HIP5500 [INTERSIL]
High Voltage IC Half Bridge Gate Driver; 高电压IC半桥栅极驱动器
| 型号： | HIP5500 |
| 厂家： | 
Intersil |
| 描述： | High Voltage IC Half Bridge Gate Driver |
| 文件： | 总12页 (文件大小：910K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HIP5500
®
July 1998
File Number 3210.3
Features
High Voltage IC Half Bridge Gate Driver
• 500V Maximum Rating
The HIP5500, a high voltage integrated circuit (HVIC) half-
bridge gate driver for standard power MOSFETs, IGBTs,
and the new Intersil Buffered MOSFET (RFV10N50BE), can
be employed in a wide variety of switching regulator circuits.
• 2A Peak Gate Drive
• Ability to Interface and Drive N-Channel Power
Devices With Complimentary Outputs For Buffered
FETs
The HIP5500 combines the functionality and flexibility of a
PWM IC with the convenience of a high voltage half-bridge
driver optimized for power supply inverters. It can be used
either open-loop or in closed-loop fashion using the SS input
for controlling the output waveform duty-cycle.
• Fault Output, Overcurrent Detection and Undervoltage
Holdoff
• Over 600kHz Sawtooth Oscillator Frequency
• Adjustable Deadtime Control
The HIP5500 incorporates a precision oscillator, adjustable
using an external resistor and capacitor. The resistor sets
the capacitor charging current and the capacitor sets the
integration time of a triangle wave. Another resistor
connected to the DIS pin adjusts the dead-time and can be
tailored to the application. The oscillator switches at twice
the output waveform fundamental frequency. The result is an
output waveform whose positive and negative half-cycles
are near perfect balance (volt-second equalization).
• Soft-Start Capability
• Low Current Standby State
• Sleep Mode Reduces Bias Current When Not Enabled
Applications
• Switching and Distributed Power Supplies
• Electronic Lighting Supplies
Short-Detect (SD) and Soft-Start (SS) inputs provide
alternative means for limiting and regulating respectively the
half-bridge output voltage. A capacitor on the SS input will
begin charging up once the EN input is made high and
causes the duty cycle of each half-cycle to “ramp” the duty
cycle of the output waveform.
Ordering Information
The SD input can sense a signal proportional to current,
providing a means of shortening the conduction periods
below that imposed by the SS input.
PART
NUMBER
TEMPERATURE
RANGE
PACKAGE
o
o
HIP5500IP
HIP5500IB
-40 C to +85 C
20 Lead Plastic DIP
Other circuits within the HIP5500 “match” upper and lower
turn-on and turn-off propagation times in order to minimize
flux imbalances when driving output transformer loads.
o
o
-40 C to +85 C
