CY25561SXC [INFINEON]

1-Output Programmable Spread Spectrum Clock Generator;
CY25561SXC
型号: CY25561SXC
厂家: Infineon    Infineon
描述:

1-Output Programmable Spread Spectrum Clock Generator

时钟 光电二极管 外围集成电路 晶体
文件: 总13页 (文件大小:290K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CY25561  
Spread Spectrum Clock Generator  
Spread Spectrum Clock Generator  
This reduction in radiated energy can significantly reduce the  
cost of complying with regulatory requirements and time to  
market without degrading the system performance.  
Features  
50 to 166 MHz operating frequency range  
Wide range of spread selections: 9  
Accepts clock and crystal inputs  
CY25561 is a very simple and versatile device to use. The  
frequency and spread percentage range is selected by  
programming S0 and S1 digital inputs. These inputs use three  
logic states including high (H), low (L), and middle (M) logic  
levels to select one of the nine available spread percentage  
ranges. Refer to Frequency and Spread Percentage Selection  
(Center Spread) on page 3 for programming details.  
Low power dissipation  
70 mW - Typ at 66 MHz  
Frequency spread disable function  
Center spread modulation  
Low cycle-to-cycle jitter  
CY25561 is intended for use with applications with a reference  
frequency in the range of 50 to 166 MHz.  
A wide range of digitally selectable spread percentages is made  
possible by using tri-level (high, low, and middle) logic at the S0  
and S1 digital control inputs.  
8-pin SOIC Package  
Functional Description  
The output spread (frequency modulation) is symmetrically  
centered on the input frequency.  
CY25561 is a spread spectrum clock generator (SSCG) IC used  
to reduce electromagnetic Interference (EMI) found in today’s  
high speed digital electronic systems.  
Spread spectrum clock control (SSCC) function enables or  
disables the frequency spread and is provided for easy  
comparison of system performance during EMI testing.  
CY25561 uses a Cypress proprietary phase-locked loop (PLL)  
and spread spectrum clock (SSC) technology to synthesize and  
frequency modulate the input frequency of the reference clock.  
By doing this, the measured EMI at the fundamental and  
harmonic frequencies of clock (SSCLK) is reduced.  
CY25561 is available in an eight-pin SOIC package with a 0 °C  
to 70 °C operating temperature range.  
For a complete list of related documentation, click here.  
Logic Block Diagram  
300 K  
REFERENCE  
DIVIDER  
Xin/  
CLK  
1
8
Loop  
Filter  
PD  
CP  
Xout  
MODULATION  
CONTROL  
FEEDBACK  
DIVIDER  
vco  
VDD  
VSS  
2
3
INPUT  
DECODER  
LOGIC  
DIVIDER  
&
MUX  
4
SSCLK  
VDD  
VDD  
20K  
20K  
20K  
VSS  
20K  
VSS  
7
5
6
SSCC  
S1  
S0  
Note: Refer to the CY25560 data sheet for operation at frequencies from 25 to100 MHz.  
Cypress Semiconductor Corporation  
Document Number: 38-07242 Rev. *K  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 8, 2018  
CY25561  
Contents  
Pin Configuration .............................................................3  
Pin Definitions ..................................................................3  
Frequency and Spread Percentage Selection  
Ordering Information ........................................................9  
Ordering Code Definitions ...........................................9  
Package Drawing and Dimensions ...............................10  
Acronyms ........................................................................11  
Document Conventions .................................................11  
Units of Measure .......................................................11  
Document History Page .................................................12  
Sales, Solutions, and Legal Information ......................13  
Worldwide Sales and Design Support .......................13  
Products ....................................................................13  
PSoC® Solutions ......................................................13  
Cypress Developer Community .................................13  
Technical Support .....................................................13  
(Center Spread) .................................................................3  
Tri-level Logic ...................................................................4  
SSCG Theory of Operation ..............................................4  
EMI ..............................................................................4  
SSCG ..........................................................................4  
Modulation Rate ..........................................................5  
CY25561 Application Schematic .....................................6  
Absolute Maximum Ratings ............................................7  
DC Electrical Characteristics ..........................................7  
Thermal Resistance ..........................................................7  
XIN/CLK DC Specifications ..............................................8  
Electrical Timing Characteristics ....................................8  
Document Number: 38-07242 Rev. *K  
Page 2 of 13  
CY25561  
Pin Configuration  
Figure 1. 8-pin SOIC pinout  
1
2
3
4
8
XIN/CLK  
VDD  
XOUT  
7 S0  
CY25561  
6
5
S1  
VSS  
SSCC  
SSCLK  
Pin Definitions  
Pin  
Name  
Type  
Description  
1
XIN / CLK  
I
Clock or crystal connection input. Refer to Frequency and Spread Percentage Selection  
(Center Spread) for input frequency range selection.  
