V9MLN41206LT [LITTELFUSE]
Analog Circuit;
| 型号： | V9MLN41206LT |
| 厂家： | 
LITTELFUSE |
| 描述： | Analog Circuit |
| 文件： | 总8页 (文件大小：180K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MLN SurgeArrayTM
Data Sheet
December 2000
File Number 4682
SurgeArrayTM Four Section Array
Transient Voltage Suppressor
Features
·
·
·
Four Individual Devices in One 1206 Chip
ESD Rated to IEC 61000-4-2 (Level 4)
AC Characterized for Impedance and
Capacitance
The MLN SurgeArrayTM is a suppressor array device
designed for the transient voltages that exist at the
circuit board level. This device provides four
independent suppressors in a single “1206” leadless
chip in order to reduce part count and placement time
as well as save space on printed circuit boards.
·
·
Low Inductance Package (<1nH)
50dB Adjacent Channel Crosstalk, at 1MHz
(Typ.)
·
·
·
·
·
·
Low Leakage, (<5µA typical at rated voltage)
Operating Voltages up to 18VM(DC)
-55ºC to +125ºC Operating Temperature Range
Ag/Pd/Pt End Terminations
Low profile, PCMCIA Compatible
Capacitance Can Be Customized
SurgeArrayTM devices are intended to suppress ESD,
EFT and other transients in order to protect integrated
circuits or other sensitive components operation at any
rated voltage up to 18VDC. SurgeArrayTM devices are
rated to the IEC 61000-4-2 Human Body Model ESD
to help products attain EMC compliance. The array
offers excellent isolation and low crosstalk between
sections.
Applications
The inherent capacitance of the SurgeArrayTM device
permits it to function as a filter/suppressor, thereby
replacing separate zener/capacitor combinations.
·
·
·
·
·
·
·
Data, I/O Ports
Analog Signal/Sensor Lines
Portable/Hand-Held Products
Mobile Communications/Cellular Phones
Computer/DSP Products
Industrial Instruments Including Medical
LCD Panels
The MLN SurgeArrayTM is manufactured with the
Littelfuse Multilayer technology process and is similar
to the Littelfuse ML- and MLE- Series of discrete
leadless chips.
The MLN SurgeArrayTM may also be provided in a
Dual version. Contact Littelfuse Sales for information.
Packaging
MLN SurgeArray (LEADLESS CHIP)
MLN SurgeArrayTM
Absolute Maximum Ratings For ratings of individual members of a series see Device Ratings and Specifications table.
MLN SurgeArray
UNIT
Continuous:
Steady State Applied Voltage: DC Voltage Range (VM(DC))…………………………. 5.5 to
Operating Ambient Temperature range (TA)………………………………………….. -55 to +125
Storage Temperature (TSTG)……………………………………………………………. -55 to +150
18
V
ºC
ºC
Device Ratings and Specifications
Any Single Section
MAX RATINGS (125ºC)
PERFORMANCE SPECIFICATIONS (25ºC)
MAXIMUM
NON-
MAXIMUM
CLAMPING
MAXIMUM
NON-
MAXIMUM
NOMINAL
VOLTAGE AT
1mA DC
CAPACITANCE
AT
1MHz (1V p-p)
TYPICAL
ESD SUPPRESSION
VOLTAGE (NOTE 1)
CONTINUOUS REPETITIVE VOLTAGE REPETITIVE
WORKING
VOLTAGE
SURGE
CURRENT
(8/20µs)
(AT NOTED
8/20µs
CURRENT) (10/1000µs)
SURGE
ENERGY
PART
NUMBER
CURRENT
(NOTE 2)
8kV CONTACT 15kV AIR
Peak Clamp
(NOTE 3)
(NOTE 4)
C
VN(DC)
MIN
VN(DC)
MAX
VM(DC)
ITM
VC
WTM
(See Fig. 3)
Peak
(V)
45
75
85
TYP
(pF)
430
250
140
100
45
MAX
(pF)
520
300
175
125
75
(V)
5.5
9
14
18
18
(A)
30
30
30
30
20
(V)
(J)
0.1
0.1
0.1
0.1
0.05
(V)
60
95
110
165
200
(V)
35
50
55
60
95
(V)
7.1
11.0
15.9
22.0
25.0
(V)
9.3
16.0
20.3
28.0
35.0
V5.5MLN41206
V9MLN41206
V14MLN41206
V18MLN41206
V18MLN41206L
15.5 at 2A
23 at 2A
30 at 2A
40 at 2A
50 at 1A
100
130
NOTES:
1.Tested to IEC61000-4-2 Human Body Model (HBM) discharge 3. Corona discharge through air (represents actual ESD event)
test circuit. See Explanation of Terms on page 7.
