SP1001 [LITTELFUSE]
SP1001 Series - 8pF 15kV Unidirectional TVS Array; SP1001系列 - 驱动8pF 15kV的单向TVS阵列
| 型号： | SP1001 |
| 厂家： | 
LITTELFUSE |
| 描述： | SP1001 Series - 8pF 15kV Unidirectional TVS Array |
| 文件： | 总6页 (文件大小：288K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
™
TVS Diode Arrays (SPA Family of Products)
General Purpose ESD Protection - SP1001 Series
RoHS
GREEN
Pb
SP1001 Series - 8pF 15kV Unidirectional TVS Array
Description
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes above
the maximum level specified in the IEC 61000-4-2
international standard (Level 4, ±±kꢀ contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protecting high-
speed signal pins.
Pinout
Features
SP1001-02
(SC70-3)
SP1001-04
(SC70-5)
SP1001-05
(SC70-6)
tꢀ -PXꢀDBQBDJUBODFꢀPGꢀꢁQ'ꢀ
(TYP) per I/O
tꢀ -PXꢀMFBLBHFꢀDVSSFOUꢀPGꢀ
0.5μA (MAX) at 5ꢀ
1
2
3
6
1
2
3
5
1
2
5
3
tꢀ &4%ꢀQSPUFDUJPOꢀPGꢀꢂꢃL7ꢀ
contact discharge, ±ꢁ0kꢀ
air discharge, (Level 4,
IEC61000-4-2)
tꢀ 4NBMMꢀQBDLBHFꢀTBWFTꢀ
board space
4
4
tꢀ -JHIUOJOHꢀ1SPUFDUJPOꢄꢀ
IEC61000-4-5, 2A (±/20ꢂs)
SP1001-02
(SOT 553)
SP1001-04
(SOT 553)
SP1001-05
(SOT 563)
1
2
3
6
1
5
NC
2
5
tꢀ &'5ꢀQSPUFDUJPOꢄꢀ
IEC61000-4-4, 40A
(5/50ns)
5
4
2
3
4
NC
4
Applications
Functional Block Diagram
tꢀ $PNQVUFSꢀ1FSJQIFSBMT
tꢀ .PCJMFꢀ1IPOFT
tꢀ -$%ꢅ1%1ꢀ57T
tꢀ 4FUꢀ5PQꢀ#PYFT
tꢀ %7%ꢀ1MBZFST
tꢀ .1ꢆꢅ1.1
SP1001-02
SP1001-02
2
4
1
5
tꢀ %JHJUBMꢀ$BNFSBT
tꢀ %FTLUPQTꢅ/PUFCPPLT
3
2
Application Example
LCD module
Controller
Input
SP1001-04
SP1001-05
4
5
4
6
5
D1
D2
D3
D4
1
2
3
1
2
3
SP 1001-04JTG (SC70-5)
SP 1001-04XTG (SOT553)
Signal
Ground
Shield
Ground
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
SP1001 Series
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
21
Revision: April 14, 2011
™
TVS Diode Arrays (SPA Family of Products)
General Purpose ESD Protection - SP1001 Series
Absolute Maximum Ratings
Thermal Information
Symbol
IPP
Parameter
Value
2
Units
A
Parameter
Rating
Units
Peak Current (tp=±/20μs)
OperatingTemperature
StorageTemperature
StorageTemperature Range
-65 to 150
°C
TOP
-40 to ±5
-60 to 150
°C
Maximum JunctionTemperature
150
260
°C
°C
TSTOR
°C
Maximum LeadTemperature (Soldering 10s)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP = 25°C)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
Forward ꢀoltage Drop
ꢀF
IF=10mA
0.7
0.9
1.2
ꢀ
Reverse ꢀoltage Drop
ꢀR
IR=1mA
IR≤1ꢂA
7.0
7.±
±.5
5.5
ꢀ
ꢀ
Reverse Standoff ꢀoltage
Reverse Leakage Current
ꢀRWM
ILEAK
ꢀR=5ꢀ
0.5
ꢂA
ꢀ
IPP=1A, tp=±/20ꢂs, Fwd
IPP=2A, tp=±/20ꢂs, Fwd
±.0
9.7
1.7
11.0
1ꢁ.0
Clamp ꢀoltage1
ꢀC
ꢀ
Dynamic Resistance
RDYN
(ꢀC2 - ꢀC1) / (IPP2 - IPP1
)
Ω
IEC61000-4-2 (Contact)
IEC61000-4-2 (Air)
Reverse Bias=0ꢀ
±15
±ꢁ0
kꢀ
kꢀ
pF
pF
pF
ESD Withstand ꢀoltage1,2
ꢀESD
12
±
Diode Capacitance1
CD
Reverse Bias=2.5ꢀ
Reverse Bias=5ꢀ
7
Notes:
1 Parameter is guaranteed by device characterization
2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode
Capacitance vs. Reverse Bias
Design Consideration
Because of the fast rise-time of the ESD transient,
14
12
10
8
placement of ESD devices is a key design consideration.
