IXFR44N80P [IXYS]

PolarHV HiPerFET Power MOSFET; PolarHV HiPerFET功率MOSFET
IXFR44N80P
型号: IXFR44N80P
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

PolarHV HiPerFET Power MOSFET
PolarHV HiPerFET功率MOSFET

文件: 总4页 (文件大小:100K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PolarHVTM HiPerFET  
Power MOSFET  
IXFR 44N80P  
VDSS = 800  
ID25 = 25  
RDS(on) 190 mΩ  
trr 250 ns  
V
A
Electrically Isolated Tab  
N-Channel Enhancement Mode  
Avalanche Rated  
Fast Intrinsic Diode  
Symbol  
Test Conditions  
Maximum Ratings  
ISOPLUS247 (IXFR)  
E153432  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
800  
800  
V
V
VGS  
VGSM  
Continuous  
Transient  
± 30  
± 40  
V
V
ID25  
IDM  
TC = 25°C  
TC = 25°C, pulse width limited by TJM  
25  
100  
A
A
Isolated Tab  
IAR  
EAR  
EAS  
TC = 25°C  
TC = 25°C  
TC = 25°C  
25  
80  
3.4  
A
mJ  
J
G = Gate  
S = Source  
D = Drain  
Features  
dv/dt  
PD  
IS IDM, di/dt 100 A/μs, VDD VDSS  
TJ 150°C, RG = 10 Ω  
,
10  
V/ns  
z Silicon chip on Direct-Copper-Bond  
substrate  
TC = 25°C  
300  
W
- High power dissipation  
- Isolated mounting surface  
- 2500V electrical isolation  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
z Low drain to tab capacitance(<30pF)  
z Low RDS (on) HDMOSTM process  
TL  
TSOLD  
1.6 mm (0.062 in.) from case for 10 s  
Plastic body for 10 seconds  
300  
260  
°C  
°C  
z Rugged polysilicon gate cell structure  
z Unclamped Inductive Switching (UIS)  
rated  
VISOL  
FC  
50/60 Hz, RMS, 1 minute  
Mounting force  
2500  
V~  
z Fast intrinsic Rectifier  
20..120 /4.5..25  
N/lb  
Applications  
Weight  
5
g
z
DC-DC converters  
Battery chargers  
Switched-mode and resonant-mode  
z
Symbol  
Test Conditions  
Characteristic Values  
z
(TJ = 25°C unless otherwise specified)  
Min. Typ.  
Max.  
power supplies  
DC choppers  
z AC motor control  
z
BVDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 800 μA  
VDS = VGS, ID = 8 mA  
VGS = ± 30 V, VDS = 0 V  
800  
V
V
3.0  
5.0  
Advantages  
± ±200  
50  
nA  
z
Easy assembly  
Space savings  
High power density  
z
IDSS  
VDS = VDSS  
VGS = 0 V  
μA  
z
TJ = 125°C  
1.5 mA  
RDS(on)  
VGS = 10 V, ID = IT, Note 1  
200 mΩ  
DS99504E(06/06)  
© 2006 IXYS All rights reserved  
IXFR 44N80P  
Symbol  
gfs  
Test Conditions  
Characteristic Values  
ISOPLUS247 (IXFR) Outline  
(TJ = 25°C unless otherwise specified)  
Min. Typ.  
Max.  
VDS= 20 V; ID = IT, Note 1  
27  
43  
S
Ciss  
Coss  
Crss  
12  
910  
30  
nF  
pF  
pF  
VGS = 0 V, VDS = 25 V, f = 1 MHz  
td(on)  
tr  
td(off)  
tf  
28  
22  
75  
27  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 VDSS, ID = 44 A  
RG = 1 Ω (External)  
Qg(on)  
Qgs  
200  
67  
nC  
nC  
nC  
VGS= 10 V, VDS = 0.5 VDSS, ID = IT  
Qgd  
65  
RthJC  
RthCS  
0.42 °C/W  
°C/W  
0.15  
Source-Drain Diode  
Characteristic Values  
TJ = 25°C unless otherwise specified)  
