ISL54200IRZ-T [INTERSIL]

USB 2.0 High/Full Speed Multiplexer; USB 2.0高速/全速多路复用器
ISL54200IRZ-T
型号: ISL54200IRZ-T
厂家: Intersil    Intersil
描述:

USB 2.0 High/Full Speed Multiplexer
USB 2.0高速/全速多路复用器

复用器 光电二极管 输出元件
文件: 总16页 (文件大小:1117K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ISL54200  
®
Data Sheet  
January 24, 2007  
FN6408.0  
USB 2.0 High/Full Speed Multiplexer  
Features  
The Intersil ISL54200 dual 2:1 multiplexer IC is a single  
supply part that can operate from a single 2.7V to 5.5V supply.  
It contains two SPDT (Single Pole/Double Throw) switches  
configured as a DPDT. The part was designed for switching  
between USB High-Speed and USB Full-Speed sources in  
portable battery powered products.  
• High Speed (480Mbps) and Full Speed (12Mbps)  
Signaling Capability per USB 2.0  
• 1.8V Logic Compatible (2.7V to +3.6V supply)  
• Enable Pin to Open all Switches  
• -3dB Frequency  
- HSx Switches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 880MHz  
- FSx Switches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 550MHz  
The 7Ω normally-closed (NC) FSx switches can swing rail to  
rail and were specifically designed to pass USB full speed  
data signals (12Mbps) that range from 0V to 3.6V. The 4.5Ω  
normally-open (NO) HSx switches have high bandwidth and  
low capacitance and were specifically designed to pass USB  
high speed data signals (480Mbps) with minimal distortion.  
• Cross-talk @ 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . -70dB  
• OFF Isolation @ 100kHz . . . . . . . . . . . . . . . . . . . . . -98dB  
• Single Supply Operation (V ) . . . . . . . . . . . . 2.7V to 5.5V  
DD  
The part can be used in Personal Media Players and other  
portable battery powered devices that need to switch between  
a high-speed transceiver and a full-speed transceiver while  
connected to a single USB host (computer).  
• Available in Ultra-thin µTQFN and TDFN Packages  
• Pb-Free Plus Anneal (RoHS Compliant)  
Applications  
The digital logic inputs are 1.8V logic compatible when  
operated with a 2.7V to 3.6V supply. The part has an enable  
pin to open all switches. It can be used to facilitate proper bus  
disconnect and connection when switching between the USB  
sources.  
• MP3 and other Personal Media Players  
• Cellular/Mobile Phones  
• PDA’s  
• Digital Cameras and Camcorders  
The ISL54200 is available in a 10 Ld 3mmx3mm TDFN and a  
small 10 Ld 2.1mmx1.6mm µTQFN packages. It operates  
over a temperature range of -40 to +85°C.  
Application Block Diagram  
3.3V  
µCONTROLLER  
V
DD  
ISL54200  
EN  
IN  
LOGIC CIRCUITRY  
VBUS  
D-  
USB  
4MΩ  
HIGH-SPEED  
TRANSCEIVER  
HSD1  
HSD2  
COMD1  
USB  
D+  
FSD1  
FSD2  
FULL-SPEED  
TRANSCEIVER  
COMD2  
GND  
GND  
PORTABLE MEDIA DEVICE  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright Intersil Americas Inc. 2007. All Rights Reserved  
1
All other trademarks mentioned are the property of their respective owners.  
ISL54200  
Pinouts  
ISL54200  
(10 LD TDFN  
TOP VIEW  
ISL54200  
(10 LD µTQFN)  
TOP VIEW  
10  
4M  
LOGIC  
VDD  
IN  
EN  
10  
9
1
2
3
4
5
4M  
CONTROL  
HSD1  
HSD2  
VDD  
IN  
9
LOGIC  
CONTROL  
1
2
3
4
HSD1  
8
8
COMD1  
COMD2  
GND  
HSD2  
FSD1  
FSD2  
COMD1  
FSD1  
FSD2  
7
7
6
6
COMD2  
5
NOTE:  
1. ISL54200 Switches Shown for IN = Logic “0” and EN = Logic “1”.  
Ordering Information  
PART NUMBER  
(Note)  
PART  
MARKING  
TEMP. RANGE (°C)  
-40 to +85  
PACKAGE (Pb-Free)  
PKG. DWG. #  
ISL54200IRZ  
200Z  
200Z  
FM  
10 Ld 3x3 TDFN  
L10.3x3A  
ISL54200IRZ-T  
-40 to +85  
10 Ld 3x3 TDFN Tape and Reel  
L10.3x3A  
ISL54200IRUZ-T  
-40 to +85  
10 Ld 2.1x1.6mm μTQFN Tape and Reel  
L10.2.1x1.6A  
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate  
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL  
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.  
