charge pump increases the V current to 160µA. The C1  
voltage is assumed to be clamped at 5.7V. These values  
are specified as V  
in the table of Electrical Characteristics:  
Increasing the supply voltage beyond the minimum sup-  
ply voltage increases the current and power in R while  
SS  
reducing the time required to charge C1. Conditions that  
SS  
may require an even smaller R  
will be discussed  
SS(MAX)  
in the Maximum Supply Start-Up section.  
and I  
(charge pump on)  
Z(OUT)  
VSS(CP)  
Maximum Supply Start-Up  
V
= V  
+ (I  
• R )  
IN(MIN)  
Z(OUT)  
VSS(CP) SS  
The maximum overvoltage supply may also exist during  
start-up. The overvoltage protection circuitry has to wake  
up before high voltage is passed to the load. Dynamically  
the GATE is ramping up while C1 is charging. Capacitor  
C1 must charge to the 2.55V UVLO1 threshold to turn on  
the regulation amplifier and reference before the OUT pin  
or  
V
= 5.7V + (160µA • R )  
IN(MIN)  
SS  
V
I
IN  
voltage exceeds the overvoltage regulation point, V  
.
RIN  
R
REG  
IN  
7.5µA  
D1  
These conditions may reduce the value of R below the  
V
DD  
SS  
GATE  
G
M1  
V
maximum value dictated by the minimum supply start-up  
C
discussed above.  
OUT  
C1  
OUT  
When current in R exceeds the current sourced from  
SS  
R
LOAD  
the V pin (essentially I ), the capacitor C1 begins to  
SS  
RIN  
Z1  
12V  
Z3  
5.7V  
LOGIC  
TIMER  
CIRCUITS  
charge. The voltage at the V pin when I = I  
labeled V  
voltage divider between R and R after the Zener clamp  
voltage from V to V is subtracted from the supply.  
is now  
+
SS  
RIN RSS  
V
C1  
. The V pin voltage is the center of a  
SS(MATCH)  
SS  
I
9µA  
I
I
I
C1  
SHUNT1  
SHUNT2  
BIAS  
IN  
SS  
V
SS  
DD  
SS  
I
R
RSS  
RSS +RIN  
RSS  
SS  
VSS(MATCH)  
=
VIN(MAX) – VZ(VDD)  
(
)
436612 F05  
Figure 5. Simplified Block Diagram  
As V increases the V  
voltage increases. If the  
IN  
SS(MATCH)  
match voltage exceeds the overvoltage regulation point  
(V ), then load is unprotected. This is true because  
REG  
C1 will still need to charge to 2.55V while V already  
SS  
436612fe  
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LTC4366  
APPLICATIONS INFORMATION  
has exceeded V . Since the OUT pin voltage is at least  
GATE Capacitor, C  
G
REG  
2.55V larger than V it exceeds the specified maximum.  
SS  
The gate capacitor is used for three functions. First, C  
G
Choosing the match point (with supply at the maximum)  
absorbs charge from the gate-to-drain capacitance of  
the MOSFET during overvoltage transients. Second, the  
capacitor also acts as a compensation element for the  
overvoltage regulation amplifier. The minimum value for  
sufficiently below V  
(by at least 2.55V), allows C1 to  
REG  
charge up in time to protect the load from overvoltage.  
In reality having V pin voltage 7V below V  
provides  
SS  
REG  
required margin for charging C1.  
C to guarantee stability is 2nF. Finally, C sets the slew  
G
G
V
= V  
– 7V  
rate of the GATE and OUT pins. The voltage at the GATE pin  
SS(MATCH)(MAX)  
REG  
rises at a slope equal to 20µA/C . This slope determines  
G
Increasing R increases the match point, so determin-  
SS  
the charging current into the load capacitor.  
ing the maximum R value while still protecting from  
SS  
overvoltage is useful. Using I = I  
:
CLOAD  
CG  
RIN  
RSS  
I
=
IG  
INRUSH  
VRSS  
VRIN  
RSS =RIN •  
The voltage rating for C must be greater than the regula-  
G
tion voltage (V ).  
