IM69D127 [INFINEON]
IM69D127 is a digital high performance MEMS microphone based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. Its small size of only 3.60 x 2.50 x 1.00 mm3 makes it a perfect match for compact audio devices, such as TWS earbuds.;
| 型号： | IM69D127 |
| 厂家： | 
Infineon |
| 描述： | IM69D127 is a digital high performance MEMS microphone based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. Its small size of only 3.60 x 2.50 x 1.00 mm3 makes it a perfect match for compact audio devices, such as TWS earbuds. |
| 文件： | 总18页 (文件大小：2042K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Description
The IM69D127V11 is an ultra-high performance digital PDM MEMS microphone designed for applications which
require a very high SNR (low self-noise) and low distortion (high AOP) and which is also IP57 robust to dust and
water.
Best-in-class signal-to-noise ratio (SNR) of 69dB(A) enables far field and low volume audio pick-up. The flat
frequency response (40Hz low-frequency roll-off) and tight manufacturing tolerance improve performance of
multi-microphone (array) applications.
The digital microphone ASIC contains an extremely low-noise preamplifier and a high-performance sigma-delta
ADC. Different power modes can be selected in order to suit specific clock frequency and current consumption
requirements.
Each IM69D127V11 microphone is calibrated with an advanced Infineon calibration algorithm, resulting in low
sensitivity tolerances ( 1dB).
Features
•
•
Component level IP57 dust and water resistant
Dynamic range of 102dB
•
•
•
Flat frequency response with low frequency roll-
off at 40Hz
Power optimized modes determined by PDM
clock frequency
Package dimensions: 3.60mm x 2.50mm x
1.00mm
PDM Output
-
-
Signal to noise ratio of 69dB(A) SNR
<1% total harmonic distortions up to
123dBSPL
-
Acoustic overload point at 127dBSPL
•
•
•
Accurate sensitivity matching ( 1dB) for beam
forming applications
Omnidirectional pickup pattern
Typical applications
•
Active Noise Cancellation (ANC) headphones and
wireless earbuds
Devices with Voice User Interface (VUI)
•
High quality audio capturing
-
-
-
Cameras
Laptops and tablets
Conference systems
•
-
-
-
Smart speakers
Home automation
IoT devices
Datasheet
www.infineon.com
Please read the sections "Important notice" and "Warnings" at the end of this document
v01_10
2022-03-15
IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Block diagram
Block diagram
VDD
MEMS BIAS
VOLTAGE REGULATORS
CHARGE PUMP
DATA
MEMBRANE 1
1-BIT
PDM
INTERFACE
DIGITAL SIGNAL
PROCESSING
STATOR
ADC
AMP
SELECT
CLOCK
MEMBRANE 2
MEMS
POWER
MODE
DIGITAL CORE
DETECTOR
CALIBRATION
COEFFICIENTS
ASIC
GROUND
Figure 1
IM69D127V11 block diagram.
Product validation
Technology qualified for industrial applications.
Ready for validation in industrial applications according to the relevant tests of IEC 60747 and 60749 or
alternatively JEDEC47/20/22.
Environmental robustness
Infineon’s latest Sealed Dual Membrane MEMS technology delivers high ingress protection (IP57) at a
microphone level. The sealed MEMS design prevents water or dust from entering between membrane
and backplate, preventing mechanical blockage or electric leakage issues commonly observed in MEMS
microphones. Microphones built with the Sealed Dual Membrane technology can be used to create IP68
devices, requiring only minimal mesh protection.
Table 1
Environmental robustness
Test Standard
Test Condition
IP5x dust resistance1)
Arizona dust A4 coarse, vertical orientation , sound hole upwards, 10
cycles (15 minutes sedimentation, 6 sec blowing)
IPx7 water immersion2)
Temporary immersion of 1 meters for 30 minutes. Microphone tested
2 hours afer removal
1
The number "5" stands for the dust ingress rating or the capacity to withstand the effects of fine, abrasive dust particles.
The "7" specifies the higher water immersion rating.
