BTM7741G [INFINEON]

TrilithIC; TrilithIC
BTM7741G
型号: BTM7741G
厂家: Infineon    Infineon
描述:

TrilithIC
TrilithIC

外围驱动器 驱动程序和接口 接口集成电路 光电二极管
文件: 总18页 (文件大小:326K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Data Sheet, Rev. 1.0, May 2007  
BTM7741G  
TrilithIC  
Automotive Power  
BTM7741G  
Table of Contents  
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1
2
2.1  
2.2  
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
4
Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Input Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Output Stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Short Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Overtemperature Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Undervoltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Open Load Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Status Flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
5
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
5.1  
5.2  
5.3  
5.4  
6
7
8
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Data Sheet  
2
Rev. 1.0, 2007-05-21  
TrilithIC  
BTM7741G  
1
Overview  
Features  
Quad D-MOS switch driver  
Free configurable as bridge or quad-switch  
Optimized for DC motor management applications  
Low RDS ON  
High side: 110 mtyp. @ 25°C, 270 mmax. @ 150°C  
Low side: 100 mtyp. @ 25°C, 230 mmax. @ 150°C  
Maximum peak current: typ. 10 A @ 25 °C  
Very low quiescent current: typ. 5 µA @ 25 °C  
Small outline, enhanced power PG-DSO-package  
Operates up to 40 V  
PG-DSO-28-22  
PWM frequencies up to 1 kHz  
Status flag diagnosis  
Short-circuit-protection  
Overtemperature shut down with hysteresis  
Internal clamp diodes  
Open load detection in Off-mode  
Under-voltage detection with hysteresis  
Green Product (RoHS compliant)  
AEC Qualified  
Description  
The BTM7741G is part of the TrilithIC family containing three dies in one package: One double high-side switch  
and two low-side switches. The drains of these three vertical DMOS chips are mounted on separated lead frames.  
The sources are connected to individual pins, so the BTM7741G can be used in H-bridge- as well as in any other  
configuration. Both the double high-side and the two low-side switches of the BTM7741G are manufactured in  
SMART SIPMOS® technology which combines low RDS ON vertical DMOS power stages with CMOS circuitry for  
control, protection and diagnosis.  
Type  
Package  
Marking  
BTM7741G  
PG-DSO-28-22  
BTM7741G  
Data Sheet  
3
Rev. 1.0, 2007-05-21  
BTM7741G  
2
Pin Configuration  
2.1  
Pin Assignment  
DL1 1  
IL1 2  
28 DL1  
27 SL1  
26 SL1  
25 DL1  
24 DHVS  
23 SH1  
22 SH1  
21 SH2  
20 SH2  
19 DHVS  
18 DL2  
17 SL2  
16 SL2  
15 DL2  
DL1 3  
N.C. 4  
DHVS 5  
GND 6  
IH1 7  
LS-Leadframe  
HS-Leadframe  
LS-Leadframe  
ST 8  
IH2 9  
DHVS 10  
N.C. 11  
DL2 12  
IL2 13  
DL2 14  
Figure 1  
Pin Assignment BTM7741G (Top View)  
Data Sheet  
4
Rev. 1.0, 2007-05-21  
BTM7741G  
Table 1  
Pin No.  
1, 3, 25, 28  
2
Pin Definitions and Functions  
Symbol Function  
DL1  
IL1  
Drain of low-side switch1, lead frame 1 1)  
Analog input of low-side switch1  
4
N.C.  
not connected  
1)  
5, 10, 19, 24 DHVS  
6
Drain of high-side switches and power supply voltage, lead frame 2  
Ground  
GND  
7
8
9
11  
IH1  
ST  
IH2  
N.C.  
Digital input of high-side switch1  
Status of high-side switches; open Drain output  
Digital input of high-side switch2  
not connected  
1)  
12, 14, 15, 18 DL2  
Drain of low-side switch2, lead frame 3  
13  
IL2  
Analog input of low-side switch2  
Source of low-side switch2  
Source of high-side switch2  
Source of high-side switch1  
Source of low-side switch1  
16,17  
20,21  
22,23  
26,27  
SL2  
SH2  
SH1  
SL1  
1) To reduce the thermal resistance these pins are direct connected via metal bridges to the lead frame.  