REG  
Using:  
V
V
= V  
= V  
– 7V  
REG  
MOSFET Selection  
RSS  
RIN  
SS(MATCH)(MAX)  
= V – V  
– V  
RSS  
The LTC4366 drives an N-channel MOSFET to conduct  
the load current. The important features of the MOSFET  
IN  
Z(VDD)  
Substituting:  
are on-resistance, R  
, the maximum drain-source  
DS(ON)  
R • V  
– 7V  
(
)
voltage, V , the threshold voltage, and the SOA.  
(BR)DSS  
IN  
REG  
RSS(MAX)  
=
=
V
– 12V – V  
– 7V  
(
)
IN(MAX)  
REG  
The maximum allowable drain-source voltage must be  
higher than the supply voltage. If the output is shorted  
to ground or during an overvoltage event, the full supply  
voltage will appear across the MOSFET.  
R • V  
– 7V  
(
)
IN  
REG  
RSS(MAX)  
V
IN(MAX) – 5V – VREG  
The threshold voltage of the MOSFET is used in the mini-  
mum supply start-up calculation. For applications with  
supplies less than 12V, a logic-level MOSFET is required.  
Above 12V a standard threshold N-channel MOSFET is  
sufficient.  
If we guarantee that R < R  
then the following  
SS  
SS(MAX)  
is true:  
V
< V  
SS(MATCH)(MAX)  
SS(MATCH)  
C1 bypasses the charge pump, and requires at least a  
0.22µF. The size of C1 needs limits also. The gate capaci-  
The SOA of the MOSFET must encompass all fault condi-  
tions. In normal operation the pass transistor is fully on,  
dissipatingverylittlepower.Butduringovervoltagefaults,  
the GATE pin is servoed to regulate the output voltage  
through the MOSFET. Large current and high voltage drop  
across the MOSFET can coexist in these cases. The SOA  
curves of the MOSFET must be considered carefully along  
with the selection of the fault timer capacitor.  
tor (C ) dictates the maximum output capacitor C1  
G
(MAX)  
that will charge to the 2.55V UVLO1 threshold (V  
)
UVLO1  
beforetheOUTvoltageexceedstheovervoltagethreshold.  
–C • R +RIN VSS(MATCH)  
V
REG  
(
)
(
)
G
SS  
C1  
=
(MAX )  
2 • VUVLO1  
VREG – V  
IG RSS R •In 1–  
IN  
SS(MATCH)   
In most cases:  
C1 = 10 • C to 100 • C  
G
(MAX)  
G
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LTC4366  
APPLICATIONS INFORMATION  
Layout Considerations  
DESIGN EXAMPLE  
Overview  
Due to the high impedances on the SD, V , and GATE  
DD  
pins, these pins are susceptible to leakages to ground.  
For example, a leakage to ground on SD will activate the  
shutdown state if greater than 1.6µA. Providing adequate  
spacingawayfromgroundedtracesandaddingconformal  
coating on exposed pins lowers the risk that leakage cur-  
rent will interrupt system operation.  
The design process starts with minimum input voltage  
start-up equations to calculate values for R and R .  
These values need further refinement to meet two other  
conditions: the maximum input voltage start-up condi-  
tions and proper current for the charging of C1. The the  
remaining element values are calculated based on the  
input parameters.  
SS  
IN  
It is important to put the bypass capacitor, C1, as close as  
possible to the OUT and V pins. Place the 10Ω resistor  
SS  
Following are the input parameters for this example:  
as close as possible to the MOSFET gate pin. This will  
limit the parasitic trace capacitance that leads to MOSFET  
self-oscillation.  
V
= 18V, V  
= 43V, V  
= 250V, I  
IN(MAX) LOAD  
SUPPLY(MIN)  
= 1.5A at start-up, I  
REG  
LOAD  
= 3A after start-up, V = 5V  
TH  
The FB pin is sensitive to parasitic capacitance when the  
regulation loop is closed. One result from this capacitive  
loading is output oscillations during overvoltage regula-  
tion. It is suggested that the resistors R and R be  
ImportantElectricalCharacteristicstableparametersused  
in this example are summarized in Table 1.  
