TLS710B0EJV50XUMA1 [INFINEON]
Fixed Positive LDO Regulator, 5V, 0.5V Dropout, PDSO8, DSO-8;
| 型号： | TLS710B0EJV50XUMA1 |
| 厂家： | 
Infineon |
| 描述： | Fixed Positive LDO Regulator, 5V, 0.5V Dropout, PDSO8, DSO-8 光电二极管 输出元件 调节器 |
| 文件： | 总22页 (文件大小：780K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Low Dropout Linear Voltage Regulator
TLS710B0
TLS710B0V50
Linear Voltage Regulator
Data Sheet
Rev. 1.0, 2015-04-02
Automotive Power
TLS710B0
Table of Contents
1
2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
3.1
3.2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Assignment PG-DSO-8 EP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Definitions and Functions PG-DSO-8 EP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1
4.2
4.3
5
Block Description and Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Voltage Regulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Typical Performance Characteristics Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Typical Performance Characteristics Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Typical Performance Characteristics Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.1
5.2
5.3
5.4
5.5
5.6
6
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Selection of External Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Reverse Polarity Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Further Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.1
6.2
6.2.1
6.2.2
6.3
6.4
6.5
7
8
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Data Sheet
2
Rev. 1.0 2015-04-02
TLS710B0V50
TLS710B0
1
Overview
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
Wide Input Voltage Range from 4.0 V to 40 V
Output Voltage 5 V
Output Voltage Precision ±2 %
Output Current up to 100 mA
Low Current Consumption of 36 µA
Very Low Dropout Voltage of typ. 200 mV at 100 mA Output Current
Stable with Small Output Capacitor of 1 µF
Enable
PG-DSO-8 EP
Overtemperature Shutdown
Output Current Limitation
Wide Temperature Range from -40 °C up to 150 °C
Green Product (RoHS compliant)
AEC Qualified
Description
The TLS710B0 is a low dropout linear voltage regulator for load current up to 100 mA. An input voltage of up
to 40 V is regulated to VQ,nom = 5 V with ±2 % precision.
The TLS710B0, with a typical quiescent current of 36 µA, is the ideal solution for systems requiring very low
operating current, such as those permanently connected to the battery.
It features a very low dropout voltage of 200 mV, when the output current is less than 100 mA. In addition, the
dropout region begins at input voltages of 4.0 V (extended operating range). This makes the TLS710B0 suitable
to supply automotive systems with start-stop requirements.
The device can be switched on and off by the Enable feature as described on Chapter “Enable” on Page 15.
In addition, the TLS710B0’s new fast regulation concept requires only a single 1 µF output capacitor to
maintain stable regulation.
The device is designed for the harsh environment of automotive applications. Therefore standard features like
output current limitation and overtemperature shutdown are implemented and protect the device against
failures like output short circuit to GND, over-current and over-temperature. The TLS710B0 can be also used
in all other applications requiring a stabilized 5 V supply voltage.
Type
Package
Marking
TLS710B0EJV50
Data Sheet
PG-DSO-8 EP
710B0V50
3
Rev. 1.0, 2015-04-02
TLS710B0
Block Diagram
2
Block Diagram
I
Q
Current
Limitation
EN
Enable
Bandgap
Reference
Temperature
Shutdown
GND
Figure 1
Block Diagram TLS710B0EJV50
Data Sheet
4
Rev. 1.0 2015-04-02
TLS710B0
Pin Configuration
3
Pin Configuration
3.1
Pin Assignment PG-DSO-8 EP
1
2
8
7
I
Q
EN
n.c.
3
4
6
5
GND
n.c.
n.c.
n.c.
Figure 2
Pin Configuration
3.2
Pin Definitions and Functions PG-DSO-8 EP
Pin
Symbol
Function
Input
1
I
For compensating line influences, a capacitor to GND close to the IC terminals is
recommended.
2
EN
Enable (integrated pull-down resistor)
Enable the IC with high level input signal.
Disable the IC with low level input signal.
