IRFY9240MPBF [INFINEON]

Power Field-Effect Transistor, 9.4A I(D), 200V, 0.51ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-257AA, HERMETIC SEALED, TO-257AA, 3 PIN;
IRFY9240MPBF
型号: IRFY9240MPBF
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 9.4A I(D), 200V, 0.51ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-257AA, HERMETIC SEALED, TO-257AA, 3 PIN

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Previous Datasheet  
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Provisional Data Sheet No. PD 9.1295A  
IRFY9240CM  
HEXFET® POWERMOSFET  
P-CHANNEL  
-200Volt, 0.51HEXFET  
Product Summary  
International Rectifier’s HEXFET technology is the key to  
its advanced line of power MOSFET transistors.The effi-  
cient geometry design achieves very low on-state resis-  
tance combined with high transconductance.  
Part Number  
BV  
R
I
D
DSS  
DS(on)  
IRFY9240CM  
-200V  
0.51Ω  
-9.4A  
Features  
HEXFET power MOSFETs also feature all of the well-  
established advantages of MOSFETs, such as voltage  
control, very fast switching, ease of paralleling and electri-  
cal parameter temperature stability.They are well-suited  
for applications such as switching power supplies, motor  
controls, inverters, choppers, audio amplifiers, high en-  
ergy pulse circuits, and virtually any application where  
high reliability is required.  
n Hermetically Sealed  
n Electrically Isolated  
n Simple Drive Requirements  
n Ease of Paralleling  
The HEXFET power MOSFET’s totally isolated package  
eliminates the need for additional isolating material between  
the device and the heatsink.This improves thermal effi-  
ciency and reduces drain capacitance.  
Absolute Maximum Ratings  
Parameter  
IRFY9240CM  
Units  
I
I
I
@ V = -10V, T = 25°C  
GS  
Continuous Drain Current  
-9.4  
-6.0  
D
C
@ V = -10V, T = 100°C Continuous Drain Current  
GS  
A
D
C
Pulsed Drain Current   
Max. Power Dissipation  
Linear Derating Factor  
-36  
DM  
P
@ T = 25°C  
100  
W
W/Kꢀ  
V
D
C
0.8  
V
E
Gate-to-Source Voltage  
Single Pulse Avalance Energy ‚  
Avalance Current   
±20  
GS  
AS  
700  
mJ  
A
I
-9.4  
AR  
E
Repetitive Avalanche Energy   
Peak Diode Recovery dv/dt ƒ  
Operating Junction  
10  
mJ  
V/ns  
AR  
dv/dt  
-5.5  
T
T
-55 to 150  
J
Storage Temperature Range  
°C  
g
stg  
LeadTemperature  
Weight  
300 (0.063 in (1.6mm) from case for 10 sec)  
4.3(typical)  
* ID current limited by pin diameter  
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IRFY9240CM Device  
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)  
Parameter  
Min Typ Max Units  
Test Conditions  
BV  
Drain-to-Source Breakdown Voltage  
-200  
V
V
= 0V, I = -1.0mA  
D
DSS  
GS  
V/°C Reference to 25°C, I = -1.0mA  
BV  
/T Temperature Coefficient of Breakdown  
-0.20  
DSS  
J
D
Voltage  
R
Static Drain-to-Source  
On-State Resistance  
Gate Threshold Voltage  
Forward Transconductance  
Zero Gate Voltage Drain Current  
0.51  
0.52  
-4.0  
V
V
V
V
= -10V, I = -6.0A „  
D
DS(on)  
GS  
GS  
DS  
DS  
DS  
= -10V, I = -9.4A „  
D
V
-2.0  
4.0  
V
= V , I  
GS  
=
-250µA  
GS(th)  
fs  
D
g
S ( )  
-15V, I  
= -6.0A „  
DS  
I
-25  
V
= 0.8 x max. rating,V  
= 0V  
DSS  
GS  
µA  
-250  
V
V
V
V
V
V
= 0.8 x max. rating  
DS  
GS  
GS  
GS  
GS  
DS  
= 0V, T = 125°C  
J
= -20V  
I
Gate-to-Source Leakage Forward  
Gate-to-Source Leakage Reverse  
Total Gate Charge  
8.7  
-100  
100  
60  
GSS  
GSS  
nA  
nC  
I
= 20V  
Q
Q
Q
28  
3.0  
4.5  
= -10V, I = -9.4A  
D
= Max. Rating x 0.5  
g
Gate-to-Source Charge  
Gate-to-Drain (‘Miller’) Charge  
Turn-On Delay Time  
15  
gs  
38  
see figures 6 and 13  
gd  
t
35  
V = -100V, I = -9.4A  
d(on)  
DD  
= 9.1Ω, V  
D
tr  
Rise Time  
85  
R
= -10V  
G
GS  
ns  
t
t
Turn-Off Delay Time  
85  
d(off)  
f
FallTime  
65  
see figure 10  
L
Internal Drain Inductance  
Measured from the drain  
lead, 6mm (0.25 in.) from  
package to center of die.  
symbol  
Modified MOSFET  
showing the internal  
D
inductanc
nH  
L
Internal Source Inductance  
8.7  
Measured from the  
source lead, 6mm (0.25  
in.) from package to  
source bonding pad.  
S
C
C
C
Input Capacitance  
1200  
570  
81  
V
= 0v, V = -25V  
DS  
iss  
GS  
Output Capacitance  
pF f = 1.0MHz.  
oss  
rss  
Reverse Transfer Capacitance  
see figure 5  
