HYB18T256400AF-3 [INFINEON]
256 Mbi t DDR2 SDRAM; 256姆吨DDR2 SDRAM
| 型号： | HYB18T256400AF-3 |
| 厂家： | 
Infineon |
| 描述： | 256 Mbi t DDR2 SDRAM |
| 文件： | 总90页 (文件大小：1656K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet, V1.02, May 2004
HYB18T256400AF
HYB18T256800AF
HYB18T256160AF
256 Mbit DDR2 SDRAM
Memory Products
N e v e r s t o p t h i n k i n g .
Edition 2004-04-02
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München, Germany
© Infineon Technologies AG 5/7/04.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide
(www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the
failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life
support devices or systems are intended to be implanted in the human body, or to support and/or maintain and
sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other
persons may be endangered.
.
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
DATASHEET Rev. 1.02 (05.04)
Features
• Differential clock inputs (CK and CK)
• Bi-directional, differential data strobes (DQS and
DQS) are transmitted / received with data. Edge
aligned with
• High Performance:
-5
-3.7
-3S
-3
read data and center-aligned with write data
DDR2 DDR2 DDR2 DDR2
Speed Sorts
Units
-400
-533
-667
-667
• DLL aligns DQ and DQS transitions with clock
• DQS can be disabled for single-ended data strobe
Bin (CL-tRCD-TRP)
3-3-3 4-4-4 5-5-5 4-4-4
tck
operation
max. Clock
Frequency
• Commands entered on each positive clock edge, data
and data mask are referenced to both edges of DQS
• Data masks (DM) for write data
200
266
333
667
MHz
Data Rate
400
3
533
4
Mb/s/pin
• Posted CAS by programmable additive latency for
CAS Latency (CL)
5
4
tck
ns
ns
ns
ns
better command and data bus efficiency
tRCD
tRP
15
15
40
55
15
15
45
60
15
15
45
60
12
12
45
57
• Off-Chip-Driver impedance adjustment (OCD) and
On-Die-Termination (ODT) for better signal quality.
• Auto-Precharge operation for read and write bursts
tRAS
tRC
• Auto-Refresh, Self-Refresh and power saving Power-
Down modes
• Average Refresh Period 7.8µs at a T
lower than
CASE
85oC, 3.9µs between 85oC and 95oC
• 1.8V ± 0.1V Power Supply
1.8 V ± 0.1V (SSTL_18) compatible) I/O
• DRAM organisations with 4, 8 and 16 data in/outputs
• Normal and Weak Strength Data-Output Drivers
• 1k page size
• Double Data Rate architecture: two data transfers per
• Lead-freePackages:
clock cycle, four internal banks for concurrent operation
60 pin FBGA for x4 & x8 components
84 pin FBPA for x16 components
• CAS Latency: 3, 4 and 5
• Burst Length: 4 and 8
1.0 Description
All of the control and address inputs are synchronized with
a pair of externally supplied differential clocks. Inputs are
latched at the cross point of differential clocks (CK rising
and CK falling). All I/Os are synchronized with a single
ended DQS or differential (DQS, DQS) pair in a source
synchronous fashion. A 15 bit address bus is used to con-
vey row, column and bank address information in a RAS /
CAS multiplexing style.
The 256Mb Double-Data-Rate-2 (DDR2) DRAMs are high-
speed CMOS Double Data Rate 2 Synchronous DRAM
devices containing 268,435,456 bits and are internally config-
ured as a quad-bank DRAMs. The 256Mb chip is organized
as either 16Mbit x 4 I/O x 4 bank, 8Mbit x 8 I/O x 4 bank or
4Mbit x 16 I/O x 4 bank device. These synchronous devices
achieve high speed double-data-rate transfer rates of up to
667 Mb/sec/pin for general applications.
The DDR2 devices operate with a 1.8V +/-0.1V power
supply and are available in FBGA packages.
The chip is designed to comply with all key DDR2 DRAM key
features: (1) posted CAS with additive latency, (2) write
latency = read latency -1, (3) normal and weak strength data-
output driver, (4) Off-Chip Driver (OCD) impedance adjust-
ment and (5) an ODT (On-Die Termination) function.
An Auto-Refresh and Self-Refresh mode is provided along
with various power-saving power-down modes.
The functionality described and the timing specifications
included in this data sheet are for the DLL Enabled mode
of operation.
Page 3
Rainer.Weidlich@Infineon.com
Rev. 1.02
May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
1.1 Ordering Information
CAS
Clock
(MHz)
Speed
Sort
Part Number
DRAM Organisation
4 banks x 16 Mbits x 4
Package
Latency
HYB18T256400AF(L)-5
HYB18T256800AF(L)-5
HYB18T256160AF(L)-5
HYB18T256400AF(L)-3.7
HYB18T256800AF(L)-3.7
HYB18T256160AF(L)-3.7
HYB18T256400AF(L)-3
HYB18T256800AF(L)-3
HYB18T256160AF(L)-3
HYB18T256400AF(L)-3S
HYB18T256800AF(L)-3S
HYB18T256160A(L)-3S
Notes:
60 pin FBGA
60 pin FBGA
84 pin FBGA
60 pin FBGA
60 pin FBGA
84 pin FBGA
60 pin FBGA
60 pin FBGA
84 pin FBGA
60 pin FBGA
60 pin FBGA
84 pin FBGA
3, 4 & 5
200
DDR2-400 4 banks x 8 Mbits x 8
4 banks x 4 Mbits x 16
4 banks x 16 Mbits x 4
4 & 5
4 & 5
5
266
DDR2-533 4 banks x 8 Mbits x 8
4 banks x 4 Mbits x 16
4 banks x 16 Mbits x 4
4 banks x 8 Mbits x 8
4 banks x 4 Mbits x 16
4 banks x 16 Mbits x 4
4 banks x 8 Mbits x 8
4 banks x 4 Mbits x 16
333
DDR2-667
1) For product nomenclature see section 10 of this datasheet
2) Versions with an “L” in the part numbers are Low Power versions of the standard component with reduced IDD6 Self-Refresh
current. See section 6.1 for IDD current specifications.
3) All FBGA packages are lead-free.
1.2 Pin Description
1.2.1 x4 Components
Function
Symbol
Function
Symbol
A0~A12
A0~A9,A11
BA0, BA1
Row Address Inputs
Column Address Inputs
Bank Address Inputs
Differential Data Strobes
No Connection (Chip to Pin)
Supply Voltage
DQS, DQS
NC
VDD
Column Address Input
for Auto-Precharge
Ground
A10/AP
VSS
Chip Select
Row Address Strobe
Column Address Strobe
Write Enable
Supply Voltage for DQ
Ground for DQs
Supply Voltage for DLL
Ground for DLL
CS
RAS
CAS
WE
VDDQ
VSSQ
VDDL
VSSDL
Reference Voltage for SSTL
Data Inputs/Outputs (x4)
DQ0~DQ3
VREF
Inputs
Clock Enable
Differential Clock Inputs
Data Input Mask
On Die Termination Enable
Reserved for future use
Not Connected
CKE
CK, CK
DM
ODT
RFU
NC
Page 4
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
1.2.1 x8 Components
Function
Symbol
Function
Symbol
A0~A12
A0~A9
Row Address Inputs
Column Address Inputs
Bank Address Inputs
Differential Data Strobes
Differential Read Data Strobes
Supply Voltage
DQS, DQS
RDQS, RDQS
VDD
BA0, BA1
Column Address Input
for Auto-Precharge
Ground
A10/AP
VSS
Chip Select
Row Address Strobe
Column Address Strobe
Write Enable
Supply Voltage for DQ
Ground for DQs
Supply Voltage for DLL
Ground for DLL
CS
RAS
CAS
WE
VDDQ
VSSQ
VDDL
VSSDL
Reference Voltage for SSTL
Data Inputs/Outputs (x8)
DQ0~DQ7
VREF
Inputs
Clock Enable
Differential Clock Inputs
Data Input Mask
On Die Termination Enable
Reserved for future use
Not connected
CKE
CK, CK
DM
ODT
RFU
NC
1.2.3 x16 Components
Function
Symbol
Function
Symbol
LDQS,LDQS
UDQS,UDQS
Row Address Inputs
Differential Data Strobes
A0~A12
Column Address Inputs
Bank Address Inputs
No Connection (Chip to Pin)
Supply Voltage
A0~A8
BA0, BA1
NC
VDD
Column Address Input
for Auto-Precharge
Ground
A10/AP
VSS
Chip Select
Row Address Strobe
Column Address Strobe
Write Enable
Supply Voltage for DQ
Ground for DQs
Supply Voltage for DLL
Ground for DLL
CS
RAS
CAS
WE
VDDQ
VSSQ
VDDL
VSSDL
Reference Voltage for SSTL
Data Inputs/Outputs
LDQ0~7, UDQ0~7
VREF
Inputs
Clock Enable
Differential Clock Inputs
Data Input Masks
On Die Termination Enable
reserved for future use
Not connected
CKE
CK, CK
LDM, UDM
ODT
RFU
NC
Page 5
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
1.3 256Mbit DDR2 Addressing
Configuration
# of Banks
64Mb x 4
32Mb x 8
4
16Mb x 16
4
4
BA0, BA1
A10 / AP
A0 ~ A12
A0 ~ A9, A11
2048 bits
1024 (1kB)
Bank Address
Auto-Precharge
Row Address
Column Address
Page Length
Page Size
BA0, BA1
A10 / AP
A0 ~ A12
A0 ~ A9
1024 bits
1024 (1kB)
BA0, BA1
A10 / AP
A0 ~ A12
A0 ~ A8
512 bits
1024 (1kB)
page length = 2 colbit,
page size in bytes = 2 colbits x ORG / 8
where colbits is the number of column address bits and ORG the number of I/O (DQ) bits.
,
1.4 Package Pinout & Addressing
1.4.1 Package Pinout for x4 components, 60 pins, FBGA Package (top view)
1
2
3
VSS
DM
7
8
DQS
VSSQ
DQ0
VSSQ
CK
9
VDD
NC
NC
A
B
C
D
E
F
VSSQ
DQS
VDDQ
DQ2
VSSDL
RAS
CAS
A2
VDDQ
NC
VSSQ
DQ1
VSSQ
VREF
CKE
BA0
A10
A3
VDDQ
NC
VDDQ
DQ3
VSS
WE
VDDQ
NC
VDDL
VDD
ODT
CK
RFU
VSS
VDD
BA1
A1
G
H
J
CS
A0
VDD
VSS
A5
A6
A4
A7
A9
K
L
A11
A8
A12
NC,(A14)
NC,(A15) NC,(A13)
Notes:
1) VDDL and VSSDL are power and ground for the DLL.They are isolated on the
device from VDD, VDDQ, VSS and VSSQ.
2) NC, (A13), NC,(A14) and NC,(A15) are additional address pins for future genera-
tion DRAMs and are not connected on this component
3) Ball position G1 “RFU” will be used for BA2 on 1Gbit memory densities and higher
Page 6
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
1.4.2 Package Pinout for x8 components, 60 pins, FBGA Package (top view)
1
2
3
7
8
9
NU,
VDD
VSS
A
B
VSSQ
DQS
VDDQ
RDQS
DM,
DQ6
VSSQ
DQS
VSSQ
DQ7
RDQS
VDDQ
DQ4
DQ1
VSSQ
VREF
CKE
BA0
A10
VDDQ
DQ3
VSS
WE
C
D
E
F
VDDQ
DQ2
VSSDL
RAS
CAS
A2
DQ0
VSSQ
CK
VDDQ
DQ5
VDDL
VDD
ODT
CK
RFU
VSS
VDD
BA1
A1
G
H
J
CS
A0
VDD
VSS
A3
A5
A6
A4
A7
A9
K
L
A11
A8
A12
NC,(A14)
NC,(A15) NC,(A13)
Notes:
1) RDQS / RDQS are enabled by EMRS(1) command.
2) If RDQS / RDQS is enabled, the DM function is disabled
3) When enabled, RDQS & RDQS are used as strobe signals during reads.
4) VDDL and VSSDL are power and ground for the DLL. They are isolated on the
device from VDD, VDDQ, VSS and VSSQ.
5) NC,(A13), NC,(A14) and NC,(A15) are additional address pins for future generation
DRAMs and are not connected on this component.
6) Ball position G1 “RFU” will be used for BA2 on 1Gbit memory densities and higher
Page 7
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
1.4.3 Package Pinout for x16 components 84 pins, FBGA Package (top view)
1
2
3
VSS
UDM
VDDQ
DQ3
VSS
LDM
VDDQ
LDQ3
VSS
WE
7
8
9
VDD
NC
A
B
C
D
E
F
VSSQ
UDQS
VDDQ
UDQ2
VSSQ
LDQS
VDDQ
LDQ2
VSSDL
RAS
UDQS
VSSQ
UDQ0
VSSQ
LDQS
VSSQ
LDQ0
VSSQ
CK
VDDQ
UDQ7
VDDQ
UDQ5
VDDQ
LDQ7
VDDQ
LDQ5
VDD
UDQ6
VDDQ
UDQ4
VDD
VSSQ
UDQ1
VSSQ
NC
LDQ6
VDDQ
LDQ4
VDDL
VSSQ
LDQ1
VSSQ
VREF
CKE
BA0
A10
G
H
J
K
L
CK
ODT
RFU
VSS
VDD
BA1
A1
CAS
CS
M
N
P
R
A2
A0
VDD
VSS
A3
A5
A6
A4
A7
A9
A11
A8
A12
NC,(A14)
NC,(A15) NC,A13)
Notes:
1) UDQS/UDQS is data strobe for upper byte, LDQS/LDQS is data strobe for lower
byte
2) UDM is the data mask signal for the upper byte UDQ0~UDQ7,
LDM is the data mask signal for the lower byte LDQ0~LDQ7
3) NC,(A13), NC, (A14) and NC, (A15) are additional address pins for future gener-
ation DRAMs and are not connected on this component.
4) Ball position G1 “RFU” will be used for BA2 on 1Gbit memory densities and
higher
Page 8
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
1.5 Input/Output Functional Description
Type
Function
Symbol
Clock: CK and CK are differential system clock inputs. All address and control inputs are sampled on the crossing of
the positive edge of CK and negative edge of CK. Output (read) data is referenced to the crossing of CK and CK
(both direction of crossing)
CK, CK
Input
Clock Enable: CKE high activates and CKE low deactivates internal clock signals and device input buffers and out-
put drivers. Taking CKE low provides Precharge Power-Down and Self-Refresh operation (all banks idle), or Active
Power-Down (row Active in any bank). CKE is synchronous for power down entry and exit and for self-refresh entry.
Input buffers excluding CKE are disabled during self-refresh. CKE is used asynchronously to detect self-refresh exit
condition. Self-refresh termination itself is synchronous. After VREF has become stable during power-on and initiali-
sation sequence, it must be maintained for proper operation of the CKE receiver. For proper self-refresh entry and
exit, VREF must be maintained to this input. CKE must be maintained high throughout read and write accesses.
Input buffers, excluding CK, CK, ODT and CKE are disabled during dower-down.
Input
Input
CKE
Chip Select: All command are masked when CS is registered high. CS provides for external rank selection on sys-
CS
tems with multiple memory ranks. CS is considered part of the command code.
Input Command Inputs: RAS, CAS and WE (along with CS) define the command being entered
RAS, CAS, WE
Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is sampled high coinci-
dent with that input data during a Write access. DM is sampled on both edges of DQS. Although DM pins are input
Input only, the DM loading matches the DQ and DQS loading. LDM and UDM are the input mask signals for x16 compo-
nents and control the lower or upper bytes. For x8 components the data mask function is disabled, when RDQS /
RQDS are enabled by EMRS(1) command.
DM, LDM, UDM
Bank Address Inputs: BA0 and BA1 define to which bank an Activate, Read, Write or Precharge command is being
Input applied. BA0 and BA1 also determines if the mode register or extended mode register is to be accessed during a
MRS or EMRS(1) cycle.
BA0, BA1
A0 - A12
Address Inputs: Provides the row address for Activate commands and the column address and Auto-Precharge bit
A10 (=AP) for Read/Write commands to select one location out of the memory array in the respective bank. A10
Input (=AP) is sampled during a Precharge command to determine whether the precharge applies to one bank (A10=low)
or all banks (A10=high). If only one bank is to be precharged, the bank is selected by BA0 and BA1. The address
inputs also provide the op-code during Mode Register Set commands.
Input/
Output
Data Inputs/Output: Bi-directional data bus. DQ0~DQ3 for x4 components, DQ0~DQ7 for x8 components,
DQx,
LDQ0~LDQ7 and UDQ0~UDQ7 for x16 components
LDQx,UDQx
Data Strobe: output with read data, input with write data. Edge aligned with read data, centered with write data. For
the x16, LDQS corresponds to the data on LDQ0 - LDQ7; UDQS corresponds to the data on UDQ0-UDQ7. The data
strobes DQS, LDQS, UDQS may be used in single ended mode or paired with the optional complementary signals
DQS, LDQS, UDQS to provide differential pair signaling to the system during both reads and writes. An EMRS(1)
control bit enables or disables the complementary data strobe signals.
DQS, (DQS)
LDQS, (LDQS), Input/
UDQS,(UDQS) Output
Read Data Strobe: For the x8 components a RDQS, RDQS pair can be enabled via the EMRS(1) for read timing.
RDQS, RDQS is not supported on x4 and x16 components. RDQS, RDQS are edge-aligned with read data. If
RDQS, RDQS is enabled, the DM function is disabled on x8 components.
Input/
RDQS, (RDQS)
Output
On Die Termination: ODT (registered HIGH) enables termination resistance internal to the DDR2 SDRAM. When
enabled, ODT is applied to each DQ, DQS, DQS and DM signal for x4 and DQ, DQS, DQS, RDQS, RDQS and DM
for x8 configurations. For x16 configuration ODT is applied to each DQ, UDQS, UDQS, LDQS, LDQS, UDM and
LDM signal. The ODT pin will be ignored if the Extended Mode Register (EMRS(1)) is programmed to disable ODT.
Input
ODT
NC
No Connect: no internal electrical connection is present
Supply DQ Power Supply: 1.8V +/- 0.1V
Supply DQ Ground
V
DDQ
V
SSQ
Supply DLL Power Supply: 1.8V +/- 0.1V
Supply DLL Ground
V
DDL
V
SSDL
Supply Power Supply: 1.8V +/- 0.1V
V
DD
Supply Ground
V
SS
Supply Reference Voltage
VREF
No Connects: BA2, A13 ~ A15 are additional address pins for future generation DRAMs and are not connected on
the components describes in this datasheet.
(BA2),
NC
(A13~A15)
Page 9
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
1.6 Block Diagrams
CKE
CK
CK
CS
WE
CAS
RAS
AP
Bank3
Bank2
Bank1
CK, CK
DLL
Mode
Registers
15
8192
Bank0
Memory
Array
15
Data
15
(8192 x 512 x 16)
4
4
4
4
4
16
Sense Amplifiers
2
DQS
Generator
DQ0-DQ3,
DM
DQS
DQS
COL0,1
Input
I/O Gating
DM Mask Logic
16
Register
2
DQS
DQS
Mask 1
1
A0-A12,
15
Write
BA0, BA1
FIFO
1
1
1
&
16
512
2
1
Drivers
(x16)
1
1
4
1
Column
Decoder
4
4
4
9
4
Column-Address
Counter/Latch
11
16
4
4
COL0,1
4
4
2
Data
4
CK,
CK
COL0,1
Note: This Functional Block Diagram is intended to facilitate user understanding of the operation of
the device; it does not represent an actual circuit implementation.
Note: DM is a unidirectional signal (input only), but is internally loaded to match the load of the bidi-
rectional DQ and DQS signals.
Block Diagram 16Mbit x 4 I/O x 4 Internal Memory Banks,
(64 Mbit x 4 Organisation with 13 Row, 2 Bank and 11 Column External Addresses)
Page 10
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
CKE
CK
CK
CS
WE
CAS
RAS
AP
Bank3
Bank2
Bank1
CK, CK
DLL
Mode
Registers
15
Bank0
Memory
Array
15
8192
Data
15
(8192x256x32)
8
8
8
8
8
32
Sense Amplifiers
1
DQS
Generator
DQ0-DQ7,
DM
DQS
DQS
COL0,1
Input
I/O Gating
DM Mask Logic
32
Register
2
DQS
DQS
A0-A12,
BA0, BA1
1
1
Mask
Write
15
FIFO
1
1
1
1
&
32
2
256
1
Drivers
(x32)
1
1
4
Column
Decoder
8
8
8
8
8
8
Column-Address
Counter/Latch
10
32
8
COL0,1
8
8
Data
2
8
CK,
CK
COL0,1
Note: This Functional Block Diagram is intended to facilitate user understanding of the operation of
the device; it does not represent an actual circuit implementation.
Note: DM is a unidirectional signal (input only), but is internally loaded to match the load of the bidi-
rectional DQ and DQS signals.
