Q67040-S4130-A2 [INFINEON]

SIPMOS PowerTransistor; SIPMOS PowerTransistor
Q67040-S4130-A2
型号: Q67040-S4130-A2
厂家: Infineon    Infineon
描述:

SIPMOS PowerTransistor
SIPMOS PowerTransistor

文件: 总8页 (文件大小:140K)
中文:  中文翻译
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SPD 09N05  
SIPMOS PowerTransistor  
Product Summary  
Features  
Drain source voltage  
55  
0.1  
9.2  
V
V
DS  
N channel  
Drain-Source on-state resistance  
Continuous drain current  
R
Enhancement mode  
DS(on)  
A
I
D
Avalanche rated  
d  
v/dt rated  
175˚C operating temperature  
Pin 1 Pin 2 Pin 3  
Type  
Package  
P-TO252  
P-TO251  
Ordering Code  
Packaging  
G
D
S
SPD09N05  
SPU09N05  
Q67040-S4136  
Tape and Reel  
Q67040-S4130-A2 Tube  
MaximumRatings , at  
T
= 25 ˚C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
Continuous drain current  
A
I
D
T
= 25 ˚C  
9.2  
6.5  
C
T
C
= 100 ˚C  
Pulsed drain current  
= 25 ˚C  
37  
IDpulse  
T
C
Avalanche energy, single pulse  
= 9.2 A, = 25 V, = 25  
35  
mJ  
E
E
AS  
I
D
V
DD  
R
GS  
2.4  
6
Avalanche energy, periodic limited by  
Reverse diode d /d  
= 9.2 A, = 40 V, d  
T
jmax  
AR  
kV/µs  
v
t
d
v
/d  
t
I
S
V
i/d  
t
= 200 A/µs  
DS  
Gate source voltage  
Power dissipation  
V
V
P
±20  
GS  
24  
W
tot  
T
= 25 ˚C  
C
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
-55... +175  
55/175/56  
˚C  
T , T  
j stg  
Data Sheet  
1
06.99  
SPD 09N05  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Characteristics  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leded  
SMD version, device on PCB:  
@ min. footprint  
-
-
-
-
6.25 K/W  
R
thJC  
100  
R
thJA  
R
thJA  
-
-
-
-
75  
50  
2
1)  
@ 6 cm cooling area  
Electrical Characteristics, at T = 25 ˚C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
min.  
55  
typ. max.  
Static Characteristics  
Drain- source breakdown voltage  
-
-
V
V
V
(BR)DSS  
GS(th)  
V
= 0 V, I = 0.25 mA  
D
GS  
2.1  
3
4
Gate threshold voltage, V = V  
GS  
DS  
I = 10 µA  
D
Zero gate voltage drain current  
µA  
I
DSS  
V
V
= 50 V, V = 0 V, T = 25 ˚C  
-
-
0.1  
-
1
DS  
DS  
GS  
j
= 50 V, V = 0 V, T = 150 ˚C  
100  
GS  
j
Gate-source leakage current  
= 20 V, V = 0 V  
-
10  
100 nA  
I
GSS  
V
GS  
DS  
Drain-Source on-state resistance  
R
DS(on)  
V
= 10 V, I = 6.5 A  
D
-
0.093  
0.1  
GS  
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Data Sheet  
2
06.99  
SPD 09N05  
Electrical Characteristics, at T = 25 ˚C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
Transconductance  
3
-
4.5  
215  
75  
-
S
g
fs  
V
2*I *R  
, I = 6.5 A  
DS(on)max D  
DS  
D
Input capacitance  
= 0 V, V = 25 V, f = 1 MHz  
270 pF  
C
C
C
iss  
V
GS  
DS  
Output capacitance  
= 0 V, V = 25 V, f = 1 MHz  
-
95  
60  
oss  
rss  
V
GS  
DS  
Reverse transfer capacitance  
= 0 V, V = 25 V, f = 1 MHz  
-
45  
V
GS  
DS  
Turn-on delay time  
= 30 V, V = 10 V, I = 9.2 A,  
-
15  
25  
30  
45  
40  
ns  
t
d(on)  
V
DD  
GS  
D
R = 50 Ω  
G
Rise time  
-
-
-
20  
30  
25  
t
r
V
= 30 V, V = 10 V, I = 9.2 A,  
GS D  
DD  
R = 50 Ω  
G
Turn-off delay time  
= 30 V, V = 10 V, I = 9.2 A,  
t
d(off)  
V
DD  
GS  
D
R = 50 Ω  
G
Fall time  
t
f
V
= 30 V, V = 10 V, I = 9.2 A,  
GS D  
DD  
R = 50 Ω  
G
Data Sheet  
3
06.99  
SPD 09N05  
Electrical Characteristics, at T = 25 ˚C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
Gate to source charge  
-
-
-
-
1.3  
3.5  
7
2
5.25  
11  
-
nC  
Q
Q
gs  
V
= 40 V, I = 9.2 A  
D
DD  
Gate to drain charge  
= 40 V, I = 9.2 A  
gd  
V
DD  
D
Gate charge total  
= 40 V, I = 9.2 A, V = 0 to 10 V  
Q
g
V
DD  
D
GS  
Gate plateau voltage  
= 40 V, I = 9.2 A  
5.9  
V
V
(plateau)  
V
DD  
D
Reverse Diode  
Inverse diode continuous forward current  
-
