BTS410E2SMD [INFINEON]

Buffer/Inverter Based Peripheral Driver;
BTS410E2SMD
型号: BTS410E2SMD
厂家: Infineon    Infineon
描述:

Buffer/Inverter Based Peripheral Driver

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®
PROFET BTS 410 E2  
Smart Highside Power Switch  
Features  
Product Summary  
Overload protection  
Overvoltage protection  
Vbb(AZ)  
65  
V
Current limitation  
Short circuit protection  
Thermal shutdown  
Overvoltage protection (including load dump)  
Fast demagnetization of inductive loads  
Reverse battery protection  
Undervoltage and overvoltage shutdown with  
auto-restart and hysteresis  
V
4.7 ... 42 V  
Operating voltage  
On-state resistance  
Load current (ISO)  
Current limitation  
bb(on)  
R
ON  
220  
m  
I
I
1.8  
5
A
A
L(ISO)  
L(SCr)  
1
)
TO-220AB/5  
Open drain diagnostic output  
Open load detection in ON-state  
CMOS compatible input  
Loss of ground and loss of V protection  
Electrostatic discharge (ESD) protection  
5
5
bb  
5
1
1
Straight leads  
Standard  
SMD  
Application  
µC compatible power switch with diagnostic feedback for 12 V and 24 V DC grounded loads  
All types of resistive, inductive and capacitve loads  
Replaces electromechanical relays, fuses and discrete circuits  
General Description  
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic  
feedback, monolithically integrated in Smart SIPMOS technology. Fully protected by embedded protection  
functions.  
+ V  
bb  
3
Vo lta g e  
so urc e  
Ga te  
Ove rvo lta g e  
p ro te c tio n  
Curre nt  
lim it  
p ro te c tio n  
V
Logic  
OUT  
Lim it fo r  
unc la m p e d  
ind . lo a d s  
Cha rg e p um p  
Le ve l shifte r  
Vo lta g e  
se nso r  
5
Te m p e ra ture  
se nso r  
Re c tifie r  
IN  
2
Op e n lo a d  
d e te c tio n  
Load  
Lo g ic  
ESD  
4
ST  
Sho rt c irc uit  
d e te c tio n  
PROFET  
GND  
1
Load GND  
Signal GND  
1)  
With external current limit (e.g. resistor R =150 ) in GND connection, resistors in series with IN and ST  
GND  
connections, reverse load current limited by connected load.  
Semiconductor Group  
1
03.97  
BTS 410 E2  
Pin  
1
Symbol  
GND  
IN  
Function  
-
Logic ground  
2
I
Input, activates the power switch in case of logical high signal  
3
V
+
Positive power supply voltage,  
the tab is shorted to this pin  
bb  
4
5
ST  
S
Diagnostic feedback, low on failure  
Output to the load  
OUT  
O
(Load, L)  
Maximum Ratings at Tj = 25 °C unless otherwise specified  
Parameter  
Symbol  
Vbb  
Values  
Unit  
V
Supply voltage (overvoltage protection see page 3)  
65  
4)  
Load dump protection2) VLoadDump = UA + Vs, UA = 13.5 V VLoad dump  
100  
V
RI3)= 2 , RL= 6.6 , td= 400 ms, IN= low or high  
Load current (Short circuit current, see page 4)  
Operating temperature range  
Storage temperature range  
IL  
self-limited  
-40 ...+150  
-55 ...+150  
A
Tj  
Tstg  
Ptot  
°C  
Power dissipation (DC), TC 25 °C  
50  
W
Inductive load switch-off energy dissipation, single pulse  
V
bb
=12V, Tj,start =150°C, TC =150°C const.  
