ISL5929EVAL1 [INTERSIL]
Dual 14-Bit, +3.3V, 130/210MSPS, CommLink TM High Speed D/A Converter; 双路14位, + 3.3V , 130 / 210MSPS , CommLink TM高速D / A转换器型号: | ISL5929EVAL1 |
厂家: | Intersil |
描述: | Dual 14-Bit, +3.3V, 130/210MSPS, CommLink TM High Speed D/A Converter |
文件: | 总13页 (文件大小:832K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ISL5929
TM
Data Sheet
February 2002
FN6021.1
Dual 14-Bit, +3.3V, 130/210+MSPS,
Features
CommLinkTM High Speed D/A Converter
• Speed Grades . . . . . . . . . . . . . . . . 130M and 210+MSPS
• Low Power . . . . . 233mW with 20mA Output at 130MSPS
• Adjustable Full Scale Output Current. . . . . 2mA to 20mA
• Guaranteed Gain Matching < 0.14dB
The ISL5929 is a dual 14-bit,
130/210+MSPS (Mega Samples
Per Second), CMOS, high speed,
low power, D/A (digital to analog) converter, designed
specifically for use in high performance communication
systems such as base transceiver stations utilizing 2.5G or
3G cellular protocols.
• +3.3V Power Supply
• 3V LVCMOS Compatible Inputs
This device complements the CommLink ISL5x61 and
ISL5x29 families of high speed converters, which include 8-,
10-, 12-, and 14-bit devices.
• Excellent Spurious Free Dynamic Range
(75dBc to Nyquist, f = 130MSPS, f
= 10MHz)
S
OUT
• UMTS Adjacent Channel Power = 71dB at 19.2MHz
• EDGE/GSM SFDR = 94dBc at 11MHz in 20MHz Window
• Dual, 3.3V, Lower Power Replacement for AD9767
Ordering Information
TEMP.
PART
NUMBER
RANGE
( C)
CLOCK
o
PACKAGE PKG. NO. SPEED
Applications
ISL5929IN
-40 to 85 48 Ld LQFP Q48.7x7A 130MHz
-40 to 85 48 Ld LQFP Q48.7x7A 210MHz
• Cellular Infrastructure - Single or Multi-Carrier: IS-136,
IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA
ISL5929/2IN
ISL5929EVAL1
25
Evaluation Platform
210MHz
• BWA Infrastructure
• Quadrature Transmit with IF Range 0–80MHz
• Medical/Test Instrumentation and Equipment
• Wireless Communication Systems
Pinout
ISL5929
(LQFP)
TOP VIEW
48 47 46 45 44 43 42 41 40 39 38 37
36
QD6
QD7
QD8
1
ID7
35
34
33
32
31
30
29
28
27
26
25
ID6
ID5
ID4
2
3
QD9
QD10
QD11
4
5
ID3
ID2
ID1
6
7
QD12
QD13 (MSB)
CLK
(LSB) ID0
SLEEP
8
9
DGND
AGND
D
10
VDD
AGND
11
12
QCOMP
ICOMP
13 14 15 16 17 18 19 20 21 22 23 24
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
1
CommLink™ is a trademark of Intersil Americas Inc.