To achieve optimal ESD suppression, the devices should be
placed on the circuit board as close to the source of the ESD
transient as possible. Install the ESD suppressors directly
behind the connector so that they are the first board-level
circuit component encountered by the ESD transient. They
are connected from signal/data line to ground.
6
4
2
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
DC Bias (V)
SP1001 Series
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
22
Revision: April 14, 2011
™
TVS Diode Arrays (SPA Family of Products)
General Purpose ESD Protection - SP1001 Series
Soldering Parameters
Reflow Condition
-Temperature Min (Ts(min)
Pb – Free assembly
tP
TP
Critical Zone
TL to TP
)
150°C
Ramp-up
TL
TS(max)
Pre Heat -Temperature Max (Ts(max)
)
200°C
tL
-Time (min to max) (ts)
60 – 1±0 secs
Ramp-down
Preheat
Average ramp up rate (Liquidus)Temp
(TL) to peak
ꢁ°C/second max
ꢁ°C/second max
TS(min)
tS
TS(max) toTL - Ramp-up Rate
25
-Temperature (TL) (Liquidus) 217°C
time to peak temperature
Reflow
Time
-Temperature (tL)
60 – 150 seconds
250+0/-5 °C
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
± minutes max.
260°C
Time 25°C to peakTemperature (TP)
Do not exceed
Part Numbering System
Product Characteristics
MatteTin (SC70-x) Pre-Plated Frame
(SOT5xꢁ)
SP1001-02 JTG
Lead Plating
Silicon Protection
TM
G= Green
T= Tape & Reel
Array (SPA )
Lead Material
Copper Alloy
Family of
TVS Diode Arrays
Package
Lead Coplanarity
0.0004 inches (0.102mm)
Series
J = SC70-3, -5 or -6, 3000 qty
X = SOT553 or SOT563, 5000 qty
Number of Channels
Subsitute Material Silicon
02 = 2 Channel
04 = 4 Channel
05 = 5 Channel
Body Material
Flammability
Molded Epoxy
UL94-ꢀ-0
Part Marking System
Notes :
1. All dimensions are in millimeters
A X X
2. Dimensions include solder plating.
ꢁ. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-20ꢁ Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish ꢀDI 11-1ꢁ.
Product Series
Number of Channels
AXX
A = SP1001 series
(varies)
Assembly Site
(varies)
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP1001-02JTG
SC70-ꢁ
SOT55ꢁ
SC70-5
SOT55ꢁ
SC70-6
SOT56ꢁ
AX2
AX2
AX4
AX4
AX5
AX5
ꢁ000
SP1001-02XTG
SP1001-04JTG
SP1001-04XTG
SP1001-05JTG
SP1001-05XTG
5000
ꢁ000
5000
ꢁ000
5000
SP1001 Series
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
23
Revision: April 14, 2011
™
TVS Diode Arrays (SPA Family of Products)
General Purpose ESD Protection - SP1001 Series
Package Dimensions — SC70
Package
Pins
SC70-3
SC70-ꢁ
Solder Pad Layout
3
B
3
JEDEC
MO-203 Issue A
Millimeters
Min
Inches
HE
E
Max
1.10
0.10
1.00
0.ꢁ0
0.25
2.25
1.ꢁ5
Min
Max
0.04ꢁ
0.004
0.0ꢁ9
0.012
0.010
0.0±9
0.05ꢁ
A
A1
A2
B
0.±0
0.00
0.70
0.15
0.0±
1.±5
1.15
0.0ꢁ1
0.000
0.02±
0.006
0.00ꢁ
0.07ꢁ
0.045
2
1
e
e
D
c
A2
A1
A
D
E
e
0.66 BSC
0.026 BSC
C
HE
L
2.00
0.26
2.40
0.46
0.079
0.010
0.094
0.01±
L
e
e
SC70-5
Solder Pad Layout
Package
Pins
SC70-5
5
not5used
6
4
3
JEDEC
MO-203 Issue A
Millimeters
Min
E
HE
Inches
Max
1.10
0.10
1.00
0.ꢁ0
0.25
2.25
1.ꢁ5
Min
Max
0.04ꢁ
0.004
0.0ꢁ9
0.012
0.010
0.0±9
0.05ꢁ
1
2
A
A1
A2
B
0.±0
