HSP43891/883 [INTERSIL]

Digital Filter; 数字滤波器
HSP43891/883
型号: HSP43891/883
厂家: Intersil    Intersil
描述:

Digital Filter
数字滤波器

文件: 总7页 (文件大小:154K)
中文:  中文翻译
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HSP43891/883  
TM  
Data Sheet  
May 1999  
FN2451.4  
Digital Filter  
Features  
The HSP43891/883 is a video-speed Digital Filter (DF)  
designed to efficiently implement vector operations such as  
FIR digital filters. It is comprised of eight filter cells cascaded  
internally and a shift and add output stage, all in a single  
integrated circuit. Each filter cell contains a 9 x 9 two’s  
complement multiplier, three decimation registers and a 26-  
bit accumulator. The output stage contains an additional 26-  
bit accumulator which can add the contents of any filter cell  
accumulator to the output stage accumulator shifted right by  
8-bits. The HSP43891/883 has a maximum sample rate of  
25.6MHz. The effective multiply-accumulate (mac) rate is  
204MHz.  
• This Circuit is Processed in Accordance to MIL-STD-883  
and is Fully Conformant Under the Provisions of  
Paragraph 1.2.1.  
• 0MHz to 25.6MHz Sample Rate  
• Eight Filter Cells  
• 9-Bit Coefficients and Signal Data  
• Low Power CMOS Operation  
- ICCSB = 500µA Maximum  
- ICCOP = 160µA Maximum at 20MHz  
• 26-Bit Accumulator per Stage  
• Filter Lengths Up to 1032 Taps  
The HSP43891/883 DF can be configured to process  
expanded coefficient and word sizes. Multiple DFs can be  
cascaded for larger filter lengths without degrading the  
sample rate or a single DF can process larger filter lengths  
at less than 25.6MHz with multiple passes. The architecture  
permits processing filter lengths of over 1000 taps with the  
guarantee of no overflows. In practice, most filter coefficients  
are less than 1.0, making even larger filter lengths possible.  
The DF provides for 8-bit unsigned or 9-bit two’s  
• Expandable Coefficient Size, Data Size and Filter Length  
• Decimation by 2, 3 or 4  
Applications  
• 1-D and 2-D FIR Filters  
• Radar/Sonar  
• Digital Video  
complement arithmetic, independently selectable for  
coefficients and signal data.  
• Adaptive Filters  
• Echo Cancellation  
• Complex Multiply-Add  
• Sample Rate Converter  
Ordering Information  
Each DF filter cell contains three re-sampling or decimation  
registers which permit output sample rate reduction at rates  
1
1
1
of / , / or / the input sample rate. These registers also  
2
3
4
provide the capability to perform 2-D operations such as  
matrix multiplication and N x N spatial  
correlations/convolutions for image processing applications.  
TEMP.  
RANGE ( C)  
PKG.  
NO.  
o
PART NUMBER  
HSP43891GM-20/883  
HSP43891GM-25/883  
PACKAGE  
-55 to 125 85 Ld PGA  
-55 to 125 85 Ld PGA  
G85.A  
G85.A  
Block Diagram  
V
V
SS  
CC  
DIN0 - DIN8  
9
DIENB  
CIENB  
5
DCM0 - 1  
ERASE  
DF  
FILTER  
CELL 0  
DF  
FILTER  
CELL 1  
DF  
FILTER  
CELL 2  
DF  
FILTER  
CELL 3  
DF  
FILTER  
CELL 4  
DF  
FILTER  
CELL 5  
DF  
FILTER  
CELL 6  
DF  
FILTER  
CELL 7  
9
9
9
9
9
9
9
9
9
CIN0 - 8  
COUT0 - 8  
COENB  
RESET  
CLK  
26  
26  
26  
26  
26  
26  
26  
5
5
26  
3
ADR0 - 2  
MUX  
26  
RESET  
CLK  
ADR0, ADR1, ADR2  
2
OUTPUT  
STAGE  
SHADD  
SENBL  
SENBH  
2
26  
SUM0 - 25  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc.  