IL = 1.8 A, ZL = 2.3H, 0 : EAS  
IN: VESD  
all other pins:  
4.5  
J
Electrostatic discharge capability (ESD)  
(Human Body Model)  
1
2
kV  
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993  
Input voltage (DC)  
VIN  
IIN  
IST  
-0.5 ... +6  
±5.0  
V
mA  
Current through input pin (DC)  
Current through status pin (DC)  
see internal circuit diagrams page 6  
±5.0  
Thermal Characteristics  
Parameter and Conditions  
Symbol  
chip - case: RthJC  
Values  
typ  
Unit  
min  
--  
max  
2.5  
75  
K/W  
Thermal resistance  
--  
--  
35  
R
--  
--  
junction - ambient (free air):  
SMD version, device on PCB5):  
thJA  
--  
2)  
Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins, e.g. with a  
150 resistor in the GND connection and a 15 kresistor in series with the status pin. A resistor for the  
protection of the input is integrated.  
3)  
4)  
5)  
R = internal resistance of the load dump test pulse generator  
I
VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839  
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for V  
connection. PCB is vertical without blown air.  
bb  
Semiconductor Group  
2
BTS 410 E2  
Electrical Characteristics  
Parameter and Conditions  
Symbol  
Values  
Unit  
at Tj = 25 °C, V = 12 V unless otherwise specified  
bb  
min  
--  
typ  
max  
Load Switching Capabilities and Characteristics  
On-state resistance (pin 3 to 5)  
RON  
IL = 1.6 A  
T=25 °C:  
j
190  
390  
220  
440  
mΩ  
T=150 °C:  
j
Nominal load current, ISO Norm (pin 3 to 5)  
ON = 0.5 V, T = 85 °C  
V
IL(ISO)  
1.6  
--  
1.8  
--  
--  
1
A
C
Output current (pin 5) while GND disconnected or  
GND pulled up, V =30 V, V = 0, see diagram  
IL(GNDhigh)  
mA  
bb  
IN  
page 7, T =-40...+150°C  
j
Turn-on time  
Turn-off time  
IN  
IN  
to 90% VOUT: ton  
to 10% VOUT: toff  
12  
5
--  
--  
125  
85  
µs  
RL = 12 , T =-40...+150°C  
j
Slew rate on  
10 to 30% VOUT, RL = 12 , T =-40...+150°C  
dV /dton  
-dV/dtoff  
--  
--  
--  
--  
3 V/µs  
6 V/µs  
j
Slew rate off  
70 to 40% VOUT, RL = 12 , T =-40...+150°C  
j
Operating Parameters  
Operating voltage 6)  
T =-40...+150°C: Vbb(on)  
4.7  
2.9  
2.7  
--  
--  
--  
42  
V
V
j
Undervoltage shutdown  
T =25°C: Vbb(under)  
4.5  
4.7  
j
T =-40...+150°C:  
j
Undervoltage restart  
T =-40...+150°C: Vbb(u rst)  
--  
--  
--  
4.9  
6.0  
V
V
j
Undervoltage restart of charge pump  
see diagram page 12  
Vbb(ucp)  
5.6  
Undervoltage hysteresis  
Vbb(under) = Vbb(u rst) - Vbb(under)  
Vbb(under)  
--  
0.1  
--  
V
Overvoltage shutdown  
Overvoltage restart  
Overvoltage hysteresis  
Overvoltage protection7)  
Ibb=4 mA  
T =-40...+150°C: Vbb(over)  
42  
40  
--  
--  
--  
52  
--  
V
V
V
V
j
T =-40...+150°C: Vbb(o rst)  
j
T =-40...+150°C: Vbb(over)  
j
0.1  
70  
--  
T =-40...+150°C: Vbb(AZ)  
j
65  
--  
Standby current (pin 3)  
VIN=0  
Tj=-40...+25°C: Ibb(off)  
Tj= 150°C:  
--  
--  
10  
18  
15  
25  
µA  
µA  
IL(off)  
--  
--  
20  
Leakage output current (included in Ibb(off)  
VIN=0  
)
Operating current (Pin 1)8), VIN=5 V,  
Tj =-40...+150°C  
IGND  
--  
1
2.1 mA  
6)  
7)  
At supply voltage increase up to V = 5.6 V typ without charge pump, V  
V - 2 V  
bb  
bb  
OUT  
Meassured without load. See also V  
in table of protection functions and circuit diagram page 7.  