Truth Table  
Pin Descriptions  
ISL54200  
FSD1, FSD2  
ISL54200  
EN  
1
IN  
0
HSD1, HSD2  
OFF  
PIN NO.  
NAME  
VDD  
IN  
FUNCTION  
ON  
OFF  
OFF  
1
2
Power Supply  
1
1
ON  
Select Logic Control Input  
0
X
OFF  
3
COMD1 USB Common Port  
COMD2 USB Common Port  
Logic “0” when 0.5V, Logic “1” when 1.4V with a 2.7V to 3.6V  
4
Supply. X = Don’t Care  
5
GND  
FSD1  
FSD2  
HSD1  
HSD2  
EN  
Ground Connection  
6
Full Speed USB Differential Port  
Full Speed USB Differential Port  
High Speed USB Differential Port  
High Speed USB Differential Port  
Bus Switch Enable  
7
8
9
10  
FN6408.0  
January 24, 2007  
2
ISL54200  
Absolute Maximum Ratings  
Thermal Information  
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 6.0V  
Input Voltages  
Thermal Resistance (Typical, Note 3)  
q
(°C/W)  
JA  
10 Ld 3x3 TDFN Package . . . . . . . . . . . . . . . . . . . .  
10 Ld µTQFN Package . . . . . . . . . . . . . . . . . . . . . .  
Maximum Junction Temperature (Plastic Package). . . . . . . +150°C  
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C  
55  
140  
FSD2, FSD1, HSD2, HSD1 (Note 2) . . . . . - 1V to ((V ) +0.3V)  
DD  
IN, EN (Note 2). . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V ) +0.3V)  
DD  
Output Voltages  
COMD1, COMD2 (Note 2) . . . . . . . . . . . . . . . . . . . . . . . -1V to 5V  
Continuous Current (HSD2, HSD1, FSD2, FSD1). . . . . . . . . ±40mA  
Peak Current (HSD2, HSD1, FSD2, FSD1)  
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . ±100mA  
ESD Rating:  
HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>7kV  
MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>400V  
CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >1.4kV  
Operating Conditions  
Temperature Range  
ISL54200IRZ and ISL54200IRUZ . . . . . . . . . . . . . . -40°C to +85°C  
V
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V  
DD  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTES:  
2. Signals on FSD1, FSD2, HSD1, HSD2, COMD1, COMD2, EN, IN exceeding V  
maximum current ratings.  
or GND by specified amount are clamped. Limit current to  
DD  
3. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
JA  
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: V = +3.3V, GND = 0V, V  
= 1.4V, V  
= 0.5V, V  
= 1.4V,  
ENH  
DD  
INH  
INL  
V
= 0.5V, (Notes 4, 6), Unless Otherwise Specified  
ENL  
TEMP  
(°C)  
MIN  
(Note 5)  
MAX  
(Note 5) UNITS  
PARAMETER  
TEST CONDITIONS  
TYP  
ANALOG SWITCH CHARACTERISTICS  
NC Switches (FSD1, FSD2)  
Analog Signal Range, V  
ANALOG  
V
= 3.3V, IN = 0V, EN = 3.3V  
Full  
+25  
Full  
+25  
Full  
0
-
-
7
V
V
Ω
Ω
Ω
Ω
DD  
DD  
ON Resistance, r  
V
V
= 3.3V, IN = 0.5V, EN = 1.4V, I  
= 40mA,  
= 0V to 3.3V, (See Figure 4)  
10  
15  
(ON)  
DD  
COMx  
or V  
FSD2  
FSD1  
-
-
r
Matching Between Channels,  
V
V
= 3.3V, IN = 0.5V, EN = 1.4V, I  
COMx  
= 40mA,  
-
0.1  
-
0.35  
0.4  
(ON)  
Δr  
DD  
or V  
= Voltage at max r  
over signal range  
