LUR13743/P1-PF/TBS-X [LIGITEK]
TAPE AND BOX TYPE LED LAMPS; 磁带和箱型LED灯
| 型号： | LUR13743/P1-PF/TBS-X |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | TAPE AND BOX TYPE LED LAMPS |
| 文件： | 总7页 (文件大小：133K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
LUR13743/P1-PF/TBS-X
DATA SHEET
DOC. NO : QW0905-LUR13743/P1-PF/TBS-X
REV
: A
DATE
: 14 - Apr. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR13743/P1-PF/TBS-X
Page 1/6
Package Dimensions
ΔH
P2
H2
H1
W2
L
W0
W1 W3
- +
D
P1 F
P
T
LUR13743/P1-PF
5.0 5.9
7.6
8.6
11.5±0.5
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/6
PART NO. LUR13743/P1-PF/TBS-X
Absolute Maximum Ratings at Ta=25 ℃
Ratings
UR
Symbol
Parameter
UNIT
IF
IFP
PD
Ir
40
Forward Current
mA
mA
Peak Forward Current
Duty 1/10@10KHz
120
mW
μA
Power Dissipation
120
Reverse Current @5V
Operating Temperature
Storage Temperature
10
Topr
Tstg
-40 ~ +85
-40 ~ +100
℃
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V)
Luminous
intensity
@20mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Peak
wave
length
λPnm
Spectral
halfwidth
△λnm
COLOR
MATERIAL
GaAlAs
PART NO
Typ.
Min.
Max.
2.4
Emitted
Lens
Min.
1.5
Red
LUR13743/P1-PF/TBS-X
660
20
300 450
Water Clear
56
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/6
PART NO. LUR13743/P1-PF/TBS-X
•Dimension Symbol Information
SPECIFICATIONS
Minimum Maximum
OPTION
CODE
SYMBOL ITEMS
SYMBOL
mm
inch
mm
inch
Tape Feed Hole Diameter
Component Lead Pitch
Front-To-Rear Deflection
-------
-------
-------
D
F
3.8
2.3
0.15
0.09
-------
4.2
3.0
0.17
0.12
0.08
0.73
0.89
1.04
0.93
0.82
0.98
1.0
-------
△H
2.0
TBS-1
TBS-2
TBS-3
TBS-5
TBS-6
TBS-7
TBS-8
TBS-9
TBS-10
TBS-11
TBS-12
TBS-13
-------
17.5
21.5
25.5
22.5
19.9
24.0
24.5
19.0
18.4
21.0
20.5
18.0
-------
0.69
0.85
1.0
18.5
22.5
26.5
23.5
20.9
25.0
25.5
20.0
19.4
22.0
21.5
19.0
36
0.89
0.78
0.94
0.96
0.75
0.72
0.83
0.81
0.71
-------
Feed Hole To Bottom Of Component
H1
0.79
0.76
0.87
0.85
0.75
1.42
0.43
0.51
0.23
0.3
Feed Hole To Overall Component Height
Lead Length After Component Height
H2
L
-------
W0
11
-------
Feed Hole Pitch
0.49
0.17
0.2
13
P
12.4
4.4
-------
Lead Location
P1
P2
T
5.8
Center Of Component Location
Overall Taped Package Thickness
-------
5.1
7.7
-------
-------
-------
1.42
9.75
15.5
4.0
0.06
0.38
0.61
0.16
0.75
-------
Feed Hole Location
Adhesive Tape Width
Adhesive Tape Position
Tape Width
W0
W1
W2
W3
8.5
14.5
0
0.33
0.57
0
-------
-------
-------
17.5
0.69
19
REMARK:TBS=Tape And Box Straight Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
minimum maxmum
Symbol
Description
mm
inch
13.0
mm
inch
13.4
10.8
2.4
Overall Length
Overall Width
L
W
H
330
265
50
340
275
60
10.4
Overall Thickness
Quantity/Box
1.97
2000PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR13743/P1-PF/TBS-X
Page4/6
Typical Electro-Optical Characteristics Curve
UR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1000
100
10
1
0 1
1.0
2.0
3.0
4.0
5.0
1
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
2.5
2.0
1.1
1.0
0.9
0.8
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
-40 -20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Directivity Radiation
Fig.6
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
600
650
700
750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR13743/P1-PF/TBS-X
Page 5/6
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°C3sec Max
260°
120°
5°/sec
max
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
6/6
PART NO. LUR13743/P1-PF/TBS-X
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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