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SC125R015A5B [VISHAY]

Rectifier Diode, Schottky, 1 Element, 15V V(RRM),;
SC125R015A5B
型号： SC125R015A5B
厂家： VISHAY    VISHAY
描述：

Rectifier Diode, Schottky, 1 Element, 15V V(RRM),

二极管
文件： 总6页 (文件大小：146K)
中文：  中文翻译
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Bulletin I0507J rev. F 03/07  
SC125.....5. Series  
SCHOTTKY DIE 125 x 125 mils  
40 (157)  
Wafer flat alligned with  
side b of the die  
a
c
0.35 ± 0.01  
(14 ± 0.4)  
C
D
A
NOTES:  
1. ALL DIMENSIONS ARE SHOWN IN  
MILLIMETERS (MILS).  
Ø
2. CONTROLLING DIMENSION: (MILS).  
Ø 125 (492)  
3. LETTER DESIGNATION:  
A = Anode (Top Metal)  
C = Cathode (Back Metal)  
D = Reject Ink Dot (only on non-conforming dies)  
4. SAWING:  
Recommended Blade  
SEMITEC S1025 QS00 Blade  
Sawing Street  
NOT TO SCALE  
0.05 +0, - 0.005  
(2 +0, - 0.2)  
5. DIMENSIONS AND TOLERANCES  
Device  
#
T
J
Max.  
V
A
B
C
D
diameter  
R
(°C)  
(V)  
SC125R015x5x  
125  
150  
15  
3.17 + 0, - 0.01 3.17 + 0, - 0.01 2.92 + 0, - 0.01 2.92 + 0, - 0.01  
(125 + 0, - 0.4) (125 + 0, - 0.4) (115 + 0, - 0.4) (115 + 0, - 0.4)  
1
0.15  
6
40  
SC125S020x5x  
20  
3.17 + 0, - 0.01 3.17 + 0, - 0.01 2.92 + 0, - 0.01 2.92 + 0, - 0.01  
(125 + 0, - 0.4) (125 + 0, - 0.4) (115 + 0, - 0.4) (115 + 0, - 0.4)  
1
40  
0.15  
6
SC125S030x5x  
150  
150  
30  
45  
3.17 + 0, - 0.01 3.17 + 0, - 0.01 2.92 + 0, - 0.01 2.92 + 0, - 0.01  
(125 + 0, - 0.4) (125 + 0, - 0.4) (115 + 0, - 0.4) (115 + 0, - 0.4)  
1
0.15  
6
40  
SC125S045x5x (*)  
3.17 + 0, - 0.01 3.17 + 0, - 0.01 2.92 + 0, - 0.01 2.92 + 0, - 0.01  
(125 + 0, - 0.4) (125 + 0, - 0.4) (115 + 0, - 0.4) (115 + 0, - 0.4)  
1
40  
0.15  
6
SC125S060x5x (*)  
SC125H045x5x  
150  
175  
60  
45  
3.17 + 0, - 0.01 3.17 + 0, - 0.01 2.92 + 0, - 0.01 2.92 + 0, - 0.01  
(125 + 0, - 0.4) (125 + 0, - 0.4) (115 + 0, - 0.4) (115 + 0, - 0.4)  
1
40  
0.15  
6
3.17 + 0, - 0.01 3.17 + 0, - 0.01 2.92 + 0, - 0.01 2.92 + 0, - 0.01  
(125 + 0, - 0.4) (125 + 0, - 0.4) (115 + 0, - 0.4) (115 + 0, - 0.4)  
1
40  
0.15  
6
SC125H100x5x  
SC125H150x5x  
175  
175  
100  
150  
3.17 + 0, - 0.01 3.17 + 0, - 0.01 2.92 + 0, - 0.01 2.92 + 0, - 0.01  
(125 + 0, - 0.4) (125 + 0, - 0.4) (115 + 0, - 0.4) (115 + 0, - 0.4)  
1
0.15  
6
40  
3.17 + 0, - 0.01 3.17 + 0, - 0.01 2.92 + 0, - 0.01 2.92 + 0, - 0.01  
(125 + 0, - 0.4) (125 + 0, - 0.4) (115 + 0, - 0.4) (115 + 0, - 0.4)  
1
40  
0.15  
6
(*) Thickness 0.25 0.01 (10 0.4)  
www.vishay.com  
1
Document Number: 93866  
SC125.....5. Series  
Bulletin I0507J rev. F 03/07  
Electrical Characteristics  
Device  
#
T
J
Max.  
V
Typ. I @ 25°C Typ. I @ 125°C Max. V @ I @ 25°C Package  
R
R
R
F
F
(°C)  
(V)  
(μA)  
(mA)  
(V)  
Style  
SC125R015x5x  
SC125S020x5x  
SC125S030x5x  
SC125S045x5x  
SC125S060x5x  
SC125H045x5x  
SC125H100x5x  
SC125H150x5x  
125  
150  
150  
150  
150  
175  
175  
175  
15  
3.5  
700  
220  
150  
110  
35  
300 (100°C)  
0.31 @ 9A  
0.51 @ 40A  
0.49 @ 15A  
0.54 @ 15A  
0.60 @ 15A  
0.62 @ 15A  
0.86 @ 15A  
1.0 @ 15A  
DO-204  
TO-220  
TO-220  
TO-247  
TO-247  
TO-220  
TO-247  
TO-220  
20  
180  
100  
75  
60  
10  
7
30  
45  
60  
45  
100  
150  
12  
15  
10  
Mechanical Data  
Device  
#
MetalThickness  
Front Metal  
MetalThickness  
Back Metal  
SC125xxxxA5x  
SC125xxxxS5x  
Bondable  
Solderable  
