LF3324BGC [LOGIC]

Memory Circuit, 1MX24, CMOS, PBGA172, LBGA-172;
LF3324BGC
型号: LF3324BGC
厂家: LOGIC DEVICES INCORPORATED    LOGIC DEVICES INCORPORATED
描述:

Memory Circuit, 1MX24, CMOS, PBGA172, LBGA-172

内存集成电路
文件: 总29页 (文件大小:853K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Features  
LF3324s may be Cascaded for depth and  
width, supporting HDTV, Multiframe SDTV,  
and other high resolution formats  
24,883,200-bit Frame Memory  
54 Mhz Max Data Rate  
May be Organized Into the Following Configurations:  
• 3,110,400 x 8-bit  
• Seamless address space is maintained  
with up to 8 cascaded devices  
• 2,488,320 x 10-bit  
Built-in ITU-R BT.656 TRS detection and  
Synchronization  
• 2,073,600 x 12-bit  
Operating Modes:  
Set & Clear Read/Write Pointer Control Pins  
Choice of Control Interfaces:  
• Random Access with Burst Control  
• FIFO  
Two-wire Serial Microprocessor Interface  
• Parallel Microprocessor Interface  
Near-Full/Empty Flags With Programmable  
Thresholds  
Input Enable Control (Write Mask) for freeze-  
frame applications  
Flexible Pointer Manipulation  
• Write and Read Pointers may be independently  
jumped to arbitrary address locations  
Output Enable Control (Data Skipping)  
JTAG Boundary Scan - IEEE 1149.1  
172 ball LBGA package  
• Write or Read Pointers can be manipulated in real-  
time based on external 24bit address  
1.8V Internal Core Power Supply  
3.3V I/O Supply  
NOTE: This Preliminary Datasheet references LF3324BGC Engineering Samples  
with an E marking under the part designation.  
Applications  
SD/HDTV Video Stream Buffer  
RGB Graphics Buffer  
Frame Synchronization  
CCTV Security Camera Systems  
Time Base Correction (TBC)  
Freeze-Frame Buffer  
Regional Read/Write for Picture-in-Picture (PIP)  
Field-Based or Frame-Based Comb Filtering  
Video Capture & Editing Systems  
Deep Data Buffering  
Video Special Effects (Rotation, Zoom)  
Test Pattern Generation  
Motion Detection or Frame-to-Frame Correlation  
Video Imaging Product  
LOGIC Devices Incorporated  
June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
LF3324 Overview  
The LF3324 is a 24 Mbit memory device that handles 8, 10, or 12bit data. The input data port may be  
clocked asynchronously to the output ports. Since reads are non-destructive, a given data value, once  
written into the memory core, may be read as many times as desired. A user requiring more storage can  
cascade up to eight LF3324s into a larger array.  
A great deal of memory addressing flexibility is offered with the LF3324. Both Burst Mode and Random  
Access addressing is possible. In addition to simple clearing of the Write and Read pointers, either pointer  
may be set/jumped to any location within the entire address space. Real-time random-access Writing or  
Reading is also supported through an external address port.  
The device is controlled by sixteen instruction words of eight bits each, which may be programmed or  
verified via standard I2C 2-wire serial or parallel microprocessor interfaces.  
The OPMODE configuration register selects one of the chip’s operating modes, each of which has versatile  
submode options:  
- FIFO With Asynchronous I/O  
- Synchronous Shift Register (Single Clock; User-set Latency)  
- Random Access With Burst Address  
Figure 1. LF3324 Functional Block Diagram  
SDA SCL  
LOAD  
PROGRAM  
PCE0  
PCE1  
PWE  
PRE  
TDI  
TWO-WIRE SERIAL  
INTERFACE  
TDO  
TRST  
TMS  
TCLK  
PARALLEL  
INTERFACE  
JTAG  
6
PADDR  
8
PDATA  
MEMORY  
24Mbit  
OE  
OUTPUT  
DATA  
PORT  
INPUT  
DATA  
PORT  
D[11:0]  
Q[11:0]  
3,110,400 x  
2,488,320 x 10  
2,073,600 x 12  
8
(x8, x10, x12)  
(x8, x10, x12)  
PE  
PF  
FLAGS  
WCLK  
WEN  
COLLIDE  
WRITE  
POINTER  
READ  
RCLK  
REN  
RSET  
RCLR  
WRITE  
CONTROL  
WSET  
IEN  
POINTER  
OUTPUT  
CONTROL  
WCLR  
MARK  
RANDOM ACCESS  
ADDRESS CONTROL  
24  
RADDRSEL  
WADDRSEL  
ADDR[23:0]  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Figure 2. Single Channel FIFO Mode Functional Block Diagram  
MARK  
WCLK  
RCLK  
WEN  
WIEN  
WRITE  
READ  
WRITE ADDRESS  
READ ADDRESS  
REN  
RSET  
RCLR  
CONTROL A  
CONTROLA  
WCLR  
WSET  
OE  
MEMORY CELL ARRAY  
12  
12  
2,073,600 x 12-bit  
2,488,320 x 10-bit  
3,110,400 x 8-bit  
D[11:0]  
Q[11:0]  
7
CHIP_ADDR6-0  
PROGRAM  
PDATA  
8
6
PF  
FLAG  
PADDR  
COLLIDE  
PE  
MASTER  
CONTROL  
GENERATOR  
PCE0  
PCE1  
PRE  
PWE  
SDA  
SCL  
I2C  
Figure 3. Random Access Mode Functional Block Diagram  
WCLK  
WEN  
WIEN  
RCLK  
WRITE  
READ  
REN  
WRITE ADDRESS  
READ ADDRESS  
CONTROL A  
WCLR  
WSET  
MARK  
RSET  
RCLR  
CONTROL  
OE  
MEMORY CELL ARRAY  
12  
12  
2,073,600 x 12-bit  
2,488,320 x 10-bit  
3,110,400 x 8-bit  
D[11:0]  
7
Q[11:0]  
CHIP_ADDR6-0  
PROGRAM  
PDATA  
8
6
PADDR  
PCE0  
MASTER  
CONTROL  
PCE1  
24  
PRE  
PWE  
SDA  
SCL  
ADDRESS  
CONTROL  
RADDRSEL  
WADDRSEL  
I2C  
24  
ADDR[23:0]  
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LOGIC Devices Incorporated  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Operating Modes  
Asynchronous FIFO mode (OPMODE = 3)  
In OPMODE 3, the LF3324 is configured as asynchronous First-In-First-Out 24Mbit memory, with indepen-  
dent read and write clocks to allow for asynchronous operation. This mode is ideal for buffering or burst  
data applications. Arbitrary write/read pointer jumping is supported in all FIFO modes. In this mode the  
device can re-time a data stream according to a read sync signal (RSET or RCLR) and either ITU-R656  
Timing Reference Signals (TRS) embedded within the incoming (video) data or the falling edge of a write  
sync signal applied to WCLR, WSET, or MARK.  
The input (write) and output (read) clocks need not be synchronous with one another, although the memory  
core may fill or empty if they differ in average frequency. After it “fills,the LF3324 continues writing and  
the oldest data gets written over. If the memory core “empties” (and neither the read nor write pointer  
have been set or cleared during run-time) the read pointer stops incrementing, and the device re-reads the  
last written sample until more data is written. In either case, when the read and write addresses are the  
same, the COLLIDE flag will go high, to alert the host. The almost-full (PF) and almost-empty (PE) flags  
provide advance warning of these conditions whenever user-selected “fullness” or “emptiness” thresholds,  
expressed in approximate eightieths of the memory core size, are exceeded. For example, if the 1/80 and  
79/80 thresholds are enabled, flag PE will go HIGH whenever the read pointer lags behind the write pointer  
by less than 1/80 of the memory space, and flag PF will go HIGH whenever the read pointer leads the  
write pointer by this amount. (Calculations are performed modulo the total address space.) The data input  
and output are sequential and the timing between write and read sync signals dynamically determines the  
effective delay (depth) of the FIFO.  
