BDP949H6327TR [INFINEON]

Small Signal Bipolar Transistor, 3A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon,;
BDP949H6327TR
型号: BDP949H6327TR
厂家: Infineon    Infineon
描述:

Small Signal Bipolar Transistor, 3A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon,

文件: 总8页 (文件大小:523K)
中文:  中文翻译
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BDP947_BDP949_BDP953  
Silicon NPN Transistors  
For AF driver and output stages  
High collector current  
4
3
2
1
High current gain  
Low collector-emitter saturation voltage  
Complementary types: BDP948, BDP950,  
BDP954 (PNP)  
Pb-free (RoHS compliant) package  
Qualified according AEC Q101  
Type  
Marking  
Pin Configuration  
Package  
SOT223  
SOT223  
SOT223  
BDP947  
BDP949  
BDP953  
BDP947 1=B 2=C 3=E  
BDP949 1=B 2=C 3=E  
BDP953 1=B 2=C 3=E  
4=C  
4=C  
4=C  
-
-
-
-
-
-
1
2011-10-05  
BDP947_BDP949_BDP953  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
V
Collector-emitter voltage  
BDP947  
BDP949  
V
V
V
CEO  
CBO  
EBO  
45  
60  
100  
BDP953  
Collector-base voltage  
BDP947  
BDP949  
45  
60  
120  
BDP953  
5
3
Emitter-base voltage  
Collector current  
A
I
C
5
Peak collector current, t 10 ms  
I
p
CM  
200  
500  
5
mA  
W
Base current  
Peak base current, t 10 ms  
Total power dissipation-  
I
B
I
BM  
p
P
tot  
T 100 °C  
S
150  
°C  
Junction temperature  
Storage temperature  
T
j
T
-65 ... 150  
stg  
Thermal Resistance  
Parameter  
Junction - soldering point  
Symbol  
Value  
10  
Unit  
K/W  
1)  
R
thJS  
2
2011-10-05  
BDP947_BDP949_BDP953  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
DC Characteristics  
V
Collector-emitter breakdown voltage  
I = 10 mA, I = 0 , BDP947  
V
V
V
(BR)CEO  
(BR)CBO  
(BR)EBO  
45  
60  
100  
-
-
-
-
-
-
C
B
I = 10 mA, I = 0 , BDP949  
C
B
I = 10 mA, I = 0 , BDP953  
C
B
Collector-base breakdown voltage  
I = 100 µA, I = 0 , BDP947  
45  
60  
120  
-
-
-
-
-
-
C
E
I = 100 µA, I = 0 , BDP949  
C
E
I = 0 , I = 100 µA, BDP953  
C
E
Emitter-base breakdown voltage  
I = 10 µA, I = 0  
5
-
-
E
C
Collector-base cutoff current  
I
µA  
CBO  
V
V
= 45 V, I = 0  
-
-
-
-
-
-
0.1  
20  
100 nA  
CB  
CB  
E
= 45 V, I = 0 , T = 150 °C  
E
A
Emitter-base cutoff current  
I
EBO  
V
= 4 V, I = 0  
EB  
C
2)  
-
DC current gain  
h
FE  
I = 10 mA, V = 5 V  
25  
100  
50  
-
-
-
-
-
C
CE  
I = 500 mA, V = 1 V  
475  
-
-
C
CE  
I = 2 A, V = 2 V, BDP947, BDP949  
C
CE  
I = 2 A, V = 2 V, BDP953  
15  
C
CE  
2)  
Collector-emitter saturation voltage  
I = 2 A, I = 0.2 A  
V
-
-
0.5  
V
CEsat  
C
B
2)  
Base emitter saturation voltage  
I = 2 A, I = 0.2 A  
V
-
-
1.3  
BEsat  
C
B
AC Characteristics  
Transition frequency  
-
-
100  
25  
-
-
MHz  
pF  
f
T
I = 50 mA, V = 10 V, f = 100 MHz  
C
CE  
Collector-base capacitance  
C
cb  
V
= 10 V, f = 1 MHz  
CB  
1
For calculation of R  
please refer to Application Note AN077 (Thermal Resistance Calculation)  
thJA  
2Pulse test: t < 300µs; D < 2%  
3
2011-10-05  
BDP947_BDP949_BDP953  
DC current gain h = ƒ(I )  
Collector-emitter saturation voltage  
FE  
C
V
= 2 V  
I = ƒ(V  
), h = 10  
CE  
C
CEsat FE  
10 4  
mA  
10 3  
-
100°C  
10 3  
10 2  
10 1  
25°C  
-55°C  
