AUIRFL014N [INFINEON]

Power Field-Effect Transistor, 1.9A I(D), 55V, 0.16ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-261AA, ROHS COMPLIANT PACKAGE-4;
AUIRFL014N
型号: AUIRFL014N
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 1.9A I(D), 55V, 0.16ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-261AA, ROHS COMPLIANT PACKAGE-4

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AUTOMOTIVE GRADE  
AUIRFL014N  
HEXFET® Power MOSFET  
Features  
Advanced Planar Technology  
Low On-Resistance  
D
S
V(BR)DSS  
55V  
0.16  
Dynamic dV/dT Rating  
150°C Operating Temperature  
Fast Switching  
Fully Avalanche Rated  
Repetitive Avalanche Allowed up to Tjmax  
RDS(on) max.  
ID  
Ω
G
1.9A  
Lead-Free, RoHS Compliant  
Automotive Qualified *  
D
Description  
Specifically designed for Automotive applications, this  
Cellular design of HEXFET® Power MOSFETs utilizes  
the latest processing techniques to achieve low on-  
resistance per silicon area. This benefit combined with  
the fast switching speed and ruggedized device design  
that HEXFET power MOSFETs are well known for,  
provides the designer with an extremely efficient and  
reliable device for use in Automotive and a wide variety  
of other applications.  
S
D
G
SOT-223  
AUIRFL014N  
G
D
S
Gate  
Drain  
Source  
Standard Pack  
Form  
Base part number  
Package Type  
Orderable Part Number  
Quantity  
Tube  
Tape and Reel  
95  
2500  
AUIRFL014N  
AUIRFL014NTR  
AUIRFL014N  
SOT-223  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress  
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is  
not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal  
resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is  
25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
Max.  
2.7  
Units  
I
I
I
I
@ T = 25°C  
A
D
D
D
1.9  
@ T = 25°C  
A
A
1.5  
@ T = 70°C  
A
15  
DM  
2.1  
Power Dissipation (PCB Mount)  
Power Dissipation (PCB Mount)  
Linear Derating Factor (PCB Mount)  
Gate-to-Source Voltage  
W
W
P
P
@T = 25°C  
A
D
D
1.0  
@T = 25°C  
A
8.3  
W/°C  
V
±20  
V
GS  
EAS  
IAR  
48  
1.7  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
0.1  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
5.0  
V/ns  
°C  
-55 to + 150  
T
T
Operating Junction and  
J
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Typ.  
90  
Max.  
120  
60  
Units  
RθJA  
RθJA  
Junction-to-Ambient (PCB mount, steady state)  
°C/W  
Junction-to-Ambient (PCB mount, steady state)  
50  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
1
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AUIRFL014N  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
55  
–––  
0.054  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
0.16  
4.0  
V
VGS = 0V, ID = 250μA  
ΔV(BR)DSS/ΔTJ  
Breakdown Voltage Temp. Coefficient  
–––  
–––  
2.0  
V/°C Reference to 25°C, ID = 1mA  
VGS = 10V, ID =1.9A  
RDS(on)  
VGS(th)  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
Ω
V
VDS = VGS, ID = 250μA  
gfs  
Forward Transconductance  
1.6  
–––  
1.0  
S
V
V
DS = 25V, ID = 0.85A  
DS = 44V, VGS = 0V  
IDSS  
Drain-to-Source Leakage Current  
–––  
–––  
–––  
–––  
μA  
25  
VDS = 44V, VGS = 0V, TJ = 150°C  
VGS = 20V  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
100  
-100  
nA  
V
GS = -20V  
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Qg  
Total Gate Charge  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
7.0  
1.2  
3.3  
6.6  
7.1  
12  
11  
ID = 1.7A  
Qgs  
Qgd  
td(on)  
tr  
1.8  
V
V
DS = 44V  
nC  
ns  
pF  
5.0  
GS = 10V, See Fig 6 and 9  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
VDD = 28V  
ID = 1.7A  
td(off)  
tf  
Ω
Turn-Off Delay Time  
Fall Time  
R
G = 6.0  
Ω,  
See Fig.10  
3.3  
190  
72  
RD =16  
VGS = 0V  
DS = 25V  
ƒ = 1.0MHz, See Fig.5  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
V
33  
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
I
I
Continuous Source Current  
MOSFET symbol  
S
–––  
–––  
1.3  
(Body Diode)  
Pulsed Source Current  
showing the  
integral reverse  
A
SM  
–––  
–––  
15  
(Body Diode)  
p-n junction diode.  