3
GND
Ground
4, 5, 6, 7 n.c.
Not connected
Leave open or connect to GND.
8
Q
–
Output
Block to GND with a capacitor close to the IC terminals, respecting the values
given for its capacitance CQ and ESR in the table “Functional Range” on Page 7.
Pad
Exposed Pad
Connect to heatsink area.
Connect with GND on PCB.
Data Sheet
5
Rev. 1.0 2015-04-02
TLS710B0
General Product Characteristics
4
General Product Characteristics
4.1
Absolute Maximum Ratings
Table 1
Absolute Maximum Ratings1)
Tj = -40 °C to +150 °C; all voltages with respect to ground (unless otherwise specified)
Parameter
Symbol
Values
Typ.
Unit Note or
Test Condition
Number
Min.
-0.3
-0.3
Max.
45
Input I, Enable EN
Voltage
VI, VEN
–
–
V
V
–
P_4.1.1
P_4.1.2
Output Q
Voltage
VQ
7
–
Temperature
Junction Temperature
Storage Temperature
ESD Absorption
ESD Susceptibility to GND
ESD Susceptibility to GND
Tj
-40
-55
–
–
150
150
°C
°C
–
–
P_4.1.3
P_4.1.4
Tstg
VESD
VESD
-2
–
–
2
kV
V
HBM2)
CDM3)
P_4.1.5
P_4.1.6
-750
750
1) Not subject to production test, specified by design.
2) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF)
3) ESD susceptibility, Charged Device Model “CDM” according JEDEC JESD22-C101
Notes
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Data Sheet
6
Rev. 1.0 2015-04-02
TLS710B0
General Product Characteristics
4.2
Functional Range
Table 2
Functional Range
Parameter
Symbol
Values
Typ. Max.
Unit Note or
Test Condition
Number
Min.
Input Voltage Range for Normal VI
VQ,nom + Vdr
–
40
V
–
P_4.2.1
Operation
1)
Extended Input Voltage Range
Enable Voltage Range
VI,ext
4.0
0
–
–
–
40
40
–
V
–
–
–
P_4.2.2
P_4.2.3
P_4.2.4
VEN
CQ
V
2)
3)
Output Capacitor’s
Requirements for Stability
1
µF
Output Capacitor’s ESR
ESR(CQ)
–
–
–
5
Ω
–
–
P_4.2.5
P_4.2.6
Junction Temperature
Ti
-40
150
°C
1) When VI is between VI,ext.min and VQ,nom + Vdr, VQ = VI - Vdr. When VI is below VI,ext,min, VQ can drop down to 0 V.
2) The minimum output capacitance requirement is applicable for a worst case capacitance tolerance of 30%
3) Relevant ESR value at f = 10 kHz
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
Data Sheet
7
Rev. 1.0 2015-04-02
TLS710B0
General Product Characteristics
4.3
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Table 3
Thermal Resistance
Symbol
Parameter
Values
Typ.
Unit Note or
Test Condition
Number
Min.
Max.
Package Version PG-DSO-8 EP
Junction to Case1)
Junction to Ambient
Junction to Ambient
RthJC
–
–
–
13
–
–
–
K/W
K/W
K/W
–
P_4.3.1
P_4.3.2
RthJA
RthJA
46
2s2p board2)
153
1s0p board, footprint P_4.3.3
only3)
Junction to Ambient
Junction to Ambient
RthJA
RthJA
–
–
71
59
–
–
K/W
K/W
1s0p board, 300 mm2
P_4.3.4
heatsink area on PCB3)
1s0p board, 600 mm2
heatsink area on PCB3)
P_4.3.5
1) Not subject to production test, specified by design
2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm
Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
3) Specified RthJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu).
Data Sheet
8
Rev. 1.0 2015-04-02
TLS710B0
Block Description and Electrical Characteristics
5
Block Description and Electrical Characteristics
5.1
Voltage Regulation
The output voltage VQ is divided by a resistor network. This fractional voltage is compared to an internal
voltage reference and drives the pass transistor accordingly.