(ON)  
FSD1  
FSD2  
(ON)  
-
of 0V to 3.3V, (Note 8)  
r
Flatness, r  
FLAT(ON)  
V
V
= 3.3V, IN = 0.5V, EN = 1.4V, I  
COMx  
= 40mA,  
+25  
Full  
+25  
Full  
+25  
Full  
-
4
-
6
Ω
(ON)  
DD  
or V  
= 0V to 3.3V, (Note 7)  
FSD1  
FSD2  
-
8
Ω
OFF Leakage Current, I  
V+ = 3.6V, IN = 3.6V, EN = 0V and 3.6V, V  
3V, V  
= 0.3V,  
-20  
-70  
-20  
-70  
2
-
20  
70  
20  
70  
nA  
nA  
nA  
nA  
FSX(OFF)  
FSX(ON)  
COMx  
= 3V, 0.3V  
FSX  
ON Leakage Current, I  
V+ = 3.6V, IN = 0V, EN = 3.6V, V  
COMx  
V
= 0.3V, 3V,  
2
-
= 0.3V, 3V  
FSX  
NO Switches (HSD1, HSD2)  
Analog Signal Range, V  
V
= 3.3V, IN = 3.3V, EN = 3.3V  
= 3.3V, IN = 1.4V, EN = 1.4V, I  
Full  
+25  
Full  
+25  
Full  
+25  
Full  
0
-
-
-
-
-
-
-
20  
-
V
DD  
V
Ω
Ω
Ω
Ω
Ω
Ω
ANALOG  
DD  
ON Resistance, r  
V
V
= 1mA,  
30  
35  
6
(ON)  
DD  
COMx  
or V  
= 3.3V (See Figure 3)  
HSD2  
HSD1  
ON Resistance, r  
V
V
= 3.3V, IN = 1.4V, EN = 1.4V, I  
= 40mA,  
4.5  
-
(ON)  
DD  
COMx  
or V  
= 0V to 400mV (See Figure 3)  
HSD1  
HSD2  
8
r
Matching Between Channels,  
V
V
= 3.3V, IN = 1.4V, EN = 1.4V, I  
COMx  
= 40mA,  
, Voltage at max  
0.01  
-
0.1  
0.5  
(ON)  
Δr  
DD  
or V  
= Voltage at max r  
(ON)  
HSD2  
HSD1  
(ON)  
r
over signal range of 0V to 400mV (Note 8)  
(ON)  
r
Flatness, r  
FLAT(ON)  
V
V
= 3.3V, IN = 1.4V, EN = 1.4V, I  
= 40mA,  
= 0V to 400mV, (Note 7)  
HSD1  
+25  
Full  
-
-
0.4  
-
1
Ω
Ω
(ON)  
DD  
COMx  
or V  
HSD2  
1.5  
FN6408.0  
January 24, 2007  
3
ISL54200  
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: V = +3.3V, GND = 0V, V  
= 1.4V, V  
= 0.5V, V  
= 1.4V,  
ENH  
DD  
INH  
INL  
V
= 0.5V, (Notes 4, 6), Unless Otherwise Specified (Continued)  
ENL  
TEMP  
(°C)  
MIN  
(Note 5)  
MAX  
(Note 5) UNITS  
PARAMETER  
OFF Leakage Current, I  
TEST CONDITIONS  
TYP  
V
V
= 3.6V, IN = 0V, EN = 0 and 3.6V, V  
or  
+25  
Full  
+25  
Full  
-20  
-70  
-20  
-70  
2
-
20  
70  
20  
70  
nA  
nA  
nA  
nA  
HSD2(OFF)  
DD  
COMD1  
= 0.3V, 3V  
or I  
= 3V, 0.3V, V  
or V  
HSD1(OFF)  
COMD2  
HSD2 HSD1  
ON Leakage Current, I  
or  
V
V
= 3.6V, IN = 3.6V, EN = 3.6V, V  
or  
= 0.3V, 3.0V  
2
-
HSD2(ON)  
DD  
COMD1  
I
= 0.3V, 3.0V, V or V  
HSD2 HSD1  
HSD1(ON)  
COMD2  
DYNAMIC CHARACTERISTICS  
Turn-ON Time, t  
V
V
V
V
= 3.3V, R = 45Ω, C = 10pF, (See Figure 1)  
+25  
+25  
+25  
+25  
-
-
-
-
25  
15  
7
-
-
-
-
ns  
ns  
ns  
ps  
ON  
Turn-OFF Time, t  
DD  
DD  
DD  
DD  
L
L
= 3.3V, R = 45Ω, C = 10pF, (See Figure 1)  
OFF  
Break-Before-Make Time Delay, t  
L
L
= 3.3V, R = 45Ω, C = 10pF, (See Figure 2)  
D
L
L
Skew, t  
= 3.3V, IN = 3.3V, EN = 3.3V, R = 45Ω, C = 10pF,  
50  
SKEW  
(HSx Switch)  
L
L
t
= t = 720ps at 480Mbps, (Duty Cycle = 50%)  
R
F
(See Figure 7)  
Total Jitter, t  
(HSx Switch)  
V
=3.3V, IN = 3.3V, EN = 3.3V, R = 45Ω, C = 10pF,  
+25  
+25  
+25  
-
-
-
210  
250  
0.15  
-
-
-
ps  
ps  
ns  
J
DD  
t = t = 720ps at 480Mbps  
R
L
L
F
Propagation Delay, t  