Copyright © Intersil Americas Inc. 2002. All Rights Reserved  
1
HSP43891/883  
Pinouts  
HSP43891/883 85 PIN (PGA)  
TOP VIEW, PINS DOWN  
1
2
3
4
5
6
7
8
9
10  
11  
A
B
C
D
E
V
COENB  
V
RESET  
DIN7  
TCS  
DIN6  
DIN1  
DIN3  
DIN2  
DIN0  
CIENB  
TCCI  
CIN7  
V
V
SS  
SS  
CC  
CC  
CC  
V
COUT7 COUT8 ERASE  
ALIGN  
CIN6  
CIN4  
CIN3  
DIENB  
COUT5 COUT6  
DIN5  
DIN4  
CIN5  
CIN2  
CIN0  
PIN  
V
COUT3 COUT4  
CC  
SENBL  
COUT1  
COUT2  
V
CIN1  
SS  
V
V
V
F
COUT0 SHADD  
CC  
SS  
SS  
SUM0  
SUM1  
G
ADR2  
ADR1  
DCM0  
ADR0  
CLK  
SUM3  
SUM5  
SUM7  
SUM8  
SUM2  
SUM4  
H
J
V
V
SUM25  
SUM24  
SUM20 SUM17 SUM16  
SS  
CC  
K
SENBH  
V
SUM19  
SUM15 SUM12 SUM10  
SUM6  
SUM9  
V
V
SS  
CC  
SS  
L
DCM1 SUM23 SUM22 SUM21 SUM18 SUM14  
SUM13  
SUM11  
V
V
SS  
CC  
2
HSP43891/883  
Pinouts (Continued)  
HSP43891/883, 85 PIN (PGA)  
, PINS UP  
1
2
3
4
5
6
7
8
9
10  
11  
L
DCM1 SUM23 SUM22 SUM21 SUM18 SUM14  
SUM13  
SUM11 SUM9  
V
V
SS  
CC  
K
SENBH SUM24  
SUM19  
SUM15 SUM12 SUM10 SUM8  
SUM6  
V
V
V
SS  
SS  
CC  
J
V
SUM25  
ADR0  
DCM0  
SUM20 SUM17 SUM16  
SUM7  
SUM5  
SUM3  
V
CC  
SS  
H
ADR1  
ADR2  
SUM4  
SUM2  
G
F
CLK  
SUM1  
SUM0  
CIN1  
V
COUT0 SHADD  
V
V
SS  
CC  
SS  
E
D
COUT1  
COUT2  
V
CIN0  
CIN2  
SENBL  
SS  
V
COUT3 COUT4  
COUT5 COUT6  
CC  
C
B
ALIGN  
PIN  
DIENB  
DIN5  
DIN4  
CIN5  
CIN6  
CIN3  
CIN4  
COUT7 COUT8 ERASE DIN8  
DIN1  
DIN6  
DIN2  
DIN3  
CIENB  
DIN0  
CIN7  
CIN8  
V
CC  
A
COENB  
V
DIN7  
V
V
V
RESET  
SS  
CC  
CC  
SS  
3
HSP43891/883  
Absolute Maximum Ratings  
Thermal Information  
o
o
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.0V  
Input/Output Voltage . . . . . . . . . . . . . . . . .GND -0.5V to V +0.5V  
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1  
Thermal Resistance (Typical, Note 1)  
θ
( C/W)  
θ
( C/W)  
JA  
36.0  
JC  
CC  
Ceramic PGA Package . . . . . . . . . . . .  