2
3
4
5
VDD  
VSS  
P
P
O
I
Positive power supply  
Power supply ground  
Modulated clock output  
SSCLK  
SSCC  
Spread spectrum clock control (enable/disable) function. SSCG function is enabled when  
input is high and disabled when input is low. This pin is pulled high internally.  
6
7
8
S1  
S0  
I
I
Tri-level logic input control pin used to select frequency and bandwidth. Frequency/Bandwidth  
selection and tri-level logic programming. See Figure 2. Pin 6 has internal resistor divider  
network to VDD and VSS. Refer to Logic Block Diagram on page 1.  
Tri-level logic input control pin used to select frequency and bandwidth. Frequency/Bandwidth  
selection and tri-level logic programming. See Figure 2. Pin 7 has internal resistor divider  
network to VDD and VSS. Refer to Logic Block Diagram on page 1.  
XOUT  
O
Oscillator output pin connected to crystal. Leave this pin unconnected If an external clock  
drives XIN / CLK.  
Frequency and Spread Percentage Selection (Center Spread)  
50–100 MHz (Low Range)  
Input  
Frequency  
(MHz)  
S1=M  
S0=M  
(%)  
4.3  
4.0  
S1=M  
S0=0  
(%)  
3.9  
3.6  
S1=1  
S0=0  
(%)  
3.3  
3.1  
S1=0  
S0=0  
(%)  
2.9  
2.6  
S1=0  
S0=M  
(%)  
2.7  
2.5  
Select the  
Frequency and  
Center Spread %  
desired and then  
set S1, S0 as  
indicated.  
50–60  
60–70  
70–80  
3.8  
3.4  
2.9  
2.5  
2.4  
80–100  
3.5  
3.1  
2.7  
2.2  
2.1  
100–166 MHz (High Range)  
Input  
Frequency  
(MHz)  
100–120  
120–130  
130–140  
140–150  
150–166  
S1=1  
S0=M  
(%)  
3.0  
2.7  
2.6  
2.6  
2.5  
S1=0  
S0=1  
(%)  
2.4  
2.1  
2.0  
S1=1  
S0=1  
(%)  
1.5  
1.4  
1.3  
S1=M  
S0=1  
(%)  
1.3  
1.1  
1.1  
1.1  
1.0  
Select the  
Frequency and  
Center Spread %  
desired and then  
set S1, S0 as  
indicated.  
2.0  
1.8  
1.3  
1.2  
Document Number: 38-07242 Rev. *K  
Page 3 of 13  
CY25561  
Tri-level Logic  
With binary logic, four states can be programmed with two control lines, whereas tri-level logic can program nine logic states using  
two control lines. Tri-level logic in CY25561 is implemented by defining a third logic state in addition to the standard logic “1” and “0”.  
Pins 6 and 7 of CY25561 recognize a logic state by the voltage applied to the respective pin. These states are defined as “0” (low),  
“M” (middle), and “1” (one). Each of these states has a defined voltage range that is interpreted by CY25561 as a “0,” “M,” or “1” logic  
state. Refer to DC Electrical Characteristics on page 7 for voltage ranges for each logic state. CY25561 has two equal value resistors  
connected internally to pin 6 and pin 7 that produce the default “M” state. Pins 6 and/or 7 can be tied directly to ground or VDD to  
program a logic “0” or “1” state, respectively. Refer to Figure 2 for examples.  