(HSx Switch)  
V
= 3.3V, IN = 3.3V, EN = 3.3V, R = 45Ω, C = 10pF,  
L L  
PD  
DD  
(See Figure 7)  
Skew, t  
V
= 3.3V, IN = 0V, EN = 3.3V, R = 39Ω, C = 50pF,  
L L  
SKEW  
(FSx Switch)  
DD  
= t = 12ns at 12Mbps, (Duty Cycle = 50%)  
t
R
F
(See Figure 7)  
Rise/Fall Time Mismatch, t  
(FSx Switch)  
V
= 3.3V, IN = 0V, EN = 3.3V, R = 39Ω, C = 50pF,  
+25  
+25  
+25  
+25  
-
-
-
-
10  
1.6  
0.9  
-70  
-
-
-
-
%
ns  
ns  
dB  
M
DD  
t = t = 12ns at 12Mbps, (Duty Cycle = 50%)  
R
L
L
F
Total Jitter, t  
V
= 3.3V, IN = 0V, EN = 3.3V, R = 39Ω, C = 50pF,  
L L  
J
DD  
t = t = 12ns at 12Mbps  
R
(FSx Switch)  
F
Propagation Delay, t  
(FSx Switch)  
V
= 3.3V, IN = 0V, EN = 3.3V, R = 39Ω, C = 50pF,  
L L  
PD  
DD  
(See Figure 7  
Crosstalk  
V
= 3.3V, R = 45Ω, f = 1MHz  
L
DD  
(See Figure 6)  
OFF Isolation  
V
= 3.3V, R = 45Ω, f = 100kHz  
+25  
+25  
+25  
+25  
-
-
-
-
-98  
880  
550  
6
-
-
-
-
dB  
MHz  
MHz  
pF  
DD  
L
FSx Switch -3dB Bandwidth  
HSx Switch -3dB Bandwidth  
Signal = -10dBm, 1.0VDC offset, R = 45Ω, C = 5pF  
L
L
Signal = -10dBm, 0.2VDC offset, R = 45Ω, C = 5pF  
L
L
HSx OFF Capacitance, C  
FSx OFF Capacitance, C  
COM ON Capacitance, C  
COM ON Capacitance, C  
f = 1MHz, V  
V
= 3.3V, IN = 0V, EN = 3.3V, V  
or  
HSxOFF  
DD  
HSD1  
= V  
= 0V, (See Figure 5)  
HSD2  
COMx  
f = 1MHz, V  
V
= 3.3V, IN = 3.3V, EN = 3.3V, V  
or  
+25  
+25  
+25  
-
-
-
9
-
-
-
pF  
pF  
pF  
FSxOFF  
DD  
FSD1  
= V  
= 0V, (See Figure 5)  
FSD2  
COMx  
f = 1MHz, V  
V
= 3.3V, IN = 3.3V, EN = 3.3V, V  
or  
12  
15  
COMX(ON)  
DD  
HSD1  
= V  
= 0V, (See Figure 5)  
HSD2  
COMx  
f = 1MHz, V  
= 3.3V, IN = 0V, EN = 3.3V, V  
or  
COMX(ON)  
DD  
FSD1  
V
= V  
= 0V, (See Figure 5)  
FSD2  
POWER SUPPLY CHARACTERISTICS  
Power Supply Range, V  
COMx  
Full  
+25  
Full  
2.7  
-
20  
-
5.5  
60  
80  
V
DD  
Positive Supply Current, I  
V
= 3.6V, IN = 0V or 3.6V, EN = 0V or 3.6V  
DD  
-
-
nA  
nA  
DD  
FN6408.0  
January 24, 2007  
4
ISL54200  
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: V = +3.3V, GND = 0V, V  
= 1.4V, V  
= 0.5V, V  
= 1.4V,  
ENH  
DD  
INH  
INL  
V
= 0.5V, (Notes 4, 6), Unless Otherwise Specified (Continued)  
ENL  
TEMP  
(°C)  
MIN  
(Note 5)  
MAX  
(Note 5) UNITS  
PARAMETER  
TEST CONDITIONS  
TYP  
DIGITAL INPUT CHARACTERISTICS  
Input Voltage Low, V , V  
INL ENL  
V
V
V
V
V
= 2.7V to 3.6V  
Full  
Full  
Full  
Full  
Full  
-
-
-
0.5  
V
DD  
DD  
DD  
DD  
DD  
Input Voltage High, V , V  
= 2.7V to 3.6V  
1.4  
-
-
-
-
V
INH ENH  
Input Current, I , I  
INL ENL  
= 3.6V, IN = 0V, EN = 0V  
= 3.6V, IN = 3.6  
-
-
-
10  
10  
1
nA  
nA  
μA  
Input Current, I  
Input Current, I  
NOTES:  
INH  
= 3.6V, EN = 3.6  
ENH  
4. V  
= Input voltage to perform proper function.  
LOGIC  
5. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.  
6. Parameters with limits are 100% tested at +25°C. Limits across the full temperature range are guaranteed by design and correlation.  
