AV80577SH0513M_技术文档

ꢀ

,QWHOꢀ$GYDQFHGꢀ'LJLWDOꢀ0HGLDꢀ%RRVWꢀDFFHOHUDWHVꢀH[HFXWLRQꢀRIꢀ

6WUHDPLQJꢀ6,0'ꢀ([WHQVLRQꢀꢂ66(ꢃꢀLQVWUXFWLRQVꢀWRꢀVLJQLILFDQWO\ꢀ

improve performance of video, audio, and image processing

for multimedia, encryption, financial, engineering, and scientific

DSSOLFDWLRQVꢄꢀꢅꢆꢇꢁELWꢀ66(ꢀLQVWUXFWLRQVꢈꢀLVVXHGꢀDWꢀDꢀWKURXJKSXWꢀ

rate of one per clock cycle, effectively doubles speed of execu-

tion over previous-generation processors. 45nm versions include

QHZꢀ6XSHUꢀ6KXIIOHꢀ(QJLQHꢀWRꢀLPSURYHꢀH[LVWLQJꢀ66(ꢀLQVWUXFWLRQVꢀ

ZKLOHꢀHQDEOLQJꢀVLJQLILFDQWꢀJDLQVꢀRQꢀWKHꢀODWHVWꢀ66(ꢉꢀLQVWUXFWLRQꢀ

set. This provides additional performance improvements in

66(ꢉꢁRSWLPL]HGꢀDSSOLFDWLRQVꢈꢀVXFKꢀDVꢀYLGHRꢀHGLWLQJꢀDQGꢀ

encoding in high-definition resolution.

ꢀ

,QWHOꢀ:LGHꢀ'\QDPLFꢀ([HFXWLRQꢀDOORZVꢀHDFKꢀFRUHꢀWRꢀVLPXOWDQHRXVO\ꢀ

ꢀ

,QWHOꢀ$GYDQFHGꢀ6PDUWꢀ&DFKHꢀVLJQLILFDQWO\ꢀUHGXFHVꢀPHPRU\ꢀ

latency to frequently used data through dynamic allocation

of shared L2 cache.

ꢀ

,QWHOꢀ6PDUWꢀ0HPRU\ꢀ$FFHVVꢀDFFHOHUDWHVꢀRXWꢁRIꢁRUGHUꢀ

execution, reduces time in-flight instructions must wait

for data, and moves data from system memory into fast

L2 cache prior to execution.

3URGXFWꢀ%ULHI

Intel® Core™2 Duo Processors

Embedded Computing

Intel^®Core^™2 Duo Processors

for Embedded Computing

Processors T9400, P8400, SL9400, SL9380, SP9300, SU9300,

T7500, T7400, L7500, L7400 and U7500

Product Overview

Intel® Core™2 Duo processors – members of Intel’s growing prod-

uct line of multi-core processors based on Intel® Core™ microarchi-

tecture – now feature 45nm process technology to deliver even

greater energy-efficient performance. Intel Core 2 Duo processor

technology makes it possible to integrate two complete execu-

tion cores in one physical package, providing advancements in

simultaneous computing for multi-threaded applications and multi-

tasking environments. Intel’s hafnium-based 45nm Hi-k silicon

process technology enables even more processor performance

by doubling transistor density and increasing cache size by up to

50 percent. The result is improved speed and efficiency, relative

to previous-generation dual-core Intel® processors.

Intel Core 2 Duo processors meet the needs of a wide range

of performance-intensive, low-power embedded applications

in smaller form factors such as retail and transaction services

(i.e., point-of-service terminals and ATMs), gaming platforms,

industrial control and automation, digital security surveillance

and medical imaging. While incorporating advanced processor

technology, they remain software-compatible with previous

IA-32 processors.

Arch State

Execution

Resources

Execution

Resources

L1 Caches

APIC

L1 Caches

APIC

Intel® Core™ Microarchitecture

Shared L2 Cache

Energy-efficient performance helps equipment manufacturers

optimally balance processing capabilities within power and

space constraints.

Power Mgmt.

Coordination Logic Coordination Logic

Core

Bus Interface

complete up to four full instructions per clock cycle.

Intel® Core™2 Duo processors, based on Intel® Core™ microarchi-

tecture, include two complete execution cores, shared L2 cache,

and intelligent power management capabilities. These features

deliver significantly greater performance-per-watt over previous-

generation dual-core Intel® processors.

ꢀ

,QWHOꢀ7UXVWHGꢀ([HFXWLRQꢀ7HFKQRORJ\³(Intel® TXT) defends

against software-based attacks and helps protect confiden-

tiality and integrity of data stored or created on the system.

Enables each application to run within its own space, protected

from all other software on the system.

ꢀ

$ORQJꢀZLWKꢀDꢀVWURQJꢀHFRV\VWHPꢀRIꢀKDUGZDUHꢀDQGꢀVRIWZDUHꢀ

vendors, including members of the Intel® Embedded and Commu-

nications Alliance (intel.com/go/eca), Intel helps cost-effectively

meet development challenges and speed time-to-market.

