SP1001-02XTG [LITTELFUSE]
Silicon Protection Arrays; 硅保护阵列
| 型号： | SP1001-02XTG |
| 厂家： | 
LITTELFUSE |
| 描述： | Silicon Protection Arrays |
| 文件： | 总7页 (文件大小：188K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM
Silicon Protection Arrays
8pF ESD Protection Array
RoHS
GREEN
Pb
SP1001 Lead-Free/Green Series
Description
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These
robust diodes can safely absorb repetitive ESD strikes
at the maximum level specified in the IEC 61000-4-2
international standard (Level 4, 8KV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protecting high-
speed signal pins.
Pinout
Features
SP1001-02
(SC70-3)
SP1001-04
(SC70-5)
SP1001-05
(SC70-6)
tꢀ -PXꢀDBQBDJUBODFꢀPGꢀꢁQ'ꢀ
(TYP) per I/O
tꢀ -PXꢀMFBLBHFꢀDVSSFOUꢀPGꢀ
0.5μA (MAX) at 5V
1
2
3
6
5
1
2
3
5
1
2
3
tꢀ &4%ꢀQSPUFDUJPOꢀPGꢀꢁL7ꢀ
contact discharge, 15kV
air discharge, (Level 4,
IEC61000-4-2)
tꢀ 4NBMMꢀQBDLBHFꢀTBWFTꢀ
board space
4
4
tꢀ -JHIUOJOHꢀ1SPUFDUJPOꢂꢀ
IEC61000-4-5, 2.5A
(8/ꢀs)
SP1001-02
(SOT 553)
SP1001-04
(SOT 553)
SP1001-05
(SOT 563)
1
2
3
6
1
5
NC
2
5
tꢀ &'5ꢀQSPUFDUJPOꢂꢀ
IEC61000-4-4, 40A
(5/50 ns)
5
4
2
3
4
NC
4
Functional Block Diagram
Applications
tꢀ $PNQVUFSꢀ1FSJQIFSBMT
tꢀ .PCJMFꢀ1IPOFT
tꢀ -$%ꢃ1%1ꢀ57T
tꢀ 4FUꢀ5PQꢀ#PYFT
tꢀ %7%ꢀ1MBZFST
tꢀ .1ꢄꢃ1.1
SP1001-02
SP1001-02
2
4
1
5
tꢀ %JHJUBMꢀ$BNFSBT
tꢀ %FTLUPQTꢃ/PUFCPPLT
3
2
SP1001-04
SP1001-05
4
5
4
6
5
1
2
3
1
2
3
SP1001 Lead-Free/Green Series
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
11
TM
Silicon Protection Arrays
8pF ESD Protection Array
Absolute Maximum Ratings
Symbol
Parameter
Value
2
Units
A
IP
Peak Current (tp=8/20μs)
TOP
TSTOR
OperatingTemperature
StorageTemperature
-40 to 85
-60 to 150
°C
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
-65 to 150
150
Units
°C
StorageTemperature Range
Maximum JunctionTemperature
°C
Maximum LeadTemperature (Soldering 10s)
300
°C
Electrical Characteristics (TOP = 25°C)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
Forward Voltage Drop
VF
VR
IF=10mA
0.7
0.9
6.7
1.2
8.0
V
Reverse Voltage Drop
Reverse Standoff
IR=10mA
IR≤1ꢀA
6.0
V
V
VRWM
ILEAK
5.5
Reverse Leakage Current
VR=5V
0.5
ꢀA
V
IPP=1A, tp=8/20ꢀs, Fwd
IPP=2A, tp=8/20ꢀs, Fwd
IEC61000-4-2 (Contact)
IEC61000-4-2 (Air)
Reverse Bias=0V
Reverse Bias=2.5V
Reverse Bias=5V
8.0
9.7
11.0
13.0
Clamp Voltage1
VC
V
8
kV
kV
pF
pF
pF
ESD Withstand Voltage1,2
VESD
15
12
8
Diode Capacitance1
CD
7
Notes:
1 Parameter is guaranteed by device characterization
2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode
Capacitance vs. Reverse Bias
14
12
10
8
6
4
2
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
DC Bias (V)
SP1001 Lead-Free/Green Series
©2008 Littelfuse, Inc.
12
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
TM
Silicon Protection Arrays
8pF ESD Protection Array
Design Consideration
Because of the fast rise-time of the ESD transient,
placement of ESD devices is a key design consideration.