Figure 2. Tri-level Logic Examples  
VDD  
VDD  
CY25561  
CY25561  
S0 = "1"  
CY25561  
S0  
S0  
S0  
S1  
S0 = "M" (N/C)  
7
6
7
6
7
6
5
S0 = "1"  
S1 = "0" (GND)  
SSCC = "1"  
S1  
S1  
S1 = "0" (GND)  
SSCC = "1"  
S1 = "1"  
VDD  
VDD  
5
SSCC = "1"  
5
peak and cycle-to-cycle. CY25561 takes a narrow band digital  
reference clock in the range of 50 to166 MHz and produces a  
clock that sweeps between a controlled start and stop frequency  
and precise rate of change. To understand what happens to a  
clock when SSCG is applied, consider a 65 MHz clock with a 50  
percent duty cycle, as shown in the following figure:  
SSCG Theory of Operation  
CY25561 is a PLL-type clock generator using a proprietary  
Cypress design. By precisely controlling the bandwidth of the  
output clock, CY25561 becomes a low-EMI clock generator. The  
theory and detailed operation of CY25561 is discussed in the  
following sections.  
EMI  
50 %  
50 %  
All digital clocks generate unwanted energy in their harmonics.  
Conventional digital clocks are square waves with a duty cycle  
that is very close to 50 percent. Because of this 50/50 duty cycle,  
digital clocks generate most of their harmonic energy in odd  
harmonics, that is; third, fifth, seventh, etc. The amount of energy  
contained in the fundamental and odd harmonics can be reduced  
by increasing the bandwidth of the fundamental clock frequency.  
Conventional digital clocks have a very high Q factor; all the  
energy at that frequency is concentrated in a very narrow  
bandwidth, and consequently, higher energy peaks. Regulatory  
agencies test electronic equipment by the amount of peak  
energy radiated from the equipment. By reducing the peak  
energy at the fundamental and harmonic frequencies, the  
equipment under test is able to satisfy agency requirements for  
EMI. Conventional methods of reducing EMI use shielding,  
filtering, multilayer PCBs, etc. CY25561 uses the approach of  
reducing the peak energy in the clock by increasing the clock  
bandwidth, and lowering the Q.  
Clock frequency = fc = 65 MHz  
Clock period = Tc =1/65 MHz = 15.4 ns  
Tc = 15.4 ns  
If this clock is applied to the Xin/CLK pin of CY25561, the output  
clock at pin 4 (SSCLK) sweeps back and forth between two  
frequencies. These two frequencies, F1 and F2, are used to  
calculate total amount of spread or bandwidth applied to the  
reference clock at pin 1. As the clock is making the transition from  
F1 to F2, the amount of time and sweep waveform play a very  
important role in the amount of EMI reduction realized from an  
SSCG clock.  
The modulation domain analyzer is used to visualize the sweep  
waveform and sweep period. Figure 4 on page 6 shows the  
modulation profile of a 65 MHz SSCG clock. Notice that the  
actual sweep waveform is not a simple sine or sawtooth  
waveform. Figure 4 on page 6 also shows a scan of the same  
SSCG clock using a spectrum analyzer. In this scan, you can see  
a 6.48 dB reduction in the peak RF energy when using the SSCG  
clock.  
SSCG  
SSCG uses a patented technology of modulating the clock over  
a very narrow bandwidth and controlled rate of change, both  
Document Number: 38-07242 Rev. *K  
Page 4 of 13  
CY25561  
Modulation Rate  
Spectrum spread clock generators use frequency modulation (FM) to distribute energy over a specific band of frequencies. The  
maximum frequency of the clock (Fmax) and minimum frequency of the clock (Fmin) determine this band of frequencies. The time  
required to transition from Fmin to Fmax and back to Fmin is the period of the modulation rate, Tmod. Modulation rates of SSCG  
clocks are most commonly referred to in terms of frequency or Fmod = 1/Tmod.  