Intel® Core™2 Duo Processors

ꢀ

%DVHGꢀRQꢀ,QWHOꢀꢉꢌQPꢀSURFHVVꢀWHFKQRORJ\

9DOLGDWHGꢀZLWKꢀ0RELOHꢀ,QWHOꢀ*0ꢉꢌꢀ([SUHVVꢀFKLSVHWꢀꢂ7ꢍꢉꢎꢎꢈꢀ3ꢇꢉꢎꢎꢃꢀDQGꢀ0RELOHꢀ,QWHOꢀ*6ꢉꢌꢀ([SUHVVꢀ

FKLSVHWꢀꢂ6/ꢍꢉꢎꢎꢈꢀ63ꢍꢋꢎꢎꢈꢀ68ꢍꢋꢎꢎꢃꢀ

ꢀ

9DOLGDWHGꢀZLWKꢀSRZHUꢁRSWLPL]HGꢀ,QWHOꢀꢌꢅꢎꢎꢀ0HPRU\ꢀ&RQWUROOHUꢀ+XEꢀFKLSVHWꢀZLWKꢀ

,QWHOꢀꢇꢆꢇꢎꢅ,5ꢀ,ꢐ2ꢀ&RQWUROOHUꢀ+XEꢀꢍ5ꢀꢂ7ꢍꢉꢎꢎꢈꢀ6/ꢍꢉꢎꢎꢃ

²ꢀ

6XSSRUWVꢀGXDOꢁFKDQQHOꢀ''5ꢆꢀUHJLVWHUHGꢀ(&&ꢀPHPRU\ꢀꢂꢌꢋꢋꢀ0+]ꢀDQGꢀꢊꢊꢏꢀ0+]ꢃꢀWRꢀKHOSꢀVDIHJXDUGꢀ

ꢀ9DOLGDWHGꢀZLWKꢀLQWHJUDWHGꢀ,QWHOꢀꢋꢅꢎꢎꢀFKLSVHWꢀꢂ6/ꢍꢋꢇꢎꢈꢀ68ꢍꢋꢎꢎꢃ

²ꢀ

%ULQJVꢀHQWHUSULVHꢁOHYHOꢀUHOLDELOLW\ꢈꢀDYDLODELOLW\ꢈꢀVHUYLFHDELOLW\ꢈꢀXVDELOLW\ꢀDQGꢀPDQDJHDELOLW\ꢀꢂ5$680ꢃꢀ

Intel® Core™2 Duo Processors

T7500 /L7500 /U7500

ꢀ

%DVHGꢀRQꢀ,QWHOꢀꢊꢌQPꢀSURFHVVꢀWHFKQRORJ\ꢀ

9DOLGDWHGꢀZLWKꢀ0RELOHꢀ,QWHOꢀ*0(ꢍꢊꢌꢀ([SUHVVꢀFKLSVHW

ꢀ

/ꢏꢌꢎꢎꢀRIIHUVꢀORZꢁSRZHUꢈꢀYDOXHꢁVHQVLWLYHꢀVROXWLRQ

Intel® Core™2 Duo Processors

T7400 /L7400 /U7500

ꢀ

%DVHGꢀRQꢀ,QWHOꢀꢊꢌQPꢀSURFHVVꢀWHFKQRORJ\ꢀ

9DOLGDWHGꢀZLWKꢀ0RELOHꢀ,QWHOꢀꢍꢉꢌ*0(ꢀ([SUHVVꢀFKLSVHW

ꢀ

7ꢏꢉꢎꢎꢀDQGꢀ/ꢏꢉꢎꢎꢀDOVRꢀYDOLGDWHGꢀZLWKꢀ,QWHOꢀ(ꢏꢌꢆꢎꢀFKLSVHWꢈꢀDGGUHVVLQJꢀWKHꢀQHHGVꢀRIꢀKLJKꢁSHUIRUPDQFHꢈꢀ

low-power platforms within small form factor designs

/ꢏꢉꢎꢎꢀDQGꢀ8ꢏꢌꢎꢎꢀDOVRꢀYDOLGDWHGꢀZLWKꢀ,QWHOꢀꢋꢅꢎꢎꢀFKLSVHWꢈꢀDQꢀLQWHJUDWHGꢀFKLSVHWꢀRIIHULQJꢀORZꢁSRZHUꢀ

platform solutions for thermally sensitive and performance-intensive embedded, communications

and storage applications

Intel® Core™ Microarchitecture (continued)

ꢀ

,QWHOꢀ9LUWXDOL]DWLRQꢀ7HFKQRORJ\¹allows one hardware platform

to function as multiple “virtual” platforms, improving manage-

ability, limiting downtime and maintaining worker productivity.

Provides greater isolation and security between different

applications and operating systems for added protection.

ꢀ

([HFXWHꢀ'LVDEOHꢀ%LW⁴marks memory regions as executable or non-

executable when combined with a supporting operating system.

'LJLWDOꢀ7KHUPDOꢀ6HQVRUꢀꢂ'76ꢃꢀHQDEOHVꢀHIILFLHQWꢀSURFHVVRUꢀDQGꢀ

platform thermal control. Thermal sensors located within the

processor measure maximum temperature on the die at any

given time.

ꢀ

,QWHOꢀꢊꢉꢀ$UFKLWHFWXUH²ꢀVXSSRUWVꢀꢊꢉꢁELWꢀLQVWUXFWLRQVꢈꢀ

SURYLGLQJꢀIOH[LELOLW\ꢀIRUꢀꢊꢉꢁELWꢀDQGꢀꢋꢆꢁELWꢀDSSOLFDWLRQVꢀ

and operating systems.

ꢀ

(PEHGGHGꢀOLIHF\FOHꢀVXSSRUWꢀSURWHFWVꢀV\VWHPꢀLQYHVWPHQWꢀE\ꢀ

enabling extended product availability for embedded customers.

