OPTIGA TRUST B SLE 95250 [INFINEON]
*This product is "not recommended for new designs". Check out our new OPTIGA™ Authenticate S for your device authentication needs.;
| 型号： | OPTIGA TRUST B SLE 95250 |
| 厂家： | 
Infineon |
| 描述： | *This product is "not recommended for new designs". Check out our new OPTIGA™ Authenticate S for your device authentication needs. |
| 文件： | 总22页 (文件大小：1744K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPTIGATM Trust
Product Authenication Family
SLE95250
OPTIGATM Trust B Authentication IC
Brief Databook
Revision 2.01, 2021-03-02
Connected Secure Systems
Edition 2021-03-02
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2020 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
OPTIGATM Trust B
DataBook
Revision History
Page or Item
Subjects (major changes since previous revision)
<Revision 2.01>, 2021-03-02
Minor typo and update
Added the UTAC package drawing
<Revision 1.01>,2016-12-15
Updated Electrical Specification
<Revision 0.91>, 2016-06-15
Updated Life span counter operation
<Revision 0.9>, 2016-04-15
Initial Release
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™,
ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™,
POWERCODE™; PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,
ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2011-11-11
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System Description
3
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OPTIGATM Trust B
DataBook
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1
Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abstract . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Document definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Textual Convention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations and Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.1
1.2
1.3
1.4
1.5
2
2.1
2.2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Application Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3
3.1
3.2
Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Typical Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Support Mode of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4
Signals Description for PG-TSNP-6-9 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pin Configuration (PG-TSNP-6-9 Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Pin Description (PG-TSNP-6-9 Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Package Outline: PG-TSNP-6-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1
4.2
4.3
4.4
4.4.1
5
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SWI I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SWI Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Authentication Response Computation Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.1
5.2
5.3
5.4
5.5
5.6
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OPTIGATM Trust B
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List of Figures
List of Figures
Figure 3-1 Application Diagram of OPTIGATM Trust B based on Direct Power. . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 3-2 Application Diagram of OPTIGATM Trust B based on Indirect Power . . . . . . . . . . . . . . . . . . . . . . 12
Figure 4-1 Pin Configuration (PG-TSNP-6-9 Package) - Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 4-2 PG-TSNP-6-9 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Product Specification
System Description
5
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OPTIGATM Trust B
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List of Tables
List of Tables
Table 3-1 Mode of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 4-1 Abbreviations for Pin Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 4-2 Abbreviations for Buffer Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 4-3 I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 4-4 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 4-5 Ground Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 4-6 PG-TSNP-6-9 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 5-1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 5-2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 5-3 SWI I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 5-4 SWI Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 5-5 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 5-6 Authentication Response Computation Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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OPTIGATM Trust B
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Preface
1
Preface
This document describes on the operation and interface characteristics of the OPTIGATM Trust B design.
1.1
Abstract
This document is the device specification for OPTIGATM Trust B design.
1.2
Document definitions
This document describes the architecture and behavior of the OPTIGATM Trust B design.
1.3
Disclaimer
Infineon is as diligent as possible in compiling and updating the information on this databook. However, Infineon
does not guarantee the correctness and completeness of the information provided. Equally, Infineon does not
guarantee that this information is up to date. For questions concerning our products, their specifications and their
utilization please contact Infineon for the latest specification. Features and spec values may be changed without
notice.
1.4
Textual Convention
This document uses the following textual conventions:
•
•
•
Functional units of subsystems are given in plain UPPER CASE. For example: “The SSC can be used to
communicate with shift registers.”.
Pins using negative logic are indicated by a N postfix. For example: “A reset input pin, RESETN, is provided
for the hardware reset.”.
Bit fields and bits in registers are generally referenced as “Register name.Bit field” or “Register name.Bit”. Most
of the register names contain a module name prefix (for example, “SSCCON”, where “SSC” is the module
name prefix, and “CON” is the actual register name). In chapters describing peripheral modules, the actual
register name is referenced also as the kernel register name.
•
Variables used to describe sets of processing units or registers appear in mixed-case type. For example, the
register name “CC6xR” refers to multiple “CC6xR” registers with the variable x (x = 0, 1, 2). The bounds of the
variables are always given where the register expression is first used (for example, “x = 2 - 0”), and is repeated
as needed in the rest of the text.
•
•
The default radix is decimal. Hexadecimal constants have a suffix with the subscript letter “H”, as in 100H.