2
Datasheet
2
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Table of contents
Table of contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Environmental robustness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1
Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
Acoustic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
Free field frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Electrical parameters and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Digital interface timing specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
PDM channel configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Audio DC offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Stereo PDM operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1
3.2
3.3
3.4
3.5
3.6
3.7
4
5
6
7
8
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Footprint and stencil recommendation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Reflow soldering and board assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Reliability specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Datasheet
3
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Typical performance characteristics
1
Typical performance characteristics
Test conditions: VDD = 1.8V, fCLK = 3.072MHz, no load on DATA
180
135
90
12
9
10000
1000
100
10
6
Phase
45
3
0
0
-45
-90
-135
-180
-3
-6
-9
-12
Amplitude
1
10
100
1000
10000
10
100
1000
10000
Frequency [Hz]
Frequency [Hz]
Figure 2
Typical amplitude and phase
response
Figure 3
Typical group delay vs
frequency
10
1
127dB SPL
125dB SPL
10
1
123dB SPL
0.1
0.01
110dB SPL
0.1
90
95
100
105
110
115
120
125
130
100
1000
10000
Input Sound Pressure Level [dB]
Frequency [Hz]
Figure 4
Typical THD vs SPL
Figure 5
Typical THD vs frequency
1200
1000
800
600
400
200
0
-110
-115
-120
-125
-130
-135
-140
-145
-150
f
clock=3.072MHz, SNR=69dB
f
clock=2.400MHz, SNR=68dB
clock=1.536MHz, SNR=67dB
f
f
clock=768kHz, SNR=64.5dB
1.6
2.1
2.6
3.1
3.6
10
100
1000
10000
V
DD [V]
Frequency [Hz]
Figure 6
Typical IDD vs VDD
Figure 7
Typical noise floor
(unweighted)
Datasheet
4
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Acoustic characteristics
2
Acoustic characteristics
Test conditions ( unless otherwise specified in the table): VDD = 1.8V, fCLK = 3.072MHz, TA = 25°C, 55% R.H., Audio
bandwidth 20Hz to 20kHz, Select pin grounded, no load, Tedge = 9ns.
Table 2
IM69D127V11 acoustic specifications
Values
Typ. Max.
Parameter
Symbol
Unit
Note or Test Condition
Min.
Sensitivity
-35
-34
-33
dBFS
1kHz, 94dB SPL, all
operating modes
Acoustic overload point
AOP
SNR
127
dBSPL
dB (A)
THD = 10%, all operating
modes
Signal to
Noise ratio
fclock=3.072MHz
69
68
67
65
A-Weighted
fclock=2.4MHz
fclock=1.536MHz
fclock=768kHz
20Hz to 8kHz bandwidth,
A-Weighted;
Total
94dBSPL
123dBSPL
127dBSPL
THD
fC LP
0.5
1
%
Measuring 2nd to 5th
harmonics; 1kHz.
harmonic
distortion
All power modes
10
Low
frequency
cutoff point
40
Hz
µs
-3dB point relative to 1kHz
Group delay 250Hz
113
23
9
600Hz
1kHz
4kHz
3
Phase
response
75Hz
1kHz
3kHz
30
2
°
-2
Directivity
Polarity
Omnidirectional
Pickup pattern
Positive pressure
increases density of
1's, negative pressure
decreases density of 1's
in data output.
Datasheet
5
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Acoustic characteristics
2.1
Free field frequency response
Figure 8
Table 3
IM69D127V11 free field frequency response
IM69D127V11 free field frequency response, normalised to 1kHz sensitivity value.
Frequency (Hz)
Upper Limit (dB)
Lower Limit (dB)
40
100
-1.5
+0.5
+1
-4.5
-1.5
-1
800
1000
1200
6000
8000
15000
0
0
+1
-1
+2
-1
+3
-1
+6
0
Datasheet
6
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Electrical parameters and characteristics
3
Electrical parameters and characteristics
3.1
Absolute maximum ratings
Stresses at or above the listed maximum ratings may affect device reliability or cause permanent device
damage. Functional device operation at these conditions is not guaranteed.
