SPD07N20G [INFINEON]

SIPMOSÒ Power Transistor Features N channel Enhancement mode Avalanche rated; SIPMOSà ?功率晶体管特点N沟道增强模式额定雪崩
SPD07N20G
型号: SPD07N20G
厂家: Infineon    Infineon
描述:

SIPMOSÒ Power Transistor Features N channel Enhancement mode Avalanche rated
SIPMOSÃ ?功率晶体管特点N沟道增强模式额定雪崩

晶体 晶体管 功率场效应晶体管 脉冲 局域网
文件: 总10页 (文件大小:658K)
中文:  中文翻译
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SPD 07N20 G  
SIPMOS Power Transistor  
Product Summary  
Features  
Drain source voltage  
200  
0.4  
7
V
A
V
DS  
N channel  
Drain-Source on-state resistance  
Continuous drain current  
R
DS(on)  
Enhancement mode  
I
D
Avalanche rated  
dv/dt rated  
Pin 1 Pin 2 Pin 3  
Type  
Package  
Pb-free  
Yes  
Packaging  
Tape and Reel  
Tube  
G
D
S
SPD07N20 G  
SPU07N20 G  
PG-TO252  
PG-TO251  
Yes  
Maximum Ratings, at T = 25 ˚C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
Continuous drain current  
A
I
D
T = 25 ˚C  
7
C
T = 100 ˚C  
4.5  
C
Pulsed drain current  
28  
IDpulse  
T = 25 ˚C  
C
Avalanche energy, single pulse  
120  
mJ  
E
E
AS  
I = 7 A, V = 50 V, R = 25  
D
DD  
GS  
4
6
Avalanche energy, periodic limited by T  
Reverse diode dv/dt  
jmax  
AR  
kV/µs  
dv/dt  
I = 7 A, V = 160 V, di/dt = 200 A/µs,  
S
DS  
T
= 175 ˚C  
jmax  
Gate source voltage  
Power dissipation  
V
V
P
±20  
GS  
40  
W
tot  
T = 25 ˚C  
C
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
-55... +175  
55/150/56  
˚C  
T , T  
j
stg  
Rev. 2.4  
Page 1  
2008-09-01  
SPD 07N20 G  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Characteristics  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leded  
SMD version, device on PCB:  
@ min. footprint  
-
-
3.1 K/W  
100  
R
thJC  
-
R
thJA  
R
thJA  
-
-
-
75  
50  
2
1)  
@ 6 cm cooling area  
-
Electrical Characteristics, at T = 25 ˚C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
min.  
200  
2.1  
typ. max.  
Static Characteristics  
Drain- source breakdown voltage  
-
-
V
V
V
(BR)DSS  
V
= 0 V, I = 0.25 mA  
D
GS  
3
4
Gate threshold voltage, V = V  
GS  
DS  
GS(th)  
I = 1 mA  
D
Zero gate voltage drain current  
µA  
I
DSS  
V
V
= 200 V, V = 0 V, T = 25 ˚C  
-
-
0.1  
-
1
DS  
DS  
GS  
j
= 200 V, V = 0 V, T = 125 ˚C  
100  
GS  
j
Gate-source leakage current  
= 20 V, V = 0 V  
-
10  
100 nA  
I
GSS  
V
GS  
DS  
Drain-Source on-state resistance  
R
DS(on)  
V
= 10 V, I = 4.5 A  
D
-
0.3  
0.4  
GS  
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Rev. 2.4  
Page 2  
2008-09-01  
SPD 07N20 G  
Electrical Characteristics, at T = 25 ˚C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