ON(CL)  
Semiconductor Group  
3
BTS 410 E2  
Parameter and Conditions  
Symbol  
Values  
Unit  
at Tj = 25 °C, V = 12 V unless otherwise specified  
bb  
min  
typ  
max  
Protection Functions  
Initial peak short circuit current limit (pin 3 to 5)9),  
IL(SCp)  
( max 450 µs if VON > VON(SC)  
)
Tj =-40°C:  
Tj =25°C:  
Tj =+150°C:  
9
--  
4
--  
12  
--  
23  
--  
15  
A
Repetitive overload shutdown current limit  
VON= 8 V, Tj = Tjt (see timing diagrams, page 10)  
Short circuit shutdown delay after input pos. slope  
IL(SCr)  
--  
--  
5
--  
A
VON > VON(SC)  
,
Tj =-40..+150°C: td(SC)  
--  
450  
µs  
min value valid only, if input "low" time exceeds 60 µs  
Output clamp (inductive load switch off)  
at VOUT = Vbb - VON(CL) IL= 40 mA, Tj =-40..+150°C: VON(CL)  
IL= 1 A, Tj =-40..+150°C:  
61  
--  
68  
--  
73  
75  
V
Short circuit shutdown detection voltage  
(pin 3 to 5)  
VON(SC)  
Tjt  
--  
150  
--  
8.5  
--  
--  
--  
V
°C  
K
Thermal overload trip temperature  
Thermal hysteresis  
Reverse battery (pin 3 to 1) 10)  
Tjt  
10  
--  
--  
-Vbb  
--  
32  
V
Diagnostic Characteristics  
Open load detection current  
IL (OL)  
mA  
(on-condition)  
Tj=-40 ..150°C:  
2
--  
150  
8)  
9)  
10)  
Add I , if I > 0, add I , if V >5.5 V  
Short circuit current limit for max. duration of t  
ST  
ST  
IN  
IN  
=450 µs, prior to shutdown  
d(SC) max  
Requires 150 resistor in GND connection. The reverse load current through the intrinsic drain-source  
diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal  
operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature  
protection is not active during reverse current operation! Input and Status currents have to be limited (see  
max. ratings page 2 and circuit page 7).  
Semiconductor Group  
4
BTS 410 E2  
Parameter and Conditions  
Symbol  
Values  
Unit  
at Tj = 25 °C, V = 12 V unless otherwise specified  
bb  
min  
typ  
max  
Input and Status Feedback11)  
Input turn-on threshold voltage  
Tj =-40..+150°C: VIN(T+)  
Tj =-40..+150°C: VIN(T-)  
1.5  
1.0  
--  
--  
--  
2.4  
--  
V
V
Input turn-off threshold voltage  
Input threshold hysteresis  
VIN(T)  
IIN(off)  
0.5  
--  
--  
V
Off state input current (pin 2), VIN = 0.4 V  
On state input current (pin 2), VIN = 5 V  
Status invalid after positive input slope  
1
30  
70  
450  
µA  
µA  
µs  
IIN(on)  
10  
--  
25  
--  
td(ST SC)  
(short circuit)  
T =-40 ... +150°C:  
j
Status invalid after positive input slope  
td(ST)  
300  
-- 1400  
µs  
(open load)  
T =-40 ... +150°C:  
j
Status output (open drain)  
Zener limit voltage T =-40...+150°C, IST = +50 uA: VST(high)  
5.0  
--  
6
--  
--  
0.4  
V
j
ST low voltage T =-40...+150°C, IST = +1.6 mA: VST(low)  
j
11)  
If a ground resistor R  
is used, add the voltage drop across this resistor.  