Pins written in bold type need power wiring.  
Data Sheet  
5
Rev. 1.0, 2007-05-21  
BTM7741G  
2.2  
Terms  
VS=12V  
IS  
CS  
CL  
470nF  
100µF  
IFH1,2  
DHVS  
5,10,19,24  
IST LK  
IST  
VDSH2  
VDSH1  
8
7
ST  
-VFH2  
-VFH1  
Diagnosis  
Biasing and Protection  
VST  
VSTL  
VSTZ  
IIH1  
IH1  
Gate  
Driver  
ISH2  
IDL2  
IDL LK 2  
ISH1  
IDL1  
IDL LK 1  
RO1  
RO2  
SH2  
DL2  
20,21  
IIH1  
IH2  
9
6
Gate  
VIH1  
Driver  
12,14,15,18  
GND  
VUVON  
VUVOFF  
VIH2  
SH1  
DL1  
IGND  
ILKCL  
22,23  
1,3,25,28  
Protection  
IIL1  
2
IL1  
IL2  
Gate  
Driver  
Protection  
IIL2  
13  
VIL1  
Gate  
Driver  
VIL th 1  
26,27  
SL1  
VIL2  
VIL th 2  
16,17  
VDSL1  
-VFL1  
VDSL2  
SL2  
-VFL2  
ISCP L 1  
ISCP L 2  
ISL1  
ISL2  
Figure 2  
Table 2  
Terms BTM7741G  
HS-Source-Current  
Named during Short Circuit  
Named during Leakage-Cond.  
ISH1,2  
ISCP H  
IDL LK  
Data Sheet  
6
Rev. 1.0, 2007-05-21  
BTM7741G  
3
Block Diagram  
DHVS  
5,10,19,24  
8
ST  
Diagnosis  
Biasing and Protection  
7
Gate  
IH1  
Driver  
RO1  
RO2  
20,21  
SH2  
9
6
Gate  
IH2  
Driver  
12,14,15,18  
DL2  
GND  
22,23  
SH1  
DL1  
1,3,25,28  
Protection  
2
Gate  
IL1  
IL2  
Driver  
Protection  
13  
Gate  
Driver  
26,27  
16,17  
SL1  
SL2  
Figure 3  
Block Diagram BTM7741G  
Data Sheet  
7
Rev. 1.0, 2007-05-21  
BTM7741G  
4
Circuit Description  
4.1  
Input Circuit  
The control inputs IH1,2 consist of TTL/CMOS compatible Schmitt-Triggers with hysteresis. Buffer amplifiers are  
driven by these stages and convert the logic signal into the necessary form for driving the power output stages.  
The inputs are protected by ESD clamp-diodes. The inputs IL1 and IL2 are connected to the internal gate-driving  
units of the N-channel vertical power-MOS-FETs.  
4.2  
Output Stages  
The output stages consist of an low RDSON Power-MOS H-bridge. In H-bridge configuration, the D-MOS body  
diodes can be used for freewheeling when communicating inductive loads. If the high-side switches are used as  
single switches, positive and negative voltage spikes which occur when driving inductive loads are limited by  
integrated power clamp diodes.  
4.3  
Short Circuit Protection  
The outputs are protected against  
– output short circuit to ground  
– output short circuit to the supply voltage, and  
– overload (load short circuit).  
An internal OP-Amp controls the Drain-Source-Voltage by comparing the DS-Voltage-Drop with an internal  
reference voltage. Above this trip point the OP-Amp reduces the output current depending on the junction  
temperature and the drop voltage.  
4.4  
Overtemperature Protection  
The high-side and the low-side switches also incorporate an over temperature protection circuit with hysteresis  
which switches off the output transistors. In the case of the high-side switches, the status output is set to low.  
4.5  
Undervoltage Lockout  
When VS reaches the switch-on voltage VUVON the IC becomes active with a hysteresis. The High-Side output  
transistors are switched off if the supply voltage VS drops below the switch off value VUVOFF  
.