ISL5929
Typical Applications Circuit
48 47 46 45 44 43 42 41 40 39 3837
36
QD6
QD7
QD8
QD9
QD10
QD11
QD12
QD13 (MSB)
ID7
ID6
ID5
ID4
ID3
ID2
1
2
3
4
5
6
7
8
9
35
34
33
32
31
30
29
ID1
ID0 (LSB)
SLEEP
CLK 28
27
26
25
DGND
AGND
R
1
50Ω
DV
PP
10
11
12
D
VDD
AGND
ICOMP
QCOMP
C
1
13 14 15 16 17 18 19 20 21 22 23 24
0.1µF
C
C
3
2
0.1µF
0.1µF
A
A
VDD
VDD
AV
AV
PP
PP
C
0.1µF
4
C
5
0.1µF
C
0.1µF
6
R
SET
1.91kΩ
50Ω
50Ω
R
R
3
2
1:1 TRANSFORMER
REPRESENTS
ANY 50Ω LOAD
(50Ω)
IOUT
(50Ω)
QOUT
BEAD
FERRITE
DV
(DIGITAL POWER PLANE) = +3.3V
(ANALOG POWER PLANE) = +3.3V
PP
L
C
10µF
1
+
+
C
C
0.1µF
11
10
1µF
9
10µH
+3.3V POWER SOURCE
FERRITE
BEAD
AV
PP
L
2
10µH
C
14
C
C
12
0.1µF
13
1µF
10µF
2
ISL5929
Functional Block Diagram
(LSB) QD0
QD1
QOUTA
QOUTB
QD2
INPUT
LATCH
QD3
QD4
CASCODE
QD5
CURRENT
SOURCE
SWITCH
MATRIX
40
40
QD6
QD7
QD8
9 LSBs
QD9
QD10
+
31 MSB
SEGMENTS
UPPER
5-BIT
QD11
QD12
DECODER
(MSB) QD13
QCOMP
SLEEP
FSADJ
INT/EXT
BIAS
GENERATION
CLK
VOLTAGE
REFIO
REFERENCE
REFLO
ICOMP
(LSB) ID0
ID1
IOUTA
IOUTB
ID2
INPUT
LATCH
ID3
ID4
CASCODE
ID5
SWITCH
MATRIX
CURRENT
SOURCE
40
40
ID6
ID7
ID8
9 LSBs
+
ID9
ID10
31 MSB
SEGMENTS
UPPER
5-BIT
ID11
ID12
DECODER
(MSB) ID13
3
ISL5929
Pin Descriptions
PIN NO.
11, 19, 26
13, 24
28
PIN NAME
PIN DESCRIPTION
AGND
Analog ground.
A
Analog supply (+2.7V to +3.6V).
Clock Iinput.
VDD
CLK
27
DGND
Connect to digital ground.
Digital supply (+2.7V to +3.6V).
10
D
VDD
20
FSADJ
Full scale current adjust. Use a resistor to ground to adjust full scale output current. Full scale output
current = 32 x V /R
.
FSADJ SET
14, 23
12, 25
NC
Not internally connected. Recommend no connect.
ICOMP, QCOMP
Compensation pin for internal bias generation. Each pin should be individually decoupled to AGND with
a 0.1µF capacitor.
1-8, 29-48
15, 22
ID13-ID0, QD13-QD0 Digital data input ports. Bit 13 is most significant bit (MSB) and bit 0 is the least significant bit (LSB).
IOUTA, QOUTA
IOUTB, QOUTB
Current outputs of the device. Full scale output current is achieved when all input bits are set to binary 1.
16, 21
Complementary current outputs of the device. Full scale output current is achieved on the complementary
outputs when all input bits are set to binary 0.
17
REFIO
Reference voltage input if Internal reference is disabled. The internal reference is not intended to drive an
external load. Use 0.1µF cap to ground when internal reference is enabled.
18
9
REFLO
SLEEP
Connect to analog ground to enable internal 1.2V reference or connect to AV
DD
to disable internal reference.
for sleep mode.
Connect to digital ground or leave floating for normal operation. Connect to DV
DD
4
ISL5929
Absolute Maximum Ratings
Thermal Information
Digital Supply Voltage DV
to DGND . . . . . . . . . . . . . . . . . . +3.6V
to AGND . . . . . . . . . . . . . . . . . . +3.6V
Thermal Resistance (Typical, Note 1)
θ
(°C/W)
70
DD
Analog Supply Voltage AV
JA
DD
LQFP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Grounds, AGND TO DGND . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
Digital Input Voltages (DATA, CLK, SLEEP). . . . . . . . . DV
Reference Input Voltage Range. . . . . . . . . . . . . . . . . . AV
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
+ 0.3V
+ 0.3V
DD
DD
Analog Output Current (I
) . . . . . . . . . . . . . . . . . . . . . . . . . 24mA
OUT
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ is measured with the component mounted on an evaluation PC board in free air.