2. Direct discharge to device terminals (IEC preferred test 4. Capacitance may be customized, contact Sales
method). See figure 2.
Temperature Derating
For applications exceeding 125ºC ambient temperature, the peak
surge current and energy ratings must be reduced as shown in
Figure 1.
100
50
0
100
80
60
40
20
0
t
TIM E
-55 50
60
70
80
90 100 110 120 130 140 150
O1
t
AMBIENTTEMPERATURE(ºC)
t2
FIGURE 1: PEAK CURRENT AND ENERGY DERATING CURVE.
FIGURE 3: PEAK PULSE CURRENT TEST WAVEFORM FOR
8/20µs CLAMPING VOLTAGE
ESD Suppression Voltage
Peak
O1 = VIRTUAL ORIGIN OF WAVE
t = TIME FROM 10% TO 90% OF PEAK
t1 = VIRTUAL FRONT TIME = 1.25 x t
t2 = VIRTUAL TIME TO HALF VALUE (IMPULSE
DURATION)
Clamp
EXAMPLE:
FOR AN 8/20µs CURRENT WAVEFORM:
8µs = t1 = VIRTUAL FRONT TIME
20µs = t2 = VIRTUAL TIME TO HALF VALUE
-20
0
20
40
60
80
Time (ns)
FIGURE 2: DEFINITION OF VARISTOR PEAK AND CLAMP
VOLTAGE ON A SUPPRESSED CONTACT DISCHARGE ESD
WAVEFORM., SEE NOTE 2 ABOVE AND EXPLANATION OF
TERMS ON PAGE 7.
.
2
MLN SurgeArrayTM
Maximum Transient V-I Characteristic and Standby Current Curves
Any Single Section
100
V18L
MAXIMUM CLAM P VOLTAGE
V18
MAXIM UM STANDBY CURRENT (LEAKAGE)
V14
V9
V5.5
V18L
V18
V14
10
V9
V5.5
1
0.000001
0.00001
0.0001
0.001
0.01
CURRENT (A)
0.1
1
10
100
FIGURE 4: V-I CHARACTERISTICS
Pulse Rating Curves
100
100
NUMBER OF SURGES
100
NUMBER OF SURGES
1
1
100
2
103
2
103
10
10
1
10
1
10
¥
¥
104
105
104
106
105
106
0.1
0.1
10
100
1000
10000
10
100
1000
10000
SQUARE WAVE IMPULSE DURATION (µs)
SQUARE WAVE IMPULSE DURATION (µs)
FIGURE 5: PULSE RATING FOR LONG DURATION SURGES FOR
V18MLN41206L (ANY SINGLE SECTION)
FIGURE 6: PULSE RATING FOR LONG DURATION SURGES
FOR V5.5MLN41206, V9MLN41206, V14MLN41206 AND
V18MLN41206 (ANY SINGLE SECTION)
3
MLN SurgeArrayTM
Typical Performance Curves
Any Single Section
500
V5.5
V9
400
300
200
V14
V18
100
0
V18L
0.1
1
10
100
1000
FREQUENCY (MHz)
FIGURE 7: CAPACITANCE VERSUS FREQUENCY
1000
100
10
V5.5
1
V9
V14
V1
0.1
V18L
0.01
0.1
1
10
100
1000
FREQUENCY (MHz)
FIGURE 8: EQUIVALENT SERIES RESISTANCE
100%
25
V18
20
V14
V9
-40ºC
15
10
5
+25ºC
+85ºC
V5.5
+125ºC
0
10%
0.0001
0
10
100
1000
10000
0.001
0.01
0.1
1
NUMBER OF DISCHARGES
CURRENT (mA)
FIGURE 9: STANDBY CURRENT AT NORMALIZED
VARISTOR VOLTAGE AND TEMPERATURE (ANY
SINGLE SECTION)
FIGURE 10: NOMINAL VOLTAGE STABILITY TO
MULTIPLE ESD IMPULSES (8KV CONTACT
METHOD, PER IEC61000-4-2) ONE SECTION.