To achieve optimal ESD suppression, the devices should
be placed on the circuit board as close to the source of
the ESD transient as possible. Install the ESD suppressors
directly behind the connector so that they are the first
board-level circuit component encountered by the ESD
transient. They are connected from signal/data line to
ground.
Application Example
LCD module
Controller
Input
D1
D2
D3
D4
SP 1001-04JTG (SC70-5)
SP 1001-04XTG (SOT553)
Signal
Ground
Shield
Ground
Soldering Parameters
Reflow Condition
Pb – Free assembly
-Temperature Min (Ts(min)
)
150°C
Pre Heat -Temperature Max (Ts(max)
)
200°C
-Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus)Temp
(TL) to peak
3°C/second max
TS(max) toTL - Ramp-up Rate
3°C/second max
217°C
-Temperature (TL) (Liquidus)
Reflow
-Temperature (tL)
60 – 150 seconds
250+0/-5 °C
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
8 minutes max.
260°C
Time 25°C to peakTemperature (TP)
Do not exceed
SP1001 Lead-Free/Green Series
©2008 Littelfuse, Inc.
13
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
TM
Silicon Protection Arrays
8pF ESD Protection Array
Part Numbering System
Product Characteristics
SP1001-02 JTG
Lead Plating
MatteTin
Silicon
G= Green
T= Tape & Reel
Lead Material
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Protection
Array
Lead Coplanarity
Subsitute Material
Body Material
Flammability
Package
Series
J = SC70-3, -5 or -6, 3000 qty
X = SOT553 or SOT563, 5000 qty
Number of Channels
02 = 2 Channel
04 = 4 Channel
Molded Epoxy
UL94-V-0
05 = 5 Channel
Notes :
Part Marking System
1. All dimensions are in millimeters
2. Dimensions include solder plating.
A X X
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-203 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Product Series
Number of Channels
AXX
A = SP1001 series
(varies)
Assembly Site
(varies)
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP1001-02JTG
SC70-3
AX2
3000
SP1001-02XTG
SP1001-04JTG
SP1001-04XTG
SP1001-05JTG
SP1001-05XTG
SOT553
SC70-5
SOT553
SC70-6
SOT563
AX2
AX4
AX4
AX5
AX5
5000
3000
5000
3000
5000
Package Dimensions - SC70-3
Package
Pins
SC70-3
B
3
Solder Pad Layout
3
JEDEC
MO-203 Issue A
Millimeters
Min
Inches
HE
E
Max
1.10
0.10
1.00
0.30
0.25
2.25
1.35
Min
Max
0.043
0.004
0.039
0.012
0.010
0.089
0.053
A
A1
A2
B
0.80
0.00
0.70
0.15
0.08
1.85
1.15
0.031
0.000
0.028
0.006
0.003
0.073
0.045
2
1
e
e
D
c
D
A2
A1
A
E
e
0.66 BSC
0.026 BSC
HE
L
2.00
0.26
2.40
0.46
0.079
0.010
0.094
0.018
C
L
SP1001 Lead-Free/Green Series
©2008 Littelfuse, Inc.