JA
Electrical Specifications
AV
DD
= DV
DD
= +3.3V, V = Internal 1.2V, IOUTFS = 20mA, T = 25°C for All Typical Values
REF A
T
= -40°C TO 85°C
A
PARAMETER
SYSTEM PERFORMANCE
Resolution
TEST CONDITIONS
MIN
TYP
MAX
UNITS
14
-
-
Bits
LSB
LSB
Integral Linearity Error, INL
Differential Linearity Error, DNL
“Best Fit” Straight Line (Note 7)
(Note 7)
-5
-3
±2.5
±1.5
+5
+3
Offset Error, I
OS
IOUTA (Note 7)
(Note 7)
-0.006
-
+0.006 % FSR
Offset Drift Coefficient
0.1
-
ppm
FSR/°C
Full Scale Gain Error, FSE
With External Reference (Notes 2, 7)
With Internal Reference (Notes 2, 7)
With External Reference (Note 7)
-3
-3
-
±0.5
±0.5
±50
+3
+3
-
% FSR
% FSR
Full Scale Gain Drift
Crosstalk
ppm
FSR/°C
With Internal Reference (Note 7)
-
±100
-
ppm
FSR/°C
f
= 100MSPS, f
= 100MSPS, f
= 10MHz
= 40MHz
-
-
83
74
-
-
dB
dB
CLK
OUT
OUT
f
CLK
Gain Matching Between Channels
(DC Measurement)
As a percentage of Full Scale Range
In dB Full Scale Range
-1.6
-0.14
2
0.6
0.05
20
+1.6
+0.14
22
% FSR
dB FSR
mA
Full Scale Output Current, I
FS
Output Voltage Compliance Range
(Note 3)
-1.0
-
1.25
V
DYNAMIC CHARACTERISTICS
Maximum Clock Rate, f
Maximum Clock Rate, f
Output Rise Time
Output Fall Time
ISL5929/2IN
ISL5929IN
210
250
150
1
-
-
-
-
-
-
-
MHz
MHz
ns
CLK
CLK
130
Full Scale Step
Full Scale Step
-
-
-
-
-
1
ns
Output Capacitance
Output Noise
5
pF
IOUTFS = 20mA
IOUTFS = 2mA
50
30
pA/√Hz
pA/√Hz
5
ISL5929
Electrical Specifications
PARAMETER
AV
DD
= DV
DD
= +3.3V, V = Internal 1.2V, IOUTFS = 20mA, T = 25°C for All Typical Values (Continued)
REF A
T
= -40°C TO 85°C
A
TEST CONDITIONS
MIN
TYP
MAX
UNITS
AC CHARACTERISTICS (Using Figure 13 with R
= 50Ω and R
LOAD
= 50Ω, Full Scale Output = -2.5dBm)
DIFF
Spurious Free Dynamic Range,
SFDR Within a Window
f
= 210MSPS, f
= 210MSPS, f
= 130MSPS, f
= 210MSPS, f
= 210MSPS, f
= 200MSPS, f
= 200MSPS, f
= 130MSPS, f
= 130MSPS, f
= 130MSPS, f
= 130MSPS, f
= 130MSPS, f
= 100MSPS, f
= 80.8MHz, 30MHz Span (Notes 4, 7)
-
-
73
80
86
56
67
68
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
CLK
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
f
= 40.4MHz, 30MHz Span (Notes 4, 7)
= 20.2MHz, 20MHz Span (Notes 4, 7)
= 80.8MHz (Notes 4, 7)
CLK
f
-
CLK
Spurious Free Dynamic Range,
f
-
CLK
SFDR to Nyquist (f
/2)
CLK
f
= 40.4MHz (Notes 4, 7, 9)
-
CLK
f
= 20.2MHz, T = 25°C (Notes 4, 7)
= 20.2MHz, T = -40°C to 85°C (Notes 4, 7)
= 50.5MHz (Notes 4, 7)
62
60
-
CLK
f
CLK
f
59
63
70
75
79
61
64
71
75
78
68
75
79
65
CLK
f
= 40.4MHz (Notes 4, 7)
-
CLK
f
= 20.2MHz (Notes 4, 7)
-
CLK
f
= 10.1MHz , T = -40°C to 85°C (Notes 4, 7)
= 5.05MHz, (Notes 4, 7)
70
-
CLK
f
CLK
f
= 40.4MHz (Notes 4, 7)
-
CLK
f
= 80MSPS, f
= 80MSPS, f
= 80MSPS, f
= 80MSPS, f
= 50MSPS, f
= 50MSPS, f
= 50MSPS, f
= 30.3MHz (Notes 4, 7)
= 20.2MHz (Notes 4, 7)
