IRL3103S [INFINEON]
Power MOSFET(Vdss=30V, Rds(on)=12mohm, Id=64A); 功率MOSFET （ VDSS = 30V ， RDS（ON） = 12mohm ，ID = 64A ）
| 型号： | IRL3103S |
| 厂家： | 
Infineon |
| 描述： | Power MOSFET(Vdss=30V, Rds(on)=12mohm, Id=64A) |
| 文件： | 总10页 (文件大小：126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PD - 94162
IRL3103S
IRL3103L
l Advanced Process Technology
l Surface Mount (IRL3103S)
l Low-profile through-hole (IRL3103L)
l 175°C Operating Temperature
l Fast Switching
HEXFET® Power MOSFET
D
VDSS = 30V
l Fully Avalanche Rated
RDS(on) = 12mΩ
Description
G
AdvancedHEXFET® PowerMOSFETsfromInternational
Rectifier utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area.
This benefit, combined with the fast switching speed and
ruggedizeddevicedesignthatHEXFETpowerMOSFETs
are well known for, provides the designer with an
extremely efficient and reliable device for use in a wide
variety of applications.
ID = 64A
S
The D2Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D2Pakissuitableforhighcurrentapplicationsbecauseofits
low internal connection resistance and can dissipate up to
2.0W in a typical surface mount application.
D2Pak
IRL3103S
TO-262
IRL3103L
The through-hole version (IRL3103L) is available for low-
profile applications.
Absolute Maximum Ratings
Parameter
Max.
Units
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
64
45
A
220
PD @TC = 25°C
Power Dissipation
94
0.63
W
W/°C
V
Linear Derating Factor
VGS
IAR
Gate-to-Source Voltage
± 16
Avalanche Current
34
A
EAR
dv/dt
TJ
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
22
mJ
V/ns
5.0
-55 to + 175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
°C
300 (1.6mm from case )
10 lbf•in (1.1N•m)
Thermal Resistance
Parameter
Junction-to-Case
Typ.
–––
Max.
1.6
40
Units
RθJC
RθJA
°C/W
Junction-to-Ambient (PCB mount)**
–––
www.irf.com
1
02/14/02
IRL3103S/IRL3103L
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
30 ––– –––
Conditions
VGS = 0V, ID = 250µA
V(BR)DSS
Drain-to-Source Breakdown Voltage
V
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.028 ––– V/°C Reference to 25°C, ID = 1mA
––– ––– 12
––– ––– 16
VGS = 10V, ID = 34A
mΩ
RDS(on)
Static Drain-to-Source On-Resistance
VGS = 4.5V, ID = 28A
VDS = VGS, ID = 250µA
VDS = 25V, ID = 34A
VDS = 30V, VGS = 0V
VDS = 24V, VGS = 0V, TJ = 150°C
VGS = 16V
VGS(th)
gfs
Gate Threshold Voltage
1.0
22
––– –––
––– –––
V
S
Forward Transconductance
––– ––– 25
––– ––– 250
––– ––– 100
––– ––– -100
––– ––– 33
––– ––– 5.9
––– ––– 17
µA
nA
IDSS
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
IGSS
VGS = -16V
Qg
ID = 34A
Qgs
Qgd
td(on)
tr
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
nC VDS = 24V
VGS = 4.5V, See Fig. 6 and 13
–––
8.9 –––
VDD = 15V
––– 120 –––
ID = 34A
td(off)
tf
Turn-Off Delay Time
Fall Time
–––
–––
14 –––
9.1 –––
RG = 1.8Ω
VGS = 4.5V, See Fig. 10
Between lead,
6mm (0.25in.)
from package
and center of die contact
VGS = 0V
D
LD
Internal Drain Inductance
––– 4.5 –––
nH
pF
G
LS
Internal Source Inductance
––– 7.5 –––
S
Ciss
Coss
Crss
EAS
Input Capacitance
––– 1650 –––
––– 650 –––
––– 110 –––
Output Capacitance
VDS = 25V
Reverse Transfer Capacitance
Single Pulse Avalanche Energy
ƒ = 1.0MHz, See Fig. 5
––– 1320ꢀ130 mJ IAS = 34A, L = 0.22mH
Source-Drain Ratings and Characteristics
Parameter
Continuous Source Current
(Body Diode)
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
IS
64
––– –––
––– –––
showing the
A
G
ISM
Pulsed Source Current
(Body Diode)
integral reverse
p-n junction diode.