20 Lead Plastic
SOIC (W)
Pinout
HIP5500 (PDIP, SOIC)
TOP VIEW
1
2
3
4
5
6
7
8
9
HO
HO
NC
20
19
18
R
T
DIS
NC
V
B
17 V
S
C
T
16 NC
SD
FLT
SS
15
14
13
12
NC
GND
V
CC
EN
LO
OSC 10
11 LO
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
1
HIP5500
Typical Application Block Diagram
POWER
TRANSFORMER
+
LOAD
HO
OSC
FLT
SD
HO
HO
HO
TO
BUFFERED
FETs
BUFFERED
FETs
+
V
B
EN
500VDC
DIS
V
S
C
V
R
T
LO
LO
LO
LO
CC
T
TO
BUFFERED
FETs
SS
GND
+
15VDC
-
Functional Block Diagram
V
CC
FLT
NOR
LATCH
V
B
SD
V
CC
V
CC
V
B
UV
OSC
V
CC
V
S
BUFFER
HO
HO
LEVEL
SHIFT
UPPER
DRIVE
R
C
T
T
OSCILLATOR
V
CC
V
S
DFF
D
Q
CK QN
DIS
LO
LO
LOWER
DRIVE
V
CC
CURRENT
SOURCE
GND
EN
UV
SS
V
CC
2
HIP5500
Absolute Maximum Ratings
Thermal Information
Offset Supply Voltage, V . . . . . . . . . . . . . . . . . . . . .-V
to +500V
Floating Supply Voltage (V to V ) . . . . . . . . . . . . . . -0.3V to +18V
Thermal Resistance
Plastic DIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 C/W
Plastic SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . 80 C/W
θ
JA
S
BS
o
B
S
o
High Side Channel Output Voltage, V , V
. V -0.5 to V +0.5
HO NHO
S
B
Fixed Supply Voltage, V
. . . . . . . . . . . . . . . . . . . . -0.5V to +18V
See Maximum Power Dissipation vs Temperature Curve Figure 21
CC
Low Side Channel Output Voltage . . . . . . . . . . . -0.5V to V
All Other Pin Voltages
+0.5V
CC
(SD, R , C , DIS, SS, EN and FLT). . . . . . . . . -0.5V to V
Storage Temperature Range . . . . . . . . . . . . . . . . . -40 C to +150 C
Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +125 C
Lead Temperature (Soldering 10s). . . . . . . . . . . . . . . . . . . . +300 C
+0.5V
o
T
T
CC
o
o
o
(SOIC - Lead Tips Only)
Offset Supply Maximum dv/dt, dV /dt . . . . . . . . . . . . . . . . . . 50V/ns
S
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
o
o
Recommended Operating Conditions (T = -40 C to +125 C Unless Otherwise Noted, All Voltages Referenced to V
)
J
SS
Discharge Time Constant . . . . . . . . . . . . . . . . . . . . . . . . . 100ns Min
Discharge Resistor Range, R . . . . . . . . . . . . . . . . . 1kΩ to 50kΩ
Offset Supply Voltage, V . . . . . . . . . . . . . . . . . . . . -2.0V to +500V
S
Floating Supply Voltage, V
(V to V ) . . . . . . . . . . +10V to +15V
BS
B S
DIS
Charging Resistor Range, R . . . . . . . . . . . . . . . . . .6.8kΩ to 400kΩ
Oscillator Capacitor Range, C . . . . . . . . . . . . . . . . . 100pF to 0.1µF
Oscillator Frequency Range . . . . . . . . . . . . . . . . . . . . . 300kHz Max
Oscillator Capacitor Charge Current Range, I
High Side Channel Output Voltage, V ,V
. . . . . . . 0V to V
BS
HO NHO