Step 1: Maximum R  
FB1  
FB2  
SS  
placed close to the pin and that the FB trace itself be  
In this design example (Figure 6.) the component sizing  
first considers the start-up phase after the charge pump  
minimized in size.  
is active. The goal is to maximize the resistance of R  
SS  
which still allows operation when the input voltage is at  
the minimum value.  
M1  
FQA62N25C  
V
V
OUT  
IN  
1.5A  
28V  
(43V CLAMP)  
(18V DC TO 250V DC)  
C
G
R
G
10nF  
10Ω  
C1  
0.47µF  
R
IN  
324k  
R
FB1  
R1  
V
GATE  
LTC4366-2  
OUT  
FB  
BASE  
DD  
12.4k  
470k  
R2  
SD  
R
422k  
100k  
FB2  
Q1  
TIMER  
V
SS  
SD  
MMBT3904  
C
T
8.2nF  
436612 F06  
R
SS  
46.4k  
Figure 6. Overvoltage Protected 28V, 1.5A Supply  
436612fe  
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LTC4366  
APPLICATIONS INFORMATION  
Table 1. Electrical Parameters Used in Design Example  
SYMBOL  
PARAMETER  
CONDITIONS  
I = 1mA, BASE = 0V  
Rising  
TYP  
MAX  
6.0V  
V
V
OUT Shunt Reg. Voltage  
OUT Undervoltage Lockout 2  
5.7V  
4.75V  
–160µA  
–45µA  
9µA  
Z(OUT)  
4.9V  
UVLO2  
I
I
I
I
V
V
V
Pin Current – Charge Pump On  
Pin Current – Regulation Amplifier On  
Pin Current – Start-Up, Gate High  
–230µA  
–72µA  
13µA  
VSS(CP)  
VSS(AMP)  
VDD(STHI)  
GATE(ST)  
SS  
SS  
DD  
GATE Open, V = 7V, OUT = 0V  
DD  
GATE Pin Current – Start-Up  
OUT Undervoltage Lockout 1  
GATE = OUT = 0V  
Rising  
–7.5µA  
2.55V  
–11µA  
2.75V  
V
UVLO1  
After the charge pump is active the V current increases  
Step 3: Find R  
SS(MAX)  
SS  
to 160µA (worst-case 230µA, see Table 1) current while  
thefinalvalueOUTvoltageisequaltotheminimumsupply  
voltage. The C1 voltage is clamped at 5.7V (worst-case  
6.0V):  
In some cases this value for R is too large to charge C1  
SS  
and power the overvoltage amplifier before the maximum  
input voltage passes to the output. The voltage at the V  
SS  
).  
pinwhenI =I  
iscalledthematchpoint(V  
RIN RSS  
SS(MATCH)  
VIN(MIN) – VZ(OUT)  
Choosing the match point (with supply at the maximum)  
sufficientlybelowV (byatleast7V),allowsC1tocharge  
RSS(MAX)  
=
REG  
IVSS(CP)  
up in time to protect the load from overvoltage:  
18V – 6V  
230µA  
R • V  
IN(MAX) 5V VREG  
– 7V  
(
)
RSS(MAX)  
=
= 52.3k  
IN  
REG  
RSS(MAX)  
=
=
V
Step 2: Determine R  
IN  
287k • 43V – 7V  
(
)
= 51.1k  
RSS(MAX)  
ThevalueforresistorR iscalculatedusingthecalculated  
250V – 5V – 43V  
IN  
R
value. R is chosen to provide enough headroom to  
SS  
IN  
In this case the R value of 52.3k calculated in Step 1  
SS  
sufficiently charge C1 to 4.9V the maximum undervoltage  
is too large.  
lockout2threshold(V  
)whichstartsthechargepump.  