Block Diagram 8Mbit x 8 I/O x 4 Internal Memory Banks
(32Mb x 8 Organisation with 13 Row, 2 Bank and 10 Column External Addresses)
Page 11
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
CKE
CK
CK
CS
WE
CAS
RAS
AP
Bank3
Bank2
Bank1
CK, CK
DLL
Mode
Registers
15
8192
Bank0
Memory
Array
15
Data
15
16
16
16
16
(8192 x 128 x 64)
16
64
Sense Amplifiers
1
DQS
Generator
LDQ0-LDQ7
LDM
DQS
DQS
COL0,1
Input
Register
I/O Gating
DM Mask Logic
UDQ0-UDQ7
64
2
Mask 2
2
Write
UDM
A0-A12,
BA0, BA1
15
FIFO
2
2
2
LDQS
LDQS
UDQS
&
64
2
Drivers
2
128
2
2
(x64)
8
2
UDQS
Column
Decoder
16
16
16
7
16
16
16
64
Column-Address
Counter/Latch
16
9
16
16
COL0
Data
2
CK,
CK
COL0,1
Note: This Functional Block Diagram is intended to facilitate user understanding of the operation
of the device; it does not represent an actual circuit implementation.
Note: DM is a unidirectional signal (input only), but is internally loaded to match the load of the
Block Diagram 4Mbit x 16 I/O x 4 Internal Memory Banks
(16Mb x 16 Organisation with 13 Row, 2 Bank and 9 Column External Addresses)
Page 12
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
2. Functional Description
2.1 Simplified State Diagram
CKEL
REFSX
Initialization
Sequence
Autorefreshing
Selfrefresh
t
RFC
CKEL
MRS
setting MRS
or EMRS
PD_entry
Idle
Precharge PD CKEH
t
MRD
Activating
t
RCD
t
WL + BL/2 + WR
Writing_AP
RP
Precharging
RL + BL/2 + t
RTP
Reading_AP
Write
Read
Writing
Reading
Automatic Sequence
Command Sequence
CKEL
Active PD
PD_entry
CKEH
Bank Active
This Simplified State Diagram is intended to provide a floorplan of the possible state transitions and the
commands to control them. In particular situations involving more than one bank, enabling / disabling on-die
termination, Power-Down entry / exit - among other things - are not captured in full detail.
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INFINEON Technologies
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256Mb DDR2 SDRAM
2.2 Basic Functionality
Read and write accesses to the DDR2 SDRAM are burst oriented; accesses start at a selected location and con-
tinue for the burst length of four or eight in a programmed sequence. Accesses begin with the registration of an
Activate command, which is followed by a Read or Write command. The address bits registered coincident with
the activate command are used to select the bank and row to be accessed (BA0 & BA1 select the bank, A0-A12
select the row). The address bits registered coincident with the Read or Write command are used to select the
starting column location for the burst access and to determine if the Auto-Precharge command is to be issued.
Prior to normal operation, the DDR2 SDRAM must be initialized. The following sections provide detailed informa-
tion covering device initialization, register definition, command description and device operation.
2.2.1 Power On and Initialization
DDR2 SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than
those specified may result in undefined operation. Power-Up and Initialization Sequence
The following sequence is required for POWER UP and Initialization.
1. Apply power and attempt to maintain CKE below 0.2 * VDDQ and ODT at a low state (all other inputs may be
undefined). To guarantee ODT off, VREF must be valid and a low level must be applied to the ODT pin. Maximum
power up interval for VDD/VDDQ is specified as 10.0 ms. The power interval is defined as the amount of time it takes
for VDD / VDDQ to power-up from 0V to 1.8 V +/- 100 mV.
- VDD,VDDL and VDDQ are driven from a single power converter output, AND
- VTT is limited to 0.95 V max, AND
- VREF tracks VDDQ/2
or
- Apply VDD before or at the same time as VDDL,
- Apply VDDL before or at the same time as VDDQ.
- Apply VDDQ before or at the same time as VTT & VREF.
at least one of these two sets of conditions must be met.
2. Start clock (CK, CK) and maintain stable power and clock condition for a minimum of 200 µs.
3. Apply NOP or Deselect commands & take CKE high.
4. Wait minimum of 400ns, then issue a Precharge-All command.
5. Issue EMRS(2) command. (To issue EMRS(2) command, provide “low” to BA0 and BA2 and “high” to BA1)
6. Issue EMRS(3) command. (To issue EMRS(3) command, provide “low” to BA2 and “high” to BA0 and BA1)
7. Issue EMRS(1) command to enable DLL. (To issue “DLL Enable” command, provide “low” to A0 and
“high” to BA0 and “low” to BA1,BA2 and A13~A15)
8. Issue MRS command (Mode Register Set) for "DLL reset". (To issue DLL reset command, provide “high” to A8
and “low” to BA0 ~ BA2 and A13 ~ A15)
9. Issue Precharge-All command.
10. Issue 2 or more Auto-Refresh commands.
11. Issue a MRS command with low on A8 to initialize device operation. (i.e. to program operating parameters with
out resetting the DLL)
12. At least 200 clocks after step 8, execute OCD Calibration (Off Chip Driver impedance adjustment). If OCD cali-
bration is not used, EMRS OCD Default command (A9=A8=A7=1) followed by EMRS(1) OCD Calibration Mode
Exit command (A9=A8=A7=0) must be issued with other parameters of EMRS(1).
13. The DDR2 SDRAM is now ready for normal operation.
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INFINEON Technologies
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256Mb DDR2 SDRAM
Example:
CK, CK
CKE
ODT "low"
Follow OCD
tMRS
tMRS
tRP
tMRS
tRP
tRFC
tRFC
tMRS
tMRS
tMRS
400 ns
flowchart
PRE
ALL
PRE
ALL
2nd Auto
refresh
1st Auto
refresh
Any
Command
EMRS(1)
OCD
EMRS(1)
OCD
NOP
EMRS(2)
MRS
EMRS(1)
EMRS(3)
MRS
min. 200 cycles to lock the DLL
Extended
Mode
Mode
Mode
Register
Set w/o
Register
Set with
OCD Drive(1)
or
OCD
Register(1) Set
calibration
mode exit
with DLL enable DLL reset
OCD default
DLL reset
2.2.2 Programming the Mode Register and Extended Mode Registers
For application flexibility, burst length, burst type, CAS latency, DLL reset function, write recovery time (WR) are
user defined variables and must be programmed with a Mode Register Set (MRS) command. Additionally, DLL
disable function, additive CAS latency, driver impedance, ODT (On Die Termination), single-ended strobe and
OCD (off chip driver impedance adjustment) are also user defined variables and must be programmed with an
Extended Mode Register Set (EMRS) command. Contents of the Mode Register (MRS) and Extended Mode Reg-
isters (EMRS(#)) can be altered by re-executing the MRS and EMRS Commands. If the user chooses to modify
only a subset of the MRS or EMRS variables, all variables must be redefined when the MRS or EMRS commands
are issued. Also any programming of EMRS(2) or EMRS(3) must be followed by programming of MRS and
EMRS(1). After initial power up, all MRS and EMRS Commands must be issued before read or write cycles may
begin. All banks must be in a precharged state and CKE must be high at least one cycles before the Mode Regis-
ter Set Command can be issued. Either MRS or EMRS Commands are activated by the low signals of CS, RAS,
CAS and WE at the positive edge of the clock. When both bank addresses BA0 and BA1 are low, the DDR2
SDRAM enables the MRS command. When the bank addresses BA0 is high and BA1 low, the DDR2 SDRAM
enables the EMRS(1) command. The address input data during this cycle defines the parameters to be set as
shown in the MRS and EMRS table. A new command may be issued after the mode register set command cycle
time (tMRD). MRS, EMRS and DLL Reset do not affect array contents, which means re-initialization including
those can be executed any time after power-up without affecting array contents.
2.2.3 DDR2 SDRAM Mode Register Set (MRS)
The mode register stores the data for controlling the various operating modes of DDR2 SDRAM. It programs CAS
latency, burst length, burst sequence, test mode, DLL reset, WR (write recovery) and various vendor specific
options to make DDR2 SDRAM useful for various applications. The default value of the mode register is not
defined, therefore the mode register must be written after power-up for proper operation. The mode register is
written by asserting low on CS, RAS, CAS, WE, BA0 and BA1, while controlling the state of address pins A0 ~
A13. The DDR2 SDRAM should be in all bank precharge (idle) mode with CKE already high prior to writing into
the mode register. The mode register set command cycle time (t
MRD
) is required to complete the write operation
to the mode register. The mode register contents can be changed using the same command and clock cycle
requirements during normal operation as long as all banks are in the precharge state. The mode register is divided
into various fields depending on functionality. Burst length is defined by A0 ~ A2 with options of 4 and 8 bit burst
length. Burst address sequence type is defined by A3 and CAS latency is defined by A4 ~ A6. A7 is used for test
mode and must be set to low for normal MRS operation. A8 is used for DLL reset. A9 ~ A11 are used for write
recovery time (WR) definition for Auto-Precharge mode. With address bit A12 two Power-Down modes can be
selected, a “standard mode” and a “low-power” Power-Down mode, where the DLL is disabled. Address bit A13
and all “higher” address bits (including BA2) have to be set to “low” for compatibility with other DDR2 memory
products with higher memory densities.
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256Mb DDR2 SDRAM
MRS Mode Register Operation Table (Address Input For Mode Set)
A13~
A15
BA2
BA1 BA0
A12 A11 A10 A9
Address Field
A8 A7 A6 A5 A4 A3 A2 A1 A0
0* PD
0*
0*
0*
WR
DLL TM
Mode
Register
CAS Latency
BT
Burst Length
Burst Type
Sequential
Interleave
A7
Mode
Normal
Test
A8
DLL Reset
No
A2 A1 A0 Burst Length
0
1
0
1
0
0
1
1
0
1
4
8
0
1
Yes
A6
0
A5
0
A4
0
Latency
Reserved
Reserved
2 (optional) ***)
3
A11 A10 A9
WR **)
Active Power-Down
Mode Select
A12
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Reserved
0
0
1
2
0
1
Fast exit (use tXARD)
Slow exit (use tXARDS)
0
1
0
3
0
1
1
4
1
0
0
4
5
1
0
1
5
6
1
1
0
Reserved
Reserved
Reserved
Reserved
BA1
BA0 MRS mode
1
1
1
0
0
0
1
MRS
EMRS(1)
EMRS(2):
Reserved
1
1
0
1
EMRS(3):
Reserved
*) Must be programmed to 0 when setting the mode register. A13 ~ A15 and BA2 are reserved for future use
and must be programmed to 0 when setting the mode register MRS
**) The programmability of WR (Write Recovery) is for Writes with Auto-Precharge only and defines the time
when the device starts precharge internally. WR must be programmed to fulfill the minimum retirement for
the analogue tWR timing.
***) CAS Latency = 2 is implemented in this design, but functionality is not tested and guaranteed.
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INFINEON Technologies
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256Mb DDR2 SDRAM
2.2.4 DDR2 SDRAM Extended Mode Register Set (EMRS(1))
The extended mode register EMRS(1) stores the data for enabling or disabling the DLL, output driver strength,
additive latency, OCD program, ODT, DQS and output buffers disable, RQDS and RDQS enable. The default
value of the extended mode register EMRS(1) is not defined, therefore the extended mode register must be writ-
ten after power-up for proper operation. The extended mode register is written by asserting low on CS, RAS, CAS,
WE, BA1 and high on BA0, while controlling the state of the address pins. The DDR2 SDRAM should be in all
bank precharge with CKE already high prior to writing into the extended mode register. The mode register set
command cycle time (tMRD) must be satisfied to complete the write operation to the EMRS(1). Mode register con-
tents can be changed using the same command and clock cycle requirements during normal operation as long as
all banks are in precharge state.
EMRS(1) Extended Mode Register Operation Table (Address Input For Mode Set)
A13~A15
A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
Address Field
BA2 BA1
0* 0*
A12 A11
Qoff
BA0
1
Extended Mode
Register
OCD program
Rtt
Additive latency
D.I.C DLL
Rtt
RDQS DQS
0*
A 6 A2 R tt (nom .)
0
0
1
0
O D T disabled
75 ohm
A 11
RDQ S,(RQ DS) Enable
D isable
0
0
1
A0
0
D LL E nable
Enable
1
1
150 ohm
E nable
Reserved
1
1
D isable
a)
Qoff
A12
O utput buffers enabled
0
1
O utput buffers disabled
DQ S,(RD Q S) Disable
Enable
A5
0
A 4 A 3
AdditiveLatency
A 10
a) Disables DQ, DQS, DQS, RDQS, RDQS
0
1
0
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
D isable
0
1
M R S m ode
M R S
BA 1 B A0
0
2
0
0
1
0
1
0
0
3
E M R S(1)
1
4
EMRS(2)
EMRS(3)
1
R eserved
R eserved
R eserved
1
1
1
1
A 9
A8
0
A 7
0
O C D C alibration Program
0
0
0
1
1
OCD Cal. Mode Exit, maintain setting
O utput D river
Im pedence C ontrol
D river
S ize
A 1
0
1
D rive (1)
D rive (0)
0
1
N orm al
100%
60%
1
0
a)
W eak
0
0
Adjust m ode
b)
1
OCD Calibration default
1
a) When Adjust mode is issued, AL from previously set value must be applied
b) After setting to default, OCD mode needs to be exited by setting A9~A7 to 000.
Refer to the following 2.2.2.5 section for detailed information.
*) must be programmed to 0 for compatibility with future DDR2 memory products.
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256Mb DDR2 SDRAM
A0 is used for DLL enable or disable. A1 is used for enabling half-strength data-output driver. A2 and A6 enables
ODT (On-Die termination) and sets the Rtt value. A3~A5 are used for additive latency settings and A7 ~ A9
enables the OCD impedance adjustment mode. A10 enables or disables the differential DQS and RDQS signals,
A11 disables or enables RDQS. Address bit A12 have to be set to “low” for normal operation. With A12 set to
“high” the SDRAM outputs are disabled and in Hi-Z. “High” on BA0 and “low” for BA1 have to be set to access the
EMRS(1). A13 and all “higher” address bits (including BA2) have to be set to “low” for compatibility with other
DDR2 memory products with higher memory densities. Refer to the table for specific codes on the previous page.
Single-ended and Differential Data Strobe Signals
The following table lists all possible combinations for DQS, DQS, RDQS, RQDS which can be programmed by
A10 & A11 address bits in EMRS(1). RDQS and RDQS are available in x8 components only. If RDQS is enabled
in x8 components, the DM function is disabled. RDQS is active for reads and don’t care for writes:
EMRS(1)
Strobe Function Matrix
Signaling
A10
A11
RDQS/DM
RDQS
DQS
DQS
(DQS Enable)
0 (Enable)
1 (Disable)
0 (Enable)
1 (Disable)
(RDQS Enable)
0 (Disable)
0 (Disable)
1 (Enable)
1 (Enable)
DM
DM
Hi-Z
Hi-Z
DQS
DQS
DQS
DQS
DQS
Hi-Z
DQS
Hi-Z
differential DQS signals
single-ended DQS signals
differential DQS signals
single-ended DQS signals
RDQS
RDQS
RDQS
Hi-Z
DLL Enable/Disable
The DLL must be enabled for normal operation. DLL enable is required during power up initialization, and upon
returning to normal operation after having the DLL disabled. The DLL is automatically disabled when entering
Self-Refresh operation and is automatically re-enabled and reset upon exit of Self-Refresh operation. Any time the
DLL is reset, 200 clock cycles must occur before a Read command can be issued to allow time for the internal
clock to be synchronized with the external clock. Less clock cycles may result in a violation of the tAC or tDQSCK
parameters.
Output Disable (Qoff)
Under normal operation, the DRAM outputs are enabled during Read operation for driving data (Qoff bit in the
EMRS(1) is set to 0). When the Qoff bit is set to 1, the DRAM outputs will be disabled. Disabling the DRAM out-
puts allows users to measure IDD currents during Read operations, without including the output buffer current.
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INFINEON Technologies
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256Mb DDR2 SDRAM
2.2.5 EMRS(2) Extended Mode Register
The Extended Mode Registers EMRS(2) and EMRS(3) are reserved for future use and must be programmed
when setting the mode register during initialization.
The extended mode register EMRS(2) is written by asserting low on CS, RAS, CAS, WE, BA2, BA0 and high on
BA1, while controlling the state of the address pins. The DDR2 SDRAM should be in all bank precharge with CKE
already high prior to writing into the extended mode register. The mode register set command cycle time (tMRD)
must be satisfied to complete the write operation to the EMRS(2). Mode register contents can be changed using
the same command and clock cycle requirements during normal operation as long as all banks are in precharge
state
A13~A15
A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
Address Field
BA2 BA1
A12 A11
BA0
0
Extended Mode
Register(2)
0*
1
0*
*) must be programmed to "0"
EMRS(2)
2.2.6 EMRS(3) Extended Mode Register
The Extended Mode Register EMRS(3) is reserved for future use and all bits except BA0 and BA1 must be pro-
grammed to 0 when setting the mode register during initialization
.
A13~A15
Address Field
BA2 BA1
A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
0*
BA0
1
Extended Mode
Register(3)
0*
1
*) must be programmed to "0"
Page 19
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INFINEON Technologies
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256Mb DDR2 SDRAM
2.3 Off-Chip Driver (OCD) Impedance Adjustment
DDR2 SDRAM supports driver calibration feature and the flow chart below is an example of the sequence. Every
calibration mode command should be followed by “OCD calibration mode exit” before any other command being
issued. MRS should be set before entering OCD impedance adjustment and ODT (On Die Termination) should be
carefully controlled depending on system environment.
MRS should
be set before entering OCD impedance adjustment and ODT should
be carefully controlled depending on system environment
Start
EMRS: OCD calibration mode exit
EMRS: Drive (1)
EMRS: Drive(0)
DQ & DQS High; DQSLow
DQ & DQS Low; DQSHigh
ALL OK
ALL OK
Test
Test
Need Calibration
Need Calibration
EMRS: OCD calibration mode exit
EMRS: OCD calibration mode exit
EMRS :
EMRS :
Enter Adjus t Mode
Enter Adjust Mode
BL=4 code inpu t to all DQs
Inc, Dec, or NOP
BL=4 code input to all DQs
Inc, Dec, or NOP
EMRS: OCD calibration mode exit
EMRS: OCD calibration mode exit
EMRS: OCD calibration mode exit
End
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INFINEON Technologies
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256Mb DDR2 SDRAM
Extended Mode Register Set for OCD impedance adjustment
OCD impedance adjustment can be done using the following EMRS(1) mode. In drive mode all outputs are driven
out by DDR2 SDRAM and drive of RDQS is dependent on EMRS(1) bit enabling RDQS operation. In Drive(1)
mode, all DQ, DQS (and RDQS) signals are driven high and all DQS (and RDQS) signals are driven low. In
Drive(0) mode, all DQ, DQS (and RDQS) signals are driven low and all DQS (and RDQS) signals are driven
high. In adjust mode, BL = 4 of operation code data must be used. In case of OCD calibration default, output driver
characteristics have a nominal impedance value of 18 Ohms during nominal temperature and voltage conditions.
Output driver characteristics for OCD calibration default are specified in the following table. OCD applies only to
normal full strength output drive setting defined by EMRS(1) and if half strength is set, OCD default driver charac-
teristics are not applicable. When OCD calibration adjust mode is used, OCD default output driver characteristics
are not applicable. After OCD calibration is completed or driver strength is set to default, subsequent EMRS(1)
commands not intended to adjust OCD characteristics must specify A7~A9 as’000’ in order to maintain the default
or calibrated value.
Off- Chip-Driver program
Operation
OCD calibration mode exit
A9
0
A8
0
A7
0
Drive(1) DQ, DQS, (RDQS) high and DQS, (RDQS) low
Drive(0) DQ, DQS, (RDQS) low and DQS, (RDQS) high
Adjust mode
0
1
0
1
0
0
1
1
1
0
0
1
OCD calibration default
OCD impedance adjust
To adjust output driver impedance, controllers must issue the ADJUST EMRS(1) command along with a 4 bit
burst code to DDR2 SDRAM as in the following table. For this operation, Burst Length has to be set to BL = 4 via
MRS command before activating OCD and controllers must drive the burst code to all DQs at the same time. DT0
in the table means all DQ bits at bit time 0, DT1 at bit time 1, and so forth. The driver output impedance is adjusted
for all DDR2 SDRAM DQs simultaneously and after OCD calibration, all DQs of a given DDR2 SDRAM will be
adjusted to the same driver strength setting. The maximum step count for adjustment is 16 and when the limit is
reached, further increment or decrement code has no effect. The default setting may be any step within the maxi-
mum step count range. When Adjust mode command is issued, AL from previously set value must be applied.
Off- Chip-Driver Adjust Program
Operation
Pull-down driver strength
4 bit burst code inputs to all DQs
D
D
D
D
T3
Pull-up driver strength
NOP (no operation)
Increase by 1 step
Decrease by 1 step
NOP
T0
T1
T2
NOP (no operation)
NOP
0
0
1
0
0
0
1
0
1
0
0
0
0
1
0
0
1
1
0
0
0
1
0
1
1
0
0
0
1
0
0
0
1
0
1
0
NOP
Increase by 1 step
Decrease by 1 step
Increase by 1 step
Increase by 1 step
Decrease by 1 step
Decrease by 1 step
Reserved
NOP
Increase by 1 step
Decrease by 1 step
Increase by 1 step
Decrease by 1 step
Reserved
Other Combinations
Page 21
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INFINEON Technologies
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256Mb DDR2 SDRAM
For proper operation of adjust mode, WL = RL - 1 = AL + CL -1 clocks and tDS / tDH should be met as the follow-
ing timing diagram. Input data pattern for adjustment, DT0 - DT3 is fixed and not affected by MRS addressing
mode (i.e. sequential or interleave). Burst length of 4 have to be programmed in the MRS for OCD impedance
adjustment.