Maximum Package Power Dissipation at 125 C  
7.0  
o
Ceramic PGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.44W  
o
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . .175 C  
Operating Conditions  
o
o
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C  
o
o
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V  
o
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300 C  
Die Characteristics  
Number of Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17,762  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
1. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS  
Devices Guaranteed and 100% Tested  
GROUP A  
SUBGROUPS  
TEMPERATURE  
o
PARAMETER  
Logical One Input Voltage  
Logical Zero Input Voltage  
Output HIGH Voltage  
SYMBOL  
CONDITIONS  
= 5.5V  
( C)  
MIN  
2.2  
-
MAX  
UNITS  
V
V
V
1, 2, 3  
1, 2, 3  
1, 2, 3  
-55 T 125  
-
0.8  
-
V
V
V
IH  
CC  
A
V
= 4.5V  
-55 T 125  
A
IL  
CC  
V
I
= 400µA  
-55 T 125  
2.6  
OH  
OH  
A
V
= 4.5V (Note 2)  
CC  
Output LOW Voltage  
Input Leakage Current  
Output Leakage Current  
V
I
V
= +2.0mA  
1, 2, 3  
1, 2, 3  
1, 2, 3  
-55 T 125  
-
0.4  
+10  
+10  
V
OL  
OL  
A
= 4.5V (Note 2)  
CC  
I
V
V
= V  
or GND  
-55 T 125  
-10  
-10  
µA  
µA  
I
IN  
CC  
= 5.5V  
A
CC  
I
V
V
= V  
CC  
or GND  
-55 T 125  
A
O
OUT  
= 5.5V  
= 5.5V  
= 4.5V  
CC  
CC  
CC  
Clock Input High  
Clock Input Low  
V
V
V
1, 2, 3  
1, 2, 3  
1, 2, 3  
-55 T 125  
3.0  
-
V
V
IHC  
A
V
-55 T 125  
-
-
0.8  
500  
ILC  
A
Standby Power Supply  
Current  
I
V
V
= V  
or GND  
-55 T 125  
µA  
CCSB  
IN  
CC  
A
= 5.5V,  
CC  
Outputs Open  
Operating Power Supply  
Current  
I
f = 20.0MHz  
1, 2, 3  
7, 8  
-55 T 125  
-
-
160.0  
-
mA  
CCOP  
FT  
A
V
= 5.5V, (Note 3)  
CC  
Functional Test  
NOTES:  
(Note 4)  
-55 T 125  
A
2. Interchanging of force and sense conditions is permitted.  
3. Operating Supply Current is proportional to frequency, typical rating is 8mA/MHz.  
4. Tested as follows: f = 1MHz, V = 2.6, V = 0.4, V 1.5V, V 1.5V, V = 3.4V, and V  
= 0.4V.  
IH IL OL ILC  
OH  
IHC  
4
HSP43891/883  
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS  
Device Guaranteed and 100% Tested  
-20 (20MHz)  
-25 (25.6MHz)  
GROUP A  
SUBGROUPS  
o
PARAMETER  
Clock Period  
SYMBOL  
NOTES  
Note 5  
TEMP ( C)  
MIN  
50  
20  
20  
20  
0
MAX  
MIN  
39  
16  
16  
17  
0
MAX  
UNITS  
ns  
t
t
t
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
-55 T 125  
-
-
-
ns  
-
CP  
CL  
CH  
A
Clock Low  
Clock High  
Input Setup  
Input Hold  
Note 5  
Note 5  
Note 5  
Note 5  
Note 5  
-55 T 125  
ns  
A
-55 T 125  
-
ns  
A
t
-55 T 125  
-
-
ns  
IS  
IH  
A
t
-55 T 125  
-
-
ns  
A
CLK to Coefficient  
Output Delay  
t
-55 T 125  
-
24  
-
20  
ns  
ODC  
A
Output Enable Delay  
t
t
Note 5  
Note 5  
9, 10, 11  
9, 10, 11  
-55 T 125  
-
-
20  
31  
-
-
15  
25  
ns  
ns  
OED  
ODS  
A
CLK to SUM Output  
Delay  
-55 T 125  
A
NOTE:  
5. AC Testing: V  
= 4.5V and 5.5V. Inputs are driven at 3.0V for a Logic”1” and 0.0V for a Logic “0”. Input and output timing measurements are  
CC  
made at 1.5V for both a Logic “1” and “0”. CLK is driven at 4.0V and 0V and measured at 2.0V.  