Binary constants have a suffix with the subscript letter “B”, as in: 111B.
When the extent of register fields, groups of signals, or groups of pins are collectively named in the body of the
document, they are given as “NAME[A:B]”, which defines a range for the named group from B to A. Individual
bits, signals, or pins are given as “NAME[C]” where the range of the variable C is given in the text. For example:
CFG[2:0] and TOS[0].
•
Units are abbreviated as follows:
•
•
•
•
•
•
•
kByte = 1024 bytes of memory
MHz = Megahertz
Byte = 8-bit quantity
MByte = 1,048,576 bytes of memory
kBaud, kBit = 1000 characters/bits per second
MBaud, MBit = 1,000,000 characters/bits per second
μs = Microsecond
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Preface
1.5
Abbreviations and Acronyms
°C
Degree Celsius
mA
milli ampere
mS
milli second
mV
milli volt
µA
micro ampere
µS
micro second
µV
micro volt
IC
Integrated Circuit
PMU
TSNP
CGU
OEM
ODM
ECC
ODC
MAC
UID
LSB
MSB
GPIO
MCU
Power Management Unit
Thin Small Non Leaded Package
Clock Generation Unit
Original Equipment Manufacturer
Original Design Manufacturer
Elliptic Curve Cryptography
OPTIGATM Digital Certificate
Message Authentication Code
Unique IDentifier
Least Significant Bit
Most Significant Bit
General Purpose I/O
Microcontroller Unit
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Overview
2
Overview
Infineon Technologies’ novel OPTIGATM Trust B Authentication chip offers a robust cryptographic solution, that
assists OEMs and system manufacturers to safeguard the authenticity and safety of their original products, and
protection of their investments against unauthorized after-market replacements.
It leverages Infineon’s market leading security know-how into the battery and accessory authentication markets.
With its innovative asymmetric cryptography approach, it significantly reduces system cost whilst making a leap
up in security.
2.1
Application Field
The main area of application is authentication leading to increased safety, functionality and reliability of the
accessories, replacement parts and disposables with a special focus on batteries.
The OPTIGATM Trust B Authentication IC lends itself for use in multiple application domains which use its safety
and highly reliable authentication features. These protect the systems from unauthorized accessories,
replacement parts and disposables.
•
Low and high density batteries
– Mobile Phones
– Computing Devices
– Digital Imaging
– Power Tools
•
•
Adaptor
Miscellenous Accessories
– Earphones
– Speakers
– Docking Stations
– Game Controller
Water Filter Replacement Parts
•
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Overview
2.2
Features
The features of OPTIGATM Trust B Authentication IC are listed as follows:
•
Security
– 131 bits Elliptic Curve Cryptography (ECC) Engine
– 163 bits OPTIGATM Trust B Digital Certificate (ODC)
– Message Authentication Code (MAC) Function
– Host Challenge by Software(Host → Slave)
– Security Library Concept for easy host side integration
– Kill-Feature
•
•
Customizable Non-Volatile Memories
– 64-bits protected NVM read-only space for customer specified information
– 512-bits unprotected NVM memories for user mode area
– Endurance of 100,000 programming cycle (at 25 Deg C ambient temperature)
Single Wire Interface
– Single-Wire Interfaces (SWI) I/O interface
– up to 500kbit/s transmission speed
– Device ID search scheme and address management for multiple device capabilities
– 96 bits Unique Chip Identification number
– Communication library concept for easy host side integration
– Multiple device capabilities in direct powered mode
– Powered directly or Indirect Power via Single-wire interface
– Device ID search and management scheme
– Power-up detection capability
– Programmable Device Address capability
Power Management
•
– Direct powered / Indirect powered application solution
– Power Up and Down Control Via SWI interface
– Power Down Control Via Power Down Command
– Wide Operating Range Single Supply Voltage Support (From 2.0V to 5.5V)
Lifespan Indicator
– The counter value can only be read by the host, and is protected from being reprogrammed
– Counter value is decrement on command
– Up to 32 bit Life Span Counter Feature
Small Package
•
•
– PG-TSNP-6-9 Package
– Package Width of 1.10mm is suitable for slim Printed Circuit Board (PCB) design
– Package Height of 0.4mm(Max) is suitable for low height form factor profile design
– Package Size: 1.5mm X 1.1mm
– Pitch: 0.5mm
– Comply with RoHS Standard
– Comply with IPC/J-STD-020 MSL-1 Standard
ESD
•
– JESD22-A114 ESD HBM Standard 2kV Standard
– JESD-C101 ESD CDM 500V Standard
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Functional Overview
3
Functional Overview
OPTIGATM Trust B is designed to be used as a companion authentication device. This authentication device
reside away from the HOSTsystem such that the host system is able to check if it is communicating with an
authenticated original product.