GND  
Semiconductor Group  
5
BTS 410 E2  
Truth Table  
Input-  
level  
Output  
level  
Status  
412  
B2  
410  
D2  
410  
E2/F2  
410  
G2  
410  
H2  
Normal  
operation  
Open load  
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
H
L
H
H
L
L
H
L
H
H
H
L
H
L
H
H
H
L
H
L
H
H
H
L
H
H
H
H
H
L
H
H
L
L
H
L
H
12  
)
H
Short circuit  
to GND  
Short circuit  
L
L
H
H
L
L
L
L
L
L
H
H
13)  
13)  
13)  
to V  
bb  
H (L  
L
)
H (L  
)
H (L  
)
Overtem-  
perature  
Under-  
voltage  
Overvoltage  
L
L
H
H
H
H
L
L
H
H
H
H
L
L
L
14)  
14)  
L
L
L
H
H
H
H
14)  
14)  
L
L
L
L
L
L = "Low" Level  
H = "High" Level  
X = don't care  
Z = high impedance, potential depends on external circuit  
Status signal after the time delay shown in the diagrams (see fig 5. page 11...12)  
Terms  
Status output  
+5V  
I
bb  
3
I
IN  
V
R
bb  
ST(ON)  
IN  
ST  
2
I
V
L
ON  
OUT  
PROFET  
I
5
ST  
ESD-  
ZD  
ST  
4
V
GND  
GND  
V
ST  
IN  
V
1
I
bb  
V
GND  
OUT  
ESD-Zener diode: 6 V typ., max 5 mA;  
< 250 at 1.6 mA, ESD zener diodes are not  
R
GND  
R
ST(ON)  
to be used as voltage clamp at DC conditions.  
Operation in this mode may result in a drift of the zener  
voltage (increase of up to 1 V).  
Input circuit (ESD protection)  
R
I
IN  
ESD-  
ZD ZD  
I1  
I2  
I
I
GND  
ZD 6 V typ., ESD zener diodes are not to be used as  
I1  
voltage clamp at DC conditions. Operation in this mode  
may result in a drift of the zener voltage (increase of up  
to 1 V).  
12)  
Power Transistor off, high impedance, versions BTS 410H, BTS 412B: internal pull up current source for  
open load detection.  
13)  
14)  
Low resistance short V to output may be detected in ON-state by the no-load-detection  
bb  
No current sink capability during undervoltage shutdown  
Semiconductor Group  
6
BTS 410 E2  
Open-load detection  
ON-state diagnostic condition: VON < RON * IL(OL); IN  
high  
Short circuit detection  
Fault Condition: VON > 8.5 V typ.; IN high  
+ V  
bb  
+ V  
bb  
V
VON  
ON  
ON  
OUT  
OUT  
Short circuit  
detection  
Logic  
unit  
Open load  
detection  
Logic  
unit  
Inductive and overvoltage output clamp  
+ V  
bb  
GND disconnect  
V
Z
V
3
ON  
V
bb  
IN  
OUT  
2
OUT  
PROFET  
PROFET  
GND  
5
ST  
4
GND  
1
V
ON  
clamped to 68 V typ.  
V
V
V
V
bb  
IN  
ST  
GND  
Overvolt. and reverse batt. protection  
Any kind of load. In case of Input=high is VOUT VIN - VIN(T+)  
.
+ V  
bb  
Due to VGND >0, no VST = low signal available.  
V
Z2  
R
R
GND disconnect with GND pull up  
IN  
IN  
Logic  
3
ST  
V
ST  
bb  
IN  
V
2
Z1  
PRO FET  
OUT  
PROFET  
GND  
5
ST  
R
GND  
4
GND  
1
Signal GND  
V
R
= 6.2 V typ., V = 70 V typ., R  
= 15 kΩ  
= 150 , R ,  
GND IN  
Z1  
Z2  
V
V
V
ST  
V
ST  
IN  
GND  
bb  
Any kind of load. If VGND > VIN - VIN(T+) device stays off  
Due to VGND >0, no VST = low signal available.  