7. Flatness is defined as the difference between maximum and minimum value of on-resistance over the specified analog signal range  
8. r  
r
matching between channels is calculated by subtracting the channel with the highest max r  
value, between HSD2 and HSD1 or between FSD2 and FSD1.  
value from the channel with lowest max  
(ON)  
(ON)  
(ON)  
Test Circuits and Waveforms  
V
DD  
VIN  
t < 20ns  
r
t < 20ns  
f
H
LOGIC  
INPUT  
50%  
VIN  
L
EN  
V
INPUT  
V
t
OUT  
OFF  
HSx or FSx  
SWITCH  
INPUT  
COMx  
SWITCH  
INPUT  
V
INPUT  
IN  
V
OUT  
90%  
90%  
R
45W  
C
L
10pF  
VIN  
L
GND  
SWITCH  
OUTPUT  
0V  
t
ON  
Repeat test for all switches. C includes fixture and stray  
L
Logic input waveform is inverted for switches that have the opposite  
logic sense.  
capacitance.  
R
L
---------------------------  
V
= V  
OUT  
(INPUT)  
R
+ r  
(ON)  
L
FIGURE 1A. MEASUREMENT POINTS  
FIGURE 1B. TEST CIRCUIT  
FIGURE 1. SWITCHING TIMES  
FN6408.0  
January 24, 2007  
5
ISL54200  
Test Circuits and Waveforms (Continued)  
V
DD  
C
VIN  
H
EN  
LOGIC  
INPUT  
FSD1 or FSD2  
V
V
OUT  
INPUT  
COMx  
VIN  
L
HSD1 or HSD2  
C
R
L
L
45Ω  
10pF  
IN  
90%  
SWITCH  
OUTPUT  
GND  
VIN  
V
OUT  
0V  
t
D
Repeat test for all switches. C includes fixture and stray  
L
capacitance.  
FIGURE 2B. TEST CIRCUIT  
FIGURE 2A. MEASUREMENT POINTS  
FIGURE 2. BREAK-BEFORE-MAKE TIME  
V
DD  
V
DD  
C
C
r
= V /I  
COMx  
(ON)  
1
r
= V /40mA  
1
(ON)  
HSx  
FSx  
V
HSX  
V
FSX  
IN  
1.4V  
V
IN  
0.5V  
1
V
1
I
COMx  
40mA  
COMx  
COMx  
EN  
GND  
EN  
GND  
1.4V  
1.4V  
Repeat test for all switches.  
FIGURE 4. FSx Switch r  
Repeat test for all switches.  
FIGURE 3. HSx Switch r  
TEST CIRCUIT  
TEST CIRCUIT  
(ON)  
(ON)  
FN6408.0  
January 24, 2007  
6
ISL54200  
Test Circuits and Waveforms (Continued)  
V
DD  
V
DD  
C
C
EN  
EN  
SIGNAL  
GENERATOR  
45Ω  
HSx or FSx  
HSx  
COMx  
IN  
IN  
IMPEDANCE  
ANALYZER  
VIN OR  
VIN  
L
VIN  
H
COMx  
GND  
FSx  
COMx  
ANALYZER  
N.C.  
GND  
R
L
Signal direction through switch is reversed, worst case values  
are recorded. Repeat test for all switches.  
Repeat test for all switches.  
FIGURE 6. CROSSTALK TEST CIRCUIT  
FIGURE 5. CAPACITANCE TEST CIRCUIT  
V
DD  
C
t
ri  
EN  
90%  
50%  
VIN  
VIN  
10%  
90%  
DIN+  
DIN-  
t
skew_i  
15.8Ω  
143Ω  
OUT+  
D2  
D1  
COMD2  
COMD1  
DIN+  
DIN-  
50%  
10%  
45Ω  
C
L
15.8Ω  
143Ω  
OUT-  
t
fi  
45Ω  
C
t
L
ro  
90%  
10%  
90%  
GND  
50%  
OUT+  
OUT-  
t
skew_o  
|tro-tri| Delay Due to Switch for Rising Input and Rising Output  
Signals.  
|tfo-tfi| Delay Due to Switch for Falling Input and Falling Output  
Signals.  
50%  
10%  
t
f0  
|tskew_0| Change in Skew through the Switch for Output Signals.  
|tskew_i| Change in Skew through the Switch for Input Signals.  
FIGURE 7B. TEST CIRCUIT  
FIGURE 7A. MEASUREMENT POINTS  
FIGURE 7. SKEW TEST  
FN6408.0  
January 24, 2007  
7
ISL54200  
Application Block Diagram  
3.3V  
µCONTROLLER  
V
DD  
ISL54200  
EN  
IN  
LOGIC CIRCUITRY  
VBUS  
D-  
USB  
4MΩ  
HIGH-SPEED  
TRANSCEIVER  
HSD1  
HSD2  
COMD1  
USB  
D+  
FSD1  
FSD2  
FULL-SPEED  
TRANSCEIVER  
COMD2  
GND  
GND  
PORTABLE MEDIA DEVICE  
were specifically designed to pass USB full-speed (12Mbps)  
differential signals and meet the USB 2.0 full-speed signal  
quality specifications. See eye diagram Figure 8.  