The control loop stability depends on the output capacitor CQ, the load current, the chip temperature and the
internal circuit design. To ensure stable operation, the output capacitor’s capacitance and its equivalent
series resistor ESR requirements given in Table 2 “Functional Range” on Page 7 must be maintained. For
details see the typical performance graph “Output Capacitor Series Resistor ESR(CQ) versus Output
Current IQ” on Page 12. Since the output capacitor is used to buffer load steps, it should be sized according
to the application’s needs.
An input capacitor CI is not required for stability, but is recommended to compensate line fluctuations. An
additional reverse polarity protection diode and a combination of several capacitors for filtering should be
used, in case the input is connected directly to the battery line. Connect the capacitors close to the regulator
terminals.
Whenever the load current exceeds the specified limit, e.g. in case of a short circuit, the output current is
limited and the output voltage decreases.
The overtemperature shutdown circuit prevents the IC from immediate destruction under fault conditions
(e.g. output continuously short-circuited) by switching off the power stage. After the chip has cooled, the
regulator restarts. This oscillatory thermal behaviour causes the junction temperature to exceed the
maximum rating of 150°C and can significantly reduce the IC’s lifetime.
Regulated
Output Voltage
Supply
IQ
II
I
Q
Current
Limitation
EN
Enable
C
LOAD
Bandgap
Reference
CI
VI
VQ
ESR
Temperature
Shutdown
CQ
GND
Figure 3
Block Diagram Voltage Regulation
Data Sheet
9
Rev. 1.0 2015-04-02
TLS710B0
Block Description and Electrical Characteristics
Table 4
Electrical Characteristics Voltage Regulator
VI = 13.5 V; Tj = -40 °C to +150 °C; all voltages with respect to ground (unless otherwise specified).
Typical values are given at Tj = 25 °C, VI = 13.5 V.
Parameter
Symbol
Values
Unit Note or
Test Condition
Number
Min. Typ. Max.
Output Voltage Precision
Output Voltage Precision
Output Current Limitation
VQ
4.9
5.0
5.1
V
0.05 mA < IQ < 100 mA P_5.1.1
6 V < VI < 28 V
VQ
4.9
5.0
5.1
V
0.05 mA < IQ < 50 mA
6 V < VI < 40 V
P_5.1.2
IQ,max
101 250 350 mA
0 V < VQ < 4.8 V
4 V < VI < 28 V
P_5.1.7
Load Regulation
steady-state
|∆VQ,load
|
–
1
1
25
25
mV
mV
IQ = 0.05 mA to 100 mA P_5.1.9
VI = 6 V
Line Regulation
steady-state
Dropout Voltage1)
Vdr = VI - VQ
Power Supply Ripple Rejection2) PSRR
|∆VQ,line
|
–
VI = 8 V to 32 V
IQ = 5 mA
P_5.1.10
P_5.1.11
P_5.1.12
P_5.1.13
P_5.1.14
Vdr
–
200 500 mV
IQ = 100 mA
–
60
–
–
dB
fripple = 100 Hz
V
ripple = 0.5 Vpp
Overtemperature Shutdown
Threshold
Tj,sd
151
–
200 °C
Tj increasing2)
Overtemperature Shutdown
Threshold Hysteresis
Tj,sdh
15
–
K
Tj decreasing2)
1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5V
2) Not subject to production test, specified by design
Data Sheet
10
Rev. 1.0 2015-04-02
TLS710B0
Block Description and Electrical Characteristics
5.2
Typical Performance Characteristics Voltage Regulator
