SC125H100S5R [INFINEON]
Rectifier Diode, Schottky, 1 Element, 100V V(RRM);
| 型号： | SC125H100S5R |
| 厂家： | 
Infineon |
| 描述： | Rectifier Diode, Schottky, 1 Element, 100V V(RRM) 二极管 |
| 文件： | 总5页 (文件大小：138K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary Data Sheet I0507J rev. B 03/01
SC125.....5.. Series
SCHOTTKY DIE 125 x 125 mils
NOTES:
a
c
0.35 ± 0.01
(0.14 ± 0.0004)
1. ALL DIMENSIONS ARE SHOWN IN
MILLIMETERS (INCHES).
Ink Dot Location
2. CONTROLLING DIMENSION: (INCH).
3. DIMENSIONS AND TOLERANCES:
C
A
a = 3.175 + 0, - 0.05
(0.125 + 0, - 0.002)
b = 3.175 + 0, - 0.05
(0.125 + 0, - 0.002)
c = 2.921 + 0, - 0.003
(0.115 + 0, - 0.0001)
d = 2.921 + 0, - 0.003
(0.115 + 0, - 0.0001)
D
Ø
f
40 (1.57)
Ø = 0.7 ± 0.1
(0.03 ± 0.004)
Wafer flat aligned with
side b of the die
4. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
D = Reject Ink Dot (only on non-conforming dies)
5. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Ø 125 (4.92)
NOT TO SCALE
NOTE: 10 mils die thickness is available on specific request only.
Contact factory for information.
1
SC125.....5. Series
Preliminary Data Sheet I0507J rev. B 03/01
Electrical Characteristics
Device
#
T
Max.
V
(V)
Typ. I @ 25°C Typ. I @ 125°C
Max. V @ I
F F
Package
Style
J
R
R
R
(°C)
(µA)
(mA)
(V)
SC125R015x5x
SC125S020x5x
SC125S030x5x
SC125S045x5x
SC125S060x5x
SC125H045x5x
SC125H100x5x
SC125H150x5x
125
150
150
150
150
175
175
175
15
n.a. contact factory
20
700
220
150
110
35
180
100
75
60
10
7
0.51 @ 40A
0.49 @ 15A
0.54 @ 15A
0.60 @ 15A
0.62 @ 15A
0.86 @ 15A
1.0 @ 15A
TO-220
TO-220
TO-247
TO-247
TO-220
TO-247
TO-220
30
45
60
45
100
150
12
15
10
Mechanical Data
Device
MetalThickness
Front Metal
MetalThickness
#
Back Metal
SC125xxxxA5x
SC125xxxxS5x
Bondable
Solderable
--
Al/Si 30 kÅ
--
Cr 1 kÅ
Cr 1 kÅ
Ni 2 kÅ
Ni 2 kÅ
Ag 3 kÅ
Ag 3 kÅ
Ti 2 kÅ
Ni 1 kÅ
Ag 35 kÅ
RecommendedStorageEnvironment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device
Description
Minimum Order Quantity
Die in Sale Package
#
SC125xxxxx5B
SC125xxxxx5R
SC125xxxxx5P
SC125xxxxx5F
Inked Probed Unsawn Wafer (Wafer in Box)
Probed Die in Tape & Reel
950
8000
950
Probed Die in Waffle Pack
Inked Probed Sawn Wafer on Film
950
2
SC125.....5. Series
Preliminary Data Sheet I0507J rev. B 03/01
Ordering Information Table
Device Code
SC 125
H
100
A
5
B
1
2
3
4
5
6
7
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Schottky Die
Chip Dimension in Mils (125 x 125)
H = 830 Process
R = OR' ing Process
S = Standard Process
Process (see Electrical Characteristics Table)
Voltage code: Code = VRRM
Chip surface metallization (Al)
Wafer Diameter in inches
Packaging (B = inked Probed Unsawn Wafers)
Wafer on Film
STEEL FRAME
3
SC125.....5. Series
Preliminary Data Sheet I0507J rev. B 03/01
Wafer in Box
ROUNDCONTAINER
TYVEK DISK
FOAM DISK
Die in Waffle Pack
CHIPTRAYPOCKET
4
SC125.....5. Series
Preliminary Data Sheet I0507J rev. B 03/01
Die in Waffle Pack
REEL FRAME
BARE DIE CARRIER TAPE
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7309
Visit us at www.irf.com for sales contact information. 03/01
5
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