Detailed Description  
The ISL54200 device is a dual single pole/double throw  
(SPDT) analog switch that operates from a single DC power  
supply in the range of 2.7V to 5.5V. It was designed to  
function as dual 2-to-1 multiplexer to select between a USB  
high-speed transceiver and a USB full-speed transceiver in  
portable battery powered products. It is offered in a TDFN  
package and a small µTQFN package for use in MP3  
players, cameras, PDAs, cellphones, and other personal  
media players. The device has an enable pin to open all  
switches.  
The FSx switches can also pass USB high speed signals  
(480Mbps) but do not quite meet the USB 2.0 high speed  
signal quality eye diagram compliance requirement.  
The maximum signal range for the FSx switches is from  
-1.5V to V . The signal voltage should not be allowed to  
DD  
exceed the V  
than -1.5V.  
voltage rail or go below ground by more  
DD  
When operated with a 2.7V to 3.6V supply, the FSx switches  
are active (turned ON) whenever the IN logic control voltage  
is 0.5V and the EN logic voltage 1.4V.  
The part consist of two 7Ω full speed (FSx) switches and two  
4.5Ω high speed (HSx) switches. The FSx switches can  
swing from 0V to V . They were designed to pass USB full-  
DD  
speed (12Mbps) differential data signals with minimal  
distortion. The HSx switches have high bandwidth and low  
capacitance to pass USB high-speed (480Mbps) differential  
data signals with minimal edge and phase distortion.  
HSx Switches (HSD1, HSD2)  
The two HSx switches (HSD2, HSD1) are bidirectional  
switches that can pass rail-to-rail signals. When powered  
with a 3.3V supply these switches have a nominal r  
of  
(ON)  
The ISL54200 was designed for MP3 players, cameras,  
cellphones, and other personal media player applications  
that have both high-speed and full-speed transceivers and  
need to multiplex between these USB sources to a single  
USB host (computer). A typical application block diagram of  
this functionality is shown above.  
4.5Ω over the signal range of 0V to 400mV with a r  
flatness of 0.4Ω. The r  
HSD2 switches over this signal range is only 0.01Ω ensuring  
(ON)  
matching between the HSD1 and  
(ON)  
minimal impact by the switches to USB high speed signal  
transitions. As the signal level increases the r  
switch,  
(ON)  
resistance increases. At signal level of 3.3V the switch  
resistance is nominally 20Ω.  
A detailed description of the two types of switches are  
provided in the sections below.  
The HSx switches were specifically designed to pass USB  
2.0 high-speed (480Mbps) differential signals typically in the  
range of 0V to 400mV. They have low capacitance and high  
bandwidth to pass the USB high-speed signals with  
minimum edge and phase distortion to meet USB 2.0 high  
speed signal quality specifications. See high-speed eye  
diagrams Figures 9 and 10.  
FSx Switches (FSD1, FSD2)  
The two FSx switches (FSD1, FSD2) are bidirectional  
switches that can pass rail-to-rail signals. When powered  
with a 3.3V supply, these switches have a nominal r  
(ON)  
resistance of 7Ω over the signal range of 0V to 3.3V. They  
FN6408.0  
January 24, 2007  
8
ISL54200  
The HSx switches can also pass USB full-speed signals  
(12Mbps) with minimal distortion and meet all the USB  
requirements for USB 2.0 full-speed signaling. See full-  
speed eye diagram Figure 11.  
computer. The device will be able to transmit and receive  
data from the computer at a data rate of 12Mbps.  
High-speed Mode  
If the IN pin = Logic “1” and EN pin = Logic “1” the part will go  
into high-speed mode. In high-speed mode the HSD1 and  
HSD2 switches are ON and the FSD1 and FSD2 switches  
are OFF (high impedance). When a USB cable from a  
computer or USB hub is connected at the common USB  
connector and the part is in the high-speed mode a link will  
be established between the high-speed driver section of the  
media player and the computer. The device will be able to  
transmit and receive data from the computer at a data rate of  
480Mbps.  
The maximum signal range for the HSx switches is from  
-1.5V to V . The signal voltage should not be allow to  
DD  
exceed the V  
than -1.5V.  
voltage rail or go below ground by more  
DD  
The HSx switches are active (turned ON) whenever the IN  
voltage is 1.4V and the EN logic voltage 1.4V when  
operated with a 2.7V to 3.6V supply.  
ISL54200 Operation  
The discussion that follows will discuss using the ISL54200 in  
the typical application shown in the block diagram on page 9.  
All Switches OFF Mode  
If the IN pin = Logic “0” or Logic “1” and EN pin = Logic “0” all  
of the switches will turn OFF (high impedance).  