CK, C K
CM D
N O P
N O P
N O P
EM R S(1)
N O P
N O P
N O P
N O P
EM R S(1)
WL
tW R
D QS
DQ S_in
tDS
tDH
DQ _in
DM
DT2 DT3
DT0 DT1
OCD calibration
mode exit
OCD adjust mode
Drive Mode
Drive mode, both Drive(1) and Drive(0), is used for controllers to measure DDR2 SDRAM Driver impedance
before OCD impedance adjustment. In this mode, all outputs are driven out tOIT after “enter drive mode” com-
mand and all output drivers are turned-off tOIT after “OCD calibration mode exit” command as the following timing
diagram.
CK, CK
CM D
N O P
N O P
E M R S (1)
N O P
E M R S (1)
N O P
N O P
N O P
tOIT
tOIT
DQ S_in
DQ _in
DQS high & DQS low for Drive(1), DQS low & DQS high for Drive 0
DQS high for Drive(1)
DQS high for Drive(0)
OCD calibration
mode exit
Enter Drive Mode
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INFINEON Technologies
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256Mb DDR2 SDRAM
2.4 On-Die Termination (ODT)
ODT (On-Die Termination) is a new feature on DDR2 components that allows a DRAM to turn on/off termination
resistance for each DQ, DQS, DQS and DM for x4 and DQ, DQ’s DM, RDQS (DM and RDQS share the same
pin), and RDQS for x8 configuration via the ODT control pin, where DQS is terminated only when enabled in the
EMRS(1) by address bit A10 = 0. For x8 configuration RDQS is only terminated, when enabled in the EMRS(1) by
address bits A10 = 0 and A11 = 1.
For x16 configuration ODT is applied to each UDQ, LDQ, UDQS, UDQS, LDQS, LDQS, UDM and LDM signal via
the ODT control pin, where UDQS and LDQS are terminated only when enabled in the EMRS(1) by address bit
A10 = 0.
The ODT feature is designed to improve signal integrity of the memory channel by allowing the DRAM controller to
independently turn on/off termination resistance for any or all DRAM devices.
The ODT function can be used for all active and standby modes. ODT is turned off and not supported in Self-
Refresh mode.
Functional Representation of ODT
VDDQ
VDDQ
sw2
sw1
Rval2
Rval1
DRAM
Input
Input
Pin
Buffer
Rval2
sw2
Rval1
sw1
VSSQ
VSSQ
Switch sw1 or sw2 is enabled by the ODT pin. Selection between sw1 or sw2 is determined by “Rtt (nominal)” in
EMRS(1) address bits A6 & A2. Target Rtt = 0.5 * Rval1 or 0.5 * Rval2.
The ODT pin will be ignored if the Extended Mode Register (EMRS(1)) is programmed to disable ODT.
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256Mb DDR2 SDRAM
ODT Truth Tables
The ODT Truth Table shows which of the input pins are terminated depending on the state of address bit A10 and
A11 in the EMRS(1) for all three device organisations (x4, x8 and x16). To activate termination of any of these
pins, the ODT function has to be enabled in the EMRS(1) by address bits A6 and A2.
EMRS(1)
EMRS(1)
Input Pin
Address Bit A10 Address Bit A11
x4 components:
DQ0~DQ3
DQS
X
X
0
X
X
X
X
DQS
DM
X
x8 components:
DQ0~DQ7
DQS
X
X
0
X
X
X
1
1
0
DQS
RDQS
RDQS
DM
X
0
X
x16 components:
LDQ0~LDQ7
UDQ0~UDQ7
LDQS
X
X
X
0
X
X
X
X
X
X
X
X
LDQS
UDQS
UDQS
LDM
X
0
X
X
UDM
X = don’t care; 0 = bit set to low; 1 = bit set to high
ODT timing modes
Depending on the operating mode synchronous or asynchronous ODT timings apply. Synchronous timings
(tAOND, tAOFD, tAON and tAOF) apply for all modes, when the on-die DLL is not disabled.
These modes are:
Active Mode
Standby Mode
Fast Exit Active Power Down Mode (with MRS bit A12 is set to “0”)
Asynchronous ODT timings (tAOFPD, tAONPD) apply when the on-die DLL is disabled.
These modes are:
Slow Exit Active Power Down Mode (with MRS bit A12 is set to “1”)
Precharge Power Down Mode
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INFINEON Technologies
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256Mb DDR2 SDRAM
ODT Timing for Active and Standby (Idle) Modes
(Synchronous ODT timings)
T8
T5
T7
T1
T3
T4
T6
T0
T2
CK, CK
see note 1
C KE
O DT
tIS
tIS
tAOND (2 tck)
tAOFD (2.5 tck)
Rtt
DQ
tAON(min)
tAOF(min)
tAOF(max)
tAON(max)
ODT01
1) Synchronous ODT timings apply for Active Mode and Standby Mode with CKE “high” and for the “Fast Exit” Active Power Down
Mode (MRS bit A12 set to “0”). In all these modes the on-die DLL is enabled.
2) ODT turn-on time (t
) is when the device leaves high impedance and ODT resistance begins to turn on. ODT turn on
AON,min
) is when the ODT resistance is fully on. Both are measured from t
time max. (t
AON,max
AOND.
3) ODT turn off time min. (t
) is when the device starts to turn off the ODT resistance.ODT turn off time max. (t
) is
AOF,max
AOF,min
when the bus is in high impedance. Both are measured from t
AOFD.
ODT Timing for Precharge Power-Down and Active Power-Down Mode (with slow exit)
(Asynchronous ODT timings)
T8
T5
T7
T1
T3
T4
T6
T0
T2
C K, CK
CKE
"low"
tIS
O DT
DQ
tIS
tAOFPD,min
tAOFPD,max
Rtt
tAONPD,min
tAONPD,max
ODT02
1) Asynchronous ODT timings apply for Precharge Power-Down Mode and “Slow Exit” Active Power Down Mode (MRS bit A12 set to
“1”), where the on-die DLL is disabled in this mode of operation.
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INFINEON Technologies
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256Mb DDR2 SDRAM
ODT timing mode switch
When entering the Power Down Modes “Slow Exit” Active Power Down and Precharge Power Down two addi-
tional timing parameters (tANPD and tAXPD) define if synchronous or asynchronous ODT timings have to be
applied.
Mode entry:
As long as the timing parameter tANPDmin is satisfied when ODT is turned on or off before entering these power-
down modes, synchronous timing parameters can be applied. If tANPDmin is not satisfied, asynchronous timing
parameters apply
T1
T-3
T-1
T-5
T-4
T-2
T0
T2
C K, C K
C KE
tANPD (3 tck)
tIS
ODT turn-off, tANPD >= 3 tck :
tIS
O D T
Synchronous
timings apply
RTT
tAOFD
ODT turn-off, tANPD <3 tck :
O D T
Asynchronous
timings apply
RTT
tAOFPDmax
ODT turn-on, tANPD >= 3 tck :
tIS
tAOND
O D T
Synchronous
timings apply
RTT
tIS
ODT turn-on, tANPD < 3 tck :
tAONPDmax
Asynchronous
timings apply
O D T
RTT
ODT03
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INFINEON Technologies
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256Mb DDR2 SDRAM
Mode exit:
As long as the timing parameter tAXPDmin is satisfied when ODT is turned on or off after exiting these power-
down modes, synchronous timing parameters can be applied. If tAXPDmin is not satisfied, asynchronous timing
parameters apply
T8
T1
T5
T7
T6
T0
T9
T10
CK,
CK
t
IS
tAXPD
CKE
t
ODT turn-off, tAXPD >= tAXPDmin:
IS
ODT
Synchronous
timings apply
Rtt
tAOFD
ODT turn-off, tAXPD < tAXPDmin:
t
IS
ODT
Asynchronous
timings apply
Rtt
tAOFPDmax
ODT turn-on, tAXPD >= tAXPDmin:
t
Synchronous
timings apply
IS
ODT
Rtt
tAOND
t
IS
ODT turn-on, tAXPD < tAXPDmin:
ODT
Asynchronous
timings apply
Rtt
tAONPDmax
ODT04
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INFINEON Technologies
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256Mb DDR2 SDRAM
2.5 Bank Activate Command
The Bank Activate command is issued by holding CAS and WE high with CS and RAS low at the rising edge of the
clock. The bank addresses BA0 and BA1 are used to select the desired bank. The row addresses A0 through A12
are used to determine which row to activate in the selected bank for x4 and x8 organised components. For x16
components row addresses A0 through A12 have to be applied. The Bank Activate command must be applied
before any Read or Write operation can be executed. Immediately after the bank active command, the DDR2
SDRAM can accept a read or write command (with or without Auto-Precharge) on the following clock cycle. If a
R/W command is issued to a bank that has not satisfied the tRCDmin specification, then additive latency must be
programmed into the device to delay the R/W command which is internally issued to the device. The additive
latency value must be chosen to assure tRCDmin is satisfied. Additive latencies of 0, 1, 2, 3 and 4 are supported.
Once a bank has been activated it must be precharged before another Bank Activate command can be applied to
the same bank. The bank active and precharge times are defined as tRAS and tRP, respectively. The minimum
time interval between successive Bank Activate commands to the same bank is determined (tRC). The minimum
time interval between Bank Active commands, to any other bank, is the Bank A to Bank B delay time (tRRD).
Bank Activate Command Cycle: tRCD = 3, AL = 2, tRP = 3, tRRD = 2
T0
T1
T2
T3
T4
Tn
Tn+1
Tn+2
Tn+3
CK, CK
Internal RAS-CAS delay tRCDmin.
Bank A
Col. Addr.
Bank B
Col. Addr.
Bank B
Addr.
Bank A
Row Addr.
Bank A
Row Addr.
Bank B
Row Addr.
Bank A
Addr.
NOP
Address
Bank A to Bank B delay tRRD.
additive latency AL=2
Read A
Begins
Posted CAS
Read A
Posted CAS
Read B
Bank A
Activate
Bank B
Activate
Bank A
Precharge
Bank B
Precharge
Bank A
Activate
NOP
Command
tRP Row Precharge Time (Bank A)
tRAS Row Active Time (Bank A)
tCCD
tRC Row Cycle Time (Bank A)
ACT
Page 28
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INFINEON Technologies
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256Mb DDR2 SDRAM
2.6 Read and Write Commands and Access Modes
After a bank has been activated, a read or write cycle can be executed. This is accomplished by setting RAS high,
CS and CAS low at the clock’s rising edge. WE must also be defined at this time to determine whether the access
cycle is a read operation (WE high) or a write operation (WE low). The DDR2 SDRAM provides a wide variety of
fast access modes. A single Read or Write Command will initiate a serial read or write operation on successive
clock cycles at data rates of up to 667Mb/sec/pin for main memory. The boundary of the burst cycle is restricted to
specific segments of the page length.
For example, the 16Mbit x 4 I/O x 4 Bank chip has a page length of 2048 bits (defined by CA0-CA9 & CA11).
In case of a 4-bit burst operation (burst length = 4) the page length of 2048 is divided into 512 uniquely address-
able segments (4-bits x 4 I/O each). The 4-bit burst operation will occur entirely within one of the 512 segments
(defined by CA0-CA8) beginning with the column address supplied to the device during the Read or Write Com-
mand (CA0-CA9 & A11). The second, third and fourth access will also occur within this segment, however, the
burst order is a function of the starting address, and the burst sequence.
In case of a 8-bit burst operation (burst length = 8) the page length of 2048 is divided into 256 uniquely address-
able double segments (8-bits x 4 I/O each). The 8-bit burst operation will occur entirely within one of the 256 dou-
ble segments (defined by CA0-CA7) beginning with the column address supplied to the device during the Read or
Write Command (CA0-CA9 & CA11).
A new burst access must not interrupt the previous 4 bit burst operation in case of BL = 4 setting. Therefore the
minimum CAS to CAS delay (tCCD) is a minimum of 2 clocks for read or write cycles.
For 8 bit burst operation (BL = 8) the minimum CAS to CAS delay (tCCD) is 4 clocks for read or write cycles.
Burst interruption is allowed with 8 bit burst operation. For details see the “Burst Interrupt” - Section of this
datasheet.
Example:
Read Burst Timing Example: (CL = 3, AL = 0, RL = 3, BL = 4)
T0
T1
T2
T3
T4
T5
T6
T7
T12
CK, CK
CM D
N O P
tCCD
N O P
N O P
N O P
N O P
R E A D
B
N O P
R E A D
C
R E A D A
N O P
tCCD
DQ S,
DQ S
Dout A0 Dout A1
Dout A2 Dout A3 Dout B0 Dout B1
Dout B2 Dout B3 Dout C0 Dout C1
Dout C2 Dout C3
DQ
RB
Page 29
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INFINEON Technologies
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256Mb DDR2 SDRAM
2.6.1 Posted CAS
Posted CAS operation is supported to make command and data bus efficient for sustainable bandwidths in DDR2
SDRAM. In this operation, the DDR2 SDRAM allows a Read or Write command to be issued immediately after the
RAS bank activate command (or any time during the RAS to CAS delay time, tRCD, period). The command is
held for the time of the Additive Latency (AL) before it is issued inside the device. The Read Latency (RL) is the
sum of AL and the CAS latency (CL). Therefore if a user chooses to issue a Read/Write command before the
tRCDmin, then AL greater than 0 must be written into the EMRS(1). The Write Latency (WL) is always defined as
RL - 1 (Read Latency -1) where Read Latency is defined as the sum of Additive Latency plus CAS latency
(RL=AL+CL). If a user chooses to issue a Read command after the tRCDmin period, the Read Latency is also
defined as RL = AL + CL.
Examples:
Read followed by a write to the same bank, Activate to Read delay < tRCDmin:
AL = 2 and CL = 3, RL = (AL + CL) = 5, WL = (RL -1) = 4, BL = 4
1
0
2
3
4
5
6
7
8
9
10
11
CK, CK
CMD
WL = RL -1 = 4
Activate
Read
Write
Bank A Bank A
Bank A
CL = 3
AL = 2
DQS,
DQS
tRCD
RL = AL + CL = 5
DQ
Dout0 Dout1 Dout2 Dout3
Din0
Din1 Din2 Din3
PostCAS1
Read followed by a write to the same bank, Activate to Read delay < tRCDmin:
AL = 2 and CL = 3, RL = (AL + CL) = 5, WL = (RL -1) = 4, BL = 8
1
0
2
3
4
5
6
7
8
9
10
11
12
CK, CK
CMD
WL = RL -1 = 4
Write
Bank A
Activate
Read
Bank A Bank A
AL = 2
CL = 3
DQS,
DQS
tRCD
RL = AL + CL = 5
DQ
Dout0 Dout1 Dout2 Dout3 Dout4 Dout5 Dout6 Dout7
Din0
Din1 Din2 D
PostCAS3
Page 30
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INFINEON Technologies
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256Mb DDR2 SDRAM
Read followed by a write to the same bank, Activate to Read delay = tRCDmin:
AL = 0, CL = 3, RL = (AL + CL) = 3, WL = (RL -1) = 2, BL = 4
1
0
2
3
4
5
6
7
8
9
10
11
CK, CK
CMD
AL = 0
Activate
Bank A
Read
Write
Bank A
Bank A
WL = RL -1 = 2
CL = 3
DQS,
DQS
tRCD
RL = AL + CL = 3
DQ
Dout0 Dout1 Dout2 Dout3
Din0
Din1 Din2 Din3
PostCAS2
Read followed by a write to the same bank, Activate to Read delay > tRCDmin:
AL = 1, CL = 3, RL = 4, WL = 3, BL = 4
1
0
2
3
4
5
6
7
8
9
10
11 12
13
CK, CK
CMD
WL = 3
Write
Activate
Bank A
Read
Bank A
Bank A
tRCD > tRCDmin.
DQS,
DQS
RL = 4
DQ
Dout0 Dout1 Dout2 Dout3
Din0
Din1 Din2 Din3
PostCAS5
Page 31
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INFINEON Technologies
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256Mb DDR2 SDRAM
2.6.2 Burst Mode Operation
Burst mode operation is used to provide a constant flow of data to memory locations (write cycle), or from memory
locations (read cycle). The parameters that define how the burst mode will operate are burst sequence and burst
length. The DDR2 SDRAM supports 4 bit and 8 bit burst modes only. For 8 bit burst mode, full interleave address
ordering is supported, however, sequential address ordering is nibble based for ease of implementation. The burst
length is programmable and defined by the addresses A0 ~ A2 of the MRS. The burst type, either sequential or
interleaved, is programmable and defined by the address bit 3 (A3) of the MRS. Seamless burst read or write
operations are supported. Interruption of a burst read or write operation is prohibited, when burst length = 4 is pro-
grammed. For burst interruption of a read or write burst when burst length = 8 is used, see the “Burst Interruption
“section of this datasheet. A Burst Stop command is not supported on DDR2 SDRAM devices.
Burst Length and Sequence
Starting Address
Burst Length
Sequential Addressing (decimal)
Interleave Addressing (decimal)
(A2 A1 A0)
x 0 0
0, 1, 2, 3
0, 1, 2, 3
x 0 1
1, 2, 3, 0
1, 0, 3, 2
4
x 1 0
2, 3, 0, 1
2, 3, 0, 1
x 1 1
3, 0, 1, 2
3, 2, 1, 0
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
0, 1, 2, 3, 4, 5, 6, 7
1, 2, 3, 0, 5, 6, 7, 4
2, 3, 0, 1, 6, 7, 4, 5
3, 0, 1, 2, 7, 4, 5, 6
4, 5, 6, 7, 0, 1, 2, 3
5, 6, 7, 4, 1, 2, 3, 0
6, 7, 4, 5, 2, 3, 0, 1
7, 4, 5, 6, 3, 0, 1, 2
0, 1, 2, 3, 4, 5, 6, 7
1, 0, 3, 2, 5, 4, 7, 6
2, 3, 0, 1, 6, 7, 4, 5
3, 2, 1, 0, 7, 6, 5, 4
4, 5, 6, 7, 0, 1, 2, 3
5, 4, 7, 6, 1, 0, 3, 2
6, 7, 4, 5, 2, 3, 0, 1
7, 6, 5, 4, 3, 2, 1, 0
8
Notes: 1) Page size for all 256Mbit components is 1 kByte
2) Order of burst access for sequential addressing is “nibble-based” and therefore different from SDR
or DDR components
Page 32
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INFINEON Technologies
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256Mb DDR2 SDRAM
2.6.3 Burst Read Command
The Burst Read command is initiated by having CS and CAS low while holding RAS and WE high at the rising
edge of the clock. The address inputs determine the starting column address for the burst. The delay from the
start of the command until the data from the first cell appears on the outputs is equal to the value of the read
latency (RL). The data strobe output (DQS) is driven low one clock cycle before valid data (DQ) is driven onto the
data bus. The first bit of the burst is synchronized with the rising edge of the data strobe (DQS). Each subsequent
data-out appears on the DQ pin in phase with the DQS signal in a source synchronous manner. The RL is equal to
an additive latency (AL) plus CAS latency (CL). The CL is defined by the Mode Register Set (MRS). The AL is
defined by the Extended Mode Register Set (EMRS(1)).
Basic Burst Read Timing
tCH
tCL
tCK
CLK
CLK
CLK, CLK
tDQSCK
DQS
tAC
DQS,
DQS
DQS
tRPST
Dout
t
RPRE
tHZ
tLZ
DQ
Dout
Dout
Dout
tDQSQmax
tDQSQmax
tQH
tQH
DO-Read
Examples:
Burst Read Operation: RL = 5 (AL = 2, CL = 3, BL = 4)
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
P ost C A S
R E A D A
N O P
N O P
N O P
N O P
N O P
N O P
N O P
N O P
<= tD Q S C K
DQ S,
DQ S
AL = 2
CL = 3
RL = 5
DQ
Dout A0 Dout A1
Dout A2 Dout A3
BRead523
Page 33
Rev. 1.02 May 2004
INFINEON Technologies
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256Mb DDR2 SDRAM
Burst Read Operation: RL = 3 (AL = 0, CL = 3, BL = 8)
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
N O P
N O P
N O P
N O P
N O P
N O P
R E A D A
N O P
N O P
CMD
<= tD Q S C K
DQ S,
DQ S
C L =
R L =
3
3
DQ's
Dout A0 Dout A1
Dout A2 Dout A3
Dout A4 Dout A5
Dout A6 Dout A7
BRead303
Burst Read followed by Burst Write: RL = 5, WL = (RL-1) = 4, BL = 4
T0
T1
T3
T4
T5
T6
T7
T8
T9
CK, CK
CM D
P osted C A S
W R ITE A
P osted C A S
R E A D A
N O P
N O P
N O P
N O P
N O P
N O P
N O P
BL/2 + 2
DQ S,
DQ S
WL = RL - 1 = 4
RL = 5
DQ
Dout A0 Dout A1
Dout A2 Dout A3
Din A0
Din A1
Din A2
Din A3
BRBW514
The minimum time from the burst read command to the burst write command is defined by a read-to-write turn-
around time, which is BL/2 + 2 clocks.
Page 34
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INFINEON Technologies
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256Mb DDR2 SDRAM
Seamless Burst Read Operation: RL = 5, AL = 2, CL = 3, BL = 4
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
P ost C A S
R E A D B
P ost C A S
N O P
N O P
N O P
N O P
N O P
N O P
N O P
R E A D
A
DQ S,
DQ S
AL = 2
CL = 3
RL = 5
DQ
Dout A0 Dout A1
Dout A2 Dout A3 Dout B0 Dout B1
Dout B2 Dout B3
SBR523
The seamless burst read operation is supported by enabling a read command at every BL / 2 number of clocks.