V
t
Diode Forward Voltage  
–––  
–––  
–––  
–––  
41  
1.0  
61  
95  
V
T = 25°C, I = 1.7A, V = 0V  
SD  
J
S
GS  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
nC  
T = 25°C, I = 1.7A  
J F  
rr  
di/dt = 100A/μs  
Q
64  
rr  
Notes:  
 Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 11 )  
‚ VDD = 25V, starting TJ = 25°C, L = 8.2mH, RG = 25Ω, IAS = 3.4A. (See Figure 12)  
ƒ ISD 1.7A, di/dt 250A/μs, VDD V(BR)DSS, TJ 150°C  
„ Pulse width 300μs; duty cycle 2%.  
When mounted on FR-4 board using minimum recommended footprint.  
† When mounted on 1 inch square copper board, for comparison with other SMD devices.  
2
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AUIRFL014N  
100  
10  
1
100  
10  
1
VGS  
15V  
VGS  
15V  
TOP  
TOP  
10V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
BOTTOM 4.5V  
BOTTOM 4.5V  
4.5V  
4.5V  
20μs PULSE WIDTH  
20μs PULSE WIDTH  
T
= 150°C  
T
= 25°C  
C
J
A
0.1  
0.1  
A
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
100  
2.0  
1.5  
1.0  
0.5  
0.0  
I
= 1.7A  
D
10  
TJ = 150°C  
TJ = 25°C  
1
VDS = 25V  
20μs PULSE WIDTH  
V
= 10V  
GS  
0.1  
A
9 A  
4
5
6
7
8
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
VGS , Gate-to-Source Voltage (V)  
T , Junction Temperature (°C)  
J
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
3
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March 26, 2014  
AUIRFL014N  
20  
16  
12  
8
350  
300  
250  
200  
150  
100  
50  
I
= 1.7A  
V
C
C
C
= 0V,  
f = 1MHz  
D
GS  
iss  
rss  
oss  
= C + C  
,
C
SHORTED  
V
V
V
= 44V  
= 28V  
= 11V  
gs  
gd  
ds  
DS  
DS  
DS  
= C  
gd  
= C + C  
ds  
gd  
C
C
iss  
oss  
C
rss  
4
FOR TEST CIRCUIT  
SEE FIGURE 9  
0
0
A
A
0
2
4
6
8
10  
1
10  
100  
Q
, Total Gate Charge (nC)  
V
, Drain-to-Source Voltage (V)  
G
DS  
Fig 5. Typical Capacitance Vs.  
Fig 6. Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
100  
10  
1
100  
10  
1
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
T = 150°C  
J
100μs  
T = 25°C  
J
1ms  
10ms  
T
T
= 25°C  
= 150°C  
A
J
V
= 0V  
GS  
Single Pulse  
A
0.1  
0.1  
A
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1
10  
100  
V
, Source-to-Drain Voltage (V)  
V
, Drain-to-Source Voltage (V)  
SD  
DS  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
4
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AUIRFL014N  
RD  
Q
G
VDS  
10V  
VGS  
Q
Q
GD  
GS  
D.U.T.  
RG  
+ VDD  
-
V
G
10V  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Charge  
Fig 9a. Basic Gate Charge Waveform  
Fig 10a. Switching Time Test Circuit  
Current Regulator  
Same Type as D.U.T.  
V
DS  
50KΩ  
90%  
.2μF  
12V  
.3μF  
+
V
DS  
D.U.T.  
-
10%  
V
GS  
V
GS  
t
t
r
t
t
f
3mA  
d(on)  
d(off)  
I
I
D
G
Current Sampling Resistors  
Fig 9b. Gate Charge Test Circuit  
Fig 10b. Switching Time Waveforms  
1000  
100  
D = 0.50  
0.20  
0.10  
10  
0.05  
P
DM  
0.02  
t
0.01  
1
1
t
2
Notes:  
1. Duty factor D = t / t  
SINGLE PULSE  
(THERMAL RESPONSE)  
1
2
2. Peak T = P  
DM  
x Z  
+ T  
thJA A  
J
A
0.1  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1 , Rectangular Pulse Duration (sec)  
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  
5
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AUIRFL014N  
120  
100  
80  
60  
40  
20  
0
I
D
TOP  
1.5A  
2.7A  
BOTTOM 3.4A  
15V  
DRIVER  
+
L
V
DS  
D.U.T  
AS  
R
G
V
DD  
-
I
A
20V  
0.01  
Ω
t
p
V
= 25V  
50  
DD  
Fig 12a. Unclamped Inductive Test Circuit  
A
150  
25  
75  
100  
125  
Starting T , Junction Temperature (°C)  
J
Fig 12c. Maximum Avalanche Energy  
Vs. Drain Current  
V
(BR)DSS  
t
p
I
AS  
Fig 12b. Unclamped Inductive Waveforms  
6
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AUIRFL014N  
SOT-223 (TO-261AA) Package Outline  
Dimensions are shown in milimeters (inches)  
SOT-223 (TO-261AA) Part Marking Information  
FL014N  
Date Code  
Y= Year  
WW= Work Week  
A= Automotive, Lead Free  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
7
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AUIRFL014N  
SOT-223 (TO-261AA) Tape & Reel Information  
Dimensions are shown in milimeters (inches)  
4.10 (.161)  
3.90 (.154)  
0.35 (.013)  
0.25 (.010)  
1.85 (.072)  
1.65 (.065)  
2.05 (.080)  
1.95 (.077)  
TR  
7.55 (.297)  
7.45 (.294)  
16.30 (.641)  
15.70 (.619)  
7.60 (.299)  
7.40 (.292)  
1.60 (.062)  
1.50 (.059)  
TYP.  