POWER  
The power supply connected at the VDD (pin 1) provides the  
DC bias voltage required by the ISL54200 part for proper  
operation. The ISL54200 can be operated with a VDD  
voltage in the range of 2.7V to 5.5V. When used in a USB  
application the VDD voltage should be kept in the range of  
3.0V to 5.5V to ensure you get the proper signal levels for  
good signal quality.  
The all OFF state can be used to switch between the two  
USB sections of the media player. When disconnecting from  
one USB device to the other USB device you can  
momentarily put the ISL54400 switch in the “all off” state in  
order to get the computer to disconnect from the one device  
so it can properly connect to the other USB device when that  
channel is turned ON.  
A 0.01µF or 0.1µF decoupling capacitor should be  
connected from the VDD pin to ground to filter out any power  
supply noise from entering the part. The capacitor should be  
located as close to the VDD pin as possible.  
LOGIC CONTROL  
The state of the ISL54200 device is determined by the  
voltage at the IN pin (pin 2) and the EN pin (pin 10). IN is  
only active when the EN pin is logic “1” (High). Refer to“Truth  
Table” on page 2.  
The EN pin is internally pulled low through a 4MΩ resistor to  
ground. For logic “0” (Low) it can be driven low or allowed to  
Float. The IN pin must be driven low or high and cannot be  
left floating.  
Logic control voltage levels:  
EN = Logic “0” (Low) when V  
0.5V or Floating.  
1.4V  
EN  
EN = Logic “1” (High) when V  
EN  
IN = Logic “0” (Low) when V 0.5V.  
IN  
IN = Logic “1” (High) when V 1.4V  
IN  
Full-speed Mode  
If the IN pin = Logic “0” and EN pin = Logic “1” the part will be  
in the full-speed mode. In this mode the FSD1 and FSD2  
switches are ON and the HSD1 and HSD2 switches are OFF  
(high impedance). In a typical application V  
will be in the  
DD  
range of 2.8V to 3.6V and will be connected to the battery or  
LDO of the portable media device. When a computer or USB  
hub is plugged into the common USB connector and the part  
is in the full-speed mode a link will be established between  
the full-speed driver section of the media player and the  
FN6408.0  
January 24, 2007  
9
ISL54200  
Typical Performance Curves T = +25°C, Unless Otherwise Specified  
A
V
= 3.3V  
DD  
TIME (10ns/DIV.)  
FIGURE 8. EYE PATTERN: 12MBPS USB SIGNAL WITH FSX SWITCHES IN THE SIGNAL PATH  
FN6408.0  
January 24, 2007  
10  
ISL54200  
Typical Performance Curves T = +25°C, Unless Otherwise Specified (Continued)  
A
V
= 3.3V  
DD  
TIME (0.2ns/DIV.)  
FIGURE 9. EYE PATTERN WITH FAREND MASK: 480MBPS USB SIGNAL WITH HSX SWITCHES IN THE SIGNAL PATH  
FN6408.0  
January 24, 2007  
11  
ISL54200  
Typical Performance Curves T = +25°C, Unless Otherwise Specified (Continued)  
A
V
= 3.3V  
DD  
TIME (0.2ns/DIV.)  
FIGURE 10. EYE PATTERN WITH NEAREND MASK: 480MBPS USB SIGNAL WITH HSX SWITCHES IN THE SIGNAL PATH  
FN6408.0  
January 24, 2007  
12  
ISL54200  
Typical Performance Curves T = +25°C, Unless Otherwise Specified (Continued)  
A
V
= 3.3V  
DD  
TIME (0.2ns/DIV.)  
FIGURE 11. EYE PATTERN: 12MBPS USB SIGNAL WITH HSX SWITCHES IN THE SIGNAL PATH  
-10  
6
R
= 45Ω  
= 0.2V  
L
V+ = 3.3V  
= 40mA  
-20  
-30  
-40  
V
to 2V  
P-P P-P  
IN  
I
COM  
5.5  
85°C  
5
-50  
25°C  
4.5  
-60  
-70  
4
3.5  
3
-80  
-90  
-40°C  
-110  
0
0.1  
0.2  
(V)  
0.3  
0.4  
0.001  
0.01  
0.1  
1
10  
100  
500  
V
FREQUENCY (MHz)  
COM  
FIGURE 12. HSx SWITCH ON RESISTANCE vs SWITCH  
VOLTAGE  
FIGURE 13. OFF-ISOLATION  
FN6408.0  
January 24, 2007  
13  
ISL54200  
Typical Performance Curves T = +25°C, Unless Otherwise Specified (Continued)  
A
-10  
Die Characteristics  
R
V
= 45Ω  
= 0.2V  
L
-20  
-30  
-40  
to 2V  
P-P  
IN  
P-P  
SUBSTRATE POTENTIAL (POWERED UP):  
GND (TDFN Paddle Connection: Tie to GND or Float)  
TRANSISTOR COUNT:  
-50  
-60  
98  
PROCESS:  
-70  
Submicron CMOS  
-80  
-90  
-110  
0.001  
0.01  
0.1  
1
10  
100  
500  
FREQUENCY (MHz)  
FIGURE 14. CROSSTALK  
FN6408.0  
January 24, 2007  
14  
ISL54200  
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)  
L10.2.1x1.6A  
D
A
B
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC  
PACKAGE  
6
MILLIMETERS  
INDEX AREA  
N
E
SYMBOL  
MIN  
0.45  
NOMINAL  
MAX  
0.55  
NOTES  
2X  
0.10 C  
A
A1  
A3  
b
0.50  
-
1
2
2X  
0.10 C  
-
-
0.05  
-
TOP VIEW  
0.127 REF  
-
0.15  
2.05  
1.55  
0.20  
0.25  
2.15  
1.65  
5
0.10 C  
0.05 C  
D
2.10  
-
C
A
E
1.60  
-
SEATING PLANE  
e
0.50 BSC  
-
A1  
k
0.20  
0.35  
-
0.40  
10  
4
-
-
SIDE VIEW  
L
0.45  
-
(DATUM A)  
N
2
PIN #1 ID  
Nd  
Ne  
θ
3
4xk  
1
2
NX L  
1
3
N
0
-
12  
4
(DATUM B)  
Rev. 3 6/06  
N-1  
NOTES:  
5
NX b  
e
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.  