Intel® Core™2 Duo Processor Platform Features

¨

T9400 /P8400 /SL9400 /SL9380 /

¨

SP9300 /SU9300

– Excellent processor and graphics performance, storage speed and reliability

²ꢀ8SꢀWRꢀꢇꢀ*%ꢀꢊꢊꢏꢐꢇꢎꢎꢀ0+]ꢀ''5ꢆꢀRUꢀꢇꢎꢎꢐꢅꢎꢊꢊꢀ0+]ꢀ''5ꢋꢀ62',00ꢀV\VWHPꢀPHPRU\

²ꢀ*UDSKLFVꢀFRUHꢀSHUIRUPDQFHꢀXSꢀWRꢀꢌꢋꢋꢀ0+]

²ꢀꢋꢎꢀODQHVꢀRIꢀ3&,ꢀ([SUHVVꢑꢀIRUꢀ,ꢐ2ꢀFRQQHFWLYLW\

data and improve reliability

– Performance-per-watt advantage for single-processor bladed form factor applications

²ꢀ6XSSRUWVꢀVLQJOHꢁFKDQQHOꢀ''5ꢆꢈꢀSURYLGLQJꢀXSꢀWRꢀꢅꢊꢀ*%ꢀPD[ꢀPHPRU\ꢀVXSSRUW

²ꢀ2SWLPL]HGꢀSHUIRUPDQFHꢁSHUꢁZDWWꢀIRUꢀVPDOOꢀIRUPꢀIDFWRUVꢒꢀ3U$0&ꢈꢀ&RPSDFW3&,ꢑꢀDQGꢀ&20ꢀ([SUHVVꢑꢀ

to embedded platforms

¨

– Excellent storage speed, reliability and remote asset management capabilities

²ꢀ,QWHJUDWHGꢀꢋꢆꢁELWꢀꢋ'ꢀJUDSKLFVꢀHQJLQHꢈꢀDQGꢀXSꢀWRꢀꢉꢀ*%ꢀRIꢀꢌꢋꢋꢐꢊꢊꢏꢀ0+]ꢀ''5ꢆꢀ62',00ꢀV\VWHPꢀPHPRU\ꢀ

²ꢀ*UDSKLFVꢀFRUHꢀSHUIRUPDQFHꢀXSꢀWRꢀꢌꢎꢎꢀ0+]

ꢀ8ꢏꢌꢎꢎꢀSURYLGHVꢀXOWUDꢀORZꢁSRZHUꢀVROXWLRQꢀZLWKꢀH[FHOOHQWꢀJUDSKLFVꢀSHUIRUPDQFH

¨

²ꢀ6XSHUEꢀJUDSKLFVꢈꢀ,ꢐ2ꢀEDQGZLGWKꢈꢀVWRUDJHꢀVSHHGꢈꢀUHOLDELOLW\ꢀDQGꢀUHPRWHꢀDVVHWꢀPDQDJHPHQWꢀFDSDELOLWLHV

– Integrated 32-bit 3D graphics engine

²ꢀ8SꢀWRꢀꢉꢀ*%ꢀRIꢀꢉꢎꢎꢐꢌꢋꢋꢐꢊꢊꢏꢀ0+]ꢀ''5ꢆꢀ62',00ꢀV\VWHPꢀPHPRU\

/(ꢇꢎꢌꢋꢏ*)ꢎꢉꢇꢉ0

/)ꢇꢎꢌꢋꢏ*)ꢎꢉꢇꢉ0

ꢆ

ꢅꢊꢀ*+]ꢀ

ꢅꢊꢀ*+]

ꢊꢊꢏꢀ0+]

ꢉꢀ0%ꢀ8QLÀHG

34 watts

ꢎꢄꢏꢌꢀ9ꢁ ꢄꢋꢀ9

100° C

ꢉꢏꢍꢀ)&ꢁ%*$

ꢉꢏꢇꢀ)&ꢁ3*$

Intel® Core™2 Duo Processors for Embedded Computing

Front-Side

Bus Speed

Thermal

Design Power VID

Product Number

Core Speed

L2 Cache

Tj Max

Package⁵

45nm process technology

¨

Intel® Core™2 Duo Processor T9400

$9ꢇꢎꢌꢏꢊ*+ꢎꢊꢅꢊ0

$:ꢇꢎꢌꢏꢊ*+ꢎꢊꢅꢊ0

ꢆꢄꢌꢋꢀ*+]

ꢅꢎꢊꢊꢀ0+]

ꢊꢀ0%ꢀ8QLILHG

35 watts

ꢎꢄꢏꢌꢀ9ꢁ ꢄꢋꢀ9

105° C

ꢉꢏꢍꢀµ)&ꢁ%*$

ꢉꢏꢇꢀµ)&ꢁ3*$

¨

Intel® Core™2 Duo Processor P8400

ꢎꢄꢏꢌꢀ9ꢁ ꢄꢋꢀ9

ꢉꢏꢍꢀ)&ꢁ%*$

ꢉꢏꢇꢀ)&ꢁ3*$

$9ꢇꢎꢌꢏꢏ6+ꢎꢌꢅꢋ0

$:ꢇꢎꢌꢏꢏ6+ꢎꢌꢅꢋ0

ꢆꢄꢆꢊꢀ*+]

ꢅꢎꢊꢊꢀ0+]

ꢋꢀ0%ꢀ8QLILHG

25 watts

105° C

¨

Intel® Core™2 Duo Processor SL9400

ꢅꢄꢇꢊꢀ*+]

ꢅꢎꢊꢊꢀ0+]

800 MHz

ꢅꢎꢊꢊꢀ0+]

