IDW40G65C5B_15 [INFINEON]

650V SiC Schottky Diode;
IDW40G65C5B_15
型号: IDW40G65C5B_15
厂家: Infineon    Infineon
描述:

650V SiC Schottky Diode

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中文:  中文翻译
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SiC  
Silicon Carbide Diode  
5th Generation thinQ!TM  
650V SiC Schottky Diode  
IDW40G65C5B  
Final Datasheet  
Rev. 2.0, 2015-04-13  
Power Management & Multimarket  
5th Generation thinQ!™ SiC Schottky Diode  
Description  
IDW40G65C5B  
1
ThinQ!™ Generation 5 represents Infineon leading edge technology for the SiC  
Schottky Barrier diodes. A combination with a new, more compact design and thin-  
wafer technology results is a new family of products showing improved efficiency  
over all load conditions, resulting from both the improved thermal characteristics  
and a lower figure of merit (Qc x Vf).  
The new thinQ!™ Generation 5 has been designed to complement our 650V  
CoolMOS™ families: this ensures meeting the most stringent application  
requirements in this voltage range.  
1
2
3
Features  
Revolutionary semiconductor material - Silicon Carbide  
Benchmark switching behavior  
No reverse recovery/ No forward recovery  
Temperature independent switching behavior  
High surge current capability  
Pb-free lead plating; RoHS compliant  
Qualified according to JEDEC1) for target applications  
Breakdown voltage tested at 44 mA2) 3)  
Optimized for high temperature operation  
Benefits  
System efficiency improvement over Si diodes  
System cost / size savings due to reduced cooling requirements  
Enabling higher frequency / increased power density solutions  
Higher system reliability due to lower operating temperatures  
Reduced EMI  
Applications  
Switch mode power supply  
Power factor correction  
Solar inverter  
Uninterruptible power supply  
Table 1  
Key Performance Parameters 4)  
Parameter  
VDC  
Value  
650  
Unit  
V
QC; VR=400V  
EC; VR=400V  
IF @ TC < 120°C  
2 x 29  
2 x 6.6  
2 x 20  
nC  
µJ  
A
Table 2  
Pin 1  
A
Pin Definition  
Pin 2  
C
Pin 3  
A
Type / ordering Code  
Package  
Marking  
Related links  
IDW40G65C5B  
PG-TO247-3  
D4065B5  
www.infineon.com/sic  
1)  
2)  
3)  
4)  
J-STD20 and JESD22  
All devices tested under avalanche conditions for a time periode of 10ms  
Per Leg  
Per Device  
Final Datasheet  
2
Rev. 2.0, 2015-04-13  
 
5th Generation thinQ!TM SiC Schottky Diode  
IDW40G65C5B  
Table of contents  
Table of Contents  
1
2
3
4
5
6
7
8
Description..........................................................................................................................................2  
Maximum ratings................................................................................................................................4  
Thermal characteristics.....................................................................................................................4  
Electrical characteristics...................................................................................................................5  
Electrical characteristics diagrams..................................................................................................6  
Simplified Forward Characteristics Model ......................................................................................8  
Package outlines................................................................................................................................9  
Revision History...............................................................................................................................10  
Final Datasheet  
3
Rev. 2.0, 2015-04-13  
5th Generation thinQ!TM SiC Schottky Diode  
IDW40G65C5B  
Maximum ratings  
2
Maximum ratings  
Table 3  
Maximum ratings  
Parameter  
Symbol  
Values  
Unit  
Note/Test Condition  
Min.  
Typ.  
Max.  
20  
Continuous forward current 1)  
IF  
TC < 120°C, D=1  
TC = 25°C, tp=10 ms  
TC = 150°C, tp=10 ms  
TC = 25°C, tp=10 µs  
TC = 25°C, tp=10 ms  
TC = 150°C, tp=10 ms  
Tj = 25°C  
103  
87  
Surge non-repetitive forward current, sine IF,SM  
halfwave 1)  
Non-repetitive peak forward current 1)  
i²t value 1)  
A
776  
53  
IF,max  
i²dt  
A²s  
38  
650  
100  
112  
175  
60  
Repetitive peak reverse voltage  
Diode dv/dt ruggedness  
Power dissipation 1)  
VRRM  
dv/dt  
Ptot  
V
V/ns  
W
VR=0..480 V  
TC = 25°C  
Operating and storage temperature  
Mounting torque  
Tj;Tstg  
-55  
°C  
Ncm  
M3 screws  
3
Thermal characteristics  
Table 4  
Thermal characteristics TO-247-3  
Parameter  
Symbol  
Values  
Typ.  
1.0  
Unit  
Note/Test Condition  
Min.  
Max.  
Thermal resistance, junction-case 1)  
Thermal resistance, junction-ambient 1) RthJA  
RthJC  
1.3  
K/W  
°C  
leaded  
62  
Soldering temperature, wavesoldering Tsold  
only allowed at leads  
1.6mm (0.063 in.) from  
case for 10 s  
260  
1)  
2)  
Per Leg  
Per Device  
Final Datasheet  
4
Rev. 2.0, 2015-04-13  
 