. . . . . . . . . . . . . . . . . . . . +10V to +15V
T
Fixed Supply Voltage, V
CC
Low Side Channel Output Voltage, V ,V
T
. . . . . . . . . 0V to V
LO NLO
All Other Pin Voltages (SD, R , C , DIS, SS, FLT and EN) 0V to V
CC
CC
. . . . .21µA to 5mA
T
T
R
T
Electrical Specifications
V
= V = +15V, V = GND = 0V, Unless Otherwise Specified
CC BS S
o
T
= -40 C
J
o
o
T
= +25 C
TO +125 C
J
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
-
TYP
5.5
300
0.4
2.0
110
7.8
2
MAX
7.0
400
3.0
3.5
145
8.5
-
MIN
-
MAX
8.0
435
-
UNITS
mA
µA
µA
mA
µA
V
Quiescent V
CC
Current
I
QCC
Quiescent V Current
BS
I
-
-
QBS
Quiescent Leakage Current
I
(V - GND) = 5.0V
-
-
LK
S
Standby V
Current
I
R
1
= 0
T
-
-
5.0
160
8.6
-
CC
STBY
2
SS Current Source
I
/ V
< V
SFT
<
/ V
3 CC
70
7.5
-
60
7.4
-
SFT/PWM
3
CC
Input Threshold
V
Low to High Transition
EN
EN-HYS
Input Hysteresis
V
V
Undervoltage Threshold
Undervoltage Threshold
Undervoltage Hysteresis
Short Detect Threshold
V
High to Low Transition
Low to High Transition
7.7
7.9
0.08
3.5
0.9
8.6
8.8
0.3
4.0
1
9.5
9.7
0.7
4.5
1.1
7.4
7.6
0.05
3.4
0.85
9.6
9.8
0.75
4.6
1.15
V
UVHL
V
V
UVLH
V
V
UVHYS
V
V
THSD
C /R Current Ratio
I
I
R
V
= 100µA,
µA
T
T
CTRAT
T
2
/3 < V
<
/ V
CC
CC
CT
3
HO, LO Peak Output Current
HO, LO Peak Output Current
LO, HO Peak Output Current
LO, HO Peak Output Current
I
+
Sourcing, LO, HO = GND
1.5
1.5
1.95
2.0
-
-
-
-
1.0
1.0
-
-
-
-
A
A
OUT
I
-
Sinking, LO, HO = V
= V
BS
OUT
CC
I
+
Sourcing, LO, HO = Vss
170
170
250
230
110
110
mA
mA
BUF
I
-
Sinking, LO, HO = V
CC
= V
BS
BUF
3
HIP5500
Electrical Specifications
V
= V = +15V, V = GND = 0V, Unless Otherwise Specified (Continued)
CC
BS
S
o
T
= -40 C
J
o
o
T
= +25 C
TO +125 C
J
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
7.5
7.2
9.8
5.0
4.5
TYP
7.8
MAX
8.1
MIN
7.4
7.1
9.7
4.9
4.4
MAX
8.2
UNITS
Soft-Start V
Soft-Start V
, Low to High
, High to Low
V SSHL
C
C
= 7.5V
V
V
V
V
V
THRESH
T
T
T
V SSLH
7.5
7.8
7.9
THRESH
T
OSC Input Upper Threshold
OSC Input Upper Threshold
V CTLH
10.4
5.6
11.0
6.2
11.1
6.3
T
V CTHL
T
to DIS
Oscillator Upper to Lower
Threshold Difference
VCTDIF
V CTLH - V CTHL
4.8
5.1
5.2
T
T
OSC_OUT R ON, Sinking
DS
OSCR
L
I
I
I
I
= -50mA
= 50mA
5
8.5
19
12
30
2
9
17
40
Ω
Ω
Ω
Ω
DS
OSC_OUT
OSC_OUT R ON, Sourcing
DS
OSCR H
14
D
OSC_OUT
DIS Output On Resistance
FLT Output On Resistance
R
DIS
DS
= 10mA
75
115
165
150
230
-
200
320
DIS
FLT
R
FLT
DS
= 5mA
100
40
Dynamic Electrical Specifications
V
= V = +15V, GND = 0V, Unless Otherwise Specified
BS
CC
T
J
= -40oC
TO +125 C
o
o
T
= +25 C
J
PARAMETER
SYMBOL
TEST CONDITIONS
= 2000pF
MIN
TYP
-
MAX
50
MIN
MAX
UNITS
ns
Turn-On Rise Time, HO, LO
Turn-Off Fall Time, HO, LO