Table 4
Absolute maximum ratings
Parameter
Symbol
Min.
Values
Unit
Note / Test Condition
Max.
4
Voltage on any pin
Vmax
V
Storage temperature
Operating temperature
TS
TA
-40
-40
100
85
°C
°C
3.2
Electrical parameters
Table 5
Electrical parameters and digital interface input
Parameter
Symbol
Values
Typ.
1.8
Unit Note / Test Condition
Min.
Max.
Supply voltage
VDD
1.65
3.6
V
A 100nF bypass capacitor
should be placed close
to the microphone's VDD
pin to ensure best SNR
performance
Clock
Operating
fclock
2.9
2.2
3.072
2.4
3.3
2.6
1.7
850
250
50
MHz
kHz
Intermediate frequencies
between those listed
cannot be used
frequency
range
modes
1.38
450
1.536
768
Standby mode
DATA = high-Z
VDD ramp-up time
Clock duty cycle
ms
%
Time until VDD ≥ VDD_min
40
45
60
At PDM clock frequency
range from minimum to
typical value
55
At PDM clock frequency
range from typical to
maximum value
Clock rise/fall time
Input logic low level
Input logic high level
tCR, tCF
VIL
13
ns
V
-0.3
0.35xVDD
VDD+0.3
200
VIH
0.65xVDD
V
Output load capacitance on
DATA
Cload
pF
Datasheet
7
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Electrical parameters and characteristics
3.3
Electrical characteristics
Test conditions (unless otherwise specified in the table): VDD= 1.8V, TA=25°C, 55% R.H.
Table 6
General electrical characteristics
Parameter
Symbol
Min.
Values
Typ.
980
Unit Note / Test Condition
Max.
1200
950
740
350
50
Current
consumption
fclock=3.072MHz
IDD
μA
Output load <5pF
fclock=2.4MHz
fclock=1.536MHz
fclock=768kHz
Standby mode
Clock Off mode
800
620
300
Istandby
Iclock_off
10
CLOCK pulled low
Grounded DATA pin
Short circuit current
1
20
mA
Power supply rejection
PSR
-75
dBFS VDD=1.8V+100mVpp sine
wave, f=40Hz to 100Hz
-80
20
50
20
50
VDD=1.8V+100mVpp sine
wave, f=100Hz to 20kHz
Startup time
0.5dB sensitivity
ms
ms
Time to start up in all
operating modes afer
VDD_min and CLOCK have
been applied
accuracy
0.2dB sensitivity
accuracy
Mode switch
time
0.5dB sensitivity
accuracy
Time to switch between
operating modes. VDD
remains on during the
mode switch
0.2dB sensitivity
accuracy
Hysteresis width
Vhys
VOL
VOH
tDD
0.1xVDD
V
V
Output logic low level
Output logic high level
Delay time for DATA driven
0.3xVDD
80
Iout= 2mA
Iout= 2mA
0.7xVDD
40
ns
ns
ns
Delay time from CLOCK
edge (0.5xVDD) to DATA
driven
Delay time for DATA high-Z 3)
Delay time for DATA valid 4)
tHZ
5
30
Delay time from CLOCK
edge (0.5xVDD) to DATA
high impedance state
tDV
100
Delay time from CLOCK
edge (0.5xVDD) to DATA
valid (<0.3xVDD or
>0.7xVDD). Load on data:
Cload=100pF, Rload=100kΩ
Power-on behavior
Idle tone is output over PDM within 3ms of applying VDD and CLK,
remains until a valid microphone signal is available. Idle tones consists
of alternating 1s and 0s, representing a zero input signal.
3
thold is depended on Cload
Load on data: Cload=100pF, Rload=100kΩ
4
Datasheet
8
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Electrical parameters and characteristics
3.4
Digital interface timing specifications
tCF
tCR
CLOCK
tDV
tDD
tHZ
DATA 1
LR = GND
DATA 1
valid
DATA 1
valid
DATA 1
valid
HiZ
HiZ
tDV
tDD
HiZ
tHZ
DATA 2
LR = VDD
DATA 2
valid
DATA 2
valid
HiZ
Figure 9
IM69D127V11 timing diagram
3.5
PDM channel configurations
Table 7
PDM channel configuration using L/R pin.