= 10.1MHz (Notes 4, 7, 9)
= 5.05MHz (Notes 4, 7)
= 20.2MHz (Notes 4, 7)
= 10.1MHz (Notes 4, 7)
= 5.05MHz (Notes 4, 7)
-
CLK
OUT
OUT
OUT
OUT
OUT
OUT
OUT
f
-
CLK
f
-
CLK
f
-
CLK
f
-
CLK
f
-
CLK
f
-
CLK
Spurious Free Dynamic Range,
SFDR in a Window with Eight Tones
f
= 210MSPS, f
OUT
= 28.3MHz to 45.2MHz, 2.1MHz Spacing,
-
CLK
50MHz Span (Notes 4, 7, 9)
f
= 130MSPS, f =17.5MHz to 27.9MHz, 1.3MHz Spacing,
-
-
-
-
-
69
76
77
94
71
-
-
-
-
-
dBc
dBc
dBc
dBc
dB
CLK
OUT
35MHz Span (Notes 4, 7)
f
= 80MSPS, f
= 10.8MHz to 17.2MHz, 811kHz Spacing,
CLK
OUT
15MHz Span (Notes 4, 7)
f
= 50MSPS, f
= 6.7MHz to 10.8MHz, 490kHz Spacing,
CLK
OUT
10MHz Span (Notes 4, 7)
Spurious Free Dynamic Range,
f
= 78MSPS, f = 11MHz, in a 20MHz Window, RBW=30kHz
CLK
OUT
SFDR in a Window with EDGE or GSM (Notes 4, 7, 9)
Adjacent Channel Power Ratio,
ACPR with UMTS
f
= 76.8MSPS, f = 19.2MHz, RBW=30kHz (Notes 4, 7, 9)
OUT
CLK
VOLTAGE REFERENCE
Internal Reference Voltage, V
Pin 20 Voltage with Internal Reference
1.2
1.23
±40
0
1.3
V
ppm/°C
µA
FSADJ
Internal Reference Voltage Drift
-
-
-
-
Internal Reference Output Current
Sink/Source Capability
Reference is not intended to drive an external load
Reference Input Impedance
-
-
1
-
-
MΩ
Reference Input Multiplying Bandwidth (Note 7)
1.0
MHz
DIGITAL INPUTS D13-D0, CLK
Input Logic High Voltage with
3.3V Supply, V
(Note 3)
2.3
3.3
-
V
IH
6
ISL5929
Electrical Specifications
AV
DD
= DV
DD
= +3.3V, V = Internal 1.2V, IOUTFS = 20mA, T = 25°C for All Typical Values (Continued)
REF A
T
= -40°C TO 85°C
A
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Input Logic Low Voltage with
(Note 3)
-
0
1.0
V
3.3V Supply, V
IL
Sleep Input Current, I
-25
-20
-10
-
-
-
+25
+20
+10
-
µA
µA
µA
pF
IH
Input Logic Current, I
IH, IL
Clock Input Current, I
-
IH, IL
Digital Input Capacitance, C
3
IN
TIMING CHARACTERISTICS
Data Setup Time, t
See Figure 15
See Figure 15
See Figure 15
-
-
-
1.5
1.5
1
-
-
-
ns
ns
SU
Data Hold Time, t
HLD
Propagation Delay Time, t
Clock
Period
PD
CLK Pulse Width, t
, t
PW1 PW2
See Figure 15 (Note 3)
2
-
-
ns
POWER SUPPLY CHARACTERISTICS
AV
DV
Power Supply
Power Supply
(Note 8)
2.7
3.3
3.3
60
24
11
17
5
3.6
3.6
62
-
V
DD
(Note 8)
2.7
V
DD
Analog Supply Current (I
)
3.3V, IOUTFS = 20mA
3.3V, IOUTFS = 2mA
3.3V (Note 5)
-
mA
mA
mA
mA
mA
mW
mW
mW
AVDD
-
Digital Supply Current (I
)
-
15
21
-
DVDD
3.3V (Note 6)
-
Supply Current (I
) Sleep Mode
AVDD
3.3V, IOUTFS = Don’t Care
3.3V, IOUTFS = 20mA (Note 5)
3.3V, IOUTFS = 20mA (Note 6)
3.3V, IOUTFS = 2mA (Note 5)
Single Supply (Note 7)
-
Power Dissipation
-
233
253
115
-
255
274
-
-
-
Power Supply Rejection
NOTES:
-0.125
+0.125 %FSR/V
2. Gain Error measured as the error in the ratio between the full scale output current and the current through R
ratio should be 32.