800 MHz

ꢊꢀ0%ꢀ8QLILHG

ꢋꢀ0%ꢀ8QLILHG

ꢅꢏꢀZDWWV

25 watts

10 watts

105° C

$9ꢇꢎꢌꢏꢊ/+ꢎꢋꢊꢊ0

ꢎꢄꢏꢌꢀ9ꢁꢅꢄꢆꢌꢀ9ꢀ

ꢎꢄꢏꢌꢀ9ꢁꢅꢄꢆꢌꢀ9

ꢎꢄꢏꢌꢀ9ꢁ ꢄꢋꢀ9

ꢍꢌꢊꢀ)&ꢁ%*$ꢀꢂ6))ꢃ

ꢍꢌꢊꢀµ)&ꢁ%*$ꢀꢂ6))ꢃ

Intel® Core™2 Duo Processor SL9380

$9ꢇꢎꢌꢏꢊ/*ꢎꢋꢋꢊ0 ꢄꢇꢎꢀ*+]

¨

Intel® Core™2 Duo Processor SP9300

$9ꢇꢎꢌꢏꢊ6+ꢎꢌꢅꢊ0 ꢆꢄꢆꢊꢀ*+]

¨

Intel® Core™2 Duo Processor SU9300

$9ꢇꢎꢌꢏꢏ8*ꢎꢎꢍꢋ0

ꢄꢆꢎꢀ*+]

65nm process technology

¨

Intel® Core™2 Duo Processor T7500

/(ꢇꢎꢌꢋꢏ**ꢎꢉꢍꢉ0

/)ꢇꢎꢌꢋꢏ**ꢎꢉꢍꢉ0

ꢆꢄꢆꢎꢀ*+]ꢀ

ꢆꢄꢆꢎꢀ*+]

800 MHz

ꢉꢀ0%ꢀ8QLÀHG

35 watts

ꢎꢄꢏꢌꢀ9ꢁꢅꢄꢋꢌꢀ9

100° C

ꢉꢏꢍꢀ)&ꢁ%*$

ꢉꢏꢇꢀ)&ꢁ3*$

¨

Intel® Core™2 Duo Processor T7400

¨

Intel® Core™2 Duo Processor L7500

/(ꢇꢎꢌꢋꢏ/*ꢎꢆꢌꢉ0 ꢄꢊꢎꢀ*+]

800 MHz

ꢊꢊꢏꢀ0+]

533 MHz

ꢉꢀ0%ꢀ8QLÀHG

ꢆꢀ0%ꢀ8QLÀHG

ꢅꢏꢀZDWWV

10 watts

ꢎꢄꢏꢌꢀ9ꢁ ꢄꢋꢀ9

ꢎꢄꢏꢌꢀ9ꢁꢅꢄꢅꢀ9

ꢎꢄꢏꢌꢀ9ꢁꢎꢄꢍꢏꢌꢀ9

100° C

ꢉꢏꢍꢀ)&ꢁ%*$

Intel® Core™2 Duo Processor L7400

/(ꢇꢎꢌꢋꢏ/)ꢎꢆꢅꢉ0 ꢄꢌꢎꢀ*+]

Intel® Core™2 Duo Processor U7500

/(ꢇꢎꢌꢋꢏ8(ꢎꢎꢉꢆ0 ꢄꢎꢊꢀ*+]

Intel in Embedded and Communications: Intel.com/go/embedded

ꢀ ¨

Intel^®processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families.

See http://www.intel.com/products/processor_number for details.

¹Intel^®Virtualization Technology requires a computer system with an enabled Intel^®processor, BIOS, virtual machine monitor (VMM) and, for some uses, certain platform software enabled for it. Functionality,

SHUIRUPDQFHꢀRUꢀRWKHUꢀEHQH¿WVꢀZLOOꢀYDU\ꢀGHSHQGLQJꢀRQꢀKDUGZDUHꢀDQGꢀVRIWZDUHꢀFRQ¿JXUDWLRQVꢀDQGꢀPD\ꢀUHTXLUHꢀDꢀ%,26ꢀXSGDWHꢁꢀ6RIWZDUHꢀDSSOLFDWLRQVꢀPD\ꢀQRWꢀEHꢀFRPSDWLEOHꢀZLWKꢀDOOꢀRSHUDWLQJꢀV\VWHPVꢁꢀ3OHDVHꢀFKHFNꢀ

with your application vendor.

²64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel^®64 architecture. Performance will vary

GHSHQGLQJꢀRQꢀ\RXUꢀKDUGZDUHꢀDQGꢀVRIWZDUHꢀFRQ¿JXUDWLRQVꢁꢀ&RQVXOWꢀZLWKꢀ\RXUꢀV\VWHPꢀYHQGRUꢀIRUꢀPRUHꢀLQIRUPDWLRQꢁ

³No computer system can provide absolute security under all conditions. Intel^®Trusted Execution Technology (Intel^®TXT) requires a computer system with Intel^®Virtualization Technology, an Intel TXT-enabled

SURFHVVRUꢂꢀFKLSVHWꢂꢀ%,26ꢂꢀ$XWKHQWLFDWHGꢀ&RGHꢀ0RGXOHVꢀDQGꢀDQꢀ,QWHOꢀ7;7ꢃFRPSDWLEOHꢀPHDVXUHGꢀODXQFKHGꢀHQYLURQPHQWꢀꢄ0/(ꢅꢁꢀ7KHꢀ0/(ꢀFRXOGꢀFRQVLVWꢀRIꢀDꢀYLUWXDOꢀPDFKLQHꢀPRQLWRUꢂꢀDQꢀ26ꢀRUꢀDQꢀDSSOLFDWLRQꢁꢀ,QꢀDGGL-

WLRQꢂꢀ,QWHOꢀ7;7ꢀUHTXLUHVꢀWKHꢀV\VWHPꢀWRꢀFRQWDLQꢀDꢀ730ꢀYꢆꢁꢇꢂꢀDVꢀGH¿QHGꢀE\ꢀWKHꢀ7UXVWHGꢀ&RPSXWLQJꢀ*URXSꢀDQGꢀVSHFL¿FꢀVRIWZDUHꢀIRUꢀVRPHꢀXVHVꢁꢀ)RUꢀPRUHꢀLQIRUPDWLRQꢂꢀVHHꢀKWWSꢈꢉꢉZZZꢁLQWHOꢁFRPꢉWHFKQRORJ\ꢉVHFXULW\ꢀ

