MR82C82 [INTERSIL]

CMOS Octal Latching Bus Driver; CMOS八进制锁存总线驱动程序
MR82C82
型号: MR82C82
厂家: Intersil    Intersil
描述:

CMOS Octal Latching Bus Driver
CMOS八进制锁存总线驱动程序

驱动
文件: 总7页 (文件大小:106K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
82C82  
CMOS Octal Latching Bus Driver  
March 1997  
Features  
Description  
• Full Eight-Bit Parallel Latching Buffer  
• Bipolar 8282 Compatible  
The Intersil 82C82 is a high performance CMOS Octal  
Latching Buffer manufactured using a self-aligned silicon  
gate CMOS process (Scaled SAJI IV). The 82C82 provides  
an eight-bit parallel latch/buffer in a 20 pin package. The  
active high strobe (STB) input allows transparent transfer of  
data and latches data on the negative transition of this sig-  
nal. The active low output enable (OE) permits simple inter-  
face to state-of-the-art microprocessor systems.  
• Three-State Noninverting Outputs  
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . 35ns Max.  
• Gated Inputs:  
- Reduce Operating Power  
- Eliminate the Need for Pull-Up Resistors  
Ordering Information  
• Single 5V Power Supply  
PART NUMBER TEMP. RANGE  
PACKAGE  
PKG. NO.  
o
o
• Low Power Operation . . . . . . . . . . . . . . . ICCSB = 10µA  
CP82C82  
IP82C82  
0 C to +70 C 20 Ld PDIP  
E20.3  
o
o
-40 C to +85 C  
• Operating Temperature Ranges  
o
o
o
o
- C82C82 . . . . . . . . . . . . . . . . . . . . . . . . . .0 C to +70 C  
CS82C82  
IS82C82  
0 C to +70 C 20 Ld PLCC  
N20.35  
o
o
o
o
-40 C to +85 C  
- I82C82 . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to +85 C  
o
o
CD82C82  
ID82C82  
0 C to +70 C 20 Ld CERDIP F20.3  
o
o
- M82C82 . . . . . . . . . . . . . . . . . . . . . . . -55 C to +125 C  
o
o
-40 C to +85 C  
o
o
MD82C82/B  
8406701RA  
MR82C82/B  
84067012A  
-55 C to +125 C  
SMD #  
o
o
-55 C to +125 C 20 Pad CLCC J20.A  
SMD #  
Pinouts  
82C82 (PDIP, CERDIP)  
82C82 (PLCC, CLCC)  
TOP VIEW  
TOP VIEW  
TRUTH TABLE  
STB  
X
OE  
H
L
DI  
X
L
DO  
Hi-Z  
L
3
2
1
20 19  
H
1
2
3
4
5
6
7
8
9
V
CC  
20  
19  
DI  
DI  
DI  
DI  
DI  
DI  
0
1
2
3
4
5
H
L
H
X
H
DO  
0
1
2
3
4
5
6
4
5
6
7
8
18 DO  
DI  
DI  
DI  
DI  
DI  
3
4
5
6
7
1
2
3
4
5
L
18 DO  
17 DO  
16 DO  
15 DO  
14 DO  
13 DO  
H
L
X
= Logic One  
= Logic Zero  
= Don’t Care  
= Latched to Value of Last  
Data  
17  
16  
15  
DO  
DO  
DO  
Hi-Z = High Impedance  
DI  
DI  
6
7
14 DO  
= Neg. Transition  
PIN NAMES  
12  
OE  
DO  
7
9
10 11 12 13  
PIN  
DESCRIPTION  
GND 10  
11 STB  
DI -DI  
Data Input Pins  
0
7
DO -DO  
0
Data Output Pins  
Active High Strobe  
7
STB  
OE  
Active Low Output  
Enable  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
File Number 2975.1  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 19949-274  
82C82  
Functional Diagram  
D Q  
CLK  
DI  
DO  
O
0
1
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DO  
DO  
DO  
DO  
DO  
DO  
DO  
1
2
3
2
3
4
5
6
7
4
5
6
7
OE  
STB  
Gated Inputs  
During normal system operation of a latch, signals on the bus DC input voltage levels can also cause an increase in ICC if  
at the device inputs will become high impedance or make these input levels approach the minimum V or maximum  
IH  
conditions. This is due to the operation of the input cir-  
transitions unrelated to the operation of the latch. These unre-  
V
IL  