FEED DIRECTION  
2.30 (.090)  
2.10 (.083)  
7.10 (.279)  
6.90 (.272)  
12.10 (.475)  
11.90 (.469)  
NOTES :  
1. CONTROLLING DIMENSION: MILLIMETER.  
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
3. EACH O330.00 (13.00) REEL CONTAINS 2,500 DEVICES.  
13.20 (.519)  
12.80 (.504)  
15.40 (.607)  
11.90 (.469)  
4
330.00  
(13.000)  
MAX.  
50.00 (1.969)  
MIN.  
18.40 (.724)  
MAX.  
NOTES :  
1. OUTLINE COMFORMS TO EIA-418-1.  
2. CONTROLLING DIMENSION: MILLIMETER..  
3. DIMENSION MEASURED @ HUB.  
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.  
14.40 (.566)  
12.40 (.488)  
4
3
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
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AUIRFL014N  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive  
qualification. IR’s Industrial and Consumer qualification  
level is granted by extension of the higher Automotive level.  
Moisture Sensitivity Level  
SOT-223  
MSL1  
Class M1A(+/- 50V )†††  
Machine Model  
(per AEC-Q101-002)  
Class H1A(+/- 350V )†††  
(per AEC-Q101-001)  
Human Body Model  
ESD  
Class C5(+/- 2000V )†††  
(per AEC-Q101-005)  
Charged Device  
Model  
Yes  
RoHS Compliant  
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
Exceptions (if any) to AEC-Q101 requirements are noted in the qualification report.  
††  
††† Highest passing voltage  
9
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March 26, 2014  
AUIRFL014N  
IMPORTANTNOTICE  
Unlessspecificallydesignatedfortheautomotivemarket,InternationalRectifierCorporationanditssubsidiaries(IR)  
reservetherighttomakecorrections,modifications,enhancements,improvements,andotherchangestoitsproducts  
andservicesatanytimeandtodiscontinueanyproductorserviceswithoutnotice. Partnumbersdesignatedwiththe  
“AUprefixfollowautomotiveindustryand/orcustomerspecificrequirementswithregardstoproductdiscontinuance  
andprocesschangenotification. AllproductsaresoldsubjecttoIR’stermsandconditionsofsalesuppliedatthetime  
oforderacknowledgment.  
IR warrants performance of its hardware products to the specifications applicable at the time of sale in accordance  
withIR’sstandardwarranty. TestingandotherqualitycontroltechniquesareusedtotheextentIRdeemsnecessary  
to support this warranty. Except where mandated by government requirements, testing of all parameters of each  
product is not necessarily performed.  
IR assumes no liability for applications assistance or customer product design. Customers are responsible for their  
products and applications using IR components. To minimize the risks with customer products and applications,  
customers should provide adequate design and operating safeguards.  
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with alterations is an unfair and deceptive business practice. IR is not responsible or liable for such altered  
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ResaleofIRproductsorservicedwithstatementsdifferentfromorbeyondtheparametersstatedbyIRforthatproduct  
or service voids all express and any implied warranties for the associated IR product or service and is an unfair and  
deceptive business practice. IR is not responsible or liable for any such statements.  
IRproductsarenotdesigned,intended,orauthorizedforuseascomponentsinsystemsintendedforsurgicalimplant  
intothebody, orinotherapplicationsintendedtosupportorsustainlife, orinanyotherapplicationinwhichthefailure  
of the IR product could create a situation where personal injury or death may occur. Should Buyer purchase or use  
IRproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdInternationalRectifier  
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
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Only products certified as military grade by the Defense Logistics Agency (DLA) of the US Department of Defense,  
are designed and manufactured to meet DLA military specifications required by certain military, aerospace or other  
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applications requiring military grade products, is solely at the Buyer’s own risk and that they are solely responsible  
for compliance with all legal and regulatory requirements in connection with such use.  
IRproductsareneitherdesignednorintendedforuseinautomotiveapplicationsorenvironmentsunlessthespecific  
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For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLD HEADQUARTERS:  
101 N. Sepulveda Blvd., El Segundo, California 90245  
Tel: (310) 252-7105  
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March 26, 2014  
AUIRFL014N  
Revision History  
Date  
Comments  
Updated part marking on page 7  
Updated data sheet with new IR corporate template  
3/26/2014  
11  
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March 26, 2014  

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