⁴ꢀ(QDEOLQJꢀ([HFXWHꢀ'LVDEOHꢀ%LWꢀIXQFWLRQDOLW\ꢀUHTXLUHVꢀDꢀ3&ꢀZLWKꢀDꢀSURFHVVRUꢀZLWKꢀ([HFXWHꢀ'LVDEOHꢀ%LWꢀFDSDELOLW\ꢀDQGꢀDꢀVXSSRUWLQJꢀRSHUDWLQJꢀV\VWHPꢁꢀ&KHFNꢀZLWKꢀ\RXUꢀ3&ꢀPDQXIDFWXUHUꢀRQꢀZKHWKHUꢀ\RXUꢀV\VWHPꢀGHOLYHUVꢀ

Execute Disable Bit functionality.

⁵ꢀ6))ꢀ ꢀ6PDOOꢀ)RUPꢀ)DFWRUꢀSDFNDJHꢁ

ꢀ ꢀ,1)250$7,21ꢀ,1ꢀ7+,6ꢀ'2&80(17ꢀ,6ꢀ3529,'('ꢀ,1ꢀ&211(&7,21ꢀ:,7+ꢀ,17(/^®ꢀ352'8&76ꢁꢀ12ꢀ/,&(16(ꢂꢀ(;35(66ꢀ25ꢀ,03/,('ꢂꢀ%<ꢀ(67233(/ꢀ25ꢀ27+(5:,6(ꢂꢀ72ꢀ$1<ꢀ,17(//(&78$/ꢀ3523-

(57<ꢀ5,*+76ꢀ,6ꢀ*5$17('ꢀ%<ꢀ7+,6ꢀ'2&80(17ꢁꢀ(;&(37ꢀ$6ꢀ3529,'('ꢀ,1ꢀ,17(/¶6ꢀ7(506ꢀ$1'ꢀ&21',7,216ꢀ2)ꢀ6$/(ꢀ)25ꢀ68&+ꢀ352'8&76ꢂꢀ,17(/ꢀ$6680(6ꢀ12ꢀ/,$%,/,7<ꢀ:+$762(9(5ꢂꢀ

$1'ꢀ,17(/ꢀ',6&/$,06ꢀ$1<ꢀ(;35(66ꢀ25ꢀ,03/,('ꢀ:$55$17<ꢂꢀ5(/$7,1*ꢀ72ꢀ6$/(ꢀ$1'ꢉ25ꢀ86(ꢀ2)ꢀ,17(/ꢀ352'8&76ꢀ,1&/8',1*ꢀ/,$%,/,7<ꢀ25ꢀ:$55$17,(6ꢀ5(/$7,1*ꢀ72ꢀ),71(66ꢀ)25ꢀ$ꢀ

3$57,&8/$5ꢀ385326(ꢂꢀ0(5&+$17$%,/,7<ꢂꢀ25ꢀ,1)5,1*(0(17ꢀ2)ꢀ$1<ꢀ3$7(17ꢂꢀ&23<5,*+7ꢀ25ꢀ27+(5ꢀ,17(//(&78$/ꢀ3523(57<ꢀ5,*+7ꢁꢀ81/(66ꢀ27+(5:,6(ꢀ$*5(('ꢀ,1ꢀ:5,7,1*ꢀ%<ꢀ,17(/ꢂꢀ

7+(ꢀ,17(/ꢀ352'8&76ꢀ$5(ꢀ127ꢀ'(6,*1('ꢀ125ꢀ,17(1'('ꢀ)25ꢀ$1<ꢀ$33/,&$7,21ꢀ,1ꢀ:+,&+ꢀ7+(ꢀ)$,/85(ꢀ2)ꢀ7+(ꢀ,17(/ꢀ352'8&7ꢀ&28/'ꢀ&5($7(ꢀ$ꢀ6,78$7,21ꢀ:+(5(ꢀ3(5621$/ꢀ,1-85<ꢀ25ꢀ

'($7+ꢀ0$<ꢀ2&&85ꢁ

ꢀ ꢀ,QWHOꢀPD\ꢀPDNHꢀFKDQJHVꢀWRꢀVSHFL¿FDWLRQVꢀDQGꢀSURGXFWꢀGHVFULSWLRQVꢀDWꢀDQ\ꢀWLPHꢂꢀZLWKRXWꢀQRWLFHꢁꢀ'HVLJQHUVꢀPXVWꢀQRWꢀUHO\ꢀRQꢀWKHꢀDEVHQFHꢀRUꢀFKDUDFWHULVWLFVꢀRIꢀDQ\ꢀIHDWXUHVꢀRUꢀ

LQVWUXFWLRQVꢀPDUNHGꢀ³UHVHUYHG´ꢀRUꢀ³XQGH¿QHGꢁ´ꢀ,QWHOꢀUHVHUYHVꢀWKHVHꢀIRUꢀIXWXUHꢀGH¿QLWLRQꢀDQGꢀVKDOOꢀKDYHꢀQRꢀUHVSRQVLELOLW\ꢀZKDWVRHYHUꢀIRUꢀFRQÀLFWVꢀRUꢀLQFRPSDWLELOLWLHVꢀDULVLQJꢀIURPꢀ