lated input transitions switch the input circuitry and typically cuitry in its linear operating region (partially conducting  
cause an increase in power dissipation in CMOS devices by state). The 82C8X series gated inputs mean that this condi-  
creating a low resistance path between V  
and GND when tion will occur only during the time the device is in the trans  
CC  
the signal is at or near the input switching threshold. Addition- parent mode (STB = logic one). ICC remains below the max-  
ally, if the driving signal becomes high impedance (“float” con- imum ICC standby specification of l0mA during the time  
dition), it could create an indeterminate logic state at the input inputs are disabled, thereby, greatly reducing the average  
and cause a disruption in device operation.  
power dissipation of the 82C8X series devices  
The Intersil 82C8X Series of bus drivers eliminates these con-  
ditions by turning off data inputs when data is latched (STB =  
logic zero for the 82C82/83H) and when the device is disabled  
(OE = logic one for 82C86H/87H). These gated inputs dis-  
Typical 82C82 System Example  
In a typical 80C86/88 system, the 82C82 is used to latch  
multiplexed addresses and the STB input is driven by ALE  
(Address Latch Enable) (see Figure 3). The high pulse width  
of ALE is approximately 100ns with a bus cycle time of  
800ns (80C86/88 at 5MHz). The 82C82 inputs are active  
only 12.5% of the bus cycle time. Average power dissipation  
related to input transitioning is reduced by this factor also.  
connect the input circuitry from the V  
and ground power  
CC  
supply pins by turning off the upper P-channel and lower N-  
channel (see Figures 1, 2). No new current flow from V to  
CC  
GND occurs during input transitions and invalid logic states  
from floating inputs are not transmitted. The next stage is held  
to a valid logic level internal to the device.  
V
CC  
V
V
CC  
CC  
P
P
P
P
OE  
N
INTERNAL  
DATA  
STB  
P
DATA IN  
V
CC  
INTERNAL  
DATA  
DATA IN  
N
N
P
N
N
N
FIGURE 16. 82C82/83H  
FIGURE 17. 82C86H/87H GATED INPUTS  
4-275  
82C82  
Application Information  
Decoupling Capacitors  
The transient current required to charge and discharge the where tR = 20ns, V  
300pF load capacitance specified in the 82C82 data sheet is outputs.  
= 5.0V, C = 300pF on each of eight  
L
CC  
determined by:  
-12  
9  
(EQ. 4)  
I = (8 x 300 x 10 )x (5.0V x 0.8)/(20 x 10 ) = 480mA  
I = C (dv/dt)  
(EQ. 1)  
L
This current spike may cause a large negative voltage spike  
Assuming that all outputs change state at the same time and  
that dv/dt is constant;  
on V , which could cause improper operation of the device.  
CC  
To lter out this noise, it is recommended that a 0.1µF  
I = C  
(EQ. 2)  
ceramic disc decoupling capacitor be placed between V  
L
CC  
and GND at each device, with placement being as near to  
the device as possible.  
(V  
x 80%)  
CC  
(EQ. 3)  
-----------------------------------  
tR/tF  
V
V
CC  
CC  
P
N
P
ALE  
STB  
P
MULTIPLEXED  
BUS  
ADDRESS  
ADDRESS  
INTERNAL  
DATA  
DATA IN  
N
N
ICC  
FIGURE 18. SYSTEM EFFECTS OF GATED INPUTS  
4-276  
82C82  
Thermal Information  
Absolute Maximum Ratings  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+8.0V Thermal Resistance (Typical)  
θ
o
θ
JC  
JA  
o
