BSP149H6327XTSA1 [INFINEON]

Power Field-Effect Transistor, 0.66A I(D), 200V, 1.8ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-4;
BSP149H6327XTSA1
型号: BSP149H6327XTSA1
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 0.66A I(D), 200V, 1.8ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-4

脉冲 光电二极管 晶体管
文件: 总9页 (文件大小:396K)
中文:  中文翻译
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BSP149  
SIPMOS® Small-Signal-Transistor  
Product Summary  
VDS  
Features  
200  
V
Ω
A
• N-channel  
• Depletion mode  
RDS(on),max  
IDSS,min  
3.5  
0.14  
• dv /dt rated  
• Available with V GS(th) indicator on reel  
• Pb-free lead plating; RoHS compliant  
• Qualified according to AEC Q101  
PG-SOT223  
• Halogen-free according to IEC61249-2-21  
Type  
Package  
Tape and Reel Information  
Marking  
Packaging  
BSP149  
PG-SOT223  
H6327: 1000 pcs/reel  
BSP149  
Non dry  
BSP149  
PG-SOT223  
H6906: 1000 pcs/reel  
BSP149  
Non dry  
sorted in VGS(th) bands1)  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
I D  
T A=25 °C  
T A=70 °C  
Continuous drain current  
0.66  
0.53  
2.6  
A
I D,pulse  
dv /dt  
V GS  
T A=25 °C  
I D=0.66 A,  
Pulsed drain current  
Reverse diode dv /dt  
Gate source voltage  
V
DS=160 V,  
di /dt =200 A/µs,  
j,max=150 °C  
6
kV/µs  
V
T
±20  
ESD Class  
(JESD22-A114-HBM)  
1B (>500,<600)  
P tot  
T A=25 °C  
Power dissipation  
1.8  
W
T j, T stg  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
-55 ... 150  
55/150/56  
°C  
1) see table on next page and diagram 11  
Rev. 2.1  
page 1  
2012-11-28  
BSP149  
Unit  
Values  
typ.  
Parameter  
Symbol Conditions  
min.  
max.  
Thermal characteristics  
Thermal resistance,  
junction - soldering point (pin 4)  
R thJS  
-
-
25  
K/W  
R thJA  
SMD version, device on PCB  
minimal footprint  
-
-
-
-
115  
70  
6 cm2 cooling area1)  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V (BR)DSS V GS=-3 V, I D=250 µA  
V GS(th) V DS=3 V, I D=400 µA  
Drain-source breakdown voltage  
Gate threshold voltage  
200  
-2.1  
-
-
V
-1.4  
-1  
V DS=200 V,  
I D(off)  
Drain-source cutoff current  
-
-
-
-
0.1  
5
µA  
V
GS=-3 V, T j=25 °C  
V
V
DS=200 V,  
GS=-3 V, T j=125 °C  
I GSS  
I DSS  
V GS=20 V, V DS=0 V  
V GS=0 V, V DS=10 V  
Gate-source leakage current  
On-state drain current  
-
-
10  
-
nA  
mA  
Ω
140  
-
R DS(on) V GS=0 V, I D=70 mA  
GS=10 V, I D=660 mA  
Drain-source on-state resistance  
-
-
1.7  
1.0  
3.5  
1.8  
V
|V DS|>2|I D|R DS(on)max  
I D=0.48 A  
,
g fs  
Transconductance  
0.4  
0.8  
-
S
V
Threshold voltage V GS(th) sorted in bands3)  
V GS(th) V DS=3 V, I D=400 µA  
J
-1.2  
-1.35  
-1.5  
-
-
-
-
-
-1  
K
L
-1.15  
-1.3  
M
N
-1.65  
-1.8  
-1.45  
-1.6  
2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (single layer, 70 µm thick) copper area for  
drain connection. PCB is vertical in still air.  
3) Each reel contains transistors out of one band whose identifying letter is printed on the reel label. A specific  
band cannot be ordered separately.  
Rev. 2.1  
page 2  
2012-11-28  
BSP149  
Unit  
Values  
typ.  
Parameter  
Symbol Conditions  
min.  
max.  
Dynamic characteristics  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C iss  
-
-
-
-
-
-
-
326  
41  
430 pF  
V GS=-3 V, V DS=25 V,  
f =1 MHz  
C oss  
Crss  
t d(on)  
t r  
55  
25  
17  
5.1  
3.4  
45  
7.7  
5.1  
68  
ns  
V
V
DD=100 V,  
GS=-2…7 V,  
t d(off)  
t f  
Turn-off delay time  
Fall time  
I D=0.50 A, R G=6 Ω  
21  
31  
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
Gate charge total  
Q gs  
-
-
-
-
0.74  
5.6  
1.0  
8.4  
14  
-
nC  
V DD=160 V,  
I D=0.05 A,  
Q gd  
Q g  
11  
V
GS=-3 to 5 V  
V plateau  
Gate plateau voltage  
0.16  
V
A
Reverse Diode  
I S  
Diode continous forward current  
Diode pulse current  
-
-
-
-
0.66  
2.6  
T A=25 °C  
I S,pulse  
V GS=-3 V, I F=0.66 A,  
T j=25 °C  
V SD  
Diode forward voltage  
-
0.9  
1.2  
V
t rr  
Reverse recovery time  
-
-
42  
60  
65  
90  
ns  
V R=100 V, I F=0.5 A,  
di F/dt =100 A/µs  
Q rr  