UVLO2  
The parameters that determine R include: minimum  
IN  
Step 4: Iterate Smaller R  
SS  
supply voltage, the final C1 voltage, MOSFET threshold  
voltage, R , 72µA maximum V pin current (regulation  
Using 51.1k (R  
) as the next guess for R , we can  
SS(MAX) SS  
SS  
SS  
now calculate R and R  
:
amplifier on, I  
), and finally the 13µA maximum  
VSS(AMP)  
IN  
SS(MAX)  
start-up current in the V pin (I  
):  
DD  
VDD(STHI)  
18V – 4.9V 0.58V 5V 72µA • 51.1k  
(
)
RIN =  
V
IN(MIN) VUVLO2 VD VTH ISS(AMP) RSS  
(
)
13µA  
RIN(MAX)  
=
=
IVDD(STHI)  
RIN = 294k  
RSS(MAX)  
18V 4.9V 0.58V 5V 72µA • 52.3k  
(
)
RIN(MAX)  
294k • 43V – 7V  
(
)
= 52.3k  
13µA  
250V – 5V 43V  
R
IN(MAX) = 287k  
In this case the R value of 51.1k is less than R  
SS  
SS(MAX)  
and the solution is acceptable.  
436612fe  
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LTC4366  
APPLICATIONS INFORMATION  
threshold, 2.75V:  
–10nF • 51.6k +291k 43V – 35.8V  
Step 5: Determine C , C1  
, Check R  
G
(MAX)  
SS  
The gate capacitor (C ) determines the gate slew rate and  
(
)(  
)
G
C1  
=
(MAX )  
therefore the slew rate of the OUT pin since the output  
2 • 2.75V  
43V 35.8V  
11µA • 51.6k • 291k In 1–  
voltage follows the GATE pin. The voltage at the GATE pin  
riseswithaslopeequalto7.5µA/C atstartupand20µA/C  
G
G
or  
when the charge pump is on. Limiting this slope will limit  
the inrush current charging the load capacitance where:  
C1  
= 0.1µF  
(MAX)  
CLOAD  
CG  
This limit on C1 does not meetthe shunt regulatorstability  
requirements (C1 > 0.22µF).  
I
=
IG  
INRUSH  
If we desire a larger value of C1 then a lower size of R  
SS  
In this example we choose C to be 10nF which limits the  
G
is required. A lower value for R is 48.7k, which calls  
SS  
inrush current to be 660mA for a 330µF C  
.
LOAD  
out an R value of 309k and a max C1 value of 0.27µF.  
IN  
C1 is used as a bypass capacitor for the circuitry between  
The next lower value of 46.4k with R of 324k, results  
VIN  
the OUT and V pins. C1 also stabilizes the shunt regula-  
SS  
in the worst-case maximum C1 value of 0.49µF. A larger  
C1 increases circuit immunity to transients in exchange  
for slightly higher current. Therefore, a selection of com-  
ponents that allow a 0.47µF C1 is recommended.  
tor that clamps the voltage between these pins where the  
minimum value for regulator stability is 0.22µF. An even  
greater 0.47µF value is desired for C1 to protect the OUT  
to V circuitry from transients on the OUT pin.  
SS  
The lowered R value of 46.4k now considers the toler-  
SS  
The startup into an overvoltage creates an upper bound-  
ances of all the components that set the C1 ramp rate to  
guarantee it charges to the 2.55V UVLO1 threshold before  
the OUT voltage exceeds the overvoltage threshold.  
ary on the value of C1. The value of C , R and R  
G
SS  
VIN  
determines a maximum C1 that will reach UVLO1 and  
power the regulation amplifier before the OUT pin voltage  
exceeds the overvoltage threshold. If our desired value  
for C1 (0.47µF) exceeds the maximum allowed C1 then  
Step 6: Determine R , R  
FB1 FB2  
The feedback resistors, R  
and R , are chosen to  
FB2  
FB1  
a smaller R must be used to iterate a new solution for  
SS  
regulatetheovervoltageat43V.Onewaytoquicklychoose  
C1  
. We start with calculating V  
:
(MAX)  
SS(MATCH)  
these resistors is to assign 100µA or 1.2V across a 12.4k  
RSS  
RSS +RVIN  
R
. R would need to drop the remainder of the regu-  
FB1 FB2  
VSS(MATCH)  
=
• V – V  
(
IN Z(VDD)  
)
lated voltage. Dividing this remainder by 100µA yields the  
value for R . In this example R drops 41.8V. When  
FB2  
FB2  
If we use the worst-case 1% maximum value for R  
SS  
divided by 100µA it results in a 422k value.  