14
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
TM
Silicon Protection Arrays
8pF ESD Protection Array
Package Dimensions - SC70-5
Package
Pins
SC70-5
5
e
e
not5used
Solder Pad Layout
6
4
3
JEDEC
MO-203 Issue A
Millimeters
Inches
E
HE
Min
0.80
0.00
0.70
0.15
0.08
1.85
1.15
Max
1.10
0.10
1.00
0.30
0.25
2.25
1.35
Min
Max
0.043
0.004
0.039
0.012
0.010
0.089
0.053
1
2
A
A1
A2
B
0.031
0.000
0.028
0.006
0.003
0.073
0.045
B
D
A2
A1
A
c
D
E
e
0.65 BSC
0.026 BSC
C
HE
L
2.00
0.26
2.40
0.46
0.079
0.010
0.094
0.018
L
Package Dimensions - SC70-6
B
B
Package
Pins
SC70-6
6
6
5
2
4
Solder Pad Layout
JEDEC
MO-203 Issue A
Millimeters
Min
E
HE
Inches
Max
1.10
0.10
1.00
0.30
0.25
2.25
1.35
Min
Max
0.043
0.004
0.039
0.012
0.010
0.089
0.053
1
3
A
A1
A2
B
0.80
0.00
0.70
0.15
0.08
1.85
1.15
0.031
0.000
0.028
0.006
0.003
0.073
0.045
B
D
A2
A1
A
c
D
E
C
e
0.65 BSC
0.026 BSC
HE
L
2.00
0.26
2.40
0.46
0.079
0.010
0.094
0.018
L
Package Dimensions - SOT553
A
Package
Pins
SOT 553
L
D
5
Millimeters
Inches
(not5used)
6
4
E
Min
Max
0.60
0.27
0.018
1.70
Min
Max
0.024
0.011
0.007
0.067
0.051
HE
Solder Pad Layout
2
3
A
B
0.50
0.17
0.08
1.50
1.10
0.020
0.007
0.003
0.059
0.043
e
c
c
D
E
B
1.30
e
0.50 BSC
0.014 BSC
L
0.10
1.50
0.30
1.70
0.004
0.059
0.012
0.067
HE
SP1001 Lead-Free/Green Series
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
15
TM
Silicon Protection Arrays
8pF ESD Protection Array
Package Dimensions - SOT563
A
Package
Pins
SOT 563
D
L
6
6
5
2
4
Millimeters
Min Max
Inches
Solder Pad Layout
E
HE
Min
Max
0.024
0.011
0.007
0.067
0.051
3
A
B
0.50
0.17
0.08
1.50
1.10
0.60
0.27
0.18
1.70
1.30
0.020
0.007
0.003
0.059
0.043
e
c
c
B
D
E
e
0.50 BSC
0.020 BSC
L
0.10
1.50
0.30
1.70
0.004
0.012
0.067
HE
0.059
Embossed CarrierTape & Reel Specification - SC70-3
Dimensions
Millimetres
Min
Inches
Max
1.85
3.55
2.05
1.60
1.25
4.10
Min
Max
0.073
0.139
0.081
0.063
0.049
0.161
E
F
1.65
3.45
1.95
1.40
1.00
3.90
0.065
0.135
0.077
0.055
0.039
0.154
P2
D
D1
P0
10P0
W
40.0 +/- 0.20
1.574 +/- 0.008
7.70
3.90
2.30
8.10
4.10
2.50
0.303
0.318
0.161
0.098
P
0.153
0.090
A0
A1
B0
B1
K0
K1
t
1.00 Ref
1.90 Ref
0.039 Ref
2.30
1.10
2.50
1.30
0.090
0.098
0.074
0.043
0.051
0.60 Ref
0.27 max
0.023 Ref
0.010
SP1001 Lead-Free/Green Series
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
16
TM
Silicon Protection Arrays
8pF ESD Protection Array
Embossed CarrierTape & Reel Specification - SC70-5 and SC70-6
Dimensions
Millimetres
Inches
Min
1.65
3.45
1.95
1.40
1.00
3.90
Max
1.85
3.55
2.05
1.60
1.25
4.10
Min
Max
0.073
0.139
0.081
0.063
0.049
0.161
E
F
0.065
0.135
0.077
0.055
0.039
0.154
P2
D
D1
P0
10P0
W
P
40.0 +/- 0.20
1.574 +/- 0.008
7.70
3.90
2.14
2.24
1.12
8.10
4.10
2.34
2.44
1.32
0.303
0.318
0.161
0.092
0.096
0.051
0.153
0.084
0.088
0.044
A0
B0
K0
t
0.27 max
0.010 max
Embossed CarrierTape & Reel Specification - SOT553 and SOT563
Dimensions
Millimetres
Min
Inches
Max
1.85
3.55
2.05
1.60
0.55
4.1
Min
Max
0.073
0.139
0.081
0.063
0.021
0.161
E
F
1.65
3.45
1.95
1.40
0.45
3.90
0.065
0.135
0.077
0.055
0.017
0.154
P2
D
D1
P0
10P0
W
P
40.0 +/- 0.20
1.574 +/- 0.008
7.70
3.90
1.73
1.73
0.64
8.10
4.10
1.83
1.83
0.74
0.303
0.318
0.161
0.072
0.072
0.029
0.153
0.068
0.068
0.025
A0
B0
K0
t
0.22 max
0.010 max
SP1001 Lead-Free/Green Series
©2008 Littelfuse, Inc.
17
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
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