(typically 625µA). Ideally the
SET
3. Parameter guaranteed by design or characterization and not production tested.
4. Spectral measurements made with differential transformer coupled output and no external filtering. For multitone testing, the same pattern was
used at different clock rates, producing different output frequencies but at the same ratio to the clock rate.
5. Measured with the clock at 130MSPS and the output frequency at 10MHz.
6. Measured with the clock at 200MSPS and the output frequency at 20MHz.
7. See “Definition of Specifications.”
8. Recommended operation is from 3.0V to 3.6V. Operation below 3.0V is possible with some degradation in spectral performance. Reduction in
analog output current may be necessary to maintain spectral performance.
9. See Typical Performance Plots.
7
ISL5929
Typical Performance (+3.3V Supply, Using Figure 13 with R
= 100Ω and R
= 50Ω)
LOAD
DIFF
SPECTRAL MASK FOR
GSM900/DCS1800/PCS1900
P>43dBm NORMAL BTS
WITH 30kHz RBW
FIGURE 1. EDGE AT 11MHz, 78MSPS CLOCK
FIGURE 2. EDGE AT 11MHz, 78MSPS CLOCK
(77dBc -NYQUIST, 6dB PAD)
(94+dBc @ ∆f = +6MHz)
SPECTRAL MASK FOR
GSM900/DCS1800/PCS1900
P>43dBm NORMAL BTS
WITH 30kHz RBW
FIGURE 3. GSM AT 11MHz, 78MSPS CLOCK
FIGURE 4. GSM AT 11MHz, 78MSPS CLOCK
(79dBc - NYQUIST, 9dB PAD)
(94+dBc @ ∆f = +6MHz, 3dB PAD)
FIGURE 5. FOUR EDGE CARRIERS AT 12.4–15.6MHz,
800kHz SPACING, 78MSPS (75+dBc - 20MHz
WINDOW)
FIGURE 6. FOUR GSM CARRIERS AT 12.4–15.6MHz,
78MSPS (75+dBc - 20MHz WINDOW, 6dB PAD)
8
ISL5929
Typical Performance (+3.3V Supply, Using Figure 13 with R
= 100Ω and R
= 50Ω) (Continued)
LOAD
DIFF
SPECTRAL MASK
UMTS TDD
P>43dBm BTS
FIGURE 7. UMTS AT 19.2MHz, 76.8MSPS (71dB 1stACPR,
75dB 2ndACPR)
FIGURE 8. ONETONE AT 10.1MHz, 80MSPS CLOCK
(71dBc - NYQUIST, 6dB PAD)
FIGURE 9. ONE TONE AT 40.4MHz, 210MSPS CLOCK
(61dBc - NYQUIST, 6dB PAD)
FIGURE 10. EIGHTTONES (CREST FACTOR=8.9) AT 37MHz,
210MSPS CLOCK, 2.1MHz SPACING
(65dBc - NYQUIST)
FIGURE 11. TWOTONES (CF=6) AT 8.5MHz, 50MSPS CLOCK,
500kHz SPACING (83dBc - 10MHz WINDOW,
6dB PAD)
FIGURE 12. FOURTONES (CF=8.1) AT 14MHz, 80MSPS
CLOCK, 800kHz SPACING (70dBc - NYQUIST,
6dB PAD)
9
ISL5929
through a known resistance. Offset error is defined as the
maximum deviation of the IOUTA output current from a value
of 0mA.
Definition of Specifications
Adjacent Channel Power Ratio, ACPR, is the ratio of the
average power in the adjacent frequency channel (or offset)
to the average power in the transmitted frequency channel.
Output Voltage Compliance Range, is the voltage limit
imposed on the output. The output impedance should be
chosen such that the voltage developed does not violate the
compliance range.