Transconductance  
3
-
4.2  
400  
85  
-
S
g
fs  
V
2*I *R  
, I = 4.5 A  
DS(on)max D  
DS  
D
Input capacitance  
= 0 V, V = 25 V, f = 1 MHz  
530  
130  
70  
pF  
C
C
C
iss  
V
GS  
DS  
Output capacitance  
= 0 V, V = 25 V, f = 1 MHz  
-
oss  
rss  
V
GS  
DS  
Reverse transfer capacitance  
= 0 V, V = 25 V, f = 1 MHz  
-
45  
V
GS  
DS  
Turn-on delay time  
= 30 V, V = 10 V, I = 3 A,  
-
10  
15  
ns  
t
d(on)  
V
DD  
GS  
D
R = 50  
G
Rise time  
-
-
-
40  
55  
30  
60  
75  
40  
t
r
V
= 30 V, V = 10 V, I = 3 A,  
GS D  
DD  
R = 50  
G
Turn-off delay time  
= 30 V, V = 10 V, I = 3 A,  
t
d(off)  
V
DD  
GS  
D
R = 50  
G
Fall time  
t
f
V
= 30 V, V = 10 V, I = 3 A,  
GS D  
DD  
R = 50  
G
Rev. 2.4  
Page 3  
2008-09-01  
SPD 07N20 G  
Electrical Characteristics, at T = 25 ˚C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
Gate to source charge  
5
10  
21  
7
7.5 nC  
-
-
-
-
Q
Q
gs  
V
= 160 V, I = 7 A  
D
DD  
Gate to drain charge  
= 160 V, I = 7 A  
22.5  
31.5  
-
gd  
V
DD  
D
Gate charge total  
= 160 V, I = 7 A, V = 0 to 10 V  
Q
g
V
DD  
D
GS  
Gate plateau voltage  
= 160 V, I = 7 A  
V
V
(plateau)  
V
DD  
D
Reverse Diode  
Inverse diode continuous forward current  
-
-
-
-
-
-
7
A
V
I
S
T = 25 ˚C  
C
Inverse diode direct current,pulsed  
-
28  
1.7  
I
SM  
T = 25 ˚C  
C
Inverse diode forward voltage  
1.3  
200  
0.6  
V
SD  
V
= 0 V, I = 14 A  
F
GS  
Reverse recovery time  
V = 100 V, I =I , di /dt = 100 A/µs  
300 ns  
t
rr  
R
F
S
F
Reverse recovery charge  
µC  
0.9  
Q
rr  
V = 100 V, I =l , di /dt = 100 A/µs  
R
F S  
F
Rev. 2.4  
Page 4  
2008-09-01  
SPD 07N20 G  
Power Dissipation  
Drain current  
P
= f (T )  
C
I = f (T )  
tot  
D
C
parameter: V 10 V  
GS  
SPD07N20  
SPD07N20  
45  
7.5  
A
W
6.0  
5.5  
5.0  
35  
30  
25  
20  
15  
10  
5
4.5  
P
I
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0
˚C  
0
20  
40  
60  
80 100 120  
160  
˚C  
0
20  
40  
60  
80 100 120  
160  
T
T
C
C
Transient thermal impedance  
= f (t )  
Safe operating area  
I = f (V  
Z
)
DS  
thJC  
p
D
parameter : D = t /T  
parameter : D = 0 , T = 25 ˚C  
p
C
SPD07N20  
10 1  
SPD07N20  
10 2  
K/W  
A
= 22.0µs  
100 µs  
t
p
I
10 0  
V
10 1  
R
Z
I
10 -1  
1 ms  
D = 0.50  
0.20  
10 0  
0.10  
10 ms  
0.05  
10 -2  
0.02  
0.01  
single pulse  
DC  
10 2  
10 -3  
10 -1  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
10 0  
10 1  
10 3  
s
V
t
V
p
DS  
Rev. 2.4  
Page 5  
2008-09-01  
SPD 07N20 G  
Typ. output characteristics  
I = f (V  
Typ. drain-source-on-resistance  
= f (I )  
)
DS  
D
R
DS(on)  
D