Semiconductor Group  
7
BTS 410 E2  
V
load  
disconnect with energized inductive  
bb  
with an approximate solution for RL > 0:  
IL·L  
IL·RL  
E =  
AS  
·(Vbb +|VOUT(CL)|)· ln (1+  
)
2·RL  
|VOUT(CL)|  
3
Maximum allowable load inductance for  
a single switch off  
L = f (IL ); Tj,start = 150°C,TC = 150°C const.,  
V
high  
bb  
IN  
2
OUT  
PROFET  
5
V
bb = 12 V, RL = 0 Ω  
L [mH]  
10000  
ST  
4
GND  
1
V
bb  
Normal load current can be handled by the PROFET  
itself.  
1000  
100  
10  
V
disconnect with charged external  
bb  
inductive load  
S
3
V
high  
IN  
bb  
2
OUT  
PROFET  
5
D
ST  
4
GND  
1
1
V
1
2
3
4
5
6
bb  
I
[A]  
L
If other external inductive loads L are connected to the PROFET,  
additional elements like D are necessary.  
Typ. transient thermal impedance chip case  
Z
thJC = f(tp, D), D=tp/T  
Z
thJC [K/W]  
10  
Inductive Load switch-off energy  
dissipation  
E
bb  
E
AS  
E
Load  
V
bb  
IN  
1
O U T  
PROFET  
=
ST  
E
L
G N D  
L
D=  
0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0
Z
{
R
L
L
E
R
0.1  
Energy stored in load inductance:  
2
1
E = / ·L·I  
L
2
L
0.01  
While demagnetizing load inductance, the energy  
dissipated in PROFET is  
1E-5 1E-4 1E-3 1E-2 1E-1 1E0  
1E1  
t
[s]  
p
E
AS= Ebb + EL - ER= VON(CL)·iL(t) dt,  
Semiconductor Group  
8
BTS 410 E2  
Options Overview  
all versions: High-side switch, Input protection, ESD protection, load dump and  
reverse battery protection with 150 in GND connection, protection against loss of  
ground  
Type  
BTS 412 B2 410D2 410E2 410F2 410G2 410H2 307  
308  
Logic version  
B
D
E
F
G
H
Overtemperature protection with hysteresis  
T >150 °C, latch function15 16  
X
X
X
X
X
X
)
)
j
X
X
X
T >150 °C, with auto-restart on cooling  
j
Short circuit to GND protection  
switches off when V >3.5 V typ. and Vbb> 7 V  
typ (when first turned on after approx. 150 µs)  
X
X
ON  
)
15  
15)  
switches off when V >8.5 V typ.  
(when first turned on after approx. 150 µs)  
X
X
X
X
X
X
X
X
ON  
X
X
Achieved through overtemperature protection  
X
X
Open load detection  
in OFF-state with sensing current 30 µA typ.  
in ON-state with sensing voltage drop across  
power transistor  
X
Undervoltage shutdown with auto restart  
Overvoltage shutdown with auto restart17)  
X
X
X
X
X
X
X
X
X
X
X
X
X
-
X
X
Status feedback for  
overtemperature  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
-
X
X
X
X
X
-
X
X
X
X
-
short circuit to GND  
X
18)  
X
18)  
X
18)  
-
18)  
short to V  
bb  
-
-
-
-
open load  
X
X
X
X
-
X
-
X
-
undervoltage  
overvoltage  
Status output type  
CMOS  
-
-
-
-
-
X
X
X
X
X
X
X
X
X
X
X
X
X
Open drain  
Output negative voltage transient limit  
(fast inductive load switch off)  
to V - V  
bb ON(CL)  
X
X
X
X
X
X
X
X
X
Load current limit  
high level (can handle loads with high inrush currents)  
low level (better protection of application)  
Protection against loss of GND  
X
X
X
X
X
X
X
X
X
X
15)  
Latch except when Vbb -VOUT < VON(SC) after shutdown. In most cases VOUT = 0 V after shutdown (V  
OUT  
0 V only if forced externally). So the device remains latched unless Vbb < VON(SC) (see page 4). No latch  
between turn on and t  
With latch function. Reseted by a) Input low, b) Undervoltage  
No auto restart after overvoltage in case of short circuit  
.