(51.6k) and minimum value for R (291k):  
VIN  
Step 7: Determine C , R1  
T
V
= 35.8V  
SS(MATCH)  
DuringanovervoltagethepowerdissipatedintheMOSFET  
is dependent on the load current and the difference be-  
tween the supply and regulated voltages. It is necessary  
to keep the device power in a safe range. In the power  
MOSFET data sheets there is a maximum safe operating  
curve displaying current versus drain to source voltage  
for a fixed pulsed time. Other pulsed time data from DC  
to 10µs are plotted on the one graph. The different lines  
of operation generally follow a constant power squared  
–C • R +R  
VREG VSS(MATCH)  
(
)
(
)
IN  
G
SS  
C1  
=
(MAX)  
2 • VUVLO1  
VREG – V  
IG RSS R •In 1–  
IN  
SS(MATCH)   
Usetheworst-casemaximumgatecurrentof1Ainstead  
of the typical 7.5µA and the worst-case minimum UVLO1  
436612fe  
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LTC4366  
APPLICATIONS INFORMATION  
2
times time or P t. Knowing the power we then adjust  
In order to limit the SD pin current (10mA max) a collector  
resistor, R1, in series with Q1 is required. The maximum  
value for this resistor is around 5M. This requirement oc-  
curs when the pull-down is required to sink 1.6µA from  
2
the time using the timer capacitor to limit the P t during  
overvoltage. In this example the MOSFET data sheet has  
2
2
a 6400W s P t for a 10ms single pulse.  
SD and V is clamped at 12V. High valued resistors are  
DD  
In this application 250V minus 43V is applied across the  
MOSFETat3A. Ifthepowerisappliedforlessthan16.5ms  
susceptibletoleakagecurrentssowechosea470kresistor  
forR1.ResistorR2providesESDprotectionforQ1’sbase.  
2
then MOSFET P t limit is not exceeded:  
The gate resistor R limits the parasitic trace capacitance  
G
P = (250V – 43V) • 3A = 621W  
on M1’s gate node that could lead to parasitic MOSFET  
2
2
2
P t = (621W) • 16.5ms = 6363W s  
self-oscillation. The recommended value for R is 10Ω.  
G
Prior to the moment when the output is regulated at 43V,  
the output is ramping from 28V to 43V. This ramp time is  
based on the 20µA gate current charging the 10nF capaci-  
tor. Using the equation for ramp time:  
High Voltage Application  
In Figure 7 the circuit accepts 110V AC (rectified to 160V)  
and protects the load from accidental connection to 220V  
AC by limiting the output to less than 200V. The circuit  
CG V 10nF 15V  
t =  
=
= 7.5ms  
has a 100V to 800V V operating range where the FET  
IN  
IG  
20µA  
breakdown voltage limits the maximum input voltage. The  
C1issetto0.47µFtoprovideabypassforthechargepump  
that is large enough to provide good noise immunity from  
outside voltage transients. The timer capacitor is sized to  
To be safe we set the overvoltage time to 10ms. We set the  
regulation time to be 2.5ms (the remainder of the 10ms  
overvoltage time minus the ramp time). In this example  
it is assumed the 250V overvoltage is a constant DC volt-  
age for 10ms. This duration exceeds Mil-Std-1275 which  
specifies a 70µs surge to 250V that decays in 1.6ms. Us-  
ing the following equation (based on charging with 9µA)  
2
give a 1ms overvoltage regulation time that keeps the P t  
2
below the 640W s specified for this MOSFET.  
