IDW75E60_09 [INFINEON]

600 V EmCon technology; 600 V EMCON技术
IDW75E60_09
型号: IDW75E60_09
厂家: Infineon    Infineon
描述:

600 V EmCon technology
600 V EMCON技术

文件: 总7页 (文件大小:179K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDW75E60  
A
Features:  
600 V EmCon technology  
Fast recovery  
Soft switching  
C
Low reverse recovery charge  
Low forward voltage  
175 °C junction operating temperature  
Easy paralleling  
Pb-free lead plating; RoHS compliant  
Complete product spectrum and PSpice Models:  
http://www.infineon.com/emcon/  
PG-TO-247-3  
Applications:  
Welding  
Motor drives  
Type  
VRRM  
IF  
VF,Tj=25°C  
Tj,max  
Marking  
Package  
IDW75E60  
600V  
75A  
1.65V  
D75E60  
PG-TO-247-3  
175°C  
Maximum Ratings  
Parameter  
Symbol  
VRR M  
IF  
Value  
Unit  
Repetitive peak reverse voltage  
Continuous forward current  
TC = 25°C  
600  
V
A
120  
82  
TC = 90°C  
75  
TC = 100°C  
Surge non repetitive forward current  
TC = 25°C, tp = 10 ms, sine halfwave  
Maximum repetitive forward current  
TC = 25°C, tp limited by tj,max, D = 0.5  
Power dissipation  
IFSM  
IFRM  
Ptot  
220  
A
225  
A
W
300  
170  
150  
TC = 25°C  
TC = 90°C  
TC = 100°C  
Operating junction and storage temperature  
Tj, Tstg  
TS  
-55…+175  
260  
°C  
°C  
Soldering temperature  
1.6mm (0.063 in.) from case for 10 s  
1
Rev. 2.1 Nov 09  
Power Semiconductors  
IDW75E60  
Thermal Resistance  
Parameter  
Symbol  
Conditions  
Max. Value  
Unit  
Characteristic  
Thermal resistance,  
junction – case  
Thermal resistance,  
junction – ambient  
RthJC  
RthJA  
0.5  
40  
K/W  
Electrical Characteristic, at Tj = 25 °C, unless otherwise specified  
Value  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
Static Characteristic  
Collector-emitter breakdown voltage VRRM  
IR=0.25mA  
600  
-
-
V
Diode forward voltage  
VF  
IF=75A  
-
-
1.65  
1.65  
2.0  
-
Tj=25°C  
Tj=175°C  
VR=600V  
Tj=25°C  
Tj=175°C  
Reverse leakage current  
IR  
µA  
-
-
-
-
40  
1000  
Dynamic Electrical Characteristics  
Diode reverse recovery time  
Diode reverse recovery charge  
trr  
Qrr  
-
-
-
-
121  
2.4  
38.5  
921  
-
-
-
-
ns  
µC  
A
Tj=25°C  
VR=400V, IF=75A,  
dIF/dt=1460A/µs  
Diode peak reverse recovery current Irr  
Diode peak rate of fall of reverse  
dIrr/dt  
A/µs  
recovery current during tb  
Diode reverse recovery time  
Diode reverse recovery charge  
Diode peak reverse recovery current Irr  
trr  
Qrrm  
-
-
-
-
155  
4.4  
46.6  
960  
-
-
-
-
ns  
µC  
A
Tj=125°C  
VR=400V, IF=75A,  
dIF/dt=1460A/µs  
Diode peak rate of fall of reverse  
dIrr/dt  
A/µs  
recovery current during tb  
Diode reverse recovery time  
Diode reverse recovery charge  
Diode peak reverse recovery current Irr  
trr  
Qrrm  
-
-
-
-
182  
5.8  
56.2  
1013  
-
-
-
-
ns  
µC  
A
Tj=175°C  
VR=400V, IF=75A,  
dIF/dt=1460A/µs  
Diode peak rate of fall of reverse  
dIrr/dt  
A/µs  
recovery current during tb  
2
Rev. 2.1 Nov 09  
Power Semiconductors  
IDW75E60  
300W  
250W  
200W  
150W  
100W  
50W  
120A  
90A  
60A  
30A  
0A  
0W  
25°C  
75°C  
125°C  
25°C  
50°C  
75°C 100°C 125°C 150°C  
TC, CASE TEMPERATURE  
TC, CASE TEMPERATURE  
Figure 1. Power dissipation as a function of  