Crosstalk, is the measure of the channel isolation from one
DAC to the other. It is measured by generating a sinewave in
one DAC while the other DAC is clocked with a static input,
and comparing the output power of each DAC at the
frequency generated.
Power Supply Rejection, is measured using a single power
supply. The nominal supply voltage is varied ±10% and the
change in the DAC full scale output is noted.
Differential Linearity Error, DNL, is the measure of the
step size output deviation from code to code. Ideally the step
size should be one LSB. A DNL specification of one LSB or
less guarantees monotonicity.
Reference Input Multiplying Bandwidth, is defined as the
3dB bandwidth of the voltage reference input. It is measured
by using a sinusoidal waveform as the external reference
with the digital inputs set to all 1s. The frequency is
increased until the amplitude of the output waveform is 0.707
(-3dB) of its original value.
EDGE, Enhanced Data for Global Evolution, a TDMA
standard for cellular applications which uses 200kHz BW,
8-PSK modulated carriers.
Spurious Free Dynamic Range, SFDR, is the amplitude
difference from the fundamental signal to the largest
harmonically or non-harmonically related spur within the
specified frequency window.
Full Scale Gain Drift, is measured by setting the data inputs
to be all logic high (all 1s) and measuring the output voltage
through a known resistance as the temperature is varied
from T
to T . It is defined as the maximum deviation
MIN
MAX
from the value measured at room temperature to the value
measured at either T or T . The units are ppm of FSR
(full scale range) per °C.
Total Harmonic Distortion,THD, is the ratio of the RMS
value of the fundamental output signal to the RMS sum of
the first five harmonic components.
MIN MAX
Full Scale Gain Error, is the error from an ideal ratio of 32
between the output current and the full scale adjust current
UMTS, Universal Mobile Telecommunications System, a
W-CDMA standard for cellular applications which uses
3.84MHz modulated carriers.
(through R
).
SET
Gain Matching, is a measure of the full scale amplitude
match between the I and Q channels given the same input
pattern. It is typically measured with all 1s at the input to
both channels, and the full scale output voltage developed
into matching loads is compared for the I and Q outputs.
Detailed Description
The ISL5929 is a dual 14-bit, current out, CMOS, digital to
analog converter. The core of each DAC is based on the
ISL5961. The maximum update rate is at least 210+MSPS
and can be powered by a single power supply in the
GSM, Global System for Mobile Communication, a TDMA
standard for cellular applications which uses 200kHz BW,
GMSK modulated carriers.
recommended range of +3.0V to +3.6V. Operation with clock
rates higher than 210MSPS is possible; please contact the
factory for more information. It consumes less than 125mW
of power per channel when using a +3.3V supply, the
maximum 20mA of output current, and the data switching at
210MSPS. The architecture is based on a segmented
current source arrangement that reduces glitch by reducing
the amount of current switching at any one time. In previous
architectures that contained all binary weighted current
sources or a binary weighted resistor ladder, the converter
might have a substantially larger amount of current turning
on and off at certain, worst-case transition points such as
midscale and quarter scale transitions. By greatly reducing
the amount of current switching at these major transitions,
the overall glitch of the converter is dramatically reduced,
improving settling time, transient problems, and accuracy.
Integral Linearity Error, INL, is the measure of the worst
case point that deviates from a best fit straight line of data
values along the transfer curve.
Internal Reference Voltage Drift, is defined as the
maximum deviation from the value measured at room
temperature to the value measured at either T
or T .
MAX
MIN
The units are ppm per °C.
Offset Drift, is measured by setting the data inputs to all
logic low (all 0s) and measuring the output voltage at IOUTA
through a known resistance as the temperature is varied
from T
to T . It is defined as the maximum deviation
MIN
MAX
from the value measured at room temperature to the value
measured at either T or T . The units are ppm of FSR
MIN MAX
Digital Inputs and Termination
(full scale range) per degree °C.