to set the C :  
T
t  
V  
2.5ms  
2.8V  
CT =IT •  
= 9µA •  
8.2nF  
M1  
IXTH12N100L  
V
V
OUT  
IN  
160V (RECTIFIED 110V AC)  
100V TO 800V  
0.5A  
(200V CLAMP)  
C
G
R
G
2nF  
10Ω  
R
IN  
C1  
0.47µF  
4.64M  
R
FB1  
R1  
V
GATE  
LTC4366-2  
OUT  
FB  
BASE  
DD  
12.4k  
470k  
R2  
SD  
R
2M  
100k  
FB2  
Q1  
TIMER  
V
SS  
SD  
BF722  
C
T
3.3nF  
436612 F07  
R
SS  
412k  
DANGER! Lethal Voltages Present  
Figure 7. Rectified 110V AC Supply Protected from 220V AC  
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APPLICATIONS INFORMATION  
28V Vehicle Application  
During negative input voltages Q2 turns on when current  
from R6 (via D4) develops a forward diode drop on R5.  
Q2 then holds the gate of M2 at the input voltage which  
turns M2 off. This blocks negative input voltages from  
reaching M1 and the load. D2 prevents damage to the  
LTC4366’s GATE pin by clamping it at ground when the  
M2’s gate is negative.  
The circuit in Figure 8 adds reverse voltage protection to  
the standard 28V application shown in Figure 6. There are  
three modes to this circuit: pass FET On when the input  
is 18V to 41V, clamping the output to 43V when more  
than 43V appears at the input and finally reverse voltage  
protection when up to –250V DC is present at the input.  
The reverse voltage protection consists of the circuitry  
inside the dotted box in Figure 8. When a positive voltage  
is first applied to the input, D3 and the forward biased  
base-collector junction of Q2 allow the gate of M2 to  
follow the input voltage minus a two diode drop. During  
this condition the body diode of M2 is used to transmit  
power to the LTC4366. Once the LTC4366 is powered up  
it fully enhances the gate of M1 and M2 (via D1). The M1  
and M2 pass FETs then provide a low impedance path to  
the load. In an overvoltage condition, D1 blocks excessive  
positivevoltagefromtheinputsupplypassingtotheGATE  
pin of the LTC4366. D4 eliminates current flow through  
R6 when the input is positive while D3 prevents emitter  
base breakdown of Q2 when the input is powering up.  
Low Voltage Application  
The circuit on the last page (Surge Protected Automotive  
Supply) starts up with minimum input voltage of 9V. In  
order to successfully start up at 9V and clamp the output  
voltage at 18V for input voltages up to 100V the value of  
R
has to be small (1.91k). The FET used in this case has  
SS  
a3Vthresholdtoeasethestart-uprequirements.Thetimer  
capacitor is sized to give a 2.5ms overvoltage regulation  
time that keeps the P t below the 420W s specified for  
this MOSFET.  
2
2
REVERSE VOLTAGE  
PROTECTION  
M2  
M1  
V
V
OUT  
FDB33N25  
FQA62N25C  
IN  
18V TO 41V  
( 250V DC)  
1.5A  
(43V CLAMP)  
Q2  
MMBT3904  
C
G
R
G
10nF  
10Ω  
D1  
R
D3  
IN  
R5  
470k  
R4  
270k  
C1  
0.47µF  
BAV3004W  
324k  
BAV3004W  
D4  
D2  
BAV3004W  
BAV3004W  
R
FB1  
R1  
R6  
270k  
V
GATE  
LTC4366-2  
OUT  
FB  
BASE  
DD  
12.4k  
470k  
SD  
TIMER  
R
422k  
FB2  
Q1  
MMBT3904  
V
SS  
SD  
R2  
100k  
C
T
8.2nF  
436612 F08  
R
SS  
46.4k  
Figure 8. 28V Vehicle Application with Reverse Voltage Protection  
436612fe  
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LTC4366  
PACKAGE DESCRIPTION  
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.  