The input clock frequency, Fin, and the internal divider count, Cdiv, determine the modulation rate. In some SSCG clock generators,  
the selected range determines the internal divider count. In other SSCG clocks, the internal divider count is fixed over the operating  
range of the part. CY25561 has a fixed divider count, as shown in Figure 3.  
Figure 3. SSCG Clock, Part Number, Fin = 65 MHz  
Device  
Cdiv  
CY25561  
2332 (All Ranges)  
Example:  
Device =  
Fin  
Range =  
CY25561  
65 MHz  
S1 = 1, S0 = 0  
=
Then;  
Modulation Rate = Fmod = 65 MHz/2332 = 27.9 kHz.  
Modulation Profile  
Spectrum  
Analyzer  
Document Number: 38-07242 Rev. *K  
Page 5 of 13  
CY25561  
CY25561 Application Schematic  
Figure 4. Application Schematic  
VDD  
C3  
0.1 uF  
2
90 MHz Reference Clock  
VDD  
1
XIN/CLK  
XOUT  
4
SSCLK  
8
CY25561  
6
S1  
S0  
5
N/C = Logic "M" state  
7
VDD  
SSCC  
VSS  
3
The schematic in Figure 4 above demonstrates how CY25561 is configured in a typical application. This application is using a 90 MHz  
reference clock connected to pin 1. Because an external reference clock is used, pin 8 (XOUT) is left unconnected.  
Figure 4 shows that pin 6 has no connection, which programs the logic “M” state, due to the internal resistor divider network of  
CY25561. Programming a logic “0” state is as simple as connecting to logic ground, as shown on pin 7.  
With this configuration, CY25561 produces an SSCG clock that is at a center frequency of 90 MHz. Referring to DC Electrical  
Characteristics on page 7, range “M, 0” at 90 MHz generates a modulation profile that has a 3.1 percent peak-to-peak spread.  
Document Number: 38-07242 Rev. *K  
Page 6 of 13  
CY25561  
DC input voltage ................................. –0.5 V to V + 0.5 V  
Absolute Maximum Ratings  
DD  
Junction temperature ............................... –40 °C to +140 °C  
Operating temperature .................................... 0 °C to 70 °C  
Storage temperature ................................ –65 °C to +150 °C  
Static discharge voltage (ESD) .......................... 2,000 V min  
[1, 2]  
Exceeding maximum ratings  
may shorten the useful life of  
the device. User guidelines are not tested.  
Supply voltage (V ) ...................................–0.5 V to +6.0 V  
DD  
DC Electrical Characteristics  
V
= 3.3 V, T = 25 °C and C (Pin 4) = 15 pF, unless otherwise noted.  
DD  
A
L
Parameter  
Description  
Power supply range  
Input high voltage  
Input middle voltage  
Input low voltage  
Conditions  
Min  
Typ  
Max  
Unit  
V
V
±10%  
2.97  
3.3  
3.63  
DD  
V
S0 and S1 only.  
S0 and S1 only.  
S0 and S1 only.  