The ISL5929 digital inputs are formatted as offset binary and
guaranteed to 3V LVCMOS levels. The internal register is
updated on the rising edge of the clock. To minimize
Offset Error, is measured by setting the data inputs to all
logic low (all 0s) and measuring the output voltage of IOUTA
10
ISL5929
reflections, proper termination should be implemented. If the
will equal the external reference. The calculation for I
(Full Scale) is:
OUT
lines driving the clock and the digital inputs are long 50Ω
lines, then 50Ω termination resistors should be placed as
close to the converter inputs as possible connected to the
digital ground plane (if separate grounds are used). These
termination resistors are not likely needed as long as the
digital waveform source is within a few inches of the DAC.
For pattern drivers with very high speed edge rates, it is
recommended that the user consider series termination (50-
200Ω) prior to the DAC’s inputs in order to reduce the
amount of noise.
I
(Full Scale) = (V X 32.
/R
OUT FSADJ SET)
If the full scale output current is set to 20mA by using the
internal voltage reference (1.23V) and a 1.91kΩ R
SET
resistor, then the input coding to output current will resemble
the following:
TABLE 1. INPUT CODING vs OUTPUT CURRENTWITH
INTERNAL REFERENCE (1.23V TYP) AND
RSET=1.91KΩ
Power Supply
INPUT CODE (D13-D0)
11 1111 1111 1111
10 0000 0000 0000
00 0000 0000 0000
IOUTA (mA)
IOUTB (mA)
Separate digital and analog power supplies are
20.6
10.3
0
0
recommended. The allowable supply range is +2.7V to
+3.6V. The recommended supply range is +3.0 to 3.6V
(nominally +3.3V) to maintain optimum SFDR. However,
operation down to +2.7V is possible with some degradation
in SFDR. Reducing the analog output current can help the
SFDR at +2.7V. The SFDR values stated in the table of
specifications were obtained with a +3.3V supply.
10.3
20.6
Analog Output
IOUTA and IOUTB are complementary current outputs. The
sum of the two currents is always equal to the full scale
output current minus one LSB. If single ended use is
desired, a load resistor can be used to convert the output
current to a voltage. It is recommended that the unused
output be either grounded or equally terminated.The voltage
developed at the output must not violate the output voltage
Ground Planes
Separate digital and analog ground planes should be used.
All of the digital functions of the device and their
corresponding components should be located over the
digital ground plane and terminated to the digital ground
plane. The same is true for the analog components and the
analog ground plane.
compliance range of -1.0V to 1.25V. R
(the impedance
OUT
loading each current output) should be chosen so that the
desired output voltage is produced in conjunction with the
output full scale current. If a known line impedance is to be
driven, then the output load resistor should be chosen to
match this impedance. The output voltage equation is:
Noise Reduction
To minimize power supply noise, 0.1µF capacitors should be
placed as close as possible to the converter’s power supply
V
= I
OUT
X R .
OUT
pins, AV
and DV . Also, the layout should be designed
OUT
DD
DD
using separate digital and analog ground planes and these
capacitors should be terminated to the digital ground for
The most effective method for reducing the power
consumption is to reduce the analog output current, which
dominates the supply current. The maximum recommended
output current is 20mA.
DV
and to the analog ground for AV . Additional filtering
DD
DD
of the power supplies on the board is recommended.
Voltage Reference
Differential Output
The internal voltage reference of the device has a nominal
value of +1.23V with a ±40ppm/°C drift coefficient over the
full temperature range of the converter. It is recommended
that a 0.1µF capacitor be placed as close as possible to the
REFIO pin, connected to the analog ground.The REFLO pin
selects the reference.The internal reference can be selected
if REFLO is tied low (ground). If an external reference is
desired, then REFLO should be tied high (the analog supply
voltage) and the external reference driven into REFIO. The
full scale output current of the converter is a function of the
IOUTA and IOUTB can be used in a differential-to-single-
ended arrangement to achieve better harmonic rejection.
With R
= 50Ω and R =50Ω, the circuit in Figure 13
DIFF
LOAD
will provide a 500mV (-2.5dBm) signal at the output of the
transformer if the full scale output current of the DAC is set to
20mA (used for the electrical specifications table). Values of
R
= 100Ω and R =50Ω were used for the typical
DIFF LOAD
performance curves to increase the output power and the
dynamic range. The center tap in Figure 13 must be
grounded.
voltage reference used and the value of R should
. I
SET OUT
In the circuit in Figure 14, the user is left with the option to
ground or float the center tap. The DC voltage that will exist
at either IOUTA or IOUTB if the center tap is floating is
be within the 2mA to 22mA range, though operation below
2mA is possible, with performance degradation.