TS8 Package  
8-Lead Plastic TSOT-23  
(Reference LTC DWG # 05-08-1637 Rev A)  
2.90 BSC  
(NOTE 4)  
0.40  
MAX  
0.65  
REF  
1.22 REF  
1.4 MIN  
1.50 – 1.75  
(NOTE 4)  
2.80 BSC  
3.85 MAX 2.62 REF  
PIN ONE ID  
RECOMMENDED SOLDER PAD LAYOUT  
PER IPC CALCULATOR  
0.22 – 0.36  
8 PLCS (NOTE 3)  
0.65 BSC  
0.80 – 0.90  
0.20 BSC  
DATUM ‘A’  
0.01 – 0.10  
1.00 MAX  
0.30 – 0.50 REF  
1.95 BSC  
TS8 TSOT-23 0710 REV A  
0.09 – 0.20  
(NOTE 3)  
NOTE:  
1. DIMENSIONS ARE IN MILLIMETERS  
2. DRAWING NOT TO SCALE  
3. DIMENSIONS ARE INCLUSIVE OF PLATING  
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR  
5. MOLD FLASH SHALL NOT EXCEED 0.254mm  
6. JEDEC PACKAGE REFERENCE IS MO-193  
436612fe  
21  
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LTC4366  
PACKAGE DESCRIPTION  
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.  
DDB Package  
8-Lead Plastic DFN (3mm × 2mm)  
(Reference LTC DWG # 05-08-ꢀ702 Rev B)  
0.6ꢀ 0.05  
(2 SIDES)  
0.70 0.05  
2.55 0.05  
ꢀ.ꢀ5 0.05  
PACKAGE  
OUTLINE  
0.25 0.05  
0.50 BSC  
2.20 0.05  
(2 SIDES)  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
R = 0.ꢀꢀ5  
0.40 0.ꢀ0  
3.00 0.ꢀ0  
(2 SIDES)  
TYP  
5
R = 0.05  
TYP  
8
2.00 0.ꢀ0  
(2 SIDES)  
PIN ꢀ BAR  
TOP MARK  
PIN ꢀ  
R = 0.20 OR  
0.25 × 45°  
(SEE NOTE 6)  
0.56 0.05  
(2 SIDES)  
CHAMFER  
4
(DDB8) DFN 0905 REV B  
0.25 0.05  
0.75 0.05  
0.200 REF  
0.50 BSC  
2.ꢀ5 0.05  
(2 SIDES)  
0 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
NOTE:  
ꢀ. DRAWING CONFORMS TO VERSION (WECD-ꢀ) IN JEDEC PACKAGE OUTLINE M0-229  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.ꢀ5mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN ꢀ LOCATION ON THE TOP AND BOTTOM OF PACKAGE  
436612fe  
22  
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LTC4366  
REVISION HISTORY  
REV  
DATE  
DESCRIPTION  
PAGE NUMBER  
A
1/12  
Added Patents Pending statement  
1
Revised Figure 4 in Applications Information section  
Removed reference to overcurrent faults under MOSFET Selection  
Fixed orientation of M2 in Figure 8  
11  
B
C
2/12  
8/12  
13  
18  
Updated Shutdown current from <20µA to <14µA  
Changed MOSFET part number and Gate Capacitor value used in the Typical Application  
Added MP-grade order information and specifications  
Added negative sign to graphs G12 x-axis and G18, G21 y-axis  
Changed MOSFET part number in Figure 1 and Figure 6  
1
1
2, 3, 4, 5  
6, 7  
11, 16  
Added section GATE Capacitor, C  
15  
G
Changed I  
current from 5A to 3A in Design Example  
16  
LOAD  
Updated C1  
values in Step 5 calculations to 0.27µF and worst case 0.49µF  
18  
(MAX)  
Updated calculated values in Step 7, added supporting text  
19  
Changed MOSFET part number and GATE capacitor used in Figure 7  
Simplified Diagram: Corrected amplifier’s input polarity in Regulate Diagram  
Functional Diagram: Added switch in series with TIMER pull-down current  
19  
D
E
8/13  
8/15  
9
9