Typical Performance Characteristics
Output Voltage VQ versus
Junction Temperature Tj
Output Current IQ versus
Input Voltage VI
400
350
300
250
200
150
100
50
Tj = −40 °C
Tj = 25 °C
Tj = 150 °C
5.15
5.1
5.05
5
4.95
4.9
4.85
V = 13.5 V
I
I
= 50 mA
Q
4.8
0
0
10
20
30
40
0
50
100
150
VI [V]
T [°C]
j
Dropout Voltage Vdr versus
Junction Temperature Tj
Dropout Voltage Vdr versus
Output Current IQ
600
600
IQ = 10 mA
Tj = −40 °C
IQ = 50 mA
Tj = 25 °C
IQ = 100 mA
500
400
300
200
100
0
500
Tj = 150 °C
400
300
200
100
0
0
50
100
150
0
20
40
60
80
100
Tj [°C]
IQ [mA]
Data Sheet
11
Rev. 1.0 2015-04-02
TLS710B0
Block Description and Electrical Characteristics
Output Voltage VQ versus
Input Voltage VI
Power Supply Ripple Rejection PSRR versus
Ripple Frequency fr
6
5
4
3
2
1
100
90
80
70
60
50
40
30
I
C
= 10 mA
Q
20
10
0
= 1 μF
Q
V = 13.5 V
V
T = 25 °C
I
I
= 50 mA
= 0.5 Vpp
Q
ripple
T = 25 °C
j
j
0
10−2
10−1
100
101
102
103
0
1
2
3
4
5
6
V [V]
f [kHz]
I
Output Capacitor Series Resistor ESR(CQ) versus
Output Current IQ
102
Unstable Region
101
100
Stable Region
10−1
CQ = 1 μF
VI = 5.5 ... 28 V
10−2
0
20
40
60
80
100
IQ [mA]
Data Sheet
12
Rev. 1.0 2015-04-02
TLS710B0
Block Description and Electrical Characteristics
5.3
Current Consumption
Table 5
Electrical Characteristics Current Consumption
VI = 13.5 V; Tj = -40 °C to +150 °C (unless otherwise specified).
Typical values are given at Tj = 25 °C, VI = 13.5 V.
Parameter
Symbol
Values
Unit Note or
Test Condition
Number
Min. Typ. Max.
Current Consumption
Iq = II
Iq,off
Iq
–
1.5
5
µA
VEN ≤ 0.4 V
Tj < 105 °C
P_5.3.1
Current Consumption
–
36
80
µA
0.05 mA < IQ < 100 mA P_5.3.2
Iq = II - IQ
Data Sheet
13
Rev. 1.0 2015-04-02
TLS710B0
Block Description and Electrical Characteristics
5.4
Typical Performance Characteristics Current Consumption
Typical Performance Characteristics
Current Consumption Iq versus
Output Current IQ
Current Consumption Iq versus
Input Voltage VI
80
80
T = −40 °C
T = −40 °C
j
j
T = 25 °C
T = 25 °C
70
60
50
40
30
20
10
0
j
70
60
50
40
30
20
10
0
j
T = 150 °C
T = 150 °C
j
j
V = 13.5 V
I
I
= 50 μA
Q
0
20
40
60
80
100
10
15
20
25
I
[mA]
V [V]
I
Q
Current Consumption Iq versus
Junction Temperature Tj
Current Consumption in OFF mode Iq,off versus
Junction Temperature Tj
4
80
70
60
50
40
30
20
10
0
VI = 13.5 V
VEN ≤ 0.4 V
3.5
3
2.5
2
1.5
1
0.5
0
VI = 13.5 V
IQ = 50 μA
0
50
Tj [°C]
100
0
50
100
150
Tj [°C]
Data Sheet
14
Rev. 1.0 2015-04-02
TLS710B0
Block Description and Electrical Characteristics
5.5
Enable
The TLS710B0 can be switched on and off by the Enable feature. Connect a HIGH level as specified below (e.g.
the battery voltage) to pin EN to enable the device; connect a LOW level as specified below (e.g. GND) to switch
it off. The Enable function has a build-in hysteresis to avoid toggling between ON/OFF state, if signals with
slow slopes are appiled to the input.
Table 6
Electrical Characteristics Enable
VI = 13.5 V; Tj = -40 °C to +150 °C; all voltages with respect to ground (unless otherwise specified).