4
MLN SurgeArrayTM
Typical Performance Curves
Any Single Section
Continued
10000
1000
100
V5.5
10
1
V9
V14
V18
V18L
0.1
0.1
1
10
100
1000
FREQUENCY (MHz)
FIGURE 11: IMPEDANCE VERSUS FREQUENCY
0
-20
-40
-60
-80
V18L
V18
V14
V9
V5.5
VIN = 1V RMS
-100
-120
Z = 50
W
0.001
0.01
0.1
1
10
100
1000
FREQUENCY (MHz)
FIGURE 12: ADJACENT CHANNEL CROSSTALK
shock, a preheat stage in the soldering process is
recommended, and the peak temperature of the solder
process should be rigidly controlled.
Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are infrared (IR)
re-flow, vapour phase re-flow and wave soldering. Typical
profiles are shown in figures 13, 14 and 15. When wave
soldering, the MLN suppressor is attached to the circuit
board by means of an adhesive. The assembly is then
placed on a conveyor and run through the soldering process
to contact the wave. With IR and vapour phase re-flow, the
device is placed in a solder paste on a substrate. As the
solder paste is heated, it re-flows and solders the unit to the
board.
When using a re-flow process, care should be taken to
ensure that the MLN chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder’s
peak temperature is essential to minimize thermal shock.
Examples of the soldering conditions for the MLN array of
suppressors are given in the tables below.
Once the soldering process has been completed, it is still
necessary to ensure that any further thermal shocks are
avoided. One possible cause of thermal shock is hot printed
circuit boards being removed from the solder process and
subjected to cleaning solvents at room temperature. The
boards must be allowed to cool gradually to less than 50ºC
before cleaning.
The recommended solder for the MLN suppressor is a
62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes. To
avoid the possibility of generating stresses due to thermal
5
MLN SurgeArrayTM
250
200
150
100
250
MAXIM UM
MAXIM UM
TEM PERATURE 222ºC
TEM PERATURE 222ºC
200
40 - 80
RAM P RATE
>50ºC/s
40 - 80
SECONDS
150
100
50
0
RAM P RATE
<2ºC/s
SECONDS
ABOVE183ºC
ABOVE183ºC
PREHEAT DWELL
PREHEAT ZONE
PREHEAT
ZONE
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
TIME(MINUTES)
TIME(MINUTES)
FIGURE 14: VAPOR PHASE SOLDER PROFILE
FIGURE 13: REFLOW SOLDER PROFILE
300
Recommended Pad Outline
MAXIMUM WAVE 260ºC
250
200
150
E
D
A
B
SECOND
PREHEAT
100
50
0
C
FIRST
PREHEAT
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
TABLE 1: PAD LAYOUT DIMENSIONS
TIME(MINUTES)
DIMENSION
millImeters 0.89
Inches
A
B
1.65
C
2.54
D
0.48
E
0.79
FIGURE 15: WAVE SOLDER PROFILE
0.035 0.065 0.100 0.018 0.030
Mechanical Dimensions
L
W
T
BW
BL
P
X
S
Inch
Millimeter
0.126 ±0.008 0.063 ±0.088
3.2 ±0.2 1.6 ±0.2
0.053 Max
1.35 Max
0.016 ±0.004 0.007+0.01/-0.002 0.030 Ref. 0.045 ±0.004 0.015 ±0.004
0.41 ±0.1
0.18+0.25/-0.05 0.76 Ref.