220
S
VSD
trr
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
––– ––– 1.2
––– 57 86
––– 110 170
V
TJ = 25°C, IS = 34A, VGS = 0V
TJ = 25°C, IF = 34A
ns
Qrr
ton
nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
Pulse width ≤ 400µs; duty cycle ≤ 2%.
max. junction temperature. (See fig. 11)
ꢀThis is a typical value at device destruction and represents
operation outside rated limits.
This is a calculated value limited to TJ = 175°C .
Starting TJ = 25°C, L = 220µH
RG = 25Ω, IAS = 34A, VGS=10V (See Figure 12)
**When mounted on 1" square PCB (FR-4 or G-10 Material). For
recommended footprint and soldering techniques refer to
application note #AN-994
ISD ≤ 34A, di/dt ≤ 120A/µs, VDD ≤ V(BR)DSS
TJ ≤ 175°C
,
2
www.irf.com
IRL3103S/IRL3103L
1000
1000
100
10
VGS
15V
VGS
15V
10V
4.5V
3.7V
3.5V
3.3V
3.0V
TOP
TOP
10V
4.5V
3.7V
3.5V
3.3V
3.0V
BOTTOM 2.7V
BOTTOM 2.7V
100
10
1
2.7V
2.7V
20µs PULSE WIDTH
20µs PULSE WIDTH
T = 25 C
J
°
°
T = 175 C
J
1
0.1
0.1
1
10
100
1
10
100
V
, Drain-to-Source Voltage (V)
V
, Drain-to-Source Voltage (V)
DS
DS
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
1000
2.5
56A
=
I
D
°
T = 25 C
J
2.0
1.5
1.0
0.5
0.0
100
10
1
°
T = 175 C
J
V
= 15V
DS
V
=10V
GS
20µs PULSE WIDTH
-60 -40 -20
0
20 40 60 80 100 120 140 160 180
2.0
3.0
V
4.0
5.0
6.0 7.0 8.0
°
T , Junction Temperature ( C)
J
, Gate-to-Source Voltage (V)
GS
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
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3
IRL3103S/IRL3103L
15
12
9
3000
I
D
= 34A
V
= 0V,
f = 1MHz
C
GS
C
= C + C
SHORTED
ds
iss
gs
gd ,
gd
C
= C
gd
rss
2500
2000
1500
1000
500
C
= C + C
oss
ds
V
V
= 24V
= 15V
DS
DS
C
iss
C
oss
6
3
C
rss
FOR TEST CIRCUIT
SEE FIGURE 13
0
0
1
10
100
0
10
20
30
40
V
, Drain-to-Source Voltage (V)
Q
, Total Gate Charge (nC)
DS
G
Fig 6. Typical Gate Charge Vs.
Fig 5. Typical Capacitance Vs.
Gate-to-Source Voltage
Drain-to-Source Voltage
1000
1000
100
10
OPERATION IN THIS AREA
LIMITED BY R
(on)
DS
100
10
1
°
T = 175 C
J
100µsec
1msec
°
T = 25 C
J
Tc = 25°C
Tj = 175°C
Single Pulse
10msec
V
= 0 V
GS
2.0
1
0.1
0.0
0.4
V
0.8
1.2
1.6
2.4
1
10
, Drain-toSource Voltage (V)
100
,Source-to-Drain Voltage (V)
SD
V
DS
Fig 8. Maximum Safe Operating Area
Fig 7. Typical Source-Drain Diode
Forward Voltage
4
www.irf.com
IRL3103S/IRL3103L
70
60
50
40
30
20
10
0
RD
VDS
VGS
D.U.T.
RG
+VDD
-
VGS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
V
DS
90%
25
50
75
100
125
150
175
°
T , Case Temperature ( C)
C
10%
V
GS
Fig 9. Maximum Drain Current Vs.
t
t
r
t
t
f
d(on)
d(off)
Case Temperature
Fig 10b. Switching Time Waveforms
10
1
D = 0.50
0.20
0.10
0.05
P
DM
0.1
0.01
SINGLE PULSE
(THERMAL RESPONSE)
t
1
0.02
0.01
t
2
Notes:
1. Duty factor D =
t / t
1 2
2. Peak T =P
x Z
+ T
thJC C
J
DM
0.00001
0.0001
0.001
0.01
0.1
t , Rectangular Pulse Duration (sec)
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
IRL3103S/IRL3103L
240
200
160
120
80
I
D
15V
TOP
14A
24A
34A
BOTTOM
DR IVER
L
V
D S
D .U .T
A S
R
+
G
V
D D
-
I
A
2
VGS
0.0 1
Ω
t
p
Fig 12a. Unclamped Inductive Test Circuit
40
V
(BR)DSS
t
p
0
25
50
75
100
125
150
175
°
Starting T , Junction Temperature ( C)
J
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
I
AS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator
Same Type as D.U.T.