This operation is allowed regardless of same or different banks as long as the banks are activated.
Seamless Burst Read Operation: RL = 3, AL = 0, CL = 3, BL = 8 (non interrupting)
T9
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
P ost C A S
R E A D B
P ost C A S
R E A D A
N O
N O P
N O P
N O P
N O P
N O P
N O P
N O P
DQ S,
DQ S
CL = 3
RL = 3
DQ
Dout A0 Dout A1
Dout A2 Dout A3 Dout A4 Dout A5 Dout A4 Dout A7 Dout B0 Dout B1 Dout B2 Dout B3
SBR_BL8
Dou
The seamless, non interrupting 8-bit burst read operation is supported by enabling a read command at every BL /
2 number of clocks. This operation is allowed regardless of same or different banks as long as the banks are acti-
vated.
Page 35
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INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
2.6.4 Burst Write Command
The Burst Write command is initiated by having CS, CAS and WE low while holding RAS high at the rising edge of
the clock. The address inputs determine the starting column address. Write latency (WL) is defined by a read
latency (RL) minus one and is equal to (AL + CL -1). A data strobe signal (DQS) has to be driven low (preamble) a
time tWPRE prior to the WL. The first data bit of the burst cycle must be applied to the DQ pins at the first rising
edge of the DQS following the preamble. The tDQSS specification must be satisfied for write cycles. The subse-
quent burst bit data are issued on successive edges of the DQS until the burst length is completed. When the
burst has finished, any additional data supplied to the DQ pins will be ignored. The DQ signal is ignored after the
burst write operation is complete. The time from the completion of the burst write to bank precharge is named
“write recovery time” (tWR) and is the time needed to store the write data into the memory array. tWR is an analog
timing parameter (see the AC table in this specification) and is not the programmed value for WR in the MRS.
Basic Burst Write Timing
tDQSH tDQSL
DQ S
DQ S,
DQ S
DQ S
t WPST
tWPRE
Din
Din
Din
Din
t DS
tDH
Example:.
Burst Write Operation: RL = 5 (AL = 2, CL = 3), WL = 4, BL = 4
T0
T1
T2
T3
T4
T5
T6
T7
T9
CK, CK
CM D
P ost C A S
W R ITE A
N O P
N O P
N O P
N O P
N O P
N O P
N O P
P recharge
<= tDQSS
Com pletion of
the Burst W rite
DQ S,
DQ S
tW R
WL = RL-1 = 4
DQ
DIN A0
DIN A1 DIN A2 DIN A3
BW543
Page 36
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INFINEON Technologies
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256Mb DDR2 SDRAM
Burst Write Operation: RL = 3 (AL = 0, CL = 3), WL = 2, BL = 4
T0
T1
T2
T3
T4
T5
T6
T7
T9
CK, CK
CM D
B ank A
A ctivate
P ost C A S
W R ITE A
N O P
N O P
N O P
P recharge
N O P
N O P
N O P
Com pletion of
the Burst W rite
<= tDQSS
DQ S,
DQ S
tR P
tW R
WL = RL-1 = 2
DQ
DIN A0
DIN A1 DIN A2 DIN A3
BW322
Burst Write followed by Burst Read: RL = 5 (AL = 2, CL = 3), WL = 4, twitter = 2, BL = 4
T0 T1 T2 T3 T4 T5 T6 T7
T9
T8
CK, CK
W rite to R ead = (C L - 1)+ BL/2 +tW TR (2) = 6
P ost C A S
R E A D A
CM D
N O P
N O P
N O P
N O P
N O P
N O P
N O P
N O P
DQ S,
DQ S
C L=3
AL=2
tW TR
W L = R L - 1 = 4
DQ
DIN A0
DIN A1 DIN A2 DIN A3
R L=5
BWBR
The minimum number of clocks from the burst write command to the burst read command is
(CL - 1) +BL/2 + tWTR
where tWTR is the write-to-read turn-around time tWTR expressed in clock cycles. The tWTR is not a write recov-
ery time (tWR) but the time required to transfer 4 bit write data from the input buffer into sense amplifiers in the
array.
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INFINEON Technologies
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256Mb DDR2 SDRAM
Seamless Burst Write Operation: RL = 5, WL = 4, BL = 4
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
P ost C A S
W R ITE B
P ost C A S
W R ITE A
N O P
N O P
N O P
N O P
N O P
N O P
N O P
DQ S,
DQ S
W L = R L - 1 = 4
DQ
DIN B0
DIN B1 DIN B2 DIN B3
DIN A0
DIN A1 DIN A2 DIN A3
SBR
The seamless burst write operation is supported by enabling a write command every BL / 2 number of clocks. This
operation is allowed regardless of same or different banks as long as the banks are activated.
Seamless Burst Write Operation: RL = 3, WL = 2, BL = 8, non interrupting
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
N O P
N O P
N O P
N O P
W R ITE A
N O P
N O P
N O P
W R ITE B
DQ S,
DQ S
W L = R L - 1 = 2
DQ
DIN B4
DIN B1 DIN B2 DIN B3
DIN B5 DIN
DIN B0
DIN A0
DIN A1 DIN A2 DIN A3
DIN A4
DIN A5 DIN A5 DIN A7
SBW_BL8
The seamless, non interrupting 8-bit burst write operation is supported by enabling a write command at every BL /
2 number of clocks. This operation is allowed regardless of same or different banks as long as the banks are acti-
vated.
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2.6.5 Write Data Mask
One write data mask input (DM) for x4 and x8 components and two write data mask inputs (LDM, UDM) for x16
components are supported on DDR2 SDRAM’s, consistent with the implementation on DDR SDRAM’s. It has
identical timings on write operations as the data bits, and though used in a uni-directional manner, is internally
loaded identically to data bits to insure matched system timing. Data mask is not used during read cycles. If DM is
high during a write burst coincident with the write data, the write data bit is not written to the memory. For x8 com-
ponents the DM function is disabled, when RDQS / RDQS are enabled by EMRS(1).
.
Write Data Mask Timing
tDQSH tDQSL
DQ S
DQ S,
DQ S
DQ S
t WPST
tWPRE
DQ
Din
Din
Din
Din
tDS
tDH
DM
don't care
.
Burst Write Operation with Data Mask: RL = 3 (AL = 0, CL = 3), WL = 2, tWR = 3, BL = 4
T0
T1
T2
T3
T4
T5
T6
T7
T9
CK, CK
CM D
B ank A
A ctivate
N O P
N O P
N O P
W R ITE A
N O P
P recharge
N O P
N O P
<= tDQSS
DQ S,
DQ S
WL = RL-1 = 2
tR P
tW R
DQ
DM
DIN A0
DIN A1 DIN A2 DIN A3
DM
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2.6.6 Burst Interruption
Interruption of a read or write burst is prohibited for burst length of 4 and only allowed for burst length of 8 under
the following conditions:
1. A Read Burst of 8 can only be interrupted by another Read command. Read burst interruption by a Write or Precharge
Command is prohibited.
2. A Write Burst of 8 can only be interrupted by another Write command. Write burst interruption by a Read or Precharge
Command is prohibited.
3. Read burst interrupt must occur exactly two clocks after the previous Read command. Any other Read burst interrupt timings
are prohibited.
4. Write burst interrupt must occur exactly two clocks after the previous Write command. Any other Read burst interrupt timings
are prohibited.
5. Read or Write burst interruption is allowed to any bank inside the DDR2 SDRAM.
6. Read or Write burst with Auto-Precharge enabled is not allowed to be interrupted.
7. Read burst interruption is allowed by a Read with Auto-Precharge command.
8. Write burst interruption is allowed by a Write with Auto-Precharge command.
9. All command timings are referenced to burst length set in the mode register. They are not referenced to the actual burst. For
example, Minimum Read to Precharge timing is AL + BL/2 where BL is the burst length set in the mode register and not the
actual burst (which is shorter because of interrupt). Minimum Write to Precharge timing is WL + BL/ 2 + tWR, where tWR
starts with the rising clock after the un-interrupted burst end and not form the end of the actual burst end.
Examples:
Read Burst Interrupt Timing Example: (CL = 3, AL = 0, RL = 3, BL = 8)
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
N O P
N O P
N O P
N O P
N O P
R E A D
B
N O P
N O P
R E A D A
DQ S,
DQ S
DQ
Dout A0 Dout A1
Dout A2 Dout A3 Dout B0 Dout B1
Dout B2 Dout B3 Dout B4 Dout B5
Dout B6 Dout B
RBI
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Write Burst Interrupt Timing Example: (CL = 3, AL = 0, WL = 2, BL = 8)
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
N O P
N O P
N O P
N O P
W R ITE A
N O P
W R ITE B
N O P
N O P
DQ S,
DQ S
DQ
Din A0
Din A1
Din A2
Din A3
Din B0
Din B1
Din B2
Din B3
Dout B4 Din B5
Din B6
Din B7
WBI
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2.7 Precharge Command
The Precharge Command is used to precharge or close a bank that has been activated. The Precharge
Command is triggered when CS, RAS and WE are low and CAS is high at the rising edge of the clock. The Pre-
charge Command can be used to precharge each bank independently or all banks simultaneously. Three address
bits A10, BA0 and BA1 are used to define which bank to precharge when the command is issued.
Bank Selection for Precharge by Address Bits
Precharge
A10
BA0
BA1
Bank(s)
Bank 0 only
Bank 1 only
Bank 2 only
Bank 3 only
all banks
LOW
LOW
HIGH
HIGH
LOW
LOW
LOW
LOW
HIGH
LOW
HIGH
LOW
HIGH
Don’t Care
Don’t Care
Note: The bank address assignment is the same for activating and precharging a specific bank.
2.7.1 Burst Read Operation Followed by a Precharge
The following rules apply as long as the tRTP timing parameter - Internal Read to Precharge Command delay time
- is less or equal two clocks, which is the case for operating frequencies less or equal 266 Mhz (DDR2 400 and
533 speed sorts):
Minimum Read to Precharge command spacing to the same bank = AL + BL/2 clocks. For the earliest possible
precharge, the Precharge command may be issued on the rising edge which is “Additive Latency (AL) + BL/2
clocks” after a Read Command, as long as the minimum tRAS timing is satisfied.
A new bank active command may be issued to the same bank if the following two conditions are satisfied simulta-
neously:
(1) The RAS precharge time (tRP) has been satisfied from the clock at which the precharge begins.
(2) The RAS cycle time (tRCmin) from the previous bank activation has been satisfied.
For operating frequencies higher than 266 MHz, tRTP becomes > 2 clocks and one additional clock cycle has to
be added for the minimum Read to Precharge command spacing, which now becomes AL + BL/2 + 1 clocks.
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Examples:
Burst Read Operation Followed by Precharge: RL = 4 (AL = 1, CL = 3), BL = 4, tRTP <= 2 clocks
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
B ank A
A ctivate
P ost C A S
R E A D A
N O P
A L + B L/2 clks
N O P
N O P
N O P
P recharge
N O P
N O P
tR P
DQ S,
DQ S
A L = 1
C L = 3
R L = 4
DQ
Dout A0 Dout A1
Dout A2 Dout A3
>=tR A S
C L = 3
>=tR C
>=tR TP
Burst Read Operation Followed by Precharge: RL = 4 (AL = 1, CL = 3), BL = 8, tRTP <= 2 clocks
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
B ank A
A ctivate
P ost C A S
R E A D A
N O P
A L + B L/2 clks
N O P
N O P
N O P
P recharge
N O P
N O P
tR P
DQ S,
DQ S
A L = 1
C L = 3
R L = 4
DQ
Dout A0 Dout A1
Dout A2 Dout A3 Dout A4 Dout A5
Dout A6 Dout A7
>=tR A S
C L = 3
>=tR C
>=tR TP
BR-P413(8)
first 4-bit prefetch
second 4-bit prefetch
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Burst Read Operation Followed by Precharge: RL = 5 (AL = 2, CL = 3), BL = 4, tRTP <= 2 clocks
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
B ank A
A ctivate
P ost C A S
N O P
N O P
tR P
N O P
N O P
N O P
N O P
P recharge
R E A D
A
A L + B L/2 clks
DQ S,
DQ S
C L = 3
A L = 2
R L = 5
DQ
Dout A0 Dout A1
Dout A2 Dout A3
>=tR A S
C L = 3
>=tR C
>=tR TP
BR-P523
Burst Read Operation Followed by Precharge: RL = 6, (AL = 2, CL = 4), BL = 4, tRTP <= 2 clocks
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
B ank A
A ctivate
P recharge
A
P ost C A S
N O P
N O P
N O P
N O P
N O P
N O P
tR P
R E A D
A
A L + B L/2 clocks
DQ S,
DQ S
A L = 2
R L = 6
C L = 4
DQ
Dout A0 Dout A1
Dout A2 Dout A3
>=tR A S
C L = 4
>=tR C
>=tR TP
BR-P624
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Burst Read Operation Followed by Precharge: RL = 4, (AL = 0, CL = 4), BL = 8, tRTP > 2 clocks
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
B ank A
A ctivate
N O P
N O P
N O P
N O P
P recharge
R E A D A
N O P
N O P
tR P
A L + B L/2 clks + 1
DQ S,
DQ S
C L = 4
R L = 4
DQ
Dout A0 Dout A1
Dout A2 Dout A3 Dout A4 Dout A5
Dout A6 Dout A7
>=tR A S
>=tR TP
BR-P404(8)
first 4-bit prefetch
second 4-bit prefetch
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2.7.2 Burst Write followed by Precharge
Minimum Write to Precharge command spacing to the same bank = WL + BL/2 + tWR. For write cycles, a delay
must be satisfied from the completion of the last burst write cycle until the Precharge command can be issued.
This delay is known as a write recovery time (t WR) referenced from the completion of the burst write to the Pre-
charge command. No Precharge command should be issued prior to the tWR delay, as DDR2 SDRAM does not
support any burst interrupt by a Precharge command. tWR is an analog timing parameter (see the AC table in this
datasheet) and is not the programmed value for tWR in the MRS.
Examples:.
Burst Write followed by Precharge: WL = (RL - 1) = 3, BL = 4, tWR = 3
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
P recharge
A
P ost C A S
W R ITE A
N O P
N O P
N O P
N O P
N O P
N O P
N O P
Com pletion of
the Burst W rite
DQ S,
DQ S
tW R
WL = 3
DQ
DIN A0
DIN A1 DIN A2 DIN A3
BW-P3
Burst Write followed by Precharge: WL = (RL - 1) = 4, BL = 4, tWR = 3
T0
T1
T2
T3
T4
T5
T6
T7
T9
CK, CK
CM D
P recharge
A
P ost C A S
W R ITE A
N O P
N O P
N O P
N O P
N O P
N O P
N O P
Com pletion of
the Burst W rite
DQ S,
DQ S
tW R
WL = 4
DQ
DIN A0
DIN A1 DIN A2 DIN A3
BW-P4
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2.8 Auto-Precharge Operation
Before a new row in an active bank can be opened, the active bank must be precharged using either the Pre-
charge Command or the Auto-Precharge function. When a Read or a Write Command is given to the DDR2
SDRAM, the CAS timing accepts one extra address, column address A10, to allow the active bank to automati-
cally begin precharge at the earliest possible moment during the burst read or write cycle. If A10 is low when the
Read or Write Command is issued, then normal Read or Write burst operation is executed and the bank remains
active at the completion of the burst sequence. If A10 is high when the Read or Write Command is issued, then
the Auto-Precharge function is enabled. During Auto-Precharge, a Read Command will execute as normal with
the exception that the active bank will begin to precharge internally on the rising edge which is CAS Latency (CL)
clock cycles before the end of the read burst. Auto-Precharge is also implemented for Write Commands.The pre-
charge operation engaged by the Auto-Precharge command will not begin until the last data of the write burst
sequence is properly stored in the memory array. This feature allows the precharge operation to be partially or
completely hidden during burst read cycles (dependent upon CAS Latency) thus improving system performance
for random data access. The RAS lockout circuit internally delays the precharge operation until the array restore
operation has been completed so that the Auto-Precharge command may be issued with any read or write com-
mand.
2.8.1 Burst Read with Auto-Precharge
If A10 is high when a Read Command is issued, the Read with Auto-Precharge function is engaged. The DDR2
SDRAM starts an Auto-Precharge operation on the rising edge which is (AL + BL/2) cycles later from the Read
with AP command if tRASmin and tRTP are satisfied. If tRASmin is not satisfied at the edge, the start point of
Auto-Precharge operation will be delayed until tRASmin is satisfied. If tRTPmin is not satisfied at the edge, the
start point of Auto-Precharge operation will be delayed until tRTPmin is satisfied.
In case the internal precharge is pushed out by tRTP, tRP starts at the point where the internal precharge happens
(not at the next rising clock edge after this event). So for BL = 4 the minimum time from Read with Auto-Precharge
to the next Activate command becomes AL + tRTP + tRP. For BL = 8 the time from Read with Auto-Precharge to
the next Activate command is AL + 2 + tRTP + tRP. Note that (tRTP + tRP) has to be rounded up to the next inte-
ger value. In any event internal precharge does not start earlier than two clocks after the last 4-bit prefetch.
A new bank active (command) may be issued to the same bank if the following two conditions are satisfied simul-
taneously:
(1) The RAS precharge time (tRP) has been satisfied from the clock at which the Auto-Precharge begins.
(2) The RAS cycle time (tRC) from the previous bank activation has been satisfied.
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Examples:
Burst Read with Auto-Precharge followed by an activation to the Same Bank (tRC Limit)
RL = 5 (AL = 2, CL = 3), BL = 4, tRTP <= 2 clocks
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
B ank
A ctivate
P osted C A S
R E A D w /A P
N O P
N O P
N O P
N O P
N O P
N O P
N O P
A10 ="high"
Auto-Precharge Begins
AL + BL/2
DQ S,
DQ S
AL = 2
CL = 3
tRP
RL = 5
DQ
Dout A0 Dout A1
Dout A2 Dout A3
tRAS
tRCmin.
BR-AP5231
Burst Read with Auto-Precharge followed by an Activation to the Same Bank (tRAS Limit):
RL = 5 (AL = 2, CL = 3), BL = 4, tRTP <= 2 clocks
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
B ank
A ctivate
P osted C A S
R E A D w /A P
N O P
N O P
N O P
N O P
N O P
N O P
N O P
A10 ="high"
Auto-Precharge Begins
tRAS(min)
DQ S,
DQ S
AL = 2
CL = 3
tRP
RL = 5
DQ
Dout A0 Dout A1
Dout A2 Dout A3
tRC
BR-AP5232
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Burst Read with Auto-Precharge followed by an Activation to the Same Bank:
RL = 4 (AL = 1, CL = 3), BL = 8, tRTP <= 2 clocks
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
B ank
A ctivate
P osted C A S
R E A D w /A P
N O P
N O P
N O P
N O P
N O P
N O P
N O P
A10 ="high"
AL + BL/2
tRP
Auto-Precharge Begins
DQ S,
DQ S
AL = 1
CL = 3
RL = 4
DQ
Dout A4 Dout A5
Dout A2 Dout A3
Dout A6 Dout A7
Dout A0 Dout A1
>= tRTP
BR-AP413(8)2
second 4-bit prefetch
first 4-bit prefetch
Burst Read with Auto-Precharge followed by an Activation to the Same Bank:
RL = 4 (AL = 1, CL = 3), BL = 4, tRTP > 2 clocks
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK, CK
CM D
B ank
A ctivate
P osted C A S
R E A D w /A P
N O P
N O P
N O P
N O P
N O P
N O P
N O P
A10 ="high"
AL + tRTP + tRP
Auto-Precharge Begins
DQ S,
DQ S
AL = 1
CL = 3
RL = 4
DQ
Dout A0 Dout A1
Dout A2 Dout A3
tRP
tRTP
BR-AP4133
first 4-bit prefetch
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2.8.2 Burst Write with Auto-Precharge
If A10 is high when a Write Command is issued, the Write with Auto-Precharge function is engaged. The DDR2
SDRAM automatically begins precharge operation after the completion of the write burst plus the write recovery
time delay (WR), programmed in the MRS register, as long as tRAS is satisfied. The bank undergoing Auto-Pre-
charge from the completion of the write burst may be reactivated if the following two conditions are satisfied.
(1) The last data-in to bank activate delay time (tDAL = WR + tRP) has been satisfied.
(2) The RAS cycle time (tRC) from the previous bank activation has been satisfied.
In DDR2 SDRAM’s the write recovery time delay (WR) has to be programmed into the MRS mode register. As
long as the analog twr timing parameter is not violated, WR can be programmed between 2 and 6 clock cycles.
Minimum Write to Activate command spacing to the same bank = WL + BL/2 + tDAL.
Examples:
Burst Write with Auto-Precharge (tRC Limit): WL = 2, tDAL = 6 (WR = 3, tRP = 3), BL = 4
T0
T1
T2
T3
T4
T5
T6
T7
CK, CK
CM D
W R ITE
w /A P
B ank A
A ctivate
N O P
N O P
N O P
N O P
N O P
N O P
N O P
A10 ="high"
Completion of the Burst Write
Auto-Precharge Begins
DQ S,
DQ S
WR
tRP
WL = RL-1 = 2
tDAL
DQ
DIN A0
DIN A1 DIN A2 DIN A3
tRCmin.
>=tRASmin.