IXWXUHꢀFKDQJHVꢀWRꢀWKHPꢁꢀ7KHꢀLQIRUPDWLRQꢀKHUHꢀLVꢀVXEMHFWꢀWRꢀFKDQJHꢀZLWKRXWꢀQRWLFHꢁꢀ'RꢀQRWꢀ¿QDOL]HꢀDꢀGHVLJQꢀZLWKꢀWKLVꢀLQIRUPDWLRQꢁꢀ7KHꢀSURGXFWVꢀGHVFULEHGꢀLQꢀWKLVꢀGRFXPHQWꢀPD\ꢀ

FRQWDLQꢀGHVLJQꢀGHIHFWVꢀRUꢀHUURUVꢀNQRZQꢀDVꢀHUUDWDꢀZKLFKꢀPD\ꢀFDXVHꢀWKHꢀSURGXFWꢀWRꢀGHYLDWHꢀIURPꢀSXEOLVKHGꢀVSHFL¿FDWLRQVꢁꢀ&XUUHQWꢀFKDUDFWHUL]HGꢀHUUDWDꢀDUHꢀDYDLODEOHꢀRQꢀUHTXHVWꢁꢀ

&RQWDFWꢀ\RXUꢀORFDOꢀ,QWHOꢀVDOHVꢀRI¿FHꢀRUꢀ\RXUꢀGLVWULEXWRUꢀWRꢀREWDLQꢀWKHꢀODWHVWꢀVSHFL¿FDWLRQVꢀDQGꢀEHIRUHꢀSODFLQJꢀ\RXUꢀSURGXFWꢀRUGHUꢁꢀ&RSLHVꢀRIꢀGRFXPHQWVꢀZKLFKꢀKDYHꢀDQꢀRUGHUꢀ

QXPEHUꢀDQGꢀDUHꢀUHIHUHQFHGꢀLQꢀWKLVꢀGRFXPHQWꢂꢀRUꢀRWKHUꢀ,QWHOꢀOLWHUDWXUHꢂꢀPD\ꢀEHꢀREWDLQHGꢀE\ꢀFDOOLQJꢀꢆꢃꢊꢋꢋꢃꢌꢍꢊꢃꢍꢎꢇꢌꢂꢀRUꢀE\ꢀYLVLWLQJꢀ,QWHO¶Vꢀ:HEꢀ6LWHꢀZZZꢁLQWHOꢁFRPꢉꢁ

ꢀ ꢀ,QWHOꢂꢀWKHꢀ,QWHOꢀORJRꢂꢀDQGꢀ,QWHOꢀ&RUHꢀDUHꢀWUDGHPDUNVꢀRIꢀ,QWHOꢀ&RUSRUDWLRQꢀLQꢀWKHꢀ8ꢁ6ꢁꢀDQGꢀRWKHUꢀFRXQWULHVꢁ

*Other names and brands may be claimed as the property of others.

ꢀ ꢀ&RS\ULJKWꢀꢀꢇꢋꢋꢏꢀ,QWHOꢀ&RUSRUDWLRQꢁꢀ$OOꢀULJKWVꢀUHVHUYHGꢁ

ꢀ ꢀ3ULQWHGꢀLQꢀ86$ꢀ

ꢋꢐꢋꢏꢉ.6&ꢉ2&*ꢉ;;ꢉ3')ꢀ

3OHDVHꢀ5HF\FOHꢀ

ꢐꢆꢑꢑꢑꢐꢃꢋꢆꢇ86

Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB) with SPEC Code(s) SL9SM, SLGFX

●

Work

Play

Support

About Intel

Change Location

●

Products

Processors

❍

Motherboards

Chipsets

Desktop

Laptop

Server

Workstation

Business PCs

Embedded & Communications

Software

All Products

●

Technology

Architecture & Silicon

Product Technologies

Manufacturing

Research

❍

Standards

http://ark.intel.com/Product.aspx?id=28026 (1 of 9) [18-Sep-2009 10:21:19 AM]

Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB) with SPEC Code(s) SL9SM, SLGFX

❍

Intel Developer Forum

●

Communities

Downloads

Reseller

❍

Intel® Reseller Center

Intel® Distributor Resource Center

Intel® Channel Partner Program

Intel® Software Partner Program

Send Feedback

Home

ARK Home

●

Browse Processors

Browse Chipsets

Browse Motherboards

Browse Ethernet Controllers

Browse Code Names

Browse Motherboards

Browse Platforms

Intel® Virtualization Technology List

System Design Tool

SSPEC/QDF

Multi-Core Migration Guide

FAQ

Intel® Processors

●

Intel® Atom™ Processor

Intel® Celeron® D Processor

Intel® Celeron® Desktop Processor

Intel® Celeron® M Processor

http://ark.intel.com/Product.aspx?id=28026 (2 of 9) [18-Sep-2009 10:21:19 AM]

Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB) with SPEC Code(s) SL9SM, SLGFX

Intel® Celeron® Mobile Processor

Intel® Core™ Duo Processor

●

Intel® Core™ i5 Desktop Processor

Intel® Core™ i7 Desktop Processor

Intel® Core™ i7 Desktop Processor Extreme Edition

Intel® Core™ Solo Processor

Intel® Core™2 Duo Desktop Processor

Intel® Core™2 Duo Mobile Processor

Intel® Core™2 Extreme Desktop Processor

Intel® Core™2 Extreme Mobile Processor

Intel® Core™2 Quad Desktop Processor

Intel® Core™2 Quad Mobile Processor

Intel® Core™2 Solo Processor

Intel® EP80579 Integrated Processor

Intel® Itanium® Processor

Intel® Pentium® 4 Processor

Intel® Pentium® Desktop Processor

Intel® Pentium® III Processor

Intel® Pentium® Mobile Processor

Intel® Xeon® Processor

Storage Processor Family

Intel® Core™2 Duo Mobile Processor

●

Intel® Core™2 Duo Processor L7000 Series

Intel® Core™2 Duo Processor P7000 Series

Intel® Core™2 Duo Processor P8000 Series

Intel® Core™2 Duo Processor P9000 Series

Intel® Core™2 Duo Processor SL9000 Series

Intel® Core™2 Duo Processor SP9000 Series

Intel® Core™2 Duo processor SU9000 Series

Intel® Core™2 Duo Processor T5000 Series

Intel® Core™2 Duo Processor T6000 Series

http://ark.intel.com/Product.aspx?id=28026 (3 of 9) [18-Sep-2009 10:21:19 AM]

Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB) with SPEC Code(s) SL9SM, SLGFX

Intel® Core™2 Duo Processor T7000 Series

●

Intel® Core™2 Duo Processor T8000 Series

Intel® Core™2 Duo Processor T9000 Series

Intel® Core™2 Duo Processor U7000 Series

Intel® Core™2 Duo Processor L7000 Series

●

Intel® Core™2 Duo Processor L7200 (4M Cache, 1.33 GHz, 667 MHz FSB)

Intel® Core™2 Duo Processor L7300 (4M Cache, 1.40 GHz, 800 MHz FSB)

Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB)

Intel® Core™2 Duo Processor L7500 (4M Cache, 1.60 GHz, 800 MHz FSB)

Intel® Core™2 Duo Processor L7700 (4M Cache, 1.80 GHz, 800 MHz FSB)

L7400

Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB)

Add to Compare Queue

Compare Now

Essentials

Status

Launched

Q1'07

L7400

2

Launch Date

Processor Number

# of Cores

Clock Speed

1.5 GHz

4 MB

L2 Cache

FSB Speed

667 MHz

FSB Parity

Instruction Set

Embedded

64-bit

Supplemental SKU

Lithography

65 nm

Max TDP

17 W

VID Voltage Range

1ku Bulk Budgetary Price

Memory Specifications

Graphics Specifications

PCIe/PCI Specifications

I/O Specifications

Networking Specifications

0.9V-1.1V

$316.00

http://ark.intel.com/Product.aspx?id=28026 (4 of 9) [18-Sep-2009 10:21:19 AM]

Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB) with SPEC Code(s) SL9SM, SLGFX

Package Specifications

Thermal Specification

Package Size

100°C

35mm x 35mm

2

Die Size

143 mm

# of Transistors

291 million

PBGA479

Sockets Supported

Halogen Free Options Available

Intel® Silicon and Support

Find Compatible Motherboards

Find Compatible Embedded Boards

Software Downloads

Support Overview

Advanced Technologies

Intel® Virtualization Technology

Execute Disable Bit

Enhanced Intel® Speedstep Technology

Enhanced Halt State (C1E)

Intel® 64

Intel® Demand Based Switching

Intel® Turbo Boost Technology

Intel® Hyper-Threading Technology

Intel® Trusted Execution Technology

Block Diagrams

http://ark.intel.com/Product.aspx?id=28026 (5 of 9) [18-Sep-2009 10:21:19 AM]

Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB) with SPEC Code(s) SL9SM, SLGFX

Additional Information

●

Products formerly Merom

Download Datasheet

Buy Now

●

LE80537LF0214M

Buy From: Arrow | Avnet

PCN/MDDS

SLGFX

899898: PCN | MDDS

SL9SM

884337: PCN | MDDS

Send feedback on PCN or MDDS links IntelQDMS@pcnalert.com

Platform Information

Napa Refresh Platform

●

Intel® Embedded Low Power Performance Platform for 2006

Intel® Mobile Office On-the-go Low Voltage PC for 2007

●

http://ark.intel.com/Product.aspx?id=28026 (6 of 9) [18-Sep-2009 10:21:19 AM]

Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB) with SPEC Code(s) SL9SM, SLGFX

Intel® Mobile Entertainment On-the-go Low Voltage PC for 2007

●

Santa Rosa Platform

●

Intel® Embedded Low Power Performance Platform for 2007

Intel® Mobile Office On-the-go Low Voltage PC for 2007

Intel® Mobile Entertainment On-the-go Low Voltage PC for 2007

Lindenhurst Platform

●

Intel® Embedded Performance UP Bladed Platform for 2007

Compatible Chipsets

Embedded Intel® 3100 Chipset

1 Configuration

●

Intel® 3100 Chipset

❍

# of CPUs: 1

❍

Embedded:

System Price: N/A

System TDP: 29.4W

Intel® E7520 Chipset

2 Configurations

●

Intel® E7520 Chipset with 6300ESB I/O Controller Hub

❍

# of CPUs: 1

❍

Embedded:

System Price: N/A

❍

●

System TDP: 30.9W

Intel® E7520 Chipset with 82801ER I/O Controller Hub 5 R (ICH5R)

❍

# of CPUs: 1

❍

Embedded:

System Price: N/A

System TDP: 29.4W

Mobile Intel® 945GM Express Chipset

2 Configurations

●

Mobile Intel® 945GM Express Chipset with 82801GBM I/O Controller Hub (ICH7M)

❍

# of CPUs: 1

❍

Embedded:

System Price: $355

❍

●

System TDP: 27.3W

Mobile Intel® 945GM Express Chipset with 82801GHM I/O Controller Hub 7 (ICH7MDH)

❍

# of CPUs: 1

❍

Embedded:

System Price: $358

System TDP: 27.3W

Mobile Intel® 945GME Express Chipset

2 Configurations

●

Mobile Intel® 945GME Express Chipset with 82801GBM I/O Controller Hub (ICH7M)

❍

# of CPUs: 1

❍

Embedded:

System Price: $355

http://ark.intel.com/Product.aspx?id=28026 (7 of 9) [18-Sep-2009 10:21:19 AM]

Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB) with SPEC Code(s) SL9SM, SLGFX

❍

●

System TDP: 27.3W

Mobile Intel® 945GME Express Chipset with 82801GHM I/O Controller Hub 7 (ICH7MDH)

❍

# of CPUs: 1

❍

Embedded:

System Price: $358

System TDP: 27.3W

Mobile Intel® 945GMS Express Chipset

2 Configurations

●

Mobile Intel® 945GMS Express Chipset with 82801GBM I/O Controller Hub (ICH7M)

❍

# of CPUs: 1

❍

Embedded:

System Price: $355

❍

●

System TDP: 27.3W

Mobile Intel® 945GMS Express Chipset with 82801GHM I/O Controller Hub 7 (ICH7MDH)

❍

# of CPUs: 1

❍

Embedded:

System Price: $358

System TDP: 27.3W

Mobile Intel® 945PM Express Chipset

2 Configurations

●

Mobile Intel® 945PM Express Chipset with 82801GBM I/O Controller Hub (ICH7M)

❍

# of CPUs: 1

❍

Embedded:

System Price: $351

❍

●

System TDP: 27.3W

Mobile Intel® 945PM Express Chipset with 82801GHM I/O Controller Hub 7 (ICH7MDH)

❍

# of CPUs: 1

❍

Embedded:

System Price: $354

System TDP: 27.3W

Ordering & Sampling Information

Product Name

Socket StepStep TDPOrdering Code SPEC CodeEmbeddedHalogen FreeVT-x

Intel® Core™2 Duo Processor

L7400 (4M Cache, 1.50 GHz,

667 MHz FSB) uFCBGA,

Socket M, Tray

PBGA479 G2 17 Watts LE80537LF0214M

SLGFX

Retired & Discontinued

Product Name

Socket StepStep TDPOrdering Code SPEC CodeEmbeddedHalogen FreeVT-x

Intel® Core™2 Duo Processor

L7400 (4M Cache, 1.50 GHz,

667 MHz FSB) uFCBGA,

Socket M, Tray

PBGA479 B2 17 Watts LE80537LF0214M SL9SM

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting

operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device

drivers and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel

64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. Consult with your

system vendor for more information.

Hyper-Threading Technology (HT Technology) requires a computer system with an Intel® processor supporting HT Technology and

http://ark.intel.com/Product.aspx?id=28026 (8 of 9) [18-Sep-2009 10:21:19 AM]

Intel® Core™2 Duo Processor L7400 (4M Cache, 1.50 GHz, 667 MHz FSB) with SPEC Code(s) SL9SM, SLGFX

an HT Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and

software you use. See www.intel.com/products/ht/hyperthreading_more.htm for more information including details on which

processors support HT Technology.

Intel® Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and

for some uses, certain platform software, enabled for it. Functionality, performance or other benefit will vary depending on

hardware and software configurations. Intel Virtualization Technology-enabled VMM applications are currently in development.

Note: Prices subject to change without notice. Prices are for direct Intel customers in 1000-unit bulk quantities and, unless

specified, represent the latest technology versions of the products. Taxes and shipping, etc. not included. Prices may vary for other

package types and shipment quantities, and special promotional arrangements may apply.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family,

not across different processor families. See http://www.intel.com/products/processor_number for details.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle,

specifications, and product descriptions at any time, without notice.

Halogen Free implies the following:

Bromine and/or chlorine in materials that may be used during processing, but do not remain within the final product are not

included in this definition. The halogens fluorine (F), iodine (I), and astatine (At) are not restricted by this standard.

“BFR/CFR and PVC-Free” Definition:

An article must meet all of the following requirements to be defined as “BFR/CFR and PVC-Free”:

1. All PCB laminates must meet Br and Cl requirements for low halogen as defined in IPC-4101B

2. For components other than PCB laminates, all homogeneous materials must contain < 900 ppm (0.09%) of Bromine [if the

Bromine (Br) source is from BFRs] and < 900 ppm (0.09%) of Chlorine [if the Chlorine (Cl) source is from CFRs or PVC. Higher

concentrations of Br and Cl are allowed in homogenous materials of components other than PCB laminates as long as their sources

are not BFRs, CFRs, PVC.

3. Although the elemental analysis for Br and Cl in homogeneous materials can be performed by any analytical method with

sufficient sensitivity and selectivity, the presence or absence of BFRs, CFRs or PVC must be verified by any acceptable analytical

techniques that allow for the unequivocal identification of the specific Br or Cl compounds, or by appropriate material declarations

agreed to between customer and supplier.

Compare

Clear Queue

Site Map RSS Jobs Investor Relations Press Room Contact Us

http://ark.intel.com/Product.aspx?id=28026 (9 of 9) [18-Sep-2009 10:21:19 AM]


型号：	AV80577SH0513M
厂家：	INTEL
描述：	Microprocessor, 64-Bit, 2260MHz, CMOS, PBGA479, MICRO, FCBGA-479 外围集成电路
文件：	总104页 (文件大小：3353K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AV80577SH0513M [INTEL]

相关型号：

AV80577SH0563M/SLB4N

AV80577SH0563M/SLGDZ

AV80577SH0613MG/SLGFG

AV80577SH0673MG/SLGLA

AV80577UG0091M/SLGSB

AV80577UG0091ML/SLGYW

AV80577UG0093M

AV80577UG0093M/SLB5Q

AV80577UG0093M/SLGAL

AV80577UG0173M/SLB5V

AV80577UG0173M/SLGAK

AV80577UG0173M/SLGS5