Turn-On Rise Time, HO, LO
Turn-Off Fall Time, HO, LO
t
C
C
C
C
C
-
-
-
-
-
-
-
-
-
-
-
DR
L
t
= 2000pF
-
50
-
ns
DF
L
t
= 200pF
= 200pF
25
25
475
35
-
-
ns
DNR
BUF
BUF
t
35
ns
DNF
C
C
Fall to LO/HO Rise
Rise to LO/HO Fall
T CTLH
= V CTHL
700
925
ns
T
T
P
T
T
LO/HO LOAD = 200pF
T CTHL
P
C
= V CTLH
-
475
700
-
925
ns
T
T
LO/HO LOAD = 200pF
LO-HO Prop Delay Mismatch
Delmatch
T CTLH and T CTHL
-
-
-
-
-
-
60
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
P
P
C
C
Rise to DIS Fall
Fall to DIS Rise
T CTDISHL
C
= V CTHL
300
600
200
425
500
450
800
-
475
825
-
T
T
P
T
T
T
T CTDISLH
C
= V CTLH
P
T
Minimum Dead Time
t
DTMIN
Short Detect Propagation Delay
t
SD = V
, LO/HO = 200pF
THSD
850
750
1100
775
SDLO/HO
Soft-Start Propagation Delay
Time
t
SS = V SSLH, LO/HO =
T
200pF
SSDLY
4
HIP5500
o
Typical Performance Curves All Curves are V = +15V, T = +25 C, Unless Otherwise Specified
CC
A
100.0
50
6.4
6.2
6.0
5.8
5.6
5.4
5.2
5.0
4.8
4.6
4.4
4.2
4.0
3.8
3.6
3.4
20
10.0
5
V
= 15V
CC
2
1.0
0.5
0.2
0.1
0.05
V
V
= 12V
= 10V
CC
0.02
0.01
0.005
CC
-40
-20
0
+20
+40
+60
+80 +100 +120
o
-40
-20
0
+20
+40
+60
+80 +100 +120
TEMPERATURE ( C)
o
TEMPERATURE ( C)
FIGURE 1. OFFSET SUPPLY LEAKAGE CURRENT vs
TEMPERATURE AT 300VDC
FIGURE 2. QUIESCENT V
CURRENT vs TEMPERATURE
CC
SUPPLY VOLTAGE
AND V
CC
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
325
V
= 15V
BS
V
V
= 15V
= 12V
CC
CC
275
225
175
125
V
= 12V
BS
V
= 10V
0
BS
V
= 10V
+20
CC
-40
-20
0
+40
+60
o
+80
+100
+120
-40
-20
+20
+40
+60
o
+80 +100 +120
TEMPERATURE ( C)
TEMPERATURE ( C)
FIGURE 3. QUIESCENT FLOATING BIAS SUPPLY CURRENT
vs TEMPERATURE AND V SUPPLY VOLTAGE
FIGURE 4. QUIESCENT STANDBY CURRENT vs
TEMPERATURE AND V SUPPLY VOLTAGE
BS
CC
65
60
55
50
45
40
35
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
V
V
V
= 10V
= 12V
= 15V
CC
CC
CC
V
= 15V
CC
V
V
V
= 10V
= 12V
= 15V
CC
CC
CC
V
V
= 12V
= 10V
CC
CC
-40
-20
0
+20
+40
+60
+80
+100 +120
-40
-20
0
+20
+40
+60
o
+80 +100 +120
o
TEMPERATURE ( C)
TEMPERATURE ( C)
FIGURE 6. ENABLE/DISABLE HYSTERESIS VOLTAGE
TEMPERATURE AND V SUPPLY VOLTAGE
FIGURE 5. ENABLE/DISABLE THRESHOLD (PERCENT V
)
CC
SUPPLY VOLTAGE
vs TEMPERATURE AND V
CC
CC
5
HIP5500
o
Typical Performance Curves All Curves are V = +15V, T = +25 C, Unless Otherwise Specified (Continued)
CC
A
120
110
100
90
1.9
V
V
V
= 10V
= 12V
= 15V
1.7
1.5
1.3
1.1
0.9
0.7
0.5
CC
CC
CC
V
V
V
= 15V
= 12V
= 10V
CC
CC
CC
80
-40
-40
-20
0
+20
+40
+60
o
+80
+100 +120
-20
0
+20
+40
+60
+80
+100 +120
TEMPERATURE ( C)
o
TEMPERATURE ( C)
FIGURE 7. SOFT-START CURRENT SOURCE CURRENT vs
TEMPERATURE AND V SUPPLY VOLTAGE
FIGURE 8. FAULT_NOT LOW LEVEL OUTPUT VOLTAGE vs