4.6  
Open Load Detection  
The open load detection of the BTM7741G works in OFF condition and is based on a voltage measurement at the  
source of the high side switch. In order to use the open load detection SH2 has to be connected to Vcc via a pull  
up resistor. Because this pull up resistor would connect the bridge output to the µC supply it needs to be  
disconnected whenever the high side switch is on. This can be done by a transistor as shown in the application  
example (Figure 4 “Application Example BTM7741G” on Page 15). To check for open load:  
Set IH1 = IH2 = LOW (both high side switches off)  
Set IL2 = LOW, IL1 = HIGH (only low side switch 1 is on)  
Connect Rol (open load pull up) to 5V via transistor  
If the load is connected properly it will pull down the voltage at SH2 to a value close to 0V.  
If the load is disconnected the resistor will pull the voltage at SH2 to value close to Vcc.  
If the voltage at SH2 is higher than the open load detection voltage VOUT(OL) then ST will be pulled down.  
Data Sheet  
8
Rev. 1.0, 2007-05-21  
BTM7741G  
4.7  
Status Flag  
The status flag output is an open drain output with zener-diode which requires a pull-up resistor, as shown in the  
application circuit in Figure 4 “Application Example BTM7741G” on Page 15. Various errors as listed in the  
table “Diagnosis” are reported by switching the open drain output ST to low.  
Table 3  
Flag  
Truth table and Diagnosis (valid only for the High-Side-Switches)  
IH1 IH2 SH1 SH2 ST Remarks  
Inputs Outputs  
0
0
1
1
0
L
L
1
1
1
1
stand-by mode  
switch2 active  
switch1 active  
both switches  
active  
Normal operation;  
identical with functional truth table  
1
0
1
L
H
L
H
H
H
Open load at high-side switch 1  
Open load at high-side switch 2  
0
1
X
X
X
X
0
1
Z
H
X
X
X
X
Z
H
0
1
0
1
detected  
detected  
Overtemperature high-side switch1  
Overtemperature high-side switch2  
Overtemperature both high-side switches  
0
1
X
X
0
X
1
X
X
0
1
0
1
X
L
L
X
X
L
L
L
X
X
L
L
L
L
L
1
0
1
0
1
0
0
detected  
detected  
detected  
detected  
Under voltage  
X
X
L
L
1
not detected  
Inputs:  
Outputs:  
Status:  
0 = Logic LOW  
1 = Logic HIGH  
X = don’t care  
Z = Output in tristate condition  
L = Output in sink condition  
H = Output in source condition  
X = Voltage level undefined  
1 = No error  
0 = Error  
Data Sheet  
9
Rev. 1.0, 2007-05-21  
BTM7741G  
5
Electrical Characteristics  
5.1  
Absolute Maximum Ratings  
Absolute Maximum Ratings1)  
– 40 °C < Tj < 150 °C  
Pos.  
Parameter  
Symbol  
Limit Values  
Unit Remarks  
min.  
max.  
High-Side-Switches (Pins DHVS, IH1,2 and SH1,2)  
5.1.1  
5.1.2  
Supply voltage  
VS  
VS(SCP)  
– 0.3  
42  
28  
V
V
Supply voltage for full short circuit  
protection  
3)  
5.1.3  
5.1.4  
5.1.5  
HS-drain current2)  
HS-input current  
HS-input voltage  
IS  
IIH  
VIH  
– 7  
– 5  
– 10  
A
TA = 25°C; tP < 100 ms  
5
16  
mA Pin IH1 and IH2  
V
Pin IH1 and IH2  
Status Output ST  
5.1.6  
5.1.7  
5.1.8  
5.1.9  
Status pull up voltage  
Status Output current  
Low-Side-Switches (Pins DL1,2, IL1,2 and SL1,2)  
Drain-Source-Clamp voltage  
VST  
IST  
– 0.3  
– 5  
5.4  
5
V
mA Pin ST  
VDSL  
42  
– 7  
– 0.3  
30  
V
V
V
A
V
VIL = 0 V; ID 1 mA  
VIL = 5 V  
VIL = 10 V  
TA = 25°C; tP < 100 ms  
5.1.10 Supply voltage for short circuit protection VDSL(SCP)  
5.1.11  
20  
5.1.12 LS-drain current2)  
5.1.13 LS-input voltage  
Temperatures  
IDL  
VIL  
3)  
10  
5.1.14 Junction temperature  
5.1.15 Storage temperature  
ESD Protection4)  
Tj  
Tstg  
– 40  
– 55  
150  
150  
°C  
°C  
5.1.16 Input LS-Switch  
5.1.17 Input HS-Switch  
5.1.18 Status HS-Switch  
5.1.19 Output LS and HS-Switch  
VESD  
VESD  
VESD  
VESD  
2
1
2
8
kV  
kV  
kV  
kV all other pins connected  
to Ground  
1) Not subject to production test; specified by design  
2) Single pulse  
3) Internally limited  
4) ESD susceptibility HBM according to EIA/JESD22-A114-B (1.5k, 100pF)  
Note:Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute  
maximum rating conditions for extended periods may affect device reliability.  