5th Generation thinQ!TM SiC Schottky Diode  
IDW40G65C5B  
Electrical characteristics  
4
Electrical characteristics  
Table 5  
Static characteristics  
Parameter  
Symbol  
Values  
Typ.  
Unit  
Note/Test Condition  
Tj=25°C  
Min.  
650  
Max.  
DC blocking voltage  
Diode forward voltage  
VDC  
VF  
1.5  
1.7  
2.1  
210  
75  
V
IF= 20 A, Tj=25°C  
IF= 20 A, Tj=150°C  
VR=650 V, Tj=25°C  
VR=600 V, Tj=25°C  
VR=650 V, Tj=150°C  
1.8  
Reverse current 1)  
IR  
1.1  
0.3  
µA  
4.1  
1450  
Table 6  
AC characteristics  
Parameter  
Symbol  
Values  
Typ.  
Unit  
Note/Test Condition  
Min.  
Max.  
Total capacitive charge 1)  
Total Capacitance 1)  
Qc  
C
VR=400 V, di/dt=200A/µs,  
IFIF,MAX, Tj=150°C  
29  
nC  
pF  
590  
76  
VR=1 V, f=1 MHz  
VR=300 V, f=1 MHz  
VR=600 V, f=1 MHz  
74  
1)  
2)  
Per Leg  
Per Device  
Final Datasheet  
5
Rev. 2.0, 2015-04-13  
 
5th Generation thinQ!TM SiC Schottky Diode  
IDW40G65C5B  
Electrical characteristics diagrams  
5
Electrical characteristics diagrams  
Table 7  
Power dissipation 1)  
Maximal diode forward current 1)  
160  
120  
100  
80  
60  
40  
20  
0
0.1  
0.3  
0.5  
0.7  
1
140  
120  
100  
80  
60  
40  
20  
0
25  
50  
75  
100  
125  
150  
175  
25  
50  
75  
100  
125  
150  
175  
TC[°C]  
TC[°C]  
Ptot=f(TC); RthJC,max  
IF=f(TC); RthJC,max;Tj175°C; parameter D=duty cycle  
Table 8  
Typical forward characteristics 1)  
Typical forward characteristics in surge current 1)  
40  
200  
180  
160  
140  
35  
-55°C  
30  
25  
20  
15  
10  
5
25°C  
-55°C  
120  
100°C  
100  
25°C  
80  
100°C  
150°C  
175°C  
60  
40  
150°C  
175°C  
20  
0
0
0
1
2
3
4
5
6
0
1
2
3
VF [V]  
VF [V]  
IF=f(VF); tp=200 µs; parameter: Tj  
IF=f(VF); tp=200 µs; parameter: Tj  
1)  
2)  
Per Leg  
Per Device  
Final Datasheet  
6
Rev. 2.0, 2015-04-13  
 