If the internal reference is used, V
FSADJ
will equal
IOUT
x (R //R ) V because R is DC shorted by the
DC
A
B
DIFF
approximately 1.2V. If an external reference is used, V
FSADJ
transformer. If the center tap is grounded, the DC voltage is
0V. Recommended values for the circuit in Figure 14 are
11
ISL5929
R =R =50Ω, R
=100Ω, assuming R =50Ω. The
LOAD
A
B
DIFF
R
= 0.5 x (R
LOAD
AT EACH OUTPUT
// R
DIFF
// R ), WHERE R =R
EQ
A
A
B
performance of Figure 13 and Figure 14 is basically the
same, however leaving the center tap of Figure 14 floating
allows the circuit to find a more balanced virtual ground,
theoretically improving the even order harmonic rejection,
but likely reducing the signal swing available due to the
output voltage compliance range limitations.
R
A
V
= (2 x OUTA x R )V
EQ
OUT
OUTA
OUTB
R
R
DIFF
LOAD
ISL5929
R
B
R
= 0.5 x (R
LOAD
// R )
DIFF
EQ
AT EACH OUTPUT
R
REPRESENTS THE
LOAD
LOAD SEEN BY THE TRANSFORMER
V
= (2 x OUTA x R )V
EQ
OUT
1:1
FIGURE 14. ALTERNATIVE OUTPUT LOADING
OUTA
R
R
Propagation Delay
DIFF
LOAD
OUTB
The converter requires two clock rising edges for data to be
represented at the output. Each rising edge of the clock
captures the present data word and outputs the previous
data.The propagation delay is therefore 1/CLK, plus <2ns of
processing. See Figure 15.
ISL5929
R
REPRESENTS THE
LOAD
LOAD SEEN BY THE TRANSFORMER
FIGURE 13. OUTPUT LOADING FOR DATASHEET
MEASUREMENTS
Test Service
Intersil offers customer-specific testing of CommLink
converters with a service called Testdrive. To submit a
request, fill out the Testdrive form at
www.intersil.com/testdrive. Or, send a request to the
technical support center.
Timing Diagram
t
t
PW2
PW1
50%
CLK
t
t
t
SU
SU
SU
W
t
t
t
HLD
HLD
HLD
D13-D0
W
W
W
0
3
1
2
t
t
PD
OUTPUT=W
PD
0
I
OUT
OUTPUT=W
OUTPUT=W
1
-1
FIGURE 15. PROPAGATION DELAY, SETUP TIME, HOLD TIME AND MINIMUM PULSE WIDTH DIAGRAM
12
ISL5929
Thin Plastic Quad Flatpack Packages (LQFP)
D
Q48.7x7A (JEDEC MS-026BBC ISSUE B)
48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
D1
-D-
INCHES
MILLIMETERS
SYMBOL
MIN
MAX
MIN
-
MAX
1.60
0.15
1.45
0.27
0.23
9.10
7.10
9.10
7.10
0.75
NOTES
A
A1
A2
b
-
0.062
0.005
0.057
0.010
0.009
0.358
0.280
0.358
0.280
0.029
-
0.002
0.054
0.007
0.007
0.350
0.272
0.350
0.272
0.018
0.05
1.35
0.17
0.17
8.90
6.90
8.90
6.90
0.45
-
-
-A-
-B-
6
E
b1
D
-
E1
3
D1
E
4, 5
3
E1
L
4, 5
e
-
N
48
0.020 BSC
48
0.50 BSC
7
PIN 1
e
-
SEATING
PLANE
Rev. 2 1/99
-H-
A
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
0.08
0.003
-C-
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane
0.08
0.003
D
A-B
C
S
M
S
-H-
.
b
o
o
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
11 -13
0.020
b1
MIN
0.008
o
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003
inch).
0
MIN
0.09/0.16
0.004/0.006
A2
A1
GAGE
PLANE
BASE METAL
WITH PLATING
7. “N” is the number of terminal positions.
L
0.09/0.20
0.004/0.008
o
o
11 -13
0.25
0.010
o
o
0 -7
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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3-13
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