Clarified “Ambient” on Operating Temperature Range; raised T  
TIMER Pin Function: Changed 278ms/µF to 311ms/µF  
to 150°C  
2
8
JMAX  
Figures 1, 6, 8: Changed C to 8.2nF from 10nF  
11, 16, 20  
12, 19  
T
In C equation, changed constant to 3.2 from 3.5; updated C calculation  
T
T
436612fe  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
23  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
LTC4366  
TYPICAL APPLICATION  
Surge Protected Automotive 12V Supply  
M1  
HUF76639S3S  
V
V
IN  
OUT  
12V  
4A  
(9V TO 100V)  
(18V CLAMP)  
C
G
R
G
2nF  
10Ω  
R
IN  
C1  
0.47µF  
29.4k  
R
FB1  
R1  
V
GATE  
LTC4366-2  
OUT  
FB  
BASE  
DD  
12.4k  
470k  
SD  
R2  
100k  
R
169k  
FB2  
Q1  
TIMER  
V
SS  
SD  
MMBT3904  
C
T
3.3nF  
436612 TA02  
R
SS  
1.91k  
RELATED PARTS  
PART NUMBER  
LTC1696  
DESCRIPTION  
COMMENTS  
Overvoltage Protection Controller  
ThinSOT™ Package, 2.7V to 28V  
LTC2909  
Triple/Dual Inputs UV/OV Negative Monitor  
Single/Dual UV/OV Voltage Monitor  
Quad UV/OV Monitor  
Pin Selectable Input Polarity Allows Negative and OV Monitoring  
Ads UV and OV Trip Values, 1.5% Threshold Accuracy  
For Positive and Negative Supplies  
LTC2912/LTC2913  
LTC2914  
LTC3827/LTC3827-1 Low I , Dual, Synchronous Controller  
4V ≤ V ≤ 36V, 0.8V ≤ V  
≤ 10V, 80µA Quiescent Current  
Q
IN  
OUT  
LTC3835/LTC3835-1 Low I , Synchronous Step-Down Controller  
Single Channel LTC3827/LTC3827-1  
4V ≤ V ≤ 60V, 1.23V ≤ V ≤ 36V, 120µA Quiescent Current  
Q
LT3845  
Low I , Synchronous Step-Down Controller  
Q
IN  
OUT  
LTC3850  
Dual, 550kHz, 2-Phase Synchronous Step-Down Dual 180° Phased Controllers, V 4V to 24V, 97% Duty Cycle, 4mm × 4mm  
IN  
Controller  
QFN-28, SSOP-28 Packages  
LTC3890  
LT4256  
Low I , Dual 2-Phase, Synchronous Step-Down 4V ≤ V ≤ 60V, 0.8V ≤ V  
≤ 24V, 50µA Quiescent Current  
Q
IN  
OUT  
Controller  
Positive 48V Hot Swap Controller with  
Open-Circuit Detect  
Foldback Current Limiting, Open-Circuit and Overcurrent Fault Output, Up to 80V  
Supply  
LTC4260  
Positive High Voltage Hot Swap Controller with  
Wide Operating Range 8.5V to 80V  
2
8-Bit ADC and I C  
LTC4352  
LTC4354  
LTC4355  
LT4363  
Ideal MOSFET ORing Diode  
External N-Channel MOSFETs Replace ORing Diodes, 0V to 18V  
Controls Two N-Channel MOSFETs, 1.2µs Turn-Off, –80V Operation  
Controls Two N-Channel MOSFETs, 0.4µs Turn-Off, 80V Operation  
100V Overvoltage and Overcurrent Protection, Latch-Off and Auto-Retry Options  
2.5V to 34V Operation, Protects 60V to –40V  
Negative Voltage Diode-OR Controller  
Positive Voltage Diode-OR Controller  
High Voltage Surge Stopper  
LTC4365  
Window Passer – OV, UV and Reverse Supply  
Protection Controller  
436612fe  
LT 0815 REV E • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
24  
LINEAR TECHNOLOGY CORPORATION 2011  
(408)432-1900 FAX: (408) 434-0507 www.linear.com/LTC4366  

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