case temperature  
Figure 2. Diode forward current as a  
function of case temperature  
(Tj 175°C)  
(Tj 175°C)  
200A  
IF=150A  
TJ=25°C  
2.0V  
1.5V  
1.0V  
0.5V  
0.0V  
175°C  
150A  
75A  
37.5A  
100A  
50A  
0A  
0°C  
50°C  
100°C  
150°C  
0V  
1V  
2V  
VF, FORWARD VOLTAGE  
Figure 3. Typical diode forward current as  
a function of forward voltage  
TJ, JUNCTION TEMPERATURE  
Figure 4. Typical diode forward voltage as a  
function of junction temperature  
3
Rev. 2.1 Nov 09  
Power Semiconductors  
IDW75E60  
5µC  
4µC  
3µC  
2µC  
1µC  
0µC  
200ns  
150ns  
100ns  
50ns  
TJ=175°C  
TJ=175°C  
TJ=25°C  
TJ=25°C  
0ns  
1000A/µs  
1500A/µs  
1000A/µs  
1500A/µs  
diF/dt, DIODE CURRENT SLOPE  
diF/dt, DIODE CURRENT SLOPE  
Figure 5. Typical reverse recovery time as  
a function of diode current slope  
(VR=400V, IF=75A,  
Figure 6. Typical reverse recovery charge  
as a function of diode current  
slope  
Dynamic test circuit in Figure E)  
(VR = 400V, IF = 75A,  
Dynamic test circuit in Figure E)  
TJ=175°C  
-1200A/µs  
-1000A/µs  
-800A/µs  
-600A/µs  
-400A/µs  
-200A/µs  
0A/µs  
TJ=175°C  
60A  
TJ=25°C  
50A  
40A  
TJ=25°C  
30A  
20A  
10A  
0A  
1000A/µs  
1500A/µs  
1000A/µs  
1500A/µs  
diF/dt, DIODE CURRENT SLOPE  
diF/dt, DIODE CURRENT SLOPE  
Figure 7. Typical reverse recovery current  
as a function of diode current  
slope  
Figure 8. Typical diode peak rate of fall of  
reverse recovery current as a  
function of diode current slope  
(VR=400V, IF=75A,  
(VR = 400V, IF = 75A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
4
Rev. 2.1 Nov 09  
Power Semiconductors  
IDW75E60  
D=0.5  
0.2  
10-1K/W  
10-2K/W  
0.1  
R , ( K / W )  
0.0556  
τ , ( s )  
0.1495  
0.02797  
3.623 E-3  
3.276 E-4  
2.635 E-5  
R2  
0.05  
0.1757  
0.12374  
0.12192  
0.02305  
0.02  
0.01  
R1  
C1=τ /R1 C2=τ /R2  
1
2
single pulse  
1µs  
10µs 100µs 1ms 10ms 100ms  
tP, PULSE WIDTH  
Figure 9. Diode transient thermal  
impedance as a function of pulse  
width  
(D=tP/T)  
5
Rev. 2.1 Nov 09  
Power Semiconductors  
IDW75E60  
6
Rev. 2.1 Nov 09  
Power Semiconductors  
IDW75E60  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2008 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or  
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or  
any information regarding the application of the device, Infineon Technologies hereby disclaims any and all  
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual  
property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the  
types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies  
components may be used in life-support devices or systems only with the express written approval of  
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of  
that life-support device or system or to affect the safety or effectiveness of that device or system. Life support  
devices or systems are intended to be implanted in the human body or to support and/or maintain and  
sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other  
persons may be endangered.  
7
Rev. 2.1 Nov 09  
Power Semiconductors  

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