Typical values are given at Tj = 25 °C, VI = 13.5 V.
Parameter
Symbol
Values
Unit Note or
Test Condition
Number
Min. Typ. Max.
Enable Voltage High Level
Enable Voltage Low Level
Enable Threshold Hysteresis
VEN,H
VEN,L
VEN,Hy
IEN,H
2
–
–
–
–
–
V
VQ settled
P_5.5.1
P_5.5.2
P_5.5.3
P_5.5.4
–
0.8
–
V
VQ ≤ 0.1 V
–
75
–
mV
µA
Enable Input Current
Low Level
5.5
VEN = 5 V
Enable Input Current
High Level
IEN,H
REN
–
–
22
µA
VEN < 18 V
P_5.5.5
P_5.5.6
Enable internal pull-down
resistor
0.9
1.5
2.6
MΩ
–
Data Sheet
15
Rev. 1.0 2015-04-02
TLS710B0
Block Description and Electrical Characteristics
5.6
Typical Performance Characteristics Enable
Typical Performance Characteristics
Enabled Input Current IEN versus
Enabled Input Voltage VEN
40
T = −40 °C
j
T = 25 °C
35
30
25
20
15
10
5
j
T = 150 °C
j
0
0
10
20
[V]
30
40
V
EN
Data Sheet
16
Rev. 1.0 2015-04-02
TLS710B0
Application Information
6
Application Information
6.1
Application Diagram
Supply
Regulated Output Voltage
I
Q
Load
e. g.
Micro
DI1
Current
Limitation
Controller
XC22xx
CQ
1µF
(ESR <5Ω)
DI2
<45V
CI2
CI1
EN
100nF
10µF
Enable
Bandgap
Reference
GND
Temperature
Shutdown
GND
Figure 4
Application Diagram
6.2
Selection of External Components
6.2.1
Input Pin
The typical input circuitry for a linear voltage regulator is shown in the application diagram above.
A ceramic capacitor at the input, in the range of 100 nF to 470 nF, is recommended to filter out the high
frequency disturbances imposed by the line e.g. ISO pulses 3a/b. This capacitor must be placed very close to
the input pin of the linear voltage regulator on the PCB.
An aluminum electrolytic capacitor in the range of 10 µF to 470 µF is recommended as an input buffer to
smooth out high energy pulses, such as ISO pulse 2a. This capacitor should be placed close to the input pin of
the linear voltage regulator on the PCB.
An overvoltage suppressor diode can be used to further suppress any high voltage beyond the maximum
rating of the linear voltage regulator and protect the device against any damage due to over-voltage above
45 V.
The external components at the input are not mandatory for the operation of the voltage regulator, but they
are recommended in order to protect the voltage regulator against external disturbances and damages.
6.2.2
Output Pin
An output capacitor is mandatory for the stability of linear voltage regulators.
The requirement to the output capacitor is given in “Functional Range” on Page 7. The graph “Output
Capacitor Series Resistor ESR(CQ) versus Output Current IQ” on Page 12 shows the stable operation range
of the device.
TLS710B0 is designed to be stable with extremely low ESR capacitors. According to the automotive
requirements, ceramic capacitors with X5R or X7R dielectrics are recommended.
Data Sheet
17
Rev. 1.0 2015-04-02
TLS710B0
Application Information
The output capacitor should be placed as close as possible to the regulator’s output and GND pins and on the
same side of the PCB as the regulator itself.
In case of rapid transients of input voltage or load current, the capacitance should be dimensioned in
accordance and verified in the real application that the output stability requirements are fulfilled.