Note:Integrated protection functions are designed to prevent IC destruction under fault conditions described in the  
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are  
not designed for continuous repetitive operation.  
Data Sheet  
10  
Rev. 1.0, 2007-05-21  
BTM7741G  
5.2  
Functional Range  
Pos.  
Parameter  
Symbol Limit Values  
Unit  
Remarks  
min.  
max.  
5.2.20 Supply voltage  
VS  
VUVOFF  
42  
V
After VS rising above  
VUVON  
5.2.21 Input voltage HS  
5.2.22 Input voltage LS  
5.2.23 Status output current  
5.2.24 Junction temperature  
VIH  
VIL  
IST  
Tj  
– 0.3  
– 0.3  
0
15  
10  
2
V
V
mA  
°C  
– 40  
150  
Note:Within the functional range the IC operates as described in the circuit description. The electrical  
characteristics are specified within the conditions given in the related electrical characteristics table  
5.3  
Thermal Resistance  
Pos.  
Parameter  
Symbol  
Limit Values  
Unit  
Conditions  
Min. Typ. Max.  
5.3.25 LS-junction to soldering point1)  
5.3.26 HS-junction to soldering point1)  
5.3.27 Junction to Ambient1)  
RthJSP  
RthJSP  
RthJA  
36  
20  
20  
K/W  
K/W  
K/W  
measured to pin 3 or 12  
measured to pin 19  
2)  
R
thJA = Tj(HS) / (P(HS)+ P(LS))  
1) Not subject to production test, specified by design.  
2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product  
(chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).  
Data Sheet  
11  
Rev. 1.0, 2007-05-21  
BTM7741G  
5.4  
Electrical Characteristics  
ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V  
unless otherwise specified  
Pos.  
Parameter  
Symbol  
Limit Values  
Unit Test Condition  
min.  
typ.  
max.  
Current Consumption HS-switch  
5.4.28 Quiescent current  
IS  
5
9
µA  
µA  
IH1 = IH2 = 0 V  
Tj = 25 °C  
1.6  
13  
3.2  
IH1 = IH2 = 0 V  
5.4.29 Supply current;  
one HS-switch active  
IS  
mA IH1 or IH2 = 5 V  
VS = 12 V  
5.4.30 Supply current;  
both HS-switches active  
5.4.31 Leakage current of  
high-side switch  
IS  
3.2  
6.4  
6
mA IH1 and IH2 = 5 V  
VS = 12 V  
ISH LK  
µA  
VIH = VSH = 0 V  
VS = 12 V  
5.4.32 Leakage current through logic GND ILKCL = IFH +  
10  
mA  
IFH = 3 A  
in free wheeling condition  
Current Consumption LS-switch  
5.4.33 Input current  
ISH  
VS = 12 V  
IIL  
8
30  
µA  
µA  
µA  
VIL = 5 V;  
normal operation  
160  
2
300  
10  
VIL = 5 V;  
failure mode  
5.4.34 Leakage current of low-side switch IDL LK  