The “stop reading when empty” FIFO-mode behavior can be avoided by making sure LOAD is HIGH and  
issuing any write or read pointer SET or CLEAR command at any time. This effectively gets the device out  
of this “read-pointer-halting” mode from that point onwards, but invalidates the flags. Random Access Mode  
allows free manipulation of the r/w pointers, and never halts the read pointer without being commanded  
to do so using REN. Since Random Access mode naturally increments the r/w pointers sequentially, like  
in FIFO mode, it may be a better mode to use if complex pointer manipulation of a single-channel of  
memory is desired.  
Synchronous shift register mode (OPMODE = 0)  
In OPMODE 0, the LF3324 becomes a shift register with programmable total latency up to 224-8 clock  
cycles. Writes and reads occur simultaneously, hence synchronous operation.  
In OPMODE 0, the user provides a single clock for both the input and output clocks and specifies a desired  
input-to-output data path latency, configuration register “WADDR” via the control interface. WCLK and RCLK  
must be tied together, as should WEN and REN. When activated, WADDR will begin to countdown, and  
once expired, will allow the inputs to begin to appear on the outputs. In OPMODE 0, WADDR countdown  
can be activated in two ways. The first occurs when the first enable is brought LOW after the LOAD  
signal has been set HIGH after MPU programming. The second is by bringing LOAD HIGH once MPU  
programming complete, after the enables have been brought LOW.  
Random Access Mode (OPMODE = 1)  
Random Access mode is a FIFO mode, with the capability of either full-time write or read pointer Random  
Accessability. This mode also supports write and read pointer jumps to arbitrary locations throughout  
the address space. Unlike Asynchronous FIFO mode, Random Access mode does not disable memory  
reads when the read pointer catches up to the write pointer. Write pointer manipulation can be done  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Operating Modes  
through setting (jumping) the write pointer to the 24bit address via the ADDR[23:0] port or to the WADDR  
configuration register. Read pointer manipulation can be done through setting (jumping) the write pointer  
to the 24bit address via the ADDR[23:0] port or to the RADDR configuration register. Periodic write and  
read pointer jumping can be accomplished by supplying an address through either the ADDR[23:0] external  
address or the WADDR/RADDR instruction registers. Continuous random access can only be accomplished  
through the use of the ADDR[23:0] ports. When the write/read pointers are not being set to an address,  
they increment sequentially in burst mode.  
In Random Access Mode, when WADRSEL = 1 and RADRSEL = 0 the write pointer is set to the address  
supplied by the ADDR[23:0] ports when WSET is brought LOW. In other words, on each active write clock  
cycle (rising edge of WCLK for which WEN was LOW two rising edges of WCLK previously), the user  
directs the write pointer to any desired memory location, using what are otherwise the second channel  
data input and output ports. In this application, ADDR[23:12] denotes the vertical (row) component,  
and ADDR[11:0], the horizontal (column) component, of a Cartesian set. Setting the configuration  
register ROW_LENGTH to the frame’s line (row) length internally defines the Cartesian coordinates. Also,  
ADDR[23:0] can also represent a single 24-bit linear address. The user governs the mapping of (ADDR)  
to the internal memory space by setting the parameter ROW_LENGTH such that the internal ADDRESS  
= ADDR[23-12] * ROW_LENGTH + ADDR[11-0]. A ROW_LENGTH setting of 0 is interpreted as 4096,  
such that ADDRESS = a 24-bit concatenation of {ADDR} for this particular value. For a standard D1 video  
application with 1716 samples per line, the user would set ROW_LENGTH to 1716 decimal = 6B4 hex.  
Offset circuitry within the LF3324 permits the user to cascade several chips in parallel and to use them  
collectively as a single large memory with a seamless address space. Data are read out sequentially by  
rising edges of RCLK, under the control of REN (read enable), RSET (read pointer force to constant), and  
RCLR (read pointer clear to 0). Holding WSET LOW keeps the device continuously in random access  
write mode. Releasing WSET to its HIGH state causes the chip to continue to write sequentially from  
the last-loaded address.  
In Random Access Mode, when RADRSEL = 1, WADRSEL = 0, MARK_SEL = 1, the read pointer is set  
to the address supplied by the ADDR[23:0] ports when RSET is brought LOW. As mentioned above,  
ADDR[23:12] represents the upper bits or the vertical (row) address, whereas ADDR[11:0] represents the  
lower bits or the horizontal (column) address. Releasing RSET HIGH causes the read address pointer to  
increment from its last assigned location to the next sequential address.  
It is important to note that WSET and RSET can be programmed to be level or negative-edge triggered.  
An edge sensitive “SET” command is useful for using SYNC signals to reset FIFO pointers. Level sensitive  
“SET” commands allow full-time Random Access capability.  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Depth Expansion  
Cascading Devices  
Multiple devices can be cascaded to deepen the address space. For every device cascaded more of the  
24bit address space is used.  
Internally, the LF3324 has a 24bit address space. The LF3324 was designed to be cascaded in parallel.  
That is, the inputs of each device are tied together. The input data word (the data word placed on the D  
input port) is to be common for all devices. Similarly, the outputs of all devices are tied together. Each  
device’s write and read pointers behave identically. Only one device drives the shared output bus at one  
time, controlled automatically through internal bus enables.  
Each device in a cascade of N devices is responsible for 1/N of the address space. That is, each device  
writes and/or reads based on the common W/R pointer locations and where that particular device sits in  
the cascade. Configuration Register C[3:0] (BASE_ADDR) is used to define each device’s place in the  
cascade.  
When cascading LF3324s, all write enables WEN and WIEN must be tied together, as must read enables  
REN (see the device connection diagram below).  
The configuration registers of each device must be programmed identically, depending on mode/function,  
except for Register C. Register C defines which region of the 24bit address space the particular device is  
responsible for. Within Register C, there is a 4bit BASE_ADDR and 4bit CASCADE word. BASE_ADDR  
determines the region of address space each device controls, and CASCADE defines how many devices  
are in cascade. Register C effectively is programmed as “Chip n of N”.  
Figure 4. Depth Expansion Example: 48Mbit Memory  
LF3324_1  
WCLK  
WCLK  
RCLK  
AREN  
RCLK  
REN  
SET  
WADRSEL  
CLR  
SET  
WADRSEL  
CLR  
RSET  
RCLR  
RSET  
RCLR  
RADRSEL  
WEN  
RADRSEL  
WEN  
IEN  
IEN  
12  
12  
24  
D
D
Q
Q
ADDR23-0  
ADDR  
LF3324_2  
WCLK  
RCLK  
AREN  
SET  
WADRSEL  
CLR  
RSET  
RCLR  
RADRSEL  
WEN  
IEN  
D
Q
ADDR  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Device Configuration  
The LF3324 has two MPU interfaces. The first is a standard two wire serial interface following the I2C  
protocol. The second is a parallel interface allowing the user to write a byte of data at a time to the  
configuration registers. When the user wishes to use the serial interface, the PROGRAM pin must be set  
LOW, while a HIGH selects the parallel interface. To provide users with more flexibility, the control registers  
have been combined with a “working latch” . Ultimately, the register-latch combination allows users to  
update the configuration registers during chip operation, and then to transfer the register contents to all  
working latches simultaneously using the LOAD signal. When high, the LOAD signal allows the LF3324  
to be pre-programmed during operation, and once brought low after programming updates the working  
latches allowing the new changes to take effect. LOAD can also be maintained low to allow changes to the  
configuration registers to be immediately reflected in the working latches.  