0.85 × V  
V
V
DD  
V
INH  
INM  
INL  
DD  
DD  
V
V
V
V
V
V
0.40 × V  
0.50 × V  
0.60 × V  
V
DD  
DD  
DD  
0.0  
2.4  
2.0  
0.0  
0.15 × V  
V
DD  
Output high voltage  
Output high voltage  
Output low voltage  
Output low voltage  
Input capacitance  
Input capacitance  
Input capacitance  
Power supply current  
Power supply current  
I
I
I
I
= 6 mA  
V
OH1  
OH2  
OL1  
OL2  
OH  
OH  
OH  
OH  
= 20 mA  
= 6 mA  
V
0.4  
1.2  
5
V
= 20 mA  
/ CLK (Pin 1)  
V
C
C
C
X
X
3
4
pF  
pF  
pF  
mA  
mA  
in1  
in2  
IN  
(Pin 8)  
6
8
10  
5
OUT  
S0, S1, SSCC (Pins 7, 6, 5)  
Fin = 65 MHz, CL = 0  
3
4
in2  
I
I
23  
48  
30  
60  
DD1  
DD2  
Fin = 166 MHz, CL = 0  
Thermal Resistance  
[3]  
Parameter  
Description  
Test Conditions  
8-pin SOIC  
Unit  
θ
Thermal resistance  
(junction to ambient)  
Test conditions follow standard test methods and  
procedures for measuring thermal impedance, in  
accordance with EIA/JESD51.  
131  
°C/W  
JA  
θ
Thermal resistance  
(junction to case)  
41  
°C/W  
JC  
Notes  
1. Operation at any absolute maximum rating is not implied.  
2. Single power supply: The voltage on any input or I/O pin cannot exceed the power pine during power-up.  
3. These parameters are guaranteed by design and are not tested.  
Document Number: 38-07242 Rev. *K  
Page 7 of 13  
CY25561  
X /CLK DC Specifications  
IN  
Parameter  
Description  
Input high voltage,  
Clock Input  
Conditions  
Min  
80  
86  
92  
Max  
Units  
V
F < 100 MHz  
F < 133 MHz  
F < 166 MHz  
% of V  
% of V  
% of V  
% of V  
IH(X)  
DD  
DD  
DD  
DD  
X
IN  
V
Input low voltage,  
Clock Input  
15  
IL(X)  
X
IN  
Electrical Timing Characteristics  
V
= 3.3 V, T = 25 5 °C and C = 15 pF, unless otherwise noted.  
DD  
A
L
Parameter  
Description  
Conditions  
= 3.3 V  
Min  
50  
1.1  
1.1  
30  
45  
Typ  
Max  
166  
1.7  
1.7  
70  
Unit  
MHz  
ns  
I
t
t
Input clock frequency range  
Clock rise time (Pin 4)  
Clock fall time (Pin 4)  
Input clock duty cycle  
Output clock duty cycle  
Cycle-to-Cycle jitter  
Cycle-to-Cycle jitter  
V
DD  
CLKFR  
RISE  
SSCLK1 @ 0.4 V–2.4 V  
SSCLK1 @ 0.4 V–2.4 V  
1.4  
1.4  
50  
ns  
FALL  
D
D
C
C
X
/ CLK (Pin 1)  
%
TYin  
TYout  
CJ1  
IN  
SSCLK1 (Pin 4)  
50  
55  
%
50 MHz–100 MHz, (S1 = M, S0 = M)  
100 MHz–166 MHz, (S1 = 1, S0 = M)  
150  
200  
225  
300  
ps  
ps  
CJ2  
Document Number: 38-07242 Rev. *K  
Page 8 of 13  
CY25561  
Ordering Information  
Part Number  
CY25561SXC  
Package Type  
8-pin SOIC, Pb-free  
8-pin SOIC – Tape and Reel, Pb-free  
Product Flow  
Commercial, 0 C to 70 C  
Commercial, 0 C to 70 C  
CY25561SXCT  
Ordering Code Definitions  
S
X
C
X
25561  
CY  
X = blank or T  
blank = Tube; T = Tape and Reel  
Temperature Grade:  
C = Commercial  
Pb-free  
Package Type:  
S = 8-pin SOIC  
Base Part Number  
Company ID: CY = Cypress  
Document Number: 38-07242 Rev. *K  
Page 9 of 13  
CY25561  
Package Drawing and Dimensions  
Figure 5. 8-pin SOIC (150 Mils) S0815/SZ815/SW815 Package Outline, 51-85066  
51-85066 *I  
Document Number: 38-07242 Rev. *K  
Page 10 of 13  
CY25561  
Acronyms  
Document Conventions  
Units of Measure  
Acronym  
Description  
EMI  
Electromagnetic Interference  
Printed Circuit Board  
Symbol  
°C  
Unit of Measure  
PCB  
PLL  
degree Celsius  
milliampere  
nanosecond  
percent  
Phase-Locked Loop  
mA  
ns  
%
SOIC  
SSC  
SSCC  
SSCG  
Small Outline Integrated Circuit  
Spread Spectrum Clock  
Spread Spectrum Clock Control  
Spread Spectrum Clock Generator  
pF  
V
picofarad  
volt  
Document Number: 38-07242 Rev. *K  
Page 11 of 13  
CY25561  
Document History Page  
Document Title: CY25561, Spread Spectrum Clock Generator  
Document Number: 38-07242  
Orig. of  
Change  
Submission  
Date  
Rev.  