Input, Output or I/O Voltage . . . . . . . . . . . . GND-0.5V to V  
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1  
+0.5V  
CC  
CERDIP. . . . . . . . . . . . . . . . . . . . . . . . 75 C/W  
18 C/W  
o
o
CLCC. . . . . . . . . . . . . . . . . . . . . . . . . . 85 C/W  
22 C/W  
PDIP . . . . . . . . . . . . . . . . . . . . . . . . . .  
PLCC. . . . . . . . . . . . . . . . . . . . . . . . . .  
Storage Temperature Range. . . . . . . . . . . . . . . . . .-65 C to +150 C  
Maximum Junction Temperature  
Ceramic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175 C  
Plastic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150 C  
75  
75  
N/A  
N/A  
Operating Conditions  
o
o
Operating Voltage Range . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V  
Operating Temperature Range  
C82C82. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to +70 C  
I82C82 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to +85 C  
M82C82 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 C to +125 C  
o
o
o
o
o
o
o
Minimum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300 C  
(PLCC Lead Tips Only)  
o
o
Die Characteristics  
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Gates  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
o
o
DC Electrical Specifications V = 5.0V ±10%;  
T = 0 C to +70 C (C82C82);  
A
CC  
o
o
T = -40 C to +85 C (I82C82);  
T = -55 C to +125 C (M82C82)  
A
o
o
A
SYMBOL  
PARAMETER  
MIN  
MAX  
UNITS  
TEST CONDITIONS  
C82C82, I82C82 (Note 1)  
M82C82 (Note 1)  
V
Logical One Input Voltage  
2.0  
2.2  
-
-
-
V
V
IH  
V
Logical Zero Input Voltage  
Logical One Output Voltage  
0.8  
-
V
IL  
V
2.9  
V
I
I
I
= -8mA, OE = GND  
= -100µA, OE = GND  
= 8mA, OE = GND  
OH  
OH  
OH  
OL  
V
-0.4V  
-
V
CC  
V
Logical Zero Output Voltage  
Input Leakage Current  
-
0.4  
1.0  
10.0  
V
OL  
II  
-1.0  
-10.0  
µA  
µA  
V
= GND or V , DIP Pins 1-9, 11  
CC  
IN  
IO  
Output Leakage Current  
V
= GND or V , OE V -0.5V  
CC CC  
O
DIP Pins 12-19  
ICCSB  
ICCOP  
NOTES:  
Standby Power Supply Cur-  
rent  
-
-
10  
1
µA  
V
= V  
or GND, V  
= 5.5V, Outputs Open  
CC  
IN  
CC  
o
Operating Power Supply  
Current  
mA/MHz  
T = +25 C, V  
= 5V, Typical (See Note 2)  
CC  
A
1. V is measured by applying a pulse of magnitude = V min to one data input at a time and checking the corresponding device output  
IH IH  
for a valid logical “1” during valid input high time. Control pins (STB, OE) are tested separately with all device data input pins at V  
-0.4.  
CC  
2. Typical ICCOP = 1mA/MHz of STB cycle time. (Example: 5MHz µP, ALE = 1.25MHz, ICCOP = 1.25mA).  
o
Capacitance T = +25 C  
A
SYMBOL  
PARAMETER  
Input Capacitance  
Output Capacitance  
TYPICAL  
UNITS  
TEST CONDITIONS  
C
C
13  
20  
pF  
pF  
Freq = 1MHz, all measurements are  
referenced to device GND  
IN  
OUT  
4-277  
82C82  
o
o
AC Electrical Specifications  
V
C
= 5.0V ±10%;  
T = 0 C to +70 C (C82C82);  
A
CC  
o
o
= 300pF (Note 1), Freq = 1MHz T = -40 C to +85 C (I82C82);  
L
A
o
o
T = -55 C to +125 C (M82C82)  
A
SYMBOL  
PARAMETER  
MIN  
MAX  
35  
55  
35  
50  
-
UNITS  
ns  
TEST CONDITIONS  
Notes 2, 3  
(1)  
(2)  
(3)  
(4)  
(5)  
(6)  
(7)  
(8)  
TIVOV  
TSHOV  
TEHOZ  
TELOV  
TIVSL  
Propagation Delay Input to Output  
Propagation Delay STB to Output  