5th Generation thinQ!TM SiC Schottky Diode  
IDW40G65C5B  
Electrical characteristics diagrams  
Table 9  
Typ. capacitance charge vs. current slope 1)  
Typ. Reverse current vs. reverse voltage 1)  
1.E-4  
30  
25  
20  
15  
10  
5
1.E-5  
1.E-6  
175°C  
1.E-7  
150°C  
1.E-8  
100°C  
-55°C  
25°C  
400  
1.E-9  
100  
0
100  
200  
300  
VR [V]  
500  
600  
300  
500  
700  
900  
dIF/dt [A/µs]  
QC=f(diF/dt); Tj=150°C; VR=400 V; IFIF,max  
IR=f(VR); parameter: Tj  
Table 10  
Max. transient thermal impedance 1)  
Typ. capacitance vs. reverse voltage 1)  
800  
700  
600  
500  
400  
300  
200  
100  
0
1
0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
single pulse  
0.01  
1.E-06  
1.E-03  
1.E+00  
0
1
10  
100  
1000  
tp [s]  
VR [V]  
Zth,jc=f(tP); parameter: D=tP/T  
C=f(VR); Tj=25°C; f=1 MHz  
1)  
2)  
Per Leg  
Per Device  
Final Datasheet  
7
Rev. 2.0, 2015-04-13  
5th Generation thinQ!TM SiC Schottky Diode  
IDW40G65C5B  
Electrical characteristics diagrams  
Table 11  
Typ. capacitance stored energy 1)  
18  
16  
14  
12  
10  
8
6
4
2
0
0
200  
400  
600  
VR [V]  
EC=f(VR)  
6
Simplified Forward Characteristics Model  
Table 12  
Equivalent forward current curve 1)  
Mathematical Equation  
VF VTH RDIFF IF  
VTH  
Tj  
 0.001Tj 1.04  
   
V
2
RDIFF  
Tj  
6.410-7 Tj 6.410-5 Tj 0.023  
   
1/Rdiff  
Vth  
VF [V]  
VF=f(IF)  
Tj in °C; -55°C < Tj < 175°C; IF < 40 A  
1)  
2)  
Per Leg  
Per Device  
Final Datasheet  
8
Rev. 2.0, 2015-04-13  
5th Generation thinQ!TM SiC Schottky Diode  
IDW40G65C5B  
7
Package outlines  
Figure 1  
Outlines TO-247, dimensions in mm/inches  
1)  
2)  
Per Leg  
Per Device  
Final Datasheet  
9
Rev. 2.0, 2015-04-13  
5th Generation thinQ!TM SiC Schottky Diode  
IDW40G65C5B  
Revision History  
8
Revision History  
5th Generation thinQ!TM SiC Schottky Diode  
Revision History: 2015-04-13, Rev. 2.0  
Previous Revision:  
Revision  
Subjects (major changes since last version)  
Release of the final datasheet.  
2.0  
We Listen to Your Comments  
Any information within this document that you feel is wrong, unclear or missing at all?  
Your feedback will help us to continuously improve the quality of this document.  
Please send your proposal (including a reference to this document) to: erratum@infineon.com  
Edition 2015-04-13  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2015 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or  
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any  
information regarding the application of the device, Infineon Technologies hereby disclaims any and all  
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual  
property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in  
question, please contact the nearest Infineon Technologies Office.  
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or  
systems and/or automotive, aviation and aerospace applications or systems only with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the  
failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or  
effectiveness of that device or system. Life support devices or systems are intended to be implanted in the  
human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to  
assume that the health of the user or other persons may be endangered.  
Final Datasheet  
10  
Rev. 2.0, 2015-04-13  
 
w w w . i n f i n e o n . c o m  
Published by Infineon Technologies AG  

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