6.3
Thermal Considerations
Knowing the input voltage, the output voltage and the load profile of the application, the total power
dissipation can be calculated:
PD = (VI - VQ) × IQ + VI × Iq
(6.1)
with
•
•
•
•
•
PD: continuous power dissipation
VI : input voltage
VQ: output voltage
IQ: output current
Iq: quiescent current
The maximum acceptable thermal resistance RthJA can then be calculated:
RthJA,max = ( Tj,max - Ta ) / PD
(6.2)
with
•
•
T
j,max: maximum allowed junction temperature
Ta: ambient temperature
Based on the above calculation the proper PCB type and the necessary heat sink area can be determined with
reference to the specification in “Thermal Resistance” on Page 8.
Example
Application conditions:
VI = 13.5 V
VQ = 5 V
IQ = 100 mA
Ta = 85 °C
Calculation of RthJA,max
:
PD= (VI – VQ) × IQ + VI × Iq
= (13.5 V – 5 V) × 100 mA
= 0.85 W
(VI × Iq can be neglected because of very low Iq)
RthJA,max= (Tj,max – Ta) / PD
= (150 °C – 85 °C) / 0.85 W = 76.47 K/W
Data Sheet
18
Rev. 1.0 2015-04-02
TLS710B0
Application Information
As a result, the PCB design must ensure a thermal resistance RthJA lower than 76.47 K/W. According to
“Thermal Resistance” on Page 8, at least 300 mm2 heatsink area is needed on the FR4 1s0p PCB, or the FR4
2s2p board can be used.
6.4
Reverse Polarity Protection
TLS710B0 is not self protected against reverse polarity faults and must be protected by external components
against negative supply voltage. An external reverse polarity diode is needed. The absolute maximum ratings
of the device as specified in “Absolute Maximum Ratings” on Page 6 must be kept.
6.5
Further Application Information
•
For further information you may contact http://www.infineon.com/
Data Sheet
19
Rev. 1.0 2015-04-02
TLS710B0
Package Outlines
7
Package Outlines
0.35 x 45°
1)
±0.1
3.9
0.1 C D 2x
+0.06
0.19
0.08
Seating Plane
C
C
0.64±0.25
0.2
1.27
0.2
2)
M
±0.09
0.41
±0.2
D 8x
6
M
C A-B D 8x
D
Bottom View
±0.2
3
A
1
4
8
5
1
4
8
5
B
0.1 C A-B 2x
1)
±0.1
4.9
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Dambar protrusion shall be maximum 0.1 mm total in excess of lead width
3) JEDEC reference MS-012 variation BA
Figure 5
PG-DSO-8 EP
Data Sheet
20
Rev. 1.0 2015-04-02
TLS710B0
Revision History
8
Revision History
Revision
Date
Changes
1.0
2015-04-02
Data Sheet - Initial Version
Data Sheet
21
Rev. 1.0 2015-04-02
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™,
EconoDUAL™, EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, LITIX™, MIPAQ™,
ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,
ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SPOC™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited,
UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of
Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay
Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association
Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc.
MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave
Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of
Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc.
TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Last Trademarks Update 2011-11-11
www.infineon.com
Edition 2015-04-02
Published by
Infineon Technologies AG
81726 Munich, Germany
Legal Disclaimer
The information given in this document shall in
no event be regarded as
Warnings
Due to technical requirements, components
may contain dangerous substances. For
information on the types in question, please
contact the nearest Infineon Technologies
Office. Infineon Technologies components may
be used in life-support devices or systems only
with the express written approval of Infineon
Technologies, if a failure of such components
can reasonably be expected to cause the failure
of that life-support device or system or to affect
the safety or effectiveness of that device or
system. Life support devices or systems are
intended to be implanted in the human body or
to support and/or maintain and sustain and/or
protect human life. If they fail, it is reasonable to
assume that the health of the user or other
persons may be endangered.
a guarantee of
conditions or characteristics. With respect to any
examples or hints given herein, any typical
values stated herein and/or any information
regarding the application of the device, Infineon
Technologies hereby disclaims any and all
warranties and liabilities of any kind, including
without limitation, warranties of non-
infringement of intellectual property rights of
any third party.
© 2014 Infineon Technologies AG.
All Rights Reserved.
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Document reference
Doc_Number
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