Channel
DATA1
Data driven
Data high-Z
L/R connection
Falling clock edge
Rising clock edge
Rising clock edge
Falling clock edge
GND
VDD
DATA2
3.6
Audio DC offset
The DC output level encoded in the DC bit stream is determined by the L/R state on startup. In each case the DC
output level is stable over time and does not vary with input signal level.
Table 8
DC output level using L/R pin
LR state
DC output level (typical)
Unit
dBFS
dBFS
LR = GND
LR = VDD
-80
-40
Datasheet
9
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Electrical parameters and characteristics
3.7
Stereo PDM operation
The IM69D127V11 is designed to function in circuits with one or two microphones on the PDM bus. When
two microphones are connected, data is transmitted alternately according to the L/R pin status of each
microphone. When two microphones are connected to a shared PDM bus, the power modes of both
microphones will be the same as both are controlled by the same PDM clock. The performance is unchanged
relative to a single microphone per bus configuration.
Figure 10
IM69D127V11 stereo mode configuration
Note:
For best performance it is strongly recommended to place a 100nF (CVDD_typical) capacitor between VDD
and ground. The capacitor should be placed as close to VDD as possible. A termination resistor (RTERM
of about 100Ω may be added to reduce the ringing and overshoot on the output signal.
)
Datasheet
10
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Package information
4
Package information
Figure 11
Table 9
IM69D127V11 package drawing.
IM69D127V11 pin configuration
Pin Number
Name
DATA
Description
1
2
3
4
5
PDM data output
Power supply
VDD
CLOCK
SELECT
Ground
PDM clock input
PDM lefꢀriꢁgt select
Ground
Datasheet
11
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Footprint and stencil recommendation
5
Footprint and stencil recommendation
The acoustic port hole diameter in the PCB should be larger than the acoustic port hole diameter of the MEMS
Microphone to ensure optimal performance. A PCB sound port size of radius 0.4 mm (diameter 0.8mm) is
recommended.
The board pad and stencil aperture recommendations shown in Figure 12 are based on Solder Mask Defined
(SMD) pads. The specific design rules of the board manufacturer should be considered for individual design
optimizations or adaptations.
Figure 12
IM69D127V11 footprint and stencil recommendation
Note:
Dimensions are in millimeters unless otherwise specified
Datasheet
12
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Packing information
6
Packing information
Figure 13
Table 10
IM69D127V11 packing information
IM69D127V11 packing information
Product
Type code
Reel diameter
Quantity per reel
IM69D127V11
I69D10
330 mm
5000
Datasheet
13
v01_10
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Reflow soldering and board assembly
7
Reflow soldering and board assembly
Infineon MEMS microphones are qualified in accordance with the IPC/JEDEC J-STD-020D-01. The moisture
sensitivity level of MEMS microphones is rated as MSL1. For PCB assembly of the MEMS microphone the widely
used reflow soldering using a forced convection oven is recommended.
The soldering profile should be in accordance with the recommendations of the solder paste manufacturer
to reach an optimal solder joint quality. The reflow profile shown in Figure 14 is recommended for board
manufacturing with Infineon MEMS microphones.
Figure 14
Table 11
Recommended reflow profile
Reflow profile limits
Profile feature
Temperature Min (Tsmin
Pb-Free assembly
150 °C
Sn-Pb Eutectic assembly
100 °C
)
Temperature Max (Tsmax
Time (Tsmin to Tsmax) (ts)
Ramp-up rate (TL to TP)
)
200 °C
150 °C
60-120 seconds
3 °C/second max.
217 °C
60-120 seconds
3 °C/second max.