0.00
0.70
0.15
0.0±
1.±5
1.15
0.0ꢁ1
0.000
0.02±
0.006
0.00ꢁ
0.07ꢁ
0.045
B
D
A2
A1
A
c
D
E
e
0.65 BSC
0.026 BSC
C
HE
L
2.00
0.26
2.40
0.46
0.079
0.010
0.094
0.01±
L
B
B
Package
Pins
SC70-6
6
SC70-6
Solder Pad Layout
6
5
4
JEDEC
MO-203 Issue A
Millimeters
Min
E
HE
Inches
Max
1.10
0.10
1.00
0.ꢁ0
0.25
2.25
1.ꢁ5
Min
Max
0.04ꢁ
0.004
0.0ꢁ9
0.012
0.010
0.0±9
0.05ꢁ
1
2
3
A
A1
A2
B
0.±0
0.00
0.70
0.15
0.0±
1.±5
1.15
0.0ꢁ1
0.000
0.02±
0.006
0.00ꢁ
0.07ꢁ
0.045
B
D
A2
A1
A
c
D
E
C
e
0.65 BSC
0.026 BSC
HE
L
2.00
0.26
2.40
0.46
0.079
0.010
0.094
0.01±
L
SP1001 Series
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
24
Revision: April 14, 2011
™
TVS Diode Arrays (SPA Family of Products)
General Purpose ESD Protection - SP1001 Series
Package Dimensions — SOT5
A
Package
Pins
SOT 553
5
L
D
SOT 55ꢁ
Solder Pad Layout
Millimeters
Min
Inches
(not5used)
6
4
E
Max
0.60
0.27
0.1±
1.70
1.ꢁ0
Min
Max
0.024
0.011
0.007
0.067
0.051
HE
2
3
A
B
0.50
0.17
0.0±
1.50
1.10
0.020
0.007
0.00ꢁ
0.059
0.04ꢁ
e
c
c
D
E
B
e
0.50 BSC
0.020 BSC
L
0.10
1.50
0.ꢁ0
1.70
0.004
0.059
0.012
0.067
HE
A
Package
Pins
SOT 563
D
L
SOT 56ꢁ
Solder Pad Layout
6
6
5
4
Millimeters
Min
Inches
E
HE
Max
0.60
0.27
0.1±
1.70
1.ꢁ0
Min
Max
0.024
0.011
0.007
0.067
0.051
2
3
A
B
0.50
0.17
0.0±
1.50
1.10
0.020
0.007
0.00ꢁ
0.059
0.04ꢁ
e
c
c
B
D
E
e
0.50 BSC
0.020 BSC
L
0.10
1.50
0.ꢁ0
1.70
0.004
0.012
0.067
HE
0.059
Embossed CarrierTape & Reel Specification — SC70-3
Dimensions
Millimetres
Min
Inches
Max
1.±5
ꢁ.55
2.05
1.60
1.25
4.10
Min
Max
0.07ꢁ
0.1ꢁ9
0.0±1
0.06ꢁ
0.049
0.161
E
F
1.65
ꢁ.45
1.95
1.40
1.00
ꢁ.90
0.065
0.1ꢁ5
0.077
0.055
0.0ꢁ9
0.154
P2
D
D1
P0
10P0
W
40.0 +/- 0.20
1.574 +/- 0.00±
7.70
ꢁ.90
2.ꢁ0
±.10
4.10
2.50
0.ꢁ0ꢁ
0.ꢁ1±
0.161
0.09±
P
0.15ꢁ
0.090
A0
A1
B0
B1
K0
K1
t
1.00 Ref
1.90 Ref
0.0ꢁ9 Ref
2.ꢁ0
1.10
2.50
1.ꢁ0
0.090
0.09±
0.074
0.04ꢁ
0.051
0.60 Ref
0.27 max
0.02ꢁ Ref
0.010
SP1001 Series
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
25
Revision: April 14, 2011
™
TVS Diode Arrays (SPA Family of Products)
General Purpose ESD Protection - SP1001 Series
Embossed CarrierTape & Reel Specification — SC70-5 and SC70-6
Dimensions
Millimetres
Min
Inches
Max
1.±5
ꢁ.55
2.05
1.60
1.25
4.10
Min
Max
0.07ꢁ
0.1ꢁ9
0.0±1
0.06ꢁ
0.049
0.161
E
F
1.65
ꢁ.45
1.95
1.40
1.00
ꢁ.90
0.065
0.1ꢁ5
0.077
0.055
0.0ꢁ9
0.154
P2
D
D1
P0
10P0
W
P
40.0 +/- 0.20
1.574 +/- 0.00±
7.70
ꢁ.90
2.14
2.24
1.12
±.10
4.10
2.ꢁ4
2.44
1.ꢁ2
0.ꢁ0ꢁ
0.ꢁ1±
0.161
0.092
0.096
0.052
0.15ꢁ
0.0±4
0.0±±
0.044
A0
B0
K0
t
0.27 max
0.010 max
Embossed CarrierTape & Reel Specification — SOT553 and SOT563
Dimensions
Millimetres
Min
Inches
Max
1.±5
ꢁ.55
2.05
1.60
0.55
4.1
Min
Max
0.07ꢁ
0.1ꢁ9
0.0±1
0.06ꢁ
0.021
0.161
E
F
1.65
ꢁ.45
1.95
1.40
0.45
ꢁ.90
0.065
0.1ꢁ5
0.077
0.055
0.017
0.154
P2
D
D1
P0
10P0
W
P
40.0 +/- 0.20
1.574 +/- 0.00±
7.70
ꢁ.90
1.7ꢁ
1.7ꢁ
0.64
±.10
4.10
1.±ꢁ
1.±ꢁ
0.74
0.ꢁ0ꢁ
0.ꢁ1±
0.161
0.072
0.072
0.029
0.15ꢁ
0.06±
0.06±
0.025
A0
B0
K0
t
0.22 max
.009 max
SP1001 Series
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
26
Revision: April 14, 2011
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