Source-Drain Diode Ratings and Characteristics  
Parameter  
Min Typ Max Units  
Test Conditions  
symbol showing the  
Modified MOSFET  
integral reverse p-n junction rectifier.  
I
Continuous Source Current (Body Diode)  
-9.4  
-36  
S
A
I
Pulse Source Current (Body Diode)   
SM  
V
t
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
-4.6  
440  
7.2  
V
T = 25°C, I = -9.4A, V  
= 0V „  
GS  
j
SD  
S
ns T = 25°C, I = -9.4A, di/dt -100 A/µs  
j
rr  
F
Q
µC  
V
-50 V „  
DD  
RR  
t
Forward Turn-On Time  
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L + L .  
S D  
on  
Thermal Resistance  
Parameter  
Min Typ Max Units  
Test Conditions  
R
R
R
Junction-to-Case  
Junction-to-Ambient  
Case-to-Sink  
1.25  
thJC  
thJA  
thCS  
80 K/Wꢀ  
Typical socket mount  
0.21  
Mounting surface flat, smooth  
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IRFY9240CM Device  
Fig. 1 — Typical Output Characteristics  
TC = 25°C  
Fig. 2 —Typical Output Characteristics  
TC = 150°C  
-9.4  
Fig. 3 — Typical Transfer Characteristics  
Fig. 4 — Normalized On-Resistance vs. Temperature  
-9.4  
Fig. 5 — Typical Capacitance vs. Drain-to-Source  
Voltage  
Fig. 6 — Typical Gate Charge vs. Gate-to-Source  
Voltage  
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IRFY9240CM Device  
1 0 0  
1 0  
1
O P E R AT IO N IN T H IS A R E A L IM IT E D  
B Y  
R
D S(on)  
100µs  
1m s  
T
T
=
2 5 °C  
C
J
=
1 5 0 °C  
S ing le P uls e  
10ms  
A
1 0  
1 0 0  
1 0 0 0  
-V  
, D ra in -to -So u rce Vo lta g e (V)  
D S  
Fig. 7 — Typical Source-to-Drain Diode Forward  
Voltage  
Fig. 8 — Maximum Safe Operating Area  
1 0  
8
6
4
2
0
A
1 5 0  
2 5  
5 0  
7 5  
1 0 0  
1 2 5  
T
, C ase Te m p era tu re (°C )  
C
Fig. 9 — Maximum Drain Current vs. Case Tempera-  
ture  
Fig. 10a — Switching Time Test Circuit  
Fig. 10b — Switching Time Waveforms  
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IRFY9240CM Device  
1 0  
1
D
=
0 . 50  
0 .2 0  
0 .1 0  
0 .0 5  
0. 1  
0 .0 2  
0 .0 1  
S IN G L E P U L S E  
( T H E R M A L R E S P O N S E )  
A
0 . 0 1  
0 . 0 0 0 0 1  
0 . 0 0 0 1  
0 . 0 0 1  
0 . 0 1  
0. 1  
1
t1 , Re ctang ular Puls e Duratio n (sec )  
Fig. 11 — Maximum Effective Transient Thermal Impedance, Junction-to-Case Vs. Pulse Duration  
Fig. 12a — Unclamped Inductive Test Circuit  
Fig. 12b — Unclamped Inductive Waveforms  
8 0 0  
6 0 0  
4 0 0  
2 0 0  
I
V
=
-1 1A  
-50 V  
=
0
A
1 5 0  
2 5  
5 0  
7 5  
1 0 0  
1 2 5  
Sta rtin g  
T , Jun ction Te m p e ra ture (°C )  
J
Fig. 12c — Max. Avalanche Energy vs. Current  
Fig. 13a — Gate ChargeTest Circuit  
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Notes:  
IRFY9240CM Device  
 Repetitive Rating; Pulse width limited by maximum  
junction temperature (see figure 11).  
‚ @ V  
= -50V, Starting T = 25°C,  
J
DD  
= [0.5  
E
L
(
)
[BV  
/(BV  
-V )]  
DSS DD  
AS  
*
*
*
DSS  
Peak I = -9.4A, V  
= -10V, 25 R 200Ω  
L
GS  
G
ƒ I  
-9.4A, di/dt -150A/µs, V  
BV  
, T 150°C  
DSS J  
SD  
„ Pulse width 300 µs; Duty Cycle 2%  
K/W = °C/W W/K = W/°C  
DD  
Fig. 13b — Basic Gate Charge Waveform  
Case Outline and Dimensions  
Pin 1 - Drain  
Pin 2 - Source  
Pin 3 - Gate  
3
2
1
TO-257AA  
NON-STANDARD PIN CONFIGURATION  
NOTES:  
Pin 1 - Gate  
Pin 2 - Drain  
Pin 3 - Source  
1. Dimensioning and tolerancing per ANSI Y14.5M-1982  
2. Controlling dimension: Inch  
3. Dimensions are shown in millimeters (Inches)  
4. Outline conforms to JEDEC outline TO-257AA  
Order Part Type IRFY9240C  
CAUTION  
BERYLLIAWARNING PER MIL-PRF-19500  
Packages containing beryllia shall not be ground, sandblasted,  
machined or have other operations performed on them which  
will produce beryllia or beryllium dust.Furthermore, beryllium  
oxide packages shall not be placed in acids that will produce  
fumes containing beryllium.  
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IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590  
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111  
IR FAR EAST: K&H Bldg., 2F, 3-30-4 Nishi-Ikeburo 3-Chome, Toshima-Ki, Tokyo Japan 171 Tel: 81 3 3983 0086  
IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371  
http://www.irf.com/  
Data and specifications subject to change without notice.8/96  
To Order  

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