BW-AP223
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Burst Write with Auto-Precharge (WR + tRP Limit): WL = 4, tDAL = 6 (WR = 3, tRP = 3), BL = 4
T0
T3
T4
T5
T6
T7
T8
T12
T9
CK, CK
CM D
P osted C A S
W R ITE w /A P
B ank A
A ctivate
N O P
N O P
N O P
N O P
N O P
N O P
N O P
Completion of the Burst Write
A10 ="high"
Auto-Precharge Begins
DQ S,
DQ S
tRP
WR
tDAL
WL = RL-1 = 4
DQ
DIN A0
DIN A1 DIN A2 DIN A3
>=tRC
>=tRAS
BW-AP423
2.8.3 Read or Write to Precharge Command Spacing Summary
The following table summarizes the minimum command delays between Read, Read w/AP, Write, Write w/AP to
the Precharge commands to the same banks and Precharge-All commands.
To Command
Minimum Delay between “From
Command” to “To Command”
From Command
Units Notes
PRECHARGE (to same banks as READ)
PRECHARGE-ALL
AL + BL/2 + max(tRTP, 2) - 2*tck
AL + BL/2 + max(tRTP, 2) - 2*tck
AL + BL/2 + max(tRTP, 2) - 2*tck
AL + BL/2 + max(tRTP, 2) - 2*tck
WL + BL/2 + tWR
WL + BL/2 + tWR
WL + BL/2 + WR
WL + BL/2 + WR
1*tck
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
1, 2
1, 2
1, 2
1, 2
2
READ
PRECHARGE (to same banks as READ w/AP)
PRECHARGE-ALL
READ w/AP
WRITE
PRECHARGE (to same banks as WRITE)
PRECHARGE-ALL
2
PRECHARGE (to same banks as WRITE w/AP)
PRECHARGE-ALL
2
WRITE w/AP
PRECHARGE
PRECHARGE-ALL
2
PRECHARGE (to same banks as PRECHARGE)
PRECHARGE-ALL
2
1*tck
2
PRECHARGE
1*tck
2
PRECHARGE-ALL
1*tck
2
Note 1: RTP[cycles] = RU{tRTP(ns) / tCK(ns)}, where RU stands for round up.
Note 2: For a given bank, the precharge period should be counted from the latest precharge command, either one bank precharge or
precharge-all, issued to that bank. The precharge period is satisfied after tRP or tRPall depending on the latest prechargte com-
mand issued to that bank
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2.8.4 Concurrent Auto-Precharge
DDR2 devices support the “Concurrent Auto-Precharge” feature. A Read with Auto-Precharge enabled, or a Write
with Auto-Precharge enabled, may be followed by any command to the other bank, as long as that command does
not interrupt the read or write data transfer, and all other related limitations (e.g. contention between Read data
and Write data must be avoided externally and on the internal data bus.
The minimum delay from a Read or Write command with Auto-Precharge enabled, to a command to a different
bank, is summarized in the table below. As defined, the WL = RL - 1 for DDR2 devices which allows the command
gap and corresponding data gaps to be minimized.
To Command
(different bank,
non-interrupting command)
Minimum Delay with
Concurrent Auto-Pre-
charge Support
From Command
Units
Note
Read or Read w/AP
Write or Write w/AP
Precharge or Activate
Read or Read w/AP
Write or Write w/AP
Precharge or Activate
(CL -1) + (BL/2) + tWTR
tCK
tCK
tCK
tCK
tCK
tCK
WRITE w/AP
BL/2
1
1)
1)
BL/2
BL/2 + 2
1
Read w/AP
Note:
1) This rule only applies to a selective Precharge command to another banks, a Precharge-All command is
illegal
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2.9 Refresh
DDR2 SDRAM requires a refresh of all rows in any rolling 64 ms interval. The necessary refresh can be generated
in one of two ways: by explicit Auto-Refresh commands or by an internally timed Self-Refresh mode.
2.9.1 Auto-Refresh Command
Auto-Refresh is used during normal operation of the DDR2 SDRAM’s. This command is non persistent, so it must
be issued each time a refresh is required. The refresh addressing is generated by the internal refresh controller.
This makes the address bits”Don’t Care” during an Auto-Refresh command. The DDR2 SDRAM requires Auto-
Refresh cycles at an average periodic interval of tREFI (maximum).
When CS, RAS and CAS are held low and WE high at the rising edge of the clock, the chip enters the Auto-
Refresh mode. All banks of the SDRAM must be precharged and idle for a minimum of the precharge time (tRP
)
before the Auto-Refresh Command can be applied. An internal address counter supplies the addresses during the
refresh cycle. No control of the external address bus is required once this cycle has started.
When the refresh cycle has completed, all banks of the SDRAM will be in the precharged (idle) state. A delay
between the Auto-Refresh Command and the next Activate Command or subsequent Auto-Refresh Command
must be greater than or equal to the Auto-Refresh cycle time (tRFC).
To allow for improved efficiency in scheduling and switching between tasks, some flexibility in the absolute refresh
interval is provided. A maximum of eight Auto-Refresh commands can be posted to any given DDR2 SDRAM,
meaning that the maximum absolute interval between any Auto-Refresh command and the next Auto-Refresh
command is 9 * tREFI.
T0
T1
T2
T3
CK, CK
"high"
CKE
> = t
> = t
> = t
RFC
N O P
RP
RFC
A U T O
R E FR E S H
A U TO
R E FR E S H
CMD
N O P
N O P
A N Y
P recharge
N O P
N O P
AR
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2.9.2 Self-Refresh Command
The Self-Refresh command can be used to retain data, even if the rest of the system is powered down. When in
the Self-Refresh mode, the DDR2 SDRAM retains data without external clocking. The DDR2 SDRAM device has
a built-in timer to accommodate Self-Refresh operation. The Self-Refresh Command is defined by having CS,
RAS, CAS and CKE held low with WE high at the rising edge of the clock. ODT must be turned off before issuing
Self Refresh command, by either driving ODT pin low or using EMRS(1) command. Once the command is regis-
tered, CKE must be held low to keep the device in Self-Refresh mode. The DLL is automatically disabled upon
entering Self Refresh and is automatically enabled upon exiting Self Refresh. When the DDR2 SDRAM has
entered Self-Refresh mode all of the external control signals, except CKE, are “don’t care”. The DRAM initiates a
minimum of one Auto Refresh command internally within tCKE period once it enters Self Refresh mode. The clock
is internally disabled during Self-Refresh Operation to save power. The minimum time that the DDR2 SDRAM
must remain in Self Refresh mode is tCKE. The user may change the external clock frequency or halt the external
clock one clock after Self-Refresh entry is registered, however, the clock must be restarted and stable before the
device can exit Self-Refresh operation.
The procedure for exiting Self Refresh requires a sequence of commands. First, the clock must be stable prior to
CKE going back HIGH. Once Self-Refresh Exit command is registered, a delay of at least tXSNR must be satis-
fied before a valid command can be issued to the device to allow for any internal refresh in progress. CKE must
remain high for the entire Self-Refresh exit period tXSRD for proper operation. Upon exit from Self Refresh, the
DDR2 SDRAM can be put back into Self Refresh mode after tXSNR expires. NOP or deselect commands must be
registered on each positive clock edge during the Self-Refresh exit interval tXSNR. ODT should be turned off dur-
ing tXSRD.
The use of Self Refresh mode introduces the possibility that an internally timed refresh event can be missed when
CKE is raised for exit from Self Refresh mode. Upon exit from Self Refresh, the DDR2 SDRAM requires a mini-
mum of one extra auto refresh command before it is put back into Self Refresh Mode.
T4
T0
T5
Tm
Tr
T1
T2
T3
Tn
CK/CK
CKE
tRP*
tis
tis
>=tXSRD
tCKE
tis
tAOFD
>= tXSNR
ODT
CMD
R ead
C om m and
Self R efresh
Entry
Non-R ead
C om m and
N O P
CK/CK may
be halted
CK/CK must
be stable
* = Device must be in the “All banks idle” state before entering Self Refresh mode.
tXSRD (>=200 tCK) has to be satisfied for a Read or a Read with Auto-Precharge command.
tXSNR has to be satisfied for any command except a Read or a Read with Auto-Precharge command
Since CKE is an SSTL input, VREF must be maintained during Self Refresh.
Page 54
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INFINEON Technologies
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2.10 Power-Down
Power-down is synchronously entered when CKE is registered low, along with NOP or Deselect command. CKE is
not allowed to go low while mode register or extended mode register command time, or read or write operation is
in progress. CKE is allowed to go low while any other operation such as row activation, Precharge, Auto-Pre-
charge or Auto-Refresh is in progress, but power-down IDD specification will not be applied until finishing those
operations.
The DLL should be in a locked state when power-down is entered. Otherwise DLL should be reset after exiting
power-down mode for proper read operation. DRAM design guarantees it’s DLL in a locked state with any CKE
intensive operations as long as DRAM controller complies with DRAM specifications.
If power-down occurs when all banks are precharged, this mode is referred to as Precharge Power-down; if
power-down occurs when there is a row active in any bank, this mode is referred to as Active Power-down. For
Active Power-down two different power saving modes can be selected within the MRS register, address bit A12.
When A12 is set to “low” this mode is referred as “standard active power-down mode” and a fast power-down exit
timing defined by the tXARD timing parameter can be used. When A12 is set to “high” this mode is referred as a
power saving “low power active power-down mode”. This mode takes longer to exit from the power-down mode
and the tXARDS timing parameter has to be satisfied.
Entering power-down deactivates the input and output buffers, excluding CK, CK, ODT and CKE. Also the DLL is
disabled upon entering Precharge Power-down or slow exit active power-down, but the DLL is kept enabled dur-
ing fast exit active power-down. In power-down mode, CKE low and a stable clock signal must be maintained at
the inputs of the DDR2 SDRAM, and all other input signals are “Don’t Care”. Power-down duration is limited by 9
times tREFI of the device.
The power-down state is synchronously exited when CKE is registered high (along with a NOP or Deselect com-
mand). A valid, executable command can be applied with power-down exit latency, tXP, tXARD or tXARDS, after
CKE goes high. Power-down exit latencies are defined in the AC spec table of this data sheet.
Power-Down Entry
Active Power-down mode can be entered after an activate command. Precharge Power-down mode can be
entered after a Precharge, Precharge-All or internal precharge command. It is also allowed to enter power-mode
after an Auto-Refresh command or MRS / EMRS(1) command when tMRD is satisfied.
Active Power-down mode entry is prohibited as long as a Read Burst is in progress, meaning CKE should be kept
high until the burst operation is finished. Therefore Active Power-Down mode entry after a Read or Read with
Auto-Precharge command is allowed after RL + BL/2 is satisfied.
Active Power-down mode entry is prohibited as long as a Write Burst and the internal write recovery is in progress.
In case of a write command, active power-down mode entry is allowed when WL + BL/2 + tWTR is satisfied.
In case of a write command with Auto-Precharge, Power-down mode entry is allowed after the internal precharge
command has been executed, which is WL + BL/2 + WR starting from the write with Auto-Precharge command. In
case the DDR2 SDRAM enters the Precharge Power-down mode.
Page 55
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INFINEON Technologies
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Examples:
Active Power-Down Mode Entry and Exit after an Activate Command
T0
T1
T2
Tn
Tn+1
Tn+2
CK, CK
Valid
C om m and
CM D
CKE
N O P
N O
N O P
A ctivate
NO P
P
tIS
tIS
tXARD or
tXARDS *)
Act.PD 0
Active
Power-Down
Exit
Active
Power-Down
Entry
note: Active Power-Down mode exit timing tXARD (“fast exit”) or tXARDS (“slow exit”) depends on the programmed
state in the MRS, address bit A12.
Active Power-Down Mode Entry and Exit after a Read Command: RL = 4 (AL = 1, CL =3), BL = 4
Tn
Tn+1
T0
T1
T2
T3
T4
T5
T6
T7
Tn+2
C K, C K
Valid
Com m and
R EAD
R EAD w/A P
C M D
CKE
N O P
N
N O P
NO P
N O P
N O P
O P
N O P
N O P
N O P
tIS
RL + BL/2
tIS
D Q S,
D Q S
CL = 3
RL = 4
tXARD or
AL = 1
tXARDS *)
DQ
Dout A0 Dout A1
Dout A2 Dout A3
Active
Power-Down
Entry
Active
Power-Down
Exit
Act.PD 1
note: Active Power-Down mode exit timing tXARD (“fast exit”) or tXARDS (“slow exit”) depends on the programmed
state in the MRS, address bit A12.
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INFINEON Technologies
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256Mb DDR2 SDRAM
Active Power-Down Mode Entry and Exit after a Write Command: WL = 2, tWTR = 2, BL = 4
Tn
Tn+1
T0
T1
T2
T3
T4
T5
T6
T7
Tn+2
C K, CK
Valid
Com m and
C M D
CKE
NO P
N O P
NO P
NO P
P
NO P
W R ITE
NO P
N
NO P
N O P
tIS
WL + BL/2 + tWTR
tIS
D Q S,
D Q S
WL = RL - 1 = 2
tWTR
tXARD or
tXARDS *)
D Q
DIN A0
DIN A1 DIN A2 DIN A3
Active
Active
Power-Down
Exit
Act.PD 2
Power-Down
Entry
note: Active Power-Down mode exit timing tXARD (“fast exit”) or tXARDS (“slow exit”) depends on the programmed
state in the MRS, address bit A12.
Active Power-Down Mode Entry and Exit after a Write Command with AP: WL = 2, tWR = 3, BL = 4
Tn
Tn+1
T0
T1
T2
T3
T4
T5
T6
T7
Tn+2
C K, CK
Valid
C om m and
W R ITE
w /A P
C M D
CKE
N O P
N O P
N O P
N O P
N O P
P
N
N O P
N O P
N O P
WL + BL/2 + WR
tIS
tIS
D Q S,
D Q S
WL = RL - 1 = 2
WR
tXARD or
tXARDS *)
DQ
DIN A0
DIN A1 DIN A2 DIN A3
Active
Active
Act.PD 3
Power-Down
Entry
Power-Down
Exit
note: Active Power-Down mode exit timing tXARD (“fast exit”) or tXARDS (“slow exit”) depends on the programmed
state in the MRS, address bit A12.WR is the programmed value in the MRS mode register.
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INFINEON Technologies
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256Mb DDR2 SDRAM
Precharge Power Down Mode Entry and Exit
T0
T1
T2
T3
Tn
Tn+1
Tn+2
CK, CK
Precharge
*)
Valid
N O P
CM D
C KE
N O P
N O P
N O P
N O
NO P
N O P
C om m and
tIS
tIS
tXP
tRP
Precharge
Power-Down
Entry
Precharge
Power-Down
Exit
*) "Precharge" may be an external command or an internal
precharge following Write with AP.
PrePD
Auto-Refresh command to Power-Down entry
T0
T1
T2
T3
T4
Tn
CK, CK
tRFC
Valid
Command
Auto
CM D
CKE
Refresh
tXP
tis
CKE can go low one clock after an Auto-Refresh command
ARPD
When tRFC expires the DRAM is in Precharge Power-Down Mode
MRS, EMRS command to Power-Down entry
T0
T1
T2
T3
T4
T5
T6
T7
CK, CK
MRS or
EMRS
CM D
C KE
t
MRD
Enters Precharge Power-Down Mode
MRS_PD
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2.11 No Operation Command
2.11.1 No Operation Command (NOP)
The No Operation Command should be used in cases when the SDRAM is in a idle or a wait state. The purpose of
the No Operation Command is to prevent the SDRAM from registering any unwanted commands between opera-
tions. A No Operation Command is registered when CS is low with RAS, CAS, and WE held high at the rising
edge of the clock. A No Operation Command will not terminate a previous operation that is still executing, such as
a burst read or write cycle.
2.11.2 Deselect Command (DESEL)
The Deselect Command performs the same function as a No Operation Command. Deselect Command occurs
when CS is brought high, the RAS, CAS, and WE signals become don’t care.
2.12 Input Clock Frequency Change
During operation the DRAM input clock frequency can be changed under the following conditions:
a) During Self-Refresh operation
b) DRAM is in Precharge Power-down mode and ODT is completely turned off.
The DDR2-SDRAM has to be in Precharged Power-down mode and idle. ODT must be already turned off and
CKE must be at a logic “low” state. After a minimum of two clock cycles after tRP and tAOFD have been satisfied
the input clock frequency can be changed. A stable new clock frequency has to be provided, before CKE can be
changed to a “high” logic level again. After tXP has been satisfied a DLL RESET command via EMRS(1) has to be
issued. During the following DLL re-lock period of 200 clock cycles, ODT must remain off. After the DLL-re-lock
period the DRAM is ready to operate with the new clock frequency.
Example:
Input frequency change during Precharge Power-Down mode
Ty+2
Tz
Ty+3
T0
T1
T2
T3
T4
Tx
Tx+1
Ty
Ty+1
D LL
R ES ET
Valid
C om m and
N O P
N O P
N O P
N O P
NO P
N O P
N O P
N O P
NO P
N O P
tRP
tAOFD
tXP
200 clocks
Minimum 2 clocks
required before
Frequency Change
occurs here
Stable new clock
ODT is off during
DLL RESET
before power-down exit
changing the frequency
Frequ.Ch.
Page 59
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256Mb DDR2 SDRAM
2.13 Asynchronous CKE Low Reset Event
In a given system, Asynchronous Reset event can occur at any time without prior knowledge. In this situation,
memory controller is forced to drop CKE asynchronously low, immediately interrupting any valid operation. DRAM
requires CKE to be maintained “high” for all valid operations as defined in this data sheet. If CKE asynchronously
drops “low” during any valid operation DRAM is not guaranteed to preserve the contents of the memory array. If
this event occurs, the memory controller must satisfy a time delay (t
) before turning off the clocks. Stable
delay
clocks must exist at the input of DRAM before CKE is raised “high” again. The DRAM must be fully re-initialized as
described the initialization sequence (section 2.2.1, step 4 thru 13). DRAM is ready for normal operation after the
initialization sequence. See AC timing parametric table for t
specification.
delay
Asynchronous CKE Low Event
stable clocks
CK, CK
tdelay
CKE
CKE drops low due to an
asynchronous reset event
Clocks can be turned off after
this point
Page 60
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3. Truth Tables
3.1 Command Truth Table
CKE
BA0
BA1
CS RAS CAS WE
Function
A12-A11 A10 A9 - A0 Notes
Previous Current
Cycle
Cycle
(Extended) Mode Register Set
Auto-Refresh
H
H
L
L
L
H
L
L
L
L
L
L
L
L
H
H
L
H
L
L
L
L
L
L
H
H
X
L
BA
X
OP Code
1, 2
1
H
H
X
X
X
X
X
X
X
X
X
X
X
Self-Refresh Entry
Self-Refresh Exit
Single Bank Precharge
Precharge all Banks
Bank Activate
H
L
L
L
X
X
1
L
H
X
L
X
H
H
H
L
X
X
1
H
H
BA
X
L
1,2
1
H
H
L
L
H
H
H
L
H
L
BA
Row Address
1, 2
Write
H
H
H
H
H
H
H
X
X
H
X
H
BA Column
BA Column
BA Column
BA Column
L
H
L
Column 1,2,3
Column 1,2,3
Column 1,2,3
Column 1,2,3
Write with Auto-Precharge
Read
H
H
L
L
H
H
L
H
H
H
X
X
H
X
H
Read with Auto-Precharge
No Operation
H
H
L
H
X
X
H
X
H
X
X
H
X
H
X
X
X
X
X
X
1
1
Device Deselect
H
X
Power Down Entry
Power Down Exit
H
L
L
X
X
X
X
X
X
X
X
1,4
1,4
H
1. All DDR2 SDRAM commands are defined by states of CS, WE, RAS, CAS, and CKE at the rising edge of the clock.
2. Bank addresses (BAx) determine which bank is to be operated upon. For (E)MRS BAx selects an (Extended) Mode
Register.
3. Burst reads or writes at BL = 4 cannot be terminated. See sections “Reads interrupted by a Read” and “Writes inter-
rupted by a Write” in section 2.4.6 for details.
4. The Power Down Mode does not perform any refresh operations. The duration of Power Down is therefore limited by
the refresh requirements outlined in section 2.7.
5. The state of ODT does not affect the states described in this table. The ODT function is not available during Self
Refresh.
6. “X” means “H or L (but a defined logic level)”.
7. Operation that is not specified is illegal and after such an event, in order to guarantee proper operation, the DRAM
must be powered down and then restarted through the specified initialization sequence before normal operation can
continue.
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3.2 Clock Enable (CKE) Truth Table for Synchronous Transitions
CKE
3,12
Command (N)
2
3
Previous
Current
Notes
Current State
Action (N)
1
1
Cycle
Cycle
RAS, CAS, WE, CS
(N-1)
(N)
Maintain Power-Down
Power-Down Exit
L
L
L
L
L
X
11, 13, 15
4, 8, 11, 13
11, 15
Power-Down
Self Refresh
H
L
DESELECT or NOP
X
Maintain Self Refresh
Self Refresh Exit
H
DESELECT or NOP
4, 5, 9
Bank(s)
Active
Active Power-Down Entry
H
L
DESELECT or NOP
4,8,10,11, 13
Precharge Power-Down Entry
Self Refresh Entry
H
H
L
L
DESELECT or NOP
AUTOREFRESH
4,8,10,11
All Banks Idle
6, 9, 11, 13
Any State other
than listed above
Refer to the Command Truth Table
H
H
7
1. CKE (N) is the logic state of CKE at clock edge N; CKE (N-1) was the state of CKE at the previous clock edge.
2. Current state is the state of the DDR2 SDRAM immediately prior to clock edge N.
3. Command (N) is the command registered at clock edge N, and Action (N) is a result of Command (N).
4. All states and sequences not shown are illegal or reserved unless explicitly described elsewhere in this document.
5. On Self Refresh Exit DESELECT or NOP commands must be issued on every clock edge occurring during the tXSNR
period.