Reverse recovery charge  
nC  
Rev. 2.1  
page 3  
2012-11-28  
BSP149  
1 Power dissipation  
2 Drain current  
P tot=f(T A)  
I D=f(T A); V GS10 V  
2
1.5  
1
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.5  
0
0
40  
80  
120  
160  
0
40  
80  
120  
160  
TA [°C]  
TA [°C]  
3 Safe operating area  
I D=f(V DS); T A=25 °C; D =0  
parameter: t p  
4 Max. transient thermal impedance  
Z thJA=f(t p)  
parameter: D =t p/T  
101  
102  
limited by on-state  
resistance  
10 µs  
100 µs  
1 ms  
0.5  
100  
10-1  
10-2  
10-3  
10 ms  
0.2  
101  
0.1  
DC  
0.05  
single pulse  
0.02  
0.01  
100  
100  
101  
102  
103  
10-4  
10-3  
10-2  
10-1  
100  
101  
102  
VDS [V]  
tp [s]  
Rev. 2.1  
page 4  
2012-11-28  
BSP149  
5 Typ. output characteristics  
I D=f(V DS); T j=25 °C  
6 Typ. drain-source on resistance  
R DS(on)=f(I D); T j=25 °C  
parameter: V GS  
parameter: V GS  
10 V  
1 V  
1
6
-0.2 V  
0.5 V  
0 V  
0.2 V  
0.5 V  
-0.1 V  
0.1 V  
5
4
3
2
1
0
0.8  
0.6  
0.4  
0.2  
0
0.2 V  
0.1 V  
0 V  
-0.1 V  
-0.2 V  
1 V  
10 V  
0
2
4
6
8
10  
0
0.2  
0.4  
0.6  
0.8  
1
VDS [V]  
ID [A]  
7 Typ. transfer characteristics  
8 Typ. forward transconductance  
I D=f(V GS); |V DS|>2|I D|R DS(on)max  
g fs=f(I D); T j=25 °C  
2
1.6  
1.2  
0.8  
0.4  
0
1.2  
1
0.8  
0.6  
0.4  
0.2  
0
-2  
-1  
0
1
2
3
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70  
VGS [V]  
ID [A]  
Rev. 2.1  
page 5  
2012-11-28  
BSP149  
9 Drain-source on-state resistance  
10 Typ. gate threshold voltage  
V GS(th)=f(T j); V DS=3 V; I D=400 µA  
parameter: I D  
R DS(on)=f(T j); I D=0.07 A; V GS=0 V  
8
6
0
-0.5  
98 %  
-1  
typ  
98 %  
4
-1.5  
-2  
2 %  
2
typ  
-2.5  
-3  
0
-60  
-20  
20  
60  
100  
140  
180  
-60  
-20  
20  
60  
100  
140  
180  
Tj [°C]  
Tj [°C]  
11 Threshold voltage bands  
12 Typ. capacitances  
I D=f(V GS); V DS=3 V; T j=25 °C  
C =f(V DS); V GS=-3 V; f =1 MHz  
10  
1000  
Ciss  
N
L
M
K
J
1
400 µA  
100  
Coss  
Crss  
0.1  
0.01  
10  
-2  
-1.5  
VGS [V]  
-1  
-0.5  
0
10  
20  
30  
VDS [V]  
Rev. 2.1  
page 6  
2012-11-28  
BSP149  
13 Forward characteristics of reverse diode  
I F=f(V SD  
15 Typ. gate charge  
V GS=f(Q gate); I D=0.5 A pulsed  
parameter: V DD  
)
parameter: T j  
5
4
10  
0.5 VDS(max)  
0.2 VDS(max)  
150 °C  
25 °C  
3
2
0.8 VDS(max)  
0.12 A 1  
150 °C,  
98%  
1
0
25 °C, 98%  
-1  
-2  
-3  
-4  
0.1  
0.01  
0
0
2
4
6
8
10  
12  
0.5  
1
1.5  
2
25 °C, 98%  
VSD [V]  
Qgate [nC]  
16 Drain-source breakdown voltage  
V BR(DSS)=f(T j); I D=250 µA  
240  
200  
160  
-60  
-20  
20  
60  
100  
140  
180  
Tj [°C]  
Rev. 2.1  
page 7  
2012-11-28  
BSP149  
Package Outline:  
Footprint:  
Packaging:  
Dimensions in mm  
Rev. 2.1  
page 8  
2012-11-28  
BSP149  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2008 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of  
conditions or characteristics. With respect to any examples or hints given herein, any typical  
values stated herein and/or any information regarding the application of the device,  
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,  
including without limitation, warranties of non-infringement of intellectual property rights  
of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please  
contact the nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information  
on the types in question, please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with  
the express written approval of Infineon Technologies, if a failure of such components can  
reasonably be expected to cause the failure of that life-support device or system or to affect  
the safety or effectiveness of that device or system. Life support devices or systems are  
intended to be implanted in the human body or to support and/or maintain and sustain  
and/or protect human life. If they fail, it is reasonable to assume that the health of the user  
or other persons may be endangered.  
Rev. 2.1  
page 9  
2012-11-28  

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