VIL = 0 V  
V
DSL = 18 V  
Under Voltage Lockout HS-switch  
5.4.35 Switch-ON voltage  
5.4.36 Switch-OFF voltage  
5.4.37 Switch ON/OFF hysteresis  
Output stages  
VUVON  
VUVOFF  
VUVHY  
1.8  
1
4.8  
3.5  
V
V
V
VS increasing  
VS decreasing  
V
UVON VUVOFF  
5.4.38 Inverse diode of high-side switch;  
VFH  
VFL  
0.8  
1.2  
1.2  
V
I
I
I
FH = 3 A  
Forward-voltage  
5.4.39 Inverse diode of low-side switch;  
Forward-voltage  
0.8  
V
FL = 3 A  
5.4.40 Static drain-source on-resistance of RDS ON H  
110  
200  
100  
160  
mΩ  
mΩ  
mΩ  
mΩ  
SH = 1 A; VS = 12 V  
high-side switch  
Tj = 25 °C  
270  
I
SH = 1 A; VS = 12 V  
Tj = 150 °C  
SL = 1 A; VIL = 5 V  
Tj = 25 °C  
5.4.41 Static drain-source  
on-resistance of low-side switch  
RDS ON L  
I
230  
ISL = 1 A; VIL = 5 V  
Tj = 150 °C  
Data Sheet  
12  
Rev. 1.0, 2007-05-21  
BTM7741G  
ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V  
unless otherwise specified  
Pos.  
Parameter  
Symbol  
Limit Values  
Unit Test Condition  
min.  
typ.  
max.  
Short Circuit of high-side switch to GND  
5.4.42 Initial peak SC current  
ISCP H  
9
6
11  
10  
8
14  
10  
A
A
A
Tj = – 40 °C  
Tj = + 25 °C  
Tj = + 150 °C  
t
del = 360 µs; VS = 12 V; VDSH = 12V  
Short Circuit of high-side switch to VS  
5.4.43 Output pull-down-resistor  
Short Circuit of low-side switch to VS  
5.4.44 Initial peak SC current  
RO  
12  
22  
50  
kΩ  
VDSL = 3 V  
ISCP L  
14  
8.5  
17  
15  
10  
22  
15  
A
A
A
Tj = – 40 °C  
Tj = 25 °C  
Tj = 150 °C  
V
DSL = 12V; VIL = 5V;  
tdel = 250 µs  
Thermal Shutdown1)  
5.4.45 Thermal shutdown junction  
Tj SD  
Tj SO  
∆Τ  
155  
150  
180  
170  
10  
190  
180  
°C  
°C  
°C  
temperature  
5.4.46 Thermal switch-on junction  
temperature  
5.4.47 Temperature hysteresis  
Status Flag Output ST of high-side switch  
5.4.48 Low output voltage  
5.4.49 Leakage current  
5.4.50 Zener-limit-voltage  
∆Τ = TjSD TjSO  
VST L  
IST LK  
VST Z  
5.4  
0.2  
0.6  
10  
V
µA  
V
IST = 1.6 mA  
VST = 5 V  
IST = 1.6 mA  
Open load detection in Off condition  
5.4.51 Open load detection voltage  
VOUT(OL)  
1.8  
2.8  
4
500  
V
µs  
5.4.52 Status change after neg. input slope td(OL)  
VS = 12 V  
with OL  
Data Sheet  
13  
Rev. 1.0, 2007-05-21  
BTM7741G  
ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V  
unless otherwise specified  
Pos.  
Parameter  
Symbol  
Limit Values  
Unit Test Condition  
min.  
typ.  
max.  