Read commands may be issued only after tXSRD (200 clocks) is satisfied.
6. Self Refresh mode can only be entered from the All Banks Idle state.
7. Must be a legal command as defined in the Command Truth Table.
8. Valid commands for Power-Down Entry and Exit are NOP and DESELECT only.
9. Valid commands for Self Refresh Exit are NOP and DESELCT only.
10. Power-Down and Self Refresh can not be entered while Read or Write operations, (Extended) mode Register operations,
Precharge or Refresh operations are in progress. See section 2.8 “Power Down” and section 2.7.2 “Self Refresh Com-
mand” for a detailed list of restrictions.
11. Minimum CKE high time is 3 clocks, minimum CKE low time is 3 clocks.
12. The state of ODT does not affect the states described in this table. The ODT function is not available during Self Refresh.
13. The Power-Down Mode does not perform any refresh operations. The duration of Power-Down Mode is therefor limited by
the refresh requirements.
14. CKE must be maintained high while the device is in OCD calibration mode.
15. “X” means “don’t care (including floating around VREF)” in Self Refresh and Power Down. However ODT must be driven
high or low in Power Down if the ODT function is enabled (Bit A2 or A6 set to “1” in EMRS(1)).
16. Operation that is not specified is illegal and after such an event, in order to guarantee proper operation, the DRAM must
be powered down and then restarted through the specified initialization sequence before normal operation can continue.
3.3 Data Mask (DM) Truth Table
Name (Function)
Write Enable
DM
L
DQs
Valid
X
Notes
1
1
Write Inhibit
H
1. Used to mask write data; provided coincident with the corresponding data.
Page 62
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256Mb DDR2 SDRAM
4. Operating Conditions
4.1 Absolute Maximum Ratings
Symbol
VDD
Parameter
Rating
Units
Notes
Voltage on VDD pin relative to VSS
Voltage on VDDQ pin relative to VSS
Voltage on VDDL pin relative to VSS
Voltage on any pin relative to VSS
1
1
1
-1.0 to + 2.3
-0.5 to + 2.3
-0.5 to + 2.3
-0.5 to + 2.3
V
V
V
V
VDDQ
VDDL
V
, V
1
IN OUT
Storage Temperature
T
1, 2
-55 to + 100
°C
STG
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reli-
ability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions,
please refer to JESD51-2 standard.
4.2 DRAM Component Operating Temperature Range
Symbol
Parameter
Operating Temperature
Rating
Units
Notes
oC
1 ~ 4
T
0 to 95
OPER
1. Operating Temperature is the case surface temperature on the center / top side of the DRAM. For measurement conditions,
please refer to the JEDEC document JESD51-2.
2. The operating temperature range are the temperatures where all DRAM specification will be supported. During operation, the
o
DRAM case temperature must be maintained between 0 - 95 C under all other specification parameters.
o
o
3. Some application may require to operate the DRAM up to 95 C case temperature. In this case above 85 C case temperature the
Auto-Refresh command interval has to be reduced to tREFI = 3.9 µs.
o
4. Self-Refresh period is hard-coded in the chip and therefore it is imperative that the system ensures the DRAM is below 85 C case
temperature before initiating self-refresh operation.
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5. AC & DC Operating Conditions
5.1 DC Operating Conditions
5.1.1 Recommended DC Operating Conditions (SSTL_18)
Rating
Symbol
Parameter
Supply Voltage
Units
Notes
Min.
1.7
Typ.
1.8
Max.
1.9
VDD
VDDDL
VDDQ
VREF
VTT
V
V
V
V
V
1
1
Supply Voltage for DLL
Supply Voltage for Output
Input Reference Voltage
Termination Voltage
1.7
1.8
1.9
1.7
1.8
1.9
1
0.49 * VDDQ 0.5 * VDDQ 0.51 * VDDQ
VREF - 0.04 VREF VREF + 0.04
2, 3
4
1. VDDQ tracks with VDD, VDDDL tracks with VDD. AC parameters are measured with VDD, VDDQ and VDDDL tied together.
2. The value of VREF may be selected by the user to provide optimum noise margin in the system. Typically the value of VREF is
expected to be about 0.5 x VDDQ of the transmitting device and VREF is expected to track variations in VDDQ.
3. Peak to peak ac noise on VREF may not exceed +/- 2% VREF (dc).
4. VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF
and must track variations in die dc level of VREF.
5.1.2 ODT DC Electrical Characteristics
Units
Parameter / Condition
Symbol
min.
nom.
75
max.
Notes
1
Rtt
Rtt
impedance value for EMRS(1)(A6,A2)=0,1; 75 ohm
Rtt1
(eff)
60
90
Ω
(eff)
(eff)
impedance value for EMRS(1)(A6,A2)=1,0; 150 ohm Rtt2
(eff)
120
180
Ω
1
2
150
Deviation of VM with respect to VDDQ / 2
delta VM - 6.00
+ 6.00
%
1) Measurement Definition for Rtt(eff):
Apply VIH
and VIL
to test pin separately, then measure current Ι(VIHac) and Ι(VILac) respectively.
(ac)
(ac)
Rtt(eff) = (VIH
(ac)
- VIL
) /(Ι(VIHac) - Ι(VILac))
(ac)
2) Measurement Definition for VM:
Measure voltage (VM) at test pin (midpoint) with no load:
delta VM =((2* VM / VDDQ) - 1) x 100%
5.1.3 Input and Output Leakage Currents:
Units
Symbol
Parameter / Condition
min.
max.
Notes
1
I
Input Leakage Current; any input 0V < V < VDD
IN
-2
+2
µΑ
IL
I
Output Leakage Current; 0V < V < VDDQ
OUT
-5
+5
µΑ
2
OL
notes: 1) all other pins not under test = 0V
2) DQ’s, DQS, DQS and ODT are disabled
Page 64
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256Mb DDR2 SDRAM
5.2 DC & AC Logic Input Levels
DDR2 SDRAM pin timing are specified for either single ended or differential mode depending on the setting of the
EMRS(1) “Enable DQS” mode bit; timing advantages of differential mode are realized in system design. The
method by which the DDR2 SDRAM pin timing are measured is mode dependent. In single ended mode, timing
relationships are measured relative to the rising or falling edges of DQS crossing at VREF. In differential mode,
these timing relationships are measured relative to the crosspoint of DQS and its complement, DQS. This distinc-
tion in timing methods is verified by design and characterization but not subject to production test. In single ended
mode, the DQS (and RDQS) signals are internally disabled and don’t care.
5.2.1 Single-ended DC & AC Logic Input Levels
Symbol
VIH (dc)
VIL (dc)
VIH (ac)
VIL (ac)
Parameter
Min.
VREF + 0.125
- 0.3
Max.
VDDQ + 0.3
VREF - 0.125
-
Units
DC input logic high
V
V
V
V
DC input low
AC input logic high
AC input low
VREF + 0.250
-
VREF - 0.250
5.2.2 Single-ended AC Input Test Conditions
Symbol
VREF
Condition
Input reference voltage
Value
Units
V
Notes
1, 2
0.5 * VDDQ
Input signal maximum peak to peak swing
Input signal minimum slew rate
1, 2
VSWING(max)
SLEW
1.0
1.0
V
3, 4
V / ns
1. This timing and slew rate definition is valid for all single-ended signals except tis, tih, tds, tdh.
2. Input waveform timing is referenced to the input signal crossing through the VREF level applied to the device under test.
3. The input signal minimum slew rate is to be maintained over the range from VIL(dc)max to VIH(ac)min for rising edges and
the range from VIH(dc)min to VIL(ac)max for falling edges as shown in the below figure.
4. AC timings are referenced with input waveforms switching from VIL(ac) to VIH(ac) on the positive transitions and VIH(ac)
to VIL(ac) on the negative transitions.
Start of Falling Edge Input Timing
Start of Rising Edge Input Timing
V
V
V
V
V
V
V
DDQ
IH(ac)
IH(dc)
REF
min
min
V
SWING(MAX)
max
max
IL(dc)
IL(ac)
SS
delta TF
VIH(dc) min - VIL(ac) max
delta TR
VIH(ac) min - VIL(dc) max
delta TR
Falling Slew =
Rising Slew =
delta TF
Page 65
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INFINEON Technologies
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256Mb DDR2 SDRAM
5.2.3 Differential DC and AC Input and Output Logic Levels
Symbol
VIN(dc)
VID(dc)
VID(ac)
VIX(ac)
VOX(ac)
Parameter
min.
max.
Units Notes
DC input signal voltage
-0.3
VDDQ + 0.3
1
DC differential input voltage
0.25
VDDQ + 0.6
2
AC differential input voltage
0.5
VDDQ + 0.6
V
V
V
3
4
5
AC differential cross point input voltage
AC differential cross point output voltage
0.5 * VDDQ - 0.175
0.5 * VDDQ - 0.125
0.5 * VDDQ + 0.175
0.5 * VDDQ + 0.125
notes:
1) VIN(dc) specifies the allowable DC execution of each input of differential pair such as CK, CK, DQS, DQS etc.
2) VID(dc) specifies the input differential voltage VTR - VCP required for switching. The minimum value is equal to VIH(dc) - VIL(dc).
3) VID(ac) specifies the input differential voltage VTR - VCP required for switching. The minimum value is equal to VIH(ac) - VIL(ac).
4) The value of VIX(ac) is expected to equal 0.5 x VDDQ of the transmitting device and VIX(ac) is expected to track variations in VDDQ.
VIX(ac) indicates the voltage at which differential input signals must cross.
5) The value of VOX(ac) is expected to equal 0.5 x VDDQ of the transmitting device and VOX(ac) is expected to track variations in
VDDQ. VOX(ac) indicates the voltage at which differential input signals must cross.
VDDQ
VTR
Crossing Point
VID
VIX or VOX
VCP
VSSQ
SSTL18_3
Page 66
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INFINEON Technologies
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256Mb DDR2 SDRAM
5.3 Output Buffer Levels
5.3.1 SSTL_18 Output DC Current Drive
Units
mA
Notes
1, 3, 4
2, 3, 4
Symbol
Parameter
Output Minimum Source DC Current
Output Minimum Sink DC Current
SSTL_18 Class II
I
-13.4
13.4
OH
I
mA
OL
1. VDDQ = 1.7 V; V
- 280 mV.
= 1.42 V. (V
OUT
-VDDQ) / IOH must be less than 21 ohm for values of V
between VDDQ and VDDQ
OUT
OUT
2. VDDQ = 1.7 V; V
= 280 mV. V
OUT
/ IOL must be less than 21 ohm for values of VOUT between 0V and 280 mV.
OUT
3. The dc value of VREF applied to the receiving device is set to VTT
4. The values of I (dc) and I (dc) are based on the conditions given in note 1 and 2. They are used to test drive current capa-
OH OL
bility to ensure VIHmin. plus a noise margin and VILmax. minus a noise margin are delivered to an SSTL_18 receiver. The
actual current values are derived by shifting the desired driver operating points along 21 ohm load line to define a convenient
current for measurement.
5.3.2 SSTL_18 Output AC Test Conditions
Symbol
Parameter
SSTL_18 Class II
Units
Notes
1
V
Minimum Required Output Pull-up
V
+ 0.603
– 0.603
V
V
V
OH
TT
TT
1
2
V
Maximum Required Output Pull-down
Output Timing Measurement Reference Level
V
OL
V
0.5 * V
DDQ
OTR
1. SSTL_18 test load for VOH and VOL is different from the reference load described in section 8.1 of this datasheet. The
SSTL_18 test load has a 20 Ohm series resistor additionally to the 25 Ohm termination resistor into VTT. The SSTL_18 definition
assumes that +/- 335 mV must be developed across the effectively 25 Ohm termination resistor (13.4 mA x 25 Ohm = 335 mV).
With an additional series resistor of 20 Ohm this translates into a minimum requirement of 603 mV swing relative to VTT, at the out-
put device (13.4 mA * 45 Ohm) = 603 mV).
2. The VDDQ of the device under test is referenced.
5.3.3 OCD “Off-Chip Driver” Default Characteristics
max.
23.4
4
Unit
Notes
Symbol
Description
min.
12.6
0
nominal
Output Impedance
Ohms
1,2
-
-
-
18
-
Pull-up / Pull down mismatch
Ohms
Ohms
1, 2, 3
8
Output Impedance step size for OCD calibration
0
-
1.5
1, 4, 5, 6,
7
Output Slew Rate
V / ns
Sout
1.5
-
5.0
1) V
DDQ
= 1.8 V ± 0.1 V; V
= 1.8 V ± 0.1 V.
DD
2) Impedance measurement condition for output source dc current: VDDQ = 1.7 V, VOUT = 1420 mV;
(VOUT-VDDQ) / IOH must be less than 23.4 ohms for values of VOUT between VDDQ and VDDQ - 280 mV. Impedance measurement
condition for output sink dc current: VDDQ = 1.7 V; VOUT = -280 mV; VOUT / IOL must be less than 23.4 ohms for values of VOUT
between 0 V and 280 mV.
3) Mismatch is absolute value between pull-up and pull-down, both are measured at same temperature and voltage.
4) Slew rates measured from VIL(ac) to VIH(ac) with the load specified in Section 8.2.
5) The absolute value of the slew rate as measured from DC to DC is equal to or greater than the slew rate as measured from AC to AC. This
is verified by design and characterisation but not subject to production test.
6) DRAM output slew rate specification applies to 400, 533 and 667 MT/s speed bins.
7) Timing skew due to DRAM output slew rate mis-match between DQS / DQS and associated DQ’s is included in tDQSQ and tQHS specifi-
cation.
8) This represents the step size when the OCD is near 18 ohms at nominal conditions across all process parameters and represents only the
DRAM uncertainty. A 0 Ohm value (no calibration) can only be achieved if the OCD impedance is 18 +/- 0.75 ohms under nominal condi-
tions.
Page 67
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256Mb DDR2 SDRAM
5.4 Default Output V-I Characteristics
DDR2 SDRAM output driver characteristics are defined for full strength default operation as selected by the
EMRS(1) bits A7~A9 =’111’. Figures in Section 5.3.5 and 5.3.6 show the driver characteristics graphically and the
tables sow the same data suitable for input into simulation tools.
5.4.1 Full Strength Default Pull-up Driver Characteristics
Pull-up Driver Current [mA]
Minimum
Nominal Default low
Nominal Default high
Maximum
Voltage (V)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
-8.5
-11.1
-16.0
-20.3
-24.0
-27.2
-29.8
-31.9
-33.4
-34.6
-35.5
-36.2
-36.8
-37.2
-37.7
-38.0
-38.4
-38.6
-11.8
-17.0
-22.2
-27.5
-32.4
-36.9
-40.8
-44.5
-47.7
-50.4
-52.5
-54.2
-55.9
-57.1
-58.4
-59.6
-60.8
-15.9
-23.8
-31.8
-39.7
-47.7
-55.0
-62.3
-69.4
-75.3
-80.5
-84.6
-87.7
-90.8
-92.9
-94.9
-97.0
-99.1
-101.1
-12.1
-14.7
-16.4
-17.8
-18.6
-19.0
-19.3
-19.7
-19.9
-20.0
-20.1
-20.2
-20.3
-20.4
-20.6
The driver characteristics evaluation conditions are:
o
Nominal Default 25 C (Tcase), VDDQ = 1.8 V, typical process
o
o
Minimum 95 C (Tcase), VDDQ = 1.7V, slow-slow process
Maximum 0 C (Tcase). VDDQ = 1.9 V, fast-fast process
0
-20
-40
Minimum
Nominal Default Low
Nominal Default High
Maximum
-60
-80
-100
-120
0
0,2
0,4
0,6
0,8
1
1,2
1,4
1,6
1,8
2
VDDQ to VOUT (V)
Page 68
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INFINEON Technologies
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256Mb DDR2 SDRAM
5.4.2 Full Strength Default Pull-down Driver Characteristics
Pull-down Driver Current [mA]
Nominal Default low Nominal Default high
Minimum
Maximum
Voltage (V)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
8.5
11.3
11.8
16.8
22.1
27.6
32.4
36.9
40.9
44.6
47.7
50.4
52.6
54.2
55.9
57.1
58.4
59.6
60.9
15.9
23.8
31.8
39.7
47.7
55.0
62.3
69.4
75.3
80.5
84.6
87.7
90.8
92.9
94.9
97.0
99.1
101.1
12.1
14.7
16.4
17.8
18.6
19.0
19.3
19.7
19.9
20.0
20.1
20.2
20.3
20.4
20.6
16.5
21.2
25.0
28.3
30.9
33.0
34.5
35.5
36.1
36.6
36.9
37.1
37.4
37.6
37.7
37.9
The driver characteristics evaluation conditions are:
o
Nominal Default 25 C (Tcase), VDDQ = 1.8 V, typical process
o
o
Minimum 95 C (Tcase), VDDQ = 1.7V, slow-slow process
Maximum 0 C (Tcase). VDDQ = 1.9 V, fast-fast process
120
100
80
60
40
20
0
Minimum
Nominal Default Low
Nominal Default High
Maximum
0
0,2 0,4 0,6 0,8
1
1,2 1,4 1,6 1,8
2
VOUT to VSSQ (V)
Page 69
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INFINEON Technologies
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256Mb DDR2 SDRAM
5.4.3 Calibrated Output Driver V-I Characteristics
DDR2 SDRAM output driver characteristics are defined for full strength calibrated operation as selected by the
procedure outlined in the Off-Chip Driver (OCD) Impedance Adjustment. The following tables show the data in
tabular format suitable for input into simulation tools. The nominal points represent a device at exactly 18 ohms.
The nominal low and nominal high values represent the range that can be achieved with a maximum 1.5 ohms
step size with no calibration error at the exact nominal conditions only (i.e. perfect calibration procedure, 1.5 ohm
maximum step size guaranteed by specification). Real system calibration error needs to be added to these values.
It must be understood that these V-I curves are represented here or in supplier IBIS models need to be adjusted to
a wider range as a result of any system calibration error. Since this is a system specific phenomena, it cannot be
quantified here. The values in the calibrated tables represent just the DRAM portion of uncertainty while looking at
one DQ only. If the calibration procedure is used, it is possible to cause the device to operate outside the bounds
of the default device characteristics tables and figure. In such a situation, the timing parameters in the specifica-
tion cannot be guaranteed. It is solely up to the system application to ensure that the device is calibrated between
the minimum and maximum default values at all times. If this can’t be guaranteed by the system calibration proce-
dure, re-calibration policy and uncertainty with DQ to DQ variation, it is recommended that only the default values
to be used. The nominal maximum ad minimum values represent the change in impedance from nominal low and
high as a result of voltage and temperature change from the nominal condition to the maximum and minimum con-
ditions. If calibrated at an extreme condition, the amount of variation could be as much as from the nominal mini-
mum to the nominal maximum or vice versa.
Full Strength Calibrated Pull-down Driver Characteristics
Calibrated Pull-down Driver Current [mA]
Nominal Minimum
(21 Ohms)
Normal Low
(18.75 Ohms)
Nominal
(18 ohms)
Normal High
(17.25 Ohms)
Nominal Maximum
(15 Ohms)
Voltage (V)
0.2
0.3
0.4
9.5
10.7
16.0
21.0
11.5
16.6
21.6
11.8
17.4
23.0
13.3
20.0
27.0
14.3
18.7
The driver characteristics evaluation conditions are:
o
Nominal 25 C (Tcase), VDDQ = 1.8 V, typical process
o
Nominal Low and Nominal High 25 C (Tcase), VDDQ = 1.8V, any process
o
Nominal Minimum 95 C (Tcase). VDDQ = 1.7 V, any process
o
Nominal Maximum 0 C (Tcase), VDDQ = 1.9 V, any process
Full Strength Calibrated Pull-up Driver Characteristics
Calibrated Pull-up Driver Current [mA]
Nominal Minimum
(21 Ohms)
Normal Low
(18.75 Ohms)
Nominal
(18 ohms)
Normal High
(17.25 Ohms)
Nominal Maximum
(15 Ohms)
Voltage (V)
0.2
0.3
0.4
-9.5
-14.3
-18.3
-10.7
-16.0
-21.0
-11.4
-16.5
-21.2
-11.8
-17.4
-23.0
-13.3
-20.0
-27.0
The driver characteristics evaluation conditions are:
o
Nominal 25 C (Tcase), VDDQ = 1.8 V, typical process
o
Nominal Low and Nominal High 25 C (Tcase), VDDQ = 1.8V, any process
o
o
Nominal Minimum 95 C (Tcase). VDDQ = 1.7 V, any process
Nominal Maximum 0 C (Tcase), VDDQ = 1.9 V, any process
Page 70
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INFINEON Technologies
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256Mb DDR2 SDRAM
5.5 Input / Output Capacitance
Symbol
Parameter
min.
1.0
-
max.