TEMPERATURE AND V
SINKING 5mA
SUPPLY VOLTAGE,
CC
CC
100
80
60
40
20
0
1.00
0.98
0.96
0.94
0.92
0.90
V
V
V
= 15V
= 12V
= 10V
CC
CC
CC
V
= 15V
= 12V
= 10V
CC
CC
CC
V
V
-40
-20
0
+20
+40
+60
+80 +100 +120
-40
-20
0
+20
+40
+60
+80
+100 +120
o
o
TEMPERATURE ( C)
TEMPERATURE ( C)
FIGURE 9. C RAMP TRIGGER AND DISCHARGE VOLTAGE
FIGURE 10. C TO R CURRENT SOURCE RATIO vs
T
T
T
TRIP POINT vs TEMPERATURE AND V
VOLTAGE
SUPPLY
TEMPERATURE
CC
27.5
27.0
26.5
26.0
25.5
25.0
V
V
V
= 15V
= 12V
= 10V
CC
CC
CC
-40
-20
0
+20
+40
+60
o
+80
+100 +120
TEMPERATURE ( C)
FIGURE 11. SHUTDOWN THRESHOLD VOLTAGE (% OF V ) vs TEMPERATURE AND V
CC
SUPPLY VOLTAGE
CC
6
HIP5500
o
Typical Performance Curves All Curves are V = +15V, T = +25 C, Unless Otherwise Specified (Continued)
CC
A
340
320
300
280
260
240
220
200
180
160
140
120
100
80
340
320
300
280
260
240
220
200
180
160
140
120
100
80
V
= 15V
CC
CC
V
= 15V
= 12V
CC
CC
V
= 12V
V
V
= 10V
CC
V
= 10V
CC
60
60
-40
-20
0
+20
+40
+60
+80
+100 +120
-40
-20
0
+20
+40
+60
+80
+100 +120
o
o
TEMPERATURE ( C)
TEMPERATURE ( C)
FIGURE 12. BUFFER GATE OUTPUT SHORT CIRCUIT SINKING
FIGURE 13. BUFFER GATE OUTPUT SHORT CIRCUIT
SOURCING CURRENT vs TEMPERATURE AND
CURRENT vs TEMPERATURE AND V
SUPPLY VOLTAGE
CC
V
SUPPLY VOLTAGE
CC
10.0
9.5
9.0
8.5
8.0
7.5
10.0
9.5
9.0
8.5
8.0
7.5
TRIP
TRIP
RESET
RESET
-40
-20
0
+20
+40
+60
o
+80
+100 +120
-40
-20
0
+20
+40
+60
+80
+100 +120
o
TEMPERATURE ( C)
TEMPERATURE ( C)
FIGURE 14. LOW-SIDE UNDERVOLTAGE THRESHOLD
VOLTAGE (TRIP/RESET) vs TEMPERATURE
FIGURE 15. HIGH-SIDE UNDERVOLTAGE THRESHOLD
VOLTAGE(TRIP/RESET) vs TEMPERATURE
1.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.8
C
-DIS FALL
-DIS RISE
T
0.6
0.4
0.2
0.0
C
T
-40
-20
0
+20
+40
+60
+80
+100 +120
-40
-20
0
+20
+40
+60
o
+80
+100 +120
o
TEMPERATURE ( C)
TEMPERATURE ( C)
FIGURE 16. PROPAGATION DELAY, C TO GATE OUTPUTS vs
FIGURE 17. PROPAGATION DELAY, C TO DIS vs
T
T
TEMPERATURE AT V
= +15V
TEMPERATURE AT V
= +15V
CC
CC
7
HIP5500
o
Typical Performance Curves All Curves are V = +15V, T = +25 C, Unless Otherwise Specified (Continued)
CC
A
1.6
1.2
0.8
0.4
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
SD-LO FALL
SD-LO RISE
-40
-20
0
+20
+40
+60
o
+80
+100 +120
-40
-20
0
+20
+40
+60
o
+80
+100 +120
TEMPERATURE ( C)
TEMPERATURE ( C)
FIGURE 18. PROPAGATION DELAY, SS TO LO GATE RISING vs
TEMPERATURE AT V = +15V
FIGURE 19. PROPAGATION DELAYS, SD TO LO GATE
RISE/FALL vs TEMPERATURE AT V
= +15V
CC
CC
3
2.75
2.5
2.25
2
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
HIP5500IP
HIP5500IB
1.75
1.5
1.25
1
0.75
0.5
0.25
0
-40
-20
0
+20
+40
+60
+80 +100 +120