The SWI communication link is the basis for the OPTIGATM Trust B to communicates with the HOST controller. It
is designed to conform to the Infineon SWI Bus Interface specification
3.1
Typical Application
OPTIGATM Trust B can be integrated to any system with very low hardware requirement. In a typical setup, only a
pull-up resistor, RSWI, is required for open-drain GPIO.
OPTIGATM Trust B provides a combination of secured authentication function and user read/write storage space
via a single serial serial interface(SWI). SWI is able to perform bidirectional communication on multiple devices on
the bus without extra hardware. Communication on the SWI is half-duplex transmission in which master and slave
can transmit and received commands only one at a time. In SWI architecture, SWI master initiates and controls
all the SWI operations. The SWI bus operates in a command and response sequence. An additional feature of
SWI interface is the ability of interrupt-based processing which allows for concurrent processing.
Figure 3-1 shows an example of a Host system connection to an OPTIGATM Trust B device
SWI MASTER
BOARD
SWI SLAVE
BOARD
VCC
OPTIGATM
VCC
V
CC
CVCC
HOST
2
RSWI
GPIO1
GND
SWI
GND
VDD
CVDD
2.2nF
GND
GND
1) GPIO configured as open drain output with drive capability of> 2mA – 10mA
2)
R
can be connected to the same VCC voltage or other system voltage lower than V
SWI
CC
Figure 3-1
Application Diagram of OPTIGATM Trust B based on Direct Power
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Functional Overview
In certain scenario where minimum number of wire connection are desired, OPTIGATM Trust B can be configured
with a total of two wires using some external circuit components. Figure 3-2 shows a setup example of the system
where OPTIGATM Trust B is powered using the communication line. The resistor, RSWI, maintains the power
supply with a voltage drop of RSWI multiplied by ISWI. The voltage is fed to the OPTIGA’s single wire interface port
and its power supply through a diode. Using the following setup, the VCC connection is not required.
SWI MASTER
BOARD
SWI SLAVE
BOARD
VCC
OPTIGATM
D VCC
IVDDP
VCC
V
CC
HOST
RSWI
CVCC
GPIO1
GND
SWI
VSWI
IOD
GND
VDD
CVDD
2.2nF
GND
GND
1) GPIO configured as open drain output with drive capability of> 2mA – 10mA
Figure 3-2
Application Diagram of OPTIGATM Trust B based on Indirect Power
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Functional Overview
3.2
Support Mode of Operation
Various mode of operations supported in OPTIGATM Trust B is tabulated in Table 3-1.
Table 3-1
Mode of Operation
Mode of Operation Description
•
All systems are disabled, lowest current
consumption mode
Power Down
Active - Idle
•
•
•
•
Communication Ready
System is not active
NVM is not active
Authentication is not active
•
•
•
•
Communication Ready
System is active
NVM is not active
Active -
Communication
Authentication is not active
•
•
•
•
Communication Ready
System is active
NVM is active
Active -
Authentication
Authentication is active
•
•
•
•
Communication Ready
System is active
NVM is active
Active - NVM
Authentication is not active
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Signals Description for PG-TSNP-6-9 Package
4
Signals Description for PG-TSNP-6-9 Package
This chapter provides:
1. Pin Configuration (PG-TSNP-6-9 Package)
2. Abbreviations for signals description (Pin Type and Buffer Type)
3. Pin Description (PG-TSNP-6-9 Package)
4.1
Pin Configuration (PG-TSNP-6-9 Package)
The Pin configuration diagram for OPTIGATM Trust B PG-TSNP-6-9 Package
Top View
4
5
6
3
2
1
VSS
VSS
VSS
VCC
SWI
VDD
Pin 1 Marking
Figure 4-1
Pin Configuration (PG-TSNP-6-9 Package) - Top View
DataBook
System Description
14
Revision 2.01, 2021-03-02
OPTIGATM Trust B
DataBook
Signals Description for PG-TSNP-6-9 Package
4.2
Abbreviations
The Standard abbreviations for I/O are shown in Table 4-1 and Table 4-2.