2. N is the number of terminals.  
3. Nd and Ne refer to the number of terminals on D and E side,  
respectively.  
0.10 M C A B  
0.05 M C  
3
(ND-1) X e  
4. All dimensions are in millimeters. Angles are in degrees.  
5. Dimension b applies to the metallized terminal and is measured  
between 0.15mm and 0.30mm from the terminal tip.  
6. The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 identifier may be  
either a mold or mark feature.  
BOTTOM VIEW  
C
L
(A1)  
NX (b)  
L
5
7. Maximum package warpage is 0.05mm.  
e
8. Maximum allowable burrs is 0.076mm in all directions.  
9. Same as JEDEC MO-255UABD except:  
SECTION "C-C"  
TERMINAL TIP  
C C  
No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm  
"L" MAX dimension = 0.45 not 0.42mm.  
FOR ODD TERMINAL/SIDE  
10. For additional information, to assist with the PCB Land Pattern  
Design effort, see Intersil Technical Brief TB389.  
b
2.50  
1.75  
0.05 MIN  
L
2.00  
0.80  
0.275  
0.10 MIN  
0.25  
0.50  
DETAIL “A” PIN 1 ID  
10  
LAND PATTERN  
FN6408.0  
January 24, 2007  
15  
ISL54200  
Thin Dual Flat No-Lead Plastic Package (TDFN)  
L10.3x3A  
2X  
0.10 C  
A
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE  
A
D
MILLIMETERS  
2X  
0.10  
C B  
SYMBOL  
MIN  
0.70  
-
NOMINAL  
MAX  
0.80  
0.05  
NOTES  
A
A1  
A3  
b
0.75  
-
-
0.20 REF  
0.25  
3.0  
-
E
-
6
INDEX  
AREA  
0.20  
2.95  
2.25  
2.95  
1.45  
0.30  
3.05  
2.35  
3.05  
1.55  
5, 8  
D
-
TOP VIEW  
B
A
D2  
E
2.30  
3.0  
7, 8  
-
// 0.10  
0.08  
C
E2  
e
1.50  
0.50 BSC  
-
7, 8  
-
C
k
0.25  
0.25  
-
-
A3  
C
SIDE VIEW  
L
0.30  
10  
0.35  
8
SEATING  
PLANE  
N
2
D2  
D2/2  
2
Nd  
5
3
7
8
(DATUM B)  
Rev. 3 3/06  
NOTES:  
1
6
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.  
2. N is the number of terminals.  
INDEX  
AREA  
NX k  
E2  
3. Nd refers to the number of terminals on D.  
(DATUM A)  
4. All dimensions are in millimeters. Angles are in degrees.  
E2/2  
5. Dimension b applies to the metallized terminal and is measured  
between 0.15mm and 0.30mm from the terminal tip.  
NX L  
6. The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 identifier may be  
either a mold or mark feature.  
N
N-1  
NX b  
5
8
e
7. Dimensions D2 and E2 are for the exposed pads which provide  
improved electrical and thermal performance.  
(Nd-1)Xe  
REF.  
M
0.10  
C A B  
8. Nominal dimensions are provided to assist with PCB Land  
Pattern Design efforts, see Intersil Technical Brief TB389.  
BOTTOM VIEW  
C
L
9. Compliant to JEDEC MO-229-WEED-3 except for D2  
dimensions.  
(A1)  
NX (b)  
L1  
L
9
5
e
SECTION "C-C"  
TERMINAL TIP  
FOR ODD TERMINAL/SIDE  
C C  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN6408.0  
January 24, 2007  
16  

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