10 2  
100°C  
25°C  
-50°C  
10 1  
10 0  
10 0  
10 0  
0
10 1  
10 2  
10 3  
10 4  
0.1  
0.2  
0.3  
0.4  
0.6  
V
CEsat  
mA  
C
V
I
Base-emitter saturation voltage  
Collector current I = ƒ(V )  
C
BE  
I = (V  
), h = 10  
V = 2 V  
C
BEsat  
FE  
CE  
10 4  
mA  
10 4  
mA  
10 3  
10 2  
10 1  
10 3  
10 2  
10 1  
10 0  
-50°C  
25°C  
-50°C  
25°C  
100°C  
100°C  
10 0  
0
V
V
0.2  
0.4  
0.6  
0.8  
1
1.3  
0
0.2  
0.4  
0.6  
0.8  
1
1.3  
V
V
BE  
BEsat  
4
2011-10-05  
BDP947_BDP949_BDP953  
Collector cutoff current I  
= ƒ(T )  
Collector-base capacitance C = ƒ(V )  
cb CB  
CBO  
A
V
= 45 V  
Emitter-base capacitance C = ƒ(V )  
CB  
eb  
EB  
10 5  
nA  
500  
pF  
10 4  
10 3  
10 2  
10 1  
10 0  
400  
350  
300  
250  
200  
150  
100  
50  
max  
CEB  
typ  
CCB  
22  
10 -1  
0
°C  
V
0
20  
40  
60  
80  
100 120  
150  
0
4
8
12  
16  
T
V
(V  
A
CB EB  
Total power dissipation P = ƒ(T )  
Permissible Pulse Load R  
= ƒ(t )  
thJS p  
tot  
S
10 2  
5.5  
W
4.5  
4
10 1  
10 0  
10 -1  
3.5  
3
D = 0,5  
0,2  
2.5  
2
0,1  
0,05  
0,02  
0,01  
0,005  
0
1.5  
1
0.5  
0
0
15 30 45 60 75 90 105 120  
150  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
°C  
s
t
t
p
s
5
2011-10-05  
BDP947_BDP949_BDP953  
Permissible Pulse Load  
P
/P  
= ƒ(t )  
totmax totDC  
p
10 3  
-
D = 0  
0.005  
0.01  
0.02  
0.05  
0.1  
10 2  
10 1  
10 0  
0.2  
0.5  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
s
t
p
6
2011-10-05  
Package SOT223  
BDP947_BDP949_BDP953  
Package Outline  
0.1  
1.6  
0.2  
6.5  
A
0.1  
0.1 MAX.  
3
B
4
3
1
2
2.3  
0.1  
0.7  
0.28  
0.0  
4
4.6  
0...10˚  
M
0.25  
A
M
0.25  
B
Foot Print  
3.5  
1.2 1.1  
Marking Layout (Example)  
Manufacturer  
2005, 24 CW  
Date code (YYWW)  
BCP52-16  
Type code  
Pin 1  
Packing  
Reel ø180 mm = 1.000 Pieces/Reel  
Reel ø330 mm = 4.000 Pieces/Reel  
0.3 MAX.  
8
1.75  
6.8  
Pin 1  
7
2011-10-05  
BDP947_BDP949_BDP953  
Edition 2009-11-16  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
2009 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee  
of conditions or characteristics. With respect to any examples or hints given herein,  
any typical values stated herein and/or any information regarding the application of  
the device, Infineon Technologies hereby disclaims any and all warranties and  
liabilities of any kind, including without limitation, warranties of non-infringement of  
intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices,  
please contact the nearest Infineon Technologies Office (<www.infineon.com>).  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact the nearest Infineon  
Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems  
only with the express written approval of Infineon Technologies, if a failure of such  
components can reasonably be expected to cause the failure of that life-support  
device or system or to affect the safety or effectiveness of that device or system.  
Life support devices or systems are intended to be implanted in the human body or  
to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be  
endangered.  
8
2011-10-05  

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