IRFY9240MPBF [INFINEON]
Power Field-Effect Transistor, 9.4A I(D), 200V, 0.51ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-257AA, HERMETIC SEALED, TO-257AA, 3 PIN;型号: | IRFY9240MPBF |
厂家: | Infineon |
描述: | Power Field-Effect Transistor, 9.4A I(D), 200V, 0.51ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-257AA, HERMETIC SEALED, TO-257AA, 3 PIN 晶体 晶体管 开关 脉冲 局域网 |
文件: | 总6页 (文件大小:241K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Provisional Data Sheet No. PD 9.1295A
IRFY9240CM
HEXFET® POWERMOSFET
P-CHANNEL
-200Volt, 0.51Ω HEXFET
Product Summary
International Rectifier’s HEXFET technology is the key to
its advanced line of power MOSFET transistors.The effi-
cient geometry design achieves very low on-state resis-
tance combined with high transconductance.
Part Number
BV
R
I
D
DSS
DS(on)
IRFY9240CM
-200V
0.51Ω
-9.4A
Features
HEXFET power MOSFETs also feature all of the well-
established advantages of MOSFETs, such as voltage
control, very fast switching, ease of paralleling and electri-
cal parameter temperature stability.They are well-suited
for applications such as switching power supplies, motor
controls, inverters, choppers, audio amplifiers, high en-
ergy pulse circuits, and virtually any application where
high reliability is required.
n Hermetically Sealed
n Electrically Isolated
n Simple Drive Requirements
n Ease of Paralleling
The HEXFET power MOSFET’s totally isolated package
eliminates the need for additional isolating material between
the device and the heatsink.This improves thermal effi-
ciency and reduces drain capacitance.
Absolute Maximum Ratings
Parameter
IRFY9240CM
Units
I
I
I
@ V = -10V, T = 25°C
GS
Continuous Drain Current
-9.4
-6.0
D
C
@ V = -10V, T = 100°C Continuous Drain Current
GS
A
D
C
Pulsed Drain Current
Max. Power Dissipation
Linear Derating Factor
-36
DM
P
@ T = 25°C
100
W
W/Kꢀ
V
D
C
0.8
V
E
Gate-to-Source Voltage
Single Pulse Avalance Energy
Avalance Current
±20
GS
AS
700
mJ
A
I
-9.4
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction
10
mJ
V/ns
AR
dv/dt
-5.5
T
T
-55 to 150
J
Storage Temperature Range
°C
g
stg
LeadTemperature
Weight
300 (0.063 in (1.6mm) from case for 10 sec)
4.3(typical)
* ID current limited by pin diameter
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IRFY9240CM Device
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter
Min Typ Max Units
Test Conditions
BV
Drain-to-Source Breakdown Voltage
-200
—
—
—
—
V
V
= 0V, I = -1.0mA
D
DSS
GS
V/°C Reference to 25°C, I = -1.0mA
∆BV
/∆T Temperature Coefficient of Breakdown
-0.20
DSS
J
D
Voltage
R
Static Drain-to-Source
On-State Resistance
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
—
—
—
—
—
—
—
—
0.51
0.52
-4.0
—
V
V
V
V
= -10V, I = -6.0A
D
DS(on)
GS
GS
DS
DS
DS
Ω
= -10V, I = -9.4A
D
V
-2.0
4.0
—
V
= V , I
GS
=
-250µA
GS(th)
fs
D
Ω
g
S ( )
≥ -15V, I
= -6.0A
DS
I
-25
V
= 0.8 x max. rating,V
= 0V
DSS
GS
µA
—
-250
V
V
V
V
V
V
= 0.8 x max. rating
DS
GS
GS
GS
GS
DS
= 0V, T = 125°C
J
= -20V
I
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
—
—
—
—
—
—
—
—
—
—
—
8.7
-100
100
60
GSS
GSS
nA
nC
I
= 20V
Q
Q
Q
28
3.0
4.5
—
= -10V, I = -9.4A
D
= Max. Rating x 0.5
g
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
15
gs
38
see figures 6 and 13
gd
t
35
V = -100V, I = -9.4A
d(on)
DD
= 9.1Ω, V
D
tr
Rise Time
—
85
R
= -10V
G
GS
ns
t
t
Turn-Off Delay Time
—
85
d(off)
f
FallTime
—
65
see figure 10
L
Internal Drain Inductance
—
—
Measured from the drain
lead, 6mm (0.25 in.) from
package to center of die.
symbol
Modified MOSFET
showing the internal
D
inductanc
nH
L
Internal Source Inductance
—
8.7
—
Measured from the
source lead, 6mm (0.25
in.) from package to
source bonding pad.
S
C
C
C
Input Capacitance
—
—
—
1200
570
81
—
—
—
V
= 0v, V = -25V
DS
iss
GS
Output Capacitance
pF f = 1.0MHz.
oss
rss
Reverse Transfer Capacitance
see figure 5
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
Test Conditions
symbol showing the
Modified MOSFET
integral reverse p-n junction rectifier.