183 °C
Liquidous temperature (TL)
Time (tL) maintained above TL
Peak Temperature (Tp)
60-150 seconds
260°C +0°C/-5°C
60-150 seconds
235°C +0°C/-5°C
Time within 5°C of actual peak
temperature (tp) 5)
20-40 seconds
10-30 seconds
Ramp-down rate
6 °C/second max.
8 minutes max.
6 °C/second max.
6 minutes max.
Time 25°C to peak temperature
Note:
For further information please consult the 'General recommendation for assembly of Infineon
packages' document which is available on the Infineon Technologies web page
5
Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum
14
Datasheet
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Reflow soldering and board assembly
The MEMS microphones can be handled using industry standard pick and place equipment. Care should be
taken to avoid damage to the microphone structure as follows:
•
•
•
•
•
Do not pick the microphone with vacuum tools which make contact with the microphone acoustic port
hole.
The microphone acoustic port hole should not be exposed to vacuum, this can destroy or damage the
MEMS.
Do not blow air into the microphone acoustic port hole. If an air blow cleaning process is used, the port
hole must be sealed to prevent particle contamination.
It is recommended to perform the PCB assembly in a clean room environment in order to avoid
microphone contamination.
Air blow and ultrasonic cleaning procedures shall not be applied to MEMS Microphones. A no-clean paste
is recommended for the assembly to avoid subsequent cleaning steps. The microphone MEMS can be
severely damaged by cleaning substances.
•
•
To prevent the blocking or partial blocking of the sound port during PCB assembly, it is recommended to
cover the sound port with protective tape during PCB sawing or system assembly.
Do not use excessive force to place the microphone on the PCB. The use of industry standard pick and
place tools is recommended in order to limit the mechanical force exerted on the package.
Datasheet
15
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IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Reliability specifications
8
Reliability specifications
The microphone sensitivity and SNR afer stress must deviate by no more than 3dB from the initial value. All
samples are submitted to 3x reflow (260°C peak temperature) before stress
Table 12
Test
Reliability Tests
Test Condition
Standard
Low temperature operation Ta=-40°C, VDD=2.5V, 1000 hours.
Low temperature storage Ta=-40°C, 1000 hours.
High temperature operation Ta=+125°C, VDD=2.5V, 1000 hours.
JESD22-A108
JESD22-A119
JESD22-A108
JESD22-A103
JESD22-A104
JESD22-A101
High temperature storage
Temperature cycling
Temperature Humidity bias
Vibration
Ta=+125°C, 1000 hours.
1000 cycles, -40°C to +125°C, 30 minutes per cycle.
Ta=+85°C, R.H = 85%, VDD=2.5V, 1000 hours.
20Hz to 2000Hz with a peak acceleration of 20g in X, IEC 60068-2-6 / MIL-STD
Y, and Z for 4 minutes each, total 4 cycles. 883K 2007.3
Mechanical shock
Reflow solder6)
ESD-SLT
10000g/0.1 msec in X, Y, Z direction. 5 shocks in each IEC 60068-2-27
direction, 30 shocks in total. VDD=2.0V
3 reflow cycles, peak temperature = +260°C
IPC-JEDEC J-
STD-020D-01
25 discharges of +/-8kV direct contact to lid while
unit is grounded.
IEC-61000-4-2
ESD-CDM
ESD-HBM
3 discharges of +/-500V direct contact to I/O pins.
3 discharges of 2kV pin to pin.
JEDEC JS-002-2014
JEDEC JS-001-2011
6
The microphone sensitivity must deviate by no more than 1dB from the initial value afer 3 reflow cycles.
16
Datasheet
v01_10
2022-03-15
IM69D127V11
IP57 dust and water resistant PDM digital XENSIVTM MEMS microphone
Revision history
Revision history
Document
Date of
Description of changes
version
release
v01_00
v01_10
2020-10-27
2022-03-15
•
•
Initial datasheet release
updated Tape and Reel Information
Glossary
Datasheet
17
v01_10
2022-03-15
Trademarks
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Edition 2022-03-15
Published by
Infineon Technologies AG
81726 Munich, Germany
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Warnings
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Document reference
IFX-nnz1570625061557
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