o
10
11
12
13
14
15
AMBIENT TEMPERATURE ( C)
SUPPLY VOLTAGE (V
)
CC
FIGURE 20. PROPAGATION DELAY, C TO GATE OUT vs
T
FIGURE 21. MAXIMUM POWER DISSIPATION vs
TEMPERATURE
o
SUPPLY VOLTAGE, V
AT +25 C FOR
CC
RISING AND FALLING GATE OUTPUTS
10
1.0
0.1
V
C
T
= V = 15V
V
V
T
= V
= COM
BS
L
A
CC
S
SS
= V
= 100pF
= 15VDC
BS
= +25 C
CC
V
V
V
= 400V
= 300V
= 200V
o
S
S
S
o
= +25 C
A
1.0
0.1
V
= 100V
S
2100pF
907pF
100pF
0.01
0.001
0.01
10
100
SWITCHING FREQUENCY (kHz)
1000
10
100
SWITCHING FREQUENCY (kHz)
1000
NOTE: All switching losses assumed to be in IC.
FIGURE 22. HIGH VOLTAGE POWER DISSIPATION vs
SWITCHING FREQUENCY
FIGURE 23. LOW VOLTAGE POWER DISSIPATION vs
FREQUENCY
8
HIP5500
R B S
9
HIP5500
COM
VBUS
U1
RG1
1
1
C
R
T
T
RDIS
CX
C 1
T
SD
SS
RSD
CSS
REN
R1
RBS
RG2
EN
LED1
OSC
+15VDC
V
CC
C
D
TRANSFORMER
GND
T1
A
CTAP
B
FIGURE 25. HIP5500 EVALUATION BOARD SILKSCREEN
10
HIP5500
Dual-In-Line Plastic Packages (PDIP)
E20.3 (JEDEC MS-001-AD ISSUE D)
20 LEAD DUAL-IN-LINE PLASTIC PACKAGE
N
E1
INDEX
AREA
INCHES MILLIMETERS
1 2
3
N/2
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-B-
-C-
A
A1
A2
B
-
4
-A-
0.015
0.115
0.014
0.045
0.008
0.980
0.005
0.300
0.240
0.39
2.93
0.356
1.55
0.204
24.89
0.13
7.62
6.10
4
D
E
BASE
PLANE
0.195
0.022
0.070
0.014
1.060
-
4.95
0.558
1.77
0.355
-
A2
A
-
SEATING
PLANE
B1
C
8
L
C
L
D1
B1
-
eA
A1
A
D1
e
D
26.9
5
C
eC
B S
B
D1
E
-
5
eB
0.010 (0.25) M
C
0.325
0.280
8.25
7.11
6
NOTES:
E1
e
5
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
e
e
6
A
B
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
-
0.430
0.150
-
10.92
3.81
7
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
L
0.115
2.93
4
9
N
20
20
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
e
6. E and
pendicular to datum
7. e and e are measured at the lead tips with the leads uncon-
are measured with the leads constrained to be per-
A
-C-
.
B
C
strained. e must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
11
HIP5500
Small Outline Plastic Packages (SOIC)
M20.3 (JEDEC MS-013-AC ISSUE C)
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
N
INDEX
AREA
M
M
B
0.25(0.010)
H
INCHES MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
12.60
7.40
MAX
2.65
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
0.5118
0.2992
-
0.30
-
1
2
3
L
0.51
9
SEATING PLANE
A
0.0091
0.4961
0.2914
0.32
-
-A-
o
13.00
7.60
3
D
h x 45
4
-C-
0.050 BSC
1.27 BSC
-
α
µ
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
M
M
S
B
0.25(0.010)
C
A
N
α
20
20
7
o
0
o
8
o
0
o
8
-
NOTES:
Rev. 0 12/93
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
12
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