Symbol  
IS  
Test Conditions  
Min. Typ.  
Max.  
VGS = 0 V  
44  
A
A
V
ISM  
Repetitive  
100  
1.5  
VSD  
IF = IS, VGS = 0 V, Note 1  
trr  
IF = 22 A, -di/dt = 100 A/μs  
250 ns  
QRM  
IRM  
VR = 100 V, VGS = 0 V  
0.8  
8.0  
μC  
A
Notes: 1. Pulse test, t 300 μs, duty cycle d ±≤ 2 %;  
2. Test current IT = 22 A.  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844  
one or moreof the following U.S. patents: 4,850,072 5,017,508  
4,881,106 5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,381,025  
5,486,715  
6,162,665  
6,259,123 B1  
6,306,728 B1  
6,404,065 B1 6,683,344  
6,534,343  
6,583,505  
6,727,585  
6,710,405B2 6,759,692  
6,710,463 6,771,478 B2  
7,005,734 B2  
IXFR 44N80P  
Fig. 1. Output Characteristics  
Fig. 2. Extended Output Characteristics  
@ 25 C  
@ 25 C  
°
°
45  
40  
35  
30  
25  
20  
15  
10  
5
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 10V  
7V  
V
= 10V  
7V  
GS  
GS  
6V  
6V  
5V  
5V  
0
0
3
6
9
12 15 18 21 24 27 30  
0
0
0
1
2
3
4
5
6
7
8
VD S - Volts  
VD S - Volts  
Fig. 3. Output Characteristics  
Fig. 4. RDS(on Norm alized to ID = 22A  
)
@ 125 C  
°
Value vs. Junction Tem perature  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
45  
40  
35  
30  
25  
20  
15  
10  
5
V
= 10V  
7V  
GS  
V
= 10V  
GS  
6V  
I
= 44A  
D
I
= 22A  
D
5V  
0
-50  
-25  
0
25  
50  
75  
100 125 150  
2
4
6
8
10  
12  
14  
16  
VD S - Volts  
TJ - Degrees Centigrade  
Fig. 6. Drain Current vs. Case  
Tem perature  
Fig. 5. RDS(on) Norm alized to ID = 22A  
Value vs. Drain Current  
28  
24  
20  
16  
12  
8
2.4  
2.2  
2
V
= 10V  
GS  
T
J
= 125 C  
°
1.8  
1.6  
1.4  
1.2  
1
T = 25 C  
J
°
4
0
0.8  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
10 20 30 40 50 60 70 80 90 100  
TC - Degrees Centigrade  
I D - Amperes  
© 2006 IXYS All rights reserved  
IXFR 44N80P  
Fig. 8. Transconductance  
Fig. 7. Input Admittance  
70  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
T = - 40 C  
°
25 C  
J
°
125 C  
°
T = 125 C  
°
J
25 C  
°
- 40 C  
°
0
10  
20  
30  
40  
50  
60  
70  
80  
3.5  
4
4.5  
5
5.5  
6
6.5  
VG S - Volts  
I D - Amperes  
Fig. 9. Source Current vs.  
Source-To-Drain Voltage  
Fig. 10. Gate Charge  
10  
9
8
7
6
5
4
3
2
1
0
140  
120  
100  
80  
V
= 400V  
DS  
I
I
= 22A  
D
G
= 10mA  
60  
40  
T = 125 C  
°
J
20  
T = 25 C  
°
J
0
0.3 0.4 0.5 0.6 0.7 0.8 0.9  
1
1.1 1.2 1.3  
0
25  
50  
75  
100 125 150 175 200  
VS D - Volts  
Q G - NanoCoulombs  
Fig. 11. Capacitance  
Fig. 12. Maximum Transient Thermal  
Resistance  
100000  
10000  
1000  
100  
1.00  
0.10  
0.01  
f = 1MHz  
C
C
iss  
oss  
C
rss  
10  
0
5
10  
15  
20  
25  
30  
35  
40  
0.001  
0.01  
0.1  
1
10  
VDS - Volts  
Pulse Width - Seconds  
IXYS reserves the right to change limits, test conditions, and dimensions

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