--  
Al (1% Si) 30 kÅ  
Ni 1 kÅ  
--  
Cr 1 kÅ  
Ni 2 kÅ  
Ag 3 kÅ  
Ag 3 kÅ  
Ti 2 kÅ  
Ag 35 kÅ Cr 1 kÅ  
Ni 2 kÅ  
RecommendedStorageEnvironment: Store in original container, in dessicated nitrogen, with no contamination.  
Shelf life for parts stored in above condition is 2 years.  
If the storage is done in normal atmosphere shelf life is reduced to six months.  
Packaging  
Device  
#
Description  
Minimum Order Quantity  
Die in Sale Package  
SC125xxxxx5B  
SC125xxxxx5R  
SC125xxxxx5P  
SC125xxxxx5F  
Inked Probed Unsawn Wafer (Wafer in Box)  
Probed Die in Tape & Reel  
950  
8000  
950  
Probed Die in Waffle Pack  
Inked Probed Sawn Wafer on Film  
950  
www.vishay.com  
2
Document Number: 93866  
SC125.....5. Series  
Bulletin I0507J rev. F 03/07  
Ordering Information Table  
Device Code  
SC 125  
H
030  
A
5
B
3
4
7
1
2
5
6
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Schottky Die  
Die Size Code  
H = 830 Process  
R = OR' ing Process  
S = Standard Process  
Process (see Electrical Characteristics Table)  
Voltage code: Code = VRRM  
Chip surface metallization (Al)  
Wafer Diameter in inches  
Packaging (B = inked Probed Unsawn Wafers)  
Wafer on Film  
STEEL FRAME  
www.vishay.com  
3
Document Number: 93866  
SC125.....5. Series  
Bulletin I0507J rev. F 03/07  
Wafer in Box  
ROUND CONTAINER  
TYVEK DISK  
FOAM DISK  
Die in Waffle Pack  
CHIP TRAY POCKET  
www.vishay.com  
4
Document Number: 93866  
SC125.....5. Series  
Bulletin I0507J rev. F 03/07  
Tape and Reel  
REEL FRAME  
BARE DIE CARRIER TAPE  
Data and specifications subject to change without notice.  
This product has been designed for Industrial Level.  
Qualification Standards can be found on IR's Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7309  
Visit us at www.irf.com for sales contact information. 03/07  
www.vishay.com  
5
Document Number: 93866  
Legal Disclaimer Notice  
Vishay  
Notice  
The products described herein were acquired by Vishay Intertechnology, Inc., as part of its acquisition of  
International Rectifier’s Power Control Systems (PCS) business, which closed in April 2007. Specifications of the  
products displayed herein are pending review by Vishay and are subject to the terms and conditions shown below.  
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or  
anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.  
Information contained herein is intended to provide a product description only. No license, express or implied, by  
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's  
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express  
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness  
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.  
Customers using or selling these products for use in such applications do so at their own risk and agree to fully  
indemnify Vishay for any damages resulting from such improper use or sale.  
International Rectifier®, IR®, the IR logo, HEXFET®, HEXSense®, HEXDIP®, DOL®, INTERO®, and POWIRTRAIN®  
are registered trademarks of International Rectifier Corporation in the U.S. and other countries. All other product  
names noted herein may be trademarks of their respective owners.  
Document Number: 99901  
Revision: 12-Mar-07  
www.vishay.com  
1

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