Table 4-1
Abbreviations for Pin Type
Description
Abbreviations
I
Standard input-only pin. Digital levels.
Output. Digital levels.
O
I/O
I/O is a bidirectional input/output signal.
Input. Analog levels.
AI
AO
AI/O
PWR
GND
MCL
MCH
NU
NC
Output. Analog levels.
Input or Output. Analog levels.
Power
Ground
Must be connected to Low (JEDEC Standard)
Must be connected to High (JEDEC Standard)
Not Usable (JEDEC Standard)
Not Connected (JEDEC Standard)
Table 4-2
Abbreviations for Buffer Type
Description
Abbreviations
Z
High impedance
PU1
PD1
PD2
TS
Pull up, 10 kΩ
Pull down, 10 kΩ
Pull down, 20 kΩ
Tristate capability: The corresponding pin has 3 operational states: Low, high and high-
impedance.
OD
Open Drain. The corresponding pin has 2 operational states, active low and tristate, and
allows multiple devices to share as a wire-OR. An external pull-up is required to sustain the
inactive state until another agent drives it, and must be provided by the central resource.
OC
PP
Open Collector
Push-Pull. The corresponding pin has 2 operational states: Active-low and active-high
(identical to output with no type attribute).
OD/PP
Open-Drain or Push-Pull. The corresponding pin can be configured either as an output with
the OD attribute or as an output with the PP attribute.
ST
Schmitt-Trigger characteristics
TTL characteristics
TTL
Note:Any changes and extensions must be negotiated first.
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System Description
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OPTIGATM Trust B
DataBook
Signals Description for PG-TSNP-6-9 Package
4.3
Pin Description (PG-TSNP-6-9 Package)
Pin description for OPTIGATM Trust B PG-TSNP-6-9 Package is shown below.
Table 4-3
Pin No.
I/O Signals
Name
Pin
Buffer Type
Function
Type
1
SWI
I/O
OD
Single Wire Interface
Table 4-4
Pin No.
Power Supply
Name Pin
Buffer Function
Type Type
2
6
VCC
VDD
PWR
–
Supply
Positive Power Input for OPTIGATM Trust B. Connect 0.1μF capacitor.
PWR
–
Digital Power Supply
Internal Digital Power Supply of OPTIGATM Trust B. Connect 2.2nF
capacitor.
Table 4-5
Pin No.
Ground Pins
Name
Pin
Type Type
PWR
Buffer Function
4, 3, 5
VSS
–
GND Pin (Pin 4 is the main VSS)
This is the common ground of the IC.
4.4
Package
4.4.1
Package Outline: PG-TSNP-6-9
Table 4-6 shows the PG-TSNP-6-9 package dimension for OPTIGATM Trust.
Table 4-6
PG-TSNP-6-9 Package Dimensions
Parameter
Symbol
Min.
1.05
Values
Typ.
1.1
Unit
Note / Test Condition
Max.
1.15
1.55
0.40
0.35
0.35
A
B
C
D
E
F
mm
mm
mm
mm
mm
mm
Package Width
1.45
1.5
Package Length
Package Height
Solder Pad Width
Solder Pad Length
Solder Pad Pitch
0.35
0.375
0.30
0.30
0.50
0.25
0.25
Figure 4-2 shows the PG-TSNP-6-9 package outline for OPTIGATM Trust.
DataBook
System Description
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OPTIGATM Trust B
DataBook
Signals Description for PG-TSNP-6-9 Package
C
E
Figure 4-2
PG-TSNP-6-9 Package
The packages with a triangle and circle laser marking on the Pin 1 location are identical packages produced at
different fabrication sites.
DataBook
System Description
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OPTIGATM Trust B
DataBook
Electrical Characteristics
5
Electrical Characteristics
5.1
Absolute Maximum Ratings
Stresses above the max. values listed here may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings
are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated
circuit.
Table 5-1
Absolute Maximum Ratings
Symbol
Parameter
Values
Unit Note / Test Condition
Min.
-0.3
-0.3
-0.3
Typ.
Max.
6.0
VCC Supply Voltage
VDD Supply Voltage
I/O
VCC
–
–
–
V
V
V
VDD
1.60
6.0
VI/O
ESD robustness HBM
VESD,HBM
2000.0
V
According to
EIA/JESD22-A114
ESD robustness CDM
Latch up
VESD,CDM
ILU
500.0
100.0
V
According to
EIA/JESD22-C101
mA
According to EIA/
JESD78
Junction temperature range
Storage Temperature
TJ
-40.0
-55.0
85.0
°C
°C
TSTORE
150.0
5.2
Operating Conditions
Within the operational range, the IC operates as explained product description.Typical Values: VCC = 3.8V, TAMB
= 25 °C
Table 5-2
Operating Conditions
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
Max.