50KΩ
.2µF
12V
.3µF
Q
G
+
VGS
V
DS
D.U.T.
-
Q
Q
GD
GS
V
GS
V
G
3mA
I
I
D
G
Current Sampling Resistors
Charge
Fig 13b. Gate Charge Test Circuit
Fig 13a. Basic Gate Charge Waveform
6
www.irf.com
IRL3103S/IRL3103L
Peak Diode Recovery dv/dt Test Circuit
+
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
D.U.T*
-
+
-
-
+
RG
• dv/dt controlled by RG
• ISD controlled by Duty Factor "D"
• D.U.T. - Device Under Test
+
-
VDD
VGS
* Reverse Polarity of D.U.T for P-Channel
Driver Gate Drive
P.W.
Period
Period
D =
P.W.
V
[
=10V
] ***
GS
D.U.T. I Waveform
SD
Reverse
Recovery
Current
Body Diode Forward
Current
di/dt
D.U.T. V Waveform
DS
Diode Recovery
dv/dt
V
DD
[
[
]
Re-Applied
Voltage
Body Diode
Forward Drop
Inductor Curent
I
]
SD
Ripple ≤ 5%
*** VGS = 5.0V for Logic Level and 3V Drive Devices
Fig 14. For N-channel HEXFET® power MOSFETs
www.irf.com
7
IRL3103S/IRL3103L
D2Pak Package Outline
10.54 (.415)
10.29 (.405)
10.16 (.400)
REF.
- B -
1.32 (.052)
4.69 (.185)
4.20 (.165)
1.40 (.055)
- A -
MAX.
1.22 (.048)
2
6.47 (.255)
6.18 (.243)
1.78 (.070)
1.27 (.050)
15.49 (.610)
14.73 (.580)
2.79 (.110)
2.29 (.090)
1
3
2.61 (.103)
2.32 (.091)
5.28 (.208)
4.78 (.188)
8.89 (.350)
REF.
1.40 (.055)
1.14 (.045)
1.39 (.055)
1.14 (.045)
3X
0.55 (.022)
0.46 (.018)
0.93 (.037)
0.69 (.027)
3X
5.08 (.200)
0.25 (.010)
M
B A M
MINIMUM RECOMMENDED FOOTPRINT
11.43 (.450)
8.89 (.350)
LEAD ASSIGNMENTS
1 - GATE
NO TES:
1
2
3
4
DIMENSIONS AFTER SO LDER DIP.
17.78 (.700)
2 - DRAIN
3 - SOURCE
DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.
CONTROLLING DIMENSION : INCH.
HEATSINK & LEAD DIMENSIONS DO NOT INCLUDE BURRS.
3.81 (.150)
2.54 (.100)
2.08 (.082)
2X
2X
D2Pak Part Marking Information
A
INTERNATIONAL
RECTIFIER
PART NUMBER
F530S
LOGO
9246
1M
DATE CODE
(YYW W )
9B
ASSEMBLY
YY
=
YEAR
= W EEK
LOT CODE
W W
8
www.irf.com
IRL3103S/IRL3103L
TO-262 Package Outline
TO-262 Part Marking Information
www.irf.com
9
IRL3103S/IRL3103L
D2Pak Tape & Reel Information
TR R
1 .60 (.0 63)
1 .50 (.0 59)
1.60 (.063)
1.50 (.059)
4.10 (.161)
3.90 (.153)
0.368 (.0145)
0.342 (.0135)
FEE D D IREC TIO N
TR L
11.60 (.457)
11.40 (.449)
1 .85 (.0 73)
1 .65 (.0 65)
24.30 (.957)
23.90 (.941)
15.42 (.609)
15.22 (.601)
1.75 (.069)
1.25 (.049)
10.90 (.429)
10.70 (.421)
4.72 (.136)
4.52 (.178)
16.10 (.634)
15.90 (.626)
FEED D IRE CTION
13.50 (.532)
12.80 (.504)
27.40 (1.079)
23.90 (.941)
4
330.00
(14.173)
MAX.
60.00 (2.362)
M IN.
30.40 (1.197)
M AX.
NO TES
1. CO MFORM S TO EIA-418.
2. CO NTROLLING DIM ENSIO N: M ILLIM ETER.
3. DIMENSION MEASURED
:
26.40 (1.039)
24.40 (.961)
4
@ HUB.
3
4. INCLUDES FLANGE DISTORTION
@
O UTER EDGE.
Data and specifications subject to change without notice.
This product has been designed and qualified for the industrial market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.02/02
10
www.irf.com
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