2.0
Units
pF
CCK
CDCK
CI
Input capacitance, CK and CK
Input capacitance delta, CK and CK
0.25
2.0
pF
Input capacitance, all other input-only pins
Input capacitance delta, all other input-only pins
1.0
-
pF
CDI
0.25
pF
Input/output capacitance,
CIO
3.0
-
4.0
0.5
pF
pF
DQ, DM, DQS, DQS, RDQS, RDQS
Input/output capacitance delta,
DQ, DM, DQS, DQS, RDQS, RDQS
CDIO
5.6 Power & Ground Clamp V-I Characteristics
Power and Ground clamps are provided on address (A0~A12, BA0, BA1), RAS, CAS, CS, WE, CKE and ODT
pins. The V-I characteristics for pins with clamps is shown in the following table:
Minimum Power
Clamp Current (mA)
Minimum Ground
Clamp Current (mA)
Voltage across clamp
(V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0.1
1.0
2.5
4.7
6.8
9.1
11.0
13.5
16.0
18.2
21.0
0.1
1.0
2.5
4.7
6.8
9.1
11.0
13.5
16.0
18.2
21.0
Page 71
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256Mb DDR2 SDRAM
6. IDD Specifications and Measurement Conditions
6.1 IDD Specifications
(VDDQ = 1.8V ± 0.1V; VDD = 1.8V ± 0.1V, 0 oC to TCASEmax
)
.
-3 & -3S
DDR2 - 667
-5
-3.7
DDR2 -533
Unit
DDR2 -400
Symbol
Parameter/Condition
I/O
max.
50
55
4
max.
55
60
4
max.
60
65
4
mA
mA
mA
mA
mA
mA
mA
mA
I
I
Operating Current
all
all
all
all
all
all
all
all
DD0
DD1
Operating Current
I
Precharge Power-Down Current
Precharge Standby Current
Precharge Quiet Standby Current:
DD2P
DD2N
DD2Q
I
28
20
13
4
36
25
16
4
45
30
20
4
I
MRS(12)=0
MRS(12)=1
Active Power-Down Standby
Current
I
DD3P
I
I
Active Standby Current
30
35
40
DD3N
DD4R
80
90
x4/x8
x16
60
70
70
80
mA
mA
Operating Current Burst Read
100
115
x4/x8
x16
70
90
85
100
I
Operating Current Burst Write
DD4W
I
Burst Auto-Refresh Current (tRFC=tRFCmin.)
Distributed Auto-Refresh Current (tRFC=7.8µs)
Self-Refresh Current for standard products
Self-Refresh Current for low power products
all
all
all
all
80
6
85
6
90
6
mA
mA
mA
mA
DD5B
I
DD5D
I
I
4
4
4
DD6
DD6
2
2
2
145
160
x4/x8
x16
125
140
135
150
I
Operating Current
mA
DD7
Page 72
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256Mb DDR2 SDRAM
6.2 IDD Measurement Conditions
(VDDQ = 1.8V ± 0.1V; VDD = 1.8V ± 0.1V)
Symbol
Parameter/Condition
Operating Current - One bank Active - Precharge
I
I
tCK =tCK(IDD).; tRC = tRC(IDD); tRAS = tRASmin(IDD); CKE is HIGH, CS is HIGH between valid commands.
DD0
DD1
Address and control inputs are SWITCHING; Data bus inputs are SWITCHING;
Operating Current - One bank Active - Read - Precharge
IOUT = 0 mA; BL = 4, tCK = tCK(IDD), tRC = tRC(IDD); tRAS = tRASmin(IDD); tRCD = tRCD(IDD), CL = CL(IDD).;AL = 0;
CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCHING, Data bus inputs are SWITCHING;
Precharge Power-Down Current: All banks idle; CKE is LOW; tCK = tCK(IDD).; Other control and address inputs are STA-
I
DD2P
DD2N
DD2Q
BLE, Data Bus inputs are FLOATING.
Precharge Standby Current: All banks idle; CS is HIGH; CKE is HIGH; tCK = tCK(IDD).; Other control and address bus inputs
I
are SWICHTING; Data bus inputs are SWITCHING.
Precharge Quiet Standby Current: All banks idle; CS is HIGH; CKE is HIGH; tCK = tCK(IDD).; Other control and address bus
I
inputs are STABLE; Data bus inputs are FLOATING.
Active Power-Down Current: All banks open; tCK = tCK(IDD).;CKE is LOW; Other control and address inputs are STABLE;
I
I
DD3P(0)
DD3P(1)
Data Bus inputs are FLOATING. MRS A12 bit is set to “0”(Fast Power-down Exit);
Active Power-Down Current: All banks open; tCK = tCK(IDD).;CKE is LOW; Other control and address inputs are STABLE;
Data Bus inputs are FLOATING. MRS A12 bit is set to “1”(Slow Power-down Exit);
Active Standby Current: All banks open; tCK = tCK(IDD).; tRAS = tRASmax(IDD).; tRP = tRP(IDD)., CKE is HIGH; CS is
I
I
DD3N
DD4R
HIGH between valid commands; Other control and address inputs are SWITCHING; Data Bus inputs are SWITCHING.
Operating Current - Burst Read: All banks open; Continuous burst reads; BL = 4; AL = 0, CL = CL(IDD).; tCK = tCK(IDD).;
tRAS = tRASmax(IDD)., tRP = tRP(IDD)., CKE is HIGH, CS is HIGH between valid commands; Address inputs are SWITCH-
ING; Data bus inputs are SWITCHING; IOUT = 0mA.
Operating Current - Burst Write: All banks open; Continuous burst writes; BL = 4; AL = 0, CL = CL(IDD).; tCK = tCK(IDD).;
tRAS = tRASmax(IDD)., tRP = tRP(IDD).;CKE is HIGH, CS is HIGH between valid commands; Address inputs are SWITCH-
ING; Data Bus inputs are SWITCHING;
I
DD4W
Burst Auto-Refresh Current: tCK = tCK(IDD); Refresh command every tRFC = tRFC(IDD) interval; CKE is HIGH, CS is
I
DD5B
HIGH between valid commands; Other control and address inputs are SWITCHING; Data bus inputs are SWITCHING.
Distributed Auto-Refresh Current: tCK = tCK(IDD).; Refresh command every tREFI=7.8 µs interval; CKE is LOW and CS is
I
DD5D
HIGH between valid commands; Other control and address inputs are SWITCHING; Data bus inputs are SWITCHING
Self-Refresh Current: CKE ≤ 0.2V; external clock off, CK and CK at 0V; Other control and address inputs are FLOATING;
I
I
DD6
DD7
Data Bus inputs are FLOATING.
All Bank Interleave Read Current:
1. All banks interleaving reads, IOUT = 0 mA; BL = 4, CL=CL(IDD), AL = tRCD(IDD) -1*tCK(IDD);
tCK = tCK(IDD), tRC = tRC(IDD), tRRD = tRRD(IDD); CKE is HIGH, CS is high between valid commands, Address bus
inputs are STABLE during DESELECTS; Data bus is SWITCHING.
2. Timing pattern:
- DDR2 -400 -333: A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D D D
- DDR2 -533 -444: A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D D D
- DDR2 -667 -444: A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D
- DDR2 -667 -555: A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D
3. Legend: Activate, RA=Read with Auto-Precharge, D=DESELECT
1. IDD specifications are tested after the device is properly initialized.
2. IDD parameter are specified with ODT disabled.
3. Data Bus consists of DQ, DM, DQS, DQS, RDQS, RDQS, LDQS, LDQS, UDQS and UDQS.
4. Definitions for IDD:
LOW is defined as VIN <= VILAC(max.); HIGH is defined as VIN >= VIHAC(min.);
STABLE is defined as inputs are stable at a HIGH or LOW level
FLOATING is defined as inputs are VREF = VDDQ / 2
SWITCHING is defined as:
Inputs are changing between HIGH and LOW every other clock (once per two clocks) for address and control signals, and
inputs changing between HIGH and LOW every other data transfer (once per clock) for DQ signals not including mask or strobes.
5. Timing parameter minimum and maximum values for IDD current measurements are defined in the following table.
Page 73
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256Mb DDR2 SDRAM
6.2 IDD Measurement Conditions (cont’d)
For testing the IDD parameters, the following timing parameters are used:
-5
-3.7
DDR2 -533
-3S
DDR2 - 667
-3
Unit
DDR2 -400
DDR2 - 667
Parameter
Symbol
3-3-3
3
4-4-4
4
5-5-5
5
4-4-4
4
CAS Latency
CL(IDD)
tCK(IDD)
tRCD(IDD)
tCK
ns
Clock Cycle Time
5
3.75
15
3
3
Active to Read or Write delay
15
15
12
ns
Active to Active / Auto-Refresh command
period
tRC(IDD)
60
60
60
57
ns
ns
Active bank A to Active
1 kB page size
tRRD(IDD)
7.5
7.5
7.5
7.5
bank B command delay
tRASmin(IDD)
tRASmax(IDD)
tRP(IDD)
45
70000
15
45
70000
15
45
70000
15
45
70000
12
ns
ns
ns
Active to Precharge Command
Precharge Command Period
Auto-Refresh to Active / Auto-Refresh com-
mand period
tRFC(IDD)
75
75
75
75
ns
6.3 ODT (On Die Termination) Current
The ODT function adds additional current consumption to the DDR2 SDRAM when enabled by the EMRS(1).
Depending on address bits A6 & A2 in the EMRS(1) a “week” or “strong” termination can be selected. The current
consumption for any terminated input pin, depends on the input pin is in tri-state or driving “0” or “1”, as long a
ODT is enabled during a given period of time.
ODT current per terminated input pin:
EMRS(1) State
Unit
min. typ. max.
A6 = 0, A2 = 1
A6 = 1, A2 = 0
A6 = 0, A2 = 1
tbd.
tbd.
tbd.
tbd.
tbd.
tbd.
7.5
mA/DQ
Enabled ODT current per DQ
IODTO
IODTT
added IDDQ current for ODT enabled;
ODT is HIGH; Data Bus inputs are FLOATING
3.75 mA/DQ
15
mA/DQ
mA/DQ
Active ODT current per DQ
added IDDQ current for ODT enabled;
ODT is HIGH; worst case of Data Bus inputs
are STABLE or SWITCHING.
A6 = 1, A2 = 0
tbd.
tbd.
7.5
note: For power consumption calculations the ODT duty cycle has to be taken into account
Page 74
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INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
7. Electrical Characteristics & AC Timing - Absolute Specification
7.1 Timing Parameter by Speed Grade - DDR2-400 & DDR2-533
(V
DDQ
= 1.8V ± 0.1V; V
DD
= 1.8V ± 0.1V) (notes 1-4)
-5
-3.7
DDR2-400-333
DDR2-533-444
Notes
Symbol
Parameter
Unit
min.
max
+ 600
+ 500
0.55
min.
max
+500
+450
0.55
0.55
t
DQ output access time from CK / CK
DQS output access time from CK / CK
CK, CK high-level width
- 600
- 500
0.45
0.45
-500
-450
0.45
0.45
ps
ps
AC
t
DQSCK
t
t
t
CH
CK
t
CK, CK low-level width
0.55
CL
HP
CK
t
Clock half period
min (t
t
min (t
t
5
6
6
7
7
8
8
CL, CH)
8000
CL, CH)
CL = 3
CL = 4 & 5
5000
5000
350
5000
3750
250
375
100
225
0.6
8000
ps
ps
ps
ps
ps
ps
t
Clock cycle time
CK
8000
8000
t
Address and control input setup time
Address and control input hold time
DQ and DM input setup time
-
-
IS
t
475
-
-
IH
t
t
150
-
-
DS
DQ and DM input hold time
275
-
-
-
-
DS
t
Address and control input pulse width (each input)
DQ and DM input pulse width (each input)
Data-out high-impedance time from CK / CK
DQ low-impedance time from CK / CK
DQS low-impedance from CK / CK
DQS-DQ skew (for DQS & associated DQ signals)
Data hold skew factor
0.6
t
t
IPW
CK
t
0.35
-
-
0.35
-
-
DIPW
CK
ps
t
tACmax
tACmax
tACmax
350
tACmax
tACmax
tACmax
300
9
9
HZ
2*tACmin
tACmin
-
t
2*tACmin
tACmin
-
ps
ps
ps
ps
(DQ)
LZ
t
LZ
9
(DQS)
t
18
DQSQ
t
-
450
-
400
QHS
t
Data output hold time from DQS
t
-t
t
-t
QH
HP QHS
HP QHS
t
Write command to 1st DQS latching transition
DQS input low (high) pulse width (write cycle)
DQS falling edge to CK setup time (write cycle)
DQS falling edge hold time from CK (write cycle)
Mode register set command cycle time
Write preamble
WL-0.25
0.35
0.2
WL+0.25
WL-0.25
0.35
0.2
WL+0.25
t
t
t
t
t
t
t
t
t
DQSS
CK
CK
CK
CK
CK
CK
CK
CK
t
-
-
DQSL,H
t
-
-
DSS
t
0.2
-
0.2
-
DSH
t
2
-
-
2
-
-
MRD
t
0.25
0.40
0.9
0.25
0.40
0.9
WPRE
t
Write postamble
0.60
1.1
0.60
70000
-
0.60
1.1
0.60
70000
-
10
9
WPST
t
Read preamble
RPRE
t
Read postamble
0.40
40
0.40
45
9
RPST
CK
ns
t
Active to Precharge command
11
RAS
t
Active to Active/Auto-Refresh command period
Auto-Refresh to Active/Auto-Refresh command period
55
60
ns
ns
RC
t
75
-
75
-
12
13
RFC
RCD
Active to Read or Write delay
t
15
15
-
-
15
15
-
-
ns
ns
(with and without Auto-Precharge)
t
Precharge command period
RP
Page 75
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INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
7.1 Timing Parameter by Speed Grade - DDR2-400 & DDR2-533
(V
DDQ
= 1.8V ± 0.1V; V
DD
= 1.8V ± 0.1V) (notes 1-4)
-5
-3.7
DDR2-400-333
DDR2-533-444
Notes
Symbol
Parameter
Unit
min.
max
min.
max
Active bank A to Active bank B
command period
x4, x8 & x16
t
t
7.5
-
7.5
-
ns
RRD
(1k page size)
CAS A to CAS B Command Period
Write recovery time
2
15
2
15
t
t
CCD
CK
ns
t
-
-
-
-
-
-
-
-
WR
t
Auto-Precharge write recovery + precharge time
Internal Write to Read command delay
WR+tRP
10
WR+tRP
7.5
14
15
DAL
CK
ns
t
WTR
t
Internal Read to Precharge command delay
7.5
7.5
ns
RTP
Exit power down to any valid command
(other than NOP or Deselect)
t
2
6 - AL
2
-
-
2
6 - AL
2
-
-
t
t
16
16
XARD
CK
Exit active power-down mode to Read command
(slow exit, lower power)
t
XARDS
CK
CK
Exit precharge power-down to any valid command
(other than NOP or Deselect)
t
-
-
-
-
t
t
XP
t
t
Exit Self-Refresh to read command
200
200
XSRD
XSNR
CK
ns
Exit Self-Refresh to non-Read command
tRFC+10
tRFC+10
tCKE CKE minimum high and low pulse width
3
-
3
-
t
CK
µs
o
o
0 C - 85 C
7.8
3.9
12
7.8
3.9
12
t
Average periodic refresh Interval
OCD drive mode output delay
19
17
REFI
o
o
85 C - 95 C
-
-
µs
ns
t
0
0
OIT
Minimum time clocks remain ON after CKE asynchro-
nously drops LOW
t
tIS+tCK+tIH
-
tIS+tCK+tIH
-
ns
DELAY
Timing that is not specified is illegal and after such an event, in order to guarantee proper operation, the DRAM must be powered down
and then restarted through the specified initialization sequence before normal operation can continue.
Page 76
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INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
7.2 Timing Parameter by Speed Grade - DDR2-667
(V
DDQ
= 1.8V ± 0.1V; V
DD
= 1.8V ± 0.1V) (notes 1-4)
-3S
-3
DDR2-667-555
DDR2-667-444
Notes
Symbol
Parameter
Unit
min.
max
+450
+400
0.55
0.55
min.
-450
-400
0.45
0.45
max
+450
+400
0.55
0.55
t
DQ output access time from CK / CK
DQS output access time from CK / CK
CK, CK high-level width
-450
-400
0.45
0.45
ps
ps
AC
t
DQSCK
t
t
t
t
t
CH
CK
t
CK, CK low-level width
CL
HP
CK
Clock half period
min (t
t
min (t
t
5
6
CL, CH)
8000
CL, CH)
CL = 3
5000
5000
3000
150
275
50
5000
3000
3000
150
275
50
8000
ps
ps
ps
ps
ps
ps
ps
Clock cycle time
CL = 4
CL = 5
8000
8000
CK
8000
8000
t
Address and control input setup time
Address and control input hold time
DQ and DM input setup time
-
-
7
7
8
8
IS
t
-
-
IH
t
-
-
DS
t
DQ and DM input hold time
175
0.6
-
-
175
0.6
-
-
DH
t
Address and control input pulse width (each input)
DQ and DM input pulse width (each input)
Data-out high-impedance time from CK / CK
DQ low-impedance time from CK / CK
DQS low-impedance from CK / CK
DQS-DQ skew (for DQS & associated DQ signals)
Data hold skew factor
t
t
IPW
CK
t
0.35
-
-
0.35
-
-
DIPW
CK
ps
t
tACmax
tACmax
tACmax
250
tACmax
tACmax
tACmax
250
9
9
HZ
2*tACmin
tACmin
-
t
2*tACmin
tACmin
-
ps
ps
ps
ps
(DQ)
LZ
t
LZ
9
(DQS)
t
18
DQSQ
t
-
350
-
350
QHS
t
Data output hold time from DQS
t
-t
t
-t
QH
HP QHS
HP QHS
t
Write command to 1st DQS latching transition
DQS input low (high) pulse width (write cycle)
DQS falling edge to CK setup time (write cycle)
DQS falling edge hold time from CK (write cycle)
Mode register set command cycle time
Write preamble
WL-0.25
0.35
0.2
WL+0.25
WL-0.25
0.35
0.2
WL+0.25
t
t
t
t
t
t
t
t
t
DQSS
CK
CK
CK
CK
CK
CK
CK
CK
t
-
-
DQSL,H
t
-
-
DSS
t
0.2
-
0.2
-
DSH
t
2
-
-
2
-
-
MRD
t
0.35
0.40
0.9
0.35
0.40
0.9
WPRE
t
Write postamble
0.60
1.1
0.60
70000
-
0.60
1.1
0.60
70000
-
10
9
WPST
t
Read preamble
RPRE
t
Read postamble
0.40
45
0.40
45
9
RPST
CK
ns
t
Active to Precharge command
11
RAS
t
Active to Active/Auto-Refresh command period
Auto-Refresh to Active/Auto-Refresh command period
60
57
ns
ns
RC
t
75
-
75
-
12
13
RFC
RCD
Active to Read or Write delay
t
15
-
12
-
ns
(with and without Auto-Precharge)
Page 77
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INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
7.2 Timing Parameter by Speed Grade - DDR2-667
(V
DDQ
= 1.8V ± 0.1V; V
DD
= 1.8V ± 0.1V) (notes 1-4)
-3S
-3
DDR2-667-555
DDR2-667-444
Notes
Symbol
Parameter
Unit
min.
max
min.
max
t
Precharge command period
15
-
-
12
-
ns
ns
RP
Active bank A to Active bank B
command period
x4, x8 & x16
t
t
7.5
7.5
-
RRD
(1k page size)
CAS A to CAS B Command Period
Write recovery time
2
15
2
15
t
t
CCD
CK
ns
t
-
-
-
-
-
-
-
-
WR
t
Auto-Precharge write recovery + precharge time
Internal Write to Read command delay
WR+tRP
7.5
WR+tRP
7.5
14
15
DAL
CK
ns
t
WTR
t
Internal Read to Precharge command delay
7.5
7.5
ns
RTP
Exit power down to any valid command
(other than NOP or Deselect)
t
2
6 - AL
2
-
-
2
6 - AL
2
-
-
t
t
16
16
XARD
CK
Exit active power-down mode to Read command
(slow exit, lower power)
t
XARDS
CK
CK
Exit precharge power-down to any valid command
(other than NOP or Deselect)
t
-
-
-
-
t
t
XP
t
t
Exit Self-Refresh to read command
200
200
XSRD
XSNR
CK
ns
Exit Self-Refresh to non-Read command
tRFC+10
tRFC+10
tCKE CKE minimum high and low pulse width
3
-
3
-
t
CK
µs
o
o
0 C - 85 C
7.8
3.9
12
7.8
3.9
12
t
Average periodic refresh Interval
OCD drive mode output delay
19
17
REFI
o
o
85 C - 95 C
-
-
µs
ns
t
0
0
OIT
Minimum time clocks remain ON after CKE asynchro-
nously drops LOW
t
tIS+tCK+tIH
-
tIS+tCK+tIH
-
ns
DELAY
Timing that is not specified is illegal and after such an event, in order to guarantee proper operation, the DRAM must be powered down
and then restarted through the specified initialization sequence before normal operation can continue.
Page 78
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INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
7.3 ODT AC Electrical Characteristics and Operating Conditions (all speed bins)
Parameter / Condition
Symbol
min.
max.
2
Units Notes
t
ODT turn-on delay
2
tAC(min)
tAC(min)
tAC(min) + 2 ns
2.5
t
AOND
CK
ns
-400 & -533
-667
tAC(max) + 1 ns
tAC(max) + 0.7 ns
20
t
ODT turn-on
AON
t
ODT turn-on (Power-Down Modes)
ODT turn-off delay
2 t
CK
+ tAC(max) + 1 ns
2.5
ns
AONPD
t
t
AOFD
CK
ns
t
ODT turn-off
tAC(min)
tAC(min) + 2 ns
3
tAC(max) + 0.6 ns
21
AOF
AOFPD
t
ODT turn-off (Power-Down Modes)
ODT to Power Down Mode Entry Latency
ODT Power Down Exit Latency
2.5 t
+ tAC(max) + 1 ns
ns
CK
t
-
-
t
t
ANPD
CK
t
8
AXPD
CK
Page 79
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INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
7.4 Notes for Electrical Characteristics & AC Timing
1. Timings are guaranteed with CK/CK differential slew rate of 2.0 V/ns. For DQS signals timings are guaranteed with a dif-
ferential slew rate of 2.0 V/ns in differential strobe mode and a slew rate of 1 V/ns in single ended mode. For other slew
rates see Section 8 of this datasheet.