VCC Supply Voltage Range
VDD Supply Voltage Range
VCC
VDD
2.0
3.8
5.5
V
V
Measurement is at the
VCC pin.VCC
1.35
1.45
1.6
Measurement is at the
VDD pin. Need to
connect 2.2nF
Capacitor.Ramp up of
VDD shall be slower
than 1µSec.
SWI Voltage Range
VSWI
-0.3
5.5
V
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System Description
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OPTIGATM Trust B
DataBook
Electrical Characteristics
Table 5-2
Operating Conditions (cont’d)
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
Max.
Current Consumption, Active Idle
Mode
IVCC, Active-Idle
0.5
mA
mA
μA
Idle Function Mode Ave
over Active Idle
Current Consumption, Active Mode, IVCC, Active-
Authentication Operation
1.0
1.0
Authentication Mode
Ave over Authentication
ECC
Current Consumption, Power-Down IVCC,PD
Mode
3.0
85
SWI is set at 0V
Maximum Value
condition is set at VCC
= 4.35V @ 85 Deg C
Ambient Temperature
TAMB
-40
25
°C
5.3
SWI I/O Characteristics
Table 5-3
SWI I/O Characteristics
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
Max.
SWI Absolute Maximum Rating
VSWI,ABR
-0.3
5.50
V
For Slave Only
SWI Input High Voltage
SWI Input Low Voltage
SWI Output High Voltage
VSWI,IH
VSWI,IL
VSWI,OH
1.2
5.5
V
V
V
-0.30
1.30
0.80
5.5
No remote powering,
measured at 1.0µA. For
Master Only
SWI Output Low Voltage
VSWI,OL
0.10
V
Measured at 1mA
SWI Bus Load
CSWI,L
250
1.2
28
pF
V
SWI Wake up Voltage
SWI Wake up Filter
VSWI,WK
tSWI,WK
0.8
7
1.0
20
µs
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System Description
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OPTIGATM Trust B
DataBook
Electrical Characteristics
5.4
SWI Timing Characteristics
Table 5-4
SWI Timing Characteristics
Symbol
Parameter
Values
Typ.
Unit Note / Test Condition
Min.
Max.
Basic Timing Parameters
Time Base
tSWI
fSWI
1.0
50
µs
Bus Frequency
10.0
500.0
500
kHz 50% Zero, 50% One
Peak Data Rate
kBits/
s
Transmit Timing Parameters
Duration for 0B
tTO
tT1
tTS
0.75
2.75
4.75
1.25
3.25
tSWI
tSWI
tSWI
Duration for 1B
Duration for STOP
Receive Timing Parameters
Duration for 0B
tRO
tR1
tRS
0.5
2.5
4.5
1.5
3.5
tSWI
tSWI
tSWI
Duration for 1B
Duration for STOP
Interrupt Timing Parameters
Interrupt Arming Time
Interrupt Active Time
tARM
tINT
4.75
0.75
tSWI
1
1.25
3.25
tSWI
Drive period for all
Slaves
Interrupt Trailing Time
tTRAIL
tSWI
Drive period for all
Slaves
Bus Time-Out Parameters
Bus Time-Out Period
tTOUT
10.0
tSWI
Power and Reset Control Timing Parameters
Power Down Low Time
Slave Power Up Delay
Slave Soft Reset Delay
tPDL
tPUP
tSRD
196.0
10.0
1.0
µs
ms
ms
5.5
EEPROM
Table 5-5
EEPROM
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
Max.
105
10
EEPROM Endurance
NCYC
Tretent
tPROG
Cycle 25 Deg C
years 25 Deg C
ms
EEPROM Retention
EEPROM Programming Time
5.1
DataBook
System Description
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Revision 2.01, 2021-03-02
OPTIGATM Trust B
DataBook
Electrical Characteristics
5.6
Authentication Response Computation Time
Table 5-6
Authentication Response Computation Time
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
Max.
Response Computation Time ECCE- TECCE131
34.0
ms
131
DataBook
System Description
21
Revision 2.01, 2021-03-02
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Published by Infineon Technologies AG
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