Output Disable Time  
-
-
ns  
Notes 2, 3  
-
ns  
Notes 2, 3  
Output Enable Time  
-
ns  
Notes 2, 3  
Input to STB Setup Time  
Input to STB Hold Time  
STB High Time  
0
25  
25  
-
ns  
Notes 2, 3  
TSLIX  
-
ns  
Notes 2, 3  
TSHSL  
TR, TF  
-
ns  
Notes 2, 3  
Input Rise/Fall Times  
20  
ns  
Notes 2, 3  
NOTES:  
1. Output load capacitance is rated at 300pF for ceramic and plastic packages.  
2. All AC parameters tested as per test circuits and definitions below. Input rise and fall times are driven at 1ns/V.  
3. Input test signals must switch between V - 0.4V and V +0.4V.  
IL  
IH  
Timing Waveforms  
TR, TF (8)  
2.0V  
0.8V  
INPUTS  
STB  
TIVSL (5)  
TSLIX  
(6)  
TSHSL (7)  
OE  
TIVOV  
(1)  
TEHOZ (3)  
TELOV (4)  
2.4V  
VOH -0.1V  
VOL +0.1V  
OUTPUTS  
0.8V  
TSHOV (2)  
Test Load Circuits  
1.7V  
0.6V  
3.3V  
150Ω  
300Ω  
300Ω  
TEST  
POINT  
TEST  
POINT  
TEST  
POINT  
OUTPUT  
OUTPUT  
OUTPUT  
300pF  
(NOTE)  
50pF  
(NOTE)  
50pF  
(NOTE)  
TIVOV, TSHOV, TELOV  
TEHOZ OUTPUT HIGH DISABLE  
TEHOZ OUTPUT LOW DISABLE  
NOTE: Includes stray and jig capacitance.  
4-278  
82C82  
Burn-In Circuits  
MD82C82 CERDIP  
V
CC  
C1  
R
R
R
R
R
R
R
R
R
1
1
1
1
1
1
1
1
1
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
F2  
F2  
F2  
F2  
F2  
F2  
F2  
F2  
F0  
A
A
A
A
A
A
A
A
F1  
3
4
5
V
CC  
6
R
R
7
2
8
A
9
R
1
2
10  
MR82C82 CLCC  
V
C1  
CC  
V
/2  
R
F2 F2  
F2  
1
CC  
R
3
R
3
R
3
3
3
2
20 19  
R
R
R
R
R
R
R
R
R
R
3
3
3
3
3
3
3
3
3
3
F2  
V
V
V
V
V
/2  
/2  
/2  
/2  
/2  
18  
17  
16  
15  
14  
4
CC  
CC  
CC  
CC  
CC  
F2  
F2  
F2  
F2  
5
6
7
8
9
10 11 12 13  
R
R
R
3
R
3
3
3
F0  
F1 V /2 V /2  
CC CC  
NOTES:  
1. V  
= 5.5 ± 0.5V, GND = 0V.  
CC  
2. V = 4.5V ±10%.  
IH  
3. V = -0.2V to 0.4V.  
IL  
4. R = 47kΩ ±5%.  
1
5. R = 2.0kΩ ±5%.  
2
6. R = 4.2kΩ ±5%.  
3
7. R = 470kΩ ±5%.  
4
8. C = 0.01µF minimum.  
1
9. F = 100kHz ±10%.  
0
10. F = F / , F = F / .  
0 2 1 2  
1
2
4-279  
82C82  
Die Characteristics  
DIE DIMENSIONS:  
GLASSIVATION:  
Type: SiO  
118.1 x 92.1 x 19 ±1mils  
2
Thickness: 8kÅ ±1kÅ  
METALLIZATION:  
Type: Si - Al  
WORST CASE CURRENT DENSITY:  
5
2
Thickness: 11kÅ ±1kÅ  
2.00 x 10 A/cm  
Metallization Mask Layout  
82C82  
D11  
2
D10  
1
V
DO0  
19  
D01  
18  
CC  
20  
3
D12  
17  
16  
15  
DO2  
DO3  
DO4  
4
5
D13  
D14  
14  
13  
DO5  
DO6  
6
7
D15  
D16  
8
9
10  
11  
12  
D17  
OE  
GND  
STB  
DO7  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate  
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
4-280  

相关型号:

MR82C82/883

IC,BUFFER/DRIVER,SINGLE,8-BIT,CMOS,LLCC,20PIN,CERAMIC
RENESAS

MR82C82/B

CMOS Octal Latching Bus Driver
INTERSIL

MR82C82B

CMOS Octal Latching Bus Driver
INTERSIL

MR82C83H

CMOS Octal Latching Inverting Bus Driver
INTERSIL

MR82C83H/883

IC,BUFFER/DRIVER,SINGLE,8-BIT,CMOS,LLCC,20PIN,CERAMIC
RENESAS

MR82C83H/B

Bus Driver, CMOS Series, 1-Func, 8-Bit, Inverted Output, CMOS, CQCC20, CERAMIC, LCC-20
ROCHESTER

MR82C83H/B

CMOS SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20
RENESAS

MR82C83HB

CMOS Octal Latching Inverting Bus Driver
INTERSIL

MR82C84A

CMOS Clock Generator Driver
INTERSIL

MR82C84A/B

CMOS Clock Generator Driver
INTERSIL

MR82C84AB

CMOS Clock Generator Driver
INTERSIL

MR82C85

CMOS Static Clock Controller/Generator
INTERSIL