d(SC)  
16)  
17)  
18)  
Low resistance short V to output may be detected in ON-state by the no-load-detection  
bb  
Semiconductor Group  
9
BTS 410 E2  
Timing diagrams  
Figure 2b: Switching an inductive load  
Figure 1a: V turn on:  
bb  
IN  
IN  
t
d(bb IN)  
V
bb  
td(ST)  
ST  
V
*)  
VOUT  
OUT  
A
ST open drain  
I L  
IL(OL)  
t
A
t
in case of too early V =high the device may not turn on (curve A)  
IN  
t
d(bb IN) approx. 150 µs  
*) if the time constant of load is too large, open-load-status may  
occur  
Figure 2a: Switching a lamp,  
Figure 3a: Turn on into short circuit,  
IN  
IN  
ST  
ST  
V
OUT  
VOUT  
t
d(SC)  
I
L
IL  
t
t
t
approx. -- µs if Vbb - VOUT > 8.5 V typ.  
d(SC)  
Semiconductor Group  
10  
BTS 410 E2  
Figure 3b: Turn on into overload,  
Figure 4a: Overtemperature:  
Reset if T <T  
j
jt  
IN  
IN  
IL  
ST  
I
L(SCp)  
I
L(SCr)  
V
OUT  
T
J
ST  
t
t
Heating up may require several seconds,  
V
bb - VOUT < 8.5 V typ.  
Figure 5a: Open load: detection in ON-state, turn  
on/off to open load  
Figure 3c: Short circuit while on:  
IN  
IN  
t
d(ST)  
ST  
ST  
VOUT  
V OUT  
I L  
I L  
**)  
open  
t
t
**) current peak approx. 20 µs  
Semiconductor Group  
11  
BTS 410 E2  
Figure 5b: Open load: detection in ON-state, open  
Figure 6b: Undervoltage restart of charge pump  
load occurs in on-state  
VON(CL)  
Von  
IN  
t
t
d(ST OL1)  
d(ST OL2)  
ST  
V bb(over)  
VOUT  
V
Vbb(u rst)  
V
bb(o rst)  
bb(u cp)  
normal  
normal  
open  
IL  
V bb(under)  
Vbb  
t
charge pump starts at Vbb(ucp) =5.6 V typ.  
td(ST OL1) = tbd µs typ., td(ST OL2) = tbd µs typ  
Figure 7a: Overvoltage:  
Figure 6a: Undervoltage:  
IN  
IN  
VON(CL)  
V
V
bb(over)  
bb(o rst)  
V
bb  
V
bb  
V
V
bb(u cp)  
V
bb(under)  
bb(u rst)  
VOUT  
VOUT  
ST  
ST open drain  
t
t
Semiconductor Group  
12  
BTS 410 E2  
Figure 9a: Overvoltage at short circuit shutdown:  
IN  
V
bb  
V
bb(o rst)  
Output short to GND  
VOUT  
short circuit shutdown  
I
L
ST  
t
Overvoltage due to power line inductance. No overvoltage auto-  
restart of PROFET after short circuit shutdown.  
Semiconductor Group  
13  
BTS 410 E2  
SMD TO-220AB/5, Opt. E3062 Ordering code  
Package and Ordering Code  
BTS410E2 E3062A T&R:  
Q67060-S6102-A4  
All dimensions in mm  
Standard TO-220AB/5  
Ordering code  
BTS 410 E2  
Q67060-S6102-A2  
TO-220AB/5, Option E3043 Ordering code  
BTS 410 E2 E3043  
Q67060-S6102-A3  
Semiconductor Group  
14  

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