1.14 ±0.1
0.38 ±0.1
6
MLN SurgeArrayTM
Ordering Information
VXXMLN TYPES
V
18 ML
N
4
1206
L
T
DEVICE FAMILY
PACKING OPTIONS
Littelfuse TVSS Device
A: <100pc Bulk Pack
H: 7in (178mm) Diameter Reel
T: 13in (330mm) Diameter Reel
MAXIMUM DC
WORKING VOLTAGE
CAPACITANCE OPTION
No Letter: Standard
MULTILAYER DESIGNATOR
L: Low Capacitance Version
SERIES DESIGNATOR
N: SurgeArray
DEVICE SIZE
NUMBER OF SECTIONS
i.e. 0.12” x 0.06”
(3mm x 1.5mm)
Explanation of Terms
Rated DC Voltage (VM(DC)
)
Capacitance (C)
This is the maximum continuous DC voltage which
may be applied up to the maximum operating
temperature of the device. The rated DC operating
voltage (working voltage) is also used as the reference
point for leakage current. This voltage is always less
than the breakdown voltage of the device.
This is the capacitance of the device at the specified
frequency (1MHz) and bias (1Vp-p). See Device
Ratings.
IEC 61000-4-2
The electrostatic discharge requirements portion of the
electromagnetic compatibility (EMC) standard written
by the International Electrotechnical Commission. The
specification describes a specific human body model
test conditions and methods.
Leakage (IL) at Rated Voltage
In the non-conducting mode, the device is at a very
high impedance (>106?) and appears essentially as an
open circuit in the system. The leakage current drawn
at this level is very low. The maximum leakage current
at rated voltage is 50µA, See figure 4.
ESD Suppression Voltage
In the case of Contact Discharge, measurements were
made by injecting an impulse from an ESD simulator
gun directly onto the DUT; in the case of Air
Discharge, the impulse was discharged onto a land
directly connected to the DUT. The resulting
suppressed ESD voltage was coupled to a 1GHz
oscilloscope via a 50W attenuator. Since the 50W is in
parallel with the DUT, it shunts a portion of the ESD
impulse current. The values given in Device Ratings
and Specifications have been corrected for this
shunting effect.
Nominal Voltage (VN(DC)
)
This is the voltage at which the device changes from
the off state to the on state and enters its conduction
mode of operation. The voltage is usually
characterized at the 1mA point and has a specified
minimum and maximum voltage listed. See figure 4.
Clamping Voltage (VC)
This is the voltage appearing across the suppressor
when measured at conditions of specified pulse
current and specified waveform. See Device Ratings.
7
MLN SurgeArrayTM
Tape and Reel Specifications
·
·
Conforms to EIA–481, Revision A
Can be supplied to IEC publication 286-3
SYMBOL
DESCRIPTION
DIMENSIONS IN MILLIMETERS
Dependent On Chip Size To Minimize Rotation
Dependent On Chip Size To Minimize Rotation
Dependent On Chip Size To Minimize Rotation
8 ±0.2
A0
B0
K0
W
F
Width Of Cavity
Length Of Cavity
Depth Of Cavity
Width Of Tape
Distance Between Drive Hole Centers And Cavity
Centers
3.5 ±0.1
E
P1
P2
Distance Between Drive Hole Centers And Tape Edge
Distance Between Cavity Center
Axial Drive Distance Between Drive Hole Centers And
Cavity Centers
1.75 ±0.1
4 ±0.1
2 ±.0.1
P0
D0
D1
t1
Axial Drive Distance Between Drive Hole Centers
Drive Hole Diameter
Diameter Of Cavity Piercing
4 ±0.1
1.55 ±0.05
1.05 ±0.05
0.3 Max.
Embossed Tape Thickness
t2
Top Tape Thickness
0.1 Max.
Standard Shipping Quantities
DEVICE SIZE 13” (330mm) REEL (“T” OPTION) 7” (178mm) REEL (“H” OPTION) BULK PACK (“A” OPTION)
1206 10,000 2,500 100
All Littelfuse products are manufactured, assembled and tested under ISO9000 quality systems certification.
Littelfuse products are sold by description only. Littelfuse Inc. reserves the right to make changes in circuit design and/or specification at any time without notice. Accordingly, the reader is cautioned
to verify that data sheets are current before placing orders. Information furnished by Littelfuse is believed to be accurate and reliable. However no responsibility is assumed by Littelfuse or its
subsidiaries for its use, or for any infringements of patents or patent rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent
rights of Littelfuse Inc. or its subsidiaries.
8
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