TABLE 3. AC ELECTRICAL PERFORMANCE CHARACTERISTICS  
-20 (20MHz)  
-25 (25.6MHz)  
TEST  
CONDITIONS  
o
PARAMETER  
Input Capacitance  
Output Capacitance  
SYMBOL  
NOTES  
TEMP ( C)  
MIN  
MAX  
15  
MIN  
MAX  
15  
UNITS  
pF  
o
C
V
= Open, f = 1MHz  
All measurements are  
referenced to device GND  
1
1
T
= 25 C  
-
-
-
-
IN  
CC  
A
o
C
T
= 25 C  
15  
15  
pF  
OUT  
ODD  
A
Output Disable Delay  
Output Rise Time  
Output Fall Time  
NOTES:  
t
1, 2  
1, 2  
1, 2  
-55 T 125  
-
-
-
20  
7
-
-
-
15  
6
ns  
ns  
ns  
A
t
-55 T 125  
A
OR  
OF  
t
-55 T 125  
7
6
A
6. The parameters listed in Table 3 are controlled via design or process parameters and are not directly tested. These parameters are  
characterized upon initial design and after major process and/or design changes.  
7. Loading is as specified in the test load circuit, C = 40pF.  
L
TABLE 4. APPLICABLE SUBGROUPS  
CONFORMANCE  
GROUPS  
METHOD  
100%/5004  
100%/5004  
100%  
SUBGROUPS  
Initial Test  
-
Interim Test  
PDA  
-
1
Final Test  
Group A  
100%  
2, 3, 8A, 8B, 10, 11  
1, 2, 3, 7, 8A, 8B, 9, 10, 11  
1, 7, 9  
-
Groups C and D  
Samples/5005  
5
HSP43891/883  
Burn-In Circuit  
HSP43891/883  
BOTTOM VIEW, PINS UP  
1
2
3
4
5
6
7
8
9
10  
11  
L
DCM1 SUM23 SUM22 SUM21 SUM18 SUM14  
SUM13  
SUM11 SUM9  
V
V
SS  
CC  
K
SENBH SUM24  
SUM19  
SUM15 SUM12 SUM10 SUM8  
SUM6  
V
V
V
SS  
SS  
CC  
J
V
SUM25  
ADR0  
DCM0  
SUM20 SUM17 SUM16  
SUM7  
SUM5  
SUM3  
V
CC  
SS  
H
ADR1  
ADR2  
SUM4  
SUM2  
G
F
CLK  
SUM1  
SUM0  
CIN1  
V
COUT0 SHADD  
V
V
SS  
CC  
SS  
E
D
COUT1  
COUT2  
V
CIN0  
CIN2  
SENBL  
SS  
V
COUT3 COUT4  
COUT5 COUT6  
CC  
C
B
ALIGN  
PIN  
DIENB  
DIN5  
DIN4  
CIN5  
CIN6  
CIN3  
CIN4  
COUT7 COUT8 ERASE TCS  
DIN1  
DIN6  
DIN2  
DIN3  
CIENB  
DIN0  
CIN7  
CIN8  
V
CC  
A
COENB  
DIN7  
V
V
RESET  
V
V
SS  
SS  
CC  
CC  
6
HSP43891/883  
S
BURN-IN SIGNALS  
PGA  
PIN  
PIN  
NAME  
BURN-IN  
SIGNAL  
PGA  
PIN  
PIN  
NAME  
BURN-IN  
SIGNAL  
PGA  
PIN  
PIN  
NAME  
BURN-IN  
SIGNAL  
PGA  
PIN  
PIN  
NAME  
BURN-IN  
SIGNAL  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
A10  
A11  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
B9  
V
GND  
F10  
C1  
C2  
COUT5  
COUT6  
ALIGN  
DIENB  
DIN5  
V
V
/2  
/2  
F10  
F11  
G1  
G2  
G3  
G9  
G10  