parameter: t = 80 µs  
p
parameter: V  
SPD07N20  
GS  
17  
SPD07N20  
P
tot = 40W  
1.3  
A
a
b
c
l
e
d
j
i
k
h
f
g
V
[V]  
GS  
a
14  
1.1  
1.0  
0.9  
4.0  
4.5  
b
c
d
e
f
12  
10  
8
5.0  
5.5  
6.0  
e
I
0.8  
6.5  
R
g
h
i
7.0  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
7.5  
d
8.0  
j
9.0  
6
k
l
10.0  
20.0  
c
a
4
f
g
k
h
b
j
l
i
2
V
[V] =  
GS  
a
b
c
d
e
6.0  
f
0.1  
0.0  
g
7.0  
h
7.5  
k
l
i
j
4.0 4.5  
5.0 5.5  
6.5  
10.0  
20.0  
8.0 9.0  
0
V
0
2
4
6
8
11  
A
0
2
4
6
8
12  
V
DS  
I
D
Typ. forward transconductance  
Typ. transfer characteristics I = f (V  
)
GS  
D
g = f(I ); T = 25˚C  
parameter: t = 80 µs  
fs  
D
j
p
parameter: g  
V
2 x I x R  
fs  
DS  
D
DS(on) max  
13  
A
6
11  
10  
9
S
4
8
I
g
7
3
2
1
0
6
5
4
3
2
1
0
V
0
1
2
3
4
5
6
7
8
10  
0
2
4
A
10 12 14 16 18  
21  
6
8
V
GS  
I
D
Rev. 2.4  
Page 6  
2008-09-01  
SPD 07N20 G  
Gate threshold voltage  
= f (T )  
Drain-source on-resistance  
= f (T )  
V
GS(th)  
j
R
DS(on)  
j
parameter : V = V , I = 1 mA  
GS  
DS D  
parameter : I = 4.5 A, V = 10 V  
D
GS  
SPD07N20  
5.0  
V
1.8  
4.4  
4.0  
3.6  
3.2  
2.8  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
max  
V
R
typ  
98%  
typ  
min  
˚C  
-60  
-20  
20  
60  
100  
160  
˚C  
-60  
-20  
20  
60  
100  
140  
200  
T
j
T
j
Typ. capacitances  
C = f (V  
Forward characteristics of reverse diode  
I = f (V  
)
)
SD  
DS  
F
parameter: V = 0 V, f = 1 MHz  
parameter: T , t = 80 µs  
GS  
j
p
10 4  
SPD07N20  
10 2  
pF  
A
10 3  
10 2  
10 1  
10 1  
10 0  
10 -1  
I
C
iss  
C
C
oss  
rss  
Tj = 25 ˚C typ  
Tj = 150 ˚C typ  
Tj = 25 ˚C (98%)  
Tj = 150 ˚C (98%)  
V
0
5
10  
15  
20  
25  
30  
40  
V
0.0  
0.4  
0.8  
1.2  
1.6  
2.0  
2.4  
3.0  
V
DS  
V
SD  
Rev. 2.4  
Page 7  
2008-09-01  
SPD 07N20 G  
Typ. gate charge  
Avalanche Energy E = f (T )  
AS  
j
V
= f (Q  
)
parameter: I = 7 A, V = 50 V  
GS  
Gate  
D
DD  
parameter: I  
= 7 A  
R
= 25  
D puls  
GS  
SPD07N20  
16  
130  
mJ  
V
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
12  
10  
8
V
V
DS max  
0,2  
0,8  
DS max  
V
E
6
4
2
0
0
4
8
12  
16  
20  
24  
28 nC  
34  
˚C  
20  
40  
60  
80  
100  
120  
160  
T
Q
Gate  
j
Drain-source breakdown voltage  
V
= f (T )  
(BR)DSS  
j
SPD07N20  
245  
V
235  
230  
225  
220  
215  
210  
205  
200  
195  
190  
185  
180  
V
˚C  
-60  
-20  
20  
60  
100  
180  
T
j
Rev. 2.4  
Page 8  
2008-09-01  
SPD 07N20 G  
Package outline: PG-TO252-3  
Rev. 2.4  
Page 9  
2008-09-01  
SPD 07N20 G  
Rev. 2.4  
Page 10  
2008-09-01  

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