2. The CK / CK input reference level (for timing reference to CK / CK) is the point at which CK and CK cross.
The DQS / DQS,RDQS/ RDQS, input reference level is the crosspoint when in differential strobe mode;
The input reference level for signals other than CK/CK, DQS / DQS, RDQS / RDQS, tIS, tiH, tDS, tDH is VREF.
For tIS, tiH, tDS, tDH input reference levels see section 8.3 of this datasheet
3. Inputs are not recognized as valid until VREF stabilizes. During the period before VREF stabilizes, CKE = 0.2 x VDDQ is
recognized as LOW.
4. The output timing reference voltage level is VTT. See section 8 for the reference load for timing measurements.
5. Min (tCL, tCH) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device
(i.e. this value can be greater than the minimum specification limits for tCL and tCH.
6. For input frequency change during DRAM operation, see the 2.11 section of this datasheet.
7. For timing definition, slew rate and slew rate derating see Section 8.3
8. For timing definition, slew rate and slew rate derating see Section 8.3
9. The tHZ, tRPST and tLZ, tRPRE parameters are referenced to a specific voltage level, which specify when the device out-
put is no longer driving (tHZ, tRPST), or begins driving (tLZ, tRPRE). tHZ and tLZ transitions occur in the same access
time windows as valid data transitions.These parameters are verified by design and characterization, but not subject to
production test.
10. The maximum limit for this parameter is not a device limit. The device operate with a greater value for this parameter, but
system performance (bus turnaround) degrades accordingly.
11. tRAS(max) is calculated from the maximum amount of time a DDR2 device can operate without a Refresh command
which is equal to 9 * tREFI
12. A maximum of eight Auto-Refresh commands can be posted to any given DDR2 SDRAM device.
13. The tRCD timing parameter is valid for both activate command to read or write command with and without Auto-Precharge.
Therefore a separate parameter tRAP for activate command to read or write command with Auto-Precharge is not neces-
sary anymore.
14. For each of the terms, if not already an integer, round to the next highest integer. tCK refers to the application clock period.
WR refers to the WR parameter stored in the MRS.
15. tWTR is at least two clocks independent of operation frequency.
16. User can choose two different active power-down modes for additional power saving via MRS address bit A12.
In “standard active power-down mode” (MRS, A12 = “0”) a fast power-down exit timing tXARD can be used. In “low active
power-down mode” (MRS, A12 =”1”) a slow power-down exit timing tXARDS has to be satisfied.
17. The clock frequency is allowed to change during self-refresh mode or precharge power-down mode. In case of clock fre-
quency change during power-down, a specific procedure is required as describes in section 2.12.
18. Consists of data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers as well as
output slew rate mis-match between DQS / DQS and associated DQ in any given cycle.
19. The Auto-Refresh command interval has be reduced to 3.9 µs when operating the DDR2 DRAM in a temperature range
between 85oC and 95oC.
20. ODT turn on time min. is when the device leaves high impedance and ODT resistance begins to turn on.
ODT turn on time max is when the ODT resistance is fully on. Both are measure from tAOND.
21. ODT turn off time min. is when the device starts to turn off ODT resistance
ODT turn off time max is when the bus is in high impedance. Both are measured from tAOFD.
Page 80
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INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
8. Reference Loads, Setup & Hold Timing Definition and Slew Rate Derating
8.1 Reference Load for Timing Measurements
The figure represents the timing reference load used in defining the relevant timing parameters of the device. It is
not intended to either a precise representation of the typical system environment nor a depiction of the actual load
presented by a production tester. System designers should use IBIS or other simulation tools to correlate the tim-
ing reference load to a system environment. Manufacturers correlate to their production test conditions, generally
a coaxial transmission line terminated at the tester electronics. This reference load is also used for output slew
rate characterization.
VDDQ
DQ
DQS
CK, CK
DQS
DUT
Vtt = VDDQ / 2
RDQS
RDQS
25 Ohm
Timing Reference Points
The output timing reference voltage level for single ended signals is the crosspoint with VTT.
The output timing reference voltage level for differential signals is the crosspoint of the true (e.g. DQS) and the
complement (e.g. DQS) signal.
8.2 Slewrate Measurements
8.2.1 Output Slewrate
With the reference load for timing measurements output slew rate for falling and rising edges is measured
between VTT - 250 mV and VTT + 250 mV for single ended signals.For differential signals (e.g. DQS / DQS) out-
put slew rate is measured between DQS - DQS = - 500 mV and DQS - DQS = + 500 mV. Output slew rate is veri-
fied by design and characterisation, but not tested during production.
8.2.2 Input Slewrate - Differential signals
Input slewrate for differential signals (CK / CK, DQS / DQS, RDQS / RDQS) for rising edges are measured from
f.e. CK - CK = -250 mV to CK - CK = + 500 mV and from CK - CK = +250 mV to CK - CK = - 500mV for falling
edges.
8.2.3 Input Slewrate - Single ended signals
Input slew rate for single ended signals (other than tis, tih, tds and tdh) are measured from dc-level to ac-level:
VREF -125 mV to VREF + 250 mV for rising edges and from VREF + 125 mV to VREF - 250 mV for falling edges.
For slew rate definition of the input and data setup and hold parameters see section 8.3 of this datasheet.
Page 81
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INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
8.3 Input and Data Setup and Hold Time
8.3.1 Timing Definition for Input Setup (tIS) and Hold Time (tIH)
Address and control input setup time (tIS) is referenced from the input signal crossing at the VIH(ac) level for a ris-
ing signal and VIL(ac) for a falling signal applied to the device under test. Address and control input hold time (tIH)
is referenced from the input signal crossing at the VIL(dc) level for a rising signal and VIH(dc) for a falling signal
applied to the device under test..
CK
CK
t
t
t
t
IS
IH
IS IH
V
V
V
V
V
V
V
DDQ
IH(ac)
IH(dc)
REF
min
min
max
max
IL(dc)
IL(ac)
SS
8.3.2 Timing Definition for Data Setup (tDS) and Hold Time (tDH)
Data input setup time (tDS) with differential data strobe enabled MR[bit10]=0, is referenced from the input signal
crossing at the VIH(ac) level to the differential data strobe crosspoint for a rising signal, and from the input signal
crossing at the VIL(ac) level to the differential data strobe crosspoint for a falling signal applied to the device under
test. DQS/DQS signals must be monotonic between VIL(dc)max and VIH(dc)min. Data input hold time (tDH) with
differential data strobe enabled MR[bit10]=0, is referenced from the input signal crossing at the VIL(dc) level to the
differential data strobe crosspoint for a rising signal and VIH(dc) to the differential data strobe crosspoint for a fall-
ing signal applied to the device under test. DQS/DQS signals must be monotonic between VIL(dc)max and
VIH(dc)min.
Data input setup time (tDS) with single-ended data strobe enabled MR[bit10]=1, is referenced from the input sig-
nal crossing at the VIH(ac) level to the data strobe crossing VREF for a rising signal, and from the input signal
crossing at the VIL(ac) level to the single-ended data strobe crossing VREF for a falling signal applied to the
device under test. Data input hold time (tDH) with single-ended data strobe enabled MR[bit10]=1, is referenced
from the input signal crossing at the VIL(dc) level to the single-ended data strobe crossing VREF for a rising signal
and VIH(dc) to the single-ended data strobe crossing VREF for a falling signal applied to the device under test.
DQS
Differential Input
Waveform
DQS
DQS
Single-ended Input
Waveform
REF
V
t
t
t
t
DS DH
DS DH
V
V
V
V
V
V
V
DDQ
IH(ac)
IH(dc)
REF
min
min
max
max
IL(dc)
IL(ac)
SS
Page 82
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
8.3.3 Slew Rate Definition for Input and Data Setup and Hold Times
Setup (tIS & tDS) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of
VREF(dc) and the first crossing of VIH(ac)min. Setup (tIS & tDS) nominal slew rate for a falling signal is defined as
the slew rate between the last crossing of VREF(dc) and the first crossing of VIL(ac)max. If the actual signal is
always earlier than the nominal slew rate line between shaded ‘VREF(dc) to ac region’, use nominal slew rate for
derating value (see fig. A). If the actual signal is later than the nominal slew rate line anywhere between shaded
‘VREF(dc) to ac region’, the slew rate of a tangent line to the actual signal from the ac level to dc level is used for
derating value.(see fig.B)
Hold (tIH & tDH) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of
VIL(dc)max and the first crossing of VREF(dc). Hold (tIH & tDH) nominal slew rate for a falling signal is defined as
the slew rate between the last crossing of VIH(dc)min and the first crossing of VREF(dc). If the actual signal is
always later than the nominal slew rate line between shaded ‘dc to VREF region’, use nominal slew rate for derat-
ing value (see fig. A). If the actual signal is earlier than the nominal slew rate line anywhere between shaded ‘dc to
VREF(dc) region’, the slew rate of a tangent line to the actual signal from the dc level to VREF level is used for
derating value (see fig.B).
CK, CK for tIS and tIH
DQS, DQS for tDS and tDH
CK, CK for tIS and tIH
DQS, DQS for tDS and tDH
t
t
t
t
IH
IS
IS IH
t
t
t
IH
t
IH
IS
IS
t
t
t
t
DS
DH
DS DH
t
t
t
DH
DH
t
DS
DS
V
V
V
V
V
DDQ
DDQ
min
min
IH(ac)
IH(dc)
min
min
IH(ac)
IH(dc)
VREF to ac
region
VREF to ac
region
V
dc to VREF
dc to Vref
region
region
V
REF
V
REF
dc to VREF
region
dc to Vref
region
V
V
max
max
V
V
IL(dc)
max
max
IL(dc)
IL(ac)
VREF to ac
region
VREF to ac
region
IL(ac)
V
V
SS
SS
Delta TFH
Delta TFS
tangent line
nominal line
Delta TRH Delta TRS
Delta TFS
Delta TRH Delta TRS
Delta TFH
VREF(dc) - VIL(ac)max
Delta TFS
tangent line [VREF(dc) - VIL(ac)max]
Delta TFS
falling
signal
falling signal
rising signal
Setup Slew Rate =
Setup Slew Rate =
Setup Slew Rate =
Setup Slew Rate =
VIH(ac)min - VREF(dc)
Delta TRS
tangent line [VIH(ac)min - VREF(dc)]
Delta TRS
rising
signal
VREF(dc)-VIL(dc)max
Delta TRH
tangent line [VREF(dc) - VIL(dc)max]
Delta TRH
rising
signal
rising signal
falling signal
Hold Slew Rate
Hold Slew Rate
=
=
Hold Slew Rate
Hold Slew Rate
=
=
VIH(dc)min - VREF(dc)
Delta TFH
tangent line [VIH(dc)min - VREF(dc)]
Delta TFH
falling
signal
fig. A
fig. B
Page 83
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
8.3.4 Input Setup (tIS) and Hold (tIH) Time Derating Table
CK, CK Differential Slew Rate
1.5 V/ns
2.0 V/ns
1.0 V/ns
∆ tIS
∆ tIH
∆ tIS
+217
+209
+197
+180
+155
+113
+30
+19
+5
-13
-37
∆ tIH
+124
+119
+113
+105
+75
+51
+30
+16
-1
-24
-53
-95
-158
-262
-345
-470
-678
-1095
∆ tIS
+247
+239
+227
+210
+185
+143
+60
+49
+35
+17
-7
∆ tIH
+154
+149
+143
+135
+105
+81
+60
+46
+29
+6
Unit
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.25
0.2
0.15
0.1
+187
+179
+167
+150
+125
+83
0
-11
-25
-43
+94
+89
+83
+75
+45
+21
0
-14
-31
-54
-83
-125
-188
-292
-375
-500
-708
-1125
-67
-23
-65
-110
-175
-285
-350
-525
-800
-1450
-80
-50
-145
-255
-320
-495
-770
-1420
-115
-225
-290
-465
-740
-1390
-128
-232
-315
-440
-648
-1065
1. For all input signals the total tIS (input setup time) and tIH (input hold time) required is calculated by adding the individual
datasheet value to the derating value listed in the previous table.
2. For slow slewrate the total setup time might be negativ (i.e. a valid input signal will not have reached VIH(ac) / VIL(ac) at the
time of the rising clock) a valid input signal is still required to complete the transistion and reach VIH(ac) / VIL(ac). For slew
rates in between the values listed in the next tables, the derating values may be obtained by linear interpolation. These val-
ues are not subject to production test. They are verified only by design and characterisation.
8.3.5 Data Setup (tDS) and Hold Time (tDH) Derating Tablefor differential DQS / DQS
DQS, DQS Differential Slew Rate
4.0 V/ns
3.0 V/ns
2.0 V/ns
1.8 V/ns
1.6 V/ns
1.4 V/ns
1.2 V/ns
1.0 V/ns
0.8 V/ns
∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH Unit
-
-
2.0 +125 +45 +125 +45 +125 +45
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ps
ps
ps
ps
ps
ps
1.5 +83 +21 +83 +21 +83 +21 +95 +33
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0
-
-
-
-
-
-
0
-
-
-
-
-
-
0
0
0
0
+12 +12 +24 +24
-11 -14 -11 -14 +1
-2 +13 +10 +25 +22
-25 -31 -13 -19 -1
-
-
-
-
-
-
-
-
-
-
-7 +11 +5 +23 +17
-31 -42 -19 -30 -7 -18 +5
-43 -49 -31 -47 -19 -35 -7
-
-
-
-
-
-
-
-
-6 +17 +6
-
-
-
-
-
-
-23 +5 -11 ps
-74 -89 -62 -77 -50 -65 -38 -53 ps
-127 -140 -115 -128 -103 -116 ps
-
-
-
-
-
-
1. For all input signals the total tDS (setup time) and tDH (hold time) required is calculated by adding the individual datasheet value to the der-
ating value listed in the previous table.
2. For slow slewrate the total setup time might be negativ (i.e. a valid input signal will not have reached VIH(ac) / VIL(ac) at the time of the ris-
ing DQS) a valid input signal is still required to complete the transistion and reach VIH(ac) / VIL(ac). For slew rates in between the values
listed in the next tables, the derating values may be obtained by linear interpolation. These values are not subject to production test. They
are verified only by design and characterisation.
Page 84
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
8.4 Overshoot and Undershoot Specification
8.4.1 AC Overshoot / Undershoot Specification for Address and Control Pins
DDR2
-400
DDR2
-533
DDR2
-667
Parameter
Units
Maximum peak amplitude allowed for overshoot area
Maximum peak amplitude allowed for undershoot area
Maximum overshoot area above VDD
0.9
0.9
0.9
V
0.9
0.9
0.9
V
0.75
0.75
0.56
0.56
0.45
0.45
V.ns
V.ns
Maximum undershoot area below VSS
Maximum Amplitude
Overshoot Area
Undershoot Area
VDD
VSS
Maximum Amplitude
Time (ns)
8.4.2 AC Overshoot / Undershoot Specification for Clock, Data, Strobe and Mask Pins
DDR2
-400
DDR2
-533
DDR2
-667
Parameter
Units
Maximum peak amplitude allowed for overshoot area
Maximum peak amplitude allowed for undershoot area
Maximum overshoot area above VDDQ
0.9
0.9
0.9
V
0.9
0.9
0.9
V
0.38
0.38
0.28
0.28
0.23
0.23
V.ns
V.ns
Maximum undershoot area below VSSQ
Maximum Amplitude
Overshoot Area
Undershoot Area
VDDQ
VSSQ
Maximum Amplitude
Time (ns)
Page 85
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
9. Package Dimensions
60 balls FBGA-Package
10, 5 mm x 10,0 mm
MO-207 Variation DJ-z (x4,x8)
0,8
0,8
TOP VIEW
(see balls through package)
0,45
+
0,05
-
6.4
10,0
84 balls FBGA-Package
12,5 mm x 10,0 mm
0,8
MO-207 Variation DK-z (x16)
0,8
TOP VIEW
0,45
(see balls through package)
+
0,05
-
6.4
10,0
Page 86
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
10. DDR2 Component Nomenclature
1
2
3
4
5
6
7
8
9
H Y B 1 8
T
2 5 6 4 0
0
A
- 5
C
Example :
INFINEON
0 = standard
1
2
HYB for DRAM Components
18 = 1.8 V Power Supply
6
7
Product Variations
Die Revision
Component Prefix
2 = two dies in one package
A = 1st Generation
B = 2nd Generation
C = 3rd Generation
C = BGA package
F = BGA package (lead and
halogen free)
-5 = DDR2-400-333
-3.7 = DDR2-533-444
-3 = DDR2-667-444
-3S = DDR2-667-555
Power Supply Voltage
DRAM Technology
3
4
5
T = DDR2
8
Package Type
Speed Grade
256 = 256 Mb
512 = 512 Mb
1G = 1024 Mb
2G = 2048 Mb
40 = x4, 4 data in/outputs
80 = x8, 8 data in/outputs
16 = x16, 16 data in/outputs
Memory Density
9
Memory Organisation
Page 87
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
11. Content
1.
Description
1.1 Ordering Information
1.2 Pin Description
1.3 DDR2 SDRAM Addressing
1.4 Package Pinouts
1.5 Input / Output Functional Description
1.6 Block Diagrams
2.
Functional Description
2.1 Simplified State Diagram
2.2 Basic Functionality
2.2.1 Power-On and Initialization
2.2.2 Programming the Mode Registers
2.2.3 Mode Register Set (MRS)
2.2.4 Extended Mode Register Set (EMRS(1))
2.2.5 Extended Mode Register Set (EMRS(2))
2.2.6 Extended Mode Register Set (EMRS(3))
2.3 Off-Chip Driver (OCD) Impedance Adjustment
2.4 ODT On-Die Active Termination
2.5 Bank Activate Command
2.6 Read and Write Command
2.6.1 Posted CAS
2.6.2 Burst Mode Operation
2.6.3 Burst Read Operation
2.6.4 Burst Write Operation
2.6.5 Write Data Mask
2.6.6 Burst Interruption
2.7 Precharge Command
2.7.1 Burst Read Operation followed by a Precharge
2.7.2 Burst Write Operation followed by a Precharge
2.8 Auto-Precharge Command
2.8.1 Read with Auto-Precharge
2.8.2 Write with Auto-Precharge
2.8.3 Read or Write to Precharge Command Spacing Summary
2.8.4 Concurrent Auto-Precharge
2.9 Refresh Commands
2.9.1 Auto-Refresh Command
2.9.2 Self-Refresh Command
2.10 Power-Down
2.11 Other Commands
2.11.1 No Operation
2.11.2 Deselect
2.12 Input Clock Frequency Change
2.13 Asynchronous CKE Low Event
3.
4.
Truth Tables
3.1 Command Truth Table
3.2 Clock Enable (CKE) Truth Table
3.3 Data Mask (DM) Truth Table
Operating Conditions
4.1 Absolute Maximum Ratings
4.2 DRAM Component Operating Temperature Range
Page 88
Rev. 1.02 May 2004
INFINEON Technologies
HYB18T256400/800/160AF
256Mb DDR2 SDRAM
Content
5.
AC & DC Operation Conditions
5.1 DC Operation Conditions
5.1.1 Recommended DC Operation Conditions
5.1.2 ODT DC Operation Conditions
5.1.3 Input and Output Leakage Current
5.2 DC & AC Logic Input Levels
5.2.1 Single-ended DC & AC Logic Input Levels)
5.2.2 Single-ended AC Input Test Conditions
5.2.3 Differential DC and AC Input and Output Logic Levels
5.3 Output Buffer Levels
5.3.1 Output DC Current Drive
5.3.2 Output AC Test Conditions
5.3.4 Default Output V-I Characteristics
5.3.5 Full Strength Pull-up Driver Characteristics
5.3.6 Full Strength Pull-down Driver Characteristics
5.3.7 Calibrated Output Driver V-I Characteristics
5.4 Input/Output Capacitances
5.5 Power & Ground Clamp V-I Characteristics
6.
7.
IDD Specifications
6.1 IDD Specifications
6.2 IDD Measurement Conditions
6.2 ODT current
AC Timing Specifications
7.1 Timing parameters by speed grade - DDR2-400 & DDR2-533
7.2 Timing parameters by speed grade - DDR2-667
7.3 ODT AC Electrical Characteristics and Operating Conditions
7.4 Notes for AC Timing Specifications
8.
Reference Loads, Slew Rates and Slew Rate Derating
8.1 Reference Load for Timing Measurements
8.2 Output Slew Rate Measurements
8.3 Input and Data Setup and Hold Time
8.3.1 Timing Definition for Input Setup and Hold Time
8.3.2 Timing Definition for Data Setup and Hold Time
8.3.3 Slew Rate Definition for Input and Data Setup and Hold Time
8.3.4 Input Setup and Hold Time Derating Table
8.3.5 Data Setup and Hold Time Derating Table
8.4 Overshoot and Undershoot Specification
9.
Package Dimensions
10. DDR2 component nomenclature
Page 89
Rev. 1.02 May 2004
INFINEON Technologies
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