G11  
H1  
H2  
H10  
H11  
J1  
V
V
K4  
K5  
K6  
K7  
K8  
K9  
K10  
K11  
L1  
V
V
CC  
SS  
CC  
CC  
CC  
CC  
COENB  
V
GND  
F2  
SUM19  
V
/2  
CC  
SS  
CC  
V
V
C3  
NC  
ADR2  
DCM0  
CLK  
V
SS  
GND  
CC  
CC  
RESET  
DIN7  
F11  
F8  
F6  
F3  
F0  
F8  
C5  
F10  
F5  
F4  
F5  
F3  
F5  
SUM15  
SUM12  
SUM10  
SUM8  
V
/2  
CC  
CC  
CC  
CC  
C6  
F0  
V
V
V
V
/2  
/2  
/2  
/2  
DIN6  
C7  
DIN4  
SUM1  
SUM3  
SUM2  
ADR1  
ADR0  
SUM5  
SUM4  
V
/2  
CC  
CC  
DIN3  
C10  
C11  
D1  
CIN5  
V
V
/2  
/2  
DIN0  
CIN3  
SUM6  
CC  
F1  
CC  
F6  
CIN8/TCCI  
COUT3  
COUT4  
CIN2  
V
/2  
DCM1  
CC  
V
V
V
V
D2  
V
/2  
F0  
L2  
SUM23  
SUM22  
SUM21  
SUM18  
SUM14  
V
V
V
V
V
/2  
/2  
/2  
/2  
/2  
CC  
SS  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
GND  
D10  
D11  
E1  
F2  
V
V
/2  
/2  
L3  
CC  
CC  
V
V
V
CC  
L4  
CC  
CC  
COUT7  
COUT8/TCC0  
ERASE  
DIN8/TCS  
DIN1  
V
/2  
COUT1  
V
/2  
V
V
CC  
L5  
CC  
CC  
CC  
CC  
V
/2  
E2  
V
GND  
J2  
SUM25  
SUM20  
SUM17  
SUM16  
SUM7  
V
V
V
V
V
/2  
/2  
/2  
/2  
/2  
L6  
SS  
CC  
CC  
CC  
CC  
CC  
F10  
F7  
E3  
COUT2  
CIN1  
V
/2  
J5  
L7  
V
V
CC  
CC  
CC  
E9  
F1  
J6  
L8  
SUM13  
V
/2  
CC  
F1  
E10  
E11  
F1  
CIN0  
F0  
J7  
L9  
V
GND  
SS  
DIN2  
F2  
SENBL  
F10  
GND  
J10  
J11  
K1  
L10  
L11  
SUM11  
SUM9  
V
/2  
CC  
CIENB  
F10  
F7  
V
V
GND  
F10  
V
/2  
SS  
SS  
CC  
CIN7  
F2  
COUT0  
SHADD  
SUM0  
V
/2  
SENBH  
SUM24  
CC  
B10 CIN6  
B11 CIN4  
F6  
F3  
F9  
K2  
V
/2  
CC  
F4  
F9  
V
/2  
K3  
V
GND  
CC  
SS  
NOTES:  
8. V /2 (2.7 ±10%) used for outputs only.  
CC  
9. 47k(±20%) resistor connected to all pins except V  
and GND.  
CC  
10. V  
= 5.5V ±0.5V.  
11. 0.1µF (minimum) capacitor between V  
CC  
and GND per position.  
CC  
12. F0 = 100kHz ±10%, F1 = F0/2, F2 = F1/2..., F11 = F10/2, 40% - 60% duty cycle.  
13. Input voltage limits: V = 0.8V maximum, V = 4.5V ±10%.  
IL  
IH  
Metallization Topology  
DIE DIMENSIONS:  
GLASSIVATION  
328 mils x 283 mils x ±1 mil  
Type: Nitrox  
Silox Thickness: 10kÅ  
METALLIZATION:  
WORST CASE CURRENT DENSITY:  
Type: Si - Al or Si-AI-Cu  
Thickness: 8kÅ  
5
2
1.2 x 10 A/cm  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
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