-
-
-
-
-
-
9.2  
37  
A
I
S
T = 25 ˚C  
C
Inverse diode direct current,pulsed  
I
SM  
T = 25 ˚C  
C
Inverse diode forward voltage  
1.05  
50  
1.8  
75  
V
V
SD  
V
= 0 V, I = 18.5 A  
F
GS  
Reverse recovery time  
V = 30 V, I =I , di /dt = 100 A/µs  
ns  
t
rr  
R
F
S
F
Reverse recovery charge  
0.085 0.13 µC  
Q
rr  
V = 30 V, I =l , di /dt = 100 A/µs  
R
F S  
F
Data Sheet  
4
06.99  
SPD 09N05  
Power Dissipation  
Drain current  
I = f (T )  
P
= f (T )  
C
tot  
D
C
parameter: V 10 V  
GS  
SPD09N05  
SPD09N05  
26  
11  
W
A
22  
20  
18  
16  
14  
12  
10  
8
9
8
7
P
I
6
5
4
3
2
1
0
6
4
2
0
˚C  
˚C  
190  
0
20 40 60 80 100 120 140 160  
190  
0
20 40 60 80 100 120 140 160  
T
T
C
C
Safe operating area  
I = f (V )  
Transient thermal impedance  
Z
= f (t )  
p
D
DS  
thJC  
parameter : D = 0 , T = 25 ˚C  
parameter : D = t /T  
C
p
SPD09N05  
SPD09N05  
10 1  
10 2  
K/W  
t
= 2.5µs  
p
A
10 0  
I
10 µs  
10 1  
V
I
Z
100 µs  
10 -1  
R
D = 0.50  
0.20  
10 0  
0.10  
1 ms  
0.05  
10 -2  
single pulse  
10 ms  
0.02  
DC  
V
0.01  
10 -1  
10 -3  
10 -1  
10 0  
10 1  
10 2  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
s
V
t
p
DS  
Data Sheet  
5
06.99  
SPD 09N05  
Typ. output characteristics  
I = f (V )  
Typ. drain-source-on-resistance  
= f (I )  
D
DS  
R
DS(on)  
D
parameter: t = 80 µs  
p
parameter: V  
GS  
SPD09N05  
SPD09N05  
24  
A
Ptot = 24W  
0.32  
c
d
e
f
g
h
i
V
[V]  
GS  
a
20  
18  
16  
14  
12  
10  
8
k
j
l
4.0  
4.5  
b
c
d
e
f
0.24  
0.20  
0.16  
0.12  
0.08  
0.04  
0.00  
i
5.0  
5.5  
h
6.0  
I
R
6.5  
g
g
h
i
7.0  
7.5  
f
8.0  
j
l
j
9.0  
k
e
k
l
10.0  
20.0  
6
d
b
4
c
a
V
[V] =  
d
GS  
c
2
e
f
g
h
i
j
k
l
5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 20.0  
0
V
0.0  
1.0  
2.0  
3.0  
4.0  
5.5  
A
0
2
4
6
8
10 12 14 16  
19  
V
DS  
I
D
Typ. forward transconductance  
Typ. transfer characteristics I = f (V  
)
D
GS  
g = f(I ); T = 25˚C  
parameter: t = 80 µs  
fs  
D
j
p
parameter: g  
V
2 x I x R  
fs  
DS  
D
DS(on) max  
30  
A
6
S
20  
15  
10  
5
4
I
g
3
2
1
0
0
V
A
0
1
2
3
4
5
6
7
8
10  
0
2
4
6
8
10 12 14 16  
20  
V
GS  
I
D
Data Sheet  
6
06.99  
SPD 09N05  
Gate threshold voltage  
= f (T )  
Drain-source on-resistance  
= f (T )  
V
GS(th)  
j
R
DS(on)  
j
parameter : V = V , I = 10 µA  
GS  
DS D  
parameter : I = 6.5 A, V = 10 V  
D
GS  
SPD09N05  
5.0  
V
0.34  
4.4  
4.0  
3.6  
3.2  
2.8  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
0.28  
0.24  
0.20  
0.16  
0.12  
0.08  
0.04  
0.00  
V
R
max  
98%  
typ  
typ  
min  
V
-60  
-20  
20  
60  
100  
140  
200  
˚C  
-60  
-20  
20  
60  
100  
140  
200  
T
j
T
j
Typ. capacitances  
Forward characteristics of reverse diode  
C = f (V )  
I = f (V )  
DS  
F
SD  
parameter: V = 0 V, f = 1 MHz  
parameter: T , t = 80 µs  
GS  
j
p
SPD09N05  
10 3  
10 2  
A
pF  
10 1  
10 0  
10 -1  
Ciss  
I
10 2  
Coss  
Crss  
Tj = 25 ˚C typ  
Tj = 175 ˚C typ  
Tj = 25 ˚C (98%)  
Tj = 175 ˚C (98%)  
10 1  
V
0
5
10  
15  
20  
25  
30  
40  
V
0.0  
0.4  
0.8  
1.2  
1.6  
2.0  
2.4  
3.0  
VDS  
V
SD  
Data Sheet  
7
06.99  
SPD 09N05  
Typ. gate charge  
Avalanche Energy E = f (T )  
AS  
j
V
= f (Q  
)
parameter: I = 9.2 A, V = 25 V  
GS  
Gate  
D
DD  
parameter: I  
= 9.2 A  
R
= 25 Ω  
D puls  
GS  
SPD09N05  
40  
16  
V
mJ  
30  
25  
20  
15  
10  
5
12  
10  
8
E
V
V
V
DS max  
0,2  
0,8  
DS max  
6
4
2
0
0
˚C  
20  
40  
60  
80 100 120 140  
180  
0
2
4
6
8
11  
Gate  
nC  
Q
T
j
Drain-source breakdown voltage  
V
= f (T )  
(BR)DSS  
j
SPD09N05  
66  
V
64  
62  
60  
58  
56  
54  
52  
50  
V
˚C  
-60  
-20  
20  
60  
100  
140  
200  
T
j
Data Sheet  
8
06.99  

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