Switching times of high-side switch1)  
5.4.53 Turn-ON-time to 90% VSH  
5.4.54 Turn-OFF-time to 10% VSH  
5.4.55 Slew rate on 10 to 30% VSH  
5.4.56 Slew rate off 70 to 40% VSH  
Switching times of low-side switch1)  
5.4.57 Turn-ON-time to 10% VDL  
5.4.58 Turn-OFF-time to 90% VDL  
tON  
tOFF  
dV/dtON  
-dV/dtOFF  
85  
80  
180  
180  
1.2  
1.6  
µs  
µs  
RLoad = 12 Ω  
VS = 12 V  
V/µs  
V/µs  
tON  
tOFF  
60  
60  
150  
150  
µs  
µs  
RLoad = 10 Ω  
VS = 12 V  
VIL = 0 to 5 V  
5.4.59 Slew rate on 70 to 50% VDL  
5.4.60 Slew rate off 50 to 70% VDL  
-dV/dtON  
dV/dtOFF  
1
1
1.5  
1.5  
V/µs RLoad = 4.7 Ω  
VS = 12 V  
V/µs  
VIL = 0 to 5 V  
Control Inputs of high-side switches IH 1, 2  
5.4.61 H-input voltage  
5.4.62 L-input voltage  
5.4.63 Input voltage hysteresis  
5.4.64 H-input current  
5.4.65 L-input current  
5.4.66 Input series resistance  
5.4.67 Zener limit voltage  
Control Inputs IL1, 2  
VIH High  
VIH Low  
VIH HY  
IIH High  
IIH Low  
RI  
1
15  
5
0.3  
30  
2.5  
60  
20  
5.5  
V
V
V
µA  
µA  
kΩ  
V
VIH = 5 V  
VIH = 0.4 V  
2.7  
5.4  
4
VIH Z  
IIH = 1.6 mA  
5.4.68 Gate-threshold-voltage  
1) Not subject to production test; specified by design  
VIL th  
0.9  
1.7  
2.2  
V
IDL = 2 mA  
Note:The listed characteristics are ensured over the operating range of the integrated circuit. Typical  
characteristics specified mean values expected over the production spread. If not otherwise specified,  
typical characteristics apply at TA = 25 °C and the given supply voltage.  
Data Sheet  
14  
Rev. 1.0, 2007-05-21  
BTM7741G  
6
Application Information  
Note:The following simplified application examples are given as a hint for the implementation of the device only  
and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the  
device. The function of the described circuits must be verified in the real application  
Watchdog  
I
TLE  
Reset  
VS=12V  
4278G  
Q
D
RQ  
100 k  
CQ  
CS  
D01  
Z39  
CD  
22µF  
10µF  
47nF  
WD  
R
VCC  
DHVS  
BCR192W  
5,10,19,24  
8
7
RS  
10 k  
ST  
to µC  
Diagnosis  
Biasing and Protection  
ROL  
10 k  
optional for  
open load  
in off  
IH1  
Gate  
Driver  
RO1  
RO2  
SH2  
DL2  
20,21  
IH2  
9
6
Gate  
Driver  
12,14,15,18  
GND  
XC866  
M
SH1  
DL1  
22,23  
1,3,25,28  
Protection  
2
IL1  
IL2  
Gate  
Driver  
Protection  
13  
Gate  
Driver  
26,27  
SL1  
16,17  
SL2  
GND  
In case of VDSL<-0.6V or reverse battery the current into the µC might be limited by external resitors to protect the µC  
Figure 4  
Application Example BTM7741G  
Data Sheet  
15  
Rev. 1.0, 2007-05-21  
BTM7741G  
7
Package Outlines  
0.35 x 45˚  
1)  
7.6 -0.2  
+0.09  
0.23  
8˚ max  
0.4 +0.8  
10.3 ±0.3  
1.27  
0.35 +0.152)  
0.1  
0.2 28x  
28  
15  
14  
1
1)  
18.1-0.4  
Index Marking  
1) Does not include plastic or metal protrusions of 0.15 max rer side  
2) Does not include dambar protrusion of 0.05 max per side  
GPS05123  
Figure 5  
PG-DSO-28-22 (Plastic Transistor Single Outline Package)  
Green Product (RoHS compliant)  
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with  
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e  
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).  
For further information on alternative packages, please visit our website:  
http://www.infineon.com/packages.  
Dimensions in mm  
Data Sheet  
16  
Rev. 1.0, 2007-05-21  
BTM7741G  
8
Revision History  
Rev. Date  
Changes  
1.0  
2007-05-21  
Initial Version  
Data Sheet  
17  
Rev. 1.0, 2007-05-21  
Edition 2007-05-21  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2007 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or  
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any  
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties  
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights  
of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in  
question, please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure  
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support  
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain  
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may  
be endangered.  

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