I
Continuous Source Current (Body Diode)
—
—
—
—
-9.4
-36
S
A
I
Pulse Source Current (Body Diode)
SM
V
t
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
—
—
—
—
—
—
-4.6
440
7.2
V
T = 25°C, I = -9.4A, V
= 0V
GS
j
SD
S
ns T = 25°C, I = -9.4A, di/dt ≤ -100 A/µs
j
rr
F
Q
µC
V
≤ -50 V
DD
RR
t
Forward Turn-On Time
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L + L .
S D
on
Thermal Resistance
Parameter
Min Typ Max Units
Test Conditions
R
R
R
Junction-to-Case
Junction-to-Ambient
Case-to-Sink
—
—
—
—
—
1.25
thJC
thJA
thCS
80 K/Wꢀ
—
Typical socket mount
0.21
Mounting surface flat, smooth
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IRFY9240CM Device
Fig. 1 — Typical Output Characteristics
TC = 25°C
Fig. 2 —Typical Output Characteristics
TC = 150°C
-9.4
Fig. 3 — Typical Transfer Characteristics
Fig. 4 — Normalized On-Resistance vs. Temperature
-9.4
Fig. 5 — Typical Capacitance vs. Drain-to-Source
Voltage
Fig. 6 — Typical Gate Charge vs. Gate-to-Source
Voltage
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IRFY9240CM Device
1 0 0
1 0
1
O P E R AT IO N IN T H IS A R E A L IM IT E D
B Y
R
D S(on)
100µs
1m s
T
T
=
2 5 °C
C
J
=
1 5 0 °C
S ing le P uls e
10ms
A
1 0
1 0 0
1 0 0 0
-V
, D ra in -to -So u rce Vo lta g e (V)
D S
Fig. 7 — Typical Source-to-Drain Diode Forward
Voltage
Fig. 8 — Maximum Safe Operating Area
1 0
8
6
4
2
0
A
1 5 0
2 5
5 0
7 5
1 0 0
1 2 5
T
, C ase Te m p era tu re (°C )
C
Fig. 9 — Maximum Drain Current vs. Case Tempera-
ture
Fig. 10a — Switching Time Test Circuit
Fig. 10b — Switching Time Waveforms
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IRFY9240CM Device
1 0
1
D
=
0 . 50
0 .2 0
0 .1 0
0 .0 5
0. 1
0 .0 2
0 .0 1
S IN G L E P U L S E
( T H E R M A L R E S P O N S E )
A
0 . 0 1
0 . 0 0 0 0 1
0 . 0 0 0 1
0 . 0 0 1
0 . 0 1
0. 1
1
t1 , Re ctang ular Puls e Duratio n (sec )
Fig. 11 — Maximum Effective Transient Thermal Impedance, Junction-to-Case Vs. Pulse Duration
Fig. 12a — Unclamped Inductive Test Circuit
Fig. 12b — Unclamped Inductive Waveforms
8 0 0
6 0 0
4 0 0
2 0 0
I
V
=
-1 1A
-50 V
=
0
A
1 5 0
2 5
5 0
7 5
1 0 0
1 2 5
Sta rtin g
T , Jun ction Te m p e ra ture (°C )
J
Fig. 12c — Max. Avalanche Energy vs. Current
Fig. 13a — Gate ChargeTest Circuit
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Notes:
IRFY9240CM Device
Repetitive Rating; Pulse width limited by maximum
junction temperature (see figure 11).
@ V
= -50V, Starting T = 25°C,
J
DD
= [0.5
E
L
(
)
[BV
/(BV
-V )]
DSS DD
AS
*
*
*
DSS
Peak I = -9.4A, V
= -10V, 25 ≤ R ≤ 200Ω
L
GS
G
I
≤ -9.4A, di/dt ≤ -150A/µs, V
≤ BV
, T ≤ 150°C
DSS J
SD
Pulse width ≤ 300 µs; Duty Cycle ≤ 2%
ꢀ K/W = °C/W W/K = W/°C
DD
Fig. 13b — Basic Gate Charge Waveform
Case Outline and Dimensions
Pin 1 - Drain
Pin 2 - Source
Pin 3 - Gate
3
2
1
TO-257AA
NON-STANDARD PIN CONFIGURATION
NOTES:
Pin 1 - Gate
Pin 2 - Drain
Pin 3 - Source
1. Dimensioning and tolerancing per ANSI Y14.5M-1982
2. Controlling dimension: Inch
3. Dimensions are shown in millimeters (Inches)
4. Outline conforms to JEDEC outline TO-257AA
Order Part Type IRFY9240C
CAUTION
BERYLLIAWARNING PER MIL-PRF-19500
Packages containing beryllia shall not be ground, sandblasted,
machined or have other operations performed on them which
will produce beryllia or beryllium dust.Furthermore, beryllium
oxide packages shall not be placed in acids that will produce
fumes containing beryllium.
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http://www.irf.com/
Data and specifications subject to change without notice.8/96
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