Programming  
the LF3324  
When the PROGRAM pin is LOW, the serial interface is active. Up to 8 LF3324 devices can be connected  
to and programmed by the serial interface. The two wire interface is composed of an SCL clock pin and a  
bi-directional SDA data pin. When inactive, SDA and SCL are forced HIGH by external pull up resistors.  
Serial MPU  
Interface  
Data transmission is achieved over the SDA pin and must remain constant during the logical HIGH portion  
of the SCL clock pulse. The level of SDA, while SCL is HIGH, is interpreted as the appropriate bit value as  
will be shown later. Changing the data on SDA must only occur when SCL is low, because any changes  
to SDA while SCL is HIGH is interpreted as a start or stop request, which are shown in Figure 7 with an  
example data transfer in Figure 8.  
The first operation to begin programming the LF3324 through the serial interface, is to send a start signal.  
When the interface is inactive, a HIGH to LOW transition must be sent on SDA while SCL is HIGH, notifying  
all connected devices (slaves) to expect a data transmission. When transferring data, the MSB of the eight  
bit sequence is the first bit to be transmitted to or from the master or slave. The first byte of data to be  
transmitted on SDA must consist of the 7-bit base address of the slave, along with an 8th READ/WRITE bit  
as the LSB, which describes the direction of the data transmission. The slave whose 7-bit CHIP_ADDR6-0,  
matches the 7-bit base address sent on SDA, will send an acknowledgement back to the master by bringing  
SDA LOW on the 9th SCL pulse. NOTE: In order to differentiate the two internal die, die 0’s CHIP_ADDR(0)  
is tied LOW and die 1’s CHIP_ADDR(0) is tied HIGH.  
During a write operation, if the slave does not send an acknowledgment back to the master device, SDA is  
left high which forces the master to generate a stop signal. In contrast, during a read operation, if there is no  
acknowledgement back from the master device, the LF3324 interprets this as if it were the end of the data  
transmission, and leaves SDA high, allowing the master to generate its stop signal.  
Figure 5. I2C Start and Stop Signals  
Start Signal  
Stop Signal  
SDA  
SCL  
SDA  
SCL  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Device Configuration  
There are four operations that can be performed between the master and the slave. They are: Write  
to consecutive registers, write to a single configuration register, read from consecutive registers and read  
from a single register. To write to consecutive control registers, a start signal and base address must be  
sent with the R/W bit as described above. After the acknowledgment back from the appropriate slave, the  
8-bit address of the target configuration register must be written to the slave with the R/W bit LOW. The  
slave then acknowledges by setting SDA LOW. The data byte to be written into the register can now be  
transferred on SDA. The slave then acknowledges by pulling SDA LOW on the next positive going pulse of  
SCL. The first configuration register address loaded into the LF3324 is considered as the beginning address  
for consecutive writes, and automatically increments to the next higher address space. Therefore after the  
acknowledgement, the data byte to configure register (first address + 1) can now be transferred from master  
to slave. At any point a stop signal can be given to end the data transfer. To write to a single configuration  
register, the same technique can be applied adding a stop signal after the first data write.  
To read from consecutive control registers, the master must again give the start signal followed by a  
base address with the R/W bit = 0, as if the master wants to write to the slave. The appropriate slave  
then acknowledges. The master will then transfer the target register address to the slave and wait for  
an acknowledge. The master will then give a repeated start signal to the slave, along with the base  
address and R/W bit this time HIGH signifying a read and wait for an acknowledge. The user must write  
to the LF3324 to select the appropriate initial target register. Otherwise the starting position of the read is  
uncertain. Once the LF3324 acknowledges, the next byte of data on SDA is the contents of the addressed  
register sent from the device. If the master acknowledges, the LF3324 will send the next higher register’s  
contents on the following byte of data. To read from only one register is the same procedure as for  
consecutive reading with a stop signal following the transfer of the register’s contents.  
Figure 6. I2C Example of transferring 11001101 on SDA  
1
2
3
4
5
6
7
8
SCL  
SDA  
The parallel MPU interface can be used to write instructions to the control registers or to read them back  
for verification. When the PROGRAM pin is HIGH, the parallel interface is selected. An external processor  
can write into an internal register by setting PADDR to the desired register address, selecting the chip using  
the PCEx pin, setting PDATA to the desired value and then pulsing PWE LOW. The data will be written into  
the selected register when both PWE and PCEx are LOW, and will be held when either signal goes HIGH.  
To read from a configuration register the processor must set PADDR to the desired address, select the chip  
with the PCEx pin, and then set PRE LOW. The chip will then drive PDATA with the contents of the selected  
register. After the processor has read the value from PDATA, PRE and PCEx should be set HIGH. The  
PDATA pins are turned off (High Impedance) whenever PCEx or PRE are HIGH or when PWE is LOW. The  
chip will only drive these pins when both PCEx and PRE are LOW and PWE is HIGH. One can also ground  
the PRE pin and use the PWE pin as a read/write direction control and use the PCEx pin as a control I/O  
strobe. NOTE: PCE0 addresses die 0, while PCE1 addresses die 1.  
Parallel MPU  
Interface  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Device Configuration  
Parallel  
Interface  
Cont’d  
Figure 7. Normal Reading and Writing From a Configuration Register  
Read Cycle - Normal Mode  
PCEx  
tCSU  
PWE  
tCSPW  
tCSU  
PRE  
tCSU  
PADDR[5:0]  
PDATA[7:0]  
tCDLY  
tCZ  
Write Cycle - Normal Mode  
PCEx  
tCSU  
tCSPW  
PWE  
PRE  
tCSU  
tCSU  
PADDR[5:0]  
PDATA[7:0]  
tCHD  
tCSU  
Figure 8. Reading and Writing From a Configuration Register with PRE Held Low  
Read Cycle - PRE held low  
tCSPW  
PCEx  
PWE  
tCSU  
PADDR[5:0]  
tCDLY  
tCZ  
PDATA[7:0]  
Write Cycle - PRE held low  
tCSPW  
PCEx  
PWE  
tCSU  
PADDR[5:0]  
PDATA[7:0]  
tCSU  
tCHD  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Detailed Signal Definitions  
VCCINT - Internal Core Power Supply  
+1.8V power supply. All pins must be connected.  
Power  
VCCO - Output Driver Power Supply  
+3.3V power supply. All pins must be connected.  
Clocks  
WCLK - Write Clock  
Data present on D11-0 is written into the LF3324 on the rising edge of WCLK when WEN was LOW for  
the previous rising edge of WCLK.  
RCLK - Read Clock  
In data is read from the LF3324 and presented on the output port (Q11-0) after a rising edge of RCLK  
while REN and OE are LOW. When using the ADDR[23:0] external address port for read-address setting,  
ADDR[23:0] is latched on the rising edge or RCLK.  
Inputs  
D11-0 - Data Input  
D11-0 is the 12-bit registered data input port. Bit 11 is the MSB in all modes. D1-0 are ignored in 10-bit  
mode and D3-0 are ignored in 8-bit mode. Any such unused inputs should either be tied to ground or  
driven to proper logic levels by external logic.  
ADDR23-0 - Random Access Address Port  
ADDR[23:0] is the 24-bit external address port. The 24bit address is a purely linear address when the  
configuration register ROW_LENGTH is equal to 0(default). When ROW_LENGTH is a non-zero value,  
the memory is set to have a row (line) length of ROW_LENGTH. ADDR11-0 specifies the X/Column-  
coordinate and ADDR23-12 specifies the Y/Row-coordinate.  