ECN No.  
Description of Change  
**  
115369  
119443  
OXC  
RGL  
07/05/2002 New data sheet.  
*A  
10/17/2002 Updated Absolute Maximum Ratings:  
Updated details corresponding to “Supply Voltage”.  
Added “DC Input Voltage” and its corresponding details.  
Added “Junction Temperature” and its corresponding details.  
Added “Static Discharge Voltage (ESD)” and its corresponding details.  
12/27/2002 Updated Absolute Maximum Ratings:  
Added Note 2 and referred the same note in maximum ratings.  
2567245 PYG / KVM 09/16/2008 Updated Ordering Information (Updated part numbers).  
*B  
*C  
122694  
RBI  
/ AESA  
CXQ  
Updated Package Drawing and Dimensions:  
spec 51-85066 – Changed revision from *A to *C.  
Updated to new template.  
*D  
*E  
3187957  
3528781  
03/04/2011 Updated Package Drawing and Dimensions:  
spec 51-85066 – Changed revision from *C to *D.  
Completing Sunset Review.  
PURU  
02/21/2012 Removed Applications.  
Removed Benefits.  
Updated Ordering Information:  
No change in part numbers.  
Added Ordering Code Definitions.  
Updated Package Drawing and Dimensions:  
spec 51-85066 – Changed revision from *D to *E.  
Added Acronyms and Units of Measure.  
Updated to new template.  
Completing Sunset Review.  
*F  
3944833  
4198708  
PURU  
CINM  
03/26/2013 Updated Pin Definitions (Replaced “GND” with “V ” for Name of Pin 3).  
SS  
*G  
11/21/2013 Added XIN/CLK DC Specifications.  
Updated Package Drawing and Dimensions:  
spec 51-85066 – Changed revision from *E to *F.  
Updated to new template.  
*H  
*I  
4586478  
4708301  
AJU  
12/03/2014 Updated Functional Description:  
Added “For a complete list of related documentation, click here.” at the end.  
TAVA  
03/31/2015 Updated Package Drawing and Dimensions:  
spec 51-85066 – Changed revision from *F to *G.  
Completing Sunset Review.  
*J  
5278942  
6063808  
PSR  
05/20/2016 Added Thermal Resistance.  
Updated Package Drawing and Dimensions:  
spec 51-85066 – Changed revision from *G to *H.  
Updated to new template.  
*K  
PAWK  
02/08/2018 Updated Package Drawing and Dimensions:  
spec 51-85066 – Changed revision from *H to *I.  
Updated to new template.  
Completing Sunset Review.  
Document Number: 38-07242 Rev. *K  
Page 12 of 13  
CY25561  
Sales, Solutions, and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at Cypress Locations.  
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© Cypress Semiconductor Corporation, 2002-2018. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,  
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries  
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other  
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress  
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to  
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users  
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as  
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation  
of the Software is prohibited.  
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE  
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent  
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any  
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is  
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products  
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or  
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the  
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably  
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,  
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other  
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.  
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in  
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.  
Document Number: 38-07242 Rev. *K  
Revised February 8, 2018  
Page 13 of 13  

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