CHIP_ADDR6-1 - Serial Interface Chip Address  
CHIP_ADDR6- determines the LF3324’s address on the two-wire microprocessor bus. Each LF3324  
chip’s 7-bit two-wire serial microprocessor interface address is equal to its CHIP_ADDR6-0. NOTE:  
CHIP_ADDR0 is internally tied LOW on die 0 and HIGH on die 1.  
SCL - Serial Clock Input  
SCL is a standard two-wire serial microprocessor interface clock pin. With this chip, it functions as a  
dedicated input, since this part cannot be the master on an two-wire serial microprocessor interface.  
PADDR5-0 - Parallel Microprocessor Interface Address Port  
PADDR5-0 is the 6-bit address port for the parallel microprocessor interface.  
PDATA7-0 - Parallel Microprocessor Interface Data Port  
PDATA7-0 is the 8-bit data port for the parallel microprocessor interface. When inactive becomes high  
impedance.  
Input/Output  
SDA - Serial Data I/O  
SDA is the standard bidirectional data pin of a two-wire serial microprocessor interface. External pullup  
is required on SDA.  
WCLR - Write Pointer Clear  
Controls  
When WCLR is brought LOW, the next rising edge of WCLK will bring the current value on D[11:0] into  
memory address 0. Whenever WCLR is HIGH, the destination for D[11:0] will be controlled by WSET.  
The user may program WCLR such that either its falling edge or its LOW state is active. If its LOW state  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Detailed Signal Definitions  
is active, holding this pin LOW will hold the write address in its zero position continuously. This control  
takes effect only when WEN is LOW.  
RADDRSEL - Read Address Select  
RADDRSEL selects the source of the read address. This pin and control MARKSEL select whether  
RSET forces the read address to the RADDR configuration register (RADDRSEL = 0) or to ADDR[23:0]  
(RADDRSEL = 1). This control takes effect only when REN is LOW.  
WSET - Write Pointer Set  
This control is active only when WCLR is HIGH. Bringing WSET LOW will cause the next rising edge  
of WCLK to bring the current value on D[11:0] into memory at the address specified by WADDR, or at  
the address present on ADDR[23:0]. Whenever WSET and WCLR are HIGH, the next rising edge of  
WCLK will bring the current D[11:0] data value into the next-higher address in sequence. WSET may be  
programmed to be either edge-triggered, in which case it affects the write pointer for only one clock cycle  
following a falling edge, after which incrementing resumes, or level-triggered, in which case it affects the  
write pointer until it is brought HIGH. For continuous random access write operation, holding WSET LOW  
and programming it to be level-triggered will provide the needed continuous write pointer override. This  
control takes effect only when WEN is LOW.  
WADDRSEL - Write Pointer Set  
WADDRSEL selects the source of the write address. WADDRSEL determines whether WSET forces  
the write address pointer to the WADDR configuration register (WADDRSEL = 0) or to ADDR[23:0]  
(WADDRSEL = 1). This control takes effect only when WEN is LOW.  
MARK - Write Address Pointer Mark  
Bringing this bit LOW will cause an internal register to store a copy the current value of the write address  
pointer, for subsequent use in synchronizing the corresponding read address pointer to the same location.  
Unlike WCLR and WSET, this control does not affect the write pointer value itself. The system must use  
MARK instead of WCLR if the entire memory core can be filled between sequential falling edges of the  
sync reference signal. In contrast, the system must use WCLR or WSET to establish a definite relationship  
between the internal address and the data stream, as in random access read mode.  
RSET - Read Address Pointer Set  
If REN is LOW, bringing RSET LOW will force the read address to the most recently marked value  
(MARK_SEL LOW), to RADDR (MARKSEL HIGH and RADRSEL LOW), or to ADDR[23:0] (MARK_SEL  
is HIGH and RADRSEL is HIGH). This pin may be programmed to be either falling edge or level sensitive  
active.  
RCLR - Read Address Pointer Clear  
Bringing RCLR LOW causes the next rising edge of RCLK to force the read address pointer to zero.  
This pin may be programmed to be active on its falling edge or in its LOW state. It can reset the read  
pointer only when REN is LOW.  
WEN - Write Enable  
If WEN is LOW, data on D11-0 is written to the device on the rising edge of WCLK. When WEN is HIGH,  
the device ignores data on D and holds the write pointer. The user must anticipate the use of WEN by one  
cycle. Therefore when desiring not to write a sample, WEN must be brought high the cycle before.  
WIEN - Memory Write Enable (Write Masking)  
WIEN is used to enable/disable writing into the memory core. A LOW on WIEN enables writing, while a  
HIGH on WIEN disables writing. The internal write address pointer is incremented by WEN regardless of  
the WIEN level. If disabling of WIEN is never desired, tie WIEN LOW.  
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DEVICES INCORPORATED  
Preliminary Datasheet  
Detailed Signal Definitions  
REN - Read Enable  
If REN is LOW and the output port is enabled, data is read and presented on Q[11:0] after tD has elapsed  
from the rising edge of RCLK. If REN goes HIGH, the last value loaded into output register will remain  
unchanged and the read pointer will be held. The user must anticipate the use of REN by one cycle.  
Therefore when desiring not to read a sample, REN must be brought high the cycle before.  
PROGRAM - Serial/Parallel Interface Selector  
When the user wishes to use the serial microprocessor to configure the LF3324, the PROGRAM pin must  
be set LOW. If the user wishes to use the parallel interface, PROGRAM must be set HIGH.  
LOAD – Instruction Load  
Bringing asynchronous control LOAD LOW updates the working instruction latches to match the current  
contents of the instruction preload latches. Holding it LOW causes the working latches to reflect all ongoing  
instruction preloads. Holding it HIGH permits the user to preset the instruction preload latches to any  
desired configuration without disturbing the work in progress. After any write to the configuration registers,  
LOAD must be brought high for one cycle, and can then be brought and left low if so desired.  
RESET - Global Reset  
Bringing synchronous control RESET LOW forces all state machines and read and write pointers to 0 and  
holds them there until it is released HIGH. It also forces the configuration registers to their default states,  
if and only if LOAD is also LOW. The user may then modify the control registers as necessary. Bringing  
RESET LOW while holding LOAD HIGH will reset the state machines and pointers, but will not change  
either the preload or the working latches.  
OE - Output Enable  
When OE is LOW, Q[11:0] is enabled for output. When OE is HIGH, Q[11:0] is placed in a high-impedance  
state. In 10-bit modes, Q1-0 are unconditionally tristated. In 8-bit modes, Q3-0 are tristated. The flag  
outputs are not affected by OE.  
PCE0/PCE1 - Parallel Interface Chip Enable  
When LOW, PCE0 enables writing to die 0 with the parallel micrprocessor interface. When LOW, PCE1  
enables writing to die 1 with the parallel micrprocessor interface.  
PWE - Parallel Interface Write Enable  
When LOW, PWE enables writing to the LF3324’s Instruction Registers with the parallel micrprocessor  
interface.  
PRE - Parallel Interface Read Enable  
When LOW, PRE enables reading from the LF3324’s Instruction Registers with the parallel micrprocessor  
interface.  
Data Outputs  
Q11-0 - Data Output  
Q[11:0] is the 12-bit registered data output port. Q[11:0] is always the MSB. In 10-bit mode, bits  
1 and 0 are tristated. In 8-bit mode, bits 3-0 are tristated. All active bits are updated on each  
rising edge of RCLK when REN is LOW.  
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Preliminary Datasheet  
Detailed Signal Definitions  
PF - Programmable Almost Full  
Flag Outputs  
PF goes HIGH (active) when the write pointer is more than (MAX_depth - (MAX_depth x TH)) locations  
ahead of the read pointer. TH is a threshold value stored in Register 9 [2:0]. PF is updated on the  
rising edge of WCLK. TRS bits either entering of emerging to/from the device can be mapped to PF  
(Register B[3:0]).  
PE - Programmable Almost Empty Flag  
PE goes HIGH (active) when the write pointer is less than or equal to (MAX_depth - (MAX_depth x TL))  
locations ahead of the read pointer. TL is a threshold value stored in Register 9 [2:0]. PE is updated  
on the rising edge of RCLK. TRS bits either entering of emerging to/from the device can be mapped  
to PE (Register B[7:4]).  
COLLIDE - Memory Read/Write Pointer Collision Flag  
This flag goes high whenever the read and write addresses to the memory core coincide.  
By monitoring the partial full/empty flags, the user can ascertain the direction of approach,  
i.e., read pointer catching up with write (FIFO empty) or write pointer catching up with read  
(FIFO full). TRS bits from D and Q can be mapped to COLLIDE (Register B[3:0]).  
TDI - JTAG input data  
TDI is the input data pin when using JTAG.  
JTAG  
TDO - JTAG output data  
TDO is the output data pin when using JTAG.  
TRSTB - JTAG reset  
TRSTB is used to reset all the registers and state machine fount the the JTAG module.  
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Preliminary Datasheet  
Detailed Signal Definitions  
TMS - JTAG Tap controller input  
TMS controls the state of the tap controller.  
TCK - JTAG clock  
TCK is the used supplied clock of JTAG. It controls the flow of data and latches input data on the  
rising edge.  
Configuration Register Map  
The various 8-bit control registers may be pre-programmed with either the parallel microprocessor port  
(PROGRAM=1), or through the serial microprocessor interface bus(PROGRAM=0). Changes in pre-  
programming begin to affect the data path when LOAD is brought LOW. In each instance, the value in  
parens () is the default state following assertion of RESET while LOAD = 0.  
Configuration Register 0 (default = 00000000)  
3:0 = ROW_LENGTH[11:8]  
(0000: 24-bit linear map; see reg 7)  
Configuration Register 1 (default = 00000000)  
7:0 = ROW_LENGTH[7:0]  
(00000000: 24-bit linear map; see reg 6)  
Configuration Register 2 (default = 00000000)  
7:0 = WADDR[23:16]  
(00000000: default = 0; see reg 9, a)  
Configuration Register 3 (default = 00000000)  
7:0 = WADDR[15:8]  
(00000000: default = 0; see reg 8, a)  
Configuration Register 4 (default = 00000000)  
7:0 = WADDR[7:0]  
(00000000: default = 0; see reg 8, 9)  
Configuration Register 5 (default = 00000000)  
7:0 = RADDR[23:16]  
(00000000)  
Configuration Register 6 (default = 00000000)  
7:0 = RADDR[15:8] (00000000)  
Configuration Register 7 (default = 00000000)  
7:0 = RADDR[7:0]  
(00000000)  
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Configuration Register Map  
Configuration Register 8 (default = 10_00_0_111)  
7:6 = WIDTH[1:0]  
5:4 = Reserved  
(10: 10 bits)  
(Make equal to 00)  
(Make equal to 0)  
(111)  
3
= MARK_ACTIVE_RSET  
2:0 = OPMODE  
Configuration Register 9 (default = 00_000_000)  
7:6 = TRS_SYNC[1:0] (00: ignore embedded TRS)  
Reserved - set to 0  
5
4
3
= -------  
= A_FLD  
(0: frame sync - use falling F-bit from TRS)  
(0: use marked address - not user defined address)  
(000: trigger empty, full on 1/80, 79/80)  
= MARK_SEL  
2:0 = FLAG_SET  
Configuration Register A (default = 00000000)  
7
6
5
4
3
2
1
0
= -------  
Reserved - set to 0  
= WSET_catch  
= RSET_b_sel  
= RCLR_b_sel  
= -------  
(0: setting pointer does not MARK its new value)  
(0: RSET is falling edge triggered)  
(0: RCLR is falling edge triggered)  
Reserved - set to 0  
= -------  
Reserved - set to 0  
= WSET_b_sel  
= WCLR_b_sel  
(0: WSET is falling edge triggered)  
(0: WCLR is falling edge triggered)  
Configuration Register B (default = 00_00_00_00)  
7:4 = -------  
RESERVED  
3:0 = FLAG_CTL  
(00: PE, PF are part-empty, -full)  
Configuration Register C (default = 0000_0000)  
7:4 = BASE_ADDR  
3:0 = CASCADE  
(0000: lowest-address chip in cascade sequence)  
(0000: single chip - no cascade of multiple chips)  
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Preliminary Datasheet  
Configuration Register Definitions  
Register 0[3:0], Register 1[7:0] = ROW_LENGTH[11:0] - for Cartesian-to-linear address map  
This control governs the remapping of Cartesian coordinates arriving on ADDR[11-0] (horizontal/column  
component) and ADDR[23-12] (vertical/row component) into a linear address, for use by the chip’s internal  
address generator. Setting ROW_LENGTH to 0 causes the incoming address to be interpreted directly as a  
linear address, with the 24bits ADDR[23:0] address.  
Register 2[7:0], Register 3[7:0], Register 4[7:0] = WADDR[23:0] - 24bit Jump’ Address  
Configuration register WADDR defines a static 24bit address (image pixel or memory location) that  
the Write pointer can be ‘jumped’ to. Bringing WSET LOW forces/jumps the memory write pointer to  
the address defined by WADDR (when WADRSEL is LOW). When used in this way, WADDR is an  
override address. For 2-D applications, where ROW_LENGTH defines a frame’s Horizontal dimension,  
, WADDR[11:0] is equal to the 12-bit X-coordinate (Horizontal) and WADDR[23:12] is considered the  
Y-coordinate (Vertical) in a Cartesian Coordinate system. When ROW_LENGTH is 0, WADDR[23:0]  
is considered to be a linear address in the memory space. By changing the ROW_LENGTH, the  
X-coordinate can be from 0 to (ROW_LENGTH-1) to make up the Cartesian plane. For example, if  
ROW_LENGTH = 16, the X-coordinate or WADDR[11:0] can be from 0 to 15 in the Cartesian space.  
Register 5[7:0], Register 6[7:0], Register 7[7:0] = RADDR[23:0] - 24bit Jump’ Address  
Bringing RSET LOW forces/jumps the read pointer to the address defined by RADDR.  
Register 8[7:6] = WIDTH[1:0] - data word size at input/output ports  
Input Port  
D[11:4]  
Output Port  
0x  
10  
11  
8 bits  
Q[11:4] (Q[3:0] tristated)  
Q[11:2] (Q[1:0] tristated)  
Q[11:0]  
10 bits  
12 bits  
D[11:2] (default)  
D[11:0]  
Register 8[5:4] = Reserved  
Register 8[3] = MARK_ACTIVE_RSET  
0
1
ignores the internal RSET that occurs following the MARK  
obeys the internal RSET according to the MARK  
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Preliminary Datasheet  
Configuration Register Definitions  
Register 8[2:0] = OPMODE[2:0] - operating mode  
000  
001  
010  
011  
1XX  
RESERVED  
Random Access  
RESERVED  
FIFO  
RESERVED  
Register 9[7:6] = TRS_SYNC[1:0] - response to embedded TRS EAV  
00  
01  
10  
disable TRS sync detection (default)  
F-bit of embedded TRS EAV marks current write pointer.  
F-bit of embedded TRS EAV sets current write pointer to value  
set by ADDR[23:0] or WADDR  
11  
RESERVED  
Register 9[4] = FLD frame/field sync select  
0
1
use only falling F-bit in EAV (frame-based sync); ignore rising F-bit (default)  
use both rising and falling F-bit in EAV (field-based sync)  
Register 9[3] MARK_SEL - This signal is used in combination with pin RADRSEL to determine to  
effect of bringing RSET low on the read pointer(s). When RSET goes to 0:  
0
1
force read pointer(s) to marked address(es) (default)  
force read pointer(s) as shown in following table:  
RADRSEL  
Read Pointer Equals:  
ADDR[23:0] address  
RADDR address  
1
0
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Configuration Register Definitions  
Register 9[2:0] = FLAG_SET[2:0] - sets fractional “fullness” and “emptiness” thresholds in  
memory core.  
Partially Full flag goes HIGH when the memory is more than “TH” full. Partially Empty flag goes  
HIGH when the memory is less than or equal to “TLfull.  
000  
001  
010  
011  
100  
101  
110  
111  
TH = 79/81 (default)  
TH = 78/81  
TL = 1/81 (default)  
TL = 2/81  
TH = 77/81  
TL = 3/81  
TH = 76/81  
TL = 4/81  
TH = 75/81  
TL = 5/81  
TH = 74/81  
TL = 6/81  
TH = 73/81  
TL = 7/81  
TH = 72/81  
TL = 8/81  
Register A[6] = WSET_catch  
0
1
Setting Write Pointer does not “MARK” its new value (default)  
Setting Write Pointer auto-MARKS its new value  
Register A[5:0] Control action.  
Rb[5]  
Rb[4]  
Rb[3]  
Rb[2]  
Rb[1]  
RSET_b_sel  
RCLR_b_sel  
WADDRSEL_b_sel  
RADDRSEL_b_sel  
WSET_b_sel  
Rb[0]  
if 0:  
WCLR_b_sel  
Each falling edge on the corresponding control pin overrides a  
memory address counter for exactly one clock cycle, after which  
normal memory address incrementing immediately resumes. (default)  
The corresponding pin continuously overrides the memory address  
counter as long as it is held LOW. Memory address incrementing  
resumes when the pin is returned HIGH.  
if 1:  
Register B[7:4]=  
-------  
Reserved  
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Configuration Register Definitions  
Register B[3:0] FLAG_CTL[3:0] for pins PE and PF *  
FLAG_CTL  
0000  
0001  
0010  
PE  
Empty (Emerging)  
------  
PF  
COLLIDE  
Full (Incoming)  
COLLIDE (Emerging)  
RA=MA (Emerging)  
D v (Incoming)  
Q v (Emerging)  
D v (Incoming)  
Q v (Emerging)  
D h (Incoming)  
Q h (Emerging)  
D h (Incoming)  
Q h (Emerging)  
COLLIDE (Emerging)  
D h (Incoming)  
D f (Incoming)  
Q f (Emerging)  
D f (Incoming)  
Q f (Emerging)  
D f (Incoming)  
Q f (Emerging)  
D v (Incoming)  
Q v (Emerging)  
0011  
Q h (Emerging)  
0100  
COLLIDE (Emerging)  
COLLIDE (Emerging)  
COLLIDE (Emerging)  
COLLIDE (Emerging)  
COLLIDE (Emerging)  
COLLIDE (Emerging)  
0101  
0110  
0111  
1000  
1001  
*Each flag is updated on the rising edge of its associated clock: WCLK (Incoming) or RCLK (Emerging)  
D f, v, h are the TRS bits embedded in the incoming TRS signals.  
Q f, v, h are the TRS bits embedded in the emerging TRS signals.  
RA is the read address pointer value.  
MA is the ‘marked’ address pointer value.  
Register C[7:4] = BASE_ADDR[3:0] - position of chip in cascade series; 0000 = lowest;  
BASE_ADDR[3:0] must not exceed CASCADE[3:0]**  
0000:  
0001:  
....  
chip one of N (N is number of chips in system)  
chip two of N (N is number of chips in system)  
....  
0111:  
chip eight of N (N is number of chips in system)  
** Note: There are two cascaded die per LF3324. Die 0 is chip 1 of 2, die 2 is chip 2 of 2.  
Register C[3:0] = CASCADE[3:0] - number of chips in a system with concatenated address  
spaces*.  
0001:  
0011:  
....  
single chip operation (two die)  
two chip cascade (four die)  
....  
1111:  
eight chip cascade (sixteen die)  
* Note limits regarding the number of possible chips, related to WIDTH control:  
8bit data: 5 or less LF3324s (WIDTH = 0x)  
10bit data: 6 or less LF3324s (WIDTH = 10)  
12bit data: 8 or less LF3324s (WIDTH = 11)  
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Preliminary Datasheet  
Reserved Configuration Registers  
Instruction registers D hex and above are reserved for test purposes only.  
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Preliminary Datasheet  
MAXIMUM RATINGS Above which useful life may be impaired (Notes 1, 2, 3, 8)  
Storage temperature  
–65°C to +150°C  
VCCINT , Internal supply voltage with respect to ground  
VCCO, Output drivers supply voltage with respect to ground  
Signal applied to high impedance output  
Output current into low outputs  
–0.5V to + 2.0V  
–0.5V to + 4.0V  
–0.5V to + 3.3V  
25 mA  
Latchup current  
> 400 mA  
OPERATING CONDITIONS To meet specified electrical and switching characteristics  
Characteristic  
VCCINT  
Mode  
Temperature Range  
0°C to +70°C  
Supply Voltage  
1.71V < Vcc < 1.89V  
3.00V < Vcc < 3.60V  
Commerical  
Commerical  
VCCO  
0°C to +70°C  
ELECTRICAL CHARACTERISTICS Over Operating Conditions (Note 4)  
Symbol  
Parameter  
Test Condition  
Min  
Typ Max Unit  
2.4  
V
Output High Voltage  
Output Low Voltage  
Input High Voltage  
Input Low Voltage  
Input Current  
V
CC = Min., IOH MAX = -4 mA  
CC = Min., IOL MAX = 4 mA  
VOH  
VOL  
VIH  
VIL  
V
V
0.4  
2.0  
V
V
(Note 3)  
0.8  
µA  
With Internal Pull-up - JTAG  
All other pins  
IIx  
+20  
µA  
Input Current  
IIx  
±10  
µA  
Ground < VOUT < VCC (Note 12)  
(Note 5,6)  
Output Leakage Current  
IOZ  
±10  
mA  
V
CC Current, Dynamic  
CC Current, Quiescent  
ICC1  
ICC2  
CIN  
COUT  
400  
mA  
10  
(Note 7)  
V
pF  
7
TA = 25°C, f = 1 MHz  
TA = 25°C, f = 1 MHz  
Input Capacitance  
Output Capacitance  
pF  
7
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Switching Characteristics  
Commercial Operating Range (0°C to +70°C) Notes 9, 10 (ns)  
LF3324BGC  
-
Max  
Min  
Max  
Min  
18  
18  
5
Symbol  
tCYC1  
tCYC2  
tPWH  
tPWL  
tDS  
Parameter  
Cycle Time 1 (WCLK, RCLK) - FIFO Mode  
Cycle Time 2 (WCLK, RCLK) - Full-time Random Access  
Clock Pulse Width High (WCLK, RCLK)  
Clock Pulse Width Low (WCLK, RCLK)  
Setup Time, Data Inputs (D)  
5
5
Hold Time, Data Inputs (D)  
1
tDH  
Write Enable Setup Time (WEN)  
Write Enable Hold Time (WEN)  
5
tWES  
tWEH  
tRES  
tREH  
tLDS  
tLDH  
tRWS  
tRWH  
tD  
1
Read Enable Setup Time (REN)  
Read Enable Hold Time (REN)  
5
1
Load Setup Time  
5
Load Hold Time  
1
R/W Set/Clr Setup Time  
5
(WCLR,RADDRSEL,WSET,WADDRSEL,RSET,RCLR)  
R/W Set/Clr Hold Time  
1
7
7
(WCLR,RADDRSEL,WSET,WADDRSEL,RSET,RCLR)  
Access Time  
tF  
10  
10  
tDIS  
Write Clock to Programmable Flags (PE, PF, COLLIDE)  
Tri-state Output Disable Delay  
tENA  
tCSU  
tCHD  
tCSPW  
tCDLY  
tCZ  
5
1
Tri-state Output Enable Delay  
Parallel Interface Control Setup Time for Reads/Writes  
Parallel Interface Control Hold Time for Reads/Writes  
Parallel Interface Control Strobe Pulse Width  
Parallel Interface Control Output Delay  
Parallel Interface Control Tristate Delay  
20  
8
10  
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Write Cycle Timing - Write Enable  
WCLK  
Preliminary Datasheet  
tWES  
tWEH  
tPWH  
tPWL  
tCYC1  
tCYC2  
WEN  
tDS tDH  
(n)  
(n+1)  
(n+3)  
(n+4)  
(n+5)  
D[11:0]  
IEN = LOW  
NOTE: WEN must be brought LOW 2 rising edges of WCLK prior to latching valid data on D  
Write Cycle Timing - Write Masking  
WCLK  
tWES  
tWEH  
tPWH  
tCYC1  
tCYC2  
tPWL  
WIEN  
tDS tDH  
data not  
written  
(n+5)  
data not  
D[11:0]  
(n)  
(n+1)  
(n+3)  
(n+4)  
written  
(n+7)  
(n+6)  
WEN = LOW  
NOTE: Bringing WIEN HIGH disables data on D from being written into memory, yet it does not disable the Write pointer from incrementing  
NOTE: WIEN must be brought HIGH 2 rising edges of WCLK prior to masking input data on D  
Read Cycle Timing  
RCLK  
tRES  
tPWH  
tCYC1  
tCYC2  
tPWL  
tREH  
tD  
REN  
tD  
Q[11:0]  
(n–2)  
(n–1)  
(n)  
(n+1)  
(n+2)  
(n+3)  
tF  
tF  
PE  
COLLIDE  
OE = LOW  
NOTE: REN should be brought LOW 2 rising edges of RCLK prior to expecting valid data on Q  
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LOGIC Devices Incorporated  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Write Reset Timing  
WCLK  
Preliminary Datasheet  
1
2
3
4
5
tRWH  
tRWS  
WCLR  
WSET  
tRWH  
tRWS  
tDS tDH  
(0)  
(n)  
(n+1)  
(1)  
(2)  
(A)  
(A+1)  
D[11:0]  
WEN = LOW  
CLR and SET both programmed to be falling edge sensitive  
*
Rising Edge 1: Clears Write Pointer and latches data on D to be written in address 0  
*
Rising Edge 4: Sets Write Pointer to Address A (based on WADDR) and latches data on D to be written in Address A  
Read Reset Timing  
1
2
8
9
10  
RCLK  
CLR  
tRWS  
tD  
....  
Q[11:0]  
(1)  
(n)  
(n+1)  
(n+2)  
(n+8)  
(0)  
REN = LOW  
NOTE: CLR programmed as being falling edge sensitive  
It takes 9 REN-enabled rising edges of RCLK (including the edge that latches a LOW on CLR) to pass the contents of address 0 to the Q port.  
Random Access Read Pointer ‘JumpTiming  
1
13  
14  
RCLK  
tDS tDH  
A23–0  
ADDR23-0  
RSET  
tD  
tD  
Q[11:0]  
(n–2)  
(n-1)  
(n)  
(n+13)  
(A)  
(A+1)  
OE = LOW  
REN = LOW WADDRSEL= LOW RADDRSEL= HIGH OPMODE[2:0]=001 MARK_SEL (Register 9[3]) =1  
NOTE: RSET programmed to be falling edge sensitive  
NOTE: It takes 14 rising edges of RCLK upon setting/jumping the Read pointer  
(to the 24bit Address "A" on ADDR) for the contents of location A to be dumped onto Q  
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LOGIC Devices Incorporated  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Random Access Write Pointer ‘JumpTiming  
1
WCLK  
tDS tDH  
ADDR23–0  
WSET  
A23-0  
tRWS  
(n+1)  
(A)  
(A+1)  
(A+2)  
(A+3)  
D[11:0]  
(n)  
(A+4)  
WEN= LOW WADDRSEL= HIGH  
OPMODE[2:0]=001  
NOTE: SET programmed to be falling edge sensitive  
NOTE: Rising edge of WCLK labeled "1" writes data on D to 24bit Address "A"  
Output Enable and Disable  
OE  
tDIS  
tENA  
HIGH IMPEDANCE  
Q[11:0]  
Jumping/Setting Pointers based on Configuration Register Address after Remapping Process  
1
2
3
4
5
6
7
WCLK  
WEN  
tRWH  
tRWH  
1
2
LOAD  
WSET  
tRWS  
tRWH  
3
tRWS  
tRWH  
4
RSET  
SET and RSET programmed to be level sensitive  
1WEN is LOW for 3 rising edges of WCLK prior to LOAD transition. It stays LOW for the minimum required 5 rising edges after the LOAD transition.  
2The configuration registers are programmed while LOAD is LOW. The LOAD transition triggers the address remap process.  
3WSET can be brought LOW (edge "3") 3 rising edges of WCLK after the LOAD transition, jumping the write pointer to the address programmed into the WADR register.  
4RSET can be brought LOW (edge "7") 7 rising edges of RCLK after the LOAD transition, jumping the read pointer to the address programmed into the RADDR register.  
Video Imaging Product  
LOGIC Devices Incorporated  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Notes  
1. Maximum Ratings indicate stress specifications only. Functional operation of these products  
at values beyond those indicated in the Operating Conditions table is not implied. Exposure to  
maximum rating conditions for extended periods may affect reliability.  
2. The products described by this specification include internal circuitry designedtoprotect the chip  
from damaging substrate injection currents and accumulations of static charge. Nevertheless,  
conventional precautions should be observed during storage, handling, and use of these circuits  
in order to avoid exposure to excessive electrical stress values.  
3. This device provides hard clamping of transient undershoot. Input levels below ground will be  
clamped beginning at –0.6V. The device can withstand operation with inputs or outputs in the  
range of –0.5 V to +5.5 V. Device operation will not be adversely affected, however, input current  
levels may be in excess of 100 mA.  
4. Actual test conditions may vary from those designated but operation is guaranteed as speci-  
fied.  
5. Supply current for a given application can be approximated by:  
2
NCV F  
where  
2
N = total number of device outputs  
C = capacitive load per output  
V = supply voltage  
F = clock frequency  
6. Tested with outputs changing every cycle and no load, at a 50 MHz clock rate.  
7. Tested with all inputs within 0.1V of VCC or Ground, and no load.  
8. These parameters are guaranteed but not 100% tested.  
9. AC specifications are tested with input transition times less than 3 ns, output reference levels  
of 1.5 V (except t  
test), and input levels of nominally 0to 3.0V. Output loading may be a  
dis  
resistive divider which provides for specified IOH and IOL at an output voltage of VOH min and  
VOL max respectively. Alternatively, a diode bridge with upper and lower current sources of IOH  
and IOL respectively, and a balancing voltage of 1.5 V may be used. Parasitic capacitance is 30  
pF minimum, and may be distributed.  
This device has high-speed outputs capable of large instantaneous current change pulses and  
fast turn-on/turn-off times. As a result, care must be exercised in the testing of this device. The  
following measures are recommended:  
a. A 0.1 µF ceramic capacitor should be installed between VCC and Ground leads as close to  
the device as possible. Similar capacitors should be installed between device VCC and the tester  
common, and device ground and tester common.  
b. Ground and VCC supply planes must be brought directly to the device leads.  
c. Input voltages on a test fixture should be adjusted to compensate for inductive ground and VCC  
noise to maintain required input levels relative to the device ground pin.  
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LOGIC Devices Incorporated  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Notes  
10. Each parameter is shown as a minimum or maximum value. Input requirements are specified  
from the point of view of the external system driving the chip. Setup time, for example, is specified  
as a minimum since the external system must supply at least that much time to meet the worst-  
case requirements of all parts. Responses from the internal circuitry are specified from the point of  
view of the device. Output delay, for example, is specified as a maximum since worst-case opera-  
tion of any device always provides data within that time.  
11. For the t  
For the t  
dis  
test, the transition is measured to the 1.5 V crossing point with datasheet loads.  
test, the transition is measured to the ±200mV level from the measured steady-state  
ena  
output voltage with ±10mA loads. The balancing voltage, V , is set at 3.0 V for Z-to-0 and 0-to-Z  
th  
tests, and set at 0 V for Z-to-1 and 1-to-Z tests.  
12. These parameters are only tested at the high temperature extreme, which is the worst case  
for leakage current.  
FIGURE B.THRESHOLD LEVELS  
FIGURE A. OUTPUT LOADING CIRCUIT  
tENA  
tDIS  
OE  
0
1.5 V  
1.5 V  
S1  
Z
Z
3.0V Vth  
DUT  
1.5 V  
1.5 V  
VOL*  
0.2 V  
0.2 V  
I
OL  
0
1
Z
Z
V
TH  
C
L
VOH*  
I
OH  
1
0V Vth  
VOL* Measured VOL with IOH = –10mA and IOL = 10mA  
VOH* Measured VOH with IOH = –10mA and IOL = 10mA  
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LOGIC Devices Incorporated  
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June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Package and Ordering Information  
BALL PAD CORNER  
14  
13  
12  
11  
10  
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
OE_b  
Q11  
REN_b  
VCCI  
VCCINT  
PADDR5  
RCLR_b  
PADDR3  
PADDR4  
PADDR0 PROGRAM  
PWEB  
PREB  
CHIP_ID5 CHIP_ID2  
CHIP_ID4 CHIP_ID1  
VCCINT  
WIEN_b  
VCCINT  
WEN_b  
RESET_b  
VCCINT  
GNDINT  
RSET_b  
PADDR1  
LOAD_b  
VCCINT  
GNDINT  
PCE0  
D11  
Q10  
VCCO  
Q9  
GNDO  
VCCO  
Q7  
VCCINT  
GNDO  
GNDO  
GNDO  
GNDO  
GNDO  
GNDO  
ADDR19  
VCCO  
VCCI  
PADDR2  
GNDINT  
Q6  
VCCINT  
GNDINT  
CHIP_ID6 CHIP_ID3  
VCCINT  
PCE1  
GNDINT  
D6  
VCCINT  
GNDINT  
GNDINT  
D3  
D8  
D9  
D10  
Q8  
VCCINT  
GNDINT  
GNDINT  
VCCINT  
VCCI  
VCCI  
D1  
D7  
Q5  
VCCO  
Q4  
D4  
D5  
Q3  
VCCO  
Q1  
Q2  
VCCINT  
D2  
G
H
J
Q0  
RCLK  
VCCO  
ADDR14  
ADDR16  
ADDR21  
ADDR22  
VCCI  
GNDINT  
GNDINT  
GNDINT  
ADDR3  
ADDR6  
TCK  
D0  
VCCI  
ADDR0  
VCCI  
ADDR5  
VCCI  
ADDR9  
GNDO  
VCCO  
WCLK  
VCCINT  
ADDR2  
ADDR4  
ADDR7  
ADDR10  
VCCINT  
GNDINT  
ADDR12  
ADDR15  
ADDR17  
ADDR20  
ADDR23  
VCCI  
PE  
ADDR13  
VCCO  
ADDR18  
VCCO  
VCCO  
VCCINT  
ADDR1  
GNDINT  
ADDR8  
ADDR11  
TDI  
GNDO  
GNDO  
WCLR_b  
VCCI  
GNDINT  
GNDINT  
PDATA2  
VCCO  
K
L
GNDO  
GNDO  
VCCO  
VCCO  
GNDO  
GNDO  
PDATA4  
VCCO  
GNDO  
PDATA7  
SDA  
GNDO  
VCCO  
M
N
P
COLLIDE WADRSEL  
VCCO  
PDATA6  
PDATA5  
PDATA0  
PDATA1  
TMS  
PF  
VCCI  
WSET_b WMARK_b RADRSEL  
SCL  
PDATA3  
TRST_b  
TDO  
Notes:  
VCCINT = 1.8V  
VCCO = 3.3V  
VCCI = 3.3V  
Ground  
1.00 REF  
1.00 REF  
172 Ball - Low Profile Ball Grid Array (LBGA)  
0°C to 70°C--Commercial Screening  
Speed  
_
LF3324BGC  
The information contained herein is subject to change without notice. LOGIC Devices reserves the right to make changes to or discontinue any semiconductor product or service  
without notice. LOGIC Devices assumes no responsibility for the use of any circuitry other than circuitry embodied in a LOGIC Devices product. Nor does it convey or imply any license  
under patent or other rights. LOGIC Devices products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless  
pursuant to an express written agreement with LOGIC Devices. Furthermore, LOGIC Devices does not authorize its products for use as critical components in life-support systems  
where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of LOGIC Devices’ products in life-support system applications implies  
that the manufacturer assumes all risk of such use and in doing so indemnifies LOGIC Devices against all charges.  
Video Imaging Product  
LOGIC Devices Incorporated  
28  
June 8, 2007 LDS.3324 G  
LF3324  
24Mbit Frame Buffer / FIFO  
DEVICES INCORPORATED  
Preliminary Datasheet  
Document History Page  
DOCUMENT TITLE: LF3324 24MBIT FRAME BUFFER / FIFO  
Rev.  
A
ECN NO. Issue Date Description of Change  
03/08/05  
03/28/05  
04/07/05  
Initiate  
B
Downgraded part speed from 12ns to 13.5ns  
Upgraded Speed from 13.5ns to 13.4ns  
C
Fixed incorrect description of the program pin on page 14  
Added data rate  
D
E
F
08/18/05  
09/14/05  
07/7/06  
Clarified Programmable FLAG operation text  
Clarified FIFO operation text  
Downgraded speed in full-time Random Access to 54MHz  
Downgraded speed in FIFO Mode to 54MHz  
G
06/08/07  
LOGIC Devices Incorporated reserves the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and  
to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current  
and complete. LOGIC Devices does not assume any liability arising out of the application or use of any product or circuit described herein. In no event shall any liability exceed  
the purchase price of LOGIC Devices products. LOGIC Devices products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety  
applications, unless pursuant to an express written agreement with LOGIC Devices. Furthermore, LOGIC Devices does not authorize its products for use as critical components in  
life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user.  
Video Imaging Product  
LOGIC Devices